KR102652911B1 - Thermo electric device - Google Patents

Abstract

A thermoelectric device according to an embodiment of the present invention includes a thermoelectric element, a connection electrode electrically connected to the thermoelectric element, a plurality of bonding layers disposed on the connection electrode, and It includes a connector portion disposed on the plurality of bonding layers, and the plurality of bonding layers are arranged to be spaced apart from each other along a circumference of a bottom surface of the connector portion.

Description

Thermoelectric device {THERMO ELECTRIC DEVICE}

The present invention relates to a thermoelectric device, and more specifically, to a joint structure of a connector connected to a thermoelectric element.

Thermoelectric phenomenon is a phenomenon caused by the movement of electrons and holes inside a material, and means direct energy conversion between heat and electricity.

Thermoelectric elements are a general term for devices that use thermoelectric phenomena, and have a structure in which a P-type thermoelectric material and an N-type thermoelectric material are joined between metal electrodes to form a PN junction pair.

Thermoelectric devices can be divided into devices that use temperature changes in electrical resistance, devices that use the Seebeck effect, a phenomenon in which electromotive force is generated due to a temperature difference, and devices that use the Peltier effect, a phenomenon in which heat absorption or heat generation occurs due to current. .

Thermoelectric elements are widely applied to home appliances, electronic components, and communication components. For example, thermoelectric elements can be applied to cooling devices, heating devices, power generation devices, etc. Accordingly, the demand for thermoelectric performance of thermoelectric elements is increasing.

The thermoelectric element includes a substrate, an electrode, and a thermoelectric leg, with a plurality of thermoelectric legs disposed between an upper substrate and a lower substrate, a plurality of upper electrodes disposed between a plurality of thermoelectric legs and an upper substrate, a plurality of thermoelectric legs, and and a plurality of lower electrodes are disposed between the lower substrate.

At this time, a wire is connected to the thermoelectric element, and for this purpose, the wire may be connected to a connector disposed on the connection electrode for connecting the thermoelectric element and the wire. Meanwhile, the electrode and thermoelectric leg can be joined by soldering, and similarly, the connecting electrode and connector can also be joined by soldering.

In general, during the manufacturing process of a thermoelectric element, it is preferable that the thermoelectric leg and connector are mounted simultaneously, but the solder printing thickness required between the electrode and the thermoelectric leg is different from the solder printing thickness required between the connection electrode and the connector. do.

The technical problem to be achieved by the present invention is to provide a joining structure for a connector connected to a thermoelectric element.

A thermoelectric device according to an embodiment of the present invention includes a thermoelectric element, a connection electrode electrically connected to the thermoelectric element, a plurality of bonding layers disposed on the connection electrode, and It includes a connector portion disposed on the plurality of bonding layers, and the plurality of bonding layers are arranged to be spaced apart from each other along a circumference of a bottom surface of the connector portion.

The connection electrode portion includes a first connection electrode and a second connection electrode spaced apart from the first connection electrode, and the first connection electrode branches into a 1-1 connection electrode area and a 1-2 connection electrode area, The second connection electrode is branched into a 2-1 connection electrode area and a 2-2 connection electrode area, and the 1-1 connection electrode area, the 1-2 connection electrode area, and the 2-1 connection electrode The plurality of bonding layers may be disposed in each region and the 2-2 connection electrode region.

The connector unit includes a plurality of connectors, and each connector is provided in each of the 1-1 connection electrode region, the 1-2 connection electrode region, the 2-1 connection electrode region, and the 2-2 connection electrode region. can be placed.

The shortest distance in the first direction between the plurality of bonding layers and the exterior of the thermoelectric element is shorter than the shortest distance in the second direction between the plurality of bonding layers and the exterior of the thermoelectric element, and the first direction is connected to the thermoelectric element. This is the direction in which the electrode units are connected, and the second direction may be perpendicular to the first direction.

A portion of the bottom of the connector portion may include a concave-shaped region, and one bonding layer among the plurality of bonding layers may be disposed to correspond to the concave-shaped region.

The concave shape may be disposed between the inner and outer surfaces of the one bonding layer.

The outer surface of at least one of the plurality of bonding layers may be disposed outside the bottom surface of the connector portion.

The distance between the inner surface of at least one of the plurality of bonding layers and the outer side of the bottom surface of the connector portion may be greater than the distance between the outer side of at least one of the plurality of bonding layers and the outer side of the bottom surface of the connector portion.

It further includes a wire part connected to the connector part, wherein the connector part includes a first wire fixing member to which the wire part is fixed and a frame for accommodating the first wire fixing member, and the first wire fixing member is of the wire part. When attached or detached, the frame moves in a direction toward at least one of a first wall surface of the frame and a second wall surface of the frame opposite the first wall surface, and the plurality of bonding layers include a first bottom surface extending from the first wall surface and It may include a first bonding layer disposed between the connection electrode portions, and a second bonding layer disposed between the connection electrode portion and a second bottom surface extending from the second wall surface and spaced apart from the first bottom surface. there is.

The connection electrode portion and the first wire fixing member may be arranged to be spaced apart from the first bonding layer and the second bonding layer that are spaced apart from each other.

The plurality of bonding layers extend from a third wall surface facing the wire entry hole and a third bonding layer disposed between the third bottom surface extending from the wire entry hole of the frame and the connection electrode portion, and the third bottom surface and It may further include a fourth bonding layer disposed between the fourth spaced apart bottom surface and the connection electrode portion.

The connector portion further includes a second wire fixing member extending from the third bottom surface, and the connection electrode portion and the second wire fixing member are spaced apart from each other between the third bonding layer and the fourth bonding layer. It can be arranged as much as possible.

The total area of the plurality of bonding layers may be 80 to 120% of the total area of the first bottom surface, the second bottom surface, the third bottom surface, and the fourth bottom surface.

The thickness of the plurality of bonding layers may be 0.08 to 0.1 mm.

The thermoelectric element includes a first substrate, a first insulating layer disposed on the first substrate, a plurality of first electrodes disposed on the first insulating layer, and a plurality of P-type disposed on the plurality of first electrodes. A thermoelectric leg and a plurality of N-type thermoelectric legs, a plurality of second electrodes disposed on the plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs, a second insulating layer disposed on the plurality of second electrodes, and It includes a second substrate disposed on a second insulating layer, wherein the connection electrode portion is disposed on a side of the plurality of first electrodes on the first substrate, and includes the plurality of first electrodes and the plurality of P-type thermoelectric legs. And a bonding layer may be further disposed between the plurality of N-type thermoelectric legs.

A thickness of the plurality of bonding layers disposed between the connection electrode portion and the connector portion and a thickness of the bonding layer disposed between the plurality of first electrodes and the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs. may be 0.8 to 0.1 mm, respectively.

The plurality of bonding layers may be solder layers.

According to an embodiment of the present invention, a thermoelectric element with excellent performance and high reliability can be obtained. In particular, according to an embodiment of the present invention, it is possible to obtain a connector joint structure that can satisfy both the solder print thickness required between the electrode and the thermoelectric leg and the solder print thickness required between the connection electrode and the connector.

The thermoelectric element according to the embodiment of the present invention can be applied not only in small-scale applications but also in large-scale applications such as vehicles, ships, steel mills, incinerators, etc.

1 is a cross-sectional view of a thermoelectric element.
Figure 2 is a perspective view of a thermoelectric element.
Figure 3 is a perspective view of a thermoelectric element including a sealing member.
Figure 4 is an exploded perspective view of a thermoelectric element including a sealing member.
Figure 5 is a top view of a substrate and electrode included in a thermoelectric element according to an embodiment of the present invention.
Figure 6 is a perspective view of a thermoelectric module in which a heat sink is disposed on a thermoelectric element according to an embodiment of the present invention.
Figure 7 is a perspective view of a connector disposed on a connection electrode portion and a wire connected to the connector according to an embodiment of the present invention.
Figure 8 is a top view of a connector according to one embodiment of the invention.
Figure 9 is a rear perspective view of a wire connected to a connector according to an embodiment of the present invention.
Figure 10 is an example of a pattern of a bonding layer disposed on a connection electrode according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

However, the technical idea of the present invention is not limited to some of the described embodiments, but may be implemented in various different forms, and as long as it is within the scope of the technical idea of the present invention, one or more of the components may be optionally used between the embodiments. It can be used by combining and replacing.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention, unless explicitly specifically defined and described, are generally understood by those skilled in the art to which the present invention pertains. It can be interpreted as meaning, and the meaning of commonly used terms, such as terms defined in a dictionary, can be interpreted by considering the contextual meaning of the related technology.

Additionally, the terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention.

In this specification, the singular may also include the plural unless specifically stated in the phrase, and when described as "at least one (or more than one) of A and B and C", it is combined with A, B, and C. It can contain one or more of all possible combinations.

Additionally, when describing the components of an embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used.

These terms are only used to distinguish the component from other components, and are not limited to the essence, sequence, or order of the component.

And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, the component is not only directly connected, coupled or connected to that other component, but also is connected to that component. It can also include cases where other components are 'connected', 'combined', or 'connected' due to another component between them.

Additionally, when described as being formed or disposed "above" or "below" each component, "above" or "below" refers not only to cases where two components are in direct contact with each other, but also to one This also includes cases where another component described above is formed or placed between two components. In addition, when expressed as "top (above) or bottom (bottom)", it may include not only the upward direction but also the downward direction based on one component.

Figure 1 is a cross-sectional view of a thermoelectric element, and Figure 2 is a perspective view of the thermoelectric element. Figure 3 is a perspective view of a thermoelectric element including a sealing member, and Figure 4 is an exploded perspective view of a thermoelectric element including a sealing member.

Referring to Figures 1 and 2, the thermoelectric element 100 includes a lower substrate 110, a lower electrode 120, a P-type thermoelectric leg 130, an N-type thermoelectric leg 140, an upper electrode 150, and an upper substrate. Includes (160).

The lower electrode 120 is disposed between the lower substrate 110 and the lower bottom surfaces of the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140, and the upper electrode 150 is disposed between the upper substrate 160 and the P-type thermoelectric leg 140. It is disposed between the upper bottom surface of the thermoelectric leg 130 and the N-type thermoelectric leg 140. Accordingly, the plurality of P-type thermoelectric legs 130 and the plurality of N-type thermoelectric legs 140 are electrically connected by the lower electrode 120 and the upper electrode 150. A pair of P-type thermoelectric legs 130 and N-type thermoelectric legs 140 disposed between the lower electrode 120 and the upper electrode 150 and electrically connected may form a unit cell.

For example, when voltage is applied to the lower electrode 120 and the upper electrode 150 through the lead wires 181 and 182, a current flows from the P-type thermoelectric leg 130 to the N-type thermoelectric leg 140 due to the Peltier effect. The substrate through which current flows absorbs heat and acts as a cooling portion, and the substrate through which current flows from the N-type thermoelectric leg 140 to the P-type thermoelectric leg 130 is heated and may act as a heating portion. Alternatively, if a temperature difference is applied between the lower electrode 120 and the upper electrode 150, the charges in the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 may move due to the Seebeck effect, and electricity may be generated. .

Here, the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 may be bismuth telluride (Bi-Te)-based thermoelectric legs containing bismuth (Bi) and tellurium (Te) as main raw materials. The P-type thermoelectric leg 130 is made of antimony (Sb), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), and tellurium. It may be a bismuth telluride (Bi-Te)-based thermoelectric leg containing at least one of (Te), bismuth (Bi), and indium (In). For example, the P-type thermoelectric leg 130 contains 99 to 99.999 wt% of Bi-Sb-Te, the main raw material, based on 100 wt% of the total weight, and nickel (Ni), aluminum (Al), and copper (Cu). , it may contain 0.001 to 1 wt% of at least one of silver (Ag), lead (Pb), boron (B), gallium (Ga), and indium (In). The N-type thermoelectric leg 140 is selenium (Se), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), and tellurium. It may be a bismuth telluride (Bi-Te)-based thermoelectric leg containing at least one of (Te), bismuth (Bi), and indium (In). For example, the N-type thermoelectric leg 140 contains 99 to 99.999 wt% of Bi-Se-Te, the main raw material, based on 100 wt% of the total weight, and nickel (Ni), aluminum (Al), and copper (Cu). , it may contain 0.001 to 1 wt% of at least one of silver (Ag), lead (Pb), boron (B), gallium (Ga), and indium (In).

The P-type thermoelectric leg 130 and N-type thermoelectric leg 140 may be formed in bulk or stacked form. In general, the bulk P-type thermoelectric leg 130 or the bulk N-type thermoelectric leg 140 is manufactured by heat-treating a thermoelectric material to produce an ingot, crushing and sieving the ingot to obtain powder for the thermoelectric leg, and then manufacturing the ingot. It can be obtained through the process of sintering and cutting the sintered body. At this time, the P-type thermoelectric leg 130 and N-type thermoelectric leg 140 may be polycrystalline thermoelectric legs. In this way, when the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 are polycrystalline thermoelectric legs, the strength of the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 can be increased. The stacked P-type thermoelectric leg 130 or the stacked N-type thermoelectric leg 140 is formed by applying a paste containing a thermoelectric material on a sheet-shaped substrate to form a unit member, and then through the process of stacking and cutting the unit members. can be obtained.

At this time, the pair of P-type thermoelectric legs 130 and N-type thermoelectric legs 140 may have the same shape and volume, or may have different shapes and volumes. For example, since the electrical conduction characteristics of the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 are different, the height or cross-sectional area of the N-type thermoelectric leg 140 is changed to the height or cross-sectional area of the P-type thermoelectric leg 130. It may be formed differently.

At this time, the P-type thermoelectric leg 130 or N-type thermoelectric leg 140 may have a cylindrical shape, a polygonal pillar shape, an oval pillar shape, etc.

Alternatively, the P-type thermoelectric leg 130 or N-type thermoelectric leg 140 may have a stacked structure. For example, a P-type thermoelectric leg or an N-type thermoelectric leg may be formed by stacking a plurality of structures coated with a semiconductor material on a sheet-shaped substrate and then cutting them. Accordingly, material loss can be prevented and electrical conduction characteristics can be improved. Each structure may further include a conductive layer having an opening pattern, thereby increasing adhesion between structures, lowering thermal conductivity, and increasing electrical conductivity.

Alternatively, the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140 may be formed to have different cross-sectional areas within one thermoelectric leg. For example, the cross-sectional area of both ends disposed toward the electrode within one thermoelectric leg may be larger than the cross-sectional area between the two ends. According to this, since a large temperature difference between both ends can be formed, thermoelectric efficiency can be increased.

The performance of a thermoelectric element according to an embodiment of the present invention can be expressed as a thermoelectric figure of merit (ZT). The thermoelectric performance index (ZT) can be expressed as Equation 1.

Here, α is the Seebeck coefficient [V/K], σ is the electrical conductivity [S/m], and α ² σ is the power factor (Power Factor, [W/mK ² ]). And, T is the temperature, and k is the thermal conductivity [W/mK]. k can be expressed as a·cp·ρ, where a is the thermal diffusivity [cm ² /S], cp is the specific heat [J/gK], and ρ is the density [g/cm ³ ].

To obtain the thermoelectric performance index of a thermoelectric element, the Z value (V/K) is measured using a Z meter, and the thermoelectric performance index (ZT) can be calculated using the measured Z value.

Here, the lower electrode 120 disposed between the lower substrate 110 and the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140, and the upper substrate 160 and the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140. The upper electrode 150 disposed between the thermoelectric legs 140 includes at least one of copper (Cu), silver (Ag), aluminum (Al), and nickel (Ni), and has a thickness of 0.01 mm to 0.3 mm. You can. If the thickness of the lower electrode 120 or upper electrode 150 is less than 0.01 mm, its function as an electrode may be reduced and electrical conduction performance may be lowered, and if it exceeds 0.3 mm, conduction efficiency may be lowered due to an increase in resistance. .

Additionally, the lower substrate 110 and the upper substrate 160 that face each other may be metal substrates, and their thickness may be 0.1 mm to 1.5 mm. If the thickness of the metal substrate is less than 0.1 mm or more than 1.5 mm, the heat dissipation characteristics or thermal conductivity may be excessively high, and the reliability of the thermoelectric element may be reduced. For example, at least one of the lower substrate 110 and the upper substrate 160 may be made of at least one of aluminum, aluminum alloy, copper, and copper alloy. The lower substrate 110 and the upper substrate 160 may be made of different materials. For example, among the lower substrate 110 and the upper substrate 160, the substrate requiring greater withstand voltage performance may be made of an aluminum substrate, and the substrate requiring more heat conduction performance may be made of a copper substrate.

In addition, when the lower substrate 110 and the upper substrate 160 are metal substrates, an insulating layer 170 is formed between the lower substrate 110 and the lower electrode 120 and between the upper substrate 160 and the upper electrode 150, respectively. ) can be further formed. The insulating layer 170 may include a material having a thermal conductivity of 1 to 20 W/mK and may correspond to the first insulating layer 220, which will be described later. Additionally, each insulating layer may be formed of multiple layers.

At this time, the lower substrate 110 and the upper substrate 160 may have different sizes. For example, the volume, thickness, or area of one of the lower substrate 110 and the upper substrate 160 may be larger than that of the other. Accordingly, the heat absorption or heat dissipation performance of the thermoelectric element can be improved. Preferably, the volume, thickness, or area of the lower substrate 110 may be larger than at least one of the volume, thickness, or area of the upper substrate 160. At this time, when the lower substrate 110 is placed in a high temperature area for the Seebeck effect, when applied as a heating area for the Peltier effect, or when a sealing member for protection from the external environment of the thermoelectric module, which will be described later, is placed on the lower substrate 110. When disposed, at least one of volume, thickness, or area can be made larger than the upper substrate 160. At this time, the area of the lower substrate 110 may be 1.2 to 5 times the area of the upper substrate 160. If the area of the lower substrate 110 is less than 1.2 times that of the upper substrate 160, the effect on improving heat transfer efficiency is not high, and if it exceeds 5 times, the heat transfer efficiency is significantly reduced, and the thermoelectric module It may be difficult to maintain the basic shape of.

Additionally, a heat dissipation pattern, for example, a concave-convex pattern, may be formed on the surface of at least one of the lower substrate 110 and the upper substrate 160. Accordingly, the heat dissipation performance of the thermoelectric element can be improved. When the uneven pattern is formed on the surface in contact with the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140, the bonding characteristics between the thermoelectric leg and the substrate may also be improved. The thermoelectric element 100 includes a lower substrate 110, a lower electrode 120, a P-type thermoelectric leg 130, an N-type thermoelectric leg 140, an upper electrode 150, and an upper substrate 160.

As shown in FIGS. 3 and 4, a sealing member 190 may be further disposed between the lower substrate 110 and the upper substrate 160. The sealing member may be disposed between the lower substrate 110 and the upper substrate 160 on the sides of the lower electrode 120, the P-type thermoelectric leg 130, the N-type thermoelectric leg 140, and the upper electrode 150. . Accordingly, the lower electrode 120, P-type thermoelectric leg 130, N-type thermoelectric leg 140, and upper electrode 150 can be sealed from external moisture, heat, contamination, etc. Here, the sealing member 190 is the outermost of the plurality of lower electrodes 120, the outermost of the plurality of P-type thermoelectric legs 130 and the plurality of N-type thermoelectric legs 140, and the plurality of upper electrodes 150. A sealing case 192 disposed at a predetermined distance from the outermost side of the sealing case 192, a sealing material 194 disposed between the sealing case 192 and the lower substrate 110, and a sealing material 194 disposed between the sealing case 192 and the upper substrate 160. It may include a sealing material 196 disposed in. In this way, the sealing case 192 may contact the lower substrate 110 and the upper substrate 160 through the sealing materials 194 and 196. Accordingly, when the sealing case 192 is in direct contact with the lower substrate 110 and the upper substrate 160, heat conduction occurs through the sealing case 192, and as a result, the lower substrate 110 and the upper substrate 160 It can prevent the problem of lowering the temperature difference between the liver. Here, the sealing materials 194 and 196 may include at least one of an epoxy resin and a silicone resin, or may include a tape with at least one of an epoxy resin and a silicone resin applied to both sides. The sealing material 194, 194 serves to seal between the sealing case 192 and the lower substrate 110 and between the sealing case 192 and the upper substrate 160, and the lower electrode 120 and the P-type thermoelectric leg ( 130), the sealing effect of the N-type thermoelectric leg 140 and the upper electrode 150 can be increased, and can be mixed with finishing materials, finishing layers, waterproofing materials, waterproofing layers, etc. Here, the sealing material 194 for sealing between the sealing case 192 and the lower substrate 110 is disposed on the upper surface of the lower substrate 110, and the sealing material for sealing between the sealing case 192 and the upper substrate 160 ( 196) may be disposed on the side of the upper substrate 160. To this end, the area of the lower substrate 110 may be larger than the area of the upper substrate 160. Meanwhile, a guide groove (G) may be formed in the sealing case 192 for pulling out the lead wires 180 and 182 connected to the electrodes. For this purpose, the sealing case 192 may be an injection molded product made of plastic or the like, and may be used interchangeably with the sealing cover. However, the above description of the sealing member is merely an example, and the sealing member may be modified into various forms. Although not shown, an insulating material may be further included to surround the sealing member. Alternatively, the sealing member may include an insulating component.

In the above, the terms lower substrate 110, lower electrode 120, upper electrode 150, and upper substrate 160 are used, but for ease of understanding and convenience of explanation, they are arbitrarily referred to as upper and lower. In addition, the positions may be reversed so that the lower substrate 110 and the lower electrode 120 are disposed at the upper portion, and the upper electrode 150 and the upper substrate 160 are disposed at the lower portion.

Figure 5 is a top view of a substrate and electrodes included in a thermoelectric element according to an embodiment of the present invention, and Figure 6 is a perspective view of a thermoelectric module with a heat sink disposed on the thermoelectric element according to an embodiment of the present invention.

Referring to Figures 5 and 6, the thermoelectric module 1000 according to an embodiment of the present invention includes a thermoelectric element 100 and a heat sink 200 disposed on the thermoelectric element 100. Redundant description of content that is the same as that described in FIGS. 1 to 4 with respect to the thermoelectric element 100 will be omitted.

Hereinafter, the description will focus on the arrangement of the connection electrode unit 400 on the first substrate 110.

As described above, the first insulating layer 170 is disposed on the first substrate 110, and a plurality of first electrodes 120 are disposed on the first insulating layer 170.

At this time, the plurality of first electrodes 120 may be arranged to form a plurality of electrode outlines, and the first substrate 110 may have a plurality of substrate outlines corresponding to the plurality of electrode outlines. Here, the electrode outline may mean the edge of the plurality of first electrodes 120, and the substrate outline may mean the edge of the first substrate 110. For example, when the plurality of first electrodes 120 are arranged in a square shape, the plurality of first electrodes 120 may have first to fourth electrode outlines E1 to E4, and the first substrate ( 110) may have first to fourth substrate outer edges (S1 to S4) corresponding to first to fourth electrode outer edges (E1 to E4), respectively.

According to an embodiment of the present invention, the connection electrode unit 400 may include a first connection electrode 410 and a second connection electrode 420 with different polarities. For example, when the (-) terminal is connected to the first connection electrode 410, the (+) terminal may be connected to the second connection electrode 420. For example, the first connection electrode 410 of the connection electrode unit 400 connects the thermoelectric element 100 and the (-) terminal, and the second connection electrode 420 connects the thermoelectric element 100 and the (+) terminal. The terminal can be connected. Accordingly, the location of the connection electrode portion 400 may affect the insulation resistance of the thermoelectric element 200. Insulation resistance refers to the electrical resistance shown by the insulator when a predetermined voltage is applied, and the thermoelectric element 100 must satisfy the predetermined insulation resistance. For example, the thermoelectric element 100 must meet the requirement of having an insulation resistance of 500 MΩ or more when a dc voltage of 500 V is applied.

According to an embodiment of the present invention, when the connection electrode unit 400 is connected to the first electrode outline E1, the distance d1 between the first electrode outline E1 and the first substrate outline S1 is 2 It may be longer than the distance (d2 to d4) between the outer edges of the second to fourth electrodes (E2 to E4) and the outer edges of the second to fourth substrates (S2 to S4). At this time, the connection electrode unit 400 includes a first insulating layer 170, a plurality of first electrodes 120, and a plurality of P-type thermoelectric elements 130 between the first substrate 110 and the second substrate 160. And it may be drawn out to the outside of a sealing member (not shown) disposed to surround the plurality of N-type thermoelectric elements 140, the plurality of second electrodes 150, and the second insulating layer 170.

Here, the shortest distance (A1, A2) between the connection electrode unit 400 and the outer edge of the first substrate (S1) may be 12 mm or more, preferably 14 mm or more, and more preferably 16 mm or more.

And, the shortest distance (B1) between the second substrate outer edge (S2) connected to the first substrate outer edge (S1) and the first connection electrode 410 and the third substrate outer edge (S3) connected to the first substrate outer edge (S1). ) and the second connection electrode 420 may have a shortest distance (B2) of 12 mm or more, preferably 14 mm or more, and more preferably 16 mm or more.

Or, from the point where the first substrate outer edge (S1) and the second substrate outer edge (S2) meet, that is, the vertex between the first substrate outer edge (S1) and the second substrate outer edge (S2) to the first connection electrode 410. The second connection electrode ( The shortest distance (F2) to 420) may be 16 mm or more, preferably 19 mm or more, and more preferably 21 mm or more.

In this way, by adjusting the distance between the outer substrate and the connection electrode portion 400, a thermoelectric element with an insulation resistance of 500 MΩ or more can be obtained under a dc voltage of 500 V.

At this time, a connector into which a wire is removably inserted may be disposed on each of the first connection electrode 410 and the second connection electrode 420. As described above, each of the electrode connection portion 400, the first connection electrode 410, and the second connection electrode 420 may be disposed outside the sealing member. According to this, wire connection is easy and the possibility of disconnection between electrodes and wires can be minimized. At this time, two connectors may be placed on each connection electrode, and the polarities of the wires connected to the two connectors placed on each connection electrode may be different from or the same as each other.

To this end, as shown, each connection electrode may include a plurality of branched connection electrode regions. For example, the first connection electrode 410 may be branched into a 1-1 connection electrode region 412 and a 1-2 connection electrode region 414, and the second connection electrode 420 may be divided into a 1-1 connection electrode region 412 and a 1-2 connection electrode region 414. It may be branched into a first connection electrode area 422 and a second-second connection electrode area 424, and a connector may be placed in each connection electrode area.

According to an embodiment of the present invention, a connector may be placed on the connection electrode portion, and an electric wire may be connected to the connector in a detachable manner.

Figure 7 is a perspective view of a connector disposed on a connection electrode portion and a wire connected to the connector according to an embodiment of the present invention, Figure 8 is a top view of a connector according to an embodiment of the invention, and Figure 9 is a diagram of the connector of the present invention. This is a rear perspective view of a wire connected to a connector according to one embodiment.

7 to 9, a connector 500 is disposed on the connection electrode 400, and an electric wire 600 is connected to the connector 500. At this time, the connector 500 may be made of a conductive material, and accordingly, the thermoelectric element 100 may be electrically connected to the wire 600 through the connection electrode 400 and the connector 500.

At this time, the connector 500 may include a first wire fixing member 510 to which the wire 600 is fixed and a frame 520 that accommodates the first wire fixing member 510. Here, the frame 520 may have an open shape toward the connection electrode 400. That is, the frame 520 has a first wall surface 5211 including a first bottom surface 5201 disposed toward the connection electrode 400 and a second bottom surface 5202 disposed toward the connection electrode portion 400. It may include a second wall surface 5212 including . At this time, the first wire fixing member 510 is disposed at a predetermined distance apart so as not to contact the connection electrode part 400, and when the wire 600 is attached or detached, the first wall 5201 of the frame 520 and the first wall surface ( It can move in directions (X1, X2) toward at least one of the second wall surfaces 5202 facing 5201). Accordingly, the first wire fixing member 510 can press the wire 600 in the horizontal direction. Here, the horizontal direction may mean a direction parallel to the direction in which the connection electrode 400 is disposed.

And, the frame 520 extends from a third floor surface 5203 extending from the wire entry hole In and a third wall surface 5213 facing the wire entrance hole In and is spaced apart from the third floor surface 5203. It may further include a fourth bottom surface 5204. At this time, the connector 500 may further include a second wire fixing member 530 extending from the third bottom surface 5203. At this time, the second wire fixing member 530 may be spaced a predetermined distance away from the connection electrode 400 and may be arranged to be inclined in a direction opposite to the direction toward the connection electrode 400. Accordingly, the second wire fixing member 530 can press the wire 600 in the longitudinal direction. Here, the longitudinal direction may mean a direction perpendicular to the direction in which the connection electrode 400 is disposed.

In this way, the frame 520 may have an open shape spaced a predetermined distance away from the connection electrode portion 400 except for the first to fourth bottom surfaces 5201 to 5204. According to this, the wire 600 is easily inserted as the first wire fixing member 510 and the second wire fixing member 530 move within the frame 520, and the inserted wire 600 has a high tensile strength. , for example, can be fixed to have a tensile strength of 2kgf or more. In addition, the connector 500 made of a conductive material can satisfy the standards of allowable voltage and current, for example, DC 20V and 1.5mA.

Meanwhile, as described above, the plurality of first electrodes 120 and connection electrodes 400 forming the thermoelectric element 100 are disposed on the same plane, that is, on the first insulating layer 170. A plurality of thermoelectric legs are mounted on the plurality of first electrodes 120, and a connector 500 is mounted on the connection electrode 400. At this time, between the plurality of first electrodes 120 and the plurality of thermoelectric legs and between the connection electrode 400 and the connector 500 may be joined by solder. In the manufacturing process, the process of mounting a plurality of thermoelectric legs on the plurality of first electrodes 120 and the process of mounting the connector 500 on the connection electrode 400 may be performed simultaneously. Accordingly, solder can be printed simultaneously on the plurality of first electrodes 120 and the connection electrodes 400. Hereinafter, the bonding layer is a layer that joins the plurality of first electrodes 120 and the plurality of thermoelectric legs to the connection electrode 400 and the connector 500, and may be, for example, a solder layer applied or printed for soldering.

Meanwhile, for bonding between the plurality of first electrodes 120 and the plurality of thermoelectric legs, it is preferable that the thickness of the bonding layer after shrinkage satisfies the range of 0.08 to 0.1 mm. For this purpose, it is preferable that the bonding layer is printed on the plurality of first electrodes 120 in a range of 0.145 to 0.2 mm.

However, when the bonding layer is printed in the range of 0.145 to 0.2 mm on the entire area of the connecting electrode 400, the internal area between the first bottom surface 5201 and the fourth bottom surface 5204 of the connector 500 As a result, the bonding layer can rise and harden. In this case, restrictions may be placed on the movement of the first wire fixing member 510 and the second wire fixing member 530, and as a result, insertion of the wire 600 may become difficult or fixing the inserted wire 600 may be difficult. Your strength may weaken.

In order to solve this problem, an embodiment of the present invention seeks to adjust the pattern of the bonding layer on the connection electrode portion.

Figure 10 is an example of a pattern of a bonding layer disposed on a connection electrode according to an embodiment of the present invention.

Referring to FIG. 10 , the bonding layer 700 may be disposed on a portion of the connection electrode portion 400 . For example, the bonding layer 700 may have a plurality of bonding layers 710, 720, 730, and 740 separated from each other on the connection electrode 400. As such, when the bonding layer 700 is disposed on a portion of the connection electrode portion 400 rather than the entire surface, the connection electrode 400 and the connector 500 may be bonded by the bonding layer 700, and may be connected to each other by the bonding layer 700. Even if it is printed with the same thickness as the first electrode 120 of , the problem of the bonding layer 700 rising to the inner area of the connector 500 can be prevented.

At this time, the bonding layer 700 may include a plurality of bonding layers 710, 720, 730, and 740, and the plurality of bonding layers 710, 720, 730, and 740 are connected to the connector 500 on the connection electrode 400. ) can be arranged to be spaced apart from each other along the perimeter of the bottom of the.

As shown in FIGS. 5 and 6, the connection electrode unit 400 includes a first connection electrode 410 and a second connection electrode 420, and the first connection electrode 410 is connected to the 1-1 connection. It branches into an electrode area 412 and a 1-2 connection electrode area 414, and the second connection electrode 420 branches into a 2-1 connection electrode area 422 and a 2-2 connection electrode area 424. When branched, a plurality of bonding layers 710, 720, 730, and 740 may be disposed in each connection electrode region 412, 414, 422, and 424, and each connection electrode region 412, 414, 422, and 424 A connector 500 may be placed in . Accordingly, the connection direction of the connection electrode unit 400, that is, the direction toward the outer edge S1 of the first substrate 110, is referred to as the first direction, and the direction perpendicular to the first direction, that is, the first substrate 110 When the direction toward the outer edge (S2) of ) may be shorter than the shortest distance b1 in the second direction between the plurality of bonding layers 710, 720, 730, and 740 and the outer edge S2 of the first substrate 110. According to this, it is easy to connect the wire 600 to the connector 500, and the insulation resistance of the thermoelectric element 100 can be improved.

Meanwhile, as described above, the plurality of bonding layers 710, 720, 730, and 740 may be arranged to be spaced apart from each other along the perimeter of the bottom of the connector 500. Here, the bottom surface of the connector 500 is the surface facing the connection electrode 400 when the connector 500 is placed on the connection electrode 400, that is, in direct contact with the connection electrode 400 or the bonding layer 700. It may refer to a surface that contacts the connection electrode 400 through . At this time, a portion of the bottom of the connector 500 may include a region C having a concave shape. Here, the area C having a concave shape may be a bottom surface extending from the wire entry hole In of the connector 500. One bonding layer 730 among the plurality of bonding layers 710, 720, 730, and 740 may be disposed to correspond to the region C having the concave shape C1. For example, the concave shape may be disposed between the inner surface 732 and the outer surface 734 of the bonding layer 730. Here, the inner surface of the bonding layer may refer to a surface facing the inside of the connector 500, and the outer surface of the bonding layer may refer to a surface facing the outside of the connector 500. According to this, the connector 500 can be stably joined and fixed to the connection electrode 400 near the wire entry hole In.

Meanwhile, the outer surface of at least one of the plurality of bonding layers 710, 720, 730, and 740 may be disposed outside the bottom of the connector 500. At this time, the distance (t1) between the inner surface (712, 722, 732, 742) of at least one of the plurality of bonding layers (710, 720, 730, 740) and the outer side of the bottom surface of the connector 500 is the plurality of bonding layers ( It may be greater than the distance t2 between at least one of the outer surfaces 714, 724, 734, and 744 among the connectors 710, 720, 730, and 740 and the outer bottom of the connector 500. According to this, since the bottom of the connector 500 can be bonded to the connection electrode 400 through a plurality of bonding layers 710, 720, 730, and 740, the bonding strength between the connector 500 and the connection electrode 400 is high. It can get higher.

More specifically, the plurality of bonding layers 710, 720, 730, and 740 may be arranged to correspond to the shape of the bottom surface of the frame 520 facing the connection electrode 400. For example, the bottom surface of the frame 520 facing the connection electrode 400 may include a first bottom surface 5201 to a fourth bottom surface 5204. For example, the bonding layer 700 includes a first bonding layer 710 and a second wall surface 5212 disposed between the first bottom surface 5201 extending from the first wall surface 5211 and the connection electrode 400. It may include a second bonding layer 720 extending from and disposed between the second bottom surface 5202 and the connection electrode 400 spaced apart from the first bottom surface 5201. At this time, the first bonding layer 710 and the second bonding layer 720 may be spaced apart from each other. Accordingly, the first bonding layer 710 and the second bonding layer 720 are not disposed between the connection electrode 400 and the first wire fixing member 510, and the first bonding layer 710 and the second bonding layer 720 are not disposed between the connecting electrode 400 and the first wire fixing member 510. The fixing member 510 may be free to move.

In addition, the bonding layer 700 includes a third bonding layer 730 disposed between the third bottom surface 5203 extending from the wire entry hole (In) of the frame 520 and the connection electrode 400 and the wire entry hole (In). ) and further includes a fourth bonding layer 740 disposed between the fourth bottom surface 5204 and the connection electrode 400, which extends from the third wall surface 5213 facing and is spaced apart from the third bottom surface 5203. can do. At this time, the third bonding layer 730 and the fourth bonding layer 740 may be spaced apart from each other. According to this, the third bonding layer 730 and the fourth bonding layer 740 are not disposed between the connection electrode 400 and the second wire fixing member 530, and the second wire is The fixing member 530 may be free to move.

At this time, the total area of the plurality of bonding layers 710, 720, 730, and 740 is the first bottom surface 5201, the second bottom surface 5202, the third bottom surface 5203, and the fourth bottom surface 5204. It may be 80 to 120% of the total area. According to this, solder can be printed on the plurality of first electrodes 120 and the connection electrode 400 in a single process and with the same thickness, and thus the bonding layer between the plurality of first electrodes 120 and the thermoelectric leg can be formed. The thickness and the thickness of the bonding layer between the connection electrode 400 and the connector 500 may be formed within the range of 0.08 to 0.1 mm. According to this, although the bonding force between the connection electrode 400 and the connector 500 is high, the bonding layer 700 is not disposed in the inner area of the connector 500, so insertion of the wire 600 is easy, and the inserted wire ( 600) can be maintained high. For example, when the bonding layer 700 is formed between the connection electrode 400 and the connector 500 according to an embodiment of the present invention, when the wire 600 is inserted into the connector 500, the force is 30N or less, preferably A wire insertion force of 15N or less, more preferably 10N or less, is required, and when the inserted wire 600 is separated from the connector 500, a tensile strength of 30N or more, preferably 40N or more, and more preferably 50N or more is required. can be seen.

The thermoelectric element according to an embodiment of the present invention can be used in a power generation device, a cooling device, a heating device, etc.

Although the present invention has been described above with reference to preferred embodiments, those skilled in the art may make various modifications and changes to the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. You will understand that you can do it.

Claims (17)

thermoelectric element,
A connection electrode portion electrically connected to the thermoelectric element,
A plurality of bonding layers disposed on the connection electrode portion, and
A connector portion disposed on the plurality of bonding layers,
A thermoelectric device wherein the plurality of bonding layers are arranged to be spaced apart from each other along the circumference of the bottom of the connector portion. According to paragraph 1,
The connection electrode unit includes a first connection electrode and a second connection electrode spaced apart from the first connection electrode,
The first connection electrode is branched into a 1-1 connection electrode area and a 1-2 connection electrode area,
The second connection electrode branches into a 2-1 connection electrode area and a 2-2 connection electrode area,
A thermoelectric device wherein the plurality of bonding layers are disposed in each of the 1-1 connection electrode region, the 1-2 connection electrode region, the 2-1 connection electrode region, and the 2-2 connection electrode region. According to paragraph 2,
The connector unit includes a plurality of connectors,
A thermoelectric device wherein each connector is disposed in each of the 1-1 connection electrode region, the 1-2 connection electrode region, the 2-1 connection electrode region, and the 2-2 connection electrode region. According to paragraph 2,
The shortest distance in the first direction between the plurality of bonding layers and the outer perimeter of the thermoelectric element is shorter than the shortest distance in the second direction between the plurality of bonding layers and the outer perimeter of the thermoelectric element,
The first direction is a direction in which the connection electrode part is connected to the thermoelectric element, and the second direction is a direction perpendicular to the first direction. According to paragraph 1,
A thermoelectric device wherein a portion of the bottom of the connector portion includes a concave-shaped region, and one bonding layer among the plurality of bonding layers is arranged to correspond to the concave-shaped region. According to clause 5,
The concave shape is a thermoelectric device disposed between the inner and outer surfaces of the one bonding layer. According to paragraph 1,
A thermoelectric device wherein an outer surface of at least one of the plurality of bonding layers is disposed outside the bottom surface of the connector portion. In clause 7,
A thermoelectric device wherein the distance between the inner surface of at least one of the plurality of bonding layers and the outer side of the bottom surface of the connector portion is greater than the distance between the outer side of at least one of the plurality of bonding layers and the outer side of the bottom surface of the connector portion. According to paragraph 1,
Further comprising a wire portion connected to the connector portion,
The connector portion includes a first wire fixing member to which the wire part is fixed and a frame for accommodating the first wire fixing member,
The first wire fixing member moves in a direction toward at least one of a first wall surface of the frame and a second wall surface of the frame opposite the first wall surface when the electric wire part is attached and detached,
The plurality of bonding layers include a first bonding layer disposed between a first bottom surface extending from the first wall surface and the connection electrode portion, and a second bottom extending from the second wall surface and spaced apart from the first bottom surface. A thermoelectric device comprising a second bonding layer disposed between a surface and the connection electrode portion. According to clause 9,
A thermoelectric device arranged to be spaced apart from the first bonding layer and the second bonding layer, which are spaced apart from each other between the connection electrode portion and the first wire fixing member. According to clause 9,
The plurality of bonding layers extend from a third wall surface facing the wire entry hole and a third bonding layer disposed between the third bottom surface extending from the wire entry hole of the frame and the connection electrode portion, and the third bottom surface and A thermoelectric device further comprising a fourth bonding layer disposed between the fourth spaced apart bottom surface and the connection electrode portion. According to clause 11,
The connector portion further includes a second wire fixing member extending from the third bottom surface,
The connection electrode portion and the second wire fixing member are arranged to be spaced apart from each other between the third bonding layer and the fourth bonding layer. According to clause 11,
The thermoelectric device wherein the total area of the plurality of bonding layers is 80 to 120% of the total area of the first bottom surface, the second bottom surface, the third bottom surface, and the fourth bottom surface. According to paragraph 1,
A thermoelectric device wherein the plurality of bonding layers have a thickness of 0.08 to 0.1 mm. According to paragraph 1,
The thermoelectric element includes a first substrate, a first insulating layer disposed on the first substrate, a plurality of first electrodes disposed on the first insulating layer, and a plurality of P-type disposed on the plurality of first electrodes. A thermoelectric leg and a plurality of N-type thermoelectric legs, a plurality of second electrodes disposed on the plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs, a second insulating layer disposed on the plurality of second electrodes, and comprising a second substrate disposed on the second insulating layer,
The connection electrode portion is disposed on the side of the plurality of first electrodes on the first substrate,
A thermoelectric device further comprising a bonding layer disposed between the plurality of first electrodes, the plurality of P-type thermoelectric legs, and the plurality of N-type thermoelectric legs. According to clause 15,
A thickness of the plurality of bonding layers disposed between the connection electrode portion and the connector portion and a thickness of the bonding layer disposed between the plurality of first electrodes and the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs. are thermoelectric devices each measuring 0.8 to 0.1 mm. According to clause 16,
A thermoelectric device wherein the plurality of bonding layers are solder layers.

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