KR102600568B1 - Electrode structure, electrode array and bodyimplantable device including the same - Google Patents

Abstract

Examples include housing; a plurality of first contact electrodes exposed to the outside of the housing; a plurality of second contact electrodes exposed to the outside of the housing; a first wiring group disposed inside the housing and electrically connected to the first contact electrode; and a second wiring group disposed inside the housing and electrically connected to the second contact electrode, wherein the plurality of first contact electrodes and the first wiring group are disposed on different planes within the housing. An electrode array is disclosed.

Description

Electrode array and bioimplantable device including same {ELECTRODE STRUCTURE, ELECTRODE ARRAY AND BODYIMPLANTABLE DEVICE INCLUDING THE SAME}

Embodiments relate to electrode arrays and bioimplantable devices including the same.

Many medical devices are being developed to help people who have lost certain functions congenitally or acquired. As such medical devices, human implant devices including neural assist devices are also being developed.

The Cochlear Implant device, which is one of the human implant devices and helps people with functional auditory nerves to detect sound by electrically stimulating the auditory nerve, is recognized as the most efficient neural assistive device developed to date. , the number of cochlear implant surgeries is increasing every year.

A cochlear implant device may include an external device provided outside the body and an internal device provided inside the body.

The external device functions to receive sound from outside the human body and convert it into an electrical signal, and may consist of a microphone (speaker), a sound processor (language synthesizer), and a transmission antenna (transmitter). At this time, the microphone and transmission antenna may be combined into a headset.

The internal device functions to stimulate the auditory nerve from signals transmitted from an external device and may be composed of a receiver and electrodes for reception and stimulation.

A cochlear implant device converts the sound signal transmitted to a microphone attached to the outside of the human body into an electrical signal through amplification and filtering processes in an external sound processor, without passing through the eardrum or ossicles, and uses an electrode implanted in the cochlea to convert the sound signal into an electrical signal. It can be transmitted through the auditory nerve fibers.

However, existing electrodes have the problem of increased cost and time, and low yield because they involve manual resistance welding and silicon molding of platinum electrodes and wires. Additionally, since electrodes and wires are resistance welded manually, there is a limit to increasing the number of electrodes.

US Patent Application Publication No. US2006/0089700

Embodiments may provide an electrode array that is easy to manufacture and a bioimplantable device including the same.

In addition, an electrode array with an increased number of electrodes per unit length and a bioimplantable device including the same can be provided.

The problem to be solved in the embodiment is not limited to this, and also includes purposes and effects that can be understood from the means of solving the problem or the embodiment described below.

An electrode structure according to an embodiment includes a contact electrode unit including a plurality of contact electrodes, a plurality of first wires, and a plurality of connection wires connecting the plurality of contact electrodes and the plurality of first wires; a pad portion including a plurality of pads and a plurality of second wires connected to the plurality of pads; and a plurality of third wires connecting the plurality of first wires and the plurality of second wires, and a connecting portion disposed between the contact electrode portion and the pad portion. The plurality of third wiring lines extend in the first direction.

The plurality of second wires may be bent at a predetermined angle from the plurality of third wires in a second direction perpendicular to the first direction.

The plurality of first to third wirings include a first wiring group and a second wiring group that are adjacent to each other. A gap in the second direction between the first wiring group and the second wiring group may be greater in the connection portion than in the contact electrode portion and the pad portion, and the second direction may be perpendicular to the first direction.

The connection part may include a folding part, and the folding part may include a space formed by a pattern in which the first wiring group and the second wiring group are spaced apart.

The plurality of contact electrodes may be arranged to be spaced apart from each other along the first direction.

The plurality of connection wires may include a wave pattern.

The plurality of contact electrodes, the plurality of first wires, the plurality of connection wires, the pad, the plurality of second wires, and the plurality of third wires may be integrated.

An electrode array according to an embodiment includes the electrode structure; a first housing including a first groove extending in the first direction; a second housing extending from the first housing and having a second groove; and a cover film that covers the first groove and the second groove and has a plurality of electrode holes, wherein the electrode structure is folded around the folding portion and the contact electrode portion and the connection portion are disposed in the first groove, The pad portion is disposed in the second groove, the plurality of contact electrodes and the plurality of first wires overlap with an insulating film therebetween, and each of the plurality of electrode holes exposes each of the plurality of contact electrodes.

A thickness of the first housing in the third direction may be inversely proportional to the distance from the second housing, and the third direction may be perpendicular to the first direction and the second direction.

The thickness of the first housing in the second direction may be inversely proportional to the distance from the second housing.

The first housing, second housing, and cover film may be integrated.

An electrode array according to another embodiment includes the electrode structure; a first housing including a first groove extending in the first direction; a second housing extending from the first housing and having a second groove; a cover film covering the first groove and the second groove and having a plurality of electrode holes; and an insulating film surrounding the electrode structure and exposing the contact electrode, wherein the electrode structure is alternately folded into in-folding and out-folding with respect to a first line to an n-1 line, wherein the contact electrode portion and the The connection portion is disposed in the first groove, the pad portion is disposed in the second groove, each of the plurality of electrode holes exposes each of the plurality of contact electrodes, and the first to n-1th lines are connected to the plurality of contact electrodes. The electrode structure is divided into n regions (n is an integer of 2 or more) along the second direction, and each region extends in the first direction.

An electrode array according to another embodiment includes the electrode structure; and an insulating film surrounding the electrode structure and exposing the contact electrode, wherein the electrode structure is folded in a direction in which the contact electrode is exposed around a reference line dividing the electrode structure in a second direction, and the folded The electrode structure is bent into a cylindrical shape with the contact electrode exposed on the outer peripheral surface and supported by a core bundle disposed inside, and the second direction is perpendicular to the first direction.

The core bundle may include a coil spring.

The plurality of third wires may include a wave pattern.

An electrode array according to another embodiment includes a first electrode structure; and a second electrode structure disposed on the first electrode structure, wherein the first electrode structure includes a plurality of first contact electrodes, a plurality of 1-1 wires, and a plurality of first contact electrodes and a plurality of first contact electrodes. A first contact electrode unit including a plurality of first connection wires connecting the 1-1 wires of; A first pad portion including a plurality of first pads and a plurality of 2-1 wires connected to the plurality of first pads, and connecting the plurality of 1-1 wires and the plurality of 2-1 wires. It includes a plurality of 3-1 wires, and includes a first connection part disposed between the first contact electrode part and the first pad part, wherein the plurality of 1-1 wires and the plurality of 3-1 wires are Extending in a first direction, the second electrode structure includes a plurality of second contact electrodes, a plurality of first-2 wires, and a plurality of plurality of second contact electrodes and a plurality of first-2 wires. a second contact electrode unit including a second connection wire; A second pad portion including a plurality of second pads and a plurality of 2-2 wires connected to the plurality of second pads, and connecting the plurality of 1-2 wires and the plurality of 2-2 wires. It includes a plurality of 3-2 wires, and a second connection part disposed between the second contact electrode part and the second pad part, wherein the plurality of 1-2 wires and the plurality of 3-2 wires are It extends in the first direction, the first contact electrode portion is folded around a reference line dividing the first contact portion in the second direction, and the second contact electrode portion divides the second contact portion in the second direction. It is folded around the reference line.

The plurality of first contact electrodes of the first electrode structure and the plurality of second contact electrodes of the second electrode structure may be arranged to be offset in the vertical direction.

a first housing including a first groove extending in the first direction; a second housing extending from the first housing and having a second groove; a cover film covering the first groove and the second groove and having a plurality of electrode holes; an insulating film surrounding the first electrode structure and exposing the first contact electrode; and an insulating film surrounding the second electrode structure and exposing the second contact electrode, wherein the first contact electrode portion, the first connection portion, the second contact electrode portion, and the second connection portion are formed in the first groove. The first pad portion and the second pad portion may be disposed within the second groove.

At least a portion of the plurality of 3-1 wires and the plurality of 3-2 wires overlap in the third direction, and the plurality of first contact electrodes and the plurality of second contact electrodes are within the first groove. may be adjacent to each other in the first direction and may not overlap each other in the third direction.

The plurality of 3-1 wires and the plurality of 3-2 wires may include a wave pattern.

According to an embodiment, the electrode structure is manufactured by patterning electrodes and wires using a laser, and the electrode array is formed by folding the electrode structure, so ease of manufacturing can be improved.

Additionally, the number of electrodes disposed per unit length increases.

The various and beneficial advantages and effects of the embodiments are not limited to the above-described content, and may be more easily understood in the process of explaining specific embodiments of the present invention.

1 is a conceptual diagram of an implantable device according to an embodiment.
Figure 2 is an exemplary diagram showing the second unit of the implantable device according to one embodiment applied to the human body.
Figure 3 is a diagram showing an electrode array according to the first embodiment.
Figure 4 is an enlarged view of X in Figure 3.
Figure 5 is an enlarged view of A in Figure 4.
Figure 6 is a view taken along the cutting line I-I' in Figure 5.
Figure 7 is a schematic diagram showing a cross section of the pad portion in Figure 3.
Figure 8 is a side view of Figure 4.
FIG. 9 is an enlarged view of the contact electrode portion disposed inside the cochlea in FIG. 2.
Figure 10 is a diagram showing an electrode structure according to one embodiment.
Figure 11 is an enlarged view of B in Figure 10.
FIG. 12 is an enlarged view of C in FIG. 10.
Figure 13 is an enlarged view of D in Figure 10.
Figure 14 is a plan view showing the substrate and the conductive material disposed on the substrate.
15 is a cross-sectional view showing the substrate and the conductive material disposed on the substrate.
Figure 16 is a diagram showing the process of forming an electrode structure by patterning a conductive material disposed on a substrate.
Figure 17 is a cross-sectional view showing the process of forming an electrode structure by patterning a conductive material disposed on a substrate.
Figure 18a is a rear view showing the folding guide groove and alignment hole formed on the back of the substrate.
Figure 18b is a front view of Figure 18a.
Figure 19 is a cross-sectional view of Figure 18b.
Figure 20 is a cross-sectional view showing the process of applying an insulating material on a substrate and an electrode structure.
Figure 21 is a cross-sectional view showing the substrate and electrode structure being folded.
Figure 22 is a cross-sectional view showing the electrode structure with the substrate removed.
Figure 23 is a cross-sectional view showing a housing formed on the electrode structure from which the substrate has been removed.
Figure 24 is a diagram showing an electrode structure according to a second embodiment.
25A and 25B are diagrams showing an electrode structure according to a third embodiment.
Figure 26 is a diagram showing the process of stacking the first electrode structure and the second electrode structure.
Figure 27 is a diagram showing an electrode structure according to the fourth embodiment.
Figure 28 is a diagram showing the process of manufacturing an electrode array according to the fourth embodiment.
Figure 29 is a diagram showing an electrode array according to the fourth embodiment.
Figure 30 is a diagram showing an electrode array according to the fifth embodiment.
Figure 31 is a diagram showing an embodiment of a contact electrode.
Figure 32 is a diagram showing a contact electrode coated with an insulating material.
Figure 33 is a cross-sectional view taken along the cutting line III-III' of Figure 32.
Figure 34 is a diagram showing another embodiment of a contact electrode.
Figure 35 is a diagram showing another embodiment of a contact electrode.
Figure 36 is a diagram showing another embodiment of a contact electrode.
Figure 37 is a diagram showing the first electrode structure of the electrode array according to the sixth embodiment.
Figure 38 is a cross-sectional view taken along the AA direction of Figure 37.
Figure 39 is a cross-sectional view taken along BB in Figure 37.
Figure 40 is a diagram showing the second electrode structure of the electrode array according to the sixth embodiment.
Figure 41 is a diagram showing the second electrode structure in a folded state based on an imaginary line.
Figure 42 and Figure 41 are cross-sectional views in the CC direction.
Figure 43 is a diagram showing a state in which the second electrode structure is separated from the substrate.
Figure 44 is a diagram showing a state in which the second electrode structure is stacked on the first electrode structure.
Figure 45 is a diagram showing the first electrode structure in a folded state based on an imaginary line.
FIG. 46A is a cross-sectional view in the FF direction of FIG. 45.
Figure 46b is a cross-sectional view in the GG direction of Figure 46.
Figure 47 is a diagram showing an electrode array according to the sixth embodiment.
FIG. 48A is a cross-sectional view in the HH direction of FIG. 47.
FIG. 48B is a cross-sectional view in direction II of FIG. 47.

Since the present invention can be subject to various changes and can have various embodiments, specific embodiments will be illustrated and described in the drawings. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all changes, equivalents, and substitutes included in the spirit and technical scope of the present invention.

Terms containing ordinal numbers, such as second, first, etc., may be used to describe various components, but the components are not limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, the second component may be referred to as the first component without departing from the scope of the present invention, and similarly, the first component may also be referred to as the second component. The term and/or includes any of a plurality of related stated items or a combination of a plurality of related stated items.

When a component is said to be "connected" or "connected" to another component, it is understood that it may be directly connected to or connected to the other component, but that other components may exist in between. It should be. On the other hand, when it is mentioned that a component is “directly connected” or “directly connected” to another component, it should be understood that there are no other components in between.

The terms used in this application are only used to describe specific embodiments and are not intended to limit the invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, terms such as “comprise” or “have” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are not intended to indicate the presence of one or more other features. It should be understood that this does not exclude in advance the possibility of the existence or addition of elements, numbers, steps, operations, components, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the technical field to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and unless explicitly defined in the present application, should not be interpreted in an ideal or excessively formal sense. No.

Hereinafter, embodiments will be described in detail with reference to the attached drawings, but identical or corresponding components will be assigned the same reference numbers regardless of reference numerals, and duplicate descriptions thereof will be omitted.

1 is a conceptual diagram of an implantable device according to an embodiment. Figure 2 is an exemplary diagram showing the second unit of the implantable device according to one embodiment applied to the human body.

Referring to FIGS. 1 and 2 , an implantable device 1 according to an embodiment may include a first unit 100 and a second unit 200 that can communicate with each other. Hereinafter, the Cochlear Implant System, one of the implantable devices, will be described as an example. However, the examples are not limited to this. By way of example, the second unit 200 may be a device that provides electrical signals to other organs or organs of the human body.

The first unit 100 may convert a sound signal into an electrical signal and provide it, and may include a first coil 140 for supplying power. The first unit 100 may be placed on the outside of the skin. That is, the first unit 100 may be an extracorporeal device that is installed outside the body rather than being implanted into the body.

The first unit 100 may include a transmitting unit 110, a voice processing unit 120, a transmitting unit 130, and a first coil 140.

The transmitting unit 110 can detect external sound signals. The sound signal may include a voice signal or an acoustic signal. The transmitting unit 110 may be selected from various electronic devices capable of detecting sound signals. In one embodiment, the talking unit 110 may be a microphone, but is not limited thereto. The transmitting unit 110 may include a volume control unit that adjusts the volume of the received sound signal.

The voice processing unit 120 may receive a sound signal detected by the speaking unit 110 and convert it into an electrical signal. The voice processing unit 120 may include a speech processor.

The transmitter 130 may receive and transmit an electrical signal from the voice processor 120. The first coil 140 can supply power. However, it is not necessarily limited to this, and the transmitter 130 may be omitted. That is, the first unit 100 may not include a separate transmitter 130. In this case, the first unit 100 may receive an electrical signal from the voice processing unit 120 and transmit the electrical signal to the second unit 200 along with power transmission through the first coil 140.

The first unit 100 may include a power supply unit (not shown). The power supply unit is configured to supply power to the first unit 100 and may include a replaceable battery or a rechargeable battery.

The power unit may receive power from an external source and store power. For example, the power supply unit may include a capacitive element such as a capacitor. The capacitive element may receive power wired from an external power source and store it, or may receive power wirelessly from an external power source through the first coil 140 of the first unit 100.

For example, in the charging mode, the first coil 140 wirelessly receives power from the coil of an external power source through electromagnetic induction and stores it in the capacitive element, and in the transmission mode, the first coil 140 transfers the power of the capacitive element to the second unit ( It may also be transmitted wirelessly to the second coil 210 of 200).

At this time, the transmission of power through the coil may use electromagnetic induction phenomenon, but is not limited to this, and other types of wireless power transmission technology may be used.

The second unit 200 may be an internal implant inserted into the skin. In one embodiment, the second unit 200 may be inserted into the subcutaneous fat layer, but is not limited thereto.

The second unit 200 may receive an electrical signal from the first unit 100 and stimulate the auditory nerve fibers within the cochlea 10.

The second unit 200 includes a receiving unit 220, a circuit unit 230 that processes the signal received from the first unit 100 to generate a stimulation signal, and a current signal according to the stimulation signal transmitted from the circuit unit 230. It may include an electrode array 1000 having a plurality of electrodes (not shown) that stimulate auditory nerve fibers within the cochlea 10.

The receiving unit 220 may receive a signal from the first unit 100. For example, the receiving unit 220 may include a second coil 210 that receives a signal along with power through the first coil 140. When transmitting power, the first coil 140 of the first unit 100 may transmit a data signal for electrical stimulation together with the power signal. For example, the first coil 140 may transmit a data signal by varying the amplitude or phase of the power signal.

Alternatively, the receiving unit 220 may directly receive a signal from the transmitting unit 130 of the first unit 100. The transmitting unit 130 and the receiving unit 220 may communicate through various communication technologies that are not limited to a specific communication technology. Additionally, the data signal may be communicated separately from the power signal through a separate communication means or a separate frequency not described above.

The circuit unit 230 may process the electrical signal received from the receiver 220 to generate a stimulation signal. The circuit unit 230 may have an integrated circuit (IC) for generating a stimulation signal. The circuit unit 230 performs various functions necessary for normal operation of the bioimplantable device 1, such as signal processing and communication, and may be composed of one or more function modules.

Additionally, the circuit unit 230 may include a terminal electrically connected to one end of the electrode array 1000, and may transmit a signal (e.g., current, voltage, etc.) toward the circuit unit 230 or the electrode array 1000 through the terminal. This can be provided.

The electrode array 1000 may have a structure in which a plurality of electrodes (not shown) are disposed on an insulating layer. The electrode array 1000 may be formed to be thin enough to be inserted into the human body's cochlea 10. The electrode array 1000 transmits the stimulation signal generated in the circuit unit 230 to the cochlea 10, and the stimulation signal can stimulate the auditory nerve of the cochlea 10. A user of the bioimplantable device 1 can detect external sounds through stimulation of the auditory nerve.

Figure 3 is a diagram showing an electrode array according to an embodiment. FIG. 4 is an enlarged view of X in FIG. 3. Figure 5 is an enlarged view of A in Figure 4. Figure 6 is a view taken along the cutting line I-I' in Figure 5. Figure 7 is a schematic diagram showing a cross section of the pad portion in Figure 3. Figure 8 is a side view of Figure 4.

Hereinafter, an electrode array according to an embodiment will be described with reference to FIGS. 3 to 8.

Referring to FIG. 3, the electrode array 1000 according to the embodiment includes a first housing 1100, a second housing 1200, and an electrode structure disposed in the first housing 1100 and the second housing 1200 ( (not shown) may be included. Below, the overall configuration of the electrode array 1000 will be described, and a detailed description of the electrode structure will be provided later.

Referring to FIGS. 3 to 6 , a plurality of wires 1701, 1703, and 1704 and a plurality of contact electrodes 1801 may be disposed in the first housing 1100. More specifically, the first housing 1100 may include a first groove 1110. A plurality of wires 1701, 1703, and 1704 and a plurality of electrodes 1801 may be disposed in the first groove 1110.

The contact electrode 1801 may be exposed to the outside of the electrode array. More specifically, the first housing 1100 covers the first wiring 1701, the third wiring 1703, the connection wiring 1704, and the contact electrode 1801 disposed on the first groove 1110. 1 May include a cover film 1301. The first cover film 1301 may include a plurality of electrode holes 1310 that expose at least a portion of the plurality of contact electrodes 1801. In one embodiment, the plurality of electrode holes 1310 may be matched one-to-one with the plurality of contact electrodes 1801 to expose one first electrode 1801 per electrode hole 1310, but this is not limited. no.

The electrode hole 1310 serves as an entrance for the collected biosignals when the bioimplantable device 1 collects biosignals, and when the bioimplantable device 1 transmits biostimulation signals to the living body, the electrode hole 1310 serves as an inlet for biostimulation signals. It can be an exit for. There may be a plurality of electrode holes 1310, and the number may be the same as the number of terminals of the circuit unit 230, but the number is not limited thereto. Additionally, as described above, the number of electrode holes 1310 may be the same as the number of contact electrodes 1801, but is not limited thereto. The number of electrode holes 1310 can be appropriately adjusted as needed.

When the bioimplantable device 1 is inserted into the cochlea, the exposed plurality of contact electrodes 1801 may contact auditory nerve fibers. The contact electrode 1801 in contact with the auditory nerve fiber can transmit an external signal to the auditory nerve fiber or, conversely, can transmit a signal from the auditory nerve fiber to the outside. However, this is an example, and as described above, the bioimplantable device according to the embodiment can be implanted and used in other body parts. Since the plurality of contact electrodes 1801 are in contact with the living body, they may be made of a material that is not harmful to the living body. For example, the plurality of contact electrodes 1801 may include platinum iridium (ptIr), but are not limited thereto.

Figure 7 (a) is a diagram showing the second housing, (b) is a diagram showing a plurality of second wires and a plurality of pads disposed in the second groove of the second housing, and (c) is a diagram showing the second housing. 2 This is a drawing showing the cover film covering the housing.

Referring to FIG. 7 , a plurality of second wirings 1702 and a plurality of pads 1802 may be disposed in the second housing 1200. More specifically, the second housing 1200 may include a second groove 1120. A plurality of second wires 1702 and a plurality of pads 1802 may be disposed in the second groove 1120. A second cover film 1302 may be disposed on the second groove 1120 where the plurality of second wires 1702 and the plurality of pads 1802 are disposed. That is, the second cover film 1302 may cover the second groove 1120.

The second cover film 1302 may be disposed on the second groove 1120 of the second housing 1200 and cover all or part of the pad 1802 disposed inside the second groove. The pad 1802 may be connected to the circuit portion 230 disposed on the second housing 1200. There is no limitation on the way the pad 1802 and the circuit unit 230 are connected. In one embodiment, a contact hole may be formed in the second housing 1200, and connection may be made using this, or connection may be made using feed-through.

The circuit unit 230 transmits an electrical signal to the connected pad 1802, and the pad 1802 is sequentially connected to the second wire 1702, the third wire 1703, the first wire 1701, and the connection wire 1704. ), and an electrical signal can be transmitted to the auditory nerve fibers through the contact electrode 1801. In addition, in the opposite mechanism, biological signals are transmitted through the contact electrode 1801, the connection wire 1704, the first wire 1701, the third wire 1703, the second wire 1702, and the pad 1802 to the circuit unit 230. ) can be provided. These electrical signals may be electrical signals necessary for the operation of the implantable device 1.

The first housing 1100, the second housing 1200, and the cover films 1301 and 1302 may be formed integrally. That is, the first housing 1100, the second housing 1200, and the cover films 1301 and 1302 may include the same insulating material. Additionally, since the first housing 1100, the second housing 1200, and the cover films 1301 and 1302 may come into contact with the living body, they may be made of a material that is not harmful to the living body.

For example, the insulating material may include a silicone elastomer. The insulating material can prevent unwanted shorts from occurring between the contact electrode 1801, the pad 1802, and the wires 1701, 1702, 1703, and 1704, and prevent unnecessary damage from the outside. It can block the inflow of electrical signals.

In one embodiment, referring to FIGS. 6 and 7 , an insulating material may be disposed between the contact electrode 1801 and the first wiring 1701 to serve as an insulating film. That is, in FIGS. 6 and 7, the interior of the first groove 1110 may be filled with an insulating material. Likewise, the interior of the second groove 1120 may also be filled with an insulating material. At the same time, a housing (1100, 1200).

Referring to FIGS. 3, 4, and 8, the thickness of the electrode array 1000 according to the embodiment may become smaller as it moves away from the second housing 1200. The thickness is the length in the third direction, that is, the z-direction. More specifically, the size of the first housing 1100 in the third direction according to the embodiment may be inversely proportional to the distance from the second housing 1200. In other words, as the first housing 1100 is located further away from the second housing 1200 in the first direction, its thickness may gradually decrease. However, it is not necessarily limited to this, and the thickness of the first housing 1100 in the first direction may be the same.

Additionally, the width of the electrode array 1000 according to the embodiment may become smaller as the width increases from the second housing. The width is the length in the second direction, that is, the y direction. More specifically, the size of the first housing 1100 in the second direction according to the embodiment may be inversely proportional to the distance from the second housing 1200. In other words, as the first housing 1100 is located further away from the second housing 1200 in the first direction, its width may gradually decrease. However, it is not necessarily limited to this, and the width of the first housing 1100 in the first direction may be the same.

The reason why the width and thickness of the first housing 1100 are inversely proportional to the distance from the second housing 1200 will be explained with reference to FIGS. 2 and 9.

FIG. 9 is an enlarged view of the contact electrode portion disposed inside the cochlea in FIG. 2.

Referring to FIGS. 2 and 9 , when the electrode array according to the embodiment is implanted into a living body, it may be banded and implanted so that the contact electrode 1801 and nerves can be properly connected depending on the body part to be implanted. For example, in order for the bioimplantable device 1 according to the embodiment to be implanted into the cochlea 10, it needs to be bent to fit the shape of the cochlea 10 before being implanted. Therefore, it may be advantageous for the first housing 1100, where the electrode to be connected to the body is located, to be flexible.

To increase the flexibility of the electrode array 1000 according to the embodiment, a flexible material can be used. In addition, if the width and thickness of the first housing 1100 are formed to be inversely proportional to the distance from the second housing 1200, the flexibility of the electrode array 1000 can be further increased.

Hereinafter, the basic shape and structure of the electrode structure disposed within the electrode array according to the embodiment will be described with reference to FIGS. 10 to 13.

Figure 10 is a diagram showing an electrode structure according to one embodiment. Figure 11 is an enlarged view of part B in Figure 10. Figure 12 is an enlarged view of part C in Figure 10. Figure 13 is an enlarged view of part D in Figure 10.

Referring to FIGS. 10 to 13 , the electrode structure 1500 according to the embodiment may include a contact electrode portion 1601, a pad portion 1602, and a connection portion 1603.

The contact electrode unit 1601 may be an area where a plurality of contact electrodes 1801, a plurality of first wires 1701, and a plurality of connection wires 1704 are disposed. The pad portion 1602 may be an area where a plurality of pads 1802 and a second wire 1702 are disposed. The connection portion 1603 may be an area where a plurality of third wires 1703 are disposed and the folding portion 1400 is located.

The contact electrode 1801, the pad 1802, the first wire 1701, the second wire 1702, the third wire 1703, and the connection wire 1704 may be integrated. In other words, the contact electrode 1801, the pad 1802, the first wire 1701, the second wire 1702, the third wire 1703, and the connection wire 1704 may all be connected.

That is, the contact electrode 1801 is connected to the connection wire 1704, the connection wire 1704 is connected to the first wire 1701, the first wire 1701 is connected to the third wire 1703, The third wire 1703 is connected to the second wire 1702, and the second wire 1702 is connected to the pad 1802 to form an integrated structure.

The contact electrode 1801, the pad 1802, the first wire 1701, the second wire 1702, the third wire 1703, and the connection wire 1704 are formed as one piece and can be made of the same material. . For example, the contact electrode 1801, the pad 1802, the first wire 1701, the second wire 1702, the third wire 1703, and the connection wire 1704 may include a conductive material, In one embodiment, it may include platinum iridium (PtIr).

The folding portion 1400 is located within the connecting portion 1603 and may be a reference area for folding the electrode structure 1500. In one embodiment, the folding part 1400 may be a space that passes through the center of the connecting part 1603 and extends in the first direction, that is, the longitudinal direction. However, it is not limited to this, and the folding portion 1400 may not pass through the center of the connecting portion 1603.

The folding portion 1400 may be formed by appropriately changing the portion to include a portion that requires folding. For example, when the electrode structure 1500 needs to be folded two or more times, the electrode structure 1500 may include two or more folding portions 1400.

In this case, each folding unit 1400 may be formed to include each section to be folded. During the manufacturing process of the electrode array 1000 according to the embodiment, the electrode structure 1500 can be folded and placed in the housings 1100 and 1200, and the folding portion 1400 is formed to facilitate folding in the process. It could be space.

The contact electrode portion 1601 and the connection portion 1603 may be disposed within the first housing 1100, and the pad portion 1602 may be disposed within the second housing 1200.

Referring to FIG. 11, a contact electrode 1801, a first wire 1701, and a connection wire 1704 may be disposed in the contact electrode unit 1601. In one embodiment, the contact electrode 1801 may be matched one-to-one with the first wiring 1701. That is, one contact electrode can be connected to one wire. However, it is not limited to this.

More specifically, the first wire 1701 and the contact electrode 1801 may be connected through a connection wire 1704. The connection wire 1704 may be a wire formed to point in a second direction from an end of the first wire 1701 extending in the first direction to connect the contact electrode 1801 and the first wire 1701. That is, the electrode structure 1500 according to the embodiment may include a connection wire 1704 that connects the first wire 1701 and the contact electrode 1801 and is bent in the second direction from the first wire 1701. .

As described above, the first wiring 1701, the connecting wiring 1704, and the contact electrode 1801 can be integrated as a single structure connected to each other.

When the electrode structure 1500 is folded around the folding unit 1400 to form the electrode array 1000, all or part of the connection wire 1704 may be folded. The contact electrode unit 1601 may be folded around the connection wire 1704 so that the contact electrode 1801 and the first wire 1701 are arranged to face each other. An insulating layer may be disposed between the facing contact electrode 1801 and the first wiring 1701. The insulating layer may include an insulating material such as the silicone synthetic polymer described above.

The connection wire 1704 may have various structures to facilitate folding. In one embodiment, the connection wire 1704 may include a zig-zag pattern. In another embodiment, the connection wire 1704 may include a concave-convex pattern. In another embodiment, the connection wire 1704 may include a wave pattern. When the connection wire 1704 includes such a pattern, the amount of tension applied to the wire when bending can be reduced compared to a straight wire, thereby increasing flexibility. When the flexibility of wiring is improved, the risk of wiring being disconnected due to tension applied during bending is reduced, thereby providing stability to the device. However, any variety of structures that can increase flexibility can be applied to the connection wiring 1704, and are not limited to zigzag patterns, uneven patterns, or wavy patterns. Additionally, the connection wire 1704 may have a straight shape.

Referring to FIG. 12, a third wiring 1703 and a folding portion 1400 may be located in the connection portion 1603.

As described above, the folding portion 1400 is a space formed to facilitate folding of the electrode structure 1500, and may be a space through which wires do not pass.

In order to form the folding portion 1400, the first and third wirings 1701 and 1703 located in the area where the contact electrode portion 1601 and the connecting portion 1603 are connected have bending patterns BP1 and BP2 in some areas. You can have

In other words, the first wire 1701 and the third wire 1703 may include a pattern bent at a predetermined angle where the two wires are connected to each other, and the space formed by this bent pattern is the folding unit 1400. It can be. To form the folding portion 1400, the first and third wires 1701 and 1703 may be bent multiple times.

The third wire 1703 may include a first wire group TG1 and a second wire group TG2 divided by a virtual line L1 passing through the center of the folding unit 1400. The group TG1 and the second wiring group TG2 may have bending patterns BP1 and BP2, respectively. However, it is not necessarily limited to this, and the bending pattern may be formed only in one of the first wiring group (TG1) and the second wiring group (TG2).

From another perspective, the wires 1701, 1702, and 1703 may include a pattern that bypasses the folding portion 1400. That is, the space formed by the wires 1701, 1702, and 1703 arranged at regular intervals in the second direction moving away from the third electrode portion 1603 in the second direction and then returning to the original interval is the folding portion 1400. ) can be.

More specifically, the spacing between the first wiring group (TG1) and the second wiring group (TG2) may be different in the contact electrode portion 1601, the connection portion 1603, and the pad portion 1602. The gap between the first wiring group TG1 and the second wiring group TG2 may be larger in the connection portion 1603 than in the contact electrode portion 1601 and the pad portion 1602. The folding portion 1400 may include a space created by a pattern in which the first wiring group TG1 and the second wiring group TG2 are spaced apart by a predetermined distance formed at the connection portion 1603 .

Referring to FIG. 13 , the pad portion 1602 may include a plurality of second wires 1702 and a plurality of pads 1802. The second wire 1702 is a wire extending from the third wire 1703, and may have a pattern bent at a predetermined angle in the second direction in the area where the two wires are connected. That is, the plurality of pads 1802 may be arranged on one side with respect to the virtual line L1.

This is to prevent the pads 1802 from overlapping each other in the third direction when folding the electrode structure 1500 to form the electrode array 1000. This is because the pad 1802 must be connected to each terminal of the circuit unit 230 disposed on the second housing, and therefore must not overlap each other in the third direction. The bending angle can be appropriately adjusted for each specific shape of the electrode structure 1500. For example, in the case of the electrode structure 1500 that does not interfere with connection to the circuit unit 230 even if the pad 1802 and the second wire 1702 partially overlap, as in the embodiment shown in FIG. 24, the bending angle may be smaller than the embodiment of FIG. 13. Additionally, even if the pads 1802 overlap in the third direction, they may not be bent if there is no problem with their connection depending on the specific design of the circuit unit 230.

The pad 1802 and the second wire 1702 may be matched one-to-one. The second wire 1702 and the third wire 1703 may also be matched one-to-one. However, it is not limited to this and can be matched one-to-many. As described above, the pad 1802, the second wiring 1702, and the third wiring 1703 may be integrated. In other words, it may be one configuration.

As described above, the pad 1802 may be connected to the electrodes of the circuit unit 230 through a contact hole formed in the second housing 1200, or may be connected to the electrodes of the circuit unit 230 using a feedthrough. Here, the electrodes of the circuit unit 230 may each form an individual channel. Accordingly, the contact electrodes 1801 connected from the pad 1802 can each form an independent channel, and the number of contact electrodes 1801 and the number of pads 1802 can correspond to the number of channels, but are not limited thereto.

Hereinafter, a method of manufacturing the electrode array 1000 according to an embodiment will be described with reference to FIGS. 14 to 25.

Figure 14 is a plan view showing the substrate and the conductive material disposed on the substrate. 15 is a cross-sectional view showing the substrate and the conductive material disposed on the substrate.

First, the patterning preparation step will be described. Referring to FIGS. 14 and 15 , the patterning preparation step is a step of forming a conductive material 1520 on the substrate 1511. In one embodiment, the substrate 1511 may be a self-adhesive film, and the conductive material may be platinum iridium foil (PtIr foil). However, it is not limited to this, and any material that can be used in the patterning process can be used as the substrate 1511, and any material that is conductive and easy to pattern and is harmless to the human body can be used as the conductive material 1520.

Figure 16 is a diagram showing a process of forming an electrode structure by patterning a conductive material disposed on a substrate. Figure 17 is a cross-sectional view showing the process of forming an electrode structure by patterning a conductive material disposed on a substrate.

Next, the patterning step proceeds. Referring to FIGS. 16 and 17 , the patterning step is a step of forming the electrode structure 1500 by patterning the conductive material 1520 disposed on the substrate. In one embodiment, the conductive material 1520 may be patterned using a laser. However, it is not limited to laser patterning.

When the patterning step is completed, the conductive material 1520 may have the shape of the electrode structure 1500, as shown in FIG. 16.

Figure 18a is a rear view showing the folding guide groove and alignment hole formed on the back of the substrate. Figure 18b is a front view of Figure 18a. Figure 19 is a cross-sectional view of Figure 18b.

Next, the substrate processing step may proceed. Referring to FIGS. 18A, 18B, and 19, the substrate processing step is a step of processing the rear side of the substrate 1511 to form the folding guide groove 1513 and the alignment hole 1514. The rear surface of the substrate 1511 faces the opposite direction from the surface on which the electrode structure 1500 is formed.

The folding guide groove 1513 is a groove formed on the rear surface of the substrate 1511 to facilitate folding when the electrode structure 1500 is folded along a line to be folded. The spacing of the grooves may be appropriately modified depending on the bioimplantable device 1 to be manufactured.

The alignment hole 1514 is a structure that guides the electrode structure 1500 to ensure accurate folding. Folding can be done accurately by checking whether the opposing alignment holes 1514 are facing each other correctly when folded.

The alignment hole 1514 may be formed outside the area where the electrode structure 1500 is formed on the substrate 1511. Unlike the folding guide groove 1513, the alignment hole 1514 is formed to completely penetrate the substrate 1511, so it may cause damage to the electrode structure 1500 when formed in the area where the electrode structure 1500 is located. am. The specific number or location of the alignment holes 1514 may be appropriately modified and applied depending on the purpose and size of the bioimplantable device 1 to be manufactured.

Figure 20 is a cross-sectional view showing the process of applying an insulating material on a substrate and an electrode structure.

Following the substrate processing step, an insulating material application step may be performed.

Referring to FIG. 20, the insulating material application step is a step of applying an insulating material 1540 on the substrate 1511 and the electrode structure 1500 formed on the substrate 1511. The insulating material 1540 may be applied using an insulating material application device 1530. The insulating material 1540 may include a silicone synthetic polymer (silicon elastomer). The applied insulating material 1540 is between the contact electrodes 1801 and the contact electrodes 1801, between the pads 1802 and the pads 1802, or between the contact electrodes 1801, the pads 1802, and the wires 1701 and 1702. , 1703, 1704), a short between them can be prevented, and unnecessary electrical signals from flowing in from the outside can be blocked. Additionally, the insulating material 1540 can serve not only to insulate the components but also to strongly bond each component and fix it in a desired position.

Figure 21 is a cross-sectional view showing the substrate and electrode structure being folded.

After applying the insulating material 1540, the folding step may proceed. Referring to FIG. 21, in the folding step, after the insulating material 1540 is applied on the substrate 1511 and the electrode structure 1500, the substrate (1511) is folded using the alignment hole 1514 and the folding guide groove 1513. This is a step of folding the electrode structure 1511) and the electrode structure 1500.

The alignment hole 1514 is configured to check whether folding has been performed accurately, and the folding guide groove 1513 may be configured to facilitate folding of the substrate 1511. This folding may be formed along the virtual line L1 where the folding guide groove 1513 is formed. The direction in which the substrate 1511 and the electrode structure 1500 are folded may be in a direction in which the substrate 1511 is exposed to the outside. In other words, the substrate 1511 and the electrode structure 1500 may be folded in a direction in which the applied insulating material 1540 contacts each other. Accordingly, portions of the electrode structure 1500 may face each other and an insulating material 1540 may be positioned between them. The insulating material 1540 positioned between the folded and facing electrode structures 1500 may function as an insulating film. That is, the insulating film can serve to prevent unnecessary shorts from occurring between the contact electrode 1801 and a plurality of wires.

Additionally, in order to improve insulation performance and bonding force, the insulating material 1540 may be reapplied one or more times immediately before the folding step.

Figure 22 is a cross-sectional view showing the electrode structure with the substrate removed.

After the folding step, the substrate removal step can be performed. Referring to FIG. 22 , the substrate removal step is a step of removing the substrate 1511 from the folded electrode structure 1500 and the insulating film located between the folded electrode structure 1500. When the substrate 1511 is removed, a portion of the electrode structure 1500 may be exposed to the outside. A portion of the exposed electrode structure 1500 may be a contact electrode 1801.

Figure 23 is a cross-sectional view showing a housing formed on the electrode structure from which the substrate has been removed.

Next, the housing formation step can be proceeded. Referring to FIG. 23, after the substrate 1511 is removed, housings 1100 and 1200 surrounding the folded electrode structure 1500 can be formed. As described above, the housings 1100 and 1200 may include a first housing 1100 and a second housing 1200, and each housing 1100 and 1200 may include cover films 1301 and 1302. You can. The cover films 1301 and 1302 are part of the housings 1100 and 1200 and may serve to cover the folded electrode structure 1500.

An electrode hole 1310 may be formed in a partial area of the first cover film 1301. The electrode hole 1310 is an opening that exposes the contact electrode 1801 under the first cover film 1301 to the outside. The electrode hole 1310 may be formed for each of the plurality of contact electrodes 1801. That is, one electrode hole 1310 can expose one contact electrode 1801. In this case, the number of electrode holes 1310 may be the same as the number of contact electrodes 1801. The number of electrode holes 1310 may be the same as the number of channels of the circuit unit 230.

The housings 1100 and 1200 and the cover films 1301 and 1302 may all include the same material. In an embodiment, the housings 1100 and 1200 and the cover films 1301 and 1302 may include an insulating material 1540 applied in the insulating material application step. More specifically, the housings 1100 and 1200 and the cover films 1301 and 1302 may include silicone synthetic polymer (silicon elastomer). The housings 1100 and 1200, the cover films 1301 and 1302, and the insulating film formed of the same insulating material 1540 may be integrated.

Figure 24 is a diagram showing an electrode structure according to another embodiment. With respect to the electrode structure according to another embodiment of the present invention, the description of substantially the same configuration as that described above will be simplified and the explanation will focus on the differences.

Referring to FIG. 24, the electrode structure 1500 may include a contact electrode portion 1601, a pad portion 1602, and a connection portion 1603.

The contact electrode unit 1601 may be an area where a plurality of contact electrodes 1801, a plurality of first wires 1701, and a plurality of connection wires 1704 are disposed. The pad portion 1602 may be an area where a plurality of pads 1802 and a second wire 1702 are disposed. The connection portion 1603 may be an area where a plurality of third wires 1703 are disposed and the folding portion 1400 is located. The first wire 1701, the second wire 1702, and the third wire 1703 may be one wire connecting the contact electrode 1801 and the pad 1802.

The electrode structure 1500 may include a virtual line L1 crossing the electrode structure 1500 in the first direction. The virtual line L1 may divide the electrode structure 1500 into two adjacent regions in the second direction. The virtual line L1 may cross the folding unit 1400.

As described above, to form the electrode array 1000, the electrode structure 1500 may be folded using the virtual line L1 as a reference line. Referring to the enlarged view of the pad portion 1602 in FIG. 24, the virtual line L1 may cross the pad portion 1602. When folding around this virtual line L1, parts of the pad portion 1602 may be bent and overlap each other.

For example, the second wiring group TG2 connected to the plurality of pads 1802 may be bent and placed on top of the pads 1802. That is, the plurality of pads 1802 may be placed in the lower area and the bent second wiring group TG2 may be placed in the upper area. However, since an insulating layer is disposed between the plurality of pads 1802 and the second wiring group TG2, they can be electrically insulated.

In this embodiment, even if a portion of the pad portion 1602 overlaps, there is no problem in connecting the electrode of the circuit portion 230 and the pad 1802. This is because even if some overlap of the pad portion 1602 occurs due to folding, overlap between the pads 1802 does not occur.

The electrode structure 1500 according to this embodiment may be folded two or more times as needed when forming the electrode array 1500. When the electrode structure 1500 is folded n-1 (n is an integer of 2 or more), the electrode structure 1500 is a virtual line dividing it into n (n is an integer of 2 or more) regions along the second direction. It may include 1 line to n-1th line (L1, L2). The first to n-1th lines do not intersect each other and may each be virtual lines extending in the first direction.

During the folding process, the electrode structure 1500 may be folded alternately between in-folding and out-folding based on the first to n-1th lines.

Figure 24 shows the electrode structure 1500 when n is 3, that is, requiring two folding. Referring to FIG. 24, the electrode structure 1500 may first be in-folded around the first line L1. Next, the electrode structure 1500 may be outfolded along the second line L2. The reason for performing in-folding and out-folding alternately is to expose the contact electrode 1801 on the outside of the completed electrode array 1000. In FIG. 24 , the electrode structure 1500 is folded twice as an example, but the present invention is not limited thereto.

25A and 25B are diagrams showing an electrode structure according to another embodiment.

The electrode structure according to this embodiment may include a plurality of electrode structures separated from each other. Hereinafter, a set of a plurality of electrode structures will be referred to as an electrode structure group.

The electrode structure group may include first to nth electrode structures (n is an integer of 2 or more) electrode structures. The first to n-th electrode structures may be separate electrode structures.

The i-th (i is an integer of 1 or more and n or less) may include an i-th contact electrode portion, an i-th pad portion, and an i-th connection portion. The ith contact electrode part, the ith pad part, and the ith connection part respectively correspond to the contact electrode part 1601, the pad part 1602, and the connection part 1603 in the embodiment of FIG. 10.

The i-th contact electrode unit includes a plurality of i-th contact electrodes, a plurality of 1-i wires, and a plurality of contact electrodes extending from the plurality of i-th contact electrodes and connecting the plurality of i-th contact electrodes and the plurality of 1-i wires. i May include connecting wiring. The i-th contact electrode, the 1-ith wire, and the i-th connection wire respectively correspond to the contact electrode 1801, the first wire 1701, and the connection wire 1704 in the embodiment of FIG. 11.

The i-th pad unit may include a plurality of i-th pads and a plurality of 2-i-th wires connected to the plurality of i-th pads. The i-th pad and the 2-ith wire correspond to the pad 1802 and the second wire 1702, respectively, in the embodiment of FIG. 13.

The i-th connection unit may include a plurality of 3-i wires connecting a plurality of 1-i wires and a plurality of 2-i wires. The 3-i wiring corresponds to the third wiring 1703 in the embodiment of FIG. 12. The i-th connection portion may be disposed between the i-th contact electrode portion and the i-th pad portion.

The length of the ith electrode structure in the first direction may be inversely proportional to i. That is, the distance between the i-th contact electrode and the i-th pad, which is closest to the i-th pad among the plurality of i-th contact electrodes, is the i+, which is the furthest from the i+1-th pad among the plurality of i+1-th contact electrodes. 1 It may be longer than the distance between the contact electrode and the i+1 pad. This is to prevent overlap between the first to nth contact electrodes when forming the electrode array 1000 by overlapping a plurality of electrode structures.

Figures 25a and 25b show the case where n is 2, that is, two electrode structures form an electrode structure group. For convenience of explanation, the case where n is 2 is taken as an example, but n is not limited to 2.

When n is 2, the electrode structure group may include a first electrode structure 1500a and a second electrode structure 1500b.

Figure 25a is a diagram showing the first electrode structure.

Referring to FIG. 25A, the first electrode structure 1500a may include a first contact electrode portion 1601a, a first pad portion 1602a, and a first connection portion 1603a.

The first contact electrode portion 1601a extends from the plurality of first contact electrodes 1801a, the plurality of 1-1 wirings 1701a, and the plurality of first contact electrodes 1801a to form a plurality of first contact electrodes ( 1801a) and a plurality of first connection wires 1704a connecting the plurality of 1-1 wires 1701a.

The first pad portion 1602a may include a plurality of first pads 1802a and a plurality of 2-1 wires 1702a connected to the plurality of first pads 1802a.

The first connection unit 1603a may include a plurality of 3-1 wires 1703a connecting a plurality of 1-1 wires 1701a and a plurality of 2-1 wires 1702a. The first connection portion 1603a may be disposed between the first contact electrode portion 1601a and the first pad portion 1602a.

The first electrode structure 1500a may be grown through the same process as the above-described embodiments up to the substrate removal step shown in FIG. 22 to form the electrode array 1000.

The first electrode structure 1500a may include a first line L1, which is an imaginary line crossing the plurality of first connection wires 1704a in the first direction. In the process of forming the electrode array 1000, the first electrode structure 1500a may be folded based on the first line L1. More specifically, the first contact electrode portion 1601a of the first electrode structure 1500a may be folded based on the first line L1. When the first contact electrode unit 1601a is folded based on the first line L1, the plurality of first contact electrodes 1801a and the plurality of 1-1 wires 1701a are stretched in the third direction with the insulating film interposed therebetween. May overlap. The first contact electrode portion 1601a and the first connection portion 1603a may be disposed in the first groove of the first housing, and the first pad portion 1602a may be disposed in the second groove of the second housing.

Referring to FIG. 25b, the second electrode structure 1500b may include a second contact electrode portion 1601b, a second pad portion 1602b, and a second connection portion 1603b.

The second contact electrode portion 1601b extends from the plurality of second contact electrodes 1801b, the plurality of 1-2 wirings 1701b, and the plurality of second contact electrodes 1801b to form a plurality of second contact electrodes ( 1801b) and a plurality of second connection wires 1704b connecting the plurality of 1-2 wires 1701b.

The second pad portion 1602b may include a plurality of second pads 1802b and a plurality of 2-2 wires 1702b connected to the plurality of second pads 1802b.

The second connection unit 1603b may include a plurality of 3-2 wires 1703b connecting the plurality of 1-2 wires 1701b and the plurality of 2-2 wires 1702b. The second connection portion 1603b may be disposed between the second contact electrode portion 1601b and the second pad portion 1602b.

Likewise, the second electrode structure 1500b can be grown through the same process as the above-described embodiments up to the substrate removal step shown in FIG. 22 to form the electrode array 1000.

The second electrode structure 1500b may include a first line L1, which is an imaginary line crossing the plurality of second connection wires 1704b in the first direction. In the process of forming the electrode array 1000, the second electrode structure 1500b may be folded based on the first line L1. More specifically, the second contact electrode portion 1601b of the second electrode structure 1500b may be folded based on the first line L1. When the second contact electrode unit 1601b is folded based on the first line L1, the plurality of second contact electrodes 1801b and the plurality of 1-2 wires 1701b are stretched in the third direction with the insulating film interposed therebetween. May overlap. The second contact electrode portion 1601b and the second connection portion 1603b may be disposed in the first groove of the first housing, and the second pad portion 1602a may be disposed in the second groove of the second housing.

In this embodiment, a process of stacking the first electrode structure 1500a and the second electrode structure 1500b is further performed to form the electrode array 1000.

Figure 26 is a diagram showing the process of stacking the first electrode structure 1500a and the second electrode structure 1500b.

Referring to FIG. 26 (a), the second electrode structure 1500b may be disposed on the first electrode structure 1500a. In order to minimize the step between the first contact electrode 1801a and the second contact electrode 1801b after the electrode structures 1500a and 1500b are stacked, the insulating material 1540 covering the first electrode structure 1500a is Some of them can be removed. The insulating material 1540 may serve as an insulating film between each component. When the second electrode structure 1500a is placed in the place where the insulating material 1540 was removed, the step difference between the first contact electrode 1801a and the second contact electrode 1801b is minimized, as shown in FIG. 26 (b). It can be.

Hereinafter, the lengths of the first electrode structure 1500a and the second electrode structure 1500b in the first direction will be described with reference to FIGS. 25A, 25B, and 26.

The plurality of first contact electrodes 1801a include 1-1 contact electrodes to 1-s (s is an integer of 1 or more) contact electrodes arranged sequentially along the first direction starting from the distance from the first pad portion 1602a. It can be included. That is, the 1-1 contact electrode may be the contact electrode furthest from the first pad portion 1602a, and the 1-s contact electrode may be the contact electrode closest to the first pad portion 1602a.

The plurality of second contact electrodes 1801b are 2-1 contact electrodes to 2-t (t is an integer of 1 or more) contact electrodes arranged sequentially along the first direction from the distance from the second pad portion 1602b. may include. That is, the 2-1st contact electrode may be the contact electrode furthest from the second pad portion 1602b, and the 2-t contact electrode may be the contact electrode closest to the second pad portion 1602b.

The distance between the 1-s contact electrode and the first pad portion 1602a may be greater than the distance between the 2-1 contact electrode and the second pad portion 1602b. That is, the distance between the 1-s contact electrode located closest to the first pad portion 1602a and the first pad portion 1602a is the distance between the 1-s contact electrode located furthest from the second pad portion 1602b and the first pad portion 1602a. It may be greater than the distance between the two pad portions 1602b. Otherwise, that is, if the distance between the 2-1 contact electrode and the second pad portion (1602b) is greater than the distance between the 1-s contact electrode and the first pad portion, a plurality of second contact electrodes (1801b) This is because some of them may overlap with some of the plurality of first contact electrodes 1801a.

The length of the first electrode structure 1500a in the first direction may be greater than the length of the second electrode structure 1500b in the first direction. If the first direction length of the first electrode structure 1500a is smaller than the first direction length of the second electrode structure 1500b, the plurality of second contact electrodes 1801b overlap the plurality of first contact electrodes 1801a. Because it can be.

The plurality of 1-2 wirings 1701b and the plurality of second contact electrodes 1801b may be stacked with the 3-1 wiring 1703c and an insulating film interposed therebetween. Additionally, the plurality of 3-1 wires 1703a and the plurality of 3-2 wires 1703b may overlap in the third direction with an insulating film therebetween.

Referring to FIGS. 25A and 25B, the first connection wire 1704a and the second connection wire 1704b may include a wave pattern or a zigzag pattern.

Referring to FIGS. 25A and 25B, the first pad portion 1602a and the second pad portion 1602b are the first pad portion (1602a) when the second electrode structure 1500b is stacked on the first electrode structure 1500a. 1602a) and the second pad portion 1602b may have a pattern to prevent them from overlapping. For example, the first pad portion 1602a may be patterned so that the first pad 1802a and the 2-1 wire 1702a face the X1 direction and the Y2 direction, as shown in FIG. 25A. The second pad portion 1602b may be patterned so that the second pad 1802b and the 2-2 wire 1702b face the X2 direction and the Y1 direction, as shown in FIG. 25B.

Figure 27 is a diagram showing an electrode structure according to another embodiment.

Referring to FIG. 27, the electrode structure 1500 may include a contact electrode portion 1601, a pad portion 1602, and a connection portion 1603.

The contact electrode unit 1601 may be an area where a plurality of contact electrodes 1801, a plurality of first wires 1701, and a plurality of connection wires 1704 are disposed. The pad portion 1602 may be an area where a plurality of pads 1802 and a second wire 1702 are disposed. The connection portion 1603 may be an area where a plurality of third wires 1703 are disposed.

The electrode structure 1500 may include a virtual line l crossing the electrode structure 1500 in the first direction. The virtual line L1 may divide the electrode structure 1500 into two adjacent regions in the second direction.

Figure 28 is a diagram showing the process of manufacturing an electrode array according to an embodiment.

The manufacturing process shown in (a) to (f) of FIGS. 28 may be substantially the same as the manufacturing process described with reference to FIGS. 14 to 22 .

Step (a) is a step of forming the conductive material 1520 on the substrate 1511. Step (b) represents forming the electrode structure 1500 by patterning the conductive material 1520 into a desired shape. Step (c) is a step of processing the substrate 1511 to form an alignment hole 1514 and a folding guide groove 1513. Step (d) shows the process of covering the patterned electrode structure 1500 by applying an insulating material 1540 on the substrate 1511. Step (e) shows the process of folding the substrate 1511, the insulating material 1540, and the electrode structure 1500. It can be folded based on the virtual line (l) in FIG. 27. Step (f) shows the process of removing the substrate 1511 from the folded electrode structure 1500. During this process, the contact electrode 1801 may be exposed to the outside.

Steps (g) and (h) are steps of forming the folded electrode structure 1500 into a cylindrical shape. More specifically, the electrode structure 1500 may be manufactured in a cylindrical shape with the contact electrode 1801 exposed to the outside in step (f) located on the outer peripheral surface. A core bundle 1900 may be disposed on the inner peripheral surface (or interior) of the cylindrical shape. The core bundle 1900 may serve as a framework to maintain the shape of the completed electrode array 1000. At the same time, the core bundle 1900 may serve to guide the stylette during the implantation step of the electrode array 1000 into the body, as will be described later.

The core bundle 1900 may be flexible. This is to prevent excessive pressure on surrounding tissues after being implanted into the body. For this purpose, the core bundle 1900 may include a coil spring containing stainless steel.

The core bundle 1900 may serve to assist the electrode array 1000 so that it can be implanted in the correct area of the body. More specifically, the core bundle 1900 can form a hole penetrating the center of the electrode array 1000, and can be implanted at an exact site using a stylette disposed within this hole. The stylet is an auxiliary tool that has the ability to move straight and has a certain level of rigidity, and can serve to assist the flexible electrode array 1000 in reaching an accurate position. The stylet is used only in the implantation step and can be removed from the electrode array 1000 after implantation. This is to prevent the straight stylet from applying pressure to surrounding tissues and causing damage.

Figure 29 is a diagram showing an electrode array according to an embodiment.

Referring to Figures 28(h) and 29, the electrode array 1000 may have a core bundle 1900 serving as a framework located on its inner peripheral surface (or inside). Wires 1701, 1702, 1703, and 1704 may be located outside the core bundle 1900. An insulating film may be located outside the core bundle 1900 and the wires 1701, 1702, 1703, and 1704. A plurality of contact electrodes 1801 exposed to the outside may be located outside the insulating film.

A plurality of contact electrodes may be located at one end of the cylindrical electrode array 1000. At the other end of the cylindrical electrode array 1000, a plurality of pads 1802 may be positioned to be exposed to the outside and connected to the circuit portion 230.

Figure 30 is a diagram showing an electrode array according to an embodiment.

Referring to FIG. 30, the electrode array 1000 can be bent in the body as needed. For flexibility and stability, the wires may include a wavy or wavy pattern. In Figure 30, the third wires 1703 have a wave pattern or a way pattern as an example, but this is not limited to this, and all wires in all of the above-described embodiments may include such a pattern to improve flexibility and stability. You can. The patterns that the wires can have may include not only wave patterns or wavy patterns, but also various patterns that help improve flexibility and stability.

Figure 31 is a diagram showing an embodiment of a contact electrode.

Referring to FIG. 31, the contact electrode 1801 may have a rectangular shape with curved vertices. Additionally, the contact electrode 1801 may include a plurality of fixing holes 1811a. In an embodiment, the fixing hole 1811a may be formed at each vertex of the contact electrode 1801. However, the shape of the contact electrode 1801 and the number and location of the fixing holes 1811a are illustrative and may be appropriately modified depending on the situation.

Figure 32 is a diagram showing a contact electrode coated with an insulating material. Figure 33 is a cross-sectional view taken along the cutting line III-III' of Figure 32.

Referring to Figures 32 and 33, the fixing hole 1811a is configured to more strongly fix the contact electrode 1801. More specifically, when applying the insulating material 1540 to fix each component of the electrode array 1000, the insulating material 1540 flows into the fixing hole 1811a formed in the contact electrode 1801 to ensure more stability. It can play a stabilizing role.

Figure 34 is a diagram showing another embodiment of a contact electrode. Figure 35 is a diagram showing another embodiment of a contact electrode.

Referring to FIGS. 34 and 35, fixing holes 1811b and 1811c may be disposed on both sides of the contact electrode 1801. That is, the fixing hole may be formed in the shape of a long bar on the left and right or top and bottom areas of the contact electrode 1801.

Figure 36 is a diagram showing another embodiment of a contact electrode.

Referring to FIG. 36, the fixing hole 1811d may be formed in the shape of a long bar in all four areas of the contact electrode 1801, including the top, bottom, left, and right.

Conventionally, when manufacturing a bioimplantable device, the electrodes in contact with the living body and the wiring connected to the electrodes were individually welded. In this case, there was a limit to increasing the number of electrodes per unit length.

The electrode structure 1500 according to the above-described embodiment is formed integrally with the contact electrode 1801 and the wiring, and is folded or bent into a cylindrical shape to manufacture the electrode array 1000 and the bioimplantable device 1 including the same. Therefore, manufacturing precision increases and the number of electrodes per unit length can be significantly increased. That is, the electrode structure 1500, the electrode array 1000, and the bioimplantable device 1 according to the embodiment can increase the number of first electrodes 1801 that can be placed per unit length, thereby improving their performance and Precision can be improved.

Figure 37 is a diagram showing the first electrode structure of the electrode array according to the sixth embodiment. FIG. 38 is a cross-sectional view taken along the line A-A of FIG. 37. Figure 39 is a cross-sectional view taken along line B-B of Figure 37.

According to an embodiment, the first electrode structure (EG1) and the second electrode structure (EG2) may be manufactured separately and combined to manufacture an electrode array.

Referring to FIGS. 37 and 38 , the first electrode structure EG1 may be formed by forming a conductive material on the first substrate 1511a and then patterning the first electrode pattern. The first electrode pattern may include a first wiring group TG1 and a plurality of first contact electrodes 1801a. The wiring group may include the above-described first wiring, second wiring, and third wiring.

For example, 16 first contact electrodes 1801a may be formed, but the number of first contact electrodes 1801a is not necessarily limited thereto.

A first connection wire 1704a may be formed between the first wire group TG1 and the first contact electrode 1801a. As described above, the first connection wire 1704a may have various curved shapes for flexibility and stability when bending. A first insulating layer 1540a may be formed on the first wiring group TG1 and the plurality of first contact electrodes 1801a. Additionally, an alignment hole 1514 may be formed in the first substrate 1511a.

Referring to FIG. 39, the first insulating layer 1540a may have a through hole 1541 through which the second contact electrode 1801b of the second electrode structure EG2 is disposed. The through hole 1541 may be formed to correspond to the area of the second contact electrode or may be formed larger.

Figure 40 is a diagram showing the second electrode structure of the electrode array according to the sixth embodiment. Figure 41 is a diagram showing the second electrode structure in a folded state based on an imaginary line. Figure 42 is a cross-sectional view in the direction C-C of Figure 41. Figure 43 is a diagram showing a state in which the second electrode structure is separated from the substrate.

Referring to FIG. 40, the second electrode structure EG2 may be formed by forming a conductive material on the second substrate 1511b and then patterning it to form a second electrode pattern. The second electrode pattern may include a second wiring group TG2 and a plurality of second contact electrodes 1801b. By way of example, 16 second contact electrodes 1801b may be formed, but the number is not necessarily limited thereto.

A second connection wire 1704b may be formed between the second wire group TG2 and the second contact electrode 1801b. A second insulating layer 1540b may be formed on the second wiring group TG2 and the plurality of second contact electrodes 1801b. The second electrode structure EG2 may be folded along the virtual line L1 crossing the plurality of second connection wires 1704b.

Referring to FIGS. 41 and 42 , in the process of folding the second electrode structure EG2 along the imaginary line, the second connection wire 1704b may be disposed on a different plane from the second contact electrode 1801b. Here, the meaning of different planes can be defined as horizontal planes with different heights relative to the reference plane.

Since the second electrode structure EG2 is bent so that the upper surfaces of the second insulating layers 1540b face each other, the boundary surface EB1 of the folded second insulating layer 1540b may not be observed. Thereafter, the second electrode structure EG2 can be manufactured by removing the second substrate 1511b as shown in Figure 43.

Figure 44 is a diagram showing a state in which the second electrode structure is stacked on the first electrode structure. Figure 45 is a diagram showing the first electrode structure in a folded state based on an imaginary line. FIG. 46A is a cross-sectional view taken along F-F of FIG. 45. Figure 46b is a cross-sectional view in the G-G direction of Figure 46.

Referring to FIG. 44, the second electrode structure (EG2) may be stacked on the first electrode structure (EG1). The second contact electrode 1801b of the second electrode structure EG2 may be disposed at a position corresponding to the through hole 1541 of the first insulating layer 1540a.

The second contact electrode 1801b may be inserted into the through-hole 1541, but is not necessarily limited to this, and the second contact electrode 1801b may be disposed on the upper part of the through-hole 1541.

Thereafter, the first electrode structure EG1 may be folded to surround the second electrode structure EG2. After the first electrode structure EG1 is folded to surround the second electrode structure EG2, the first substrate 1511a may be removed.

Referring to FIG. 45, the first wiring group TG1 and the second wiring group TG2 may be bent to partially overlap the first and second contact electrodes 1801a and 1801b in a plane view. In this case, the width of the electrode array can be made narrower by the overlap width. However, it is not necessarily limited to this, and the first wiring group TG1 and the second wiring group TG2 may not overlap the first and second contact electrodes 1801a and 1801b on a plane.

Referring to FIG. 46a, in the cross section of the portion where only the first electrode structure EG1 is disposed, the first contact electrode 1801a is disposed on one side of the first insulating layer 1540a, and the first connection wire 1704a is bent. Thus, the first wiring group TG1 may be disposed on the other side of the first insulating layer 1540a.

Referring to FIG. 46b, in the cross section of the portion where the first electrode structure (EG1) and the second electrode structure (EG2) are stacked, the second contact electrode (1801b) is disposed on one side (S1) of the second insulating layer (1540b). And, the second connection wire 1704b is bent so that the second wire group TG2 can be disposed on the other side of the second insulating layer 1540b.

At this time, the first insulating layer 1540a may be laminated on the second insulating layer 1540b, and the first wiring group TG1 may be disposed on the other side S2 of the first insulating layer 1540a. At this time, the interface EB2 between the first insulating layer 1540a and the second insulating layer 1540b may form an insulating layer that cannot be observed.

According to an embodiment, the first wiring group TG1 and the second wiring group TG2 may be arranged on different planes. Exemplarily, the second wiring group TG2 may be disposed on the boundary surface EB2 of the insulating layers, and the first wiring group TG1 may be disposed on the upper surface of the insulating layer. That is, in the thickness direction, the second wiring group TG2 may be disposed in an area between the second contact electrode 1801b and the first wiring group TG1.

According to this configuration, there is an advantage in that wiring can be placed on different planes, thereby reducing the width and/or thickness of the electrode array.

When manufactured with the same configuration as the embodiment, fewer wires are arranged within the same width, so it is possible to increase the thickness of each wire and increase the spacing and pitch between wires. Accordingly, the thickness of each wire increases, thereby increasing mechanical stability and increasing the gap between each wire, thereby reducing the possibility of a short circuit occurring between wires.

In the specification, a structure in which the first electrode structure and the second electrode structure are stacked is described, but the number of stacked electrode structures is not particularly limited. To facilitate wiring design, the number of stacking electrode structures can be appropriately adjusted.

Figure 47 is a diagram showing an electrode array according to the sixth embodiment. FIG. 48A is a cross-sectional view taken in the H-H direction of FIG. 47. Figure 48b is a cross-sectional view taken along line II of Figure 47.

Referring to FIGS. 47 and 48A, in the electrode array 1000, the first contact electrode 1801a forms the first to 16th channels, and the second contact electrode 1801b forms the 17th to 32nd channels. can be formed. However, the number of contact electrodes can be adjusted in various ways as needed. The first contact electrode 1801a may be exposed to the outside through the electrode hole 1310 formed in the housing 1110.

Referring to Figure 48b, the second contact electrode 1801b may be exposed through the electrode hole 1310 formed in the housing 1110. At this time, in the cross section of the area where the second contact electrode 1801b is disposed, the second wiring group TG2 may be disposed in an area between the second contact electrode 1801b and the first wiring group TG1. At this time, the cross sections of the first contact electrode 1801a and the first connection wire 1704a may not be visible.

A first insulating region (ILD1) is formed between the second contact electrode (1801b) and the second wiring group (TG2), and a second insulating region (ILD1) is formed between the second wiring group (TG2) and the first wiring group (TG1) ILD2) may be formed. At this time, the thickness of the first insulating area (ILD1) may be thicker than the thickness of the second insulating area (ILD2). Additionally, the vertical distance d1 between the second contact electrode 1801b and the second wiring group TG2 may be greater than the vertical distance d2 between the second wiring group TG2 and the first wiring group TG1. there is.

The first insulating area ILD1 is formed by folding the second insulating layer on the second contact electrode 1801b and the second insulating layer on the second wiring group TG2, while the second insulating area ILD2 is formed by folding the second insulating layer on the second contact electrode 1801b and the second insulating layer on the second wiring group TG2. This is because it has the thickness of the first insulating layer formed on the group TG1.

However, it is not necessarily limited to this, and by forming an additional insulating layer for bonding between the insulating layers, the thickness of the first insulating region (ILD1) and the second insulating region (ILD2) become the same or the thickness of the second insulating region (ILD2) becomes the same. The thickness may become thicker.

In addition, although not shown, the end of the electrode array may include a first pad portion electrically connected to the first wiring group TG1 and a second pad portion electrically connected to the second wiring group TG2. The first pad portion and the second pad portion may be disposed on the same plane to facilitate electrical connection with the circuit portion. Here, being on the same plane may mean being placed at the same height from the reference plane. However, it is not necessarily limited to this, and the first pad portion and the second pad portion may be disposed on different planes.

Although the above description focuses on the examples, this is only an example and does not limit the present invention, and those skilled in the art will be able to You will see that various variations and applications are possible. For example, each component specifically shown in the examples can be modified and implemented. And these variations and differences in application should be construed as being included in the scope of the present invention as defined in the appended claims.

Claims (13)

housing;
a plurality of first contact electrodes exposed to the outside of the housing;
a plurality of second contact electrodes exposed to the outside of the housing;
a first wiring group disposed inside the housing and electrically connected to the plurality of first contact electrodes;
A second wiring group disposed inside the housing and electrically connected to the plurality of second contact electrodes.
a plurality of first connection wires electrically connecting the first wire group and the plurality of first contact electrodes; and
A plurality of second connection wires electrically connecting the second wire group and the plurality of second contact electrodes,
The plurality of first contact electrodes and the first wiring group are arranged on different planes within the housing,
The plurality of first connection wires are bent and formed to electrically connect the first wire group and the plurality of first contact electrodes,
The plurality of second connection wires are bent and formed to electrically connect the second wire group and the plurality of second contact electrodes,
An electrode array wherein the height at which the first connection wire is bent is different from the height at which the second connection wire is bent.
According to paragraph 1,
The second wiring group is an electrode array disposed on a different plane from the first wiring group.
According to paragraph 1,
The second wiring group is an electrode array disposed in an area between the second contact electrode and the first wiring group.
According to paragraph 1,
An electrode array wherein the distance between the first contact electrode and the first wiring group is longer than the distance between the second contact electrode and the second wiring group.
delete delete According to paragraph 1,
a first insulating region between the second contact electrode and the second wiring group; and
An electrode array including a second insulation region between the second wiring group and the first wiring group.
In clause 7,
An electrode array in which the thickness of the first insulating region is thicker than the thickness of the second insulating region.
In clause 7,
An electrode array wherein the vertical distance between the second contact electrode and the second wiring group is greater than the vertical distance between the second wiring group and the first wiring group.
According to paragraph 1,
A first pad portion electrically connected to the first wiring group and a second pad portion electrically connected to the second wiring group,
An electrode array wherein the first pad portion and the second pad portion are disposed on the same plane.
A first unit including a transmitting unit; and
Includes a second unit capable of communicating with the first unit,
The second unit includes an electrode array including a circuit unit that processes electrical signals to generate stimulation signals, and a plurality of power sources to which current signals according to the stimulation signals are applied,
The electrode array is,
housing;
a plurality of first contact electrodes exposed to the outside of the housing;
a plurality of second contact electrodes exposed to the outside of the housing;
a first wiring group disposed inside the housing and electrically connected to the first contact electrode;
A second wiring group disposed inside the housing and electrically connected to the second contact electrode.
a plurality of first connection wires electrically connecting the first wire group and the plurality of first contact electrodes; and
A plurality of second connection wires electrically connecting the second wire group and the plurality of second contact electrodes,
The plurality of first contact electrodes and the first wiring group are arranged on different planes within the housing,
The plurality of first connection wires are bent and formed to electrically connect the first wire group and the plurality of first contact electrodes,
The plurality of second connection wires are bent and formed to electrically connect the second wire group and the plurality of second contact electrodes,
A bioimplantable device wherein the height at which the first connection wire is bent is different from the height at which the second connection wire is bent.
Preparing a first electrode structure including a plurality of first contact electrodes, a first wiring group, and a first connection wiring;
Preparing a second electrode structure including a plurality of first contact electrodes, a first wiring group, and a second connection wiring; and
Comprising the step of folding the second electrode structure and the first electrode structure,
The step of folding the second electrode structure and the first electrode structure,
folding the second electrode structure so that the second connection wire is bent;
Placing the folded second electrode structure on the first electrode structure; and
An electrode array manufacturing method comprising folding the first electrode structure to surround the second electrode structure. delete

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