KR102601334B1 - Method of forming oxide film for injection molding for mobile camera module - Google Patents
Method of forming oxide film for injection molding for mobile camera module Download PDFInfo
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- KR102601334B1 KR102601334B1 KR1020230093132A KR20230093132A KR102601334B1 KR 102601334 B1 KR102601334 B1 KR 102601334B1 KR 1020230093132 A KR1020230093132 A KR 1020230093132A KR 20230093132 A KR20230093132 A KR 20230093132A KR 102601334 B1 KR102601334 B1 KR 102601334B1
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- oxide film
- forming
- camera module
- injection
- copper plating
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- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000001746 injection moulding Methods 0.000 title claims abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910052802 copper Inorganic materials 0.000 claims abstract description 24
- 239000010949 copper Substances 0.000 claims abstract description 24
- 238000007747 plating Methods 0.000 claims abstract description 23
- 238000002347 injection Methods 0.000 claims abstract description 20
- 239000007924 injection Substances 0.000 claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims abstract description 6
- 150000002902 organometallic compounds Chemical class 0.000 claims abstract description 4
- 230000007261 regionalization Effects 0.000 claims abstract description 4
- 230000003213 activating effect Effects 0.000 claims abstract description 3
- 239000002994 raw material Substances 0.000 claims abstract description 3
- 239000000243 solution Substances 0.000 claims description 10
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 9
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 claims description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- COLNVLDHVKWLRT-QMMMGPOBSA-N L-phenylalanine Chemical compound OC(=O)[C@@H](N)CC1=CC=CC=C1 COLNVLDHVKWLRT-QMMMGPOBSA-N 0.000 claims description 3
- 239000004113 Sepiolite Substances 0.000 claims description 3
- 229940051250 hexylene glycol Drugs 0.000 claims description 3
- CXHHBNMLPJOKQD-UHFFFAOYSA-M methyl carbonate Chemical compound COC([O-])=O CXHHBNMLPJOKQD-UHFFFAOYSA-M 0.000 claims description 3
- COLNVLDHVKWLRT-UHFFFAOYSA-N phenylalanine Natural products OC(=O)C(N)CC1=CC=CC=C1 COLNVLDHVKWLRT-UHFFFAOYSA-N 0.000 claims description 3
- 229910052624 sepiolite Inorganic materials 0.000 claims description 3
- 235000019355 sepiolite Nutrition 0.000 claims description 3
- 229910000906 Bronze Inorganic materials 0.000 claims description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 239000004115 Sodium Silicate Substances 0.000 claims description 2
- 239000010974 bronze Substances 0.000 claims description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910017604 nitric acid Inorganic materials 0.000 claims description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 36
- 230000008569 process Effects 0.000 description 4
- 230000003667 anti-reflective effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000001579 optical reflectometry Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/06—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
- B05D5/061—Special surface effect
- B05D5/063—Reflective effect
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
- C23C18/204—Radiation, e.g. UV, laser
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
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Abstract
본 발명은 모바일 카메라 모듈용 사출물 산화피막 형성방법에 관한 것으로서, 사출 성형된 카메라 모듈 부품의 산화 피막 형성이 용이하게 이루어질 수 있게 되어 카메라 모듈 표면의 빛 반사를 감소시킬 수 있는 효과를 나타낸다.
이를 실현하기 위한 본 발명은, 카메라 모듈 본체를 금속유기화합물이 첨가된 사출 레진을 원료로 사출 성형하는 모듈 사출단계와; 상기 사출된 모듈 본체의 표면을 레이저로 패턴 형성하여 활성화 하는 레이저 패턴 형성단계와; 상기 패턴 형성 부위에 무전해 동도금을 실시하는 동도금 단계와; 상기 동도금 부위에 침상 구조를 이루는 산화피막층을 형성시키는 산화피막 형성단계;를 포함하는 것을 특징으로 한다.The present invention relates to a method for forming an oxide film on an injection-molded camera module. The oxide film can be easily formed on injection-molded camera module parts, which has the effect of reducing light reflection on the surface of the camera module.
The present invention for realizing this includes a module injection step of injection molding the camera module body using injection resin to which a metal organic compound is added as a raw material; A laser pattern forming step of activating the surface of the injected module body by forming a pattern with a laser; A copper plating step of performing electroless copper plating on the pattern formation area; and an oxide film forming step of forming an oxide film layer forming a needle-like structure on the copper plating area.
Description
본 발명은 카메라 모듈용 사출물 산화피막 형성방법에 관한 것으로서, 더욱 상세하게는 휴대폰 카메라 모듈 부품 중 사출물 표면의 빛 반사를 저감시키기 위한 산화피막 공정이 용이하게 이루어질 수 있도록 하기 위한 모바일 카메라 모듈용 사출물 산화피막 형성방법에 관한 것이다.The present invention relates to a method of forming an oxide film on an injection-molded product for a camera module, and more specifically, oxidation of an injection-molded product for a mobile camera module to facilitate the oxidation film process to reduce light reflection on the surface of the injection-molded product among mobile phone camera module components. It relates to the method of forming a film.
최근 스마트폰을 비롯한 휴대용 전자기기에 카메라 모듈이 기본적으로 채용되고 있다. 휴대용 전자기기는 시장의 요구에 의해 그 두께가 줄어드는 추세에 있고, 이에 따라 카메라 모듈도 소형화가 요구되고 있다.Recently, camera modules are basically used in portable electronic devices, including smartphones. The thickness of portable electronic devices is decreasing due to market demands, and accordingly, camera modules are also required to be miniaturized.
한편, 이러한 카메라 모듈 부품 중 사출물 표면의 빛 반사도를 낮춰야 하는 부품의 경우는 반사율 저감을 위해 사출이나 금속 표면에 AR(무반사)코팅을 하거나 동소재에 산화피막을 형성, 또는 사출이나 기타 금속면에 동박 테잎을 부착하여 산화피막하는 방법이 사용되고 있다.Meanwhile, among these camera module parts, in the case of parts that need to reduce the light reflectivity of the injection molded surface, AR (anti-reflective) coating is applied to the injection molded or metal surface to reduce reflectivity, or an oxide film is formed on the same material, or an oxide film is applied to the injection molded or other metal surface. A method of attaching copper foil tape and forming an oxidized film is being used.
그러나 종래 기술에서는 도장층의 보호를 위해 AR작업을 다수회 진행하게 됨으로써, 작업시간이 증대됨과 함께 이에 따른 제품 생산비용이 증가하는 문제점이 있었다.However, in the prior art, AR work was performed multiple times to protect the paint layer, resulting in increased work time and increased product production costs.
또한, 흑색 산화피막 방법의 경우 구리의 표면에만 수행될 수 있기 때문에 사출물에는 적용될 수 없는 단점을 가지고 있다.In addition, the black oxide film method has the disadvantage that it cannot be applied to injection-molded products because it can only be performed on the surface of copper.
본 발명은 상기한 종래 기술에서의 문제점을 개선하기 위해 제안된 것으로서, 카메라 모듈 사출물의 표면에 산화피막을 용이하게 형성시킬 수 있는 기술을 제공함으로써 사출 부품의 빛 반사저감 효율을 향상시킬 수 있도록 하는데 목적이 있다.The present invention was proposed to improve the problems in the prior art described above, and provides a technology that can easily form an oxide film on the surface of a camera module injection molded product, thereby improving the light reflection reduction efficiency of the injection molded part. There is a purpose.
상기 목적을 이루기 위한 본 발명의 산화피막 형성방법은, 카메라 모듈 본체를 금속유기화합물이 첨가된 사출 레진을 원료로 사출 성형하는 모듈 사출단계와; 상기 사출된 모듈 본체의 표면을 레이저로 패턴 형성하여 활성화 하는 레이저 패턴 형성단계와; 상기 패턴 형성 부위에 무전해 동도금을 실시하는 동도금 단계와; 상기 동도금 부위에 침상 구조를 이루는 산화피막층을 형성시키는 산화피막 형성단계;를 포함하는 것을 특징으로 한다.The method for forming an oxide film of the present invention to achieve the above object includes a module injection step of injection molding the camera module body using injection resin to which a metal organic compound is added as a raw material; A laser pattern forming step of activating the surface of the injected module body by forming a pattern with a laser; A copper plating step of performing electroless copper plating on the pattern formation area; An oxide film forming step of forming an oxide film layer forming a needle-like structure on the copper plating area.
이러한 본 발명의 모듈 산화피막 형성방법은, 사출 성형된 카메라 모듈 부품의 산화 피막 형성이 용이하게 이루어질 수 있게 되어 카메라 모듈 표면의 빛 반사를 현저하게 감소시킬 수 있는 효과를 나타낸다.This method of forming an oxide film on a module of the present invention facilitates the formation of an oxide film on injection molded camera module parts, which has the effect of significantly reducing light reflection on the surface of the camera module.
특히, 사출 수지에 대한 레이저 패턴형성 작업을 통한 산화피막 형성이 이루어질 수 있게 되어 생산성이 향상되는 이점을 나타낸다.In particular, the advantage of improving productivity is that an oxide film can be formed through laser patterning on the injection resin.
도 1은 본 발명의 산화피막 형성과정 순서도.
도 2는 본 발명의 일 실시 예에 따른 카메라 모듈 외관 구조도.
도 3은 본 발명의 카메라 모듈에 산화피막층이 형성된 상태도.
도 4는 본 발명의 산화피막층이 형성된 카메라 모듈 단면 구조도.
도 5는 도 4의 A부 확대 단면도.1 is a flowchart of the oxide film formation process of the present invention.
Figure 2 is an exterior structural diagram of a camera module according to an embodiment of the present invention.
Figure 3 is a state in which an oxide film layer is formed in the camera module of the present invention.
Figure 4 is a cross-sectional structural diagram of a camera module on which an oxide film layer of the present invention is formed.
Figure 5 is an enlarged cross-sectional view of part A of Figure 4.
이하, 본 발명의 구체적인 실시 예를 첨부 도면을 참조하여 상세히 살펴보기로 한다.Hereinafter, specific embodiments of the present invention will be examined in detail with reference to the accompanying drawings.
본 발명의 실시 예는 여러 가지 형태로 변형될 수 있으며, 본 발명의 범위가 아래에서 상세히 설명하는 실시 예로 한정되는 것으로 해석되어서는 안 된다. 본 실시 예는 당 업계에서 평균적인 지식을 가진 자에게 본 발명을 더욱 완전하게 설명하기 위하여 제공되는 것이다.Embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the embodiments described in detail below. This example is provided to more completely explain the present invention to those with average knowledge in the art.
따라서, 도면에서 표현한 구성요소의 형상 등은 더욱 명확한 설명을 강조하기 위해서 과장되어 표현될 수 있다. 각 도면에서 동일한 구성은 동일한 참조부호로 도시한 경우가 있음을 유의하여야 한다. 또한, 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 공지 기술의 기능 및 구성에 관한 상세한 설명은 생략될 수 있다.Accordingly, the shapes of components expressed in the drawings may be exaggerated to emphasize a clearer description. It should be noted that the same configuration may be indicated by the same reference numeral in each drawing. Additionally, detailed descriptions of the functions and configurations of known technologies that are judged to unnecessarily obscure the gist of the present invention may be omitted.
먼저, 본 발명의 일 실시 예에 따른 모바일 카메라 모듈용 사출물 산화피막 형성방법을 도 1 내지 도 5를 통해 살펴보면 다음과 같다.First, the method of forming an oxide film for an injection-molded product for a mobile camera module according to an embodiment of the present invention is as follows through FIGS. 1 to 5.
<모듈 사출단계><Module injection step>
본 실시 예에서는 폴리카본메이드 등과 같은 금속유기화합물이 첨가된 사출레진의 사출 성형을 통해 일정 형상의 카메라 모듈용 모듈 본체(10)를 사출 성형하게 된다.In this embodiment, the
즉, 이때에는 도 2에서와같이 단면이 대략 "ㄷ"형상을 이루는 가운데 카메라 렌즈가 고정될 수 있는 렌즈창(11)이 사각 형상을 이루어 관통 형성된 모듈 본체(10)의 사출이 이루어지게 된다.That is, at this time, as shown in FIG. 2, the cross-section is approximately "ㄷ" shaped, and the
<레이저 패턴 형성><Laser pattern formation>
이와 같이 성형된 모듈 본체(10)의 표면에 레이저로 패턴을 형성하는 과정을 수행하게 된다.A process of forming a pattern using a laser is performed on the surface of the
이러한 레이저 패턴 작업을 통해 모듈 본체(10) 표면에 대한 후속 동도금 공정이 용이하게 이루어질 수 있도록 활성화 되어지게 된다.Through this laser pattern work, the subsequent copper plating process on the surface of the
<동도금><Copper plating>
이후, 상기 활성화가 이루어진 부위에 무전해 동도금을 입히는 동도금 단계를 실시하게 된다.Afterwards, a copper plating step is performed in which electroless copper plating is applied to the activated area.
즉, 이때에는 렌즈창(11) 주변 부위를 포함하여 내면과 외면의 레이저 패턴 형성 부위에 무전해 동도금이 입혀지면서 동도금층이 박막으로 형성될 수 있게 된다. 동도금에는 인청동이 사용될 수 있다.That is, at this time, electroless copper plating is applied to the laser pattern forming area on the inner and outer surfaces, including the area around the
<산화피막 형성><Formation of oxide film>
그리고, 동도금의 형성이 완료되면 해당 부위에 대한 산화피막층(20)을 형성시키는 작업을 실시하게 된다.Then, when the formation of copper plating is completed, the work of forming the
즉, 이때에는 동도금이 형성된 모듈 본체(10)를 강 알칼리성의 산화피막 용액에 투입하게 되면, 동도금에 불균일한 침상 구조를 이루는 산화피막층(20)이 형성되어지게된다.That is, at this time, when the
이러한 산화피막 형성단계에서의 산화피막 용액은 수산화나트륨 25~40중량%, 규산나트륨 10~30중량%, 질산 1~10중량%, 이산화티타늄 5~20중량%, 에틸렌글리콜 5~20중량%, 디메틸포름아미드 10~20중량%, 헥실렌글리콜 1~15중량%의 비율로 혼합 조성을 이룸이 바람직하다.The oxide film solution in this oxide film formation step is 25-40% by weight of sodium hydroxide, 10-30% by weight of sodium silicate, 1-10% by weight of nitric acid, 5-20% by weight of titanium dioxide, 5-20% by weight of ethylene glycol, It is preferable to have a mixed composition of 10 to 20% by weight of dimethylformamide and 1 to 15% by weight of hexylene glycol.
또한, 산화피막의 균질성 향상을 위해서 페닐알라닌사하이드록시라제, 세피올라이트 및 메틸 카보네이트 성분이 각각 1~5중량%의 비율로 추가 첨가됨이 바람직하다.In addition, in order to improve the homogeneity of the oxide film, it is preferable that phenylalanine tetrahydroxylase, sepiolite, and methyl carbonate components are each added in an amount of 1 to 5% by weight.
이와 같은 혼합 조성을 이루는 산화피막 용액에 모듈 본체(10)를 일정시간 침지시키게 되면, 동도금의 표면이 산화되면서 미세한 침상 구조의 산화피막층(20)이 형성되어질 수 있게 된다.When the
특히, 산화피막 용액에는 디메틸포름아미드 및 헥실렌글리콜 성분이 혼합되어 있기 때문에 이물질의 동도금 점착을 방지함과 함께 용액의 점도 조절을 통한 전체적으로 피막층의 안정성을 향상시킬 수 있게 된다.In particular, since dimethylformamide and hexylene glycol components are mixed in the oxide film solution, it is possible to prevent foreign substances from adhering to the copper plating and improve the overall stability of the film layer by controlling the viscosity of the solution.
또한, 산화피막 용액의 기능성 향상을 위해 추가로 첨가된 조성물 중 페닐알라닌사하이드록시라제 및 세피올라이트는 산화피막층(20)의 내부식성을 향상시킴과 함께 뭉침이나 벗겨짐 탈락 현상을 방지하는 기능을 수행하게 되며, 메틸 카보네이트는 용액에서의 기포 발생을 억제하여 피막 품질을 향상시키는 진보된 작용효과를 나타내게 된다.In addition, among the compositions additionally added to improve the functionality of the oxide film solution, phenylalanine sahydroxylase and sepiolite improve the corrosion resistance of the
따라서 본 발명의 모듈 산화피막 형성방법은, 사출 성형된 카메라 모듈 부품의 산화 피막 형성이 용이하게 이루어질 수 있게 되어 카메라 모듈 표면의 빛 반사를 감소시킬 수 있는 효과를 나타낸다.Therefore, the module oxide film forming method of the present invention allows the oxide film to be easily formed on injection molded camera module parts, which has the effect of reducing light reflection on the camera module surface.
특히, 사출 수지에 대한 레이저 패턴형성 작업을 통한 산화피막 형성이 이루어질 수 있게 되어 생산성이 향상되는 이점을 나타낸다.In particular, the advantage of improving productivity is that an oxide film can be formed through laser patterning on the injection resin.
그리고, 상기에서 본 발명의 특정한 실시 예가 설명 및 도시되었지만 본 발명의 산화피막 형성방법이 당업자에 의해 다양하게 변형되어 실시될 수 있음은 자명한 일이다. In addition, although specific embodiments of the present invention have been described and shown above, it is obvious that the method of forming an oxide film of the present invention can be implemented in various modifications by those skilled in the art.
예를 들면, 상기 실시 예에서는 카메라 모듈의 특정 부품이 제시되었으나, 본 발명의 기술은 카메라 모듈 부품 중 빛 반사도를 낮춰야 하는 다양한 부품에 적용될 수 있게 된다.For example, in the above embodiment, specific parts of the camera module were presented, but the technology of the present invention can be applied to various parts of the camera module that require lower light reflectivity.
따라서 이와 같은 변형된 실시 예들은 본 발명의 기술적 사상이나 범위로부터 개별적으로 이해되어져서는 안되며, 이와 같은 변형된 실시 예들은 본 발명의 첨부된 특허청구범위 내에 포함된다 해야 할 것이다.Therefore, such modified embodiments should not be understood individually from the technical spirit or scope of the present invention, and such modified embodiments should be included within the scope of the appended claims of the present invention.
10 : 모듈 본체 11 : 렌즈창
20 : 산화피막층10: module body 11: lens window
20: Oxide layer
Claims (5)
상기 사출된 모듈 본체의 표면을 레이저로 패턴 형성하여 활성화 하는 레이저 패턴 형성단계와;
상기 패턴 형성 부위에 무전해 동도금을 실시하는 동도금 단계와;
상기 동도금 부위에 침상 구조를 이루는 산화피막층을 형성시키는 산화피막 형성단계;를 포함하고,
상기 산화피막 형성단계에서는 동도금이 형성된 모듈 본체를 강 알칼리성의 산화피막 용액에 투입하여 산화피막층을 형성시키며,
상기 산화피막 용액은 수산화나트륨, 규산나트륨, 질산, 이산화티타늄, 에틸렌글리콜, 디메틸포름아미드, 헥실렌글리콜의 혼합 조성을 이루는 것을 특징으로 하는 모바일 카메라 모듈용 사출물 산화피막 형성방법.
A module injection step of injection molding the camera module body using injection resin to which a metal organic compound is added as a raw material;
A laser pattern forming step of activating the surface of the injected module body by forming a pattern with a laser;
A copper plating step of performing electroless copper plating on the pattern formation area;
It includes an oxide film forming step of forming an oxide film layer forming a needle-like structure on the copper plating area,
In the oxide film formation step, the module body on which copper plating is formed is put into a strongly alkaline oxide film solution to form an oxide film layer.
A method of forming an injection-molded oxide film for a mobile camera module, wherein the oxide film solution is a mixture of sodium hydroxide, sodium silicate, nitric acid, titanium dioxide, ethylene glycol, dimethylformamide, and hexylene glycol.
상기 산화피막 용액에는 페닐알라닌사하이드록시라제, 세피올라이트 및 메틸 카보네이트 성분이 추가로 첨가된 것을 특징으로 하는 모바일 카메라 모듈용 사출물 산화피막 형성방법.
In claim 1,
A method of forming an oxide film for an injection molded product for a mobile camera module, characterized in that phenylalanine tetrahydroxylase, sepiolite, and methyl carbonate components are additionally added to the oxide film solution.
상기 동도금은 인청동이 사용된 것을 특징으로 하는 모바일 카메라 모듈용 사출물 산화피막 형성방법.
In claim 1,
A method of forming an injection molded oxide film for a mobile camera module, characterized in that phosphor bronze is used for the copper plating.
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| JP2840471B2 (en) * | 1990-03-22 | 1998-12-24 | キヤノン株式会社 | Method of manufacturing conductive cover |
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