KR19980053133U - Backlight structure such as LCD - Google Patents
Backlight structure such as LCD Download PDFInfo
- Publication number
- KR19980053133U KR19980053133U KR2019960066320U KR19960066320U KR19980053133U KR 19980053133 U KR19980053133 U KR 19980053133U KR 2019960066320 U KR2019960066320 U KR 2019960066320U KR 19960066320 U KR19960066320 U KR 19960066320U KR 19980053133 U KR19980053133 U KR 19980053133U
- Authority
- KR
- South Korea
- Prior art keywords
- guide plate
- light guide
- led chip
- lcd
- section
- Prior art date
Links
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims 1
- 238000011900 installation process Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 2
- 101710186755 Putative pterin-4-alpha-carbinolamine dehydratase 1 Proteins 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/0088—Positioning aspects of the light guide or other optical sheets in the package
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0003—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being doped with fluorescent agents
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
- G02B6/0038—Linear indentations or grooves, e.g. arc-shaped grooves or meandering grooves, extending over the full length or width of the light guide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/0058—Means for improving the coupling-out of light from the light guide varying in density, size, shape or depth along the light guide
Abstract
본 고안은 LED 칩과 도광판을 이용하여 LCD 등의 백라이트 구조를 구성함에 있어서, 저면을 요철면(15)으로 형성하고, 한쪽 단면상 두께가 다른쪽 단면 두께보다 얇게 구성하고, 두꺼운 단면쪽에는 통공(14)을 형성한 도광판(10)과; 그리고 상기 도광판(10)의 통공(14)에 끼워 설치되며, 도광판(10)의 단면쪽으로 향해 설치한 LED 칩(11)을 포함하고, 또 양단으로 길게 LED 리드(13)을 형성한 고정부재(12)를 포함하도록 구성한 것을 특징으로 한다. 본 고안에 의하면 저전류로 저가로 제조가능하고 부품수가 적고 설치공정이 간편한 효과가 있다.According to the present invention, when constructing a backlight structure such as an LCD using an LED chip and a light guide plate, the bottom surface is formed as an uneven surface 15, the thickness on one cross section is made thinner than the thickness of the other cross section, and the thick cross section has a through hole ( A light guide plate 10 on which 14 is formed; And a fixing member installed in the through hole 14 of the light guide plate 10 and including an LED chip 11 installed toward the end surface of the light guide plate 10 and having the LED leads 13 long at both ends thereof. 12) characterized in that configured to include. According to the present invention, low current can be manufactured at low cost, the number of parts is small, and the installation process is simple.
Description
본 고안은 LCD 등의 백라이트 구조에 관한 것이다. 백라이트의 종류로는 도광판에 의한 것과 도 1에 예시한 바와 같이, PCD(1) 상의 프레임(2) 내면에 LED 칩(3)을 격자형태로 여러개 배열하고 (도면에서는 도시상 LED 칩(3) 하나만 도시함) 그 위에 실리콘액(4)을 채우고 최종적 가장 상단에는 확산시트(5)를 형성한 것이 있다.The present invention relates to a backlight structure such as an LCD. As the type of backlight, as illustrated in FIG. 1, as shown in FIG. 1, a plurality of LED chips 3 are arranged in a lattice form on the inner surface of the frame 2 on the PCD 1 (in the drawing, the LED chips 3 shown in the drawing). Only one) is filled with the silicon liquid 4 thereon, and the diffusion sheet 5 is formed at the top end.
도 1에 예시한 LED 칩(3)에 의한 발광은 밝기는 밝으나 특히 격자 형태로 배열하는 LED 칩(3)의 많은 소요로 가격이 비싸고, 이물 문제가 따르며 백라이트로 작동시 고전류를 필요로 하는 단점이 있다.Light emission by the LED chip 3 illustrated in FIG. 1 is bright, but the cost is high due to the large number of LED chips 3 arranged in a lattice form. There is this.
본 고안은 상기한 점을 감안하여, LED 칩을 이용하되 종래의 도광판을 이용하여 백라이트를 구성함으로서 극히 저렴한 가격으로 제조할 수 있게 하고 또한 이물에 안전하고 고전류도 요하지 않도록 한 것으로 이하, 본 고안을 상술한다.In view of the above points, the present invention uses a LED chip, but by using a conventional light guide plate to configure a backlight, it can be manufactured at an extremely low price and also safe to foreign objects and does not require a high current. It is detailed.
도 1은 종래 백라이트의 한 구성예.1 is a configuration example of a conventional backlight.
도 2는 본 고안에 따른 백라이트의 개략 구성도로 (가)는 개략 요부평면도 (나)는 (가)의 측단면구성도.2 is a schematic configuration diagram of a backlight according to the present invention (a) is a schematic main plan view (b) is a side cross-sectional configuration diagram (a).
* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
10 : 도광판11 : LED 칩10 light guide plate 11: LED chip
12 : 고정부재13 : LED 리드12: fixing member 13: LED lead
14 : 통공15 : 요철면14: through hole 15: uneven surface
16 : 형광체16: phosphor
본 고안에서는 도 2에 예시한 바와 같이, 도광판(10)의 일측에 LED 칩(11)이 설치되도록 하였다.In the present invention, as illustrated in FIG. 2, the LED chip 11 is installed on one side of the light guide plate 10.
(가)도는 도광판(10)의 일측에 LED 칩(11)이 형성된 것을 보여주는 평면도이고, (나)도는 개략 측단면도이다.(A) is a plan view showing the LED chip 11 is formed on one side of the light guide plate 10, (B) is a schematic side cross-sectional view.
LED 칩(11)은 LED 칩(11)을 고정하는 고정부재(12) 상단측면으로 즉 도광판(10)의 전방을 향해 고정 설치된다. 본 도면에서는 편의상 5개의 LED 칩(11)이 설치된 것으로 예시하였지만 이에 한정되는 것은 아니다.The LED chip 11 is fixedly installed toward the upper side of the fixing member 12 that fixes the LED chip 11 toward the front of the light guide plate 10. In the figure, it is illustrated that five LED chips 11 are installed for convenience, but the present invention is not limited thereto.
고정부재(12)의 길이방향 양단에는 LED 리드(13)를 다리식으로 하방으로 길게 형성하여 도시하지 않은 PCB에 +, -연결한다.On both ends of the fixing member 12 in the longitudinal direction, the LED lead 13 is formed long downward with a leg to connect + and-to the PCB (not shown).
고정부재(12)는 도광판(10) 일측 끝단에 형성한 통공(14)을 통해 끼워 고정토록 한다.The fixing member 12 is fitted to be fixed through the through hole 14 formed at one end of the light guide plate 10.
한편 도광판(10)의 하면에 요철면(15)을 형성하여 그 요철면(15)에 형광체(16)를 도포하였다. 형광체(16)는 형광물질로 이루어진다. 도광판은 도 2의 (나)도에서 보듯이, LED 칩(11)이 있는 쪽은 두께가 두껍고 그곳에서 거리가 먼쪽으로 갈수록 단면상 좁게 형성시켰다.On the other hand, the concave-convex surface 15 was formed on the lower surface of the light guide plate 10 and the phosphor 16 was applied to the concave-convex surface 15. The phosphor 16 is made of a fluorescent material. As shown in (b) of FIG. 2, the light guide plate was formed to have a thicker side on the side where the LED chip 11 was located, and narrower in cross section as the distance from the side to the far side was increased.
그 이유는 LED 칩(11)으로부터의 발광은 거리가 멀수록 빛의 세기가 약해지므로 이를 다소 보상하여 거리가 멀어도 균일한 밝기가 어느정도 유지되도록 하기 위한 것이다.The reason for this is that the light emission from the LED chip 11 is weaker as the distance increases, so that the light intensity is slightly compensated so that uniform brightness is maintained to some extent even when the distance is far.
상기 구조에 의하면, LED 칩(11)의 발광시 도광판(10)을 통해 빛이 전달된다. 이때 도광판(10)의 저면은 요철로 되어 있음과 동시에 형광체(16)가 도포되어 있어 밝기 향상과 균일한 반사 및 반사량을 크게 하여 휘도를 향상시킬 수 있고 또한 도광판(10)의 단면상 먼 거리로 갈수록 도광판(10)의 두께가 얇아지게 되어 있어 먼거리에서 휘도가 낮아지는 것도 보상할 수 있다.According to the above structure, light is transmitted through the light guide plate 10 when the LED chip 11 emits light. At this time, the bottom surface of the light guide plate 10 is irregular and at the same time the phosphor 16 is coated, so that the brightness can be improved and the uniform reflection and the reflection amount can be increased to improve the brightness. Since the thickness of the light guide plate 10 is thin, the luminance may be reduced at a long distance.
또한 본 고안에 의하면 적은 수의 LED 칩(11)과 도광판(10)을 이용하여 매우 저가(종래 LED 칩 배열 구성가격의 1/10로 백라이트를 구성할 수 있는 장점이 있고 또한 전류 소모도 적어 저전류로 작동가능한 장점이 있다.In addition, according to the present invention, by using a small number of LED chips 11 and the light guide plate 10, it is very inexpensive (the advantage of configuring a backlight at 1/10 of the conventional LED chip array configuration price and low current consumption is low. The advantage is that it can be operated with current.
또한 발광요소인 LED 칩(11)을 갖는 고정부재(12)를 도광판(10)에 삽입식으로 끼워 고정하므로 설치공정도 매우 간편하고 부품의 수도 적은 장점이 있다.In addition, since the fixing member 12 having the LED chip 11 as the light emitting element is inserted into and fixed to the light guide plate 10, the installation process is very simple and the number of parts is advantageous.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960066320U KR19980053133U (en) | 1996-12-31 | 1996-12-31 | Backlight structure such as LCD |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960066320U KR19980053133U (en) | 1996-12-31 | 1996-12-31 | Backlight structure such as LCD |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR19980053133U true KR19980053133U (en) | 1998-10-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019960066320U KR19980053133U (en) | 1996-12-31 | 1996-12-31 | Backlight structure such as LCD |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR19980053133U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980080215A (en) * | 1997-03-18 | 1998-11-25 | 야스카와 히데아키 | Lighting device, liquid crystal display device and electronic device |
| KR19990003536A (en) * | 1997-06-25 | 1999-01-15 | 김영환 | Backlight Unit of Liquid Crystal Display |
| KR100796482B1 (en) * | 2001-03-07 | 2008-01-21 | 엘지.필립스 엘시디 주식회사 | Backlight and method for manufacturing the same |
| CN106005017A (en) * | 2016-06-27 | 2016-10-12 | 美通重工有限公司 | Novel chassis structure |
-
1996
- 1996-12-31 KR KR2019960066320U patent/KR19980053133U/en not_active Application Discontinuation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980080215A (en) * | 1997-03-18 | 1998-11-25 | 야스카와 히데아키 | Lighting device, liquid crystal display device and electronic device |
| KR19990003536A (en) * | 1997-06-25 | 1999-01-15 | 김영환 | Backlight Unit of Liquid Crystal Display |
| KR100796482B1 (en) * | 2001-03-07 | 2008-01-21 | 엘지.필립스 엘시디 주식회사 | Backlight and method for manufacturing the same |
| CN106005017A (en) * | 2016-06-27 | 2016-10-12 | 美通重工有限公司 | Novel chassis structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E601 | Decision to refuse application |