KR102617770B1 - Hole formming system and hole forming method - Google Patents

Abstract

A hole forming system according to an exemplary embodiment of the present disclosure includes a laser output device that outputs laser; A stage rotating around a first rotation axis; and a reflector that reflects the laser incident from the laser output device toward the stage.

Description

Hole forming system and hole forming method {HOLE FORMMING SYSTEM AND HOLE FORMING METHOD}

The technical idea of the present disclosure relates to a hole forming system and a hole forming method, and more specifically, to a hole forming system and a hole forming method for forming a hole (eg, via hole or through hole) in a semiconductor device.

In accordance with the rapid development of the electronics industry and user demands, electronic devices are becoming more compact, highly integrated, and large-area. Accordingly, the size of semiconductor devices included in electronic devices is entering the nanometer scale.

Therefore, when forming holes in a semiconductor chip, there is an increasing need to uniformly remove only a specific mold layer without affecting adjacent holes.

In addition, wafer-level packaging, in which chips are packaged directly on the wafer, rather than first cutting the wafer into chips and then packaging them, is increasing. In this case, a via hole is made in the wafer to create an interconnect, or a via hole is required to serve as a heat sink in a multi-layered semiconductor.

The technical idea of the present disclosure is to provide a hole forming system and a hole forming method that can improve the processing quality of the irradiated object, prevent quality degradation due to particles, and perform interconnect creation and heat sink functions. The purpose.

A hole forming system according to an exemplary embodiment of the present disclosure includes a laser output device that outputs laser; A stage rotating around a first rotation axis; and a reflector that reflects the laser incident from the laser output device toward the stage, and the reflector may vibrate around a second rotation axis extending in a direction intersecting the direction in which the first rotation axis extends. .

The first rotation axis may overlap the reflector.

The reflector may repeat clockwise rotation and counterclockwise rotation around the second rotation axis.

The reflector includes a reflective surface on which the laser is reflected, and the reflector may vibrate so that the angle of incidence between the laser and the reflective surface alternately increases and decreases.

It may further include a gas injection device disposed between the reflector and the stage, and the gas injection device may include a housing including an upper opening and a lower opening and a lens surrounded by the housing.

The upper opening of the housing may be larger than the lower opening of the housing.

A hole forming system according to an exemplary embodiment of the present disclosure includes a laser output device that outputs laser; a reflector that reflects the laser output from the laser output device; A stage on which the subject is placed; and a rotation module between the reflector and the stage, wherein the rotation module rotates about a first rotation axis and may include a plurality of rotation reflectors that reflect the laser.

At least one of the plurality of rotating reflectors may vibrate.

Among the plurality of rotating reflectors, one disposed closest to the stage may vibrate around a second rotation axis extending in a direction intersecting the direction in which the first rotation axis extends.

Among the plurality of rotating reflectors, the one disposed closest to the stage may overlap the first rotation axis.

A hole forming method according to an exemplary embodiment of the present disclosure includes disposing an object to be irradiated on a stage; outputting a laser from a laser output device; reflecting the laser output from the laser output device on a reflector and irradiating it to the irradiated object; and rotating the stage, wherein reflecting the laser on the reflector may include vibrating the reflector so that an increase and decrease in the incident angle of the laser is alternately repeated.

A hole forming method according to an exemplary embodiment of the present disclosure includes disposing an object to be irradiated on a stage; outputting a laser from a laser output device; Reflecting the laser output from the laser output device toward the rotation module on a reflector; reflecting the laser at rotating reflectors of the rotating module; And it may include rotating the rotation module.

According to an exemplary embodiment of the present disclosure, as the reflector vibrates and the laser travel path repeatedly changes along the travel area and the laser is irradiated to the irradiated object, the output intensity of the laser can be relatively lowered, and the laser's output intensity can be relatively lowered. Processing quality can be improved.

According to an exemplary embodiment of the present disclosure, as the reflector vibrates and the laser travel path repeatedly changes along the travel area and the laser is irradiated to the irradiated object, particles generated by processing of the irradiated object are affected by the movement of the laser. It can be removed from the irradiated object, and quality deterioration due to particles can be prevented.

According to an exemplary embodiment of the present disclosure, the irradiated object rotates according to the rotation of the stage, so that particles generated by processing the irradiated object can be removed from the irradiated object by centrifugal force, and quality deterioration due to the particles can be prevented. You can.

1 is a diagram for explaining a hole forming system according to an exemplary embodiment of the present disclosure.
Figures 2 and 3 are diagrams for explaining the vibration of the reflector of the hole forming system according to Figure 1.
FIG. 4 is a diagram for explaining the rotation of the stage of the hole forming system according to FIG. 1.
FIG. 5 is a diagram illustrating the progress area of the laser according to the operation of the reflector of the hole forming system according to FIG. 1.
FIG. 6 is a diagram for explaining a processing line formed on an object to be irradiated by the hole forming system according to FIG. 1.
FIG. 7 is a diagram showing an object in which a hole is formed by the hole forming system according to FIG. 1.
FIG. 8 is a diagram for explaining components for driving a reflector according to an exemplary embodiment of the present disclosure.
FIG. 9 is a diagram for explaining a hole forming system according to an exemplary embodiment of the present disclosure.
FIG. 10 is a diagram for explaining the laser travel area according to the operation of the reflector and rotation module of the hole forming system according to FIG. 9.
FIG. 11 is a diagram for explaining a hole forming system according to an exemplary embodiment of the present disclosure.

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the attached drawings.

1 is a diagram for explaining a hole forming system according to an exemplary embodiment of the present disclosure.

Referring to FIG. 1 , the hole forming system may include a laser output device 100, a reflector 200, and a stage 300.

The laser output device 100 may be a device that outputs laser. In one embodiment, the laser output device 100 may include a laser generator, an optical fiber, and an optical system. The laser generated in the laser generator may be output to the outside of the laser output device 100 through an optical fiber and an optical system. In one embodiment, the laser output device 100 may output by adjusting the output intensity of the laser output. The laser output device 100 may output a laser toward the reflector 200.

The reflector 200 may reflect the laser incident from the laser output device 100 toward the stage 300. The laser output from the laser output device 100 may be reflected on the reflective surface 201 of the reflector 200. In one embodiment, the reflector 200 may be a flat mirror.

The stage 300 may have the shape of a plate extending along a plane defined by the first direction D1 and the second direction D2. The upper surface of the stage 300 may be parallel to a plane defined by the first direction D1 and the second direction D2. The first direction D1 and the second direction D2 may intersect each other. For example, the first direction D1 and the second direction D2 may be perpendicular to each other.

The stage 300 may be arranged to overlap the reflector 200 in the third direction D3. As an example, the stage 300 may vertically overlap the reflector 200. In other words, the reflector 200 may be placed vertically on the stage 300. The third direction D3 may intersect the first direction D1 and the second direction D2. For example, the third direction D3 may be perpendicular to the first direction D1 and the second direction D2. In one embodiment, the stage 300 may include suction ports for fixing the object to be examined on the stage 300.

The stage 300 may rotate around the first rotation axis R1. The first rotation axis R1 may be an imaginary line defining the rotation center of the stage 300. The first rotation axis R1 of the stage 300 may extend in the third direction D3. In one embodiment, the stage 300 may include a driving unit for its rotation, and the stage 300 may rotate by the operation of the driving unit.

In one embodiment, the first rotation axis R1 of the stage 300 may overlap the reflector 200 in the third direction D3. For example, the first rotation axis R1 of the stage 300 may vertically overlap the reflector 200. In other words, the reflector 200 may be disposed perpendicular to the first rotation axis R1 of the stage 300. The reflector 200 may be disposed on the same line as the first rotation axis R1 of the stage 300.

In one embodiment, the reflector 200 may be arranged so that an extension of the first rotation axis R1 of the stage 300 intersects the second rotation axis R2 at one point. This is to enable the position of the hole to be formed to be easily determined, and ultimately to accurately form the position and size of the hole in the irradiated object 400.

Figures 2 and 3 are diagrams for explaining the vibration of the reflector of the hole forming system according to Figure 1.

Referring to FIGS. 2 and 3, the reflector 200 may reflect the laser incident from the laser output device 100. The laser from the time it is output from the laser output device 100 until it is reflected from the reflector 200 may be defined as the incident laser L1. The laser after being reflected from the reflector 200 before being irradiated to the irradiated object 400 may be defined as the reflected laser L2. The incident laser (L1) and the reflected laser (L2) are separated for convenience of explanation and may physically be one laser beam.

The rotation axis of the reflector 200 may be defined as the second rotation axis R2. The second rotation axis R2 of the reflector 200 may extend in the first direction D1. The second rotation axis R2 of the reflector 200 may extend in a direction intersecting the direction in which the first rotation axis R1 of the stage 300 extends. For example, the second rotation axis R2 of the reflector 200 may extend in a direction perpendicular to the direction in which the first rotation axis R1 of the stage 300 extends. The reflector 200 may vibrate around the second rotation axis R2. The reflector 200 may rotate around the second rotation axis R2.

While the laser is reflected from the reflector 200, the reflector 200 may vibrate. Vibrating the reflector 200 may include alternately repeating the first rotation operation and the second rotation operation. The first rotation operation may be an operation of rotating the reflector 200 in the fourth direction D4 about the second rotation axis R2 (see FIG. 2). The second rotation operation may be an operation of rotating the reflector 200 in the fifth direction D5 about the second rotation axis R2 (see FIG. 3). From the perspective of FIGS. 2 and 3, the fourth direction D4 may be clockwise around the second rotation axis R2. The fifth direction D5 may be a counterclockwise direction centered on the second rotation axis R2. That is, the fourth direction D4 and the fifth direction D5 may each correspond to circular motion in opposite directions.

When the reflector 200 rotates at the maximum angle in the fourth direction D4 by performing the first rotation operation, the incident angle between the reflecting surface 201 of the reflector 200 and the incident laser L1 and the angle of incidence of the reflector 200 The reflection angle between the reflection surface 201 and the reflection laser may form a first angle A1. The first angle A1 may be the minimum incident angle between the reflective surface 201 and the incident laser L1 and the minimum reflection angle between the reflective surface 201 and the reflective laser.

When the second rotation operation is performed and the reflector 200 rotates at the maximum angle in the fifth direction D5, the incident angle between the reflecting surface 201 of the reflector 200 and the incident laser L1 and the angle of the reflector 200 are changed. The reflection angle between the reflection surface 201 and the reflection laser L2 may form a second angle A2. The second angle A2 may be greater than the first angle A1. The second angle A2 may be the maximum angle of incidence between the reflective surface 201 and the incident laser L1 and the maximum angle of reflection between the reflective surface 201 and the reflective laser L2.

According to the vibration of the reflector 200, the incident angle between the incident laser L1 and the reflecting surface 201 and the reflection angle between the reflecting laser L2 and the reflecting surface 201 are changed to the first angle A1 and the second angle ( A2) can vary between. According to the vibration of the reflector 200, the incident angle between the incident laser L1 and the reflective surface 201 and the reflection angle between the reflective laser L2 and the reflective surface 201 may repeatedly increase and decrease. According to the vibration of the reflector 200, the incident angle between the incident laser L1 and the reflecting surface 201 increases from the first angle A1 to the second angle A2, and from the second angle A2 to the first angle A2. The decrease in angle A1 can be alternately repeated.

In one embodiment, the reflector 200 may perform an oscillating motion to have a maximum rotation angle of 5 degrees to 30 degrees. Here, the vibration frequency may cover various bands, but in one embodiment, the reflector 200 may vibrate at 200 Hz to 16000 Hz. As the frequency of the reflector 200 increases, the vibration operation may be performed to have a small maximum rotation angle.

FIG. 4 is a diagram for explaining the rotation of the stage of the hole forming system according to FIG. 1.

Referring to FIG. 4 , the object 400 may be placed on the stage 300 . As an example, the irradiated object 400 may be a semiconductor package. A semiconductor package may include at least one of a memory element and a processor. The memory element may be volatile memory such as dynamic random access memory (DRAM), or non-volatile memory such as flash memory, magnetic RAM (MRAM), ferroelectric RAM (FRAM), phase change RAM (PRAM), or resistive RAM (RRAM). there is. The processor may be a graphics processing unit (GPU) or a central processing unit (CPU).

Additionally, the irradiated body 400 is not limited to a semiconductor package and may include a brittle material such as glass. In addition, the irradiated object 400 may include an object made of a material capable of laser processing.

The irradiated object 400 may be disposed on the stage 300 so as to overlap the first rotation axis R1 of the stage 300 in the third direction D3. As an example, the object 400 may be arranged to vertically overlap the first rotation axis R1 of the stage 300. In other words, the object 400 may be placed perpendicular to the first rotation axis R1 of the stage 300.

The irradiated object 400 may include a processing area 410 . The processing area 410 may be a partial area of the irradiated object 400 that is removed in the hole forming process. The irradiated object 400 may be placed on the stage 300 so that the processing area 410 of the irradiated object 400 overlaps the first rotation axis R1 of the stage 300 in the third direction D3. As an example, the object 400 may be arranged so that the center of the processing area 410 of the object 400 overlaps the first rotation axis R1 of the stage 300 in the third direction D3. In one embodiment, after the subject 400 is placed on the stage 300, the suction ports of the stage 300 create negative pressure so that the subject 400 is fixed.

After the object to be irradiated 400 is disposed, the stage 300 may rotate. The stage 300 may rotate about the first rotation axis R1 in the sixth direction D6 (that is, clockwise about the first rotation axis R1 from the perspective of FIG. 4 ). In one embodiment, unlike what is shown, the stage 300 may rotate counterclockwise (from the perspective of FIG. 4) about the first rotation axis R1. The rotation speed of the stage 300 can be appropriately adjusted depending on the frequency of the reflector 200, the output intensity of the laser, etc.

FIG. 5 is a diagram illustrating the progress area of the laser according to the operation of the reflector of the hole forming system according to FIG. 1.

Referring to FIG. 5 , the path along which the reflective laser L2 reflected from the reflector 200 travels until it reaches the irradiated object 400 may be defined as the travel path of the reflective laser L2. According to the vibration of the reflector 200, the reflection laser L2 travels on a travel path between the first travel path PP1 and the second travel path PP2 (the first travel path PP1 and the second travel path PP2). (including).

The first traveling path PP1 has a first incident angle between the reflective surface 201 of the reflector 200 and the incident laser L1 and a first reflection angle between the reflective surface 201 of the reflector 200 and the incident laser L2. This may be the travel path of the reflected laser L2 at the angle A1. The second traveling path PP2 has an incident angle between the reflective surface 201 of the reflector 200 and the incident laser L1 and a reflection angle between the reflective surface 201 of the reflector 200 and the reflected laser at a second angle A2. ) may be the path of the reflection laser (L2).

According to the vibration of the reflector 200, the travel path of the reflective laser L2 changes from the first travel path PP1 to the second travel path PP2 and from the second travel path PP2 to the first travel path. (PP1) Changes can be repeated alternately. By adjusting the vibration angle of the reflector 200, the first angle A1 and the second angle A2 can be adjusted, and the first travel path PP1 and the second travel path PP2 can be set.

A progress area PR, which is an area in which the reflected laser L2 reflected from the reflector 200 can proceed until it reaches the irradiated object 400, may be defined. The progress area PR may be an area including all progress paths through which the reflective laser L2 can travel. The progress path of the reflection laser L2 may change along the progress area PR. The progress area (PR) may be defined as an area between the first progress path (PP1) and the second progress path (PP2). The progress area (PR) may have the shape of a two-dimensional triangle. The progress area PR may be parallel to the third direction D3. From a planar perspective defined by the first direction D1 and the second direction D2, the progress area PR may have the shape of a straight line.

The travel area PR of the reflective laser L2 may have a straight line on the upper surface of the irradiated object 400. The progress area (PR) may be set so that the length of the progress area (PR) on the upper surface of the subject 400 matches the diameter of the processing area 410 of the subject 400. By adjusting the vibration angle of the reflector 200, the first and second angles A1 and A2 and the first and second travel paths PP1 and PP2 can be adjusted, and the progress area PR can be set. . In one embodiment, the progress area PR may be set so that the center of the progress area PR overlaps the first rotation axis R1 of the stage 300 in the third direction D3.

FIG. 6 is a diagram for explaining a processing line formed on an object to be irradiated by the hole forming system according to FIG. 1.

Referring to FIG. 6 , the reflection laser L2 may be irradiated to the irradiated object 400 in response to the vibration of the reflector 200 and the rotation of the stage 300. As explained in FIG. 5, since the progress path of the reflective laser L2 repeatedly changes along the progress area PR, the reflected laser L2 moves along the straight progress area PR on the upper surface of the irradiated object 400. It can be investigated accordingly.

As the stage 300 rotates, the irradiated object 400 rotates and the reflected laser L2 is irradiated, thereby forming processing lines PL on the irradiated object 400. The processing lines PL may be lines connecting portions of the irradiated object 400 irradiated with the reflective laser L2. Even if the reflected laser L2 is irradiated from the upper surface of the irradiated object 400 along a straight progression region PR, the irradiated object 400 rotates, so the portion of the irradiated object 400 to which the reflected laser L2 is irradiated These can form curved processing lines (PL). As the irradiated object 400 rotates, processing lines PL may be formed in different portions of the processing area 410 .

Portions of the irradiated object 400 irradiated with the reflection laser L2 may be processed by the reflection laser L2. In other words, portions of the irradiated object 400 where the processing lines PL are formed may be processed by the reflective laser L2. For example, parts of the irradiated object 400 may be removed by the heat of the reflective laser L2.

When the irradiation of the reflective laser L2 and the rotation of the stage 300 proceed for a sufficient time, the machining lines PL are formed overlapping in the machining area 410 of the irradiated object 400, thereby forming the machining area 410. This can be processed as a whole. As an example, the processing area 410 may be removed to form a hole in the irradiated object 400.

According to an exemplary embodiment of the present disclosure, the processing lines PL may be implemented radially. The hole forming system creates an elliptical processing line (PL) with a diameter corresponding to the radius from the origin to the processing area 410 on the irradiated object 400 in response to the vibration of the reflector 200 and the rotation of the stage 300. can be formed. A curved or oval-shaped processing line (PL) can form a hole with excellent processing quality, and particles can be removed without a separate process.

As an example, the processing line PL may be formed in a plurality of oval shapes symmetrical to the origin. As another example, the processing line PL may form a closed curve in the horizontal, vertical, and diagonal directions. As another example, the processing line PL may be formed as a radial curve with apex symmetry.

FIG. 7 is a diagram showing an object in which a hole is formed by the hole forming system according to FIG. 1.

Referring to FIG. 7 , a hole 420 may be formed in the irradiated object 400 by performing the hole forming method described in FIGS. 2 to 6 .

In one embodiment, the irradiated object 400 may be a semiconductor package. The semiconductor package 400 may include a conductor 430 that is electrically connected to a memory element or processor. As an example, the conductor 430 may be a solder ball or pad. A hole forming method according to an exemplary embodiment of the present disclosure provides forming a hole 420 for electrically connecting the conductor 430 of the semiconductor package 400 to an external wiring.

The hole forming method according to an exemplary embodiment of the present disclosure can relatively lower the output intensity of the laser as the laser is irradiated to the irradiated object while the traveling path of the laser repeatedly changes along the traveling area, and the laser is irradiated to the irradiated object. Processing quality can be improved.

According to the hole forming method according to an exemplary embodiment of the present disclosure, the intensity of the laser focus can be increased due to the lens creating a small focus. When the laser focus formed in this way is quickly moved and irradiated, the phase change of the irradiated object melts from a solid to a liquid, and at the same time, the laser beam changes position due to vibration and solidifies again into a solid, causing problems due to laser heat (e.g., thermal deformation). can be solved, and because of this, particles can be easily removed.

Specifically, a focus with a small size and high intensity can be obtained using a high magnification lens. In other words, the focus may have a relatively high intensity compared to the same input energy. Because the input energy is relatively low, the phase change of the irradiated object due to laser heat can be minimized.

As the laser travel path changes repeatedly along the travel area and the laser irradiates the irradiated object, particles generated by processing the irradiated object may be removed from the irradiated object by the movement of the laser, and quality deterioration due to the particles. can be prevented. In addition, because the particles are removed, processing can be performed without interference from subsequent lasers irradiated along the same path, thereby creating a relatively deep hole and ensuring processing quality. Exemplary implementation of the present disclosure In the hole forming method according to the example, the irradiated object 400 rotates according to the rotation of the stage, so that particles generated by processing of the irradiated object can be removed from the irradiated object by centrifugal force, and quality deterioration due to particles is prevented. It can be.

FIG. 8 is a diagram for explaining components for driving a reflector according to an exemplary embodiment of the present disclosure.

Referring to FIG. 8, the hole forming system may include a connection shaft 210a connected to the reflector 200a and a power source 220a connected to the connection shaft 210a. The power source 220a may provide power to rotate the connecting shaft 210a. The connecting shaft 210a can rotate by receiving power from the power source 220a, and the reflector 200a connected to the connecting shaft 210a can rotate together with the connecting shaft 210a. The reflector 200a may vibrate using the connection shaft 210a as a rotation axis.

FIG. 9 is a diagram for explaining a hole forming system according to an exemplary embodiment of the present disclosure.

Referring to FIG. 9 , the hole forming system may include a laser output device 100b, a reflector 200b, a stage 300b, and a rotation module 500. The laser output device 100b may output a laser toward the reflector 200b. The reflector 200b may reflect the laser output from the laser output device 100b toward the rotation module 500.

The rotation module 500 may include a first rotation reflector 510, a second rotation reflector 520, a third rotation reflector 530, and a fourth rotation reflector 540. Although the rotation module 500 is shown and described as including four rotation reflectors 510, 520, 530, and 540, the number of rotation reflectors 510, 520, 530, and 540 is not limited thereto. The rotation module 500 may further include a case 550. Rotating reflectors 510, 520, 530, and 540 may be disposed in the case 550 of the rotation module 500.

Some of the plurality of rotating reflectors 510 to 540 (eg, 510 and 520) may be installed at the same first angle, and others (eg, 530 and 540) may be installed at a second angle. This is to guide the laser output from the reflector 200b to the irradiated object 400b.

The laser reflected from the reflector 200b may be incident into the case 550 of the rotation module 500. The case 550 of the rotation module 500 may include an upper opening through which a laser can pass, and the laser reflected from the reflector 200b may be incident into the case 550 through the upper opening of the case 550. You can.

The laser incident into the case 550 may be sequentially reflected by the first rotating reflector 510, the second rotating reflector 520, the third rotating reflector 530, and the fourth rotating reflector 540. The case 550 of the rotation module 500 may include a lower opening through which a laser can pass, and the laser reflected from the fourth rotating reflector 540 may enter the case 550 through the lower opening of the case 550. It may proceed outward and be irradiated to the irradiated object 400b on the stage 300b.

The rotation axis of the rotation module 500 may be defined as the third rotation axis R3. The rotation module 500 may rotate about the third rotation axis R3. The rotation module 500 may rotate in the seventh direction D7 (that is, clockwise around the third rotation axis R3 when viewed from above) about the rotation axis R3. In one embodiment, unlike what is shown, the rotation module 500 may rotate counterclockwise (as viewed from above) about the third rotation axis R3. The case 550 and the first to fourth rotation reflectors 510, 520, 530, and 540 of the rotation module 500 may rotate about the third rotation axis R3 of the rotation module 500. The third rotation axis R3 of the rotation module 500 may extend in the third direction D3.

Among the rotating reflectors 510, 520, 530, and 540, the fourth rotating reflector 540, which is the last rotating reflector at which the laser is reflected, may vibrate similarly to the reflector 200b. Since only the fourth rotating reflector 540 vibrates, there is no need to provide a plurality of vibration power sources, so the durability of the device can be improved and the manufacturing cost of the hole forming system can be reduced. In addition, damage to the object 400b can be reduced by stably fixing the stage 300b instead of rotating the rotation module 500, thereby increasing the yield of the object 400b and related equipment.

The fourth rotation reflector 540 may vibrate around the fourth rotation axis R4 extending in a direction intersecting the direction in which the third rotation axis R3 of the rotation module 500 extends. As the rotation module 500 rotates, the fourth rotation axis R4 of the fourth rotation reflector 540 may rotate together with the fourth rotation reflector 540 . Among the rotating reflectors 510, 520, 530, and 540, the fourth rotating reflector 540 may be placed closest to the stage 300b. In one embodiment, the first to third rotating reflectors 510, 520, and 530 may also vibrate similarly to the reflector 200.

The third rotation axis R3 of the rotation module 500 may overlap the reflector 200b in the third direction D3. For example, the third rotation axis R3 of the rotation module 500 may vertically overlap the reflector 200b. In other words, the reflector 200b may be disposed perpendicular to the third rotation axis R3 of the rotation module 500. The reflector 200b may be disposed on the same line as the third rotation axis R3 of the rotation module 500.

The third rotation axis R3 of the rotation module 500 may overlap the first and fourth rotation reflectors 510 and 540. The third rotation axis R3 of the rotation module 500 may pass through the first and fourth rotation reflectors 510 and 540.

FIG. 10 is a diagram for explaining the laser travel area according to the operation of the reflector and rotation module of the hole forming system according to FIG. 9.

Referring to FIG. 10, the laser output from the laser output device 100b is reflected by the reflector 200b and the first to fourth rotating reflectors 510, 520, 530, and 540 of the rotation module 500, and the reflector (200b) and the fourth rotating reflector 540 may vibrate. Accordingly, the travel path of the laser reflected from the fourth rotating reflector 540 and traveling toward the irradiated object 400b may change along the progress area PRb. In other words, the laser may be repeatedly irradiated to the irradiated object 400b along the progress area PRb. The progress area PRb may have the shape of a circle in a planar view defined by the first direction D1 and the second direction D2. The progress area (PRb) may have the shape of a three-dimensional cone.

The progress area PRb may be set so that the progress area PRb and the processing area 410b coincide on the upper surface of the irradiated object 400b. A laser may be irradiated to the irradiated object 400b along the progress area PRb, thereby forming a circular hole in the irradiated object 400b. The size of the hole can be adjusted by setting the progress area PRb by adjusting the vibration angle of the reflector 200b and the vibration angle of the fourth rotating reflector 540.

FIG. 11 is a diagram for explaining a hole forming system according to an exemplary embodiment of the present disclosure.

Referring to FIG. 11, the hole forming system may include a laser output device 100c, a reflector 200c, and a stage 300c. The laser output device 100c may output a laser toward the reflector 200c. The reflector 200c may reflect the laser output from the laser output device 100c toward the stage 300c.

The hole forming system may further include a gas injection device 600 between the reflector 200c and the stage 400c. The gas injection device 600 may include a housing 610 and a lens 620. Lens 620 may be surrounded by housing 610 . The lens 620 and the housing 610 may be spaced apart. A gas flow path (GP) may be provided between the lens 620 and the housing 610. The gas flow path (GP) may surround the lens 620. The lens 620 may be configured to focus the laser on the irradiated object 400c. As an example, the lens 620 may be an objective lens. The laser reflected from the reflector 200c may pass through the lens 620 and be irradiated to the object 400c.

Housing 610 may include an upper opening 611 and a lower opening 612. The upper opening 611 of the housing 610 may be larger than the lower opening 612. The housing 610 may have a structure whose width becomes smaller as it approaches the stage 300c.

The gas injection device 600 may further include a gas source 630. The gas source 630 may supply gas (GAS) toward the housing 610 and the lens 620. The gas source 630 may include a gas opening 631 that opens toward the housing 610 and the lens 620. The gas source 630 may supply gas (GAS) toward the housing 610 and the lens 620 through the gas opening 631. For example, the gas supplied through the gas source 630 may be air. In one embodiment, as shown, the gas opening 631 of the gas source 630 is opened toward the upper surface of the lens 620 and may supply gas (GAS) toward the upper surface of the lens 620. In one embodiment, unlike what is shown, the gas opening 631 of the gas source 630 is opened toward the gas flow path GP between the housing 610 and the lens 620 and opens toward the gas flow path GP. Gas can be supplied. The gas source 630 may be arranged so as not to interfere with the path of the laser that is reflected from the reflector 200c and travels toward the irradiated object 400c.

The gas (GAS) supplied through the gas source 630 sequentially passes through the upper opening 611, the gas flow path (GP), and the lower opening 612 of the housing 610 to the irradiated object 400c on the stage 300c. ) can be sprayed toward. Since the size of the lower opening 612 is relatively small, the flow rate of gas may increase while passing through the lower opening 612.

When a laser is irradiated to the irradiated object 400c using the laser output device 100c and the reflecting plate 200c, the irradiated object 400c is processed and particles may be generated on the irradiated object 400c. As the gas (GAS) supplied through the gas source 630 is sprayed toward the irradiated object 400c, particles generated on the irradiated object 400c may be removed.

As above, exemplary embodiments have been disclosed in the drawings and specification. In this specification, embodiments have been described using specific terms, but this is only used for the purpose of explaining the technical idea of the present disclosure and is not used to limit the meaning or scope of the present disclosure described in the claims. Therefore, those skilled in the art will understand that various modifications and other equivalent embodiments are possible therefrom. Therefore, the true technical protection scope of the present disclosure should be determined by the technical spirit of the appended claims. something to do.

Claims (7)

A laser output device that outputs laser;
A stage on which the subject is placed;
a reflector that reflects the laser incident from the laser output device toward the stage; and
Comprising a rotation module between the stage and the reflector,
The rotation module rotates about a third rotation axis and includes a plurality of rotation reflectors that reflect the laser, and a fourth rotation reflector disposed closest to the stage among the plurality of rotation reflectors is connected to the third rotation axis. Vibrates about a fourth rotation axis different from the other, and the fourth rotation axis extends in a direction that intersects the direction in which the third rotation axis extends in the fourth rotation reflector,
The laser processing lines formed on the irradiated object are implemented in a radial shape, and each processing line is formed in an oval shape with a diameter corresponding to the radius from the origin of the irradiated object to the processing area. According to paragraph 1,
The fourth rotating reflector is,
A hole forming system, wherein the laser is reflected last among the plurality of rotating reflectors. According to paragraph 1,
A hole forming system, wherein the third rotation axis passes through the fourth rotation reflector. delete According to paragraph 1,
Further comprising a gas injection device disposed between the reflector and the stage,
A hole forming system wherein the gas injection device includes a housing including an upper opening and a lower opening and a lens surrounded by the housing. According to clause 5,
A hole forming system wherein the upper opening of the housing is larger than the lower opening of the housing. A laser output device that outputs laser;
a reflector that reflects the laser output from the laser output device;
A stage on which the subject is placed; and
Comprising a rotation module between the reflector and the stage,
The rotation module rotates about a third rotation axis and includes a plurality of rotation reflectors that reflect the laser, and among the plurality of rotation reflectors, a fourth rotation reflector on which the laser is reflected last is connected to the third rotation axis. It vibrates around an intersecting fourth rotation axis, the fourth rotation axis extends in a direction intersecting the direction in which the third rotation axis extends and the fourth rotation reflector, and the laser processing lines formed on the irradiated object are radial. A hole forming system, wherein each processing line is formed in an oval shape with a diameter corresponding to the radius from the origin of the object to the processing area.