KR102637985B1 - Ram module fixing device for high impact - Google Patents

Abstract

The high-impact RAM module fixing device according to the present invention includes a motherboard having a socket portion into which at least one RAM module is inserted and fastened, and is provided on both left and right sides based on the longitudinal direction of the socket portion, and is coupled to the motherboard. A pair of first fixing parts and both ends are respectively coupled to the first fixing parts, and include a second fixing part supporting and fixing an upper end of the RAM module inserted into the socket part, and the main board and the first fixing part. The fixing part and the second fixing part are coupled to each other by fastening members.

Description

RAM module fixing device for high impact {RAM MODULE FIXING DEVICE FOR HIGH IMPACT}

The present invention relates to a high-impact RAM module fixing device. More specifically, the present invention relates to a high-impact RAM module fixing device, and more specifically, to strengthen the fixing force of the RAM module, which is one of the core components of electronic equipment computers, so that the RAM can be maintained even in environments requiring high impact such as war or combat. This relates to a high-impact RAM module fixing device that can prevent the module from momentarily falling off.

Computers, which were used in a small number of specialized areas, have continued to develop and have reached a stage where they are now widely used by the public. In particular, the rapid development of semiconductor devices has made large-capacity computers smaller and more widely used as personal computers.

In addition, these computers are an indispensable element that is used not only for personal use, but also for public use, especially in military units where various strategies and tactics have become possible due to the development of technology.

Thanks to the rapid development described above, the scope of work using computers today has become very extensive, and application software is being promoted in the direction of making the most of the computer's hardware. Such technological changes are related to the selection of hardware and application This brought about a change in the way software was used, requiring hardware selection to match the application software.

Additionally, the expansion of application software requires more and more RAM (Random Access Memory).

Therefore, a certain amount of RAM is generally required to use application software, and a larger amount of RAM has the effect of increasing the use of application software.

The above-mentioned RAM is generally used as a RAM module made by mounting several RAMs on a board and making connection terminals to configure the necessary storage device, and the RAM module is inserted into a DIMM (Dual DIMM) slot installed on the computer's motherboard. It is used by attaching it to the In-line Memory Module (In-line Memory Module) socket.

These sockets are equipped with locking devices using clamps at both ends to prevent the mounted RAM from falling out, and by flipping these clamps, the RAM module in the socket can be separated or fixed.

In other words, it is one of the key components that determine the performance of a computer, and the RAM module required for performance upgrades is generally designed to be replaceable rather than integrated with the computer. For convenience of replacement, there is a clamp that holds the left and right sides of the RAM module. A type of locking device is applied and used as a single standard.

However, this locking device cannot prevent the RAM module from falling out of the socket when a high level of impact of more than 30g or 10ms is applied to electronic equipment equipped with a RAM module, including computers, and such impact may cause damage to the RAM module. Instantaneous disconnection causes a defect that forces the computer to shut down, and this defect has become a fatal problem causing great damage, especially in war or combat situations where high impacts can occur frequently.

Therefore, a method to solve these problems is required.

Republic of Korea Patent Publication No. 10-1998-0027677

The present invention is an invention made to solve the problems of the prior art described above. By reinforcing the fixing force of the RAM module in the main board structure, reliability is achieved in high-impact environments such as military use or electronic equipment applied to housings with weak structural rigidity. The purpose is to prevent the computer from shutting down due to loss of computer RAM.

The problems of the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

The high-impact RAM module fixing device of the present invention for achieving the above object is provided with a main board having a socket portion into which at least one RAM module is inserted and fastened, and each on both left and right sides based on the longitudinal direction of the socket portion, , a pair of first fixing parts coupled to the main board and a second fixing part each of which has both ends coupled to the first fixing parts and supporting and fixing the upper end of the RAM module inserted into the socket part; The main board and the first and second fixing parts are coupled to each other by fastening members.

In addition, the first fixing part may further include a body and a socket coupling groove formed on one side of the body and into which the left or right end of the socket part is fitted.

In addition, the first fixing part is formed on the side of the body opposite to the surface where the socket coupling groove is formed, and further includes a RAM module coupling groove into which the left or right end of the RAM module coupled to the socket part is inserted and fixed. It can be included.

And the second fixing part is detachably coupled to the guide module and a guide module having a third coupling hole through which the fastening member is coupled so that both ends are coupled to the top of the first fixing part, and is connected to the guide module. and a support module that supports and fixes the upper end of the RAM module inserted into the socket, and the support module is provided inside the guide module and is slidably movable and is located between the guide module and the support module. The RAM module can be compressed and fixed.

At this time, the guide module may further include an insertion hole through which the support module is inserted inside, and at least one fourth coupling hole through which the fastening module is coupled so that the support module is coupled to the guide module.

In addition, the fourth coupling hole is formed in a slit shape, and the fastening module penetrating the fourth coupling hole is temporarily fastened to the support module and reciprocates along the direction of the slit shape of the fourth coupling hole. It is possible, and the RAM module located between the guide module and the support module is pressed by the moving support module and then main-fastened so that the guide module and the support module closely support the RAM module face to face. You can.

At this time, the guide module and the support module may further include a buffer member provided on a surface in close contact with the RAM module to prevent damage to the RAM module when the RAM module is compressed and to relieve external shock.

The high-impact RAM module fixing device of the present invention to solve the above problems has the following effects.

First, it is a method of fixing the RAM module according to the inserted position, rather than a method of fixing the RAM module to a fixed frame by force fitting, which has the advantage of minimizing the impact on the RAM module when an impact occurs.

Second, it can be applied in addition to the existing method in which fixing brackets are generally used to fix RAM modules, so it has the advantage of not only increasing usability but also maximizing the fixing force of RAM modules.

Third, it has the advantage of effectively cushioning the shock transmitted to the motherboard due to high shock beyond the shock absorption range of the housing, preventing not only damage to the RAM module but also the forcible release of the RAM module.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

1 is an exemplary diagram showing the overall configuration of a high-impact RAM module fixing device according to an embodiment of the present invention;
Figure 2 is an exploded perspective view showing a high-impact RAM module fixing device according to an embodiment of the present invention;
Figure 3 is an exemplary diagram showing a first fixing part in the high-impact RAM module fixing device according to an embodiment of the present invention;
Figure 4 is an exemplary diagram showing a second fixing part in the high-impact RAM module fixing device according to an embodiment of the present invention; and
Figure 5 is an exemplary diagram showing how a RAM module is stably supported and fixed by a high-impact RAM module fixing device according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention in which the object of the present invention can be realized in detail will be described with reference to the attached drawings. In describing this embodiment, the same names and the same symbols are used for the same components, and additional description accordingly will be omitted.

The present invention is a high-impact RAM that strengthens the fixing force of the RAM module, which is one of the core components of electronic equipment computers, and prevents the instantaneous falling off of the RAM module even in environments requiring high impact such as war or combat. It concerns module fixing devices.

As shown in FIGS. 1 and 2, the high-impact RAM module fixing device according to the present invention includes a main board 400 having a socket portion 300 into which at least one RAM module 500 can be inserted and fastened. and a pair of first fixing parts 100 and both ends that can be provided on both left and right sides of the socket part 300 in the longitudinal direction and are detachably coupled to the main board 400. is coupled to the first fixing part 100, more specifically, to a pair of first fixing parts provided on both left and right sides of the socket part 300, and is coupled to the same direction as the longitudinal direction of the socket part 300. It has a second height that is coupled to the socket portion 300 so that it can be positioned at a certain distance apart, thereby supporting and fixing the upper end of the RAM module 500 inserted into the socket portion 300. It can be done including the government (200).

At this time, the main board 400, the first fixing part 100, and the second fixing part 200 are provided with fastening members such as screws to facilitate replacement and maintenance of the RAM module 500. 600), it is preferable to assemble them by mutual coupling.

According to an embodiment of the present invention, both left and right sides of the RAM module 500 are provided on both left and right sides of the socket portion 300 and inserted into the socket portion 300 (left and right relative to the longitudinal direction of the socket portion). In the same sense as referring to both sides, the first fixing part 100, which is inserted in the same direction as the longitudinal direction of the socket part and allows both ends of the RAM module to be fixed to both left and right sides, is shown in FIG. 3. As described above, it may be formed on a body forming the exterior of the first fixing part 100 (at this time, the body may be interpreted in the same way as the first fixing part), and on one side of the body, At least one first coupling hole 130 through which the fastening member 600 penetrates so that the body can be coupled to the main board 400, and a second fixing part 200 that can be formed on the upper surface of the body It may include a second coupling hole 140 through which the fastening member 600 is coupled so as to be coupled to the upper end of the first fixing part 100.

At this time, the size of the body may vary depending on the number of RAM modules 500 inserted into the socket portion 300, and for the same reason, the second coupling hole 140 formed on the upper surface of the body is also It should be noted that the number of RAM modules 500 combined can be varied to correspond to the number of second fixing units 200 .

In addition, the position of the fastening hole formed around the socket part 300 may vary depending on the type of the main board 400 having the socket part 300, so it is formed in the body so that the body is connected to the fastening member ( The first coupling hole 130, which is coupled to the main board 400 by 600), has a structure that can be adjusted depending on the position of the fastening hole, for example, a folding structure, a sliding structure, or a variable structure with a certain groove. It can be made of any one of the coupling structures so that it can be formed on the body through a connection part extending from the body.

The first fixing part 100 may be simply provided on both left and right sides of the socket part 300 and coupled to the main board 400, but the first fixing part 100 is not limited thereto. One side of the body forming the exterior of the first fixing part 100 so that the fixing force of the socket part 300 can be strengthened and the fixing strength of the RAM module 500 inserted into the socket part 300 can also be strengthened. A socket coupling groove 110 may be formed into which the left or right end of the socket portion 300 can be fitted.

In addition, the first fixing part 100 can be formed on the side of the body opposite to the surface where the socket coupling groove 110 is formed, so that the RAM module 500 inserted into and coupled to the socket part 300 can be formed. A RAM module coupling groove 120 that allows the left or right end to be inserted so that both sides can be fixed by the first fixing part 100 when the RAM module 500 is inserted into the socket part 300. can be formed, and thus the fixing force of the RAM module 500 can be further improved.

The socket coupling groove 110 and the RAM module coupling groove 120 are formed to correspond to the number of RAM modules 500 that can be coupled to the main board 400 as described above in the body. The socket coupling groove 110 is formed on the inner surface of the body, and the RAM module coupling groove 120 is formed on the outer surface opposite to the inner surface, so that the socket portion 300 and the body are connected to each other. It is desirable that both sides of the RAM module 500 can be coupled and fixed at the same time.

According to one embodiment of the present invention, the upper part of the pair of first fixing parts 100 is coupled so that the upper part of the RAM module 500 inserted into the socket part 300 can be supported and fixed. As shown in FIG. 4, the second fixing part 200 has a fastening member 600 so that both ends can be coupled to the top of the first fixing part 100, that is, the upper surface of the body. It can be detachably coupled to the guide module 210 and the guide module 210 having a third coupling hole 211 for penetrating coupling, and is connected to the guide module 210 to be connected to the socket portion 300. It may include a support module 220 that allows the upper end of the inserted RAM module 500 to be supported and fixed.

At this time, the support module 220 is provided inside the guide module 210, and the ram is capable of sliding and can be positioned between the guide module 210 and the support module 220. The module 500 can be supported and fixed by compressing it.

For example, the second fixing part 200 is composed of the guide module 210 and the support module 220 that are interconnected as one set, and due to the nature of the structure in the main board 400, there are many When the RAM module 500 is inserted, the support module 220 is inserted into the guide module 210 in order to minimize the gap and maximize the efficiency of the space used. It is desirable.

To this end, an insertion hole 214 may be formed in the guide module 210 to allow the support module 220 to be inserted into the inside of the guide module 210, and the support module 220 may be formed in the guide module 210. At least one fourth coupling hole 212 through which the fastening member 600 penetrates and can be coupled to the module 210 may be included.

In addition, the support module 220 is formed to be located on the same line as the fourth coupling hole 212 while located inside the guide module 210, and penetrates the fourth coupling hole 212. There is at least one fifth coupling hole 221 that allows the guide module 210 and the support module 220 to be coupled by fastening the fastening member 600, more specifically, the fourth coupling hole. It can be formed in the same number as (212).

In that state, the guide module 210 is coupled to the body of the first fixing part 100, so that one side of the guide module 210 and one side of the support module 220, more specifically, the The upper part of the RAM module 500 inserted into the socket portion 300 is positioned between the inner surface of the guide module 210 and the outer surface of the support module 220, and the support module 220 is positioned at the As the RAM module 500 is slidably moved toward the inner surface of the guide module 210, the RAM module 500 is compressed by the guide module 210 and the support module 220, thereby causing the guide module 210 and the support module 220 to press together. ) can be fixed by closely supporting the RAM module 500 face to face.

To this end, the fourth coupling hole 212 formed in the guide module 210 through which the fastening member 600 penetrates and allows the support module 220 to be coupled is formed in the shape of a long slit in a certain direction. The support module 220 may be capable of reciprocating sliding movement in a certain direction inside the guide module 210.

That is, the fastening member 600 penetrating the fourth coupling hole 212 is temporarily fastened to the support module 220 and reciprocates along the slit-shaped direction of the fourth coupling hole 212. It is possible, and the RAM module 500 located between the guide module 210 and the support module 220 is compressed by the moving support module 220, and the support that was temporarily fastened in that state is compressed. By main-fastening the module 220, the guide module 210 and the support module 220 are in close contact with each other face-to-face on both sides of the RAM module 500, so that they can be supported and fixed.

At this time, the guide module 210 and the support module 220 are provided on a surface that is in close contact with the RAM module 500 to prevent damage to the RAM module 500 when the RAM module 500 is compressed. , when a high impact generated from the outside is transmitted to the main board 400, a buffer member 230 may be further provided to alleviate the shock and prevent the RAM module 500 from being forcibly removed.

The buffer member 230 may be made of a foam-type insulating tape, or any other soft buffer material that can absorb and cushion shock and prevent the RAM module 500 in close contact with it from being damaged. Anything can be applied selectively.

In addition, the guide module 210 includes the RAM module 500, which slides and moves inside the guide module 210 as described above and is supported and fixed in close contact between the guide module 210 and the support module 220. ) may be formed with at least one inspection hole 213 to visually identify whether the compression has been performed correctly, through which the user can ensure that the second fixing part 200 is accurately coupled to the RAM module ( 500), the binding force and support fixing force can be accurately exerted.

In this way, the fact that the upper part of the RAM module 500 inserted into the socket part 300 is compressed and fixed by the second fixing part 200 can be more easily understood with reference to FIG. 5. .

As described above, preferred embodiments according to the present invention have been examined, and the fact that the present invention can be embodied in other specific forms in addition to the embodiments described above without departing from the spirit or scope thereof is recognized by those skilled in the art. It is self-evident to them. Therefore, the above-described embodiments should be regarded as illustrative and not restrictive, and accordingly, the present invention is not limited to the above description but may be modified within the scope of the appended claims and their equivalents.

100: first fixing part 110: socket coupling groove
120: Ram module coupling groove 130: First coupling hole
140: second coupling hole 200: second fixing part
210: Guide module 211: Third coupling hole
212: Fourth coupling hole 213: Inspection hole
214: Insertion hole 220: Support module
221: Fifth coupling hole 230: Buffer member
300: Socket part 400: Main board
500: Ram module 600: Fastening member

Claims (6)

A motherboard having a socket portion into which at least one RAM module is inserted and coupled;
A pair of first fixing parts provided on both left and right sides in the longitudinal direction of the socket part and coupled to the main board; and
a second fixing part each of which has both ends coupled to the first fixing part and supporting and fixing an upper end of the RAM module inserted into the socket part;
Including,
The main board and the first and second fixing parts are coupled to each other by fastening members,
The second fixing part is,
a guide module having a third coupling hole through which the fastening member is coupled so that both ends are coupled to the top of the first fixing part; and
a support module detachably coupled to the guide module and connected to the guide module to support and fix the upper end of the RAM module inserted into the socket;
Including,
The support module is provided inside the guide module, is capable of sliding, and is fixed by pressing the ram module located between the guide module and the support module.
According to paragraph 1,
The first fixing part is,
body;
a socket coupling groove formed on one side of the body and into which the left or right end of the socket portion is fitted;
a RAM module coupling groove formed on a side of the body opposite to the surface where the socket coupling groove is formed, and allowing the left or right end of the RAM module coupled to the socket portion to be inserted and fixed;
A high-impact RAM module fixing device further comprising a.
delete According to paragraph 1,
The guide module is,
an insertion hole that allows the support module to be inserted inside; and
At least one fourth coupling hole through which the fastening member is coupled so that the support module is coupled to the guide module;
A high-impact RAM module fixing device further comprising a.
According to clause 4,
The fourth coupling hole is,
It is made in the shape of a slit,
The fastening member penetrating the fourth coupling hole is capable of reciprocating movement along the direction of the slit shape of the fourth coupling hole while being temporarily fastened to the support module, and is connected to the guide module by the moving support module. A high-impact RAM module fixing device that is main-fastened while pressing the RAM module located between the support modules so that the guide module and the support module closely support the RAM module face-to-face.
According to clause 5,
The guide module and support module are,
A buffer member provided on a surface in close contact with the RAM module to prevent damage to the RAM module and relieve external shock when the RAM module is compressed;
A high-impact RAM module fixing device further comprising a.

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