KR102673188B1 - Inductor device - Google Patents

Abstract

An inductor element is disclosed. The disclosed inductor element includes a conductive coil, a magnetic body portion surrounding the conductive coil, a first terminal electrically connected to the conductive coil and including a portion extending along a first surface area of the magnetic body portion, and a first terminal electrically connected to the conductive coil. a second terminal connected to and including a portion extending along a second surface area of the magnetic body portion, a shielding cover portion disposed to cover at least a portion of the magnetic body portion and including a conductive material, and the shielding cover portion; It may include a heat dissipating material layer disposed between the magnetic body portions and having relatively higher thermal conductivity in the in-plane direction than in the out-of-plane direction.

Description

Inductor device {Inductor device}

The present invention relates to electronic devices, and more specifically to inductor devices.

Generally, an inductor is a device that generates inductance by winding a coil made of a conductor around a magnetic core, and can generate electromagnetism by flowing a current through the coil. In addition, an inductor is an element that removes noise in the corresponding frequency band by using the characteristic of increasing impedance in proportion to the frequency of the signal, or amplifies the signal in a specific frequency band by forming a resonance circuit with a capacitor. They are passive elements that together become important components of electrical or electronic circuits. In particular, an inductor in which a coil is embedded inside a magnetic core to form an integrated structure can obtain high inductance by maximizing the magnetic effective cross-sectional area, and can be usefully used in electric vehicle circuits, etc.

In the process of applying a magnetic field in a specific direction to the magnetic core of an inductor, removing the magnetic field, and then applying a magnetic field in the opposite direction, energy loss may occur. This loss is called hysteresis loss. When a current is applied to the coil, a magnetic field is induced in the magnetic core according to Ampere's law, and this induced magnetic field can cause a current to flow in the magnetic core according to Lenz's law. At this time, the current flowing in the magnetic core causes Energy loss occurs, and this is called eddy current loss. These hysteresis losses and eddy current losses are not always negative when considering the various applications of inductors, but it may be desirable to reduce these losses whenever possible.

When current flows through the inductor's coil, energy can be temporarily stored in the magnetic field within the coil, and when the current flowing through the inductor changes, the time-varying magnetic field induces a voltage in the conductor according to Faraday's law. As a result of their magnetic field-based operation, inductors can generate electric and magnetic fields that may interfere with, hinder, or reduce the performance of other electronic components adjacent to them. Additionally, other electric fields, magnetic fields, or static charges generated from electrical components on the circuit board may interfere with, hinder, or degrade the performance of the inductor. Accordingly, electromagnetic shielding for the inductor may be required.

Meanwhile, heat generated from electronic devices such as inductors can have a significant impact on the lifespan and reliability of the product. If the heat generated from the inductor element continues, the efficiency (Q value) decreases, and problems such as thermal damage and thermal runaway occur as the temperature of the element repeatedly rises, which will directly affect the entire product to which the inductor is applied. You can. Therefore, there is a need for technology that can reduce the generation of Joule heating caused by current or eddy current flowing in the coil, or appropriately eliminate and/or eliminate it.

The technical problem to be achieved by the present invention is to provide an inductor element that has excellent electromagnetic shielding performance and greatly improves heat dissipation performance, thereby effectively suppressing and/or preventing problems such as reduced efficiency due to heat generation, thermal damage, and thermal runaway. It is provided.

In addition, the technical problem to be achieved by the present invention is to reduce current consumption and improve the distribution characteristics of current consumption by applying a material (raw material) with enhanced insulation properties and excellent physical properties to the magnetic body (core). The purpose is to provide an inductor element that has

The problem to be solved by the present invention is not limited to the problems mentioned above, and other problems not mentioned will be understood by those skilled in the art from the description below.

According to one embodiment of the present invention, a conductive coil; a magnetic body surrounding the conductive coil; a first terminal electrically connected to the conductive coil and including a portion extending along a first surface area of the magnetic body portion; a second terminal electrically connected to the conductive coil and including a portion extending along a second surface area of the magnetic body portion; a shielding cover portion disposed to cover at least a portion of the magnetic body portion and including a conductive material; And an inductor element disposed between the shielding cover and the magnetic body and including a heat dissipating material layer having relatively higher thermal conductivity in the in-plane direction than in the out-of-plane direction ( inductor device) is provided.

The heat insulating material layer may have a thermal conductivity that is about 50 to 200 times higher in the in-plane direction than in the out-of-plane direction.

The heat insulating material layer may include graphite.

The heat insulating material layer may be formed on the inner surface of the shielding cover.

It may further include an adhesive layer disposed between the shielding cover portion and the heat dissipating material layer.

The shielding cover portion includes a top cover portion that covers the top surface of the magnetic body portion; a first side cover part extending from the upper cover part and covering a first side of the magnetic body part; and a second side cover part extending from the upper cover part and covering a second side face of the magnetic body part facing the first side surface.

A first side hole may be formed in the first side cover part, and a second side hole may be formed in the second side cover part.

A plurality of top holes may be formed in the top cover portion.

The heat dissipating material layer may be disposed between the top cover and the magnetic body, and an air gap may be formed between the first side cover and the magnetic body and between the second side cover and the magnetic body. A gap can be created.

The air gap may have a thickness of about 25 ㎛ or more.

The magnetic main body may include a plurality of magnetic particles, and a multiple coating layer may be formed on the surface of the magnetic particle, wherein the multiple coating layer includes a first insulating coating layer covering the surface of the magnetic particle, and a first insulating coating layer on the first insulating coating layer. It may include a second insulating coating layer formed on the second insulating coating layer and a third insulating coating layer formed on the second insulating coating layer.

The first insulating coating layer may include phosphate, the second insulating coating layer may include glass, and the third insulating coating layer may include a rust preventive agent.

The first insulating coating layer may include phosphate, the second insulating coating layer may include a rust preventive, and the third insulating coating layer may include glass.

According to another embodiment of the present invention, a conductive coil; a magnetic body surrounding the conductive coil; a first terminal electrically connected to the conductive coil and including a portion extending along a first surface area of the magnetic body portion; a second terminal electrically connected to the conductive coil and including a portion extending along a second surface area of the magnetic body portion; and a shielding cover portion disposed to cover at least a portion of the magnetic body portion and including a conductive material, wherein the magnetic body portion includes a plurality of magnetic particles, and a multiple coating layer is formed on the surface of the magnetic particles, The multiple coating layer is an inductor device including a first insulating coating layer covering the surface of the magnetic particle, a second insulating coating layer formed on the first insulating coating layer, and a third insulating coating layer formed on the second insulating coating layer. provided.

The first insulating coating layer may include phosphate, the second insulating coating layer may include glass, and the third insulating coating layer may include a rust preventive agent.

The first insulating coating layer may include phosphate, the second insulating coating layer may include a rust preventive, and the third insulating coating layer may include glass.

It is disposed between the shielding cover part and the magnetic body part, and may further include a heat dissipating material layer having relatively higher thermal conductivity in an in-plane direction than in an out-of-plane direction.

The heat insulating material layer may include graphite.

According to embodiments of the present invention, it is possible to implement an inductor element that has excellent electromagnetic shielding performance and excellent heat dissipation performance, thereby effectively suppressing/preventing problems such as reduced efficiency due to heat generation, thermal damage, and thermal runaway. You can.

In addition, according to embodiments of the present invention, by applying a material (raw material) with enhanced insulation properties and excellent physical properties to the magnetic main body (core), current consumption can be reduced and the distribution characteristics of current consumption can be improved. It is possible to implement an inductor element that can

However, the effects of the present invention are not limited to the above effects and can be expanded in various ways without departing from the technical spirit and scope of the present invention.

1 is a diagram showing a partial configuration of an inductor device according to an embodiment of the present invention.
Figure 2 is an internal perspective view showing a partial configuration of an inductor element according to an embodiment of the present invention.
Figure 3 is a diagram showing an inductor element according to an embodiment of the present invention.
Figure 4 is a perspective view showing a shielding cover and a heat dissipating material layer that can be applied to an inductor element according to an embodiment of the present invention.
Figure 5 is a cross-sectional view showing a combined structure of a shielding cover and a heat dissipating material layer that can be applied to an inductor device according to another embodiment of the present invention.
Figure 6 is a perspective view showing a shielding cover that can be applied to an inductor element according to another embodiment of the present invention.
Figure 7 is a plan view showing a shielding cover that can be applied to an inductor element according to another embodiment of the present invention.
Figure 8 is a graph showing temperature change characteristics according to change in current application time for inductor elements according to the embodiment, first comparative example, and second comparative example described in Table 1.
Figure 9 is a graph showing temperature change characteristics according to change in current application time for inductor elements according to the embodiment, first comparative example, and second comparative example described in Table 1.
FIG. 10 is an image taken by a thermal imaging camera showing temperature change characteristics according to a change in current application time for inductor elements according to the embodiment, first comparative example, and second comparative example described in Table 1.
Figure 11 is a perspective view showing a combined structure of a shielding cover and a heat dissipating material layer that can be applied to an inductor element according to another embodiment of the present invention.
Figure 12 is a graph showing the change in surface resistance according to the thickness of the air gap of an inductor element according to another embodiment of the present invention.
13 and 14 are diagrams for explaining an inductor element according to another embodiment of the present invention.
Figure 15 is a graph showing the current consumption characteristics of inductor elements according to the examples and comparative examples described in Table 2.
Figure 16 is a graph showing the current consumption characteristics of inductor elements according to the examples and comparative examples described in Table 2.

Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings.

The embodiments of the present invention described below are provided to explain the present invention more clearly to those skilled in the art, and the scope of the present invention is not limited by the examples below. The embodiment may be modified in several different forms.

The terms used herein are used to describe specific embodiments and are not intended to limit the invention. As used herein, singular terms may include plural forms unless the context clearly indicates otherwise. Additionally, as used herein, the terms “comprise” and/or “comprising” refer to the term “comprise” and/or “comprising” to specify the presence of the mentioned shapes, steps, numbers, operations, members, elements and/or groups thereof. and does not exclude the presence or addition of one or more other shapes, steps, numbers, operations, members, elements and/or groups thereof. In addition, the term "connection" used in this specification not only means that certain members are directly connected, but also includes indirectly connected members with other members interposed between them.

In addition, when a member is said to be located “on” another member in the present specification, this includes not only the case where a member is in contact with another member, but also the case where another member exists between the two members. As used herein, the term “and/or” includes any one and all combinations of one or more of the listed items. In addition, terms such as “about” and “substantially” used in the specification herein are used in the sense of a range or close to the numerical value or degree, taking into account unique manufacturing and material tolerances, and to aid understanding of the present application. Precise or absolute figures provided for this purpose are used to prevent infringers from taking unfair advantage of the stated disclosure.

Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. The size or thickness of areas or parts shown in the attached drawings may be somewhat exaggerated for clarity of specification and convenience of explanation. Like reference numerals refer to like elements throughout the detailed description.

1 is a diagram showing a partial configuration of an inductor device according to an embodiment of the present invention. Figure 1 (A) shows the top side of the corresponding configuration of the inductor element, and drawing (B) shows the bottom side of the corresponding configuration of the inductor element. Figure 2 is an internal perspective view showing a partial configuration of an inductor element according to an embodiment of the present invention.

Referring to FIGS. 1 and 2 , the inductor device according to an embodiment of the present invention may include a conductive coil ( 10 in FIG. 2 ) and a magnetic body portion 20 surrounding the conductive coil 10 . The conductive coil 10 may be said to be buried or embedded within the magnetic body portion 20. The magnetic body portion 20 may be referred to as a magnetic core or core body portion. The inductor element may include a first terminal 30a and a second terminal 30b electrically connected to the conductive coil 10. The first terminal 30a may include a portion extending along a first surface area of the magnetic body portion 20, and the second terminal 30b may include a portion extending along a second surface area of the magnetic body portion 20. may include parts that are

The magnetic body portion 20 may have a hexahedral structure, a structure somewhat modified from the hexahedron structure, or a structure similar to the hexahedron structure. The magnetic body portion 20 may have an upper surface (S10) and a lower surface (S30) facing it, and may have four side surfaces (S21, S22, S23, and S24). The first side S21 and the second side S22 may be arranged to be parallel and face each other, and the third side S23 and the fourth side S24 may be arranged to be parallel and face each other.

The first terminal 30a may have a shape extending from the third side S23 to a portion of the lower surface S30 adjacent thereto, and the second terminal 30b may extend from the third side S23 to a portion of the lower surface S30 adjacent thereto. It may have a shape that extends to a portion of the lower surface (S30). A groove area (first groove area) in which the first terminal 30a can be seated may be provided in a portion of the third side S23 and the lower surface S30 adjacent thereto. Similarly, a groove area (second groove area) in which the second terminal 30b can be seated may be provided in a portion of the fourth side S24 and the lower surface S30 adjacent thereto.

The inductor element described with reference to FIGS. 1 and 2 may further include a shielding cover portion that covers at least a portion of the magnetic body portion 20 . An example is shown in Figure 3. Figure 3 is a diagram showing an inductor element according to an embodiment of the present invention.

Referring to FIG. 3, the inductor device according to an embodiment of the present invention may further include a shielding cover portion 50 disposed to cover at least a portion of the magnetic body portion 20. The shielding cover 50 may include a conductive material, for example, a metallic material. The shielding cover 50 may be an electromagnetic shield, that is, an electromagnetic interference (EMI) shield. The shielding cover part 50 may be arranged to cover the top surface (S10 in FIG. 1) and at least two side surfaces (for example, S21 and S22 in FIG. 1) of the magnetic body part 20.

However, the specific structure of the inductor element shown and described with reference to FIGS. 1 to 3 is illustrative and may vary depending on the case. For example, various known technologies may be referred to for the shape of the conductive coil 10, the shape and location of the first and second terminals 30a and 30b, and the structure of the shielding cover 50, thereby The scope of the present invention is not limited. As a non-limiting example, the conductive coil 10 may have a circular as well as a square cross-sectional structure, and there may be two or more conductive coils 10, and the first and second terminals 30a and 30b are formed on the same side. It could be.

Although not shown in FIG. 3, the inductor element according to an embodiment of the present invention may further include a 'heat dissipation material layer' disposed between the shielding cover part 50 and the magnetic body part 20. The heat insulating material layer will be described in more detail with reference to FIG. 4 and the like. Figure 4 is a perspective view showing the shielding cover portion 50A and the heat dissipation material layer 40 that can be applied to the inductor element according to an embodiment of the present invention.

Referring to FIG. 4, according to an embodiment of the present invention, a heat dissipating material layer 40 may be disposed between the shielding cover portion 50A and the magnetic body portion (20 in FIGS. 1 to 3). The heat insulating material layer 40 may have relatively higher thermal conductivity in the in-plane direction than in the out-of-plane direction. Here, the in-plane direction may mean a direction parallel to the plane formed by the heat dissipation layer 40 (i.e., plane direction). The out-of-plane direction is a direction perpendicular to the in-plane direction (i.e., the plane direction), and can be said to be the thickness direction of the heat radiation layer 40.

The heat insulating material layer 40 may have a thermal conductivity that is, for example, about 40 to 200 times higher in the in-plane direction than in the out-of-plane direction. Additionally, the heat insulating material layer 40 may have higher (excellent) thermal conductivity in the in-plane direction than that of the shielding cover portion 50A. For example, the heat dissipating material layer 40 is about 2 to 100 times or about 10 times or more in the in-plane direction than the shielding cover 50A, for example, a shielding cover formed of copper. It can have high thermal conductivity.

As a specific example, the heat insulating material layer 40 may include graphite. The heat insulating material layer 40 may be formed of graphite or may include graphite as a main constituent material. Graphite may have a layered structure, and due to the layered structure, it may have significantly higher thermal conductivity in the in-plane direction compared to the out-of-plane direction. The heat dissipating material layer 40 may have a film structure or a layered structure in which planar graphite molecules are generally aligned in the in-plane direction of the heat dissipating material layer 40 and sintered. However, this is illustrative and the present invention is not limited thereto. Additionally, in the embodiment of the present invention, the material of the heat dissipation layer 40 is not limited to graphite and may vary depending on the case.

The heat insulating material layer 40 may have a thickness of, for example, about 5 ㎛ to 50 ㎛. According to one embodiment, the thickness of the heat insulating material layer 40 may be about 5 ㎛ to 30 ㎛ or about 5 ㎛ to 20 ㎛. The heat dissipation layer 40 can exhibit excellent heat dissipation characteristics while having a relatively thin thickness.

The heat insulating material layer 40 may be formed on the inner surface (inner surface) of the shielding cover portion 50A. The heat insulating material layer 40 may be attached, deposited, or applied to the inner surface of the shielding cover portion 50A. With the heat dissipation layer 40 formed on the inner surface of the shielding cover 50A, the shielding cover 50A can be mounted or attached to the magnetic body portion of the inductor (20 in FIGS. 1 to 3). there is. Accordingly, the heat dissipating material layer 40 may be in contact with at least a portion of the magnetic body portion (20 in FIGS. 1 to 3). The heat insulating material layer 40, which has high thermal conductivity in the in-plane direction, maximizes heat diffusion ability even at a thin thickness, thereby increasing heat dissipation efficiency to the outside through the shielding cover. The thermal diffusion ability can improve heat dissipation efficiency by allowing heat dissipation to occur across the board while suppressing the bottleneck phenomenon of heat dissipation due to a limited heat dissipation path.

According to one embodiment, the shielding cover portion 50A is a top cover portion 52 that covers the upper surface (S10 in FIG. 2) of the magnetic body portion (20 in FIG. 2), and is positioned perpendicularly from the upper cover portion 52. (or generally vertically) extends vertically from the first side cover part 58a and the top cover part 52, which cover the first side (S21 in Figure 2) of the magnetic body part (20 in Figure 2) A second side cover portion extending (or generally vertically) and covering the second side (S22 in FIG. 2) facing the first side (S21 in FIG. 2) of the magnetic body portion (20 in FIG. 2) (58b) may be included.

A first side cover part 58a and a second side cover part 58b may be provided at one end and the other end of the top cover part 52 in the first direction, respectively. A first extension portion 53a and a second extension portion 53b may be provided at one end and the other end of the top cover portion 52 along the second direction perpendicular to the first direction. The first extension part 53a and the second extension part 53b may serve to facilitate mounting or attachment of the shielding cover part 50A to the magnetic body part (20 in FIG. 2).

The first side cover portion 58a may include a first portion 55a having a relatively large width and a second portion 56a having a relatively small width. The first part 55a may be connected to one end of the top cover 52, and the second part 56a may extend from the center of the lower end of the first part 55a. Similarly, the second side cover portion 58b may include a first portion 55b having a relatively large width and a second portion 56b having a relatively small width. The first part 55b may be connected to the other end of the top cover 52, and the second part 56b may extend from the center of the lower end of the first part 55b.

The heat insulating material layer 40 may be formed entirely or substantially entirely on the inner surface of the shielding cover portion 50A. In this case, the heat insulating material layer 40 may be formed conformally to a predetermined thickness on the inner surface of the top cover part 52 and the inner surfaces of each of the first and second side cover parts 58a and 58b.

According to an embodiment of the present invention, by using the heat dissipation layer 40 having excellent heat dissipation characteristics, that is, the heat dissipation material layer 40 has higher thermal conductivity in the in-plane direction than in the out-of-plane direction. ) By using the conductive coil (10 in FIG. 2) and the magnetic body part (20 in FIG. 2), heat generated from the conductive coil (20 in FIG. 2) is diffused to the entire area and effectively dissipated, thereby greatly improving heat dissipation performance. In particular, when applying the heat insulating material layer 40 made of graphite, etc. to the inner surface of the shielding cover 50A, the heat conduction characteristics are improved and the heat generated from the conductive coil (10 in FIG. 2) is transferred to the surrounding area (board area). ), the surface temperature of the inductor element can be significantly lowered. In particular, when heat generation occurs locally in the inductor element, the heat sink layer 40 can achieve rapid heat dissipation due to high heat conduction in the in-plane direction. Therefore, according to the embodiment, it is possible to implement an inductor element that has excellent electromagnetic shielding performance and excellent heat dissipation performance, thereby effectively suppressing and/or preventing problems such as reduced efficiency due to heat generation, thermal damage, and thermal runaway. You can.

FIGS. 5A and 5B are cross-sectional views showing the combined structure of the shielding cover portion 50A and the heat dissipating material layer 40 that can be applied to inductor devices according to other embodiments of the present invention.

Referring to FIG. 5A, in the inductor device according to an embodiment of the present invention, an adhesive layer 45 may be further disposed between the shielding cover portion 50A and the heat dissipating material layer 40. Referring to FIG. 5B, the adhesive layer 45 may be disposed between the heat dissipating material layer 40 and the magnetic main body 20.

The adhesive layer 45 may be referred to as an adhesive layer. The adhesive layer 45 may be made of flexible plastic (polymer) and may have a type of film or layer form. The adhesive layer 45 may have a thickness of, for example, several μm to several tens of μm. According to one example, the thickness of the adhesive layer 45 may be about 10 μm or less. According to one embodiment, with the heat insulating material layer 40 formed on one side of the adhesive layer 45, the other side of the adhesive layer 45 is attached to the shielding cover portion 50A or the magnetic body portion 45, The heat dissipating material layer 40 can be formed by attaching it to the shielding cover portion 50A and the magnetic body portion 20. However, this is an example, and the adhesive layer 45 may not be used.

Figure 6 is a perspective view showing a shielding cover portion 50B that can be applied to an inductor element according to another embodiment of the present invention.

Referring to FIG. 6, the shielding cover part 50B has a structure similar to the shielding cover part 50A described in FIG. 4, and includes a first side hole H1 formed in the first side cover part 58a' and It may include a second side hole (H2) formed in the second side cover portion (58b'). The first and second side holes H1 and H2 may be through holes.

The first side cover portion 58a' may include a first part 55a' having a relatively large width and a second part 56a' having a relatively small width. Similarly, the second side cover portion 58b' may include a first portion 55b' having a relatively large width and a second portion 56b' having a relatively small width. The first side hole (H1) may be formed in the first portion (55a') of the first side cover portion (58a'), and the second side hole (H2) may be formed in the first portion (55a') of the second side cover portion (58b'). It may be formed in one part 55b'.

As a non-limiting example, the first side hole H1 may have a rectangular shape and, for example, may be formed with a width greater than that of the second portion 56a'. The first side hole H1 may have a larger size than the second portion 56a'. As a non-limiting example, the second side hole H2 may have a rectangular shape and, for example, may be formed with a width greater than that of the second portion 56b'. The second side hole H2 may have a larger size than the second portion 56b'. The first side hole H1 and the second side hole H2 can be formed at appropriate positions without reducing the electromagnetic wave shielding ability of the shielding cover portion 50B.

Although not shown in FIG. 6, a heat insulating material layer may be formed on the inner surface of the shielding cover portion 50B. The heat dissipating material layer may correspond to the heat dissipating material layer 40 described in FIGS. 4 and 5.

According to the embodiment of Figure 6, by forming the first side hole (H1) in the first side cover portion (58a') and forming the second side hole (H2) in the second side cover portion (58b'), the side The heat dissipation efficiency can be improved. Additionally, by reducing the contact area on the side between the shielding cover portion 50B and the magnetic body portion (20 in FIG. 2), current consumption can be reduced and eddy current loss can be reduced. Additionally, when the heat dissipating layer 40 described in FIGS. 4 and 5 is formed, the inner heat dissipating material layer may be exposed to the outside through the side holes H1 and H2.

Figure 7 is a plan view showing a shielding cover portion 50C that can be applied to an inductor element according to another embodiment of the present invention.

Referring to FIG. 7, the shielding cover portion 50C has a structure similar to the shielding cover portion 50A described in FIG. 4, but may include a plurality of top holes H30 formed in the top cover portion 52'. You can. The plurality of top holes H30 may be through holes. Each of the plurality of upper holes H30 may have a diameter of about 1 mm or less. The plurality of top holes H30 may be arranged regularly at regular intervals. Although not shown, a heat dissipating material layer may be formed on the inner surface of the shielding cover portion 50C. The heat dissipating material layer may correspond to the heat dissipating material layer 40 described in FIGS. 4 and 5.

According to the embodiment of FIG. 7, the plurality of upper holes H30 serve to improve heat dissipation efficiency through the upper cover portion 52' without reducing the electromagnetic shielding function of the shielding cover portion 50C. can do.

Table 1 below shows the temperature change due to current application of the inductor element according to an embodiment of the present invention and the inductor element according to the first comparative example (Comparative Example 1) and the second comparative example (Comparative Example 2) that can be compared thereto. This is a summary of the results of measuring characteristics. Here, the inductor element according to the above embodiment is a case in which a heat dissipating material layer formed of graphite is applied to the inner surface of the shielding cover. The inductor device according to the first comparative example is a case in which no heat dissipating material layer is applied. The inductor element according to the second comparative example is a case in which a heat dissipating material layer formed of thermal grease is applied to the inner surface of the shielding cover. In the above Example, Comparative Example 1, and Comparative Example 2, all shielding cover parts made of copper (Cu) were used. The thermal conductivity (out-of-plane thermal conductivity) of copper (Cu) may be about 400 W/mK, and the thermal conductivity (out-of-plane thermal conductivity) of thermal grease may be about 3.8 W/mK. The out-of-plane thermal conductivity of graphite may be about 9 to 15 W/mK, and the in-plane thermal conductivity may be about 1,500 W/mK. Meanwhile, the thermal conductivity (out-of-plane thermal conductivity) of air may be about 0.025 W/mK.

division Room temperature (℃) △T (℃) Comparative Example 1 Comparative example 2 Example Comparative Example 1 Comparative example 2 Example electric current
is it
hour
(min) 0 50.3 54.6 50.1 0 0 0 One 57 62.1 57.6 6.7 7.5 7.5 2 58.7 69.8 64.8 8.4 15.2 14.7 3 68.1 76.6 71.3 17.8 22 21.2 4 75.4 82.8 77.1 25.1 28.2 27 5 90.8 90.8 84.3 40.5 36.2 34.2 6 105 105 97.6 54.7 50.4 47.5 7 118 108 101 67.7 53.4 50.9 8 124 111 104 73.7 56.4 53.9 9 125 113 107 74.7 58.4 56.9 10 127 115 109 76.7 60.4 58.9 11 129 116 111 78.7 61.4 60.9 12 130 117 111 79.7 62.4 60.9 13 134 118 113 83.7 63.4 62.9 14 134 120 115 83.7 65.4 64.9 15 135 120 115 84.7 65.4 64.9

Table 1 above shows the change in surface temperature of the inductor elements according to the current application time while applying a current of 20 volts and 10A to the inductor elements according to each of the above Example, Comparative Example 1, and Comparative Example 2. The actual temperature (real temperature) and temperature change (ΔT) according to the change in current application time were measured.

Figure 8 is a graph showing temperature change characteristics according to change in current application time for inductor elements according to the embodiment, first comparative example, and second comparative example described in Table 1. Figure 8 graphically expresses some of the results in Table 1.

Referring to FIG. 8, it can be seen that the temperature increase of the inductor device according to the above embodiment is less than that of the inductor device according to the first and second comparative examples as the current application time increases.

Figure 9 is a graph showing temperature change characteristics according to change in current application time for inductor elements according to the embodiment, first comparative example, and second comparative example described in Table 1. Figure 9 graphically expresses some of the results in Table 1.

Referring to FIG. 9, it can be seen that the temperature increase rate of the inductor device according to the above embodiment as the current application time increases is significantly lower than that of the inductor device according to the first comparative example.

FIG. 10 is an image taken by a thermal imaging camera showing temperature change characteristics according to a change in current application time for inductor elements according to the embodiment, first comparative example, and second comparative example described in Table 1.

Referring to FIG. 10, it can be seen that the temperature increase of the inductor device according to the above embodiment is less than that of the inductor device according to the first and second comparative examples as the current application time increases.

From the results of FIGS. 8 to 10, it can be seen that the inductor according to the above embodiment exhibits better heat dissipation performance than the inductors according to the first and second comparative examples.

Figure 11 is a perspective view showing the combined structure of the shielding cover portion 50A and the heat dissipating material layer 40' that can be applied to an inductor device according to another embodiment of the present invention.

Referring to FIG. 11, the shielding cover portion 50A may have the same structure as described in FIG. 4 or a similar structure. In this embodiment, the heat dissipating material layer 40' may be formed (placed) only on the inner surface of the upper cover part 52 of the shielding cover part 50A. A heat dissipating material layer may not be formed (disposed) on the inner surfaces of the first and second side covers 58a and 58b of the shielding cover 50A. In this case, a heat dissipating material layer 40' may be disposed between the top cover 52 and the magnetic body portion (20 in FIG. 2), and the first side cover portion 58a and the magnetic body portion (20 in FIG. 2). An air gap may be provided between 20) and between the second side cover part 58b and the magnetic body part (20 in FIG. 2). Here, the air gap may have a thickness of about 25 ㎛ or more. For example, the air gap may have a thickness of about 25 to 50 μm.

By using the above-described air gap, the surface resistance (insulation resistance) of the inductor element can be improved, and as the insulation resistance increases, the effect of lowering current consumption and stabilizing current consumption characteristics can be obtained. To enhance this effect, it may be desirable for the air gap to have a thickness of about 25 ㎛ or more.

Figure 12 is a graph showing the change in surface resistance according to the thickness of the air gap of an inductor element according to another embodiment of the present invention. Here, the structure of the inductor element having the air gap may be the same as that described with reference to FIG. 11.

Referring to FIG. 12, when the air gap is about 25 ㎛ or more, the surface resistance of the inductor element can be significantly increased. Therefore, as the surface resistance (insulation resistance) of the inductor element increases, the effect of lowering current consumption and stabilizing current consumption characteristics can be obtained. The air gap may preferably have a thickness of, for example, about 25 to 50 μm or about 25 to 45 μm.

13 and 14 are diagrams for explaining an inductor element according to another embodiment of the present invention.

13 and 14, the inductor element according to another embodiment of the present invention includes a conductive coil 10, a magnetic body portion 20A surrounding the conductive coil 10, a first terminal 30a, and a second terminal 30a. It may include a terminal 30b. This structure may be similar to that described with reference to FIGS. 1 to 3, etc. For convenience, although not shown in FIG. 13, a shielding cover portion that covers at least a portion of the magnetic body portion 20A may be further provided.

In this embodiment, the magnetic body portion 20A may include a plurality of magnetic particles 5, and a multiple coating layer 7 may be formed on the surface of the magnetic particles 5. Here, the magnetic particles 5 may include iron (Fe), for example. The multiple coating layer 7 is formed on a first insulating coating layer 7a covering the surface of the magnetic particles 5, a second insulating coating layer 7b formed on the first insulating coating layer 7a, and a second insulating coating layer 7b. It may include a third insulating coating layer 7c formed. Accordingly, the multiple coating layer 7 may be a triple coating layer (triple insulating coating layer).

The first to third insulating coating layers 7a, 7b, and 7c may have different material compositions. As a specific example, the first insulating coating layer 7a may include phosphate, the second insulating coating layer 7b may include glass, and the third insulating coating layer 7c may include a rust preventive agent. The first insulating coating layer 7a may be a phosphate layer, the second insulating coating layer 7b may be a glass layer, and the third insulating coating layer 7c may be a rust preventive layer. Here, the glass may be formed from water glass. The rust inhibitor may include, for example, a potassium-based material and silicon oxide (SiO ₂ ). The potassium-based material may serve to provide water-repellent properties. The rust preventive material is not limited to the above, and various common rust preventive materials can be used. The first to third insulating coating layers 7a, 7b, and 7c can be formed through multiple coating processes on the magnetic particles 5.

According to another embodiment, the first insulating coating layer 7a may include phosphate, the second insulating coating layer 7b may include a rust inhibitor, and the third insulating coating layer 7c may include glass. . The first insulating coating layer 7a may be a phosphate layer, the second insulating coating layer 7b may be a rust preventive layer, and the third insulating coating layer 7c may be a glass layer. Even if the materials of the second insulating coating layer 7b and the third insulating coating layer 7c are reversed, generally similar effects can be achieved.

According to an embodiment of the present invention, by constructing the magnetic body portion 20A using raw materials whose insulating properties have been strengthened by applying the multiple coating layer 7, the insulation of the magnetic body portion 20A itself can be strengthened, and as a result, , it is possible to obtain the effect of lowering the current consumption of the inductor element and improving the current consumption characteristics. In particular, when applying a triple or more insulating coating layer using phosphate, glass (water glass), and a rust preventive agent, the above-mentioned effects can be greatly improved.

An increase in current consumption increases the possibility of affecting surrounding devices due to an increase in magnetic field, and may cause an increase in temperature due to a decrease in the efficiency of the component. Current consumption may increase depending on the degree of contact between the non-insulated shielding cover and the magnetic body due to external factors such as size tolerance or deformation of the shielding cover. However, as in the embodiment of the present invention, when the magnetic body portion 20A is manufactured from a raw material (i.e., 5) whose insulation is strengthened by applying a multi-coating layer 7, the magnetic body portion 20A and the shielding cover Regardless of the degree of negative contact, the current consumption shows a stable distribution and the current consumption characteristics can be improved. Therefore, in this case, current consumption characteristics can be improved even if there is no separate insulator between the magnetic body portion 20A and the shielding cover portion.

Additionally, in an embodiment of the present invention, a plurality of magnetic particles 5 to which the multi-coating layer 7 is applied are mixed with a predetermined binder material to prepare a mixture, and then the mixture is pressed and cured to produce a magnetic body portion ( 20A) can be manufactured. The pressure molding and curing methods may be the same or similar to well-known methods.

Table 2 below summarizes the results of evaluating the current consumption characteristics of the inductor device according to the embodiment of the present invention and the inductor device according to the comparative example. Here, the inductor element according to the above embodiment includes a magnetic body formed using magnetic particles to which a triple coating layer (i.e., triple surface treatment) has been applied, as described with reference to FIGS. 13 and 14. Meanwhile, the inductor device according to the comparative example includes a magnetic body formed using magnetic particles surface-treated (coated) with only phosphate. Evaluate the current consumption characteristics for a number of measurement samples (samples) corresponding to each of the above examples and comparative examples, and evaluate the current consumption characteristics for the 'normal state' and 'state with physical deformation/pressure applied' did. To evaluate the current consumption characteristics, a voltage of 12 volts was applied to the inductor element.

division Normal Physical strain/pressurization Comparative example Example Comparative example Example measurement sample Current consumption (mA) Current consumption (mA) Current consumption (mA) Current consumption (mA) One 168 161 183 162 2 162 162 170 162 3 162 162 164 162 4 172 162 188 162 5 162 161 162 161 6 167 162 183 162 7 162 162 169 162 8 162 162 170 162 9 162 162 170 162 10 162 161 172 162 11 162 162 175 162 12 162 162 185 162 13 162 162 173 162 14 164 161 182 164 15 164 162 172 162 16 165 161 185 161 17 163 162 184 162 18 164 162 186 162 19 176 161 180 161 20 163 161 181 161 21 161 161 172 162 22 161 162 161 163 23 164 162 169 162 24 161 161 171 161 25 162 161 177 161 26 162 161 176 161 27 167 161 194 161 28 161 161 179 161 29 163 161 169 164 30 162 161 176 161

Table 3 below organizes the data in Table 2 into Max, Min, and Average values. In Table 3, Max is the maximum current consumption among multiple measurement samples (samples), Min is the minimum current consumption among multiple measurement samples (samples), and Average is the consumption of multiple measurement samples (samples). Indicates the average value of current.

division Normal Physical strain/pressurization Comparative example Example Comparative example Example Current consumption
(mA) Max 176 162 194 164 Min 161 162 161 161 Average 164 161 176 162

Figure 15 is a graph showing the current consumption characteristics of inductor elements according to the examples and comparative examples described in Table 2. Figure 15 is a graph of the steady-state current consumption measurement results in Table 2.

Figure 16 is a graph showing the current consumption characteristics of inductor elements according to the examples and comparative examples described in Table 2. Figure 16 is a graph of the current consumption measurement results in the state of applying physical deformation/pressure in Table 2.

Referring to Figures 15 and 16, the inductor element according to the embodiment has low current consumption and uniform current consumption characteristics (i.e., current consumption characteristics with small deviation) both in the normal state and in the state with physical strain/pressure applied. You can check what it represents. On the other hand, in the case of the inductor element according to the comparative example, it can be confirmed that the difference in current consumption between measurement samples is large and the characteristics are uneven (unstable) both in the normal state and in the state with physical strain/pressure applied.

As in the comparative example, when the magnetic body manufactured from raw materials surface-treated only with phosphate was applied, the distribution of current consumption and the average absolute value increased depending on the contact strength between the magnetic body and the shielding cover. Current consumption may increase depending on the degree of contact between the poorly insulated shielding cover and the magnetic body due to external factors such as size tolerance and deformation of the shielding cover.

However, when the magnetic body made of raw materials with reinforced insulation properties using a triple coating layer is applied as in the example, the current consumption shows a stable distribution regardless of the degree of contact between the magnetic body and the shielding cover. Characteristics have been improved. Therefore, in the case of the embodiment, even if there is no insulator between the magnetic body portion and the shielding cover portion, the current consumption characteristics can be improved by the raw material with enhanced insulating properties.

According to the embodiments of the present invention described above, an inductor that has excellent electromagnetic shielding performance and excellent heat dissipation performance can effectively suppress/prevent problems such as reduced efficiency due to heat generation, thermal damage, and thermal runaway. The device can be implemented. In addition, according to embodiments of the present invention, by applying a material (raw material) with enhanced insulation properties and excellent physical properties to the magnetic main body (core), current consumption can be reduced and the distribution characteristics of current consumption can be improved. It is possible to implement an inductor element that can

In this specification, preferred embodiments of the present invention are disclosed, and although specific terms are used, they are merely used in a general sense to easily explain the technical content of the present invention and aid understanding of the invention, and do not define the scope of the present invention. It is not intended to be limiting. It is obvious to those skilled in the art that in addition to the embodiments disclosed herein, other modifications based on the technical idea of the present invention can be implemented. Those skilled in the art will understand that the inductor element according to the embodiment described with reference to FIGS. 1 to 16 may be variously substituted, changed, and modified without departing from the technical spirit of the present invention. You will be able to see that it exists. Therefore, the scope of the invention should not be determined by the described embodiments, but by the technical idea stated in the patent claims.

* Explanation of symbols for main parts of the drawing *
5: magnetic particles 7: multi-coating layer
7a: first insulating coating layer 7b: second insulating coating layer
7c: Third insulating coating layer 10: Conductive coil
20, 20A: magnetic main body 30a: first terminal
30b: second terminal 40, 40': heat insulating material layer
45: Adhesive layer 50, 50A∼50C: Shielding cover portion
52, 52': top cover part 53a, 53b: extension part
58a, 58a': first side cover part 58b, 58b': second side cover part
H1: 1st side hole H2: 2nd side hole
H30: Top hole S10: Top surface
S21∼S24: Side S30: Bottom side

Claims (14)

conductive coil;
a magnetic body surrounding the conductive coil;
a first terminal electrically connected to the conductive coil and including a portion extending along a first surface area of the magnetic body portion;
a second terminal electrically connected to the conductive coil and including a portion extending along a second surface area of the magnetic body portion;
a shielding cover portion disposed to cover at least a portion of the magnetic body portion and including a conductive material; and
It is disposed between the shielding cover portion and the magnetic body portion and includes a heat dissipating material layer having relatively higher thermal conductivity in an in-plane direction than in an out-of-plane direction,
The shielding cover portion includes a top cover portion that covers the top surface of the magnetic body portion; a first side cover extending from the top cover and covering a first side of the magnetic body; and a second side cover extending from the top cover and covering a second side of the magnetic body facing the first side,
An inductor device in which a first side hole is formed in the first side cover part and a second side hole is formed in the second side cover part. According to claim 1,
The heat dissipating material layer is an inductor element having a thermal conductivity that is 40 to 200 times higher in the in-plane direction than in the out-of-plane direction. According to claim 1,
The heat dissipating material layer is an inductor element containing graphite. According to claim 1,
The heat dissipating material layer is an inductor element formed on the inner surface of the shielding cover. According to claim 1,
The inductor element further includes an adhesive layer disposed between the shielding cover portion and the heat dissipating material layer. delete delete conductive coil;
a magnetic body surrounding the conductive coil;
a first terminal electrically connected to the conductive coil and including a portion extending along a first surface area of the magnetic body portion;
a second terminal electrically connected to the conductive coil and including a portion extending along a second surface area of the magnetic body portion;
a shielding cover portion disposed to cover at least a portion of the magnetic body portion and including a conductive material; and
It is disposed between the shielding cover portion and the magnetic body portion and includes a heat dissipating material layer having relatively higher thermal conductivity in an in-plane direction than in an out-of-plane direction,
The shielding cover portion includes a top cover portion that covers the top surface of the magnetic body portion; a first side cover extending from the top cover and covering a first side of the magnetic body; and a second side cover extending from the top cover and covering a second side of the magnetic body facing the first side,
An inductor element having a plurality of top holes formed in the top cover portion. conductive coil;
a magnetic body surrounding the conductive coil;
a first terminal electrically connected to the conductive coil and including a portion extending along a first surface area of the magnetic body portion;
a second terminal electrically connected to the conductive coil and including a portion extending along a second surface area of the magnetic body portion;
a shielding cover portion disposed to cover at least a portion of the magnetic body portion and including a conductive material; and
It is disposed between the shielding cover portion and the magnetic body portion and includes a heat dissipating material layer having relatively higher thermal conductivity in an in-plane direction than in an out-of-plane direction,
The shielding cover portion includes a top cover portion that covers the top surface of the magnetic body portion; a first side cover extending from the top cover and covering a first side of the magnetic body; and a second side cover extending from the top cover and covering a second side of the magnetic body facing the first side,
The heat dissipating material layer is disposed between the top cover portion and the magnetic body portion,
An inductor element having an air gap between the first side cover and the magnetic body and between the second side cover and the magnetic body. According to claim 1,
The magnetic body portion includes a plurality of magnetic particles,
A multiple coating layer is formed on the surface of the magnetic particle,
The multiple coating layer includes a first insulating coating layer covering the surface of the magnetic particle, a second insulating coating layer formed on the first insulating coating layer, and a third insulating coating layer formed on the second insulating coating layer. An inductor element. According to claim 10,
The first insulating coating layer includes phosphate,
An inductor element wherein one of the second insulating coating layer and the third insulating coating layer includes glass, and the other includes a rust preventive agent. delete delete delete