KR102600530B1 - Heat-radiating foam tape - Google Patents

Abstract

The heat dissipating foam tape of exemplary embodiments of the present invention includes a foam layer including a first heat conductive urethane foam layer and a second heat conductive urethane foam layer each having a thickness of 40 to 80 μm, and a bottom surface of the first heat conductive urethane foam layer. It includes a first thermally conductive acrylic adhesive layer disposed on the surface and having a thickness of 30 to 70 μm, and a second thermally conductive acrylic adhesive layer disposed between the first thermally conductive urethane foam layer and the second thermally conductive urethane foam layer. Heat dissipation performance and shock absorption can be improved.

Description

Heat-radiating foam tape {HEAT-RADIATING FOAM TAPE}

The present invention relates to heat dissipating foam tape. More specifically, it relates to a heat dissipating foam tape using a thermally conductive filler.

As electronic and mechanical devices become more highly integrated and high-performance, excessive heat may be generated in certain parts during operation of the device.

The generated heat can damage or change the physical or chemical structure of components and cause malfunction or damage to the device.

For example, excessive heat may be generated from the antenna of a mobile phone, the motor of a car, or the battery of various devices, which may cause a decrease in the stability, durability, reliability, and lifespan of the device.

Therefore, heat insulating materials are being applied to efficiently dissipate the generated heat. Metal plates, metal sheets, etc. are usually used as heat insulating materials. However, the metal plate and metal sheet generally need to be applied in a flat position, and if applied in a curved position, they may not adhere sufficiently and heat dissipation performance may be reduced. Additionally, as the thickness increases, processing and molding become more difficult, and there are limits to its application as a heat insulator. Therefore, since it can only be applied as a thin film, it is difficult to expect an impact mitigation effect.

Japanese Patent Publication No. 2870198 discloses a heat sink using a mixture of silicon, carbon fiber, and alumina, but does not provide sufficient impact resistance and heat dissipation performance.

Japanese Patent Publication No. 2870198

One object of the present invention is to provide a heat dissipation foam tape with excellent heat dissipation performance and shock absorption.

1. A foam layer including a first thermally conductive urethane foam layer and a second thermally conductive urethane foam layer, each having a thickness of 40 to 80㎛; A first thermally conductive acrylic adhesive layer disposed on the bottom of the first thermally conductive urethane foam layer and having a thickness of 30 to 70㎛; and a second thermally conductive acrylic adhesive layer disposed between the first thermally conductive urethane foam layer and the second thermally conductive urethane foam layer and in direct contact with the foam layer.

2. The heat dissipating foam tape of 1 above, wherein the second thermally conductive urethane foam layer and the second thermally conductive acrylic adhesive layer are alternately and repeatedly laminated while in contact with each other.

3. The heat dissipating foam tape of 1 above, wherein the first thermally conductive urethane foam layer and the second thermally conductive urethane foam layer have the same thickness.

4. The heat dissipating foam tape of 1 above, wherein the total thickness of the heat dissipating foam tape is 120 to 250㎛.

5. The heat dissipating foam tape of 1 above, wherein the second heat conductive acrylic adhesive layer has a thickness of 1 to 7㎛.

6. The heat dissipating foam tape of 1 above, wherein the foam layer includes a urethane-based binder and a thermally conductive filler.

7. The heat dissipating foam tape of 6 above, wherein the weight ratio of the urethane-based binder and the thermally conductive filler is 1:1 to 4:1.

8. The heat dissipating foam tape of 1 above, wherein the first thermally conductive acrylic adhesive layer includes an acrylic adhesive resin and a thermally conductive filler.

9. The heat dissipating foam tape of item 8 above, wherein the first thermally conductive acrylic adhesive layer further includes boron nitride (BN).

10. The heat dissipating foam tape of item 8 above, further comprising a release film attached to the bottom of the first thermally conductive acrylic adhesive layer.

11. The heat dissipating foam tape according to 1 above, which is applied as a heat dissipation shock absorbing member between the rear cover of the display device and the battery.

The heat dissipation foam tape of exemplary embodiments may have excellent heat dissipation performance and shock absorption in the thickness direction while being thin by stacking heat conductive urethane foam layers and heat conductive acrylic adhesive layers having a predetermined thickness.

1 is a schematic cross-sectional view showing a heat dissipating foam tape according to example embodiments.
Figure 2 is a schematic cross-sectional view showing a heat dissipating foam tape according to example embodiments.
Figure 3 is a schematic plan view showing the rear of the body of the display device.
Figure 4 is a schematic plan view showing the rear cover of the display device.
Figure 5 is a schematic cross-sectional view showing the battery area of the display device.

Exemplary embodiments of the present invention provide a heat dissipating foam tape in which a plurality of thermally conductive urethane foam layers and a plurality of thermally conductive acrylic adhesive layers are laminated. Heat dissipation performance and shock absorption can be improved.

With reference to the drawings below, embodiments of the present invention will be described in more detail. However, the following drawings attached to this specification illustrate preferred embodiments of the present invention, and serve to further understand the technical idea of the present invention along with the contents of the above-described invention, so the present invention is described in such drawings. It should not be interpreted as limited to the specifics.

1 is a schematic cross-sectional view showing a heat dissipating foam tape according to example embodiments.

Referring to FIG. 1, the heat dissipating foam tape 10 includes a plurality of foam layers, a first thermally conductive acrylic adhesive layer 120, and a first thermally conductive acrylic adhesive layer 120. The foam layers include a first thermally conductive urethane foam layer 110 and a second thermally conductive urethane foam layer 140.

The thickness of each of the first thermally conductive urethane foam layer 110 and the second thermally conductive urethane foam layer 140 may be 40 to 80 μm. If the thickness is less than 40㎛, thermal conductivity and impact resistance may be reduced. When the thickness exceeds 80㎛, the surface of the foam layer may not be formed flat and may have a concavo-convex structure. In this case, when the foam layer is laminated and/or bonded with the thermally conductive acrylic adhesive layer or applied to the skin adhesive, adhesion may be reduced. Additionally, vertical thermal conductivity may decrease due to a decrease in adhesion. Preferably, the thickness may be 50 to 70㎛.

In exemplary embodiments, the first thermally conductive urethane foam layer 110 and the second thermally conductive urethane foam layer 140 may have substantially the same thickness. In this case, the heat dissipation performance of the first heat conductive urethane foam layer 110 and the second heat conductive urethane foam layer 140 may be balanced, and thus the heat dissipation performance of the entire heat dissipation foam tape 10 may be increased. there is.

The foam layer may include voids. Therefore, it can have impact resistance, elasticity, and restoring force.

In exemplary embodiments, the foam layer may include a urethane-based binder and a thermally conductive filler. The urethane-based binder may provide elasticity to the foam layer.

The urethane-based binder may include a polyurethane resin commonly used in the art. For example, the urethane-based binder may include a polyurethane resin formed through a polymerization reaction of a polyisocyanate-based compound and a polyol-based compound.

The thermally conductive fillers include, for example, alumina, titania, zirconia, ferrite, silica, zinc oxide, magnesium oxide, aluminum carbide, silicon carbide, aluminum nitride, boron nitride, carbon black, graphite, carbon fiber, melamine cyanurate, etc. may include. Preferably, graphite may be used, and graphite may include, but is not limited to, artificial graphite, natural graphite, etc. The particle size of graphite may be 2 to 10 μm.

In exemplary embodiments, the foam layer may include the urethane-based binder and the thermally conductive filler at a weight ratio of 1:1 to 4:1. If the content of the thermally conductive filler is less than 4:1 relative to the weight of the urethane-based binder, the thermal conductivity of the foam layer may be significantly reduced. If the content of the thermally conductive filler is greater than 1:1 relative to the weight of the urethane-based binder, it becomes difficult to secure the thickness of the foam layer, and impact resistance and vertical thermal conductivity may be reduced. Preferably, the weight ratio of the urethane-based binder and the thermally conductive filler may be 1:1 to 2:1.

The foam layer may be formed by applying and drying a composition for forming a foam layer including the urethane-based binder, the thermally conductive filler, and a solvent. For example, the composition may include 10 to 40% by weight of the urethane-based binder and 5 to 40% by weight of the thermally conductive filler.

In exemplary embodiments, the composition for forming a foam layer may include a foam material. The foam material may include a blowing agent or hollow foam particles.

The foaming agent may include an organic or inorganic foaming agent that generates gas. The organic blowing agent includes halogen-substituted alkanes such as acetone, ethyl acetate, methylene chloride, chloroform, ethylidene chloride, vinylidene chloride, monofluorotrichloromethane, chlorodifluoromethane, and dichlorodifluoromethane, It may include butane, hexane, heptane, diethyl ether, etc. The inorganic blowing agent may include water, air, CO ₂ , N ₂ , O ₂ , N ₂ O, etc.

The hollow foamed particles may include hollow particles whose outer edges are surrounded by a polymer resin or an inorganic material.

In some embodiments, the particle diameter of the hollow foam particles may be 20 to 40 μm. In the above particle size range, a foam layer with improved shock absorption and heat dissipation performance can be formed.

The foamed material may be included in an amount of 0.1 to 10% by weight based on the total weight of the urethane-based binder. If the content of the foam material is less than 0.1% by weight, the expansion rate of the foam layer may be insufficient. Accordingly, the shock absorption capacity of the heat dissipation foam tape 10 may be reduced. In addition, when applying the heat dissipating foam tape 10, adhesion to the skin adherent may be reduced, thereby reducing heat dissipation performance. If the content of the foamed material exceeds 10% by weight, heat dissipation performance may be reduced. Preferably, the foamed material may be included in an amount of 0.5 to 5% by weight or 1 to 4% by weight based on the total weight of the urethane-based binder.

In some embodiments, the adhesive force of the foam layer may be 400 gf/inch or more. In this case, the heat dissipating foam tape 10 can be easily bonded to the object, and the heat dissipating foam tape 10 may not be separated even if stress is applied to the object. Preferably, the adhesive force of the foam layer may be 2,500 gf/inch or less so that it can be separated again without damaging the object bonded to the foam layer.

In exemplary embodiments, the density of the foam layer may be 300 to 500 kg/m ³ . The density can be adjusted through the content of the urethane-based binder, the amount of the foam material used, etc. In the above density range, it is possible to improve shock absorption and joint adhesion while having a thickness that ensures vertical heat dissipation performance.

The first thermally conductive acrylic adhesive layer 120 may be formed on the bottom of the first thermally conductive urethane foam layer 110.

In exemplary embodiments, the first thermally conductive acrylic adhesive layer 120 may include an acrylic adhesive resin and a thermally conductive filler.

The acrylic adhesive resin may include an acrylic resin containing an acrylate-based polymerizable compound, a crosslinking agent, and/or a curing agent commonly used in the art.

The thermally conductive fillers include, for example, alumina, titania, zirconia, ferrite, silica, zinc oxide, magnesium oxide, aluminum carbide, silicon carbide, aluminum nitride, boron nitride, carbon black, graphite, carbon fiber, melamine cyanurate, etc. may include. Preferably, graphite may be used, and graphite may include, but is not limited to, artificial graphite, natural graphite, etc. The particle size of graphite may be 2 to 10 μm.

In example embodiments, the first thermally conductive acrylic adhesive layer 120 may include boron nitride (BN). The boron nitride can additionally improve the thermal conductivity of the first thermally conductive acrylic adhesive layer 120.

In some embodiments, the first thermally conductive acrylic adhesive layer 120 may be formed from a composition for forming a first adhesive layer including the acrylic adhesive resin, the thermally conductive filler, and a solvent. The first thermally conductive acrylic adhesive layer 120 can be manufactured by applying, drying, and/or curing the composition for forming the first adhesive layer.

The composition for forming the first adhesive layer may include 10 to 30% by weight of the acrylic adhesive resin, 1 to 60% by weight of the thermally conductive filler, and a remaining amount of solvent. In some embodiments, the weight ratio of the acrylic adhesive resin and the thermally conductive filler may be 3:1 to 1:6, preferably 1:1 to 1:6.

In exemplary embodiments, the composition for forming the first adhesive layer may contain 0.6% by weight or more per 1 μm of the thickness of the first thermally conductive acrylic adhesive layer 120 on which the thermally conductive filler is to be formed. In this case, heat dissipation characteristics through the first thermally conductive acrylic adhesive layer 120 may be improved. Preferably, the composition for forming the first adhesive layer may be included in an amount of 0.7% by weight or more per 1 μm of the thickness of the first thermally conductive acrylic adhesive layer 120 on which the thermally conductive filler is to be formed.

The thickness of the first thermally conductive acrylic adhesive layer 120 may be 30 to 70 μm. If the thickness is less than 30㎛, the shock absorbency of the heat dissipation foam tape 10 may decrease or voids may occur at the attachment interface. In addition, the adhesion between the skin adhesive and the heat dissipating foam tape 10 may decrease, resulting in decreased heat transfer characteristics. If the thickness exceeds 70㎛, the thickness of the heat dissipation foam tape 10 becomes excessively thick, and heat is not released through the heat dissipation foam tape 10 and is caught inside the heat dissipation foam tape 10, or is not released in the horizontal direction. can be released as

The first thermally conductive urethane foam layer 110 and the second thermally conductive urethane foam layer 140 may overlap in the thickness direction of the heat dissipation foam tape 10. A second thermally conductive acrylic adhesive layer 130 may be interposed between the first thermally conductive urethane foam layer 110 and the second thermally conductive urethane foam layer 140.

The second thermally conductive acrylic adhesive layer 130 can bond a plurality of foam layers to each other. For example, the second thermally conductive acrylic adhesive layer 130 may bond the first thermally conductive urethane foam layer 110 and the second thermally conductive urethane foam layer 140 to each other.

For example, the second thermally conductive acrylic adhesive layer 130 may be formed from a composition for forming a second adhesive layer.

The composition for forming the second adhesive layer may include 10 to 30% by weight of the acrylic adhesive resin, 1 to 20% by weight of the thermally conductive filler, and a remaining amount of solvent. In some embodiments, the weight ratio of the acrylic adhesive resin and the thermally conductive filler may be 1:1 to 4:1 or 1:1 to 2:1.

In exemplary embodiments, the thickness of the second thermally conductive acrylic adhesive layer 130 may be 1 to 7 μm. If the thickness is less than 1㎛, the foam layers may be incompletely bonded. If the thickness exceeds 10㎛, heat dissipation performance and impact resistance may be reduced compared to the thickness of the heat dissipation foam tape 10. Preferably, the thickness of the first thermally conductive acrylic adhesive layer 120 may be 3 to 5 ㎛.

In exemplary embodiments, the total thickness of the heat dissipating foam tape 10 may be 110 to 300 μm. If the thickness is less than 110㎛, the shock absorbency of the heat dissipation foam tape 10 may be insufficient. In addition, if sufficient thickness is not secured, voids may occur at the adhesion interface with the adhesive material, and heat capacity may be reduced, thereby deteriorating heat dissipation characteristics. If the thickness exceeds 300㎛, heat may not be released through the heat dissipating foam tape 10 and may be trapped inside the heat dissipating foam tape 10 or may be emitted in a horizontal direction. Preferably, the total thickness of the heat dissipation foam tape 10 may be 120 to 250 μm or 130 to 200 μm.

Figure 2 is a schematic cross-sectional view showing a heat dissipating foam tape according to example embodiments. Descriptions of configurations that are substantially the same as those described with reference to FIG. 1 may be omitted.

Referring to FIG. 2, the heat dissipating foam tape 12 may include a release film 150 formed on the bottom of the first heat conductive acrylic adhesive layer 120. The release film 150 is formed on the bottom of the first thermally conductive acrylic adhesive layer 120, and can be removed when applying the heat dissipating foam tape 12 to the attachment object.

The second thermally conductive urethane foam layer 140 and the second thermally conductive acrylic adhesive layer 130 may define a stacking unit 190.

As shown in FIG. 2, two stacking units 190 (190, 192) may be included, and three or more may be included.

When two or more stacking units 190 are stacked, the thermally conductive acrylic adhesive layers 130 and 132 and the thermally conductive urethane foam layers 140 and 142 may be alternately stacked in contact with each other.

Figure 3 is a schematic plan view showing the rear of the body of the display device. Figure 4 is a schematic plan view showing the rear cover of the display device. Figure 5 is a schematic cross-sectional view showing the battery area of the display device.

Referring to FIGS. 3 to 5 , the display device 20 may include a body portion 22 and a rear cover 200.

The body portion 22 may include a printed circuit board 220 to which electronic devices 230 such as a display panel, a touch sensor, and an antenna are connected. The body portion 22 may include a battery accommodating portion, and a battery 210 may be accommodated within the battery accommodating portion. An area that entirely covers the area of the battery compartment may be defined as the battery area (BA).

The rear cover 200 may cover the printed circuit board 220 and electronic devices 230 formed on the rear of the body 22.

For example, when using and charging the display device 20, an excessive amount of heat may be generated from the battery 210, and surrounding electronic devices may be damaged by the heat. Therefore, it is necessary to quickly dissipate the heat emitted from the battery 210 to the outside of the display device 20.

In exemplary embodiments, the heat dissipating foam tape 10 may be provided as a heat dissipating shock absorbing member that covers the entire area of the battery 210 within the battery area BA.

For example, the heat dissipating foam tape 10 may be attached to an area corresponding to the battery area BA of the rear cover 200. The first thermally conductive acrylic adhesive layer 120 of the heat dissipating foam tape 10 may be attached to the rear cover 200. When the rear cover 200 is coupled to the rear of the body 22, the heat dissipating foam tape 10 may be placed on the battery 210. At this time, the heat dissipation foam tape 10 and the battery 210 may be in direct contact or may be spaced apart at a predetermined interval.

Accordingly, heat generation of the display device 20 can be effectively controlled due to the excellent heat dissipation characteristics of the heat dissipation foam tape 10.

In exemplary embodiments, the heat dissipating foam tape 10 may be provided as a heat dissipating material or filler for a flexible device. For example, it can be applied to devices that have various shapes other than a flat plate or devices that are deformed during use to improve heat dissipation and impact resistance. In particular, the heat dissipating foam tape 10 may be suitable for flexible displays and portable devices, and for example, may protect the battery of a mobile phone from impact while dissipating heat generated from the battery.

Hereinafter, preferred embodiments are presented to aid understanding of the present invention, but these examples are only illustrative of the present invention and do not limit the scope of the appended claims, and are examples within the scope and technical idea of the present invention. It is obvious to those skilled in the art that various changes and modifications are possible, and it is natural that such changes and modifications fall within the scope of the appended patent claims.

Examples and Comparative Examples

A composition for forming a foam layer containing 20% by weight of a urethane binder (Noroo Paint, BF001), 20% by weight of graphite with a particle size of about 5㎛ or less, and the remaining amount of solvent (toluene and ethyl acetate mixed solvent) was prepared. Foamed hollow particles with a calcium carbonate shell and a particle diameter of about 30 μm were added as a foaming material in an amount of about 2% based on the total weight of the urethane-based binder.

The composition was applied on a substrate and dried to form a first urethane foam layer and a second urethane foam layer each having a thickness of about 45 μm.

A composition for forming an adhesive layer was prepared by mixing 20% by weight of acrylic adhesive resin (IMC-A300 from KH Tech), 10% by weight of graphite with a particle size of about 5㎛ or less, and the remaining amount of solvent.

The composition for forming an adhesive layer was applied, dried, and cured on one surface of the first urethane foam layer to form a first adhesive layer with a thickness of about 50 μm.

The composition for forming an adhesive layer was applied, dried, and cured on the other side of the first urethane foam layer on which the first point adhesive layer was not formed, thereby forming a second point adhesive layer with a thickness of about 3 μm.

The heat dissipation foam tape of Example 1 was prepared by attaching a urethane foam layer on the second point adhesive layer.

In the heat dissipation foam tape of Example 1, the heat dissipation foam tapes of Examples and Comparative Examples were prepared by adjusting the thicknesses of the urethane foam layer and the acrylic adhesive layer as shown in Table 1 below.

Thickness of the first acrylic adhesive layer (㎛) Thickness of the first urethane foam layer (㎛) Thickness of the second acrylic adhesive layer (㎛) Thickness of the third urethane foam layer (㎛) Total thickness (㎛) Example 1 50 45 3 45 143 Example 2 30 40 3 40 113 Example 3 30 80 3 80 193 Example 4 70 40 3 40 153 Example 5 70 80 3 80 233 Example 6 37 50 3 50 140 Comparative Example 1 - 50 - - 50 Comparative Example 2 - 50 3 50 103 Comparative Example 3 20 50 3 50 123 Comparative Example 4 80 50 3 50 183 Comparative Example 5 50 30 3 30 113 Comparative Example 6 50 90 3 90 233 Comparative Example 7 50 93 - - 143 Comparative Example 8 30 83 - - 113 Comparative Example 9 30 163 - - 193 Comparative Example 10 70 83 - - 153

The first point adhesive layer of the heat dissipating foam tape was attached to the area corresponding to the battery area (BA) on the inner side of the rear cover 200 of the display device 20, as shown in FIG. 4.

A heating device was disposed in the battery compartment of the body portion 22 of the display device 20 shown in FIG. 3, and a thermocouple was disposed on the surface of the insulating device.

Samples were prepared by attaching the rear cover 200 to the rear of the body 22 so that the heat dissipating foam tape faces the battery 210.

In Comparative Examples 1 and 2, the first urethane foam layer was directly attached to the rear cover 200.

Experimental example: temperature measurement

For the prepared samples, the average temperature and maximum temperature for about 1 hour were measured using a thermal imaging camera while maintaining the temperature at about 60°C by operating the electric heating device, and the temperature (T.C.) was measured using a thermocouple as shown in the table below. It is shown in 2.

Temperature (℃) best average T.C. Example 1 57.5 53.4 64.1 Example 2 58.4 54.0 64.6 Example 3 57.4 53.4 64.1 Example 4 57.5 53.4 64.3 Example 5 58.3 53.8 64.6 Example 6 57.5 53.4 64.1 Comparative Example 1 59.8 55.7 66.0 Comparative Example 2 59.4 55.4 65.9 Comparative Example 3 59,4 54.9 65.4 Comparative Example 4 59.3 54.9 65.5 Comparative Example 5 59.4 55.0 65.5 Comparative Example 6 59.1 55.0 65.4 Comparative Example 7 61.3 60.8 67.2 Comparative Example 8 61.8 61.0 67.5 Comparative Example 9 60.9 60.5 66.9 Comparative Example 10 61.2 60.6 67.0

Referring to Table 2, it was confirmed that the heat dissipation characteristics of the examples were improved compared to Comparative Examples 1 and 2 that did not include the first acrylic adhesive layer. In addition, it was confirmed that the heat dissipation characteristics of the Examples were improved compared to Comparative Examples 3 to 6 in which the thickness of the first acrylic adhesive layer or the urethane foam layer was outside the above-mentioned range. In addition, compared to Comparative Examples 7 to 10 that did not include a second acrylic adhesive layer, it was confirmed that Examples 1 to 4 had improved heat dissipation characteristics when forming heat dissipation foam tapes with the same thickness.

Experimental example: Impact resistance evaluation

The heat dissipating foam tapes of the manufactured examples and comparative examples were cut into strip-shaped specimens with a size of 20mmХ20mm and a width of 0.7mm, and the cut specimens were attached between glass and an adherend (polycarbonate or metal plate). The energy at which the heat dissipating foam tape is destroyed was measured using a DuPont tester while varying the vertical weight heights of 50g and 100g, and the results are shown in Table 3 below.

Polycarbonate (mJ) Metal plate (mJ) Example 1 198 212 Example 2 185 197 Example 3 211 226 Example 4 187 199 Example 5 215 228 Example 6 194 201 Comparative Example 1 132 141 Comparative Example 2 172 178 Comparative Example 3 174 180 Comparative Example 4 177 182 Comparative Example 5 165 174 Comparative Example 6 184 191 Comparative Example 7 161 173 Comparative Example 8 156 165 Comparative Example 9 181 195 Comparative Example 10 160 171

Referring to Table 3, it was confirmed that the impact resistance of the examples was improved compared to Comparative Examples 1 and 2 that did not include the first acrylic adhesive layer. In addition, it was confirmed that the impact resistance of the Examples was improved compared to Comparative Examples 3 to 6 in which the thickness of the first acrylic adhesive layer or the urethane foam layer was outside the above-mentioned range. In addition, compared to Comparative Examples 7 to 10 that did not include the second acrylic adhesive layer, it was confirmed that Examples 1 to 4 had improved impact resistance when forming a heat dissipating foam tape with the same thickness.

10, 12: Heat dissipation foam tape
110: First thermally conductive urethane foam layer
120: First thermally conductive acrylic adhesive layer
130: Second thermally conductive acrylic adhesive layer
140: Second thermally conductive urethane foam layer
190: stacking unit

Claims (11)

A foam layer including a first thermally conductive urethane foam layer and a second thermally conductive urethane foam layer, each having a thickness of 40 to 80㎛;
A first thermally conductive acrylic adhesive layer disposed on the bottom of the first thermally conductive urethane foam layer and having a thickness of 30 to 70㎛; and
It includes a second thermally conductive acrylic adhesive layer having a thickness of 1 to 7㎛, which is disposed between the first thermally conductive urethane foam layer and the second thermally conductive urethane foam layer and is in direct contact with the foam layer,
The foam layer includes a urethane-based binder and a thermally conductive filler,
The first thermally conductive acrylic adhesive layer includes an acrylic adhesive resin and a thermally conductive filler,
The first thermally conductive acrylic adhesive layer further includes boron nitride (BN).
The heat dissipating foam tape of claim 1, wherein the second thermally conductive urethane foam layer and the second thermally conductive acrylic adhesive layer are alternately and repeatedly laminated while in contact with each other.
The heat dissipating foam tape of claim 1, wherein the first thermally conductive urethane foam layer and the second thermally conductive urethane foam layer have the same thickness.
The method according to claim 1, wherein the total thickness of the heat dissipating foam tape is 120 to 250㎛, heat dissipating foam tape.
delete delete The heat dissipating foam tape of claim 1, wherein the weight ratio of the urethane-based binder and the thermally conductive filler is 1:1 to 4:1.
delete delete The heat dissipating foam tape of claim 1, further comprising a release film attached to the bottom of the first thermally conductive acrylic adhesive layer.
The heat dissipating foam tape according to claim 1, wherein the heat dissipating foam tape is applied as a heat dissipating shock absorbing member between the rear cover of the display device and the battery.