KR102655011B1 - Display device - Google Patents

Abstract

This embodiment relates to a display device. By forming a downward bending portion at the end of the inner plate disposed on the inner surface of the back cover, which is the rear support structure of the display device, and allowing the outer surface of the downward bending portion to contact the inner surface of the back cover, the rigidity of the inner plate is increased. and heat dissipation performance is improved, crack damage to the display panel can be prevented by the elastic force of the downward bending portion, and the rigidity of the back cover is improved by forming an inward bending portion at the tip of the vertical extension portion of the back cover, and the elasticity of the inward bending portion is improved. The display device can be protected from side impacts by modification.

Description

Display device {DISPLAY DEVICE}

The present invention improves the rigidity and stability of the support structure by forming a bending portion at one or more ends of a display device, a back cover, which is the rear support structure of the display device, and an inner plate for reinforcing rigidity disposed on the inner surface of the back cover. This relates to a display device that improves heat dissipation performance.

As various portable electronic devices such as mobile communication terminals and laptop computers develop, the demand for flat panel display devices that can be applied to them is increasing.

Flat panel display devices include Liquid Crystal Display Device, Plasma Display Panel, Field Emission Display Device, Light Emitting Diode Display Device, and Organic Light Emitting Diode. Display devices (Organic Light Emitting Diode Display Device) are being researched.

Among these display devices, a liquid crystal display (LCD) is composed of an array substrate containing thin film transistors, an upper substrate including a color filter and/or a black matrix, and a liquid crystal material layer formed between them, and contains a pixel. This is a device in which the arrangement of the liquid crystal layer is adjusted according to the electric field applied between the two electrodes of the area, and the light transmittance is adjusted accordingly to display the image.

The display panel of such a liquid crystal display device is defined by a display area (active area, AA) that provides an image to the user and a non-display area (NA) that is the surrounding area of the display area (AA). is usually manufactured by bonding a first substrate, which is an array substrate on which thin film transistors are formed to define a pixel area, and a second substrate, which is an upper substrate, on which a black matrix and/or color filter layer, etc. are formed.

The array substrate or first substrate on which the thin film transistor is formed includes a plurality of gate lines (GL) extending in a first direction and a plurality of data lines (DL) extending in a second direction perpendicular to the first direction. And one pixel area (Pixel; P) is defined by each gate line and data line. One or more thin film transistors are formed in one pixel area (P), and the gate or source electrode of each thin film transistor may be connected to a gate line and a data line, respectively.

Among these flat panel displays, liquid crystal displays do not have their own light-emitting elements, so they require a separate light source. Accordingly, a backlight unit equipped with a light source such as an LED is provided on the back, and irradiates light toward the front of the liquid crystal panel, and only through this, an identifiable image is realized.

Meanwhile, organic light emitting display devices, which have recently been in the spotlight as display devices, have the advantages of fast response speed, high luminous efficiency, brightness, and viewing angle by using organic light emitting diodes (OLEDs: Organic Light Emitting Diodes) that emit light on their own.

Such an organic light emitting display device uses a self-light emitting device and does not require a backlight used in a liquid crystal display device using a non-light emitting device, so it can be lightweight and thin. In addition, organic light emitting display devices have superior viewing angles and contrast ratios compared to liquid crystal displays, and are also advantageous in terms of power consumption. In addition, organic light emitting display devices are capable of driving at low direct current voltages, have a fast response speed, are resistant to external shocks because their internal components are solid, have a wide operating temperature range, and have the advantage of being particularly inexpensive in terms of manufacturing costs.

These organic light emitting display devices display images in a top emission method or a bottom emission method depending on the structure of the organic light emitting device including the first electrode, the second electrode, and the organic light emitting layer. do. The bottom emission method displays visible light generated from the organic light emitting layer toward the bottom of the substrate where the transistor is formed, while the top emission method displays visible light generated from the organic light emitting layer toward the top of the substrate where the transistor is formed.

This organic light emitting display device arranges subpixels containing organic light emitting diodes in a matrix form and controls the brightness of the subpixels selected by a scan signal according to the gradation of data. In addition, organic light-emitting diode displays are self-luminous devices, and have low power consumption, high-speed response speed, high luminous efficiency, high luminance, and wide viewing angle.

Meanwhile, there is a set device in the concept of a finished product including such a display device, and examples of such a set device may include a TV, a computer monitor, and a billboard.

This display device or set device includes a support structure that supports the liquid crystal or organic light emitting display panel from the rear. This support structure must protect the display panel by forming the exterior of the display device, so a certain level of rigidity must be secured, and the display device must have a certain level of rigidity. It must have a function to radiate heat generated from the panel or control circuit to the outside.

Meanwhile, a typical organic light emitting display device may use a back cover that supports the rear of the organic light emitting display panel and an inner plate that is attached to the inner surface of the back cover to reinforce the rigidity of the back cover and perform a heat dissipation function.

However, in this conventional back cover and inner plate structure, the thickness of the back cover or inner plate became thick to ensure the rigidity of the display device, and there was a problem in that heat generation through the inner plate was insufficient.

Accordingly, in this embodiment, we would like to propose a method of increasing the rigidity of the support structure of the display device and improving heat dissipation characteristics through the support structure by changing the structures of the back cover and inner plate.

The present invention is intended to solve the above-described conventional problems. The purpose of the present invention is to provide a display device with improved rigidity and heat dissipation characteristics by changing the structure of the back bucker and inner plate, which are support structures constituting the display device. will be.

Another object of the present invention is to improve the rigidity of the back cover by forming an inward bending portion at the tip of the vertical extension of the back cover, which is the rear support structure of the display device, and to prevent damage due to side impact by elastic deformation of the inward bending portion. The purpose is to provide a display device with

Another object of the present invention is to improve the rigidity and heat dissipation performance of the inner plate by forming a downward bending portion at the end of the inner plate disposed on the inner surface of the back cover, which is the rear support structure of the display device, and allowing the outer surface of the downward bending portion to contact the inner surface of the back cover. The aim is to provide a display device that can improve the display panel and prevent crack damage to the display panel by the elastic force of the downward bending portion.

Another object of the present invention is to increase the overall rigidity of the display device support structure by forming an inward bending portion at the tip of the vertical extension of the back cover, which is the rear support structure, and forming a downward bending portion at the end of the inner plate disposed on the inner surface of the back cover. The aim is to provide a display device with a structure that can smoothly dissipate heat generated from the display device.

In order to achieve the above object, the display device according to the present embodiment includes a back cover including a horizontal portion supporting the rear of the display panel and a vertical extension portion extending vertically from an end of the horizontal portion to cover the side of the display panel, and an adhesive. It may be configured to include an inner plate including a horizontal portion that is adhered to the inner surface of the horizontal portion of the back cover through a member, and a downward bending portion that is bent downward from an edge of the horizontal portion and contacts the inner surface of the horizontal portion of the back cover.

Additionally, in addition to the above configuration, an inward bending portion bent toward the side of the display panel may be further provided at an end of the vertical extension portion of the back cover, and a first portion for elastic deformation of the inward bending portion is provided between the vertical extension portion of the back cover and the inward bending portion. A gap is provided, and a second gap may be formed between the horizontal portion of the inner plate and the downward bending portion for elastic deformation of the downward bending portion.

In addition, the downward bending portion of the inner plate may be a double bending structure including a first bending portion that is primarily bent upward from the horizontal portion of the inner plate and a secondary bending portion that is bent downward from an end of the first bending portion. .

Meanwhile, the display panel includes a substrate, a light emitting layer including a plurality of thin film transistors formed on the substrate, an organic light emitting element layer that emits light between both electrode layers disposed on one side of the thin film transistor, and a light emitting layer disposed on one side of the light emitting layer. It may be an organic light emitting display panel including an encapsulation layer. In particular, the organic light emitting display panel may be a bottom emission type organic light emitting display panel in which light from the organic light emitting element layer is emitted through the substrate.

At this time, when the light emitting surface of the organic light emitting display panel is defined as the image display area, an optical layer and an encapsulation layer are sequentially stacked on the bottom of the image display surface, and the light emitting layer is on the bottom of the image display surface. The substrate, thin film transistor, and organic light emitting device layer are sequentially arranged, and a polarizing layer may be further arranged on top of the substrate.

In addition, the above organic light emitting device layer is a white organic light emitting device layer that emits white light, and the light emitting layer may further include a color filter layer disposed on the white organic light emitting device layer.

According to an embodiment of the present invention, as will be described below, the rigidity and heat dissipation characteristics of the display device support structure are improved by changing the structures of the back bucker and the inner plate, which are support structures constituting the display device.

More specifically, by forming an inward bending portion at the tip of the vertical extension of the back cover, which is the rear support structure of the display device, the rigidity of the back cover can be improved and the display device can be protected from side impacts by elastic deformation of the inward bending portion. It works.

In addition, the rigidity and heat dissipation performance of the inner plate are improved by forming a downward bending portion at the end of the inner plate disposed on the inner surface of the back cover, which is the rear support structure of the display device, and allowing the outer surface of the downward bending portion to contact the inner surface of the back cover. Crack damage to the display panel can be prevented by the elastic force of the bending part.

Figure 1 shows an example of a display device support structure according to the prior art.
Figure 2 shows another example of a display device support structure according to the prior art.
Figure 3 shows a cross-section of a display device including a back cover and an inner plate according to an embodiment of the present invention.
Figure 4 is a partial perspective view of the back cover and inner plate used in this embodiment, showing a configuration in which an inward bending portion is formed at a vertical extension of the back cover and a downward bending portion is formed at an end of the inner plate.
Figure 5 is an enlarged view of an inward bending portion formed in the vertical extension portion of the back cover according to this embodiment.
Figure 6 shows various forms of downward bending portions formed at the ends of the inner plate according to this embodiment.
Figure 7 shows various cross-sectional structures of the organic light emitting display panel used in the display device according to this embodiment.
FIG. 8 is a detailed cross-sectional view showing a stacked structure of a bottom emission type organic light emitting display panel that can be used in this embodiment.

Hereinafter, some embodiments of the present invention will be described in detail with reference to the exemplary drawings. In adding reference numerals to components in each drawing, identical components may have the same reference numerals as much as possible even if they are shown in different drawings. Additionally, when describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description may be omitted.

Additionally, when describing the components of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and the nature, sequence, order, or number of the components are not limited by the term. When a component is described as being “connected,” “coupled,” or “connected” to another component, that component may be directly connected or connected to that other component, but there are no other components between each component. It should be understood that may be “interposed” or that each component may be “connected,” “combined,” or “connected” through other components.

FIG. 1 shows an example of a display device support structure according to the prior art, and FIG. 2 shows another example of a display device support structure according to the prior art.

The conventional display device shown in FIG. 1 includes a display panel 10 and a back cover 20 and a middle cabinet 30 as a support structure for supporting the display panel.

In the embodiment of FIG. 1, the back cover 20 may be made of an advanced composite material (ACM) with a thickness of about 2.5 mm or more to ensure constant rigidity.

Advanced Composite Material (ACM) refers to a high-performance composite material that combines carbon fiber, silicon carbide fiber, aramid fiber, boron fiber, etc. with heat-resistant resin such as epoxy resin or polyimide. .

When using a back cover of such ACM material, the end cannot be bent and molded due to the characteristics of the material, so it is combined with the back cover 20 to form the side exterior of the display device and protect the side of the display panel 10. The middle cabinet 30 should be used more.

That is, the middle cabinet 30 having a T-shaped cross-section is coupled to the back cover at the end area of the flat back cover 20 through an adhesive member 42 such as a double-sided tape, and the middle cabinet 30 The display panel 10 is glued and fixed on the horizontal support part.

Additionally, in the structure of FIG. 1, a pad 50 made of a magnetic or non-magnetic material may be used on the inner surface of the back cover 20, and this magnetic pad 50 may be used on the inner surface of the back cover 20. It functions to fill the space between the panels 10.

At this time, the middle cabinet 30 can be replaced with other expressions such as guide panel, plastic chassis, p-chassis, support main, main support, and mold frame, and has a square cross-sectional shape with multiple bends. It is a frame-shaped structure.

This middle cabinet 30 is made of a mold material of synthetic resin such as polycarbonate or a metal material such as aluminum, and may be manufactured through injection molding, but is not limited thereto.

In the display device support structure as shown in Figure 1, there is a problem that forming work to realize accurate dimensions is difficult due to the characteristics of the ACM material, and there is a disadvantage that the thickness T1 of the back cover is relatively large to ensure sufficient back cover rigidity.

In addition, due to the characteristics of ACM, which is the material of the back cover 20, it is difficult to bend or bend the end portion, so an additional middle cabinet 30 is required, which has the disadvantage of increasing the number of parts and increasing the overall thickness of the display device.

FIG. 2 shows another display device support structure proposed to compensate for the shortcomings of the structure shown in FIG. 1, including a back cover 20 having an L-shaped cross section with bent ends, and a back cover 20 to supplement the rigidity of the back cover and perform a heat dissipation function. It may be configured to include an inner plate (60) attached to the inner surface of the back cover.

At this time, the back cover 20 may be made of a PCM (Pre-Coated Metal) material made of metal such as aluminum, and since the nature of the metal material allows it to be bent, the back cover covers the entire rear of the display device. It may include a horizontal portion 22 and a vertical extension portion 24 formed by bending an end of the horizontal portion in the vertical direction.

An adhesive member 44, such as double-sided tape, is disposed on the inner surface of the edge of the horizontal portion of the back cover 20, and the edge of the display panel 10 is seated and fixed on top of the adhesive member.

Additionally, in the structure of FIG. 2, an inner plate 60 made of a metal material is disposed on the inner surface over the entire horizontal portion of the back cover.

This inner plate 60 is attached to the inner surface of the horizontal portion of the back cover through an adhesive member 46 such as double-sided tape, increases the bending rigidity of the back cover, and controls the display panel 10 and the control circuit (C-) of the display device. It has the function of a heat sink that absorbs and releases heat emitted from PCB, etc.

Compared to the method of FIG. 1, the support structure of FIG. 2 does not require the use of a middle cabinet, so the number of parts is reduced and the structure is simplified, and the strength of the metal material (PCM) reduces the thickness of the back cover and the overall display device. There is an advantage in reducing the thickness.

However, even if the structure of FIG. 2 is used, the thickness of the inner plate 60 or the back cover 20 must be thick to ensure sufficient rigidity of the support structure, and if the thickness of the inner plate is thin, sufficient rigidity cannot be secured. The downside is that it is difficult.

In addition, when the display device is driven, heat generated from the display panel or control circuit is transferred to the inner plate, but an adhesive member such as double-sided tape is placed between the inner plate and the back cover. Generally, the adhesive member does not have excellent thermal conductivity. Therefore, there is a risk that heat dissipation characteristics may deteriorate.

In addition, in the structure of FIG. 2, the thickness of the back cover 20 must be reduced in response to the trend of thinning display devices. When the thickness of the back cover becomes thinner, the rigidity of the back cover, especially the vertical extension portion, weakens. There is a disadvantage that it is difficult to reduce the thickness of the back cover beyond a certain level.

In addition, since the end of the inner plate 60 is sharply exposed, there is a risk that the adhesive member 44 for fixing the display panel may be damaged by the end and further cause cracks in the display panel.

Additionally, when the display panel moves downward due to damage to the adhesive member 44 for fixing the display panel, the display panel may collide with the inner plate 60 made of a strong material, resulting in crack defects.

Accordingly, in one embodiment of the present invention, a downward bending portion is formed on the edge of the inner plate attached with an adhesive member to the inner surface of the back cover that supports the rear of the display panel, and the downward bending portion is brought into contact with the surface of the back cover, thereby forming the inner plate. It improves the rigidity and heat dissipation characteristics of the display panel and prevents cracks in the display panel due to elastic deformation of the downward bending portion.

In addition, by forming an inward bending portion at the edge of the vertically extending portion of the back cover, the rigidity of the back cover is supplemented and damage to the display device due to a side impact due to elastic deformation of the bending portion can be prevented.

Figure 3 shows a cross-section of a display device including a back cover and an inner plate according to an embodiment of the present invention.

As shown in FIG. 3B, the display device according to the present embodiment includes a display panel 100 that displays an image, a horizontal portion 210 that supports the rear of the display panel, and a display device that extends vertically from an end of the horizontal portion to display the display panel. The back cover 200 includes a vertical extension portion 220 that covers the side of the panel, and is adhered to the inner surface of the horizontal portion of the back cover through an adhesive member 420, and is bent downward at the end to form a horizontal portion of the back cover. It is configured to include an inner plate 500 including a downward bending portion 520 in contact with the inner surface.

In addition to forming a downward bending portion on the inner plate 500, the display device according to the present embodiment has a portion of the vertical extension portion 220 of the back cover 200 bent inward toward the side of the display panel. A bending portion 230 may be further formed.

The inner plate 500 is a plate-shaped member made of PCM (Pre-Coated Material) material such as aluminum or its alloy, and is attached to the inner surface of the back cover by the adhesive member 420, the horizontal portion 510. ) and a downward bending portion 520 that is bent downward from the edge of the horizontal portion toward the rear of the display device.

The downward bending portion 520 of the inner plate contacts the inner surface of the horizontal portion 510 of the back cover 200, and the contact area where the downward bending portion 520 and the back cover contact is denoted as A, as shown in FIG. 3B. Display.

That is, as shown in FIG. 3B, the bottom of the horizontal portion 510 of the inner plate is attached to and mounted on one side of an adhesive member 420, such as a double-sided tape, attached to the horizontal surface of the back cover 200, and is mounted downward in that state. The bottom of the bending portion 520 directly contacts the horizontal surface of the back cover.

Therefore, the heat transferred to the inner plate 500 through the contact area A where the downward bending portion 520 and the back cover contact is transferred to the back cover 200, which is also a metal material, and can be emitted to the outside, as shown in Figure 2 Compared to the same conventional structure, the heat dissipation characteristics of the display device are improved.

In addition, compared to the configuration of FIG. 2 without the downward bending portion 520, the rigidity, especially bending rigidity, of the inner plate 500 can be improved by the downward bending portion 520, and thus the overall strength of the display device can be improved. There is an effect of reducing the thickness of the back cover or inner plate under conditions of increased or same strength.

Additionally, a certain gap exists between the horizontal portion 510 and the downward bending portion 520 of the inner plate 500, and this is expressed as a second gap 522. Due to this second gap, the downward bending portion 520 has elastic force in the vertical direction and can undergo constant elastic deformation according to the vertical load.

Because the edge of the inner plate has elasticity due to the second gap 522 of the downward bending portion 520, the display panel 100 is tilted downward due to damage to the adhesive member 410 for fixing the display panel or a strong vertical impact. Even if it moves and collides with the inner plate, it has the effect of preventing cracks in the display panel by absorbing a portion of the impact.

That is, in FIG. 3B, the downward bending portion 520 is supported on the back cover by the contact area A, and a second gap 522 is formed between the downward bending portion 520 and the horizontal portion 510 of the inner plate, so that the lower When the display panel 100 collides with the inner plate due to an impact, etc., the inner plate is elastically deformed and can absorb the impact.

In addition, an inward bending portion 230 may be further formed by bending a portion of the vertical extension portion 220 of the back cover 200 inward toward the side of the display panel. In this case, the vertical extension portion 220 and the inward bending portion may also be formed. A certain gap is formed between the parts 230, and this gap is expressed as a first gap 232.

Due to this inward bending portion 230 of the back cover, compared to the conventional structure of FIG. 2, not only can the rigidity of the edge area of the back cover, especially bending rigidity, be improved, but also the edge of the back cover has a smooth rounding effect. There is.

In addition, the inward bending part 230 has elastic force and can be elastically deformed to a certain degree by the first gap 232 between the inward bending part 230 and the vertical extension part 220 of the back cover 200. Elasticity prevents panel damage from side impact.

That is, when the display panel is pushed toward the edge due to a side impact, etc., there is a possibility that the display panel may be damaged by directly hitting the vertical extension of the back cover in the structure of FIG. 2, whereas in this embodiment, the back cover is bent inward. Because shock is absorbed while additionally elastically deforming, cracks and damage to the display panel can be prevented.

In addition, when an impact is applied to the side of the display device, such as in a situation where the display device falls to the ground, the inward bending portion 230 of the back cover can absorb a portion of the shock due to the first gap 232, so that the display It has the effect of protecting the device from side impacts.

In this specification, the inner side or inner surface refers to the direction toward the inside of the display device or the surface in that direction, and the lower side or outer surface refers to the surface toward the outside of the display device or the surface in that direction.

That is, in FIG. 3B, the inside of the back cover vertical extension 220 refers to a right-to-left direction, and the lower side of the inner plate refers to a top-down direction.

Figure 4 is a partial perspective view of the back cover and inner plate used in this embodiment, showing a configuration in which an inward bending portion is formed at a vertical extension of the back cover and a downward bending portion is formed at an end of the inner plate. Figure 5 is an enlarged view of an inward bending portion formed in the vertical extension portion of the back cover according to this embodiment.

As shown in FIG. 4A, the back cover 200 is a plate-shaped member of a certain thickness and includes a horizontal portion 210 that forms the rear of the display device and a vertical extension portion 220 that extends by bending in the vertical direction from the edge of the horizontal portion. Including, it is a plate-shaped member having an overall L-shaped cross section.

In addition, the back cover 200 according to the present embodiment includes an inward bending portion 230 formed by bending the edge of the vertical extension portion 220 inward toward the side of the display panel, and the vertical extension portion 220 and A first gap 232, which is a constant gap, is formed between the inward bending portions 230.

These vertical extensions and/or inward bending parts may be provided on all four sides of the back cover, but are not limited thereto and may be formed on only some of the four sides of the back cover depending on the layout design of the control circuit, etc.

The back cover 200 in this specification is not limited to that term, but includes Plate Bottom, Cover Bottom, Base Frame, Metal Frame, and Metal Chassis. Chassis), chassis base, m-chassis, etc. may be used as other expressions, and should be understood as a concept that includes all types of frames or plate-shaped structures placed at the rear base of the display device as a support for the display panel. something to do.

In addition, in this specification, the term "display device" refers to a display device in the narrow sense, such as a liquid crystal module (LCM), an organic light emitting display module (OLED module), which includes a display panel and a driver for driving the display panel. Of course, it is also used as a concept to include set electronic devices or set devices such as laptop computers, televisions, computer monitors, mobile electronic devices such as smartphones or electronic pads, etc., which are finished products containing such LCM, OLED modules, etc.

In other words, the term display device in this specification is used to include not only display devices in a narrow sense such as LCM and OLED modules, but also set devices that are application products including them.

Meanwhile, the back cover 200 according to this embodiment may be formed of metal or metal-containing materials with thermal conductivity, for example, electrolytic galvanized iron (EGI), hot-dip galvanized steel sheet, galvalume steel sheet, It may be composed of PCM (Pre-Coated Metal) material, which is a colored steel sheet material such as aluminum-plated steel sheet or electro-galvanized steel sheet, coated with polyester resin, or attached with a lami film, etc., but is limited thereto. It doesn't work.

Additionally, the thickness of the back cover 200 may be approximately 0.5 mm, but is not limited thereto, and may be smaller than the thickness of the back cover of the configuration shown in FIG. 2, which is approximately 1.8 mm.

That is, according to this embodiment, because the rigidity is increased by the inward bending portion formed on the back cover and the downward bending portion formed on the inner plate, the thickness of the back cover is reduced compared to the case where such bending portion is not used (FIG. 2). It can be reduced.

As a result, this embodiment can reduce the overall thickness and weight of the display device.

As shown in Figure 5a, the height H2 of the inward bending portion 230 of the back cover is smaller than the height H1 of the vertical extension portion 220 of the back cover, and more specifically, the height H1 of the vertical extension portion of the back cover It may be equal to or smaller than the thickness of the adhesive member 410 for fixing the display panel in FIG. 3B, but is not limited thereto.

In addition, the size G1 of the first gap 232, which is the gap between the vertical extension portion 220 of the back cover and the inward bending portion 230, takes into account the convenience of the bending process of the inward bending portion and the degree of elastic deformation required for the inward bending portion. So it can be decided appropriately.

The inner plate (500) according to this embodiment is a plate-shaped member mounted on the inner surface of the horizontal portion of the back cover 200 through the adhesive member 420, and is a horizontal plate portion that is attached to the adhesive member 420. It includes a portion 510 and a downward bending portion 520 that is formed by bending an edge of the horizontal portion downward and contacts the inner surface of the horizontal portion of the back cover.

In addition, a certain gap G2 is formed between the horizontal part 510 and the downward bending part 520 of the inner plate 500, and this gap is defined as the second gap 522.

This downward bending part 520 has three functions as follows.

First of all, it is a function of increasing the overall rigidity of the inner plate. That is, compared to a general flat inner plate, the edge portion is double bent, so the overall bending rigidity of the inner plate can be increased.

Second, it is a function of improving the heat dissipation characteristics of the inner plate. In the structure of FIG. 2 without a downward bending portion, the inner plate is adhered to the back cover by an adhesive member 46. The adhesive member 46 is a double-sided tape and is made of a material with little thermal conductivity, resulting in the display panel or control circuit. Even if the metal inner plate absorbs the heat emitted from the back, its function of transferring it to the outside and dissipating heat is minimal.

On the other hand, when the downward bending portion 520 according to the present embodiment is provided, the downward bending portion 520 contacts the inner surface of the back cover, so that heat generated from the display panel and control circuit is transferred to the downward bending portion of the inner plate and the back cover. It can be easily released to the outside.

In particular, when the display panel is an organic light emitting display panel, since the organic light emitting element is vulnerable to heat, it is necessary to further improve heat dissipation performance by the downward bending portion of the inner plate.

Thirdly, it is a vertical shock absorption function caused by elastic deformation of the downward bending part of the inner plate.

When a vertical load or impact occurs on the display device, or the adhesive member (44 in FIG. 2) for fixing the display panel is damaged, the display panel may move downward and come into contact with the inner plate.

In this case, in the conventional structure of FIG. 2 without a downward bending portion, the inner plate is a single flat structure, so it cannot absorb the amount of impact caused by a collision with the display panel, and thus there is a possibility that defects such as cracks or cracks in the display panel may occur.

On the other hand, by providing the downward bending portion 520 with the second gap 522 according to the present embodiment, when a lower load is applied to the inner plate, the downward bending portion is elastically deformed, thereby functioning as a damper to absorb the load. .

Therefore, in the above case, even if the display panel collides with the inner plate, the impact is appropriately absorbed, thereby preventing panel cracks due to load or impact applied in the vertical direction of the display device.

Meanwhile, as shown in FIG. 6, the size G2 of the second gap 522 can be appropriately set according to the basic thickness of the adhesive member and the inner plate and the required degree of elastic deformation of the second gap of the inner plate.

That is, when the second gap 522 is formed to a constant size G2 as shown in Figure 6a, the overall thickness of the inner plate increases, so the thickness of the adhesive member 420 must be increased to t1, but the elastic deformation increases, thereby improving shock absorption performance. is improved.

Meanwhile, when the second gap 522 is formed to a very small value or almost 0 as shown in Figure 6b, the degree of elastic deformation is somewhat lower, but the heat dissipation characteristics can be improved by increasing the area in heat conduction contact with the back cover. , there is an advantage in that the thickness of the adhesive member 420 can be reduced to t2.

FIG. 6C is a structure for taking only the advantages of FIGS. 6A and 6B, and shows an example in which the downward bending portion 520' has a double bending structure.

That is, the downward bending portion 520' of the inner plate has a first bending portion 524' that is primarily bent upward from the horizontal portion 510 and a second bending portion 526' that is bent 180 degrees downward. It is configured to include.

As a result, as shown in Figure 6c, the size of the second gap can be secured to a certain level or more at G2, while the thickness of the adhesive member 420 can be kept small at t2, so the mounting thickness of the inner plate can be reduced while maintaining the elastic deformation characteristics. It has advantages.

Additionally, the extension length L of the downward bending portion of the inner plate can be set in consideration of heat dissipation characteristics, and it is advantageous to be as large as possible.

That is, the horizontal part of the inner plate is formed in an area that can be adhered to the back cover through the adhesive member 420, and the length L of the downward bending part can be set as long as possible so that the downward bending part covers the entire other area. there is.

This inner plate 500 may be formed of aluminum, its alloy, or other metal material, but is not limited thereto, and other materials having strength and heat conduction characteristics above a certain level may be used.

Meanwhile, the display panel 100 used in the display device according to this embodiment is, in principle, all types of liquid crystal display panels, organic light emitting diode (OLED) display panels, and plasma display panels (PDP). Any type of display panel can be used, and the structure of the back cover and inner plate according to this embodiment is not limited to a specific display panel as long as it can be applied.

However, when the display panel is a liquid crystal display panel, a backlight unit consisting of a light source, light guide plate, optical sheet, etc. must be provided between the display panel and the back cover or cover bottom, and a support structure to support this backlight unit must be provided. It may be necessary, and since the liquid crystal material is more resistant to heat than the organic light emitting material as will be described below, the possibility of applying the inner plate of this embodiment may be somewhat low.

On the other hand, in the case of an organic light emitting (OLED) display panel, several layers such as a light emitting panel layer and an encapsulation layer as a glass substrate containing organic light emitting elements and thin film transistors (TFTs) are combined into one panel. Since it is in the form of a single assembly that is laminated and the organic light-emitting device used is a self-luminous device and therefore does not require a backlight unit such as a separate light source, the structure of the back cover and inner plate according to this embodiment is easy to apply.

In addition, the organic light emitting element or organic light emitting material used in the organic light emitting display panel is more vulnerable to heat than the liquid crystal material, and heat dissipation of the display device becomes more important, so the need for the inner plate according to this embodiment is greater.

Therefore, it may be desirable for the display panel 100 according to this embodiment to be an organic light emitting diode (OLED) display panel.

Figure 7 shows various cross-sectional structures of the organic light emitting display panel used in the display device according to this embodiment.

As described above, the display panel used in the display device to which this embodiment is applied may include any type, such as a liquid crystal display panel or an organic light emitting display panel. However, a backlight unit is not required and the light emitting element is vulnerable to heat, so heat dissipation characteristics are poor. Considering this important point, it may be more advantageous to apply it to a display device having an organic light emitting display panel.

The organic light emitting display panel 100 that can be used in this embodiment includes a light emitting layer including a substrate, a plurality of thin film transistors formed on the substrate, and an organic light emitting element layer that emits light between both electrode layers disposed on one side of the thin film transistor, It may be configured to include an encapsulation layer disposed on one side of the light-emitting layer.

Meanwhile, the organic light emitting display panel according to this embodiment can be divided into a top emission type and a bottom emission type depending on the direction in which light from the organic light emitting element layer travels.

Simply put, in the top emission method, light generated from the organic light emitting device layer travels upward in the direction opposite to the substrate of the light emitting layer, and one side of the substrate in the opposite direction becomes the image display surface.

Conversely, in the bottom emission method, the light generated in the organic light emitting device layer travels in the direction of the substrate of the light emitting layer and is emitted through the substrate. In this case, the outer surface of the substrate of the light emitting layer becomes the image display surface.

Figure 7a is a cross-sectional view of a top emission type display panel in which light is emitted in the direction of a thin film transistor (TFT) based on the substrate of the light emitting layer among the organic light emitting display panels.

As shown in FIG. 7A, the top emission organic light emitting display panel 1100 may be configured to include a light emitting layer 1180 and an encapsulation layer 1190 disposed on one side of the light emitting layer to protect the light emitting layer. .

The light-emitting layer 1180 is an array substrate portion including an organic light-emitting element layer that self-emits light, and includes a glass substrate 1182, a plurality of thin film transistor layers (TFT; 1184) formed on the glass substrate 1182, and a thin film The organic light emitting device layer 1186 disposed on one side of the transistor layer is formed by sequentially stacking.

Although not shown, a first electrode (anode or cathode electrode) connected to the source or drain electrode of the thin film transistor and a second electrode (cathode or anode) are disposed, and an organic light emitting device layer 1186 is disposed between both electrode layers. .

The organic light emitting device spontaneously emits light according to the potential difference generated between the two electrodes by the switching operation of the thin film transistor.

Meanwhile, there is no problem in the direction in which the glass substrate is placed on both sides of the light emitting layer because the glass substrate prevents the inflow of external moisture and foreign substances, but in the direction opposite to the glass substrate, that is, the organic light emitting display layer is formed. The direction surface needs to be protected because moisture, foreign substances, etc. can enter from the outside.

The encapsulation layer 1182 is a protective layer used for this purpose, and is bonded to the upper surface of the organic light-emitting device layer of the light-emitting layer to prevent damage to the organic light-emitting device.

In this specification, the encapsulation layer is not limited to that term, and should be understood as a concept that includes all types of protective layers disposed to protect the organic light-emitting element layer of the light-emitting layer constituting the organic light-emitting display panel. It may be expressed in other terms such as protective layer, second substrate layer, etc.

Meanwhile, as shown in FIG. 7A, in the top emission method, light is emitted in the direction opposite to the glass substrate 1182 of the light emitting layer, and an image display surface is formed in that direction, and the image display surface direction, that is, the organic light emitting device An encapsulation layer 1190 is formed on the immediate outer surface of layer 1186.

Additionally, as shown in FIG. 7A, in the top emission method, the encapsulation layer 1190 is placed on the image display surface side, so it must be transparent and, as a result, must be made of a glass material. Additionally, in the top emission method, the encapsulation layer 1190 forms the image display surface exposed to the viewer, so it must have a certain level of rigidity to be resistant to external shocks.

Therefore, in the top emission method, the encapsulation layer 1190 must be formed as a glass layer with a relatively thick first thickness T1, and in large-sized TVs, etc., the first thickness T1 of the encapsulation layer 1190 is at least about It must be more than 1mm.

Figures 7b and 7c are cross-sectional views of a bottom emission type organic light emitting display panel. Figure 7b shows a case where glass light emitting layers for each color are applied, and Figure 7c shows a case where a white organic light emitting layer (WOLED) and a color filter layer are used. This case is explained below as a representative example of FIG. 7b.

As shown in Figure 7b, the organic light emitting display panel 1200 that can be used in the display device according to the embodiment of the present invention includes an encapsulation layer 1290, a light emitting layer 1180 disposed on the encapsulation layer, and a light emitting layer. It may be configured to include a polarizing layer 1270 disposed on the layer.

The light emitting layer 1180 refers to an array substrate portion including an organic light emitting device layer that emits light independently, and includes a substrate 1211 made of glass material and a plurality of thin film transistor layers (TFT; 1214) formed on the substrate 1211. and an organic light emitting device layer 1219 disposed on one side of the thin film transistor layer are formed by sequentially stacking.

As explained in more detail in FIG. 8, a first electrode (anode or cathode electrode) connected to the source or drain electrode of the thin film transistor and a second electrode (cathode or anode) are disposed, and an organic light emitting device layer is formed between both electrode layers. (1219) is placed.

The organic light emitting device spontaneously emits light according to the potential difference generated between the two electrodes by the switching operation of the thin film transistor.

At this time, one side of the polarization layer 1270 becomes the image display surface where the image is displayed, and the polarization layer 1270, the emission layer 1180, and the encapsulation layer 1290 are arranged in that order below the image display surface. , in some cases, the polarization layer 1270 may not be included.

Meanwhile, Figure 7b illustrates a case in which the organic light-emitting element layer 1219 constituting the light-emitting layer 1180 uses an organic light-emitting material that outputs light for each color (R, G, and B) without a separate color filter. , FIG. 7C shows an example in which the organic light emitting device layer is a white organic light emitting device layer 1264 that emits white light, and a color filter layer 1248 disposed on the white organic light emitting device layer.

7B and 7C, in the bottom emission type organic light emitting display panel 1200, the light emitting layer 1180 has a substrate 1211 and a thin film transistor layer 1214 below it based on the image display surface. , the organic light emitting device layer 1219 is arranged sequentially.

In this state, the light emitted from the organic light emitting device layer passes through the thin film transistor layer 1214 and the substrate 1211. Therefore, assuming that the substrate 1211 is on the bottom side, it is expressed as a bottom emission method in which light is emitted in the direction of the substrate.

In this bottom emission type organic light emitting display panel 1200, in order to protect the organic light emitting device layer 1219, an encapsulation layer 1290 is disposed adjacent to the organic light emitting device layer 1219.

Accordingly, the encapsulation layer (1190 in FIG. 7A) of the top emission method is placed on the image display surface, while the encapsulation layer (1290) of the bottom emission method (FIGS. 7B and 7CD) is placed on the video display surface. Since it is placed on the opposite side, it does not need to be a transparent material, and it does not need to be rigid enough to require protection from external impacts.

In other words, it is sufficient for the encapsulation layer 1290 in the bottom emission method to simply have the function of preventing moisture and foreign substances from penetrating into the organic light emitting device layer of the light emitting layer 1280.

Therefore, the encapsulation layer 1290 of the organic light emitting display panel according to the present embodiment has a second thickness (T2) smaller than the first thickness (T1) of the above-described top emission type encapsulation layer 1190. The branch can be implemented with a thin film of a metal material, etc.

In fact, the second thickness of the encapsulation layer 1290 of the organic light emitting display panel according to this embodiment may be formed to be about 0.05 to 0.2 mm.

In addition, the material constituting the encapsulation layer 1290 of the organic light emitting display panel according to this embodiment is not limited to metal, and can be made of any material that can protect the organic light emitting device layer and be formed into a thin film. There are no limits.

However, in order to prevent hydrogen, oxygen, etc. from penetrating into the organic light emitting device layer 1219 and oxidizing the organic light emitting device, an iron-nickel alloy, a so-called Invar metal material, which prevents the penetration of hydrogen/oxygen, etc. It is desirable to form

Additionally, the encapsulation layer 1290 is preferably formed of a metal material having reflection characteristics above a certain level.

Since the light emitted from the organic light emitting device layer 1219 must be output to the image display surface in the opposite direction of the encapsulation layer 1290, the encapsulation layer 1290 is formed of a metal material with reflection characteristics above a certain level. This is because the encapsulation layer 1290 functions as a kind of reflector, thereby improving the luminous efficiency of the display panel.

In this way, by using a bottom emission type organic light emitting display panel according to an embodiment of the present invention, the thickness of the encapsulation layer can be reduced compared to the top emission type as shown in Figure 7a, and the encapsulation layer ( 1290) has the advantage of improving the luminous efficiency of the display panel according to its reflection characteristics.

7B and 7C, the light emitted from the organic light emitting device layer 1219 must be output to the image display surface in the opposite direction of the encapsulation layer 1290, so the encapsulation layer 1290 reflects more than a certain level. This is because, when formed of a metal material with certain properties, the encapsulation layer 1290 functions as a kind of reflector, thereby improving the luminous efficiency of the display panel.

Meanwhile, unlike FIG. 7B where color-specific glass light-emitting layers are applied, FIG. 7C is a white organic light-emitting device layer (WOLED; 1264) that emits white light, and a color filter layer (1248) disposed on the white organic light-emitting device layer. ) shows an example consisting of

Since the luminous efficiency of white organic light-emitting devices is generally superior to that of organic light-emitting devices of other colors, using the structure shown in FIG. 7C can further improve the luminous efficiency of the organic light-emitting display device.

Figure 8 is a detailed cross-sectional view showing a stacked structure of a bottom emission type organic light emitting display panel that can be used in an embodiment of the present invention.

For convenience. In FIG. 8, the direction of light emission or the image display surface is shown toward the bottom of the drawing, as opposed to FIG. 7.

As shown in FIG. 8, a polarization layer 1270 is placed on the image display surface side, a light-emitting layer 1280 is stacked in contact with it, and an encapsulation layer 1290 is placed on one side of the light-emitting layer 1280.

The detailed configuration of the light emitting layer 1280 of the bottom emission type organic light emitting display panel used in this embodiment will be described as follows.

On the substrate 1211 of the light emitting layer 1280, a buffer layer 1220, a light blocking layer 1222, a first interlayer insulating layer 1224, a semiconductor layer 1226, a gate insulating layer 1228, a gate electrode 1230, and a second interlayer insulating layer 1224 are formed. Interlayer insulating film 1232, source electrode 1242, drain electrode 1244, third interlayer insulating film 1246, color filter 1248, planarization layer 1250, first electrode 1260, bank 1262, An organic light emitting device layer 1264, a second electrode 1266, a passivation layer 1268, etc. may be disposed.

Meanwhile, the substrate 1211 of the light emitting layer 1280 may be a glass substrate, but is not limited thereto, and may be made of plastic including PET (Polyethylen terephthalate), PEN (Polyethylen naphthalate), polyimide, etc. It may be a substrate, etc.

The buffer layer 1220 is intended to block the penetration of impurity elements on the substrate 1211 or improve the interface characteristics and flatness, and may be formed of a single layer or multiple layers of silicon nitride (SiOx) or silicon oxide (SiNx). You can.

The light blocking layer 1222 is used to block light incident on the channel region of the semiconductor layer 1226. To this end, the light blocking layer 1222 may be formed of an opaque metal layer to block light. Additionally, the light blocking layer 1222 may be electrically connected to the drain electrode 1244 to prevent parasitic capacitance.

The first interlayer insulating film 1224 insulates the light blocking layer 1222 and the semiconductor layer 1226 from each other. This first interlayer insulating film 1224 includes an insulating material and may be stacked on the buffer layer 1220 and the light blocking layer 1222.

The semiconductor layer 1226 includes silicon (Si) and is disposed on the first interlayer insulating film 1224, and is composed of an active region forming a channel, a source region and a drain region in which both sides of the active region are doped with a high concentration of impurities. It can be.

The gate insulating film 1228 insulates the semiconductor layer 1226 and the gate electrode 1230 from each other. This gate insulating film 1228 includes an insulating material and may be stacked on the semiconductor layer 1226.

The gate electrode 1230 is disposed on the gate insulating film 1228 and receives a gate voltage from the gate line.

The second interlayer insulating film 1232 protects the gate electrode 1230 and insulates the gate electrode 1230, source electrode 1242, and drain electrode 1244 from each other. This second interlayer insulating film 1232 includes an insulating material and may be stacked on the first interlayer insulating film 1224, the semiconductor layer 1226, and the gate electrode 1230.

The source electrode 1242 and the drain electrode 1244 are each disposed on the second interlayer insulating film 1232 and contact the semiconductor layer 1226 through the first and second contact holes formed in the second interlayer insulating film 1232. can do. Additionally, the drain electrode 1244 may contact the light blocking layer 1222 through the third contact hole.

Here, the source electrode 1242 and the drain electrode 1244, the semiconductor layer 1226 in contact with these electrodes, and the gate insulating film 1228 and gate electrode 1230 formed on the semiconductor layer 1226 are thin film transistors. A layer 1214 may be configured.

The third interlayer insulating film 1246 protects the source electrode 1242 and the drain electrode 1244.

The color filter 1248 may be disposed at a position overlapping the organic light emitting device layer 1264 on the second interlayer insulating film 1232 to change the color of light emitted in the direction of the substrate 1211 in the bottom emission method.

The planarization layer 1250 protects the source electrode 1242 and the drain electrode 1244 and can flatten the surface on which the first electrode 1260 is disposed.

The first electrode 1260 is disposed on the planarization layer 1250 and may contact the drain electrode 1244 through the fourth contact hole formed in the planarization layer 1250. Additionally, the first electrode 1260 serves as an anode electrode and may be formed of a transparent conductive material with a relatively large work function value so that light generated from the organic light emitting device layer 1264 is transmitted.

For example, the first electrode 1260 may be made of a metal oxide such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide), a mixture of metal and oxide such as ZnO:Al or SnO2:Sb, or poly(3-methylthiamine). ophene), poly[3,4-(ethylene-1,2-dioxy)thiophene] (PEDT), polypyrrole, and conductive polymers such as polyaniline. Additionally, the first electrode 260 may be made of carbon nanotubes (Carbon Nano Tubes, CNTs), graphene, silver nanowires, etc.

The organic light emitting device layer 1264 is disposed on the first electrode 1260 and may be composed of a single layer made of a light emitting material, or may be composed of multiple layers of a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer. You can. The organic light emitting device layer 1264 may be a white light organic light emitting device layer that outputs white light, and may be applied to the entire surface without patterning. This organic light emitting device layer 1264 omits the patterning process, which can simplify the manufacturing process or reduce costs.

The second electrode 1266 is disposed on the organic light emitting device layer 1264 and, as a cathode electrode, may be made of a conductive material with a relatively small work function value. Here, the second electrode 1266 may be formed of a single metal such as Ag or a single layer of an alloy composed of a certain ratio of Mg, etc., or multiple layers thereof, depending on the bottom emission method.

A first electrode 1260 connected to the thin film transistor, a second electrode 1266 disposed opposite to the first electrode 1260, and an organic light emitting element interposed between the first electrode 1260 and the second electrode 1266. The layer 1264 may be collectively referred to as an organic light emitting device.

When a predetermined voltage is applied to the first electrode 1260 and the second electrode 1266, the organic light emitting device layer 1264 generates holes injected from the first electrode 1260 and electrons provided from the second electrode 1266. It is transported to the organic light emitting device layer 1264 to form an exciton, and when the exciton transitions from the excited state to the ground state, light is generated and can be emitted in the form of visible light.

The bank is formed on the edge of the first electrode 1260 and may have an opening to expose the first electrode 1260. These banks may be formed of inorganic insulating materials such as SiOx, SiNx, and SiON.

The passivation layer 1268 serves to protect the organic layer from moisture and oxygen, and may be made of a multilayer structure of inorganic materials, organic materials, and mixtures thereof.

Meanwhile, a low-reflection layer 1271 may be included on each of the light-shielding layer 1222, the gate electrode 1230, the source electrode 1242, and the drain electrode 1244. This low-reflection layer prevents reflection of external light. By preventing this, problems such as reduced visibility, reduced luminance, and reduced contrast ratio characteristics can be prevented.

The low-reflection layer 1271 may be made of a material that absorbs external light introduced through the substrate 1211, or may be coated with a light absorber. Here, external light may mean non-polarized light that does not pass through a polarizing plate or a polarizing layer.

The material that absorbs external light may be made of a light-absorbing metal or an alloy thereof, and may have a black-based color. For example, the low-reflection layer 1271 may be any one of molybdenum (Mo), chromium (Cr), titanium (Ti), niobium (Nb), manganese (Mn), and tantalum (Ta), or an alloy thereof. . However, the embodiments are not limited to this and may be other metals capable of absorbing light. Accordingly, the low-reflection layer 1271 can prevent external light from being reflected back to the outside.

Additionally, this low-reflection layer 1271 is made of metal oxide or an alloy of metal and metal oxide that absorbs light, and can block light introduced from the outside. For example, the low-reflection layer 1271 may be made of metal oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), and ITZO (Indium Tin Zinc Oxide), and external light is transmitted through the low-reflection layer 1271. The light reflected from the surface of and after passing through the low-reflection layer 1271 cause destructive interference with each other and cannot go out again.

Meanwhile, the organic light emitting display panel 1200 according to this embodiment further includes a transmittance adjustment film (not shown) and/or a transparent multilayer film (not shown) disposed on one side of the substrate 1211 to absorb light in the visible region. It can be included.

The transmittance adjustment film has a predetermined transmittance by absorbing light incident on the substrate 1211 from the outside, and functions to greatly lower the reflectance of the substrate 1211 by absorbing external light.

A transparent multilayer film is a structure in which a plurality of refractive layers with different refractive indices are stacked between adjacent layers. It functions to reduce the reflectance of external light by extinguishing external light due to destructive interference of lights reflected from the refractive layers having various refractive indices.

This transmittance adjustment film and/or transparent multilayer film may constitute the above-described polarization layer 1270 itself or a portion thereof.

As described above, according to an embodiment of the present invention, a downward bending portion is formed at the end of the inner plate disposed on the inner surface of the back cover, which is the rear support structure of the display device, and the outer surface of the downward bending portion is brought into contact with the inner surface of the back cover, thereby forming the inner plate. It has the effect of improving the rigidity and heat dissipation performance of the display panel and preventing crack damage to the display panel due to the elastic force of the downward bending portion.

In addition, forming an inward bending portion at the tip of the vertical extension portion of the back cover improves the rigidity of the back cover and protects the display device from side impact due to elastic deformation of the inward bending portion.

The above description and attached drawings are merely illustrative of the technical idea of the present invention, and those skilled in the art will be able to combine the components without departing from the essential characteristics of the present invention. , various modifications and transformations such as separation, substitution, and change will be possible. Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but are for illustrative purposes, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted in accordance with the claims below, and all technical ideas within the equivalent scope should be construed as being included in the scope of rights of the present invention.

100: display panel 200: back cover
210: horizontal part (of the back cover) 220: vertical extension part
230: inward bending portion 232: first gap
410: Adhesive member for fixing display panel 420: Adhesive member
500: Inner plate 510: Horizontal portion (of the inner plate)
520: downward bending portion 522: second gap
1280: Emission layer 1290: Encapsulation layer
1211: Substrate 1214: Thin film transistor (layer)
1219, 1264: Organic light emitting device layer

Claims (9)

display panel;
It includes a horizontal part supporting the rear of the display panel and a vertical extension part extending vertically from an end of the horizontal part to cover a side of the display panel, and an inward bending part at an end of the vertical extension part that is bent in a lateral direction of the display panel. is disposed, and a first gap is provided between the vertical extension portion and the inward bending portion for elastic deformation of the inward bending portion, and a first gap is provided between the horizontal portion of the inner plate and the downward bending portion for elastic deformation of the downward bending portion. Back cover provided with 2 gaps;
an inner plate including a horizontal portion adhered to the inner surface of the horizontal portion of the back cover through an adhesive member, and a downward bending portion bent downward from an edge of the horizontal portion and contacting the inner surface of the horizontal portion of the back cover;
A display device including a. delete delete According to paragraph 1,
A display device in which the downward bending portion of the inner plate radiates heat generated from the display panel through the back cover that is in contact with the display panel. According to clause 4,
The downward bending portion of the inner plate is a double bent structure including a first bending portion primarily bent upward from the horizontal portion of the inner plate and a secondary bending portion bent downward from an end of the primary bending portion. Device. According to paragraph 1,
The display panel includes a substrate, a light emitting layer including a plurality of thin film transistors formed on the substrate, an organic light emitting element layer that emits light between both electrode layers disposed on one side of the thin film transistor, and a light emitting layer disposed on one side of the light emitting layer. A display device that is an organic light emitting display panel including an encapsulation layer. According to clause 6,
The organic light emitting display panel is a bottom emission type organic light emitting display panel in which light from the organic light emitting element layer is emitted through the substrate. In clause 7,
When the light emitting surface of the organic light emitting display panel is defined as the image display surface, the light emitting layer and the encapsulation layer are sequentially stacked below the image display surface, and the light emitting layer is the image display surface. A display device in which the substrate, the thin film transistor, and the organic light emitting device layer are sequentially disposed on a lower portion of the substrate, and a polarization layer is further disposed on an upper portion of the substrate. According to clause 8,
The organic light emitting device layer is a white organic light emitting device layer that emits white light, and the light emitting layer further includes a color filter layer disposed on the white organic light emitting device layer.

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