KR102651592B1 - Dual-curable Electrically Conductive Adhesive Composition Comprising Silver Particles - Google Patents

Abstract

The present invention is A) 3 to 15% by weight of acrylic resin; (B) 5'15% by weight of epoxy resin, (C) 3.5 to 9.5% by weight of latent hardener, (D) 0.1 to 0.7% by weight of radical polymerization initiator, (E) 0.05 to 0.2% by weight of stabilizer, (F) epoxy acrylic It relates to a dual-cure electrically conductive adhesive composition containing 1 to 10% by weight of resin and 70% by weight of (G) silver (Ag).

Description

Dual-curable Electrically Conductive Adhesive Composition Comprising Silver Particles }

The present invention relates to a dual-cure electrically conductive adhesive composition containing silver particles, and more specifically, to an epoxy acrylic resin containing an acrylic resin, an epoxy resin, a latent curing agent, a radical polymerization initiator, a stabilizer, epoxy, and acrylic, and is a dual-cure electrically conductive adhesive composition containing silver particles. It is an adhesive composition that can be pre-cured, is fully cured by heat, and contains an electrically conductive filler.

Electrically conductive adhesives are used in the electronics field for touch panels, LCD displays, PCB adhesion, and die attachment, and can also be applied to small electronic products such as smartphones and tablet PCs.

Small electronic products such as smartphones and tablet PCs are equipped with a camera module (CCM: Compact Camera Module), and since it is an electronic component sensitive to certain temperatures, soldering is not possible due to damage to the component due to strong heat.

In such cases, electrically conductive adhesives can be used as an alternative where soldering is required.

For example, U.S. Patent No. 6,344,157 describes an electrically conductive adhesive comprising a polymeric resin, a conductive filler, a corrosion inhibitor, and a metal filler. The metal filler here may be selected from indium, indium alloy, tin alloy, or mixtures thereof. The polymeric resin may be selected from the group consisting of vinyl-, phenol-, epoxy-, maleimide-, polyimide-, or silicon-containing resins.

A method of manufacturing a conductive adhesive using a metal filler is a method of manufacturing a conductive adhesive including a metal filler and a combination of cyanate ester and epoxy resin as a polymeric resin component (Korean Patent Publication No. 10-2012-0034080). There is a method of producing a combination of an epoxy resin and an amine compound as a resin component (Korean Patent Publication No. 10-2011-0101551). In addition, there is also a conductive die adhesive (Korean Patent Publication No. 10-2013-0107513) consisting of an acrylic monomer, a butadiene compound, a heat curing agent, and a conductive metal component.

However, adhesives made from a combination of cyanate ester and epoxy resin, adhesives made from a combination of epoxy resin and amine compounds, and adhesives made from a combination of acrylic monomer, butadiene compound, and heat curing agent all require high-temperature curing conditions of 120°C to 180°C. It is necessary, but its application is limited in the case of heat-sensitive electronic components such as camera modules.

Methods for improving electrical conductivity include increasing the content of silver particles and filler materials of conductive metals. However, in this case, the viscosity of the adhesive becomes too high, so there is a problem that a solvent or diluent must be used. In the case of an epoxy liquid paste adhesive containing a solvent or diluent (Korean Patent Publication No. 10-2008-0058822), the epoxy resin in a parallel state with the surrounding atmosphere absorbs moisture, and this moisture causes the ripple of the PCB (printed circuit board). During the reflow process, it changes into saturated steam, which may cause a fatal imbalance in the package due to excessive pressure caused by this steam and a decrease in the bending strength of the mold compound and die adhesive. Typical imbalance modes in packages include cracking of the encapsulant, cracking of the substrate, severe deformation of the package, and interlayer separation of one or more material bonding surfaces.

In addition, solvent-type or diluent-type liquid paste adhesives have the problem that the application method is limited to the screen printing method, a B-stage process for solvent volatilization is required, and there are problems in the working environment due to the solvent volatilization process.

In the case of one-component acrylate UV-curable electrically conductive adhesive, a low viscosity adhesive can be made using acrylate monomer, but it causes deep curing problems.

Since silver particles and conductive metal are light-shielding substances, a resin composition that mixes silver particles and conductive metal with ultraviolet curable resin absorbs even ultraviolet rays, so even when irradiated with ultraviolet rays, the deep portion of the resin composition cannot be cured. For this reason, the practical use of the above resin composition has not been expanded.

The present invention is intended to solve the problems of the prior art, and aims to provide a composition of a dual-cure electrically conductive adhesive containing silver particles that have low viscosity and can be heat-cured at ultraviolet rays and low temperatures.

In order to solve the above problems, the present invention is A) 3 to 15% by weight of acrylic resin; (B) 5 to 15% by weight of epoxy resin, (C) 3.5 to 9.5% by weight of latent hardener, (D) 0.1 to 0.7% by weight of radical polymerization initiator, (E) 0.05 to 0.2% by weight of stabilizer, (F) epoxy acrylic. Provided is a dual-cure electrically conductive adhesive composition containing 1 to 10% by weight of resin and 70% by weight of (G) silver (Ag).

In addition, the present invention provides a dual-cure electrically conductive adhesive composition, wherein the (A) acrylic resin has an acrylate monomer with 1 to 6 acrylic groups in the molecule.

In addition, the present invention provides a dual-cure electrically conductive adhesive composition, wherein the (B) epoxy resin has an epoxy equivalent weight of 160 to 170 g/eq, a viscosity of 2,000 to 4,000 cps, and is a mixture of bifunctional bisphenol type A and bisphenol type F. provides.

In addition, the present invention provides a dual curable electrically conductive adhesive composition, wherein the latent curing agent (C) is solid at 20 to 25° C. and is a modified aliphatic polyamine compound.

In addition, the present invention provides a dual-cure electrically conductive adhesive composition, wherein the (D) radical polymerization initiator is an initiator that undergoes photoreaction in the ultraviolet range of 200 to 420 nm and is a phosphine oxide-based compound.

In addition, the (E) stabilizer of the present invention is a substance that can improve storage stability at room temperature,

Provided is a dual-cure electrically conductive adhesive composition comprising at least one of barybturic acid, boric acid ester compound, and aluminum chelate.

In addition, the present invention is characterized in that the (F) epoxy acrylic resin includes an epoxy acrylic resin having an epoxy equivalent weight of 500 g/eq, a viscosity of 250,000 to 350,000 cps, and one epoxy group and one acrylate group. A dual-cure electrically conductive adhesive composition is provided.

In addition, in the present invention, the silver (Ag) (G) is an electrically conductive particle, consisting of an average particle size of 2 ㎛ ~ 15 ㎛, a specific surface area of 0.2 ~ 1.0 m ² /g, and a tap density of 2 ~ 6 g / cm ² . ) Provides a dual-cure electrically conductive adhesive composition comprising particles.

The present invention also provides a dual-cure electrically conductive adhesive comprising the adhesive composition.

After UV curing, the adhesive resin composition of the present invention can improve conductivity by enabling curing of parts where deep curing is not achieved at low temperatures using silver particles and conductive metal.

Hereinafter, preferred embodiments of the present invention will be described in detail. First, in describing the present invention, detailed descriptions of related well-known functions or configurations are omitted in order to not obscure the gist of the present invention.

As used herein, the terms 'about', 'substantially', etc. are used to mean at or close to the numerical value when manufacturing and material tolerances inherent in the stated meaning are presented, and are used to enhance the understanding of the present invention. Precise or absolute figures are used to assist in preventing unscrupulous infringers from taking unfair advantage of stated disclosures.

The dual-cure electrically conductive adhesive composition of the present invention includes (A) 3 to 15% by weight of acrylic resin; (B) 5 to 15% by weight of epoxy resin, (C) 3.5 to 9.5% by weight of latent hardener, (D) 0.1 to 0.7% by weight of radical polymerization initiator, (E) 0.05 to 0.2% by weight of stabilizer, (F) epoxy acrylic. It is characterized by containing 1 to 10% by weight of resin and 60 to 80% by weight of (G) silver (Ag).

The acrylic resin of component (A) is a viscosity, thixotropic, and photocurable resin of the composition, and is cured by ultraviolet rays. Acrylic resins may be used singly or in combination of two or more types, such as mono-, di-, or tri-functional or multi-functional groups.

In particular, when using acrylic monomer, it is easy to control the viscosity because the viscosity is low.

Specific examples of monofunctional acrylic monomers include Caprolactone Acrylate (CA), Isobornyl Acrylate (IBOA), Benzyl Acrylate (BZA), and Cyclic Trimethylopropane Formal Acrylate (Cyclic). trimethylopropane formal Acrylate (CTFA), Tridecyl Acrylate (TDA), 2-Phenoxy ethyl Acrylate (PHEA), 2-Hydroxy ethyl acrylate (2) -HEA), tetrahydrofurfuryl acrylate (THFA), N,N-dimethylacrylamide (DMAA), etc., but are not limited to these.

Specific examples of difunctional acrylic monomers include 1,6-hexanediol diacrylate (HDDA), tripropylene glycol diacrylate (TPGDA), and triethylene glycol diacrylate ( Triethylene glycol diacrylate (TEGDA), etc.

In addition, there are multifunctional acrylic monomers. Specific examples include trimethylolpropane triacrylate (TMPTA), pentaerythritol tetraacrylate (PETTA), and dipentaerythritol. pentaacrylate (DPPA), dipentaerythritol hexaacrylate (DPHA), etc.

The epoxy resin of component (B) is generally bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, phenol novolac epoxy resin, cresol novolac epoxy resin, amino epoxy resin, or cycloaliphatic epoxy resin. Two or more types can be used in combination.

The bisphenol A type epoxy resin preferably has an epoxy equivalent weight of 150 to 400 g/eq. Examples of commercially available products include YD-128, YD-134, YD-136, KDS-8128 from KUKDO Chemical, These include ADEKA's EP-4300E, EP-4000S, and EP-4010S, DIC's EPICLON 840 and EPICLON 850, and Huntsman's EPON825, EPON826, EPON828, and EPON830.

Bisphenol F-type epoxy resin preferably has an epoxy equivalent weight of 150 to 400 g/eq. Examples of commercially available products include KUKDO Chemical's YDF-165, YDF-170, YDF-1020, KDS-8170, and ADEKA. These include EP-4901E from DIC, EPICLON 830, EPICLON 830-S, EPICLON 835, EPICLON 835LV from DIC, and DER354 from Dow Chemical.

Novolak resins include phenol novolak resins and cresol novolak resins. Phenol novolac epoxy, which is a phenol analog, preferably has an equivalent weight of 160 to 200 g/eq. Examples of commercially available products include YDPN-628, YDPN-631, YDPN-638 from KUKDO Chemical, and EPICLON from DIC. There are N-740, EPICLON N-770, EPICLON N-775, EPICLON N-865, etc.

Phenol novolac epoxy, which is a cresol analogue, preferably has an equivalent weight of 190 to 220 g/eq. Examples of commercially available products include YDCN-500-1P and YDCN-500-4P from KUKDO Chemical and DIC. There are EPICLON N-660, EPICLON N-665, EPICLON N-670, EPICLON N-673, EPICLON N-680, EPICLON N-695, etc.

In addition, in the case of amino epoxy, the epoxy equivalent is 95g/eq, and there are ADEKA's EP-3950S and EP-3950L.

Cycloaliphatic epoxy resins have an epoxy equivalent of 120 to 220 g/eq, and include Daicel's CELLOXIDE 2021P, CELLOXIDE 2081, CELLOXIDE 2000, EHPE 3150, and EPOLEAD GT401.

The latent hardener of component (C) is a compound that is solid at room temperature and becomes activated when heated. Representative examples include imidazole compounds or reaction products of amine compounds and epoxy compounds.

Specific examples of imidazole compounds that are solid at room temperature and examples of commercially available products include 2-methyl imidazole (2-MZ-H), 2-undecyl imidazole (C11Z) from Shikoku, 2-Heptadecyl imidazole (C17Z), 2-ethyl-4methyl imidazole (2E4MZ), 2-phenyl imidazole (2PZ, 2PZ-PW), 2-phenyl-4-methyl imidazole (2P4MZ), 1- Benzyl-2methyl imidazole (1B2MZ), 1-benzyl-2-phenyl imidazole (1B2PZ), EH-5011S from ADEKA, etc. can be used.

Examples of commercially available products of the reaction product of an amine compound and an epoxy compound include PN-23, PN-H, PN-31, PN-40, PN-23J, and PN-31J from Ajinomoto Inc. , PN-40J, MY-23, MY-24, MY-H, MY-HK, ADEKA's EH-3731S, EH-4360S, EH-4370S, EH-4357S, etc. can be used.

The radical polymerization initiator of component (D) generates radicals by energy rays such as visible light and ultraviolet rays. In particular, a radical polymerization initiator capable of exhibiting a photoreaction in the 200-500nm ultraviolet range can be used. For example, one type or more than one type can be selected and used among hydroxyketone series, phosphine oxide series, and amino ketone, and there are no restrictions on use. Examples of commercially available products in the hydroxyketone series include 1-hydroxycyclohexyl phenyl ketone (Irgacure 184) and 2-hydroxy-2methyl-1-phenyl-1-propanone (Darocur) from BASF. 1173), etc.

Examples of commercially available products of the phosphine oxide series include 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (Lucirin TPO) and 2,4,6-trimethylbenzoyl-diphenyl phosphine from BASF. These include fornate (Lucirin TPO-L) and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide (Irgacure 819).

Examples of commercially available aminoketone-based products include 2-methyl-1[4-(methylthio)phenyl]-2-morphoninopropane-1-one (Irgacure 907) from BASF, 2 -Benzyl-2-dimethylamino-1-(4-morphoninophenyl)-butanone-1- (Irgacure 369), etc.

The stabilizer of component (E) is a substance that can improve storage stability at room temperature (25°C). It can be used as barbituric acid, boric acid ester compound, aluminum chelate, etc., and at least one or a mixture of two must be used to improve storage stability at room temperature (25°C).

The (F) epoxy acrylic resin, which contains both epoxy and acrylic, is a compound in which the radically reactive functional group is an acrylate group and the thermally reactive functional group is an epoxy group. Specific examples include glycidyl methacrylate, (meth)acryloyl group-containing alicyclic epoxy resin, and (meth)acryloyl group-containing bisphenol A type epoxy resin. Examples of commercially available products of glycidyl methacrylate resin include EM54 from ETERNA, NK oligo EA-5311, EA-5511, and EA05711 from SHIN-NAKAMURA CHEMICAL. . Examples of commercially available products of alicyclic epoxy resin containing a (meth)acryloyl group include Cychromer M100, Cychromer A200, and Cychromer 2000 from Daicel. Commercially available bisphenol A-type epoxy resins containing a (meth)acryloyl group include NK Oligo EA-1010N, EA-1010LC, and EA-1010NT manufactured by SHIN-NAKAMURA CHEMICAL.

The electrically conductive particles of component (G) are silver (Ag) and are micron-sized conductive particles.

Commercially available companies include Ferro Corp., Technic Inc., Ames Goldsmith Corp., Dowa Holdings Co., Ltd., and Metalor Technologies.

Electrically conductive particles silver (Ag) can be classified into spherical or plate shapes depending on their shape, and either spherical or plate shapes or a mixture of spherical and plate shapes can be used, but in the present invention, plate shapes are used.

The average particle size of silver (Ag) particles may be 0.1 to 100 ㎛, but is not limited thereto. Preferably it is 2㎛~15㎛, and the maximum particle size should not exceed 30㎛.

The specific surface area of silver (Ag) is preferably 0.1 to 10 m ² /g, and more preferably 0.2 to 1.0 m ² /g.

The tap density of silver (Ag) is preferably 1 to 10 g/cm ² , and more preferably 2 to 6 g/cm ² .

In the adhesive composition of the present invention, the content of electrically conductive silver particles is preferably 60 to 80% by weight, and more preferably 65 to 75% by weight. Here, the content refers to the total weight of the composition (100% by weight). If the silver content is less than 60%, electrical conductivity may be insufficient, and if it exceeds 80%, viscosity and adhesion may deteriorate.

The present invention will be further clarified by the following examples, which are merely specific examples of the present invention and are not intended to limit or restrict the scope of protection of the present invention.

Example

The present invention will be described in more detail by way of examples, but the present invention is not limited to these examples.

1. Preparation of resin composition

(A-1) Acrylate Resin 1: manufactured by Miwon Special Chemicals [MIRAMER M600]

Dipentaerythritol hexaacrylate, molecular weight 578, hexafunctional

(A-2) Acrylate Resin 2: manufactured by Miwon Special Chemicals [MIRAMER M410]

Ditrimethylolpropane tetraacrylate, molecular weight 466, tetrafunctional

(A-3) Acrylate Resin 3: manufactured by Miwon Special Chemicals [MIRAMER M300]

Trimethylolpropane triacrylate, molecular weight 296, trifunctional

(A-4) Acrylate Resin 4: manufactured by Miwon Special Chemicals [MIRAMER M200]

1,6-hexanedioldiacrylate, molecular weight 226, bifunctional

(A-5) Acrylate Resin 5: manufactured by Miwon Special Chemicals [MIRAMER M1140]

Isobornyl acrylate, molecular weight 208, monofunctional

(B) Epoxy resin: Kukdo Chemical [KDS-8161]

Bisphenol A/F type epoxy, epoxy equivalent weight 160~170g/eq, bifunctional

(C) Latent hardener: Adeka [EH-4357S]

Alicyclic polyamine hardener, average particle size 5㎛

(D-1) Radical polymerization initiator 1: manufactured by BASF [Lucirin TPO]

2,4,6-trimethylbenzoyl-diphenylphosphine oxide, molecular weight 348.4

(D-2) Radical polymerization initiator 1: manufactured by BASF [Irgacure 819]

Bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, molecular weight 418.5

(E) Stabilizer: [Barbituric acid] manufactured by Sigma-Aldrich, molecular weight 128.1

(F-1) Epoxy acrylic resin 1: manufactured by Shin-Nakamura Chemical [EA-1010N]

Bisphenol A type epoxy containing acryloyl group, epoxy equivalent weight 500g/eq

(F-2) Epoxy acrylic resin 2: manufactured by Shin-Nakamura Chemical [EA-S3010]

Bisphenol F-type epoxy containing acryloyl group, epoxy equivalent weight 420g/eq

(G-1) Electrically conductive silver particles 1: manufactured by Metalor Technologies [SA-0201]

Tap density: 4.7 g/cc, specific surface area: 0.83 m ² /g, average particle size (d ₅₀ ): 2.6 ㎛

(G-2) Electrically conductive silver particles 2: manufactured by Metalor Technologies [EA-0101]

Tap density: 5.2 g/cc, specific surface area: 0.28 m ² /g, average particle size (d ₅₀ ): 6.8 ㎛

(G-3) Electrically conductive silver particles 3: manufactured by Metalor Technologies [AB-0022]

Tap density: 2.2 g/cc, specific surface area: 0.63 m ² /g, average particle size (d ₅₀ ): 13.4 ㎛

[Formula 1]

(A-1)

(A-2)

(A-3)

(A-4)

(A-5)

(B)

(D-1)

(D-2)

(E)

(F-1)

(F-2)

Examples 1-7 and Comparative Examples 1-3 Resin compositions were prepared according to the contents in Tables 1 and 2, respectively.

Specifically, after placing (A) acrylic resin, (B) epoxy resin, (D) radical polymerization initiator, (E) stabilizer, and (F) epoxy acrylic resin in a 500g container equipped with a disperser and a thermometer, at room temperature, 1,000 ~ Dispersion was performed at 2,000 RPM for 1 hour. Afterwards, (G) silver (Ag) was added and dispersed for an additional 30 minutes at 500 to 1,000 RPM. At this time, the temperature was controlled using cooling water so that the temperature of the composition did not rise above 30°C, and finally, the latent hardener (C) was added and dispersed for an additional 20 minutes to prepare a resin composition.

Raw material name Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 (A) Ingredient
acrylic resin)
(weight%) MIRAMER M600 8.0 8.0 8.0 8.0 8.0 8.0 MIRAMER M410 8.0 MIRAMER M300 MIRAMER M200 MIRAMER M1140 (B) Ingredient
Epoxy resin (% by weight) KDS-8161 10.0 10.0 10.0 10.0 10.0 10.0 10.0 (C) Ingredient Latent hardener (% by weight) EH-4357S 6.5 6.5 6.5 6.5 6.5 6.5 6.5 (D) Ingredient
radical polymerization initiator
(weight%) Lucirin TPO 0.2 0.2 0.2 0.2 0.2 0.2 0.2 Irgacure 819 0.2 0.2 0.2 0.2 0.2 0.2 0.2 (E)Ingredients
stabilizator
(weight%) barbituric acid 0.1 0.1 0.1 0.1 0.1 0.1 0.1 (F) Ingredient Epoxy acrylic resin
(weight%) EA-1010N 5.0 5.0 5.0 5.0 5.0 5.0 EA-S3010 5.0 (G) Component is particle
(weight%) SA-0201 70.0 35.0 EA-0101 70.0 70.0 70.0 35.0 35.0 AB-0022 70.0 35.0

Raw material name Comparative Example 1 Comparative Example 2 Comparative Example 3 (A) Ingredient
acrylic resin)
(weight%) MIRAMER M600 MIRAMER M410 MIRAMER M300 8.0 MIRAMER M200 8.0 MIRAMER M1140 8.0 (B) Ingredient
Epoxy resin (% by weight) KDS-8161 10.0 10.0 10.0 (C) Ingredient Latent hardener (% by weight) EH-4357S 6.5 6.5 6.5 (D) Ingredient
radical polymerization initiator
(weight%) Lucirin TPO 0.2 0.2 0.2 Irgacure 819 0.2 0.2 0.2 (E)Ingredients
stabilizator
(weight%) barbituric acid 0.1 0.1 0.1 (F) Ingredient Epoxy acrylic resin
(weight%) EA-1010N 5.0 5.0 5.0 (G) Component is particle
(weight%) EA-0101 70.0 70.0 70.0

2. Volume resistivity measurement

The test piece was obtained by curing a slide glass with a length of 7cm, width of 1cm, and thickness of 50㎛ for 3J with a 365nm LED curing machine, and then cured in an oven at 80°C for 60 minutes.

After the temperature of the obtained test piece was lowered to 25°C, the resistance value (Ω) was measured using a KEITHLEY digital multimeter with a distance between electrodes of 50 mm. The ^volume resistivity (

3. Appearance

Appearance was assessed by visual inspection of the specimen using the naked eye, and if particulate matter could not be identified, the sample was considered homogeneous.

3. Viscosity and thixotropic value

Viscosity was measured using Brookfield's Viscometer HBDV-II at 25°C, and a shear rate of 5 RPM was applied.

The thixotropic value was obtained by dividing the viscosity by 10 times the value of 0.5 RPM / 5 RPM.

Example One 2 3 4 5 6 7 Appearance (365nm@LED 3J + Oven 80℃/60 minutes)
uniformity
uniformity
uniformity
uniformity
uniformity
uniformity
uniformity Viscosity (Cps) 35,000 32,000 33,000 150,000 27,000 80,000 29,000 thixotropic value 2.5 2.5 2.8 3.0 3.0 2.9 3.0 Volume resistivity (x10 ^-3 Ω m) 3.5 5.0 4.0 2.5 40 3.0 25

Comparative example One 2 3 Appearance (365nm@LED 3J + Oven 80℃/60 minutes)
uneven uneven
(After UV curing, non-curing occurs) uneven
(After UV curing, non-curing occurs) Viscosity (Cps) 28,000 19,000 16,000 thixotropic value 2.6 2.8 2.9 Volume resistivity (x10 ^-3 Ω m) 150 330 1000

According to Tables 3 and 4, when pre-cured with UV, there was a significant difference in conductivity depending on whether or not it was cured. Examples 1 to 7 were pre-cured with UV. In this case, the conductivity and appearance were good, but when pre-curing was not done with UV as in Comparative Examples 1 to 3, the conductivity and appearance were not good.

Example 1 contains a 6-functional acrylate monomer, and Example 2 contains a 4-functional acrylate monomer. In addition, Examples 3 to 7 all contain a hexafunctional acrylate monomer. However, Comparative Example 1 contains a trifunctional acrylate monomer, Comparative Example 2 contains a bifunctional acrylate monomer, and Comparative Example 3 contains a monofunctional acrylate monomer.

When the number of acrylate monomer functional groups was 4 or more, surface hardening was sufficiently achieved when cured with UV. However, when the number of acrylate monomer functional groups was 3 or less, surface hardening was not sufficiently achieved when cured with UV.

Although it has not been clearly explained, it is assumed that the presence or absence of UV curing varies depending on the number of functional groups of the acrylate monomer contained in the adhesive, and that it affects the degree of curing when post-curing with heat, thereby reducing conductivity.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and various substitutions, modifications, and changes are possible without departing from the technical spirit of the present invention, as is commonly known in the technical field to which the present invention pertains. It will be clear to those who have the knowledge of.

Claims (9)

(A) 3 to 15% by weight of acrylic resin; (B) 5 to 15% by weight of epoxy resin, (C) 3.5 to 9.5% by weight of latent hardener, (D) 0.1 to 0.7% by weight of radical polymerization initiator, (E) 0.05 to 0.2% by weight of stabilizer, (F) epoxy acrylic. Contains 1 to 10% by weight of resin and 60 to 80% by weight of (G) silver (Ag),
A dual-cure electrically conductive adhesive composition, wherein the acrylic resin is a polymerization of at least one of 4- to 6-functional acrylate monomers.
delete According to clause 1,
The (B) epoxy resin has an epoxy equivalent of 160 to 170 g/eq, a viscosity of 2,000 to 4,000 cps, and is a dual-cure electrically conductive adhesive composition, characterized in that it is a mixture of difunctional bisphenol type A and bisphenol type F.
According to clause 1,
The (C) latent curing agent is a solid at 20-25°C and is a dual-cure electrically conductive adhesive composition, characterized in that it is a modified aliphatic polyamine compound.
According to clause 1,
The (D) radical polymerization initiator is an initiator that undergoes a photoreaction in the 200-420nm ultraviolet range, and is a dual-cure electrically conductive adhesive composition, characterized in that it is a phosphine oxide-based compound.
According to clause 1,
The (E) stabilizer is a substance that can improve storage stability at room temperature,
A dual-cure electrically conductive adhesive composition comprising at least one of barybturic acid, boric acid ester compound, and aluminum chelate.
According to clause 1,
The (F) epoxy acrylic resin has an epoxy equivalent weight of 500 g/eq, a viscosity of 250,000 to 350,000 cps, and is a dual-cure electrically conductive material comprising an epoxy acrylic resin consisting of one epoxy group and one acrylate group. Adhesive composition.
According to clause 1,
The silver (Ag)(G) is an electrically conductive particle and includes silver (Ag) particles with an average particle size of 2㎛~15㎛, a specific surface area of ^0.2 ~1.0m2/g, and a tap density of 2~6g/ ^cm2 . A dual-cure electrically conductive adhesive composition characterized in that.
A dual-cure electrically conductive adhesive comprising the adhesive composition according to any one of claims 1 or 3 to 8.