KR102651042B1 - Cable device - Google Patents

Abstract

Disclosed is a cable device that includes an optical cable capable of transmitting power and a connector connected to the optical cable, and has improved electromagnetic wave shielding performance at the connector. The cable device includes a cable and a connector connected to the cable, wherein the connector includes a printed circuit board including a ground electrode, is provided to accommodate the printed circuit board therein, and faces a mounting surface of the printed circuit board. A shield case including a first surface and a second surface perpendicular to the first surface, disposed between the printed circuit board and the shield case, and the ground electrode and the shield case to ground the shield case. It may include an elastic member provided to contact the second surface of the.

Description

Cable device {CABLE DEVICE}

The present invention relates to a cable device including an optical cable capable of transmitting high-voltage power and a connector connected to the optical cable, and more specifically, to a cable device including a connector with improved electromagnetic interference (EMI) shielding performance. It's about.

Electromagnetic interference (EMI) is a disorder in which electromagnetic signals are affected by electromagnetic interference, and the problem caused by this is becoming more serious due to the recent rapid increase in electromagnetic wave use technology. Accordingly, recent electronic products are required to have an electromagnetic wave shielding structure.

Cables may include conductors such as copper wire for high voltage power transmission. The cable may have an electromagnetic wave shielding structure that surrounds the conductor to shield electromagnetic waves generated from the conductor.

Cables containing electromagnetic shielding structures may be black or have a highly visible primary color. Cables with this appearance are easily visible to the naked eye, so when connected to an electronic device, the cable is exposed to the outside of the electronic device and may impair the overall appearance of the electronic device.

Cables that do not contain an electromagnetic wave shielding structure are difficult to check with the naked eye and are therefore called invisible cables. Recently, there is a trend to use invisible cables to prevent design deterioration of electronic devices due to cables.

However, if an invisible cable is used, electromagnetic wave shielding may not be achieved at the connector connected to the transparent cable.

One aspect of the present invention provides a cable device including an invisible cable that does not include an electromagnetic shielding structure, and a connector connected to the transparent cable and having improved electromagnetic interference (EMI) shielding performance.

Another aspect of the present invention provides a cable device including an elastic member that electrically connects the ground electrode of the printed circuit board and the shield case without interfering with die bonding of the optical element to the printed circuit board. do.

According to the idea of the present invention, a cable device includes a cable and a connector connected to the cable, the connector is provided to accommodate a printed circuit board including a ground electrode, and the printed circuit board therein, and the printed circuit board is provided to accommodate the printed circuit board. A shield case including a first surface facing the mounting surface of the circuit board and a second surface perpendicular to the first surface, and disposed between the printed circuit board and the shield case to ground the shield case. It may include an elastic member provided to contact the ground electrode and the second surface of the shield case.

The cable may include a conductor provided to transmit power and an optical fiber provided to transmit an optical signal.

The elastic member and the shield case may include a conductive material so that they can be electrically connected through contact.

The cable may accommodate the conductor and the optical fiber therein and may further include a coating through which light is transmitted.

The elastic member may be compressively deformed when accommodated in the shield case.

At least a portion of the elastic member may be provided to protrude outside the mounting surface of the printed circuit board.

The elastic member may be surface mounted (SMT) on the printed circuit board to be electrically connected to the ground electrode.

The elastic member includes a mounting part that is surface mounted (SMT) on the printed circuit board, a bending part formed by bending from the mounting part, and an extension part extending from the bending part, and the bending part is a part of the printed circuit board. It may be provided to protrude outward from the mounting surface.

A length of the elastic member in a direction parallel to the mounting surface of the printed circuit board may be greater than a length of the elastic member in a direction perpendicular to the mounting surface of the printed circuit board.

The elastic member includes an elastic portion that is elastically deformable by an external force, is provided to cover an outer surface of the elastic portion, has a conductive outer surface portion, and at least a portion of the outer surface portion, has adhesive force, and is in contact with the ground electrode. It may include an adhesive part provided to do so.

The connector may include an optical element mounted on the printed circuit board, and a driving IC mounted on the printed circuit board and provided to control the optical element.

The optical element and the driving IC may be mounted on the printed circuit board by die bonding.

When the length of the elastic member in the direction perpendicular to the mounting surface of the printed circuit board is referred to as the height of the elastic member, the height of the elastic member is determined when the optical element is die bonded to the printed circuit board ( It can be set to 1mm or less so as not to interfere with die bonding.

The connector is provided to accommodate the shield case inside, and includes an external case containing an insulating material, connected to the printed circuit board, and a plug provided to connect the connector to a connection portion of an external device. .

According to the idea of the present invention, the cable device includes a cable including a conductor provided to transmit power and a connector connected to the cable, wherein the connector includes a printed circuit board including a ground electrode, and the printed circuit. A shield case provided to cover the entire surface of the substrate and an elastic member mounted on the printed circuit board, wherein the elastic member is in contact with the ground electrode and the shield case, respectively, to ground the shield case. It can be included.

The cable further includes an optical fiber provided to transmit an optical signal, and a sheath that accommodates the conductor and the optical fiber therein to protect the conductor and the optical fiber, and the sheath may be transparent.

The shield case may include a first surface facing the mounting surface of the printed circuit board and a second surface perpendicular to the second surface, and the elastic member may be provided to contact the second surface.

At least a portion of the elastic member may be provided to protrude outside the mounting surface of the printed circuit board.

According to the idea of the present invention, a cable device includes a conductor, a cable including a transparent sheath that covers the conductor, and a connector connected to the cable, wherein the connector includes a ground electrode. An elastic member provided to electrically connect a circuit board, a shield case that accommodates the printed circuit board therein and has conductivity, and the ground electrode and the shield case, wherein the printed circuit board is accommodated inside the shield case. When doing so, it may include an elastic member that is compressively deformed between the printed circuit board and the shield case.

The shield case may include a first surface facing the mounting surface of the printed circuit board, and the elastic member may be provided to contact the ground electrode and the first surface.

According to the idea of the present invention, there is a cable device including a transparent cable that does not include an electromagnetic shielding structure and a connector connected to the transparent cable, and the electromagnetic interference (EMI) shielding performance of the connector is improved. Cable devices can be provided.

According to the spirit of the present invention, it is possible to provide a cable device including an elastic member that electrically connects the ground electrode of the printed circuit board and the shield case without interfering with die bonding of the optical element to the printed circuit board. You can.

1 is a perspective view of a cable device according to an embodiment of the present invention.
Figure 2 is a cross-sectional view of a cable in a cable device according to an embodiment of the present invention.
Figure 3 is an exploded perspective view of a cable device according to an embodiment of the present invention.
Figure 4 is a diagram separately illustrating some components including a printed circuit board and an elastic member mounted on the printed circuit board in a cable device according to an embodiment of the present invention.
Figure 5 is a side view of a printed circuit board and an optical element and driving IC mounted on the printed circuit board in a cable device according to an embodiment of the present invention.
Figure 6 is a diagram illustrating the process of inserting a printed circuit board into a shield case in a cable device according to an embodiment of the present invention.
Figure 7 is a diagram separately illustrating some components including a printed circuit board and an elastic member mounted on the printed circuit board in a cable device according to another embodiment of the present invention.
Figure 8 is a diagram illustrating a process of inserting a printed circuit board into a shield case in a cable device according to another embodiment of the present invention.
Figure 9 is a diagram separately illustrating some components including a printed circuit board and an elastic member mounted on the printed circuit board in a cable device according to another embodiment of the present invention.
Figure 10 is a diagram illustrating the process of inserting a printed circuit board into a shield case in a cable device according to another embodiment of the present invention.

The embodiments described in this specification and the configurations shown in the drawings are only preferred examples of the disclosed invention, and at the time of filing this application, there may be various modifications that can replace the embodiments and drawings in this specification.

Additionally, the terms used herein are used to describe embodiments and are not intended to limit and/or limit the disclosed invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, terms such as “comprise” or “have” are intended to indicate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are not intended to indicate the presence of one or more other features. The existence or addition of numbers, steps, operations, components, parts, or combinations thereof is not excluded in advance.

In addition, terms including ordinal numbers such as “first”, “second”, etc. used in this specification may be used to describe various components, but the components are not limited by the terms, and the terms It is used only for the purpose of distinguishing one component from another. For example, a first component may be named a second component, and similarly, the second component may also be named a first component without departing from the scope of the present invention.

Here, an electronic device used while connected to a cable device according to various embodiments of the present invention will be described. First, examples of application of the electronic device according to an embodiment of the present invention include all mobile communication terminals that operate based on communication protocols corresponding to various communication systems, video phones, and e-book readers. (e-book reader), laptop PC (laptop personal computer), netbook computer, PDA (personal digital assistant), PMP (portable multimedia player), MP3 (MPEG-1 audio layer-3) player, mobile medical care A device, camera, or wearable device (e.g., a head-mounted-device (HMD) such as electronic glasses, an electronic garment, an electronic bracelet, an electronic necklace, an electronic accessory, an electronic tattoo, or It may include all information and communication devices such as smart watches, multimedia devices, and application devices thereof.

According to some embodiments, the electronic device may be a smart home appliance. Smart home appliances include, for example, televisions, DVD (digital video disk) players, stereos, refrigerators, air conditioners, vacuum cleaners, ovens, microwave ovens, washing machines, air purifiers, set-top boxes, TV boxes (e.g. For example, it may include at least one of Samsung HomeSyncTM, Apple TVTM, or Google TVTM), game consoles, electronic dictionaries, electronic keys, camcorders, or electronic photo frames.

According to some embodiments, the electronic device may be various medical devices (e.g., magnetic resonance angiography (MRA), magnetic resonance imaging (MRI), computed tomography (CT), imaging device, ultrasound machine, etc.), navigation device, GPS receiver, etc. (global positioning system receiver), EDR (event data recorder), FDR (flight data recorder), automotive infotainment devices, marine electronic equipment (e.g. marine navigation system and gyro compass, etc.), avionics, It may include at least one of a security device, a vehicle head unit, an industrial or household robot, a financial institution's automatic teller's machine (ATM), or a store's point of sales (POS).

According to some embodiments, the electronic device may be a piece of furniture or building/structure containing a communication function, an electronic board, an electronic signature receiving device, a projector, or any other device. It may include at least one of measuring devices (e.g. water, electricity, gas, or radio wave measuring devices, etc.).

Electronic devices according to various embodiments of the present invention may be one or a combination of more than one of the various devices described above. Additionally, electronic devices according to various embodiments of the present invention may be flexible devices. Additionally, it will be apparent to those skilled in the art that electronic devices according to various embodiments of the present invention are not limited to the above-described devices.

Hereinafter, the elastic member may include a first to a third elastic member.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the attached drawings.

1 is a perspective view of a cable device according to an embodiment of the present invention. Figure 2 is a cross-sectional view of a cable in a cable device according to an embodiment of the present invention. Figure 3 is an exploded perspective view of a cable device according to an embodiment of the present invention.

Referring to FIG. 1, a cable device 1 according to an embodiment of the present invention may include a cable 10 and a connector 100 connected to the cable 10. The connector 100 may include a first connector 100a connected to a first external device (not shown) and a second connector 100b connected to a second external device (not shown). The cable 10 may be provided to interconnect the first connector 100a and the second connector 100b. The first connector 100a and the second connector 100b may be provided with the same configuration. The first connector 100a and the second connector 100b are provided with the same configuration, and the connector 100 will be described below.

The connector 100 includes a plug 101 provided to be coupled to a plug receiving portion (not shown) of an external device (not shown), and a cover for the plug 101 to prevent dust, etc. from entering the plug 101. It may include a plug cap 102 provided to do so. When coupling the plug 101 to the plug receiving portion, the plug cap 102 may be detachably coupled to the plug 101 so that the plug cap 102 can be separated from the plug 101 . When the cable device 1 is not in use, the user can prevent foreign substances such as dust from entering the plug 101 by attaching the plug cap 102 to the plug 101.

The connector 100 may include external cases 131 and 132 provided to accommodate at least a portion of the plug 101. The outer cases 131 and 132 may function as gripping portions. The user may hold the external cases 131 and 132 with his or her fingers and couple the plug 101 to the plug receiving portion (not shown) of the external device. When the user holds the external cases 131 and 132, there is a risk of electric shock if current flows through the external cases 131 and 132. To prevent this, the external cases 131 and 132 may be made of an insulating material.

Referring to FIG. 2, the internal structure of the cable in the cable device according to an embodiment of the present invention will be described in detail.

Referring to FIG. 2, the cable 10 may include a conductor 11, an optical fiber 12, and a sheath 13 that accommodates the conductor 11 and the optical fiber 12 therein. The conductor 11 may be configured to transmit power from a first external device (not shown) to a second external device (not shown) or from a second external device to a first external device. The optical fiber 12 may be configured to transmit an optical signal from a first external device to a second external device or to transmit an optical signal from a second external device to a first external device.

According to the spirit of the present invention, the cable 10 includes a conductor 11 provided to transmit power, thereby transmitting power from a first external device to a second external device or from a second external device to a first external device. Power can be transmitted.

The conductor 11 may include a copper wire. The conductor 11 and the optical fiber 12 may each be provided in plural numbers.

The covering 13 may be provided to accommodate the conductor 11 and the optical fiber 12 therein. The covering 13 may be made of an insulating material. Additionally, the covering 13 may be provided so that it is not easily visible to the user. For example, the covering 13 may be provided to transmit light. Here, the coating 13 through which light is transmitted can be said to be transparent. The transparent coating 13 is less visible to the user, so it does not spoil the appearance of the electronic device and can improve aesthetics.

Alternatively, the covering 13 may be provided to reflect external light so as not to be easily visible to the user. The coating 13 is colorless and may be made of a material having a predetermined reflectance. Here, the meaning of 'colorless' can include both transparent and opaque things. The coating 13 is formed to have a predetermined reflectivity and can reflect light incident on the coating 13. Accordingly, the conductor 11 and the optical fiber 12 disposed inside the covering 13 may not be clearly recognized with the naked eye from the outside.

According to one embodiment of the present invention, the cable 10 is disposed inside the sheath 13 and does not include a filler provided to fill the space between the sheath 13 and the conductor 11 and the optical fiber 12. You can. Generally, the filler is provided to prevent the cable from being bent beyond a predetermined angle and to prevent the optical fiber from being cut due to bending. Fillers may be provided to reinforce the relatively weak bending strength of optical fibers. According to one embodiment of the present invention, the cable 10 includes a conductor 11 inside the sheath 13, and the conductor 11 has relatively strong bending strength. The bending strength of the cable 10 can be increased due to the conductor 11 disposed inside the sheath 13. By increasing the bending strength of the cable 10, it is possible to prevent the optical fiber 12 from being cut due to bending of the cable 10 even if a separate filler is not provided inside the sheath 13.

Additionally, according to the spirit of the present invention, the cable 10 may not include an electromagnetic wave shielding structure. In general, a cable including a conductor may include an electromagnetic wave shielding structure to shield electromagnetic waves transmitted from an external device to the outside of the cable through the conductor. For example, the electromagnetic wave shielding structure may include aluminum foil and/or braid wire provided to surround the conductor. However, cables containing an electromagnetic wave shielding structure have a color such as black that is easily visible to the user. Likewise, cables that are visible to the user may spoil the appearance of the electronic device. In order to improve the aesthetics of the electronic device without damaging its appearance, the cable 10 according to the spirit of the present invention may not include an electromagnetic wave shielding structure. However, if the cable does not include an electromagnetic wave shielding structure, EMI shielding is not achieved at the connector connected to the cable, so a method for shielding this is needed. According to the spirit of the present invention, in a cable device that does not include an electromagnetic wave shielding structure and includes an optical cable capable of transmitting power, EMI shielding performance at a connector connected to the optical cable can be improved.

Referring to FIG. 3, the cable device 1 according to an embodiment of the present invention may include a cable 10 and a connector 100 connected to the cable 10. The connector 100 includes a printed circuit board 110, a plug 101 that is coupled to the printed circuit board 110 to connect an external device (not shown) and the connector 100, and an internal printed circuit board 110. It may include shield cases 121 and 122 provided to accommodate the shield cases 121 and 122, and external cases 131 and 132 provided to cover the shield cases 121 and 122. The connector 100 may further include a plug cap 102 provided to protect the plug 101.

The printed circuit board 110 may include a lens 107 that transmits an optical signal from the optical fiber 12 to the printed circuit board 110 . An optical element 104 (see Figure 5) and a driving IC 103 (see Figure 5) provided to control the optical element 104 may be provided inside the lens 107. The optical element may include a Vertical Cavity Surface Emitting Laser (VCSEL) chip and a Photodiode (PD) chip.

The shield cases 121 and 122 may be provided to cover the entire front surface of the printed circuit board 110. The shield cases 121 and 122 may be provided to accommodate the printed circuit board 110 therein. The shield cases 121 and 122 may include a conductive material. For example, the shield cases 121 and 122 may include a metal material.

The external cases 131 and 132 may include an insulating material. The external cases 131 and 132 may be provided to contact the shield cases 121 and 122. Since the outer cases 131 and 132 have insulation properties, the shield cases 121 and 122 have conductivity, and even if current flows through the shield cases 121 and 122, current may not flow into the outer cases 131 and 132. Accordingly, even if the user holds the external cases 131 and 132, he or she may not receive an electric shock due to the current transmitted from an external device (not shown) to the connector 100 through the cable 10.

Figure 4 is a diagram separately illustrating some components including a printed circuit board and an elastic member mounted on the printed circuit board in a cable device according to an embodiment of the present invention. Figure 5 is a side view of a printed circuit board and an optical element and driving IC mounted on the printed circuit board in a cable device according to an embodiment of the present invention.

Referring to FIGS. 4 and 5 , the printed circuit board 110 of the present invention and the components mounted on the printed circuit board 110 will be described in detail. Meanwhile, FIG. 4 is a diagram that does not show the optical element 104 mounted on the printed circuit board 110 and the driving IC 103 provided to control it.

Referring to FIG. 4, the printed circuit board 110 according to an embodiment of the present invention may include a power electrode 111 connected to the conductor 11 of the cable 10.

The conductors 11 may be provided in plural numbers. For example, the conductor 11 may include a first conductor 11a, a second conductor 11b, a third conductor 11c, and a fourth conductor 11d.

A plurality of power electrodes 111 may be provided. For example, the power electrode 111 may include a first power electrode 111a, a second power electrode 111b, and a third power electrode 111c.

The first to third conductors 11a, 11b, and 11c may be disposed to contact the first to third power electrodes 111a, 111b, and 111c, respectively. The conductor 11 may be arranged to transmit power. The conductor 11 can transmit power to the printed circuit board 110 through the power electrode 111. As the number of conductors 11 and power electrodes 111 increases, the conductors 11 can transmit greater power to the printed circuit board 110.

The fourth conductor 11d may be disposed to contact the first ground electrode 112. The first ground electrode 112 may have a digital ground (DGND) potential. The first ground electrode 112 may operate as a return path of the positive pole.

The printed circuit board 110 may further include a second ground electrode 113. The second ground electrode 113 may have a digital ground (DGND) potential like the first ground electrode 112 and may operate as a return path of the positive pole. The second ground electrode 113 may be disposed adjacent to the edge of the printed circuit board 110.

As described above, the printed circuit board 110 may include a plug 101. In the drawing, the plug 101 is shown simplified.

According to one embodiment of the present invention, the connector may include a first elastic member 200a mounted on the printed circuit board 110. The first elastic member 200a may be arranged to contact the second ground electrode 113. The first elastic member 200a may be surface mounted (SMT: Surface Mounting Technology) on the printed circuit board 110. The first elastic member 200a may have conductivity. Accordingly, the first elastic member 200a may contact the second ground electrode 113 and be electrically connected to the second ground electrode 113.

The first elastic member 200a may include an SMD gasket. The first elastic member 200a may include an elastic body that is elastically deformable and a conductive outer surface that is provided to cover the outer surface of the elastic body. Accordingly, the first elastic member 200a can be elastically deformed and have conductivity. Additionally, as shown in FIG. 4 , the first elastic member 200a may be arranged so that at least a portion of the first elastic member 200a protrudes outside the mounting surface of the printed circuit board 110 . Additionally, a plurality of first elastic members 200a may be provided. This is to increase the contact area between the first elastic member 200a and the second ground electrode 113.

According to the spirit of the present invention, the first elastic member 200a may be provided with a height of 1 mm or less. This is to prevent the first elastic member 200a from interfering with mounting the optical element 104 and the driving IC 103 on the printed circuit board 110 by die bonding.

Referring to FIG. 5, the optical element 104 and the driving IC 103 provided to control the optical element 104 may be mounted on the printed circuit board 110 by die bonding. Additionally, the driver IC 103 and the optical element 104 may be electrically connected by wire bonding. Additionally, the driving IC 103 and the electrode on the printed circuit board 110 may be electrically connected by wire bonding. Die bonding and wire bonding can be collectively referred to as chip on board.

As described above, the cable 10 may include an optical fiber 12, and the connector 100 is an optical element provided to transmit an optical signal to the optical fiber 12 or to receive an optical signal from the optical fiber 12. 104) may be included. The optical element 104 and the driving IC 103 provided to control the optical element 104 may be mounted on the printed circuit board 110. Since the optical element 104 and the driving IC 103 are vulnerable to heat, it is difficult to mount them on the printed circuit board 110 by surface mounting (SMT). In addition, since the optical element 104 and the driving IC 103 are vulnerable to heat, after the optical element 104 and the driving IC 103 are mounted on the printed circuit board 110, surface mounting (SMT) is performed around the optical element 104 and the driving IC 103. When components are mounted using the optical element 104 and the driving IC 103, the optical element 104 and the driving IC 103 may not function normally due to heat. Therefore, in order to mount certain components on the printed circuit board 110 using surface mounting (SMT), the optical element 104 and the driving IC 103 must be mounted before mounting them on the printed circuit board 110. For example, the first elastic member 200a must be mounted using surface mounting (SMT) before mounting the optical element 104 and the driving IC 103 on the printed circuit board 110.

However, if the first elastic member 200a is mounted on the printed circuit board 110 before the optical element 104 and the driving IC 103, die bonding and/or wire bonding are performed. It may interfere with the operation of mechanical equipment (hereinafter referred to as die bonding equipment). Specifically, the die bonding facility has a predetermined maximum separation distance from the printed circuit board 110. m1 shown in Figure 5 may indicate the maximum separation distance of the die bonding equipment. For example, m1 may be 1 mm.

If there are components higher than the maximum separation distance (m1) of the die bonding facility around the optical element 104 and the driving IC 103 to be die bonded, the die bonding facility may get caught in the components. Accordingly, the die bonding equipment cannot perform die bonding normally. Therefore, the height of the components mounted on the printed circuit board 110 must be less than or equal to the maximum separation distance (m1) of the die bonding facility. For example, the height of the first elastic member 200a may be less than or equal to 1 mm. The height of the first elastic member 200a may refer to the length of the first elastic member 200a in a direction perpendicular to the mounting surface of the printed circuit board 110.

Figure 6 is a diagram illustrating the process of inserting a printed circuit board into a shield case in a cable device according to an embodiment of the present invention.

Hereinafter, the process of inserting the first elastic member 200a into the shield cases 121 and 122 according to an embodiment of the present invention will be described in detail.

Referring to FIG. 6, the height h1 of the first elastic member 200a may be smaller than the width d1 of the first elastic member 200a. The height (h1) of the first elastic member (200a) may indicate the length of the first elastic member (200a) in the y-axis direction, and the width (d1) of the first elastic member (200a) may refer to the first elastic member (200a). 200a) can indicate the length in the x-axis direction. The y-axis shown in the drawing may point to a direction perpendicular to the mounting surface of the printed circuit board. The x-axis shown in the drawing may point in a direction parallel to the mounting surface of the printed circuit board.

The shield cases 121 and 122 may include an upper shield case 121 and a lower shield case 122. Hereinafter, the first elastic member 200a will be described as an example of contacting the lower shield case 122, but the present invention is not limited thereto. The first elastic member 200a may be provided to contact the upper shield case 121.

The first elastic member 200a may be provided to enable elastic deformation. Additionally, the first elastic member 200a may have an outer surface made of a conductive material. Accordingly, the first elastic member 200a may have conductivity.

At least a portion of the first elastic member 200a may protrude outside the mounting surface of the printed circuit board 110. In other words, at least a portion of the first elastic member 200a may be provided to protrude to the side of the printed circuit board 110. The side of the printed circuit board 110 may point in the x-axis direction.

When the printed circuit board 110 is inserted into the lower shield case 122, the width of the first elastic member 200a may be reduced. Specifically, the width of the first elastic member 200a may be reduced from d1 to d2 due to compression deformation of the first elastic member 200a. As described above, the first elastic member 200a is provided to be elastically deformable, so even if the first elastic member 200a is elastically deformed, the first elastic member 200a may not be damaged. Additionally, when the printed circuit board 110 is inserted into the lower shield case 122, the first elastic member 200a and the lower shield case 122 can be in stable contact even if an assembly tolerance occurs.

The first elastic member 200a may be provided to contact the side of the lower shield case 122. The lower surface 122a of the lower shield case 122 may indicate a surface facing the mounting surface of the printed circuit board 110. The side surface 122b of the lower shield case 122 may indicate a surface perpendicular to the mounting surface of the printed circuit board 110.

When the first elastic member 200a is provided to contact the upper surface of the upper shield case, the height (h1) of the first elastic member (200a) may be greater than the maximum separation distance (m1) of the die bonding facility. Therefore, in order to make the height (h1) of the first elastic member (200a) equal to or smaller than the maximum separation distance (m1) of the die bonding equipment, the first elastic member (200a) contacts the side (122b) of the lower shield case. It can be arranged to do so. This can be called a side grounding structure.

The first elastic member 200a is surface mounted (SMT) on the printed circuit board 110 to contact the ground electrode 113, and when accommodated inside the lower shield case, to contact the side 122b of the lower shield case. It can be provided. Since the first elastic member 200a is conductive and the lower shield case 122 is also conductive, the first elastic member 200a and the lower shield case 122 contact each other. The shield case 122 and the ground electrode 113 may be electrically connected. Accordingly, the lower shield case 122 and the upper shield case 121 coupled to the lower shield case may be electrically connected to the ground electrode 113. The shield cases 121 and 122 may have the same potential as the ground electrode 113.

According to the spirit of the present invention, if the shield cases 121 and 122 provided to cover the entire surface of the printed circuit board 110 have a GND potential, EMI shielding performance can be improved. To this end, the elastic member according to the spirit of the present invention can electrically connect the ground electrode and the shield case. The elastic member may be provided to contact each of the ground electrode and the shield case. Through this structure, the cable device 1 according to the spirit of the present invention includes an invisible optical cable that does not have an electromagnetic wave shielding structure, and the EMI shielding performance in the connector 100 can be improved.

Figure 7 is a diagram separately illustrating some components including a printed circuit board and an elastic member mounted on the printed circuit board in a cable device according to another embodiment of the present invention. Figure 8 is a diagram illustrating a process of inserting a printed circuit board into a shield case in a cable device according to another embodiment of the present invention.

Below, other embodiments of the present invention will be described in detail.

According to another embodiment of the present invention, a second elastic member 200b may be mounted on the printed circuit board 110. Other components except for the second elastic member 200b are the same as the above-described embodiment, so duplicate descriptions thereof will be omitted.

The second elastic member 200b may have elasticity. The second elastic member 200b may have conductivity. For example, the second elastic member 200b may be made of a metal material. Specifically, the second elastic member 200b may be formed by bending a metal plate.

Referring to FIG. 8, the second elastic member 200b may include a mounting portion 201b, a bending portion 202b, and an extension portion 203b. The mounting part 201b may be provided to contact the ground electrode 113 of the printed circuit board 110. The mounting portion 201b may be surface mounted (SMT) on the printed circuit board 110. The bending portion 202b may be formed by bending one end of the mounting portion 201b. The extension portion 203b may extend from the bending portion 202b. The cross section of the second elastic member 200b may be approximately C-shaped.

The second elastic member 200b may have a height (h2) and a width (d3). The height (h2) of the second elastic member 200b may be equal to or smaller than the maximum separation distance (m1) of the die bonding equipment. At least a portion of the second elastic member 200b may protrude to the side of the printed circuit board 110.

When the printed circuit board 110 is inserted into the lower shield case 122, the width of the second elastic member 200b may be reduced. Specifically, the width of the second elastic member 200b may be reduced from d3 to d4 due to elastic deformation of the second elastic member 200b. As described above, the second elastic member 200b is provided to be elastically deformable, so even if the second elastic member 200b is elastically deformed, the second elastic member 200b may not be damaged. Additionally, when the printed circuit board 110 is inserted into the lower shield case 122, the second elastic member 200b and the lower shield case 122 can be in stable contact even if an assembly tolerance occurs.

As described above, when the shield cases 121 and 122 have the GND potential, the EMI shielding performance of the connector 100 can be improved. To this end, the second elastic member 200b can electrically connect the ground electrode 113 and the side surface 122b of the lower shield case. The second elastic member 200b may be provided to contact each of the ground electrode 113 and the lower shield case 122. Through this structure, the cable device 1 includes an invisible optical cable that does not have an electromagnetic wave shielding structure, while EMI shielding performance in the connector 100 can be improved.

Figure 9 is a diagram separately illustrating some components including a printed circuit board and an elastic member mounted on the printed circuit board in a cable device according to another embodiment of the present invention. Figure 10 is a diagram illustrating the process of inserting a printed circuit board into a shield case in a cable device according to another embodiment of the present invention.

Hereinafter, a cable device according to another embodiment of the present invention will be described in detail with reference to FIGS. 9 and 10.

Referring to FIG. 9, a cable device according to another embodiment of the present invention may include a third elastic member 200c.

The third elastic member 200c may include an elastic portion that is elastically deformable by external force, an outer surface portion that is electrically conductive, and an adhesive portion that has adhesive force and is provided to cover the outer surface of the elastic portion. The outer surface portion forms the outer surface of the third elastic member 200c, and the elastic portion may be disposed inside the outer surface portion. The adhesive portion may be provided on a side facing the printed circuit board 110. The third elastic member 200c may be adhered to the printed circuit board 110 through the adhesive portion. The third elastic member 200c may include a sponge gasket.

According to another embodiment of the present invention, the third elastic member 200c may not be surface mounted (SMT) on the printed circuit board 110. The third elastic member 200c may be attached to the printed circuit board 110 by an adhesive having adhesive force. The third elastic member 200c may be in contact with the printed circuit board 110 so that its conductive outer surface is in contact with the first ground electrode 112.

Since the third elastic member 200c is not surface mounted (SMT) on the printed circuit board 110, no heat is generated when the third elastic member 200c is attached to the printed circuit board 110. Therefore, even if the third elastic member 200c is adhered to the printed circuit board 110 after the optical element 104 and the driving IC 103 are die bonded to the printed circuit board 110, the optical element 104 ) and the driving IC 103 do not undergo any deformation due to heat. The third elastic member 200c may be attached to the printed circuit board 110 after the optical element 104 and the driving IC 103 are mounted on the printed circuit board 110 by die bonding.

Since the third elastic member 200c is bonded to the printed circuit board 110 after die bonding is completed, the height (h3, see Figure 10) of the third elastic member 200c is greater than the maximum separation distance (m1) of the die bonding equipment. Even if it is large, it does not interfere with the operation of the die bonding equipment.

When the third elastic member 200c is not inserted into the shield cases 121 and 122, the height h3 of the third elastic member 200c may be greater than the maximum separation distance m1 of the die bonding facility.

Referring to FIG. 10, the height of the third elastic member 200c may be reduced as the printed circuit board 110 is inserted into the shield cases 121 and 122. Specifically, as the printed circuit board 110 is inserted into the shield cases 121 and 122, the height of the third elastic member 200c may be reduced from h3 to h4. At this time, h4 may be equal to the distance between the mounting surface of the printed circuit board 110 and the upper surface 121a of the upper shield case 121.

The third elastic member 200c may contact the first ground electrode 112 and the upper surface 121a of the upper shield case. Since the outer surface of the third elastic member 200c is conductive, the third elastic member 200c contacts the first ground electrode 112 and the upper shield case 121, so that the shield cases 121 and 122 have a ground potential. You can.

As described above, when the shield cases 121 and 122 have a ground potential, the EMI shielding performance of the connector 100 can be improved. To this end, the third elastic member 200c can electrically connect the first ground electrode 112 and the top surface 121a of the upper shield case. The third elastic member 200c may be provided to contact each of the first ground electrode 112 and the upper shield case 121. Through this structure, the cable device 1 includes an invisible optical cable that does not have an electromagnetic wave shielding structure, while EMI shielding performance in the connector 100 can be improved.

In the above, specific embodiments are shown and described. However, it is not limited to the above-described embodiments, and those skilled in the art can make various changes without departing from the gist of the technical idea of the invention as set forth in the claims below. .

1: cable device 10: cable
11: conductor 12: optical fiber
13: covering 100: connector
101: plug 102: plug cap
103: Optical element 104: Driving IC
110: printed circuit board 113: ground electrode
121: upper shield case 122: lower shield case
131: upper external case 132: lower external case
200a, 200b, 200c: elastic member

Claims (20)

cable; and
A connector connected to the cable; Including,
The connector is,
A printed circuit board including a ground electrode,
A shield case provided to accommodate the printed circuit board therein and including a first surface facing the mounting surface of the printed circuit board and a second surface perpendicular to the first surface;
An elastic member is disposed between the printed circuit board and the shield case and is provided to contact the ground electrode and the second surface of the shield case to ground the shield case,
A cable device in which the elastic member undergoes compression deformation when accommodated in a shield case. According to paragraph 1,
The cable is
A cable device including a conductor provided to transmit electric power and an optical fiber provided to transmit an optical signal. According to paragraph 1,
The cable device includes a conductive material so that the elastic member and the shield case can be electrically connected through contact. According to paragraph 2,
The cable is
A cable device that accommodates the conductor and the optical fiber therein and further includes a coating through which light is transmitted. delete According to paragraph 1,
A cable device wherein at least a portion of the elastic member is provided to protrude outside the mounting surface of the printed circuit board. According to clause 6,
A cable device in which the elastic member is surface mounted (SMT) on the printed circuit board to be electrically connected to the ground electrode. According to clause 6,
The elastic member is,
A mounting portion that is surface mounted (SMT) on the printed circuit board,
A bending portion formed by bending from the mounting portion and
It includes an extension part extending from the bending part,
A cable device wherein the bending portion is provided to protrude outside the mounting surface of the printed circuit board. According to clause 6,
A cable device wherein a length of the elastic member in a direction parallel to the mounting surface of the printed circuit board is greater than a length of the elastic member in a direction perpendicular to the mounting surface of the printed circuit board. According to paragraph 1,
The elastic member is,
An elastic portion provided to be elastically deformable by an external force,
An outer surface portion provided to cover the outer surface of the elastic portion and having conductivity, and
A cable device including, as at least a portion of the outer surface portion, an adhesive portion that has adhesive force and is provided to contact the ground electrode. According to paragraph 1,
The connector is,
An optical element mounted on the printed circuit board,
A cable device including a driver IC mounted on the printed circuit board and provided to control the optical element. According to clause 11,
A cable device in which the optical element and the driving IC are mounted on the printed circuit board by die bonding. According to clause 12,
When the length of the elastic member in a direction perpendicular to the mounting surface of the printed circuit board is referred to as the height of the elastic member,
A cable device in which the height of the elastic member is 1 mm or less so that the elastic member does not interfere with die bonding of the optical element to the printed circuit board. According to paragraph 1,
The connector is,
an outer case provided to accommodate the shield case inside, and including an insulating material;
A cable device connected to the printed circuit board and including a plug provided to connect the connector to a connection portion of an external device. A cable including a conductor provided to transmit power, an optical fiber provided to transmit an optical signal, and a sheath accommodating the conductor and the optical fiber therein to protect the conductor and the optical fiber; and
A connector connected to the cable; Including,
The connector is,
A printed circuit board including a ground electrode,
A shield case provided to cover the entire front of the printed circuit board, and
An elastic member mounted on the printed circuit board, wherein the elastic member is in contact with the ground electrode and the shield case, respectively, to ground the shield case. According to clause 15,
A cable device in which the sheath is provided transparently. According to clause 15,
The shield case includes a first surface facing the mounting surface of the printed circuit board and a second surface perpendicular to the first surface,
The elastic member is a cable device provided to contact the second surface. According to clause 17,
A cable device wherein at least a portion of the elastic member is provided to protrude outside the mounting surface of the printed circuit board. A cable including a conductor and a transparent sheath that covers the conductor; and
A connector connected to the cable; Including,
The connector is,
A printed circuit board including a ground electrode,
A shield case that accommodates the printed circuit board therein, has conductivity, and includes a first surface facing the mounting surface of the printed circuit board, and
An elastic member provided to electrically connect the ground electrode and the shield case, and includes an elastic member that is compressively deformed between the printed circuit board and the shield case when the printed circuit board is accommodated inside the shield case. do,
The elastic member is a cable device provided to contact the ground electrode and the first surface. delete

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