KR19980079459A - High frequency oscillator - Google Patents

Abstract

The present invention relates to a high frequency oscillation apparatus, wherein a high frequency oscillation apparatus emits a high frequency through an antenna due to interaction between hot electrons emitted into a working space and a resonator in an anode, and the anode includes a cathode body and a plurality of anodes. It consists of an upper plate formed with one first vane, and a lower plate formed with a plurality of second vanes, and directly coupling the first vane and the second vane in an interdigital manner, and then the upper and lower plates are fastened and manufactured. As the assembly process is simple, mass production can be improved, and the inductance component of the resonator is increased by the fan-shaped grooves formed on the upper and lower plates, so that the fundamental frequency can be obtained even at a low operating voltage (about 4 kV). Stabilizes, reduces the size of the resonator, and extends each vane a certain length or And by fastening the strap through the mounting groove, it is to be able to easily fasten the strap.

Description

High frequency oscillator

The present invention relates to a high frequency oscillator having high efficiency and output while maintaining stable operating characteristics at low voltage.

Generally, high frequency oscillator generates high frequency by high voltage supplied from outside, and is used for high frequency oscillator which generates high frequency of 2450MHz used for medical, microwave and other heating, industrial heating range, continuous wave radar. It is divided into a high frequency oscillator which generates a high frequency of 915MHz.

On the other hand, conventional conventional high frequency oscillation apparatus, as shown in Figures 1 and 2, to form a plurality of cavity resonators to induce high frequency components in the inside of the anode body 13 formed in a cylindrical shape by copper pipe or the like A plurality of (usually even) vanes 15 are arranged at equal intervals toward the center direction, and the anodes 16 are formed by these anode bodies 13 and vanes 15.

The inner and outer equalization rings 15a and 15b are connected to the vane 15 every other vane 15 so as to obtain a constant resonant frequency by varying the capacitance at the upper and lower sides of the vane 15, respectively. Near the central axis of the working space 12 is formed between the leading end of the plurality of vanes 15 and the filament (17).

In addition, in the working space 12, filaments 17 wound in a spiral shape by mixing and sintering tungsten (W) and thorium oxide (ThO ₂ ) so as to generate high heat are arranged coaxially with the anode body 13. .

On the other hand, the upper and lower end hats 20 and 21 are fixed to both ends of the filament 17 in order to prevent radiating hot electrons that do not contribute to the oscillation in the central axis direction, and at the center of the lower end hat 21. The first cathode support 23, the central support made of molybdenum, is welded to the lower end of the upper end hat 20 through the through hole, and the second cathode support made of molybdenum 25 is formed on the bottom surface of the lower end hat 21. ) Is welded.

Here, the first cathode support 23 supports the upper end hat 20 while passing through the central axis of the filament 17, and the first and second cathode supports 23 and 25 support the cathode of the high frequency oscillator. It is a filament electrode which electrically connects to the external connection terminals 29 and 31 connected to the power supply terminals 30b and 32b through the through hole formed in the insulating ceramic 27, and supplies electric current to the filament 17.

In addition, one end of the choke coils 30 and 32 is electrically connected to the external connection terminals 29 and 31, and the other end of the choke coils 30 and 32 is a capacitor 34 disposed at the side wall of the box filter. ), Ferrites 30a and 32a absorbing noise are inserted and fixed in the choke coils 30 and 32 along the longitudinal directions of the choke coils 30 and 32.

The upper and lower sides of the anode body 13 have upper and lower portions of funnel-shaped magnetic bodies that form a magnetic path to form a uniform magnetic flux in the working space 12 formed by the filaments 17 and the vanes 15. The pole pieces 33 and 35 are welded to each other, and the upper and lower shield cups 37 and 39 are hermetically welded to the upper and lower portions of the upper and lower pole pieces 33 and 35, respectively. At the upper and lower portions of the 37 and 39, the antenna ceramic 45 and the insulating ceramic 27 are hermetically welded to seal the inside of the anode body 13 with vacuum.

In addition, ring-shaped magnets 41 and 43 are disposed on the outer surfaces of the upper and lower shield cups 37 and 39 to maintain a constant magnetic field distribution in the anode body 13, and constitute an output portion of the high frequency oscillator. The cylindrical antenna ceramic 45 is joined to the upper opening end of the upper shield cup 37 to insulate the antenna cap 51 described later.

In Fig. 1, an exhaust plate 47 made of copper is joined to an upper end of an antenna ceramic 45, and a vane 15 for outputting high frequency oscillated in a cavity resonator near an inner central part of the exhaust pipe 47. The end of the antenna 49 is fixed in the exhaust plate 47 while the antenna 49 derived from the < RTI ID = 0.0 > is passed through the through hole of the upper pole piece 33 and extends axially.

In addition, the side of the exhaust pipe 47 serves as a window that not only protects the welded and fixed portion of the exhaust pipe 47 but also prevents sparking due to electric field concentration and acts as a high frequency antenna while simultaneously emitting high frequency output to the outside. An antenna ceramic 45 and an antenna cap 51 are placed thereon.

In addition, an upper and lower yoke 53} 55 is provided outside the anode body 13 to determine the amount of magnetic flux in the anode body 13, and between the anode body 13 and the lower yoke 55. A plurality of aluminum cooling fins 57 are fitted by a clamp member 55a fixed to the anode body 13 and the lower yoke 55 to form the upper and lower yokes together with the magnets 41 and 43. Covered by (53,55).

An operation process of the high frequency oscillation device configured as described above will be described with reference to FIGS. 1 and 2.

First, when power is applied through the external connection terminals 29 and 31, the external connection terminal 29, the first cathode support 23, the upper end hat 20, the filament 17 lower end hat 21, The closed circuit is constituted by the second cathode support 25 and the external connection terminal 31 so that an operating current is supplied to the filament 17 so that the filament 17 is heated, and then hot electrons are emitted from the filament 17. .

At this time, due to the driving voltage applied to the second cathode support 25 and the anode 16, the filament (with the vane 15) in the working space 12 between the outer surface of the filament 17 and the vanes 15 17) A strong electric field is formed on the side, and the magnetic flux generated from the two magnets 41 and 43 is applied to the upper yoke 53, the lower yoke 55, the upper pole piece 33, the lower pole piece 35 and the action. It is distributed in the magnetization furnace which consists of the space 12, and high magnetic flux density is formed in the working space 12. FIG.

Therefore, the hot electrons emitted from the surface of the hot filament 17 into the working space 12 travel toward the vane 15 or the anode body 13 by the strong electric field present in the working space 12 and at the same time the working space ( The strong magnetic flux density formed in 12) causes a helical rotational movement while receiving a force perpendicular to the traveling direction of the hot electrons and proceeding toward the anode 16.

The electron group formed by the motion of the hot electrons periodically causes the vane 15 to interfere with each other, and the capacitance component (C), which is a capacitance acting between the vanes facing each other, and the vanes facing the anodes. The parallel resonant circuit is constituted by the inductance component L composed of the body 13.

Therefore, the above-mentioned capacitance component (C) and inductance component (L) are the resonant frequency, that is,

Is determined and the high frequency is induced, and then emitted to the outside through the antenna 49.

On the other hand, in the heating device or the medical device using the high frequency oscillation device, lowering the operating voltage of the high frequency oscillation device reduces the cost of the structure, the power supply circuit, noise, and the cost and efficiency of each insulated furnace due to low pressure. As it provides various advantages in terms of stability and economics through improvement, etc., the technology for lowering the operating voltage as much as possible has been studied in various fields related thereto, and as a technology related to catabolism, it was proposed by the applicant of the present application. Japanese Patent Application No. 96-27348, which is a high frequency oscillation device.

As shown in FIGS. 3 and 4, the high frequency oscillator has a vane 148 facing downward in order to obtain a high efficiency of 70% or more even at a low operating voltage (for example, about 4 kV). An upper plate 138 forming a first resonator, a lower plate 146 having a vane 150 facing upward, and forming a second resonator, and an upper plate 138 separating the first and second resonators. And an center plate 136 between the lower plates 146 and receiving heated energy radiated from the filament 114 between the filament 114 and the anode body 104 to emit hot electrons into the working space. The vane 108 is formed in a structure in which the rotor 116 is installed, and the vanes 108 facing upward and downward of the center plate 136 are opposite to each other at the same position and the vane 148 and the lower plate 146 in opposite directions. Vane (1) 50) and interdigitated without interfering with each other, that is, interdigital (lnterdigital).

However, the conventional high frequency oscillation apparatus as described above has a complicated manufacturing process because each vane of the upper plate and the lower plate and the vanes formed on the upper and lower sides of the center plate are connected to each other in an interdigital manner. Not only the bonding process is cumbersome, but also difficult to mass production problems.

Therefore, the present invention has been devised to solve the above problems, by directly combining the vane of the upper plate and the lower plate without the center plate in an interdigital way to simplify the manufacturing and assembly process to increase the productivity The purpose is to provide a high frequency oscillator.

In order to achieve the above object, the high frequency oscillation apparatus according to the present invention, in the high frequency oscillation apparatus for emitting a high frequency, through the antenna due to the interaction with the resonator in the thermoelectronic anode emitted into the working space, the anode is And an anode body, an upper plate on which a plurality of first vanes are formed, and a lower plate on which a plurality of second vanes are formed, and directly combining the first vane and the second vane in an interdigital manner, and then the upper and lower plates. It is characterized in that the fastening.

1 is a longitudinal sectional view of a conventional conventional high frequency oscillation apparatus,

Figure 2 is a longitudinal cross-sectional view of the positive electrode body in a conventional conventional high frequency oscillator;

3 is an exploded perspective view of a conventional low voltage high frequency oscillation apparatus,

4 is a longitudinal cross-sectional view of the high frequency oscillator shown in FIG.

5 is an exploded perspective view of a high frequency oscillation apparatus according to the present invention,

6 is a view showing an upper plate of the high frequency oscillation apparatus according to the present invention;

7 is a view showing a lower plate of the high frequency oscillation apparatus according to the present invention;

8 is a view showing a combination of the upper plate and the lower plate of the high frequency oscillation apparatus according to the present invention,

9 is a view for explaining that the strap is fastened according to an embodiment of the present invention,

10 to 12 are views for explaining that the strap is fastened according to another embodiment of the present invention,

13 is a view for explaining that the high frequency oscillation apparatus according to the present invention is coupled to the positive electrode body;

14 is a partially cutaway perspective view taken along the line CC ′ of FIG. 13.

* Explanation of symbols for the main parts of the drawings

204: bipolar body 238: upper plate

246: lower plate 248, 250: vane

256, 258, 266, 268: Fan Groove

272: through hole 274: coupling portion

362, 367: settling grooves 364, 369 coupling grooves

360, 365: strap

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In addition, the same code | symbol is attached | subjected about the same part as a conventional structure, and description is abbreviate | omitted in order to avoid the overlapping description.

5 is an exploded perspective view of the high frequency oscillation apparatus according to the present invention.

As shown in FIG. 5, the upper plate 238 has a plurality of vanes 248 facing downwards, the lower plate 246 has a plurality of vanes 250 facing upwards, and The vanes 250 of the vanes 248 and the lower plate 246 are coupled in an interdigital manner.

That is, in the conventional high frequency oscillator, the vane 108 of the center plate 136 and the vanes 148 and 150 of the upper and lower plates 138 and 146 are coupled in an interdigital manner, whereas the high frequency oscillator according to the present invention has an upper plate. Vanes 248 of 238 and vanes 250 of lower plate 246 are directly coupled in an interdigital manner.

6 is a view showing an upper plate of the high frequency oscillation apparatus according to the present invention, FIG. 7 is a view showing a lower plate of the high frequency oscillation apparatus according to the present invention, and FIG. 8 is a high frequency oscillation apparatus according to the present invention. The upper plate and the lower plate of the figure is combined.

6 to 8, the upper and lower predetermined portions of the upper and lower plates 238 and 246 respectively form fan-shaped grooves 256, 258, 266 and 268 to increase the inductance component, thereby reducing the size of the resonator. Compensate for the ingredients.

At this time, the fan-shaped grooves 258 and 268 formed on the upper portion of the upper plate 238 and the fan-shaped grooves 256 and 266 formed on the lower portion of the lower plate 246 are positioned at the time of assembly, as shown in FIG. Are formed to match.

Therefore, since the inductance component is increased by the fan-shaped grooves 256, 258, 266 and 268 formed in the upper and lower predetermined portions of the upper plate 238 and the lower plate 246, respectively, the inductance component is compensated for even though the size of the resonator is small. At the operating voltage (about 4kV), the fundamental frequency (2.45GHz) can be obtained.

In addition, the rectangular winding hole larger than the circumference of the antenna 270 on the upper predetermined portion of the upper plate 238, preferably the fan-shaped groove 268 so that the upper plate 238 and the antenna 270 are not connected. 272 is formed, and a coupling part 274 in which the antenna 270 is mounted is formed inside the lower plate 246 so that the antenna 270 has a rectangular through hole 272 formed on the upper plate 238. ) And then coupled to the coupling portion 274 formed on the lower plate 246 by the brazing method.

Therefore, since the antenna 270 is coupled to the coupling part 274 of the lower plate 246 through the through hole 272 formed on the upper plate 238, it is possible to reduce the external size of the resonator. In addition, it can emit high-quality high frequency to the outside.

And, as shown in Figure 6, vane pair having a capacitance set in a predetermined portion in the front of the rotation direction of the electron group from the vanes that the antenna 270 is in contact among the plurality of vanes 248 formed on the upper plate 238 (A) is formed, and in the opposing part of this vane pair A, the coupling groove B is formed so that the vane pair B 'formed in the lower plate 246 may be couple | bonded in an interdigital manner.

In addition, as illustrated in FIG. 7, a vane pair having a capacitance set in a predetermined portion in front of the rotation direction of the electron group from the vanes in which the antenna 270 contacts among the plurality of vanes 250 formed on the lower plate 246. (B ') is formed, and the joining groove (A') is formed in the opposing part of this vane pair (B ') so that the vane pair (A) formed in the upper plate 238 may be coupled in an interdigital manner. .

As shown in FIG. 8, the vane pair A formed on the upper plate 238 includes a coupling groove A ′ formed on the lower plate 246 and a vane pair B ′ formed on the lower plate 246. ) Is fitted into the coupling groove (B) formed in the upper plate 238, respectively, is coupled in an interdigital manner.

Therefore, even if the movement of the electron group is delayed by the potential of the antenna 270 while the antenna 270 is passing through the connected vanes, the vane formed at a predetermined portion in front of the field direction of the electron group from the vane to which the antenna 270 is connected The phase of the electron group is compensated by the set capacitances present in the pairs A and B ', and the phase of the high frequency is kept constant, thereby preventing the phase breakage, that is, the phenomenon of high frequency.

Meanwhile, in order to fasten the straps 360 and 365 to the vanes 248 and 250 of the upper and lower plates 238 and 246 which are coupled in an interdigital manner, as illustrated in FIG. 9, each vane 248 and 250 has a longitudinal direction (ie, an upper portion). The vanes 248 of the plate 238 are formed to extend in a predetermined length in the downward direction and the vanes 250 of the lower plate 246 are upward, respectively, and the vanes 250 of the lower plate 246 extended upward. At the same time, the upper strap 360 is fastened to the lower strap 365 at the same time as the vane 248 of the upper plate 238 extending downward.

Accordingly, the straps 360 and 365 may be easily fastened to the vanes 248 and 250 of the upper and lower plates 238 and 246 which are coupled in an interdigital manner.

In addition, as shown in FIGS. 10 to 12, the mounting groove 362 is formed to seat the upper boost 360 on the upper plate 238, and each vane 248 of the upper plate 238. A coupling groove 364 is formed in order to fasten the lower strap 365 to a lower portion of the bottom portion).

Then, a seating groove 367 is formed to seat the lower strap 365 on the lower portion of the lower plate 246, and the upper strap 360 is fastened to an upper portion of each vane 250 of the lower plate 246. In order to form a coupling groove 369.

At this time, as shown in Figure 12, the diameter of the seating groove 362 formed in the upper portion of the upper plate 238 is lower so that each vane 248 of the upper strap 360 and the upper plate 238 is not connected It is formed larger than the diameter of the coupling groove 369 formed in the plate 246, the diameter of the seating groove 367 formed in the lower portion of the lower plate 246 is each vane of the lower strap 365 and the lower plate 246 It is formed larger than the diameter of the fixing groove 364 formed in the upper plate 238 so that the 250 is not connected.

Thus, the upper strap 360 is fastened to the coupling groove 369 formed on the upper side of each vane 250 of the lower plate 246 and seated in the mounting groove 362 formed on the upper plate 238, The lower strap 365 is fastened to the coupling groove 364 formed at the lower side of each vane 248 of the upper plate 238 and simultaneously seated in the mounting groove 367 formed at the lower side of the lower plate 246. Straps 360 and 365 may be easily fastened to the vanes 248 and 250 of the upper and lower plates 238 and 246 which are coupled in a manner.

On the other hand, Figure 13 is a view for explaining that the high frequency oscillation apparatus according to the present invention is coupled to the positive electrode body, Figure 14 is a partially cut perspective view cut on the basis of CC 'of FIG.

13 and 14, the inductance component of the resonator is coupled by interposing a plurality of upper and lower slots 280 and 282 between the outer side of each vane 248 and 250 coupled in an interdigital manner and the anode body 204. It can be increased to stabilize the high frequency output while reducing the appearance.

At this time, the upper slot 280 is fastened to the upper plate 238 without being connected to the lower plate 246, the lower slot 282 is fastened to the lower plate 246 without being connected to the upper plate 238 do.

Effects of the high frequency oscillation apparatus according to the present invention configured as described above will be described in detail with reference to FIGS. 5 to 14.

First, when a low voltage (for example, 4 kV) is applied through the external connection terminals 29 and 31, the operating current is supplied to the filament 114 and heated, and the emitter 116 is heated by the filament 114. Hot electrons begin to be released into the working space 12.

At this time, a strong electric field is formed in the working space 12 between the outer surface of the emitter 116 and the vanes 248 and 250 by the driving voltage applied to the cathode and the anode body 204, and the strong electric field is the vane 248,250. ) To emitter 116.

In addition, the magnetic flux is distributed in the magnetic closed circuit including the magnets 41 and 43, the lower pole piece 33, the lower poly 35, and the working ridge 12 to form a high magnetic flux density in the working space 12.

Accordingly, the hot electrons emitted from the surface of the emitter 116 into the working space 12 generate electron groups according to the strong electric field distribution existing between the cathode and the anode body 204, and the generated electron groups represent the working space ( It is forced by the strong magnetic field present in 12) perpendicular to the direction of travel to start the spiral rotational movement in the working space 12.

Capacitance component (c) in the sub-resonator formed by each of the vanes 248 and 250 coupled by the resonator and the digital method formed by the upper plate 238 and the lower plate 246 is formed by the movement of the hot electrons. And an inductance component (L) constitute a parallel resonant circuit.

Accordingly, the above-described capacitance component (C) and inductance component (L) are the resonant frequency, that is,

Is determined and the high frequency is induced, and then emitted to the outside through the antenna 270.

At this time, since the vanes 248 of the upper plate 238 and the vanes 250 of the lower plate 246 are directly coupled to each other in an interdigital manner, the upper and lower plates 138 and 146 are interdigital through the central plate 136. Compared with the conventional high frequency oscillation apparatus coupled to the structure is simple, so that the manufacturing and assembly process is simplified, it is possible to increase the mass production.

6 to 8, the fan-shaped grooves 258 and 268 formed on the upper plate 238 and the fan-shaped grooves 256 and 266 formed on the lower portion of the lower plate 246 of the resonator. Since the inductance component is increased, the inductance component is compensated even if the size of the resonator is small, so that a fundamental frequency (2.45 GHz) can be obtained at a low operating voltage (about 4 kV).

In addition, since the antenna 270 is coupled to the coupling portion 274 of the lower plate 246 through the through hole 272 formed in the upper predetermined portion of the upper plate 238, the outer size of the resonator may be reduced. In addition, it can emit high-quality high frequency to the outside.

6 to 8, the vane pair A formed in the upper plate 238 includes a coupling groove A ′ formed in the lower plate 246, and a vane pair formed in the lower plate 246. Since B 'is coupled to the coupling groove B formed in the upper plate 238 in an interdigital manner, the electron group is moved by the electric potential of the antenna 270 while passing through the vanes to which the antenna 270 is connected. Even if delayed, the phase of the electron group is compensated by the set capacitances present in the vane pairs A and B ', and the phase of the high frequency is kept constant, thereby preventing the phase breakage of the high frequency, that is, the modulating shape.

On the other hand, as shown in Figure 9, the longitudinal direction of each vane (248, 250) of the upper and lower plates (238, 246) (that is, the vanes 250 of the upper plate 238 is lower, the vanes of the lower plate 246 is upper side). Direction) and each of the vanes 248 of the upper plate 238 extending downward while fastening the upper strap 360 to the vanes 250 of the lower plate 246 extending upward by a predetermined length. By fastening the lower straps 365 to the straps, the straps 360 and 365 can be easily fastened to the vanes 248 and 250 of the upper and lower plates 238 and 246 coupled in an interdigital manner.

In addition, as shown in Figure 10 to 11, the upper strap 360 is fastened to the engaging groove 369 formed on the upper side of each vane 250 of the lower plate 246 and at the same time the upper portion of the upper plate 238 It is seated in the mounting groove 362 formed in the lower strap 365 is fastened to the coupling groove 364 formed on the lower side of each vane 248 of the upper plate 238 and formed at the lower side of the lower plate 246 By being seated in the seating groove 367, the straps 360 and 365 may be easily fastened to the vanes 248 and 250 of the upper and lower plates 238 and 246 coupled in the interdigital manner.

At this time, as shown in Figure 12, the diameter of the mounting groove 362 formed in the upper portion of the upper plate 238 is formed larger than the diameter of the coupling groove 369 formed in the lower plate 246, the upper strap 360 Not connected to each vane 248 of the upper plate 238, the diameter of the mounting groove 367 formed in the lower portion of the lower plate 246 is larger than the diameter of the fixing groove 364 formed in the upper plate 238 The lower strap 365 is not connected to each vane 250 of the lower plate 246.

13 and 14, the upper and lower plates 238 and 246 coupled in an digital manner are connected to the anode body 204 through a plurality of (preferably, eight) upper and lower slots 280 and 282. Since the coupling, the inductance component of the resonator is increased to stabilize the high frequency output and to reduce the appearance.

At this time, the upper slot 280 is fastened to the upper plate 238 without the lower plate 246 connected, the lower slot 282 is fastened to the lower plate 246 without being connected to the upper plate 238 do.

As described above, by using the present invention, the vanes of the upper plate and the vane of the lower plate are directly coupled in an interdigital manner, so that the manufacturing and assembly processes are simple and the mass productivity can be increased, and the upper and lower portions of the upper and lower plates are Since the inductance component of the resonator is increased by the fan-shaped grooves formed respectively, the inductance component is compensated even if the size of the resonator is small, so that the fundamental frequency (2.45 GHz) can be obtained even at a low operating voltage (about 4 kV).

In addition, since the antenna is coupled to the coupling portion of the lower plate through the through-hole formed in the upper predetermined portion of the upper plate, not only can reduce the outer size of the resonator, but also the effect of emitting high-quality high frequency to the outside have.

In addition, even if the phase of the high frequency induced in the resonator is delayed by the potential of the antenna while passing through the vane to which the antenna is connected, the phase of the high frequency is compensated by the capacitance present in the vane pair formed on the upper and lower plates. By keeping the phase of the high frequency induced from each vane constant, it is possible to prevent high frequency phase break (modulation).

In addition, each vane of the upper and lower plates extend a predetermined length in the longitudinal direction thereof to fasten the upper and lower straps, or the upper and lower straps can be fastened respectively through a seating groove formed in the upper and lower plates and a coupling groove formed in each vane. There is an effect that can easily fasten the strap to each vane to be coupled.

In addition, since the upper and lower plates coupled by the interdigital method are coupled to the anode body via a plurality of upper and lower slots, the inductance component of the resonator is increased to stabilize the high frequency output and reduce the appearance.

Claims (8)

In the high frequency oscillation apparatus which induces a high frequency due to the interaction between the hot electrons emitted into the working space and the resonator in the anode, the anode comprises: an anode body, an upper plate on which a plurality of first vanes are formed; A high frequency oscillation apparatus comprising: a lower plate having a plurality of second vanes formed thereon, wherein the first vane and the second vane are directly coupled in an interdigital manner, and then the upper and lower plates are fastened. The vane pair having a predetermined capacitance set in the upper and lower plates, respectively, and the coupling groove is formed in the opposing portions of the formed vane pair so that each vane pair is coupled in an interdigital manner. High frequency oscillator. The high frequency oscillator according to claim 1 or 2, wherein grooves are formed in upper and lower portions of the upper and lower plates, respectively. 4. The high frequency oscillation apparatus according to claim 3, wherein the grooves formed in the upper and lower plates are fan-shaped. 4. The through hole of claim 3, wherein a through hole larger than a circumference of the antenna is formed in the upper predetermined portion of the upper plate, a coupling portion is formed inside the lower plate, and the antenna has a through hole formed on the upper plate. High frequency oscillator, characterized in that coupled to the coupling portion through. 6. The high frequency oscillation apparatus according to claim 5, wherein the first and second vanes extend a predetermined length in the longitudinal direction thereof and are fastened to the strap. The method of claim 5, wherein the upper and lower plates of the upper and lower mounting grooves are respectively formed, and the first and second vanes are formed in the second vane by respectively forming a coupling groove having a smaller diameter than the mounting groove. It is characterized by seating in the seating groove formed in the lower portion of the lower plate while fastening the upper strap in the coupling groove and seated in the seating groove formed in the upper portion of the upper plate, and fastening the lower strap to the coupling groove formed in the first vane. High frequency oscillator. According to claim 1, wherein the outer side of the upper plate is coupled to the positive electrode body via a plurality of upper slots, the outer side of the lower plate is coupled to the positive electrode body via a plurality of lower slots. Oscillator.