KR102616398B1 - Case top and display module including the same - Google Patents

Abstract

The present invention provides a case top that radiates heat generated from the driver IC to the outside through the case top, but minimizes heat damage to the display panel connected to the case top by lowering the surface temperature of the case top as much as possible, and a display module including the same. and the purpose is to provide a device.
To this end, the case top according to the present invention includes a connection member electrically connected to the display panel and on which a driver IC is mounted, a contact part in contact, and a plurality of rows of openings, and the openings arranged in one row are connected to the other adjacent row. It is arranged to be offset from the openings arranged in .
The arrangement pattern of these openings changes the heat transfer path to be blocked as much as possible, and the longer heat transfer path allows heat to be dissipated to the outside more quickly and effectively.

Description

Case top and display module comprising the same {CASE TOP AND DISPLAY MODULE INCLUDING THE SAME}

The present invention relates to a case top for a display device with excellent heat dissipation effect and a display module including the same.

As modern society gradually develops into an information society, the demand for various home appliances or portable display devices is increasing. Accordingly, various lightweight and thin display devices such as Liquid Crystal Display Device (LCD) and Organic Light Emitting Display Device (OLED) are being used.

Generally, such a display device includes a display panel that displays an image and a driver that supplies a driving signal to the display panel. The driving unit includes a driver IC (Integrated Circuit), and when driving a display device, the driver IC generates considerable heat.

Below, we will explain in detail the problems that may arise due to the heat generation problem of the driver IC and the conventional technologies used to solve these problems, using the liquid crystal display device as an example.

Figure 1 is an exploded perspective view of the main components of a conventional liquid crystal display device.

Generally, the liquid crystal display device 100 includes a cover bottom 110, a backlight unit 190 disposed on the cover bottom 110, and is disposed on the top of the backlight unit 190 to support the liquid crystal display panel 160 from the bottom. It includes a guide panel 170, a liquid crystal display panel 160, and a case top 180 that surrounds the guide panel 170 and is fastened to the cover bottom 110. The cover bottom 110 and case top 180 serve as a case for the liquid crystal display device and store the backlight unit 190 and the liquid crystal display panel 160.

The backlight unit 190 may include a reflective sheet 120, a light guide plate 130, a light source 140, and an optical film 150 disposed on the side of the light guide plate 130, but the light guide plate is omitted. It may also be composed of a non-light plate backlight unit.

The liquid crystal display panel 160 includes a first substrate, a thin film transistor (TFT) substrate 161, and a second substrate, a color filter substrate 162, which are bonded opposite each other with a liquid crystal layer in between. The thin film transistor substrate 161 is provided with a plurality of gate lines and a plurality of data lines that intersect the gate lines.

A driving printed circuit board (PCB) 165 that supplies driving signals to the gate line and data line is electrically connected to the thin film transistor board 161. Specifically, a flexible connecting member 163 such as a flexible printed circuit board (FPC) is connected to one edge of the thin film transistor substrate 161, and the connecting member 163 serves as a medium to form a driving printed circuit board 165. ) is connected. A driver IC 164 that applies a driving signal and a timing signal to the thin film transistor substrate 161 is mounted on one surface of the connecting member 163.

Ultimately, in order to drive the display device 100, the driver IC 164 must operate, and when the driver IC 164 operates, a significant amount of high temperature heat is generated in the driver IC 164.

As a result, there was a problem that the driver IC 164 was damaged and malfunctioned or its lifespan was shortened. Damage to the driver IC 164 ultimately leads to malfunction of the display device 100 or deterioration of image quality, making it difficult to secure product reliability.

To solve this problem of driver IC heat generation, a method of using the case top as a heat dissipation member, as shown in FIG. 2, was conventionally used.

As shown in FIG. 2, the case top 180 is arranged to surround the upper edge of the display panel 160. A guide panel 170 is provided at the lower part of the display panel 160 to support the lower edge of the display panel 160.

A driving printed circuit board 165 is connected to one end of the display panel 160 by a connecting member 163 on which a driver IC 164 is mounted. At this time, the connecting member 163 is folded toward the outer surface of the guide panel 170 and placed so that the driving printed circuit board 165 is in close contact with the outer surface of the guide panel 170.

At this time, one side of the connecting member 163 on which the driver IC 164 is mounted is arranged to face the outer surface of the guide panel 170, and the other side of the connecting member 163 on which the driver IC 164 is not mounted is placed on the case. It is brought into contact with the inner surface of the tower 180.

Since the connecting member 163 is in contact with the case top 180 made of metal, the heat generated in the driver IC 164 is transmitted to the case top 180 through the connecting member 163 and can be emitted to the outside. there is. In this way, the case top 180 could be used as a heat dissipation member for the driver IC 164.

However, another problem occurred as the case top 180 was used as a heat dissipation member.

The case top 180 surrounds the upper surface edge of the display panel 160 in a manner that contacts it, so that heat transferred from the driver IC 164 to the case top 180 was directly transferred to the display panel 160. Accordingly, the driver IC 164 dissipates heat, but a problem occurs in which the display panel 160 is damaged by heat.

In other words, the heat generated from the driver IC 164 was dissipated by the case top 180, which had the effect of lowering the heat of the driver IC 164. However, the heat transferred from the case top 180 was used to reduce the heat generated by the display panel. It was difficult to solve other problems where (160) was damaged.

The present invention is intended to solve the above-described problems, and its purpose is to provide a case top that quickly and effectively dissipates heat generated from a driver IC to the outside to prevent damage to the driver IC, and a display module including the same.

Another object of the present invention is to provide a case top and a display module including the same that minimize damage to the display panel by heat generated from the driver IC through the case top.

In addition, another object of the present invention is to provide a case top that can minimize heat damage to the driver IC and display panel without adding a separate heat dissipation member, and a display module including the same.

In order to achieve the above object, the present invention provides the following case top and a display module including the same.

The case top according to the present invention includes a connection member electrically connected to the display panel and on which a driver IC is mounted, a contact portion in contact, and a plurality of rows of openings.

The openings arranged in one row are arranged to be offset from the openings arranged in another adjacent row. Specifically, the spacing between openings arranged in one row is arranged to correspond to the openings arranged in another adjacent row.

Additionally, the contact portion is in surface contact with the connection member corresponding to the driver IC, and the opening portions are disposed closer to the display panel than the contact portion.

The display module according to the present invention includes a display panel, a guide panel disposed below the display panel and supporting the display panel, and a case top surrounding the display panel and the guide panel. A driving printed circuit board is disposed on the side or back of the guide panel, a driver IC is mounted on one side, and a connecting member that electrically connects the display panel and the driving printed circuit board is additionally included.

At this time, the case top includes a front portion that surrounds a portion of the upper surface of the display panel, and a side portion that extends from the front portion and faces the side of the guide panel. Contact portions and openings are disposed on the side surface of the case top.

As the case top includes a plurality of openings, the heat conduction path of the case top becomes longer and more complicated, making it easier to dissipate heat to the outside before it is conducted to the front of the case top. In particular, the heat dissipation effect can be further increased by the positional relationship between the contact portion and the openings provided in the case top according to the present invention and the arrangement of the openings.

Ultimately, as the heat conduction path of the case top becomes more complex, heat transfer from the contact part of the case top to the front part of the case top, which is far away, is minimized, thereby minimizing heat damage to the display panel.

According to the present invention, the heat generated from the driver IC can be quickly and effectively dissipated to the outside by using the case top as a heat dissipation member without installing a separate heat dissipation member in the display module.

In addition, according to the present invention, the heat transfer path is complicated by creating a blocking point when heat is transferred from the case top, which has the effect of slowing down the heat transfer speed.

In addition, according to the present invention, heat is easily released to the outside during the process of heat transfer along a long heat transfer path, which has the effect of suppressing an increase in the surface temperature of the case top.

In addition, according to the present invention, heat transferred to the display panel from the case top, which has a complex heat conduction path, is minimized, which has another effect of minimizing heat damage to the display panel.

Figure 1 is an exploded perspective view of a conventional display device.
Figure 2 is a cross-sectional view of a conventional display device using a case top as a heat dissipation member.
Figure 3 is an exploded perspective view of the display module according to the present invention.
Figure 4 is an enlarged view of a portion of the case top according to the present invention.
Figure 5 is a cross-sectional view of the display module according to the present invention.
Figure 6 is a side view of one embodiment of a case top according to the present invention.
Figure 7 is a side view of another embodiment of the case top according to the present invention.
Figure 8 is a side view of another embodiment of the case top according to the present invention.
Figure 9 is a side view of another embodiment of the case top according to the present invention.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the attached drawings. In the drawings, identical reference numerals are used to indicate identical or similar components.

Hereinafter, the “top (or bottom)” of the substrate or the provision or arrangement of any component on the “top (or bottom)” of the substrate means that any component is provided or disposed in contact with the upper (or lower) surface of the substrate. In addition, it is not limited to not including other components between the substrate and any components provided or disposed on (or under) the substrate.

When a component is described as being “connected,” “coupled,” or “connected” to another component, that component may be directly connected or connected to that other component, but there are no other components between each component. It should be understood that may be “interposed” or that each component may be “connected,” “combined,” or “connected” through other components.

Figure 3 is an exploded perspective view of a case top and a display module including the same according to the present invention.

The display module 200 includes a display panel 260 that displays an image, a guide panel 270 disposed below the display panel 260 and supporting the display panel 260, and a drive connected to the display panel 260. It includes a case top 280 surrounding a printed circuit board 265, a display panel 260, and a guide panel 270.

At least one connection member 263 is connected to an edge of at least one side of the display panel 260 to electrically connect the display panel 260 and the driving printed circuit board 265.

That is, one end of the connecting member 263 is connected to the display panel 260, and the other end is connected to the driving printed circuit board 265.

A driver IC 264 that applies a driving signal and a timing signal to the display panel 260 is mounted on one surface of the connection member 263.

On the driving printed circuit board 265, driving element circuits such as a timing controller that controls the driving timing of the driver IC 264 and a power supply unit that supplies power are mounted.

The connecting member 263 is preferably made of a flexible film such as a flexible printed circuit (FPC), and the type is not particularly limited.

The flexible circuit board is based on a base film, and is formed so that metal wires disposed on the base film are electrically connected to the driver IC 264.

For example, the connecting member 263 may use a chip on film (COF) or a tape carrier package (TCP).

At this time, the connecting member 263 may be comprised of a plurality, and the multiple connecting member 263 may be connected to one driving printed circuit board 265. Through this connection relationship, the display panel 260 and the plurality of driving printed circuit boards 265 can be electrically connected.

The connecting member 263 connected to one end of the display panel 260 may be folded toward the outer side of the panel guide 270 disposed below. Accordingly, the driving printed circuit board 265 connected to the connecting member 263 can be placed in close contact with the side of the guide panel 270.

Additionally, when the length of the connecting member 263 is made longer, the driving printed circuit board 265 may pass through the side of the guide panel 270 and be placed in close contact with the back of the guide panel 270.

When the connecting member 263 and the driving printed circuit board 265 are folded and come into close contact with the guide panel 270, the display panel 260 can be easily stored in the display device.

One surface of the connection member 263 on which the driver IC 264 is mounted is disposed to face the outer surface of the guide panel 270. Accordingly, the other surface of the connection member 263 on which the driver IC 264 is not mounted is arranged to face and contact the inner surface of the case top 280.

The case top 280 is arranged to surround the display panel 260, the driving printed circuit board 265 connected to the display panel 260, and the guide panel 270. The case top 280 may be connected to the guide panel 270 by a fastening member such as a screw.

However, it is sufficient if the display panel 260 and the guide panel 270 are stored in a form that does not directly contact the case top 280, and the case top 280 is connected to the display panel 260 or the guide panel 270. Direct contact with the field is not essential.

Figure 4 is an enlarged view of a portion of the case top according to the present invention shown in Figure 3, and Figure 5 is a cross-sectional view of a display module equipped with the case top according to the present invention.

The case top 280 covers the upper edge of the display panel 260 and serves to protect the display module from external shock.

The case top 280 includes a front portion 287 that surrounds a portion of the upper surface of the display panel 260, and a side portion 281 that extends from the front portion 287 and faces the side of the guide panel 270. The side portion 281 includes a contact portion 283 and a plurality of openings 282.

The front portion 287 of the case top 280 may correspond to the bezel of the display device and is preferably formed to have as narrow a width as possible.

The side portion 281 of the case top 280 extends to be bent into an 'L' shape at the border with the front portion 287.

This side portion 281 surrounds the driving printed circuit board 265 and the guide panel 270 connected to the display panel 260.

At this time, the side portion 281 of the case top 280 is in close contact with the connecting member 263 connected to the display panel 260.

The case top 280 has an overall rectangular border shape with a hollow upper surface, which may vary depending on the shape of the display panel 260.

The case top 280 may have an integrated structure in which all square edges are connected, but may also have a structure in which a straight member and a 'ㄷ' shaped member are combined.

The side portion 281 of the case top 280 includes a contact portion 283 that contacts the connecting member 263 of the display panel 260 and a plurality of rows of openings 282.

A plurality of rows are defined along the height direction of the case top 280, and a plurality of openings 282 are provided in one row. That is, a plurality of openings 282 form one row, and when these plurality of openings 282 rows are stacked to form a layer along the height direction of the case top 280, a plurality of rows of openings 282 are formed.

The connection member 263 is electrically connected to the display panel 260, and a driver IC 264 is mounted on one side. Additionally, the connecting member 263 comes into contact with the contact portion 283 provided on the side portion 281 of the case top 280.

At this time, it is preferable that the contact portion 283 of the case top 280 is in surface contact with the surface of the connecting member 263 corresponding to the driver IC 264.

Since the case top 280 made of metal has excellent thermal conductivity, heat generated in the driver IC 264 is discharged to the outside through the case top 280 in contact with the connection member 263.

If the driver IC 264 is brought into direct contact with the case top 280, physical damage may be inflicted on the driver IC 264, so the driver IC 264 is connected to the case top (264) with the connection member 263 in between. It is desirable to connect it to the contact portion 283 of 280).

That is, the connecting member 263 connected to the display panel 260 is in contact with the contact portion 283 of the case top 280, and the connecting member 263 in contact with the contact portion 283 is designed to maximize the heat dissipation effect. It is desirable that the surface corresponding to the surface on which the driver IC 264 is mounted is in surface contact.

At this time, the contact portion 283 disposed on the case top 280 may have a concave shape in the direction of the driver IC 264.

Since the contact portion 283 of the case top 280 has a concave shape, there is no need to forcefully fold the connecting member 263 when contacting the side portion 281 of the case top 280.

In addition, as the contact portion 283 has a concave shape, the heat transfer path transmitted to the case top 280 becomes longer, which has the effect of slowing down the heat conduction speed and allowing heat to be more easily discharged to the outside.

The surface where the concave-shaped contact portion 283 directly contacts the connecting member 263 is preferably provided as a flat surface with a large contact area in order to maximize the heat conduction effect.

Figure 6 is a side view of a case top according to an embodiment of the present invention.

As shown in FIG. 6, a plurality of rows of openings 282, in addition to the contact portion 283, are disposed on the side portion 281 of the case top 280. At this time, the openings 282 arranged in one row are arranged to be offset from the openings 282 arranged in another adjacent row.

The openings 282 are disposed closer to the display panel 260 than the contact portion 283, that is, closer to the front portion 287 of the case top 280.

As described above, heat generated in the driver IC 264 is transferred to the case top 280 through the contact portion 283 provided on the side portion 281 of the case top 280.

However, if the heat transferred to the case top 280 is transferred to the display panel 260 in contact with the case top 280, it may lead to damage to the display panel 260.

In other words, it is possible to obtain a heat dissipation effect for the driver IC 264 by using the case top 280 as a heat dissipation member, but another problem is that the display panel 260 is damaged due to the heat transferred to the case top 280. It could happen.

Therefore, the present invention provides a plurality of rows of openings 282 in the case top 280, and solves the existing problems through the arrangement pattern of the openings 282 and the positional relationship between the openings 282 and the contact portion 283. Make sure to minimize it.

To this end, the openings 282a and 282b arranged in adjacent rows are not arranged so that their tops and bottoms correspond to each other in the same pattern, but are arranged so that they are offset from each other in the top-bottom positional relationship.

In addition, the openings 282 are disposed closer to the display panel 260 than the contact portion 283, so that heat transmitted from the contact portion 283 is blocked by the plurality of openings 282 and the display panel 260 ), heat transfer can be minimized.

As in the present invention, due to the plurality of rows of openings 282 arranged so that only some opening areas correspond to each other, the overall heat transfer path of the case top 280 is changed so that heat is easily blocked, resulting in a heat transfer path. It becomes longer and more complicated.

When the opening areas of the openings 282 in each row are arranged to completely correspond to each other, the heat transmitted through the contact unit 283 causes the spacing areas 285a and 285b between the openings 282 to continue vertically and continuously. This reduces the heat blocking effect.

However, as in the present invention, the openings 282 arranged in different rows adjacent to each other are arranged at positions offset from each other, thereby preventing the heat transferred from the driver IC 264 from being transferred directly to the front part 287 of the case top 280. It will block it.

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This complex heat transfer path further slows down the heat conduction speed and allows heat to be dissipated to the outside while passing through the complex heat transfer path, thereby minimizing the rapid transfer of heat to the entire surface of the case top 280. .
More specifically, as shown in FIG. 6, it is preferable that the spacing portion 285a between the openings 282a arranged in the same row is arranged to correspond to the openings 282b in the adjacent row.
That is, the space 285a between the openings 282a arranged in one row is arranged to correspond to the openings 282b arranged in another adjacent row.
The first spacing portions 285a between the openings 282a arranged in the first row are arranged to correspond to the openings 282b of the adjacent second row, and pass through the first spacing portions 285a to the second row. The facing row is primarily blocked by the opening 282b of the second row.

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At this time, the heat passing through the first spacer 285a is blocked from heat transfer by the opening 285b in the second row, and the opening 285b in the second row becomes the primary heat blocking point.

The heat blocked in this way spreads to both sides along the opening 282b, thereby lengthening the heat transfer path.

While heat is transferred through this extended heat transfer path, a significant amount of heat is released to the outside.

Here, the same row does not only mean that the openings 282 are physically completely on the same line, but also exists in the same row when the opening areas of the openings 282 partially overlap along the center line of the same row. It is defined as

The openings 282 preferably have a slit shape, and the longitudinal direction of the openings 282 is preferably arranged parallel to the contact portion 283.

Since the openings 282 have a slit shape that is longer than the width, the heat transfer path is made longer.

In addition, it is desirable that the longitudinal direction of the openings 282 be arranged parallel to the contact portion 283 so that the heat transfer path is as long as possible.

Figure 7 shows another embodiment of the arrangement of the openings 282.

As shown in FIG. 7 , the openings 282 in adjacent rows are arranged to stagger each other, so that the plurality of openings 282 may have a zigzag arrangement pattern.

This zigzag pattern makes the heat transfer path more complicated and longer, which further increases the effect of lowering the surface temperature of the case top.

Figure 8 shows another embodiment of the arrangement of the openings 282.

As shown in FIG. 8, the openings 282 in adjacent rows may be arranged so that the arrangement pattern of the plurality of rows is stepped. Even in the case of such a stepped arrangement pattern, the heat transfer path becomes more complex and longer, further increasing the effect of lowering the surface temperature of the case top.

Figure 9 shows another embodiment of the case top according to the present invention, and the openings 282 may be additionally disposed in the same row as the contact portions 283.
That is, in addition to the upper side of the contact part 283, additionally disposed on the side, that is, in the same row as the contact part 283, changes the transfer path for heat escaping through the side of the contact part 283, thereby increasing the surface temperature of the case top. It can be made to deteriorate.

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Although the above description focuses on the embodiments of the present invention, various changes and modifications can be made at the level of those skilled in the art. Accordingly, it will be understood that such changes and modifications are included within the scope of the present invention as long as they do not depart from the scope of the present invention.

100: liquid crystal display device 110: cover bottom
120: reflective sheet 130: light guide plate
140: light source 150: optical film
160: liquid crystal display panel 170, 270: guide panel
180, 280: Case top 190: Backlight unit
160, 260: Display panel
161: thin film transistor substrate 162: color filter substrate
163, 263: Connection member 164, 264: Driver IC
165, 265: Driving printed circuit board
281: side part 287: front part
282: opening 283: contact part
285: Separation part

Claims (12)

In the case top surrounding the display panel,
a contact portion in contact with a connection member electrically connected to the display panel and on which a driver IC is mounted; and
openings arranged in multiple rows and multiple columns; Includes,
The openings arranged in one row are arranged to be offset from the openings arranged in another adjacent row,
The openings are disposed closer to the display panel than the contact portion,
The contact portion and the opening extend long in a first direction,
A case top wherein the length of the opening extending long in the first direction is longer than the length of the spaced portion between the plurality of openings adjacent to each other in the first direction.
In the case top surrounding the display panel,
a contact portion in contact with a connection member electrically connected to the display panel and on which a driver IC is mounted; and
multiple openings; Includes,
The openings are disposed closer to the display panel than the contact portion,
The contact portion and the opening extend long in a first direction,
A case top wherein the length of the opening extending in the first direction is longer than the length of the spaced portion between the plurality of openings adjacent to each other in the first direction.
According to paragraph 1,
A case top wherein the space between the openings arranged in one row corresponds to the openings arranged in another adjacent row.
According to paragraph 1,
A case top wherein the openings have a slit shape, and the longitudinal direction of the openings is arranged parallel to the contact portion.
According to paragraph 2,
Case top, wherein the openings are additionally disposed in the same row as the contact portion.
According to paragraph 1,
A case top wherein the contact portion is in surface contact with the connection member corresponding to the driver IC.
According to paragraph 1,
Case top, wherein the contact portion has a concave shape in the direction of the driver IC.
display panel;
a guide panel disposed below the display panel and supporting the display panel;
a driving printed circuit board disposed on a side or back of the guide panel;
A connection member on which a driver IC is mounted on one side and electrically connects the display panel and the driving printed circuit board;
And surrounding the display panel and the guide panel,
It includes a contact part in contact with the connecting member and openings arranged in multiple rows and multiple columns,
a case top where the openings arranged in one row are arranged to be offset from the openings arranged in another adjacent row;
Including,
The openings are disposed closer to the display panel than the contact portion,
The contact portion and the opening extend long in a first direction,
A display module wherein the length of the opening extending in the first direction is longer than the length of the spaced portion between the plurality of openings adjacent to each other in the first direction.
According to clause 8,
The case top is,
a front portion surrounding a portion of the upper surface of the display panel;
A display module including a side part extending from the front part and facing a side of the guide panel, wherein the contact part and the opening parts are disposed on the side part.
display panel;
a guide panel disposed below the display panel and supporting the display panel;
a driving printed circuit board disposed on a side or back of the guide panel;
A connection member on which a driver IC is mounted on one side and electrically connects the display panel and the driving printed circuit board;
And surrounding the display panel and the guide panel,
a case top including a contact portion in contact with the connecting member and a plurality of openings;
Including,
The openings are disposed closer to the display panel than the contact portion,
The contact portion and the opening extend long in a first direction,
A display module wherein the length of the opening extending long in the first direction is longer than the length of the spaced portion between the plurality of openings adjacent to each other in the first direction.
According to clause 9,
A display module, wherein the spacing between the openings arranged in one row corresponds to the openings arranged in another adjacent row.
A display device comprising the display module according to any one of claims 8 to 11.

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