KR19980045515U - Vacuum line connection device - Google Patents
Vacuum line connection device Download PDFInfo
- Publication number
- KR19980045515U KR19980045515U KR2019960058657U KR19960058657U KR19980045515U KR 19980045515 U KR19980045515 U KR 19980045515U KR 2019960058657 U KR2019960058657 U KR 2019960058657U KR 19960058657 U KR19960058657 U KR 19960058657U KR 19980045515 U KR19980045515 U KR 19980045515U
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- KR
- South Korea
- Prior art keywords
- holders
- vacuum line
- vacuum
- link
- connection device
- Prior art date
Links
- 238000000034 method Methods 0.000 claims abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Flanged Joints, Insulating Joints, And Other Joints (AREA)
- Quick-Acting Or Multi-Walled Pipe Joints (AREA)
Abstract
1. 청구범위에 기재된 고안이 속하는 기술분야1. TECHNICAL FIELD OF THE INVENTION
진공라인 연결장치Vacuum line connection device
2. 고안의 해결하고자 하는 기술적 과제2. Technical problem to be solved
본 고안은 링크 다각형으로 된 조합으로 구성하되, 마지막 조합인 링크부에 조임력을 제공할 수 있도록 하여 간단한 작업공정으로 진공라인간을 연결하는 진공라인 연결장치를 제공함에 그 목적이 있다.The object of the present invention is to provide a vacuum line connection device for connecting the vacuum lines in a simple work process by configuring a combination of link polygons, but to provide a tightening force to the link unit which is the last combination.
3. 고안의 해결방법의 요지3. Summary of solution of design
본 고안은 진공라인간의 서로 접촉하는 두 개의 플랜지에 끼워져 지지하는 다수의 홀더; 상기 다수의 홀더 상하측을 연결하여 다각형 조합하는 링크; 및 상기 링크의 단부에 각각 장착된 홀더를 연결할 수 있도록 장착되며, 상기 다수의 홀더가 플랜지를 클램핑할 수 있도록 조임력을 제공하는 수단을 포함하는 진공라인 연결장치를 제공한다.The present invention includes a plurality of holders that are supported by two flanges in contact with each other between vacuum lines; A link connecting polygons by connecting upper and lower sides of the plurality of holders; And means mounted to connect respective holders mounted at ends of the link, the means for providing a tightening force to allow the plurality of holders to clamp the flanges.
4. 고안의 중요한 용도4. Important uses of the devise
반도체 진공라인간의 연결을 신속하고 누수없이 결합시킬 수 있도록 한 것임.The connection between semiconductor vacuum lines can be quickly and without leakage.
Description
본 고안은 반도체 제조장비 중 진공라인간을 연결하는 연결장치에 관한 것으로, 특히 진공라인간의 접촉 부위의 누수없이 신뢰성있게 결합될 수 있도록 한 진공라인 연결장치에 관한 것이다.The present invention relates to a connecting device for connecting vacuum lines among semiconductor manufacturing equipment, and more particularly to a vacuum line connecting device that can be reliably coupled without leakage of the contact between the vacuum line.
일반적으로, 진공라인간을 연결하는 배관 작업시 소구경 라인(통상 2 이하)은 양측 라인에 암나사와 수나사를 가공하여 서로 체결하고 실링할 수 있도록 하고 있으며, 대구경 라인(통상 2 이상)은 각 연결 라인의 단부에 플랜지를 장착하여 나사로 체결하고 있으며, 연결하는 플랜지 사이에는 부시와 같은 밀봉재를 삽입하여 누수를 방지하고 있다.In general, when pipe work is connected between vacuum lines, small-diameter lines (usually 2 or less) allow female threads and male threads to be machined on both sides to be fastened and sealed, and large-diameter lines (normally 2 or more) are connected to each other. A flange is attached to the end of the line and fastened with a screw. A sealing material such as a bush is inserted between the flanges to be connected to prevent leakage.
이때, 상기 플랜지 사이의 부시가 손상을 입었을 때는 진공도에 큰 영향을 미치기 때문에 상기 플랜지의 결합을 좀더 신뢰성있게 하기 위하여 종래에는 도 1에 도시한 바와 같이 ㄷ자 형상의 고리(105)를 이용하여 연결하려고 하는 진공라인(101, 102)의 플랜지(103)의 단턱부에 소정간격으로 물리도록 하고 볼트(106)로 조여 조정할 수 있도록 하고 있다.At this time, when the bush between the flange is damaged has a great effect on the degree of vacuum, in order to make the coupling of the flange more reliable conventionally, as shown in Figure 1 to try to connect using the U-shaped ring 105 The stepped portion of the flange 103 of the vacuum line 101, 102 is to be bitten at a predetermined interval, and tightened by a bolt 106 to adjust it.
미설명부호 104는 부시를 나타낸다.Reference numeral 104 denotes a bush.
그러나, 이와 같은 구조에서 고리가 플랜지를 조여주는 힘은 볼트의 조임력에 의해 이루어지는데, 이때 스패너로 볼트를 조일 때, 힘이 과대하면 상기 볼트가 마모되거나, 플랜지에 접촉하는 고리면이 마모되는 경우가 발생하여 진공라인의 연결이 신뢰적이지 못하며, 만약 마모가 발생되었을 때에는 드릴이나 쇠톱 등으로 연결부를 절단해서 진공라인을 해체하여야 하는 번거로운 문제점이 있다. 또한, 상기 각각의 고리로 플랜지의 네 부분을 고리가 조여주도록 하므로 결합작업이 불편할 뿐만 아니라 작업시간이 오래 걸리며, 볼트를 조일 때, 좌우 대칭의 힘이 균형을 이루지 못하고, 결국 한쪽으로 치우치는 결과를 초래하여 누수가 발생하는 문제점이 있다.However, in such a structure, the force tightening the flange by the ring is made by the tightening force of the bolt, wherein when the bolt is tightened with a spanner, when the force is excessive, the bolt is worn or the ring surface contacting the flange is worn. There is a problem that the connection of the vacuum line is not reliable, and if wear occurs, it is troublesome to dismantle the vacuum line by cutting the connection part with a drill or a hacksaw. In addition, the four hooks of the flange to each of the loops to tighten the loop, so not only the uncomfortable work, but also takes a long time, when tightening the bolt, the force of the left and right symmetry is not balanced, and the result is biased to one side There is a problem that leaks occur.
따라서, 본 고안은 상기의 제반 문제점을 해결하기 위하여 안출된 것으로서, 링크 다각형으로 된 조합으로 구성하되, 마지막 조합인 링크부에 조임력을 제공할 수 있도록 하여 간단한 작업공정으로 진공라인간을 연결하는 진공라인 연결장치를 제공함에 그 목적이 있다.Therefore, the present invention has been devised to solve the above problems, but composed of a combination of link polygons, but the last combination to provide a tightening force to the link portion vacuum connecting the vacuum lines between the simple work process The purpose is to provide a line connection.
또한, 본 고안은 진공라인을 연결하는 두 개의 플랜지부에 접촉하는 면적을 크게 하여 조여줄 수 있도록 함으로써 진공 누수를 신뢰성있게 방지하는 진공라인 연결장치를 제공함에 다른 목적이 있다.In addition, the present invention has another object to provide a vacuum line connecting device that can reliably prevent the vacuum leakage by allowing the area in contact with the two flange portion connecting the vacuum line to be tightened.
도 1은 종래 기술에 따른 진공라인 연결장치의 사용상태를 나타낸 단면도;1 is a cross-sectional view showing a state of use of the vacuum line connection device according to the prior art;
도 2는 본 고안에 의한 진공라인 연결장치의 일실시예 구성을 나타낸 사시도;Figure 2 is a perspective view showing an embodiment configuration of a vacuum line connection device according to the present invention;
도 3은 본 고안에 의한 진공라인 연결장치의 사용상태를 나타낸 평면도이다.3 is a plan view showing a state of use of the vacuum line connection device according to the present invention.
*도면의 주요부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *
1, 2 : 진공라인3 : 플랜지1, 2: vacuum line 3: flange
4 : 제 1 홀더4a : 홀4: first holder 4a: hole
4b : 제 1 홀더 내면5 : 가이드 샤프트4b: inner surface of first holder 5: guide shaft
6 : 링크7 : 제 2 홀더6: link 7: second holder
8 : 클램프 샤프트8: clamp shaft
상기 목적을 달성하기 위하여 본 고안은, 진공라인간의 서로 접촉하는 두 개의 플랜지에 끼워져 지지하는 다수의 홀더; 상기 다수의 홀더 상하측을 연결하여 다각형 조합하는 링크; 및 상기 링크의 단부에 각각 장착된 홀더를 연결할 수 있도록 장착되며, 상기 다수의 홀더가 플랜지를 클램핑할 수 있도록 조임력을 제공하는 수단을 포함하는 진공라인 연결장치를 제공한다.In order to achieve the above object, the present invention provides a plurality of holders that are inserted into and supported by two flanges in contact with each other between vacuum lines; A link connecting polygons by connecting upper and lower sides of the plurality of holders; And means mounted to connect respective holders mounted at ends of the link, the means for providing a tightening force to allow the plurality of holders to clamp the flanges.
이하, 첨부된 도면을 참조하여 본 고안의 실시예를 상세히 설명한다.Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention;
도 2는 본 고안에 의한 진공라인 연결장치의 일실시예 구성을 나타낸 사시도; 도 3은 본 고안에 의한 진공라인 연결장치의 사용상태를 나타낸 평면도이다.Figure 2 is a perspective view showing an embodiment configuration of a vacuum line connection device according to the present invention; 3 is a plan view showing a state of use of the vacuum line connection device according to the present invention.
도면에서 1, 2는 진공라인, 3은 플랜지, 4는 제 1 홀더, 4a는 홀, 4b는 제 1 홀더 내면, 5는 가이드 샤프트, 6은 링크, 7은 제 2 홀더, 8은 클램프 샤프트를 각각 나타낸다.In the drawing, 1, 2 is vacuum line, 3 is flange, 4 is 1st holder, 4a is hole, 4b is inside 1st holder, 5 is guide shaft, 6 is link, 7 is 2nd holder, 8 is clamp shaft Represent each.
본 고안에 의한 진공라인 연결장치는 진공라인간을 누수없이 신속하고 간단하게 연결할 수 있도록 구현한 것으로, 도 1에 도시한 바와 같이 진공라인(1, 2)간의 서로 접촉하는 두 개의 플랜지부(3)에 끼워져 지지하도록 ㄷ자 형상을 가지며, 일측이 상하로 관통된 홀(4a)이 형성된 다수의 제 1 홀더(4)를 구비한다. 이때, 상기 다수의 제 1 홀더(4) 내면(4b)은 안측으로 갈수록 소정 각도만큼 좁혀진 형상을 가진다.The vacuum line connection device according to the present invention is implemented so that the vacuum lines can be quickly and simply connected without leakage, and as shown in FIG. 1, two flange portions 3 contacting each other between the vacuum lines 1 and 2. It is provided with a plurality of first holder (4) having a c-shape so as to be inserted into the support and formed with a hole (4a) through one side up and down. At this time, the inner surface 4b of the plurality of first holders 4 has a shape narrowed by a predetermined angle toward the inner side.
그리고, 상기 다수의 제 1 홀더(4)는 그의 홀(4a)을 관통하는 가이드 샤프트(5)와, 상기 가이드 샤프트(5)의 상하부에 끼워지는 링크(6)에 의해 상호 연결되며, 상기 링크(6)의 단부에는 수평 및 수직으로 교차하는 방향으로 홀이 관통되게 형성된 제 2 홀더(7)가 구비된다. 여기서, 상기 제 2 홀더(7)의 수평 관통홀에는 암나사부가 형성되어 있다.In addition, the plurality of first holders 4 are interconnected by guide shafts 5 penetrating through holes 4a thereof, and links 6 fitted to upper and lower portions of the guide shafts 5, and the links At the end of (6) is provided a second holder (7) formed so that the hole penetrates in the direction crossing each other horizontally and vertically. Here, the female thread portion is formed in the horizontal through hole of the second holder (7).
상기 링크(6)의 단부에 각각 장착된 제 2 홀더(7)의 수평 관통홀에는 클램프 샤프트(8)가 장착되는데, 상기 클램프 샤프트(8)는 링크(6)를 다각형으로 조합시키며, 플랜지(3)를 클램핑할 수 있도록 조임력을 제공한다.Clamp shafts 8 are mounted in the horizontal through-holes of the second holders 7 respectively mounted at the ends of the links 6, which clamps the links 6 into polygons, Provide clamping force to clamp 3).
상기와 같이 구성된 본 고안의 작용상태를 설명한다.It describes the working state of the present invention configured as described above.
상기 진공라인(1, 2)간을 연결하기 위하여 그들 단부에 장착된 플랜지(3)가 맞물리도록 하고, 상기 맞물린 플랜지(3) 사이에는 기밀을 유지하기 위한 O링을 삽입한다. 그리고, 상기 맞물린 플랜지(3)에는 링크(6)에 의해 연결된 다수의 제 1 홀더(4)가 삽입되며, 이 상태에서 제 2 홀더(7)의 수평 관통홀에 클램프 샤프트(8)를 체결하여 조임력을 가한다. 상기 제 1 및 제 2 홀더(4, 7)의 내면은 소정 각도로 좁혀지는 경사면을 형성하고 있으므로 상기 클램프 샤프트(8)를 조임에 따라 링크(6)에 의해 연결된 홀더의 내면 안쪽으로 플랜지(3)가 점점 삽입되어 조여지게 된다. 이때, 상기 클램프 샤프트(8)의 조임 구동에 따라 다수의 제 1 홀더(4)와 제 2 홀더(7)에는 일정하게 조임력이 제공되는 것이다.In order to connect the vacuum lines 1 and 2, the flanges 3 mounted at their ends are engaged, and an O-ring for maintaining airtightness is inserted between the engaged flanges 3. In addition, a plurality of first holders 4 connected by the links 6 are inserted into the engaged flanges 3, and in this state, the clamp shaft 8 is fastened to the horizontal through holes of the second holders 7. Apply tightening force. Since the inner surfaces of the first and second holders 4 and 7 form an inclined surface that is narrowed at a predetermined angle, the flanges 3 into the inner surface of the holder connected by the link 6 as the clamp shaft 8 is tightened. ) Is gradually inserted and tightened. At this time, a plurality of first holder 4 and the second holder 7 is provided with a constant tightening force in accordance with the tightening drive of the clamp shaft (8).
본 실시예에서는 3 진공라인에 적용하여 4개의 홀더로 플랜지를 조여주는 예를 보여주고 있으나, 상기 홀더수를 늘려 다각형 링크 조합을 이룸으로써 다양한 사이즈의 진공라인에 적용하여 플랜지 이음을 할 수 있다.This embodiment shows an example of tightening the flange with four holders by applying to three vacuum lines, but by increasing the number of holders to form a polygonal link combination, flange joints can be applied to vacuum lines of various sizes.
또한, 본 실시예에서는 진공라인을 예로 설명하고 있으나, 이에 국한하는 것은 아니고, 유량라인이나 기타 튜브의 연결용에 적용할 수 있음은 주지의 사실이다.In addition, although the vacuum line is described as an example in the present embodiment, it is well known that the present invention can be applied to the connection of flow lines or other tubes.
이상에서 설명한 본 고안은 전술한 실시예 및 첨부된 도면에 의해 한정되는 것은 아니고, 본 고안의 기술적 사상을 벗어나지 않는 범위내에서 여러 가지 치환, 변형 및 변경이 가능함은 본 고안이 속하는 기술분야에서 통상의 지식을 가진 자에게 있어 명백할 것이다.The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes are possible within the scope without departing from the technical spirit of the present invention. It will be evident to those who have knowledge of.
전술한 바와 같이 본 고안에 따르면, 클램프 샤프트 하나의 구동만으로 제 1 및 제 2 홀더가 플랜지를 조여주게 되므로 진공라인간의 결합작업을 신속히 수행하여 작업능률을 향상시키며, 또한 상기 링크의 다각형 조합에 의해 홀더가 일정하게 플랜지를 가압해 주므로 한쪽으로 편중됨이 없이 균일하게 플랜지를 조여주어 누수의 발생을 제거할 수 있는 효과를 가진다.As described above, according to the present invention, since the first and second holders tighten the flange by only one driving of the clamp shaft, the coupling operation between the vacuum lines can be performed quickly, thereby improving the work efficiency, and also by the polygonal combination of the links. Since the holder presses the flange constantly, it has the effect of eliminating the leakage by tightening the flange uniformly without being biased to one side.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960058657U KR200160146Y1 (en) | 1996-12-27 | 1996-12-27 | Connecting device for vacuum line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960058657U KR200160146Y1 (en) | 1996-12-27 | 1996-12-27 | Connecting device for vacuum line |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19980045515U true KR19980045515U (en) | 1998-09-25 |
| KR200160146Y1 KR200160146Y1 (en) | 1999-11-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019960058657U KR200160146Y1 (en) | 1996-12-27 | 1996-12-27 | Connecting device for vacuum line |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200160146Y1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101489548B1 (en) * | 2010-11-12 | 2015-02-03 | 도쿄엘렉트론가부시키가이샤 | Vacuum processing apparatus and assembly method thereof |
-
1996
- 1996-12-27 KR KR2019960058657U patent/KR200160146Y1/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101489548B1 (en) * | 2010-11-12 | 2015-02-03 | 도쿄엘렉트론가부시키가이샤 | Vacuum processing apparatus and assembly method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR200160146Y1 (en) | 1999-11-01 |
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