KR102599870B1 - Heat inspection apparatus and heat inspection method using the same - Google Patents

Abstract

The present invention relates to a fever test device and a fever test method using the same.
More specifically, the present invention relates to a heat test device for testing heat generation characteristics of a printed circuit board (PCB) using a chamber and an IR camera unit, and a heat test method using the same.
The fever test device according to the present invention includes a housing part with a space for placing at least one PCB (Printed Circuit Board) inside, a door part mounted on the housing part and opening and closing the space of the housing part ( Door Part), at least one connecting terminal part connected to the PCB, and a driving signal supplying part that supplies a driving signal to the PCB through the connecting terminal part. And it may include an infrared camera part (IR Camera Part) that takes thermal images of the PCB while a driving signal is supplied to the PCB.

Description

Fever test device and fever test method using the same {HEAT INSPECTION APPARATUS AND HEAT INSPECTION METHOD USING THE SAME}

The present invention relates to a fever test device and a fever test method using the same.

More specifically, the present invention relates to a heat test device for testing heat generation characteristics of a printed circuit board (PCB) using a chamber and an IR camera unit, and a heat test method using the same.

In general, a printed circuit board (PCB) may refer to a thin plate on which electrical components such as integrated circuits, resistors, or switches are placed.

These PCBs can be used in various electronic products such as computers.

In the early stages of manufacturing electronic products including a PCB, a PCB prototype can be designed and manufactured, and an electronic product prototype can be manufactured using the PCB prototype.

Conventionally, the heat generation characteristics of the PCB were tested while operating an electronic product prototype.

If excessively high heat is generated in the PCB as a result of the operation of the electronic product prototype, the design of the PCB must be changed.

In this case, since the heating characteristics of the PCB can be tested only after the electronic product prototype is completed, the time and cost required to manufacture the electronic product may increase excessively.

As a prior art for inspecting a PCB, Korean Patent Publication No. 10-2016-0009874 (title of the invention: PCB test device) [Document 1] describes a technical configuration that measures the heat conduction characteristics of the PCB when heat is applied to the PCB within the case. is posting.

Since the technology according to Document 1 does not operate the PCB but directly applies heat to the PCB, there is a problem in that it is difficult to determine in advance what kind of heat generation characteristics the PCB has during operation in an electronic product.

[Document 1] Republic of Korea Patent Publication No. 10-2016-0009874

The purpose of the present invention is to provide a heat test device that can test the heat generation characteristics of a PCB in advance using a chamber and an IR camera unit before mounting the PCB on an electronic product, and a heat test method using the same.

Another purpose of the present invention is to provide a heat test device and a heat test method using the same that can suppress or prevent the occurrence of heat problems by quickly identifying the heat generation characteristics of the PCB in advance at the initial stage of PCB manufacturing.

Another object of the present invention is to provide a heat test device and a heat test method using the same that fully understand the heat generation characteristics of a PCB, have a sufficiently low manufacturing cost, and are sufficiently small in size.

The fever test device according to the present invention includes a housing part with a space for placing at least one PCB (Printed Circuit Board) inside, a door part mounted on the housing part and opening and closing the space of the housing part ( Door Part), at least one connecting terminal part connected to the PCB, and a driving signal supplying part that supplies a driving signal to the PCB through the connecting terminal part. And it may include an infrared camera part (IR Camera Part) that takes thermal images of the PCB while a driving signal is supplied to the PCB.

In addition, the connection terminal unit includes a first connection terminal unit and a second connection terminal unit corresponding to different driving signals, and when the door unit is closed, the wall of the housing unit facing the door unit is called a first wall. In this case, the gap between the connection terminal and the door may be smaller than the gap between the connection terminal and the first wall.

In addition, it may further include a connecting cord connecting the connection terminal portion and the PCB.

Additionally, when the PCB is placed inside the housing, the connection cord may include a portion that passes between the PCB and the lower surface of the housing.

In addition, it further includes a display part that displays a thermal image of the PCB captured by the infrared camera unit during a preset reference period on a screen, and the driver detects at least one electronic component included in the PCB from the thermal image. It may further include a temperature information extraction unit that extracts information about temperature changes within the reference period.

In addition, it is disposed within the housing part and further includes a tray part on which the PCB is placed, and the tray part may include an electrically conductive material.

In addition, it may further include a fastening means for electrically connecting the PCB and the tray unit.

Additionally, the fastening means may have a pin shape.

In addition, it may further include a visible light camera part (VR Camera Part) that takes pictures of the PCB while the PCB is placed in the housing part.

In addition, the driving unit may further include a component determination unit that determines at least one electronic component mounted on the PCB from the image captured by the visible light camera unit.

In addition, the step of inputting map data containing location information about the location of at least one component mounted on the PCB on the PCB may be further included.

Additionally, map data may include various information such as location information of electronic components on the PCB, name information, and type information of electronic components.

The heat test device and heat test method using the same according to the present invention have the effect of reducing the time and cost required for manufacturing electronic products because the heat generation characteristics of the PCB can be tested in advance before mounting the PCB on the electronic product. there is.

1 is a diagram for explaining the configuration of a fever test device according to the present invention.
2 to 4 are diagrams for explaining the connection terminal unit in detail.
5 to 8 are diagrams for explaining the electrical connection between the connection terminal portion and the PCB.
9 to 12 are diagrams for explaining the fastening means.
Figure 13 is a diagram for explaining the visible light camera unit.
14 to 16 are diagrams for explaining the driving unit.
17 to 18 are diagrams for explaining a fever test method using a fever test device according to the present invention.
19 to 28 are diagrams to explain a method of extracting temperature information for each PCB and/or electronic component.

Hereinafter, a fever test device and a fever test method using the same according to the present invention will be described in detail with reference to the attached drawings.

Since the present invention can make various changes and have various embodiments, specific embodiments will be illustrated in the drawings and described in detail in the detailed description. This is not intended to limit the present invention to specific embodiments, but may be understood to include all changes, equivalents, and substitutes included in the spirit and technical scope of the present invention.

In describing the present invention, terms such as first and second may be used to describe various components, but the components may not be limited by the terms. The above terms may be used only for the purpose of distinguishing one component from another. For example, a first component may be referred to as a second component, and similarly, the second component may be referred to as a first component without departing from the scope of the present invention.

The term and/or may include any of a plurality of related stated items or a combination of a plurality of related stated items.

When a component is said to be "connected" or "connected" to another component, it means that it may be directly connected to or connected to that other component, but that other components may also exist in between. It can be understood. On the other hand, when a component is referred to as being “directly connected” or “directly connected” to another component, it can be understood that there are no other components in between.

The terms used in this document are only used to describe specific embodiments and are not intended to limit the invention. Singular expressions may include plural expressions, unless the context clearly indicates otherwise.

In this document, terms such as “comprise” or “have” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and one or more other features. It can be understood that it does not exclude in advance the possibility of the existence or addition of elements, numbers, steps, operations, components, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by a person of ordinary skill in the technical field to which the present invention pertains. Terms defined in commonly used dictionaries can be interpreted as having meanings consistent with the meanings they have in the context of related technologies, and unless clearly defined in this application, are interpreted as having an ideal or excessively formal meaning. It may not work.

In addition, the embodiments disclosed in this document are provided to provide a more complete explanation to those with average knowledge in the art, and the shapes and sizes of elements in the drawings may be exaggerated for clearer explanation.

In describing the present invention in this document, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description may be omitted.

Various embodiments described in this document may be implemented in a recording medium readable by a computer or similar device using software, hardware, or a combination thereof.

According to hardware implementation, embodiments of the present invention include ASICs (application specific integrated circuits), DSPs (digital signal processors), DSPDs (digital signal processing devices), PLDs (programmable logic devices), and FPGAs (field programmable gate arrays). It may be implemented using at least one of processors, controllers, micro-controllers, microprocessors, and electrical units for performing functions.

Meanwhile, according to software implementation, embodiments such as procedures or functions in the present invention may be implemented with a separate software module that performs at least one function or operation.

Hereinafter, the first direction (First Direction, DR1) intersects (perpendicularly) the second direction (Second Direction, DR2) and the third direction (DR3), and the second direction (DR2) intersects (perpendicularly) the second direction (DR2) and the third direction (DR3). ) can intersect (perpendicularly).

Here, the first direction DR1 and the second direction DR2 can be collectively referred to as the horizontal direction.

In addition, the third direction (DR3) can be referred to as the vertical direction.

1 is a diagram for explaining the configuration of a fever test device according to the present invention.

Looking at Figure 1, the fever inspection device (1A, hereinafter referred to as 'test device') according to the present invention includes a housing part (10), a door part (20), and a connecting terminal part (Connecting Terminal). Part (not shown), a driving part (30), and an infrared camera part (IR Camera Part (60), not shown) may be included.

The housing portion 10 may have a space therein for placing at least one PCB (Printed Circuit Board, 40). For example, the housing unit 10 may have a hexahedral shape with a space therein.

The PCB 40 is a board used in electronic products such as computers and home appliances and may include various electronic components (EP) such as integrated circuits (ICs), resistors, and capacitors.

In order to stably place the PCB 40 inside the housing part 10, a tray part 40 (not shown) may be placed inside the housing part 10.

The PCB 40 may be placed on the tray unit 40 within the housing unit 10.

In order to ground the PCB 40, the tray portion 40 may include an electrically conductive material such as metal.

The door unit 20 is mounted on the housing unit 10 and can open and close the internal space of the housing unit 10.

The housing portion 10 may have sufficient thermal insulation performance to insulate the interior of the housing portion 10. To this end, it is possible for the door part 20 to have sufficient insulation performance in order to secure sufficient insulation performance when the door part 20 is closed and blocks the internal space of the housing part 10 (closed).

A plurality of connection terminal units 60 may be provided within one housing unit 10 .

When the door part 20 is closed, the connection terminal part 60 may be located in the inner space of the housing part 10.

Among the plurality of connection terminal parts 60, at least two connection terminal parts 60 may have different shapes. For example, at least two connection terminal units 60 may have different numbers of connection pins.

In addition, at least two of the plurality of connection terminal units 60 may have different voltages and/or currents of corresponding driving signals. That is, the two connection terminal units 60 may correspond to different driving signals.

The driving unit 30 can drive the inspection device 1A according to the present invention.

For this purpose, the driver 30 may include a driving signal supply part (not shown).

The driving signal supply unit may supply a driving signal to the PCB disposed in the housing unit 10 through the connection terminal unit 60.

This driving unit 30 will be described in more detail later.

Although not shown, the infrared camera unit can capture thermal images of the PCB placed in the housing unit 10 while a driving signal is supplied to the PCB.

The inspection device 1A according to the present invention may further include a display part 50.

The display unit 50 can display on the screen the thermal image of the PCB captured by the infrared camera unit during a preset reference period.

This inspection device 1A will be described in more detail below.

2 to 4 are diagrams for explaining the connection terminal unit in detail. Hereinafter, descriptions of parts described in detail above may be omitted.

Looking at FIGS. 2 and 3 , the connection terminal unit 60 may be disposed on the lower wall (LW) of the housing unit 10.

In addition, there may be a plurality of connection terminal units 60.

For example, the connection terminal 60 may include a first connection terminal 61, a second connection terminal 62, a third connection terminal 63, and a fourth connection terminal 64.

At least one of the first connection terminal 61, the second connection terminal 62, the third connection terminal 63, or the fourth connection terminal 64 may have a different shape from the others.

For example, as shown in FIG. 3, the first connection terminal portion 61, the second connection terminal portion 62, the third connection terminal portion 63, and the fourth connection terminal portion 64 each have different shapes. You can. In detail, the second connection terminal 62 may have a 2-pin shape, and the third connection terminal 63 may have a 3-pin shape.

2 and 3 illustrate an example of the shape of the connection terminal portion 60, and the present invention may not be limited thereto. For example, at least one connection terminal portion 60 may have a 4-pin, 5-pin, etc. shape.

At least one of the first connection terminal 61, the second connection terminal 62, the third connection terminal 63, or the fourth connection terminal 64 may correspond to a different driving signal from the others.

For example, the first connection terminal 61 may correspond to a driving signal with a driving voltage of 5V, and the second connection terminal 62 may correspond to a driving signal with a driving voltage of 12V. Expressed differently, the first connection terminal unit 61 becomes a path for supplying a driving signal with a 5V driving voltage to the connected PCB, and the second connection terminal unit 62 supplies a driving signal with a 12V driving voltage to the connected PCB. It is possible to become a supply channel.

Here, an example of a driving signal corresponding to the connection terminal portion 60 has been described, and the present invention may not be limited thereto. For example, at least one connection terminal unit 60 may be able to correspond to a driving signal having a driving voltage of 0.5V, 1.5V, or 20V.

In addition, it is possible for different driving signals to have different currents.

For example, the first connection terminal 61 may correspond to a driving signal with a 5V driving voltage and a 1 mA current, and the second connection terminal 62 may correspond to a driving signal with a 5V driving voltage and a 1.2 mA current. do.

Let us assume that the first connection terminal 61 corresponds to a first driving signal, and the second connection terminal 62 corresponds to a second driving signal different from the first driving signal.

In this case, at least one of the current and voltage of the first driving signal may be different from at least one of the current and voltage of the second driving signal.

In the above, only current and voltage are described for the driving signal, but the present invention may not be limited thereto.

For example, the driving signal supplied to the PCB through the connection terminal 60 may further include a clock signal, a data signal, etc.

Considering this, different driving signals may have different at least one of a voltage component, a current component, a clock signal component, or a data signal component.

2 and 3, it is assumed that the number of connection terminal units 60 is four, but the present invention may not be limited to this. For example, in the present invention, the number of connection terminal units 60 can be varied, such as 2, 3, or 5.

As shown in FIG. 2, an infrared camera unit 70 may be disposed on the upper wall (UW) of the housing unit 10.

The infrared camera unit 70 can capture thermal images of the PCB placed on the tray unit 40 within the housing unit 10.

Here, the thermal image may refer to an image of the PCB captured by the infrared camera unit 70 in a state in which at least one connection terminal unit 60 is connected to the PCB and a driving signal is supplied.

In addition, the thermal image captured by the infrared camera unit 70 may be a photo-type image or a video-type image. Preferably, in order to more clearly determine changes in the thermal characteristics of the PCB, it may be desirable for the thermal image captured by the infrared camera unit 70 to be a video type image.

The connection terminal unit 60 may be located between the door unit 20 and the tray unit 40 when the door unit 20 is closed.

For example, as shown in FIG. 4, assume that the door 20 is closed and the internal space of the housing 10 is shielded.

In this shielding state, the distance D1 between the door 20 and the connection terminal 60 in the first direction DR1 is greater than the distance D2 between the connection terminal 60 and the rear wall (RW). It could be smaller.

Here, the rear wall (RW) may refer to the wall of the housing unit 10 facing the door unit 20 when the door unit 20 is closed (shielded state). In the claims, the rear wall (RW) is referred to as the first wall.

Hereinafter, a method of connecting the connection terminal portion 60 and the PCB will be described with reference to the attached drawings.

Figures 5 to 8 are diagrams for explaining the electrical connection between the connection terminal portion and the PCB. Hereinafter, descriptions of parts described in detail above may be omitted.

Looking at FIG. 5, the connection terminal portion 60 and the PCB may be electrically connected by a connecting cord (CC). For this purpose, terminals may be placed on both sides of the connection cord (CC).

In this way, when connecting the connection terminal part 60 and the PCB using the connection cord (CC), the size of the housing part 10 can be reduced and the overall weight of the inspection device 1A can be reduced. In other words, it may be possible to slim and weigh the inspection device 1A.

Looking at FIG. 6, a support portion 41 may be disposed below the tray portion 40. From another perspective, the support portion 41 may be disposed between the tray portion 40 and the lower wall LW of the housing portion 10.

The width W1 of the tray portion 40 in the second direction DR2 may be larger than the width W2 of the support portion 41.

In this case, both ends of the tray portion 40 may extend further than the support portion 41 in the second direction DR2.

Accordingly, a predetermined space may be provided between both ends of the tray portion 40 and the lower wall LW of the housing portion 10. The space provided between the tray portion 40 and the lower wall (LW) of the housing portion 10 is indicated by a dotted line.

Hereinafter, the space provided between the tray part 40 and the lower wall LW of the housing part 10 may be referred to as a code space.

Looking at FIG. 7, a connection cord (CC) that electrically connects the connection terminal portion 60 and the PCB may pass through the code space.

From another perspective, one end of the connection cord (CC) is connected to the connection terminal portion 60, the other end of the connection cord (CC) is connected to the PCB, and the connection cord (CC) is between one end and the other end. may include parts that pass through code space.

In this case, it is possible to prevent the connection cord CC from interfering with thermal image capturing by the infrared camera unit 70.

Meanwhile, it is possible for multiple PCBs to be disposed within the housing portion 10.

For example, as shown in FIG. 8, a first PCB (PCB1) and a second PCB (PCB2) may be placed together on the upper part of the tray unit 40 within the housing unit 10.

The first PCB (PCB1) is disposed adjacent to the door part 20, and the second PCB (PCB2) is disposed between the first PCB (PCB1) and the rear wall (RW) of the housing part 10 in the first direction (DR1). It can be located between .

The first connection cord (CC1) electrically connects the first PCB (PCB1) and the connection terminal portion 60, and the second connection cord (CC2) electrically connects the second PCB (PCB2) and the connection terminal portion 60. You can.

In this case, the second connection cord CC2 may include a part passing through the space between the tray part 40 and the lower wall LW of the housing part 10, that is, the cord space.

When a cord space is provided between the tray part 40 and the lower wall (LW) of the housing part 10, thermal images of the connection cord (CC) are captured even when a plurality of PCBs of the tray part 40 are placed. It is possible to prevent interference with .

The tray unit 40 and the PCB can be fastened by a predetermined fastening member. This is as follows with reference to the attached drawings.

9 to 12 are diagrams for explaining the fastening means. Hereinafter, descriptions of parts described in detail above may be omitted.

Looking at FIG. 9, a first hole (First Hole, H1) may be formed in the PCB, and a second hole (Second Hole, H2) corresponding to the first hole (H1) may be formed in the tray unit 40.

The first hole H1 may have a shape that penetrates the PCB, and the second hole (H2) may have a shape that penetrates the tray unit 40 or may have a groove shape that is recessed to a predetermined depth.

A fastening means (FM) such as a screw or a pin may pass through the first hole (H1) and be connected to the second hole (H2). Accordingly, the PCB can be fixed to the tray portion 40.

When the tray portion 40 and the fastening means (FM) include an electrically conductive material, it is possible to stably ground the PCB through the fastening means (FM). In this case, it is possible to perform tests on the heating characteristics of the PCB more reliably.

At the beginning of the PCB manufacturing stage, it may be difficult to clearly determine whether the PCB will operate normally.

When the PCB is grounded to the tray unit 40 using the fastening means (FM), serious problems such as destruction of the PCB can be suppressed or prevented even when the PCB operates abnormally.

Looking at FIG. 10, a plurality of second holes H2 may be formed in the tray portion 40.

In this way, when the number of second holes H2 formed in the tray unit 40 is plural, it may be possible to correspond to various types of PCBs.

For example, the positions of the first holes H1 may be different in different PCBs. Considering this, by forming a plurality of second holes H2 in the tray unit 40, various types of PCBs can be stably connected (grounded) to the tray unit 40.

The fastening means (FM) may preferably have a pin shape.

For example, as shown in (A) of FIG. 11, the fastening means (FM) may include a head part (HP) and a pillar part (PP).

As shown in FIG. 11 (B), the fastening means (FM) may pass through the first hole (H1) and be fastened to the second hole (H2).

The pillar portion PP can have a smooth surface. Accordingly, the fastening means (FM) can be inserted into the first hole (H1) and the second hole (H2) without rotating.

The diameter of the head portion (HP) may be larger than the diameter of the pillar portion (PP).

The head (HP) may contact the upper surface of the PCB. Accordingly, the PCB and the tray unit 40 can be easily electrically connected.

This case may correspond to a case where a terminal for grounding is formed on the upper surface of the PCB.

Alternatively, as shown in Figure 12 (A), the fastening means (FM) includes a first pillar part (PP1), a head part (HP), and a second pillar part (PP2). It can be included.

The head part HP may be located between the first pillar part PP1 and the second pillar part PP2.

The first pillar portion PP1 and the second pillar portion PP2 may have a smooth surface.

The diameter of the head part HP may be larger than the diameters of the first pillar part PP1 and the second pillar part PP2.

As shown in (B) of FIG. 12, the fastening means (FM) may be located between the PCB and the tray portion 40.

In detail, the first pillar part PP1 may be inserted into the first hole H1 of the PCB, and the second pillar part PP2 may be inserted into the second hole H2 of the tray part 40.

The head part (HP) may contact the lower surface of the PCB between the PCB and the tray part 40. Accordingly, the PCB and the tray unit 40 can be easily electrically connected.

This case may correspond to a case where a terminal for grounding is formed on the lower surface of the PCB.

By using this pin-type fastening means (FM), it is possible to easily fasten (ground) the PCB and the tray portion 40 without equipment such as a driver.

In addition, even when the size of the housing unit 10 is relatively small, it may be possible to easily fasten (ground) the PCB to the tray unit 40.

Meanwhile, the inspection device 1A according to the present invention may further include a visible light camera unit capable of taking general images of the PCB. This is as follows with reference to the attached drawings.

Figure 13 is a diagram for explaining the visible light camera unit. Hereinafter, descriptions of parts described in detail above may be omitted.

Looking at (A) of FIG. 13, the inspection device 1A according to the present invention may further include a visible light camera part (VR Camera Part, 80).

The visible light camera unit 80 can take thermal images of the PCB disposed on the upper part of the tray unit 40 within the housing unit 10.

The image captured by the visible light camera unit 80 may mean an image corresponding to the visible light region.

Hereinafter, an image may refer to an image captured by the visible light camera unit 80, unlike a thermal image.

In order to effectively match the thermal image of the PCB captured by the infrared camera unit 70 and the image captured by the visible light camera unit 80, the infrared camera unit 70 and the visible light camera unit 80 are sufficiently close. It is possible to locate them adjacently.

For example, the infrared camera unit 70 and the visible light camera unit 80 may be configured as one module.

In order to effectively capture an image of the PCB with the door 20 closed, it may be desirable to install at least one lighting part 90 inside the housing 10.

For example, at least one lighting unit 90 may be disposed on the upper wall (UW), right side wall (RSW), and left side wall (LSW) of the housing unit 10, respectively.

Meanwhile, as shown in FIG. 13 (B), a plurality of visible light camera units 80 may be disposed within the housing unit 10.

For example, the visible light camera unit 80 includes a top camera unit 80T disposed on the upper wall (UW) of the housing unit 10, and a right camera unit disposed on the right wall (RSW) of the housing unit 10. It may include (80R) and a left camera unit (80L) disposed on the left wall (LSW) of the housing unit (10).

The top camera unit (80T) can capture images of the front of the PCB from the top of the PCB.

The right camera unit 80R and the left camera unit 80L can capture images of the side of the PCB.

Hereinafter, the driving unit 30 will be examined in detail with reference to the attached drawings.

14 to 16 are diagrams for explaining the driving unit. Hereinafter, descriptions of parts described in detail above may be omitted.

Referring to FIG. 14 , the driver 30 may include a control unit 300, a communication unit 310, an interface unit 320, a drive signal supply unit 330, a memory unit 340, and a user input unit 350.

Since the components shown in FIG. 14 are not essential, it is also possible to implement the driving unit 30 with more or fewer components.

The communication unit 310 can communicate with an external device under the control of the control unit 300. For example, the communication unit 310 may communicate with other devices or servers through the Internet under the control of the control unit 300.

The interface unit 320 may provide a passage for connecting the drive unit 30 and other devices. For example, other electronic devices, external memory, etc. may be connected to the driving unit 30 through the interface unit 320.

The driving signal supply unit 330 may supply a driving signal to at least one PCB connected to the connection terminal unit 60 under the control of the control unit 300.

To this end, the driving signal supply unit 330 may generate various driving signals different in at least one of a voltage component, a current component, a clock signal component, or a data signal component under the control of the control unit 300.

The memory unit 340 can store various information, data, programs, etc. necessary for driving the inspection device 1A.

In addition, the memory unit 340 can store various information such as map data for the PCB, a thermal image of the PCB, and an image of the PCB.

The user input unit 350 may include key input means such as buttons through which the user can input various commands, data, etc.

The control unit 300 can control the overall operation of the inspection device 1A.

For example, the control unit 300 can control the supply of a driving signal to the PCB through the connection terminal unit 60.

The control unit 300 can control the infrared camera unit 70 to capture thermal images of the PCB.

The control unit 300 can control the capture of images of the PCB by controlling the visible light camera unit 80.

The control unit 300 can control on/off of the lighting unit 90.

The control unit 300 may control the inspection device 1A in response to the closing and opening of the door unit 20. For example, the control unit 300 controls the infrared camera unit 70 to stop taking thermal images of the PCB when the door unit 20 is open, and to stop taking thermal images of the PCB when the door unit 20 is closed. Filming can resume.

In FIG. 1 , a case in which the housing unit 10 and the drive unit 30 are provided separately has been described, but the present invention may not be limited to this. For example, the housing part 10 and the driving part 30 may be formed integrally, or a part of the driving part 30 may be formed integrally with the housing part 10.

For example, as shown in FIG. 15, it is possible to place the user input unit 350 in the housing unit 10.

In order to implement various functions of the control unit 300, as shown in FIG. 16, the control unit 300 includes a power selection unit 301, a thermal image analysis unit 302, a temperature information extraction unit 303, and map data. Analysis unit 304a, image analysis unit 304b, PCB determination unit 305a, component determination unit 305b, alarm unit 306, defect determination unit 307, replacement product search unit 308, and emergency stop unit. It may include (309).

Since the components shown in FIG. 16 are not essential, it is also possible to implement the control unit 300 with more or fewer components.

The power selection unit 301 may select at least one drive signal to be supplied to the PCB connected to the connection terminal unit 60 from among various drive signals.

The thermal image analysis unit 302 can capture a thermal image of the PCB captured by the infrared camera unit 70.

The temperature information extraction unit 303 may extract temperature information of the PCB and/or temperature information of electronic components included in the PCB based on the results analyzed by the thermal image analysis unit 302.

From another perspective, information about the temperature change of at least one electronic component included in the PCB within a reference period can be extracted from the thermal image of the PCB.

The image analysis unit 304b can analyze the image of the PCB captured by the visible light camera unit 80.

In addition, the image analysis unit 304b can output map data as a result of analyzing the image of the PCB.

The map data analysis unit 304a can analyze map data.

For example, the map data analysis unit 304a may analyze map data directly input by the user and/or map data output by the image analysis unit 304b.

The PCB determination unit 305a may determine at least one PCB disposed on the upper part of the tray unit 40 based on the results analyzed by the map data analysis unit 304a.

The component determination unit 305b may determine at least one electronic component disposed on the PCB based on the analysis result by the map data analysis unit 304a.

The alarm unit 306 can detect if the PCB operates abnormally to the extent that it may be destroyed during the PCB inspection process and notify the user through audio and/or video.

The defect determination unit 307 may determine whether the PCB and/or the electronic components placed on the PCB are defective based on the temperature information of the temperature information extraction unit 303.

The replacement product search unit 308 may search the Internet for replacement products for the PCB and/or electronic component determined by the defect determination unit 307 and provide search results.

The emergency stop unit 309 may block the supply of a driving signal to the PCB and stop the inspection process if the PCB operates abnormally to the extent that it may be destroyed during the PCB inspection process.

The functions and operations of the driving unit 30 described above can be made clearer through the following description.

17 to 18 are diagrams for explaining a fever test method using a fever test device according to the present invention. Hereinafter, descriptions of parts described in detail above may be omitted.

A method of inspecting the heat generation characteristics of a PCB using the inspection device 1A according to the present invention will be described below.

As shown in FIG. 17, the PCB to be inspected and the connection terminal unit 60 can first be connected (S100).

Afterwards, the PCB connected to the connection terminal unit 60 can be placed on the upper part of the tray unit 40 within the housing unit 10 (S110).

In addition, it is possible to fasten (ground) the PCB to the tray unit 40 using a predetermined fastening means.

Afterwards, the type of driving signal required to drive the PCB can be determined, and a predetermined driving signal can be selected according to the determination result (S120). This can be performed by the power selection unit 301 of the control unit 300 of the driver 30.

Afterwards, the time to perform the PCB inspection can be set (S130). From another perspective, it is possible to supply a driving signal to the PCB and set the time for the infrared camera unit 70 to capture a thermal image of the PCB in this state.

Afterwards, a driving signal can be supplied to the PCB (S140).

And the infrared camera unit 70 can start taking thermal images of the PCB (S150).

Through this process, you can begin testing the heat generation characteristics of the PCB.

Afterwards, the thermal image of the PCB can be analyzed to determine whether the temperature of the PCB exceeds the preset critical temperature (S160).

For example, the thermal image analysis unit 302 may analyze the thermal image of the PCB being photographed, and the temperature information extraction unit 303 may extract temperature information of the PCB according to the analysis results.

In addition, the emergency stop unit 309 can determine whether the temperature information of the PCB extracted by the PCB exceeds a preset critical temperature.

Here, it may mean a temperature that is excessively high enough to destroy the PCB. If the PCB operates abnormally, there is a possibility that a temperature exceeding the critical temperature may occur in the PCB.

As a result of the determination in step S160, if the temperature of the PCB is above the critical temperature, the inspection can be emergency stopped and the supply of the driving signal to the PCB can be blocked (S170).

Afterwards, the alarm unit 307 may notify that an abnormality has occurred (S180).

In addition, the recording of the thermal image of the PCB can be ended (S190).

On the other hand, as a result of the determination in step S160, if the temperature of the PCB is below the critical temperature, it can be determined whether the preset inspection time (set time) has been reached (S200).

If, as a result of the determination in step S160, the set time has not been reached, the process may proceed again to step S160.

On the other hand, if the set time has been reached as a result of the determination in step S160, the supply of the driving signal to the PCB can be blocked (S210).

Afterwards, the end of thermal imaging of the PCB is notified (S220), and thermal imaging can be ended (S190).

Figure 18 shows an example of a thermal image of a PCB captured by the infrared camera unit 7.

Looking at Figure 18, the heat generated from the PCB is indicated by a predetermined color. Parts with higher heat may be displayed closer to red, and parts with lower heat may be displayed closer to blue.

Using these thermal images, it is possible to intuitively, quickly and easily determine how much heat will be generated in which part during the PCB driving process.

Accordingly, PCB designers can check thermal images and quickly and easily change the design as needed. Accordingly, the time required to develop PCBs and/or electronic products can be reduced, and it is possible to reduce development costs.

In addition, the manufacturing cost of the inspection device 1A can be sufficiently reduced by using a simple structure using the housing unit 10 and the infrared camera unit 70. Accordingly, the designer of the PCB can individually use the inspection device 1A according to the present invention, so that the design of the PCB and/or electronic products can proceed more quickly.

Meanwhile, in the inspection device 1A according to the present invention, it is possible to classify and extract temperature information for each electronic component placed on the PCB. Regarding this, please refer to the attached drawings as follows.

19 to 28 are diagrams to explain a method of extracting temperature information for each PCB and/or electronic component. Hereinafter, descriptions of parts described in detail above may be omitted.

First, let's look at how to classify and determine the PCB and/or the electronic components placed on the PCB as follows.

Looking at FIG. 19, it can be determined whether map data exists after setting the inspection time (S300).

Map data may correspond to the PCB to be inspected.

For example, map data may include information about the overall size of the PCB, information about the location, type, name, capacity, number, etc. of electronic components placed on the PCB.

An example of such map data is shown in FIG. 20.

In FIG. 20, IC1, IC2, and IC3 may refer to integrated circuits placed on the PCB, and C1, C2, and C3 may refer to capacitors placed on the PCB.

Here, map data containing information about integrated circuits and capacitors among the electronic components placed on the PCB are described as an example, but information about any electronic component that can generate heat may be included in the map data.

Map data can be written directly by the user and input into the driving unit 30. For example, a PCB designer may be able to create map data such as a drawing for the PCB using a program such as CAD and input it into the driving unit 30.

As a result of the determination in step S300, if map data exists, the map data analysis unit 304a can analyze the map data (S310).

Thereafter, the PCB determination unit 305a may determine whether the number of PCBs disposed in the housing unit 10 is plural (S320).

As a result of the determination in step S320, when there are multiple PCBs, the PCB determination unit 305a can distinguish and determine each PCB (S330).

Map data in the case where there are multiple PCBs is shown in FIG. 21.

Looking at FIG. 21, it can be seen that at least one electronic component is disposed on each of the first PCB (PCB1) and the second PCB (PCB2).

Afterwards, at least one electronic component placed on the PCB can be distinguished and determined (S340).

Meanwhile, if the number of PCBs is one rather than plural as a result of the determination in step S320, there is no need to distinguish the PCBs, so at least one electronic component arranged on the PCB can be distinguished and determined (S340).

Meanwhile, if the determination result in step S300 is that there is no map data, an image of the PCB can be captured using the visible light camera unit 80 (S350).

An example of a PCB image captured by the visible light camera unit 80 is shown in FIG. 22.

Looking at FIG. 22, the image of the PCB captured by the visible light camera unit 80 may be a photo-type image.

The image of the PCB as shown in FIG. 22 may be an image captured by the top camera unit 80T of the visible light camera unit 80.

Afterwards, the image analysis unit 304b may analyze the image of the PCB (S360).

In addition, the image analysis unit 304b may output map data of the PCB as a result of analyzing the image of the PCB.

An example of PCB map data output by the image analysis unit 304b is shown in FIG. 23.

The image analysis unit 304b is capable of acquiring various information such as the name, number, color, and shape of at least one electronic component from the PCB image, and creating and outputting map data based on the obtained information.

For example, the image analysis unit 304b may obtain information such as the number, name, shape, and number of pins of the integrated circuit from the PCB image and determine the integrated circuit based on this.

Alternatively, the image analysis unit 304b may determine the resistance based on the shape of the resistance and determine the resistance value of the resistor by analyzing the color band displayed on the surface of the determined resistance.

It is possible for a user to directly input map data into the driving unit 30, and it may also be possible for the image analysis unit 304b to analyze and output image information.

After the image analysis step (S360), the process may proceed to step S310. Since step S310 has been previously described, redundant description will be omitted.

Meanwhile, PCB images can be captured from various angles.

For example, as shown in FIG. 24, it may be possible to photograph the side of the PCB using the right camera unit 80R of the visible light camera unit 80.

In this case, it may be easy to distinguish and distinguish electronic components such as capacitors (C) arranged vertically on the PCB.

Considering this, the image analysis unit 304b analyzes images captured by at least one visible light camera unit 80, preferably a plurality of visible light camera units 80, and creates a map based on the analysis results. It is possible to output data.

For example, it may be difficult to determine the type, capacity, etc. of a capacitor placed vertically on a PCB using only the image captured by the top camera unit 80T of the visible light camera unit 80.

Referring to FIG. 25, when a plurality of PCBs are disposed on the tray unit 40, it is possible to form a paint layer 42 on the surface of the tray unit 40 to distinguish and distinguish each PCB.

Here, the graphic layer 42 is used to more easily distinguish and determine the PCB in the image captured by the visible light camera unit 80, and may be capable of reflecting or absorbing light of a specific wavelength.

In this case, it may be easy to distinguish the PCB.

For example, as shown in FIG. 26, the graphic layer 42 may be exposed in the area between adjacent PCBs.

In addition, it may be possible to distinguish the PCB based on the paint layer 42 in the image captured by the top camera unit 80T.

As described above, after classifying and determining the PCB and/or electronic components placed on the PCB, it is possible to extract temperature information for each PCB and/or electronic component.

Referring to FIG. 27 , the thermal image analysis unit 302 may analyze the thermal image after filming of the thermal image is completed (S230).

Thereafter, based on the analysis results, the temperature information extraction unit 303 may extract information about the temperature of the PCB (S240).

Information about temperature may include a variety of information, such as information about temperature distribution according to the location of the PCB, information about temperature at a specific point in time, information about change in temperature over a certain period, highest temperature, lowest temperature, etc. there is.

Afterwards, it is determined whether there are multiple PCBs (S250), and if there are multiple PCBs as a result of the determination, temperature information can be matched to each PCB (S260).

Put another way, it is possible to extract temperature information for each PCB.

For example, it is possible to separately extract temperature information corresponding to the first PCB (PCB) and to separately extract temperature information corresponding to the second PCB (PCB2) from the extracted total temperature information.

Afterwards, temperature information can be matched to the electronic components placed on the PCB (S270).

For example, it is possible to match temperature information to the first integrated circuit disposed on the PCB and to match temperature information to the first capacitor.

Expressed differently, it is possible to extract temperature information for each electronic component.

An example of temperature information extracted for each electronic component is shown in Figure 28.

Looking at FIG. 28, the temperature information shows information about temperature changes of component 1, component 2, and component 3 over time.

In the case of component 1, the temperature is higher than the ideal temperature when the driving time exceeds Ta, and the critical temperature can be reached when the driving time is Tb.

Considering this, part 1 can be said to be defective.

The remaining parts 2 and 3 can be said to have passed.

Afterwards, the abnormal part can be determined based on the extracted temperature information (S280).

For example, during the heat inspection process of a PCB, among a plurality of electronic components placed on the PCB, it is possible to determine which electronic component has a temperature that has risen above a preset ideal temperature.

Here, the ideal temperature can be said to be a temperature set to ensure the reliability of the PCB and/or electronic components.

The ideal temperature may be lower than the critical temperature, which is the temperature at which the PCB and/or electronic components are destroyed.

The defect determination unit 307 may determine that an electronic component having an abnormal temperature is defective.

If there are no electronic components with an abnormal temperature, steps after step S280 may be omitted.

Thereafter, after determining the electronic component having an abnormal temperature, the replacement product search unit 308 may search for a replacement product to replace the electronic component on the Internet or from information stored in the memory unit 340 (S290).

Meanwhile, if, as a result of the determination in step S250, the number of PCBs is one rather than plural, the process can proceed to step S270.

As such, a person skilled in the art will understand that the technical configuration of the present invention described above can be implemented in other specific forms without changing the technical idea or essential features of the present invention.

Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive, and the scope of the present invention is indicated by the claims described later rather than the detailed description above, and the meaning and scope of the claims. And all changes or modified forms derived from the equivalent concept should be construed as falling within the scope of the present invention.

Claims (5)

A housing part provided with a space for placing at least one PCB (Printed Circuit Board) therein;
A door part mounted on the housing unit and opening and closing the space of the housing unit;
At least one connecting terminal part connected to the PCB;
A driving part including a driving signal supplying part that supplies a driving signal to the PCB through the connection terminal part;
An infrared camera part that takes thermal images of the PCB while a driving signal is supplied to the PCB;
A tray part disposed within the housing part and on which the PCB is placed;
A visible light camera part (VR Camera Part) that photographs the PCB while the PCB is placed in the housing part;
At least one lighting part for taking an image of the PCB when the door part is closed; and
At least one connecting cord electrically connecting the PCB and the connection terminal portion;
Including,
The housing part
Upper Wall;
a lower wall opposing the upper wall;
a rear wall located between the upper wall and the lower wall and facing the door when the door is closed;
A right side wall located between the upper wall and the lower wall; and
a left side wall located between the upper wall and the lower wall and opposing the right wall;
Including,
The infrared camera unit and the visible light camera unit are each disposed on the upper wall,
The infrared camera unit and the visible light camera unit are composed of one module,
At least one lighting unit is disposed on the upper wall, the right wall, and the left wall, respectively,
The visible light camera unit
a top camera unit disposed on the upper wall and capturing a front image of the PCB;
a right camera unit disposed on the right wall and capturing a side image of the PCB; and
a left camera unit disposed on the left wall and capturing a side image of the PCB;
Including,
Further comprising a support portion disposed between the tray portion and the lower wall,
The width of the tray portion is greater than the width of the support portion,
One end of the tray portion extends further toward the left wall than the support portion,
The other end of the tray portion extends further toward the right wall than the support portion,
The gap between the connection terminal portion and the door portion is smaller than the gap between the connection terminal portion and the rear wall,
The PCB includes a first PCB and a second PCB disposed on the tray portion,
The first PCB is adjacent to the door part,
The second PCB is disposed between the first PCB and the rear wall,
The connection code is
a first connection cord electrically connecting the first PCB and the connection terminal portion; and
a second connection cord electrically connecting the second PCB and the connection terminal portion;
Including,
The second connection cord includes a portion passing through a space between the tray portion and the lower wall,
The PCB further includes a first hole,
The tray portion includes an electrically conductive material,
The tray portion further includes a plurality of second holes corresponding to the first holes,
Further comprising a fastening means for grounding the PCB to the tray portion,
When a terminal for grounding is formed on the upper surface of the PCB,
The fastening means is
head; and
A pillar portion having a smooth surface;
Including,
The fastening means passes through the first hole and is fastened to the second hole,
The diameter of the head portion is larger than the diameter of the column portion,
The head contacts the upper surface of the PCB,
When a terminal for grounding is formed on the lower surface of the PCB,
The fastening means is
a first pillar portion having a smooth surface;
a second pillar portion having a smooth surface; and
a head positioned between the first pillar and the second pillar;
Including,
The diameter of the head portion is larger than the diameter of the first column portion and the diameter of the second column portion,
The first pillar portion is inserted into the first hole,
The second pillar portion is inserted into the second hole,
The fastening means includes a portion located between the PCB and the tray portion,
The head part is in contact with the lower surface of the PCB between the PCB and the tray part. According to claim 1,
The connection terminal part is
A first connection terminal portion; and
a second connection terminal;
Including,
The first connection terminal corresponds to the first driving signal,
The second connection terminal corresponds to the second driving signal,
The current and voltage of the first driving signal are different from the current and voltage of the second driving signal,
A fever test device, characterized in that the number of pins of the first connection terminal portion is different from the number of pins of the second connection terminal portion. According to claim 2,
A fever inspection device further comprising a display part that displays on a screen a thermal image of the PCB captured by the infrared camera unit during a preset reference period. According to claim 3,
Further comprising a paint layer formed on the surface of the tray portion,
A fever inspection device characterized in that the paint layer reflects or absorbs light of a specific wavelength. According to claim 4,
The driving part
a power selection unit that selects a driving signal to be supplied to the PCB connected to the connection terminal unit;
a thermal image analysis unit that analyzes the thermal image of the PCB captured by the infrared camera unit;
a temperature information extraction unit that extracts information about a temperature change of at least one electronic component included in the PCB within the reference period based on the results analyzed by the thermal image analysis unit;
an image analysis unit that analyzes the image of the PCB captured by the visible light camera unit and outputs map data corresponding to the PCB;
a map data analysis unit that analyzes the map data output by the image analysis unit;
a PCB determination unit that determines the PCB placed on the tray unit based on the results analyzed by the map data analysis unit;
a component determination unit that determines the electronic component placed on the PCB based on the results analyzed by the map data analysis unit;
a defect determination unit that determines whether the electronic component disposed on the PCB is defective based on the information about the temperature extracted by the temperature information extraction unit; and
a replacement product search unit that searches the Internet for replacement products for the electronic component determined by the defect determination unit to be defective and provides search results;
Including,
The map data includes at least one of the location, type, name, capacity, color, shape, or number of the electronic component disposed on the PCB,
The image analysis unit analyzes the image captured by the top camera unit and the image captured by the right camera unit and outputs map data corresponding to the PCB.