KR102590374B1 - Semi-non-combustible board - Google Patents
Semi-non-combustible board Download PDFInfo
- Publication number
- KR102590374B1 KR102590374B1 KR1020230075254A KR20230075254A KR102590374B1 KR 102590374 B1 KR102590374 B1 KR 102590374B1 KR 1020230075254 A KR1020230075254 A KR 1020230075254A KR 20230075254 A KR20230075254 A KR 20230075254A KR 102590374 B1 KR102590374 B1 KR 102590374B1
- Authority
- KR
- South Korea
- Prior art keywords
- weight
- parts
- monomer units
- methacrylate monomer
- board
- Prior art date
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- 239000000203 mixture Substances 0.000 claims description 41
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 39
- 239000010410 layer Substances 0.000 claims description 37
- 239000000835 fiber Substances 0.000 claims description 22
- 239000000377 silicon dioxide Substances 0.000 claims description 19
- 239000000178 monomer Substances 0.000 claims description 18
- 239000012790 adhesive layer Substances 0.000 claims description 16
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 15
- 239000004745 nonwoven fabric Substances 0.000 claims description 15
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 10
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 10
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical class C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 8
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 claims description 8
- 229920001577 copolymer Polymers 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 7
- 229920000058 polyacrylate Polymers 0.000 claims description 7
- 239000002952 polymeric resin Substances 0.000 claims description 7
- SEILKFZTLVMHRR-UHFFFAOYSA-N 2-phosphonooxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOP(O)(O)=O SEILKFZTLVMHRR-UHFFFAOYSA-N 0.000 claims description 6
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 claims description 6
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 6
- CEDDGDWODCGBFQ-UHFFFAOYSA-N carbamimidoylazanium;hydron;phosphate Chemical compound NC(N)=N.OP(O)(O)=O CEDDGDWODCGBFQ-UHFFFAOYSA-N 0.000 claims description 6
- 239000002134 carbon nanofiber Substances 0.000 claims description 6
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 claims description 6
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 5
- 239000003365 glass fiber Substances 0.000 claims description 5
- 229910021536 Zeolite Inorganic materials 0.000 claims description 4
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052626 biotite Inorganic materials 0.000 claims description 4
- 239000000378 calcium silicate Substances 0.000 claims description 4
- 229910052918 calcium silicate Inorganic materials 0.000 claims description 4
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 claims description 4
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052900 illite Inorganic materials 0.000 claims description 4
- 229910001629 magnesium chloride Inorganic materials 0.000 claims description 4
- 239000000395 magnesium oxide Substances 0.000 claims description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 4
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 4
- VGIBGUSAECPPNB-UHFFFAOYSA-L nonaaluminum;magnesium;tripotassium;1,3-dioxido-2,4,5-trioxa-1,3-disilabicyclo[1.1.1]pentane;iron(2+);oxygen(2-);fluoride;hydroxide Chemical compound [OH-].[O-2].[O-2].[O-2].[O-2].[O-2].[F-].[Mg+2].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[K+].[K+].[K+].[Fe+2].O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2 VGIBGUSAECPPNB-UHFFFAOYSA-L 0.000 claims description 4
- 229910052613 tourmaline Inorganic materials 0.000 claims description 4
- 229940070527 tourmaline Drugs 0.000 claims description 4
- 239000011032 tourmaline Substances 0.000 claims description 4
- 239000010457 zeolite Substances 0.000 claims description 4
- XRKLXLGVJOJYOO-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethanol;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.CC(=C)C(O)=O.OCCOCCO XRKLXLGVJOJYOO-UHFFFAOYSA-N 0.000 claims description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical group COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 3
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical group CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 claims description 3
- UACSZOWTRIJIFU-UHFFFAOYSA-N hydroxymethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCO UACSZOWTRIJIFU-UHFFFAOYSA-N 0.000 claims description 3
- KNNOZYMZRGTZQM-UHFFFAOYSA-N tri(propan-2-yl)silyl 2-methylprop-2-enoate Chemical compound CC(C)[Si](C(C)C)(C(C)C)OC(=O)C(C)=C KNNOZYMZRGTZQM-UHFFFAOYSA-N 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 description 20
- 125000003342 alkenyl group Chemical group 0.000 description 8
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 6
- 239000011777 magnesium Substances 0.000 description 6
- 229910052749 magnesium Inorganic materials 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- RZMWTGFSAMRLQH-UHFFFAOYSA-L disodium;2,2-dihexyl-3-sulfobutanedioate Chemical compound [Na+].[Na+].CCCCCCC(C([O-])=O)(C(C([O-])=O)S(O)(=O)=O)CCCCCC RZMWTGFSAMRLQH-UHFFFAOYSA-L 0.000 description 4
- 229920002681 hypalon Polymers 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 239000002023 wood Substances 0.000 description 4
- 210000002268 wool Anatomy 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 150000004760 silicates Chemical class 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- 240000000797 Hibiscus cannabinus Species 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 235000013311 vegetables Nutrition 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 125000006043 5-hexenyl group Chemical group 0.000 description 1
- 241000894006 Bacteria Species 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000009395 breeding Methods 0.000 description 1
- 230000001488 breeding effect Effects 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F13/00—Coverings or linings, e.g. for walls or ceilings
- E04F13/07—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor
- E04F13/08—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor composed of a plurality of similar covering or lining elements
- E04F13/0875—Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor composed of a plurality of similar covering or lining elements having a basic insulating layer and at least one covering layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/022—Non-woven fabric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/047—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material made of fibres or filaments
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J143/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium, or a metal; Adhesives based on derivatives of such polymers
- C09J143/02—Homopolymers or copolymers of monomers containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J143/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium, or a metal; Adhesives based on derivatives of such polymers
- C09J143/04—Homopolymers or copolymers of monomers containing silicon
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/62—Insulation or other protection; Elements or use of specified material therefor
- E04B1/74—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls
- E04B1/82—Heat, sound or noise insulation, absorption, or reflection; Other building methods affording favourable thermal or acoustical conditions, e.g. accumulating of heat within walls specifically with respect to sound only
- E04B1/84—Sound-absorbing elements
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/62—Insulation or other protection; Elements or use of specified material therefor
- E04B1/92—Protection against other undesired influences or dangers
- E04B1/94—Protection against other undesired influences or dangers against fire
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Architecture (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Structural Engineering (AREA)
- Civil Engineering (AREA)
- Acoustics & Sound (AREA)
- Electromagnetism (AREA)
- Textile Engineering (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
본 발명은 돌출부를 포함하는 준불연보드를 제공한다.The present invention provides a semi-non-combustible board including a protrusion.
Description
본 발명은 준불연보드에 관한 것이다.The present invention relates to a semi-non-combustible board.
빌딩에는 하나의 실내 공간을 여러 개의 단위 공간으로 구획하기 위한 수단으로서 벽채가 형성되며 그 벽채의 마감재로 보드(board)가 사용된다.In a building, a wall is formed as a means to divide one indoor space into several unit spaces, and a board is used as a finishing material for the wall.
최근에는 소음을 감소시키는 기술이 적용된 흡음 보드가 널리 적용된다. 흡음 보드의 대표적인 것이 마그네슘 보드와 목모 보드이다.Recently, sound-absorbing boards with noise-reducing technology are widely applied. Representative sound-absorbing boards are magnesium boards and wood wool boards.
마그네슘 보드는 돌가루와 마그네슘을 넣어 혼합해 만든 보드이다. 마그네슘 보드는 그 특성상 무거울뿐더러 시공, 운반 중 쉽게 깨질 수 있으며, 물에 약하고 공기 중에 쉽게 산화하는 단점을 갖는다.Magnesium board is a board made by mixing stone powder and magnesium. Due to its nature, magnesium board is not only heavy, but can easily break during construction and transportation, and has the disadvantage of being weak to water and easily oxidized in the air.
마그네슘 보드의 단점을 개선한 것이 목모 보드이다. 목모 보드는 톱밥을 넣어 만들기 때문에 가볍다. 다만, 목모 보드는 습기에 약할뿐더러 쉽게 썩고, 벌레나 세균이 번식하기 쉬운 단점을 갖는다.Wooden board improves the shortcomings of magnesium board. Wood wool boards are light because they are made with sawdust. However, wood wool boards have the disadvantage of being vulnerable to moisture, rotting easily, and easily breeding bugs and bacteria.
특히, 목모 보드는 그 물성상 마그네슘 보드보다도 흡음 기능이 상대적으로 떨어지는 것으로 알려져 있는데, 이처럼 현존하는 보드들은 여러 단점을 발생시키고 있다는 점을 고려해볼 때, 흡음 기능을 강화하면서도 기존 보드들의 단점을 해결할 수 있는 신개념의 흡음 보드에 대한 필요성이 대두된다.In particular, wood wool boards are known to have a relatively poorer sound absorption function than magnesium boards due to their physical properties. Considering that existing boards have various disadvantages, it is possible to solve the shortcomings of existing boards while strengthening the sound absorption function. The need for a new concept of sound-absorbing board is emerging.
본 발명은 상기와 같은 문제점을 해결하기 위해 안출된 것으로서, 본 발명의 목적은 흡음성능을 가지는 준불연보드를 제공하는 것이다.The present invention was developed to solve the above problems, and the purpose of the present invention is to provide a semi-non-combustible board with sound absorption performance.
본 발명의 과제는 이상에서 언급한 과제들로 제한되지 않으며, 언급되지 않은 또 다른 과제들은 아래의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.The object of the present invention is not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.
상기 목적을 달성하기 위하여 본 발명은In order to achieve the above object, the present invention
돌출부를 포함하는 준불연보드를 제공한다.Provides a semi-non-combustible board including protrusions.
또한, 상기 준불연보드는,In addition, the semi-non-combustible board is,
돌출부를 포함하는 보드층;A board layer including protrusions;
상기 보드층 하부에 형성된 접착층;An adhesive layer formed below the board layer;
상기 접착층 하부에 형성된 부직포층; 및A non-woven fabric layer formed below the adhesive layer; and
상기 부직포층 하부에 형성된 무기질층;을 포함하고,It includes; an inorganic layer formed below the non-woven fabric layer,
상기 접착층은 아크릴계 고분자 수지 48-52 중량부, 아크릴계 혼합물 8-12 중량부, 수산화알루미늄 18-22 중량부, 구아니딘 포스페이트 4-8 중량부, 탄소나노섬유 2-6 중량부, 탄산칼슘 1-5 중량부 및 메틸에틸케톤 5-9 중량부를 포함하는 접착층 형성용 조성물로 형성된 것이고,The adhesive layer includes 48-52 parts by weight of acrylic polymer resin, 8-12 parts by weight of acrylic mixture, 18-22 parts by weight of aluminum hydroxide, 4-8 parts by weight of guanidine phosphate, 2-6 parts by weight of carbon nanofibers, and 1-5 parts by weight of calcium carbonate. It is formed of a composition for forming an adhesive layer containing 5-9 parts by weight of methyl ethyl ketone,
상기 아크릴계 고분자 수지는 에틸메타크릴레이트 단량체 단위 23-27 중량부, 하이드록시메틸메타크릴레이트 단량체 단위 23-27 중량부, 글리시딜메타크릴레이트 단량체 단위 23-27 중량부 및 2-포스포노옥시에틸 메타크릴레이트(2-(phosphonooxy)ethyl methacrylate) 단량체 단위 23-27 중량부를 포함하는 제1 아크릴레이트계 공중합체 78-82 중량부 및 트리이소프로필실릴 메타크릴레이트 단량체 단위 23-27 중량부, 메틸메타크릴레이트 단량체 단위 23-27 중량부, n-부틸메타크릴레이트 단량체 단위 23-27 중량부 및 메타크릴산 단량체 단위 23-27 중량부를 포함하는 제2 아크릴레이트계 공중합체 18-22 중량부로 이루어지고,The acrylic polymer resin includes 23-27 parts by weight of ethyl methacrylate monomer units, 23-27 parts by weight of hydroxymethyl methacrylate monomer units, 23-27 parts by weight of glycidyl methacrylate monomer units, and 2-phosphonooxy 78-82 parts by weight of a first acrylate-based copolymer containing 23-27 parts by weight of 2-(phosphonooxy)ethyl methacrylate monomer units and 23-27 parts by weight of triisopropylsilyl methacrylate monomer units, 18-22 parts by weight of a second acrylate-based copolymer comprising 23-27 parts by weight of methyl methacrylate monomer units, 23-27 parts by weight of n-butyl methacrylate monomer units, and 23-27 parts by weight of methacrylic acid monomer units. It comes true,
상기 아크릴계 혼합물은 2-포스포노옥시에틸 메타크릴레이트, 글리시딜메타크릴레이트 및 디메타크릴레이트 디에틸렌글리콜이 3:3:4의 중량비율로 혼합된 혼합물이고,The acrylic mixture is a mixture of 2-phosphonooxyethyl methacrylate, glycidyl methacrylate, and dimethacrylate diethylene glycol in a weight ratio of 3:3:4,
상기 부직포층은 유리섬유와 실리카섬유의 복합사를 이용하여 형성된 것이고,The non-woven layer is formed using a composite yarn of glass fiber and silica fiber,
상기 무기질층은 산화마그네슘 28-32 중량부, 염화마그네슘 18-22 중량부, 활성탄소섬유 3-7 중량부, 토르말린 3-7 중량부, 일라이트 3-7 중량부, 흑운모 3-7 중량부, 제올라이트 3-7 중량부, 알루미늄실리케이트 1-5 중량부, 칼슘실리케이트 1-5 중량부 및 규산염 17-21 중량부를 포함하는 무기질층 형성용 조성물로 형성된 것을 특징으로 한다.The inorganic layer includes 28-32 parts by weight of magnesium oxide, 18-22 parts by weight of magnesium chloride, 3-7 parts by weight of activated carbon fiber, 3-7 parts by weight of tourmaline, 3-7 parts by weight of illite, and 3-7 parts by weight of biotite. , It is characterized in that it is formed of a composition for forming an inorganic layer containing 3-7 parts by weight of zeolite, 1-5 parts by weight of aluminum silicate, 1-5 parts by weight of calcium silicate, and 17-21 parts by weight of silicate.
또한, 상기 부직포층은,In addition, the non-woven fabric layer,
25℃에서의 점도가 150,000-180,000 mPaㆍs이고, 분자 내에 적어도 2개의 규소-결합된 알케닐기를 갖는 폴리다이오가노실록산 33-37 중량부, 25℃에서의 점도가 500-1,000 mPaㆍs이고, 분자 내에 적어도 3개의 규소-결합된 수소 원자를 갖는 폴리다이오가노실록산 8-12 중량부, 25℃에서의 점도가 1,200,000-1,500,000 mPaㆍs인 폴리오가노하이드로겐실록산 8-12 중량부, 실란 표면처리된 삼산화 안티모니(Sb2O3) 13-17 중량부, 알루미늄하이드레이트 13-17 중량부, 클로로술폰화 폴리에틸렌 고무 8-12 중량부, 소듐디헥실술포숙시네이트 2-6 중량부 및 백금계 촉매 0.1-2 중량부를 혼합하고, 400-500 rpm의 회전속도로 교반하여 실리콘 조성물을 제조하는 단계; 실리카섬유에 상기 실리콘 조성물을 코팅하는 단계; 및 실리카섬유를 160-200℃의 온도에서 건조 및 경화시키는 단계;를 포함하는 실리콘 조성물이 코팅된 실리카섬유를 제조하는 단계;A viscosity at 25°C of 150,000-180,000 mPa·s, 33-37 parts by weight of polydiorganosiloxane having at least two silicon-bonded alkenyl groups in the molecule, a viscosity at 25°C of 500-1,000 mPa·s, and , 8-12 parts by weight of polydiorganosiloxane having at least 3 silicon-bonded hydrogen atoms in the molecule, 8-12 parts by weight of polyorganohydrogensiloxane having a viscosity of 1,200,000-1,500,000 mPa·s at 25°C, silane surface 13-17 parts by weight of treated antimony trioxide (Sb 2 O 3 ), 13-17 parts by weight of aluminum hydrate, 8-12 parts by weight of chlorosulfonated polyethylene rubber, 2-6 parts by weight of sodium dihexyl sulfosuccinate and platinum base. Mixing 0.1-2 parts by weight of catalyst and stirring at a rotation speed of 400-500 rpm to prepare a silicone composition; Coating the silicone composition on silica fibers; and drying and curing the silica fibers at a temperature of 160-200°C; manufacturing silica fibers coated with a silicone composition including;
유리섬유 및 상기 실리카섬유를 7:3의 중량비율로 포함하도록 합사하여 복합사를 제조하는 단계; 및Manufacturing a composite yarn by plying glass fiber and the silica fiber at a weight ratio of 7:3; and
상기 복합사를 경사 및 위사로 포함시켜 부직포를 제조하는 단계;를 수행하여 제조되는 부직포를 사용한 것을 특징으로 한다.It is characterized by using a non-woven fabric manufactured by performing the step of manufacturing a non-woven fabric by including the composite yarn as warp and weft yarns.
본 발명에 따른 준불연보드는 흡음 효과가 우수하고, 준불연 성능을 가진다.The semi-non-combustible board according to the present invention has excellent sound absorption effect and semi-non-combustible performance.
도 1은 본 발명의 일 측면에서 제공되는 준불연보드의 입체면을 나타낸 모식도이고,
도 2는 본 발명의 일 측면에서 제공되는 준불연보드의 도 1에서 나타낸 A-A 단면을 나타낸 모식도이고;
도 3은 본 발명의 일 측면에서 제공되는 준불연보드의 도 1에서 나타낸 B-B 단면을 나타낸 모식도이고;
도 4는 본 발명의 일 측면에서 제공되는 준불연보드의 상부면을 나타낸 모식도이고,
도 5는 본 발명의 일 측면에서 제공되는 준불연보드의 히부면을 나타낸 모식도이고,
도 6은 본 발명의 다른 측면에서 제공되는 준불연보드의 히부면을 나타낸 모식도이고,
도 7은 본 발명의 또 다른 측면에서 제공되는 준불연보드의 단면을 나타낸 모식도이다.1 is a schematic diagram showing the three-dimensional surface of a semi-non-combustible board provided in one aspect of the present invention,
Figure 2 is a schematic diagram showing the AA cross section shown in Figure 1 of the semi-non-combustible board provided in one aspect of the present invention;
Figure 3 is a schematic diagram showing the BB cross-section shown in Figure 1 of the semi-non-combustible board provided in one aspect of the present invention;
Figure 4 is a schematic diagram showing the upper surface of a semi-non-combustible board provided in one aspect of the present invention,
Figure 5 is a schematic diagram showing the hip surface of a semi-non-combustible board provided in one aspect of the present invention,
Figure 6 is a schematic diagram showing the hip surface of a semi-non-combustible board provided in another aspect of the present invention,
Figure 7 is a schematic diagram showing a cross section of a semi-non-combustible board provided in another aspect of the present invention.
이하에서는 첨부된 도면을 참조하여 다양한 실시예를 보다 상세하게 설명한다. 본 명세서에 기재된 실시예는 다양하게 변형될 수 있다. 특정한 실시예가 도면에서 묘사되고 상세한 설명에서 자세하게 설명될 수 있다. 그러나 첨부된 도면에 개시된 특정한 실시 예는 다양한 실시예를 쉽게 이해하도록 하기 위한 것일 뿐이다. 따라서 첨부된 도면에 개시된 특정 실시예에 의해 기술적 사상이 제한되는 것은 아니며, 발명의 사상 및 기술 범위에 포함되는 모든 균등물 또는 대체물을 포함하는 것으로 이해되어야 한다.Hereinafter, various embodiments will be described in more detail with reference to the attached drawings. The embodiments described herein may be modified in various ways. Specific embodiments may be depicted in the drawings and described in detail in the detailed description. However, the specific embodiments disclosed in the attached drawings are only intended to facilitate understanding of the various embodiments. Accordingly, the technical idea is not limited to the specific embodiments disclosed in the attached drawings, and should be understood to include all equivalents or substitutes included in the spirit and technical scope of the invention.
1차, 2차, 제1, 제2 등과 같이 서수를 포함하는 용어는 다양한 구성요소들을 설명하는데 사용될 수 있지만, 이러한 구성요소들은 상술한 용어에 의해 한정되지는 않는다. 상술한 용어는 하나의 구성요소를 다른 구성요소로부터 구별하는 목적으로만 사용된다.Terms containing ordinal numbers, such as primary, secondary, first, second, etc., may be used to describe various components, but these components are not limited by the above-mentioned terms. The above-mentioned terms are used only for the purpose of distinguishing one component from another.
본 명세서에서, '포함한다' 또는 '가지다' 등의 용어는 명세서상에 기재된 특징, 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것이 존재함을 지정하려는 것이지, 하나 또는 그 이상의 다른 특징들이나 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는 것으로 이해되어야 한다. 어떤 구성요소가 다른 구성요소에 '연결되어' 있다거나 '접속되어' 있다고 언급된 때에는, 그 다른 구성요소에 직접적으로 연결되어 있거나 또는 접속되어 있을 수도 있지만, 중간에 다른 구성요소가 존재할 수도 있다고 이해되어야 할 것이다. 반면에, 어떤 구성요소가 다른 구성요소에 '직접 연결되어' 있다거나 '직접 접속되어' 있다고 언급된 때에는, 중간에 다른 구성요소가 존재하지 않는 것으로 이해되어야 할 것이다.In this specification, terms such as 'include' or 'have' are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are not intended to indicate the presence of one or more other features. It should be understood that this does not exclude in advance the possibility of the existence or addition of elements, numbers, steps, operations, components, parts, or combinations thereof. When a component is said to be 'connected' or 'connected' to another component, it is understood that it may be directly connected or connected to the other component, but that other components may exist in between. It should be. On the other hand, when a component is mentioned as being 'directly connected' or 'directly connected' to another component, it should be understood that there are no other components in between.
그 밖에도, 본 발명을 설명함에 있어서, 관련된 공지 기능 혹은 구성에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우, 그에 대한 상세한 설명은 축약하거나 생략한다.In addition, when describing the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description thereof is abbreviated or omitted.
본 발명은This invention
돌출부(10, 211)를 포함하는 준불연보드(100, 200)를 제공한다.Provided are semi-non-combustible boards (100, 200) including protrusions (10, 211).
이때, 도 1-7에 본 발명에 따른 준불연보드(100, 200)를 모식도로 나타내었으며, 이하, 도 1-7을 참조하여 본 발명에 따른 준불연보드(100, 200)에 대하여 상세히 설명한다.At this time, the semi-non-combustible boards (100, 200) according to the present invention are shown in a schematic diagram in Figures 1-7, and hereinafter, the semi-non-combustible boards (100, 200) according to the present invention will be described in detail with reference to Figures 1-7. do.
도 1-3을 참조하면, 본 발명에 따른 준불연보드(100)는 돌출부(10)를 포함하고, 돌출부(10)와 더불어 홈(20, groove)을 포함한다.Referring to Figures 1-3, the semi-non-combustible board 100 according to the present invention includes a protrusion 10, and includes a groove 20 in addition to the protrusion 10.
상기 홈(20)은 바닥부(21)와 내부홈(22)을 포함하는 것이 바람직하다. 상기 홈(20)은 완전히 뚫린 형태의 홀(hole)이 아닌 막힌 구조를 가져 바닥부(21)를 형성하되, 바닥부(21)로 향할수록 넓어지는 구조를 이룬다. 이에 따라 내부홈(22)이 형성된다. 이러한 구조를 통해 흡음에 더욱 효율적이다.The groove 20 preferably includes a bottom 21 and an inner groove 22. The groove 20 has a closed structure rather than a fully open hole, forming the bottom 21, and becomes wider toward the bottom 21. Accordingly, an internal groove 22 is formed. This structure makes sound absorption more efficient.
또한, 상기 준불연보드(100)는 내부홈(22) 하부면, 즉 돌출부(10)와 홈(20)을 포함하고, 돌출부(10)의 특수 구조로 인해 내부홈(22)이 형성되며, 내부홈(22)이 형성된 하부면에는 하부홀(23)이 형성된 것이 바람직하다. 상기 하부홀(23)은 준불연보드(100)의 상부면에서는 보이지 않으나 대각선으로 비스듬하게 관찰시 보이는 구멍이다. 이러한 구조를 통해 흡음에 더욱 효율적이다.In addition, the semi-non-combustible board 100 includes a lower surface of the internal groove 22, that is, a protrusion 10 and a groove 20, and the internal groove 22 is formed due to the special structure of the protrusion 10, It is preferable that a lower hole 23 is formed on the lower surface where the internal groove 22 is formed. The lower hole 23 is not visible from the upper surface of the semi-non-combustible board 100, but is visible when observed diagonally. This structure makes sound absorption more efficient.
도 1에서 A-A 단면을 나타낸 도 2를 살펴보면 하부홀(23)이 없어 관통하는 홀이 없는 구조임을 확인할 수 있다.Looking at Figure 2, which shows the cross section A-A in Figure 1, it can be seen that there is no lower hole 23, so it is a structure without penetrating holes.
도 1에서 B-B 단면을 나타낸 도 3을 살펴보면 하부홀(23)을 통해 관통하는 홀이 형성된 구조임을 확인할 수 있다.Looking at FIG. 3 showing the B-B cross section in FIG. 1, it can be seen that the structure has a hole penetrating through the lower hole 23.
도 4에서는 하부홀(23)이 겹쳐 형성되어 상대적으로 큰 홀을 형성하고 있는 구조를 확인할 수 있고, 도 5에서는 하부홀(23)이 겹치지 않고 형성되어 상대적으로 작은 홀을 형성하고 있는 구조를 확인할 수 있다.In Figure 4, it can be seen that the lower holes 23 are formed overlapping to form a relatively large hole, and in Figure 5, the structure in which the lower holes 23 are formed without overlapping to form a relatively small hole can be seen. You can.
또한, 본 발명에 따른 준불연보드(100)는 상기와 같은 이중타공 구조를 통해 다양한 두께에도 적용 가능하다.In addition, the semi-non-combustible board 100 according to the present invention can be applied to various thicknesses through the double perforated structure as described above.
상기 홈(20)은 선형 패턴을 가진다. 돌출부(10)와 홈(20)이 교대로 반복되어 형성된 구조를 가진다.The grooves 20 have a linear pattern. It has a structure in which the protrusions 10 and grooves 20 are alternately repeated.
상기 준불연보드(100)는 돌출부(211)를 포함하는 보드층으로 구성될 수 있고, 상기 보드층은 친환경 식물성 케나프(KENAF), 엘엠 화이버(LM fiber), 폴리에틸렌테레프탈레이트(PET) 소재로 형성된 것일 수 있다. 바람직하게는, 식물성 케나프 60 중량부, 엘엠 화이버 20 중량부 및 폴리에틸렌테레프탈레이트(PET) 20 중량부를 포함하는 원료를 이용하여 제조되는 것일 수 있다.The semi-non-combustible board 100 may be composed of a board layer including a protrusion 211, and the board layer is made of eco-friendly vegetable kenaf, LM fiber, and polyethylene terephthalate (PET). It may have been formed. Preferably, it may be manufactured using raw materials containing 60 parts by weight of vegetable kenaf, 20 parts by weight of Elm fiber, and 20 parts by weight of polyethylene terephthalate (PET).
도 7을 참조하면, 본 발명에 따른 준불연보드(200)는 돌출부(211)를 포함하는 보드층(210); 상기 보드층(210) 하부에 형성된 접착층(220); 상기 접착층(220) 하부에 형성된 부직포층(230); 및 상기 부직포층(230) 하부에 형성된 무기질층(240);을 포함한다.Referring to Figure 7, the semi-non-combustible board 200 according to the present invention includes a board layer 210 including a protrusion 211; An adhesive layer 220 formed below the board layer 210; A non-woven fabric layer 230 formed below the adhesive layer 220; and an inorganic layer 240 formed below the non-woven fabric layer 230.
상기 보드층(210)은 전술한 바와 같으므로 자세한 설명은 생략한다.Since the board layer 210 is the same as described above, detailed description is omitted.
상기 접착층(220)은 아크릴계 고분자 수지 48-52 중량부, 아크릴계 혼합물 8-12 중량부, 수산화알루미늄 18-22 중량부, 구아니딘 포스페이트 4-8 중량부, 탄소나노섬유 2-6 중량부, 탄산칼슘 1-5 중량부 및 메틸에틸케톤 5-9 중량부를 포함하는 접착층 형성용 조성물로 형성된 것이 바람직하고, 아크릴계 고분자 수지 49-51 중량부, 아크릴계 혼합물 9-11 중량부, 수산화알루미늄 19-21 중량부, 구아니딘 포스페이트 5-7 중량부, 탄소나노섬유 3-5 중량부, 탄산칼슘 2-4 중량부 및 메틸에틸케톤 6-8 중량부를 포함하는 접착층 형성용 조성물로 형성된 것이 더욱 바람직하다.The adhesive layer 220 includes 48-52 parts by weight of an acrylic polymer resin, 8-12 parts by weight of an acrylic mixture, 18-22 parts by weight of aluminum hydroxide, 4-8 parts by weight of guanidine phosphate, 2-6 parts by weight of carbon nanofibers, and calcium carbonate. It is preferably formed of a composition for forming an adhesive layer containing 1-5 parts by weight and 5-9 parts by weight of methyl ethyl ketone, 49-51 parts by weight of an acrylic polymer resin, 9-11 parts by weight of an acrylic mixture, and 19-21 parts by weight of aluminum hydroxide. , It is more preferable that it is formed of a composition for forming an adhesive layer containing 5-7 parts by weight of guanidine phosphate, 3-5 parts by weight of carbon nanofibers, 2-4 parts by weight of calcium carbonate, and 6-8 parts by weight of methyl ethyl ketone.
상기 아크릴계 고분자 수지는 에틸메타크릴레이트 단량체 단위 23-27 중량부, 하이드록시메틸메타크릴레이트 단량체 단위 23-27 중량부, 글리시딜메타크릴레이트 단량체 단위 23-27 중량부 및 2-포스포노옥시에틸 메타크릴레이트(2-(phosphonooxy)ethyl methacrylate) 단량체 단위 23-27 중량부를 포함하는 제1 아크릴레이트계 공중합체 78-82 중량부 및 트리이소프로필실릴 메타크릴레이트 단량체 단위 23-27 중량부, 메틸메타크릴레이트 단량체 단위 23-27 중량부, n-부틸메타크릴레이트 단량체 단위 23-27 중량부 및 메타크릴산 단량체 단위 23-27 중량부를 포함하는 제2 아크릴레이트계 공중합체 18-22 중량부로 이루어진 것을 사용한다. 상기 제1 아크릴레이트계 공중합체는 상기 단위를 포함하여 높은 접착력과 더불어 수지 자체에서 난연성 및 불연성을 보조해준다. 상기 제2 아크릴레이트계 공중합체는 접착력과 내구성을 확보하여 준다.The acrylic polymer resin includes 23-27 parts by weight of ethyl methacrylate monomer units, 23-27 parts by weight of hydroxymethyl methacrylate monomer units, 23-27 parts by weight of glycidyl methacrylate monomer units, and 2-phosphonooxy 78-82 parts by weight of a first acrylate-based copolymer containing 23-27 parts by weight of 2-(phosphonooxy)ethyl methacrylate monomer units and 23-27 parts by weight of triisopropylsilyl methacrylate monomer units, 18-22 parts by weight of a second acrylate-based copolymer comprising 23-27 parts by weight of methyl methacrylate monomer units, 23-27 parts by weight of n-butyl methacrylate monomer units, and 23-27 parts by weight of methacrylic acid monomer units. Use what has been done. The first acrylate-based copolymer contains the above units and provides flame retardancy and incombustibility in the resin itself along with high adhesive strength. The second acrylate-based copolymer ensures adhesion and durability.
상기 아크릴계 혼합물은 2-포스포노옥시에틸 메타크릴레이트, 글리시딜메타크릴레이트 및 디메타크릴레이트 디에틸렌글리콜이 3:3:4의 중량비율로 혼합된 혼합물인 것이 바람직하다. 상기 성분을 포함하여 난연성을 높이고 접착력을 향상시켜준다.The acrylic mixture is preferably a mixture of 2-phosphonooxyethyl methacrylate, glycidyl methacrylate, and dimethacrylate diethylene glycol in a weight ratio of 3:3:4. Including the above ingredients increases flame retardancy and improves adhesion.
상기 수산화알루미늄, 구아니딘 포스페이트 및 탄소나노섬유는 난연제로 적용되며, 상기 수산화알루미늄, 구아니딘 포스페이트 및 탄소나노섬유를 9-11:2-4:1-3의 중량비율로 혼합하여 적용함으로써 혼화성을 높여 더욱 난연성을 높일 수 있다.The aluminum hydroxide, guanidine phosphate, and carbon nanofibers are applied as a flame retardant. The aluminum hydroxide, guanidine phosphate, and carbon nanofibers are mixed and applied at a weight ratio of 9-11:2-4:1-3 to increase miscibility. Flame retardancy can be further improved.
상기 탄산칼슘은 충전제로 적용되어 내구성을 향상시킨다.The calcium carbonate is applied as a filler to improve durability.
상기 메틸에틸케톤 용매로 적용되어 혼화성을 높인다.It is applied as the methyl ethyl ketone solvent to increase miscibility.
상기 부직포층(220)은 유리섬유와 실리카섬유의 복합사를 이용하여 형성된 것이 바람직하다.The non-woven fabric layer 220 is preferably formed using a composite yarn of glass fiber and silica fiber.
상기 부직포층은,The nonwoven layer is,
25℃에서의 점도가 150,000-180,000 mPaㆍs이고, 분자 내에 적어도 2개의 규소-결합된 알케닐기를 갖는 폴리다이오가노실록산 33-37 중량부, 25℃에서의 점도가 500-1,000 mPaㆍs이고, 분자 내에 적어도 3개의 규소-결합된 수소 원자를 갖는 폴리다이오가노실록산 8-12 중량부, 25℃에서의 점도가 1,200,000-1,500,000 mPaㆍs인 폴리오가노하이드로겐실록산 8-12 중량부, 실란 표면처리된 삼산화 안티모니(Sb2O3) 13-17 중량부, 알루미늄하이드레이트 13-17 중량부, 클로로술폰화 폴리에틸렌 고무 8-12 중량부, 소듐디헥실술포숙시네이트 2-6 중량부 및 백금계 촉매 0.1-2 중량부를 혼합하고, 400-500 rpm의 회전속도로 교반하여 실리콘 조성물을 제조하는 단계; 실리카섬유에 상기 실리콘 조성물을 코팅하는 단계; 및 실리카섬유를 160-200℃의 온도에서 건조 및 경화시키는 단계;를 포함하는 실리콘 조성물이 코팅된 실리카섬유를 제조하는 단계;A viscosity at 25°C of 150,000-180,000 mPa·s, 33-37 parts by weight of polydiorganosiloxane having at least two silicon-bonded alkenyl groups in the molecule, a viscosity at 25°C of 500-1,000 mPa·s, and , 8-12 parts by weight of polydiorganosiloxane having at least 3 silicon-bonded hydrogen atoms in the molecule, 8-12 parts by weight of polyorganohydrogensiloxane having a viscosity of 1,200,000-1,500,000 mPa·s at 25°C, silane surface 13-17 parts by weight of treated antimony trioxide (Sb 2 O 3 ), 13-17 parts by weight of aluminum hydrate, 8-12 parts by weight of chlorosulfonated polyethylene rubber, 2-6 parts by weight of sodium dihexyl sulfosuccinate and platinum base. Mixing 0.1-2 parts by weight of catalyst and stirring at a rotation speed of 400-500 rpm to prepare a silicone composition; Coating the silicone composition on silica fibers; and drying and curing the silica fibers at a temperature of 160-200°C; manufacturing silica fibers coated with a silicone composition including;
유리섬유 및 상기 실리카섬유를 7:3의 중량비율로 포함하도록 합사하여 복합사를 제조하는 단계; 및Manufacturing a composite yarn by plying glass fiber and the silica fiber at a weight ratio of 7:3; and
상기 복합사를 경사 및 위사로 포함시켜 부직포를 제조하는 단계;를 수행하여 제조되는 부직포를 사용한다.A nonwoven fabric manufactured by manufacturing a nonwoven fabric by including the composite yarn as warp and weft yarns is used.
상기 실리콘 조성물이 코팅된 실리카섬유는, 먼저, 실리콘 조성물을 제조한다. 상기 실리콘 조성물은 각 물질을 혼합하고, 430-480 rpm의 회전속도로 교반하여 제조되는 것이 더욱 바람직하다.The silica fiber coated with the silicone composition is first prepared as a silicone composition. It is more preferable that the silicone composition is prepared by mixing each material and stirring at a rotation speed of 430-480 rpm.
다음, 실리카섬유에 상기 실리콘 조성물을 코팅한다. 상기 실리카섬유를 상기 실리콘 조성물로 코팅하는 것은 침지, 도포 등의 방법을 수행할 수 있다.Next, the silicone composition is coated on the silica fiber. Coating the silica fiber with the silicone composition can be performed by methods such as dipping and application.
다음, 실리카섬유를 160-200℃의 온도에서 건조 및 경화시킨다. 더욱 바람직하게는, 170-190℃의 온도에서 건조 및 경화시킨다.Next, the silica fiber is dried and cured at a temperature of 160-200°C. More preferably, it is dried and cured at a temperature of 170-190°C.
상기 실리카섬유는 실리콘 조성물이 코팅된 것을 사용한다. The silica fiber is coated with a silicone composition.
상기 실리콘 조성물은 25℃에서의 점도가 150,000-180,000 mPaㆍs이고, 분자 내에 적어도 2개의 규소-결합된 알케닐기를 갖는 폴리다이오가노실록산 33-37 중량부, 25℃에서의 점도가 500-1,000 mPaㆍs이고, 분자 내에 적어도 3개의 규소-결합된 수소 원자를 갖는 폴리다이오가노실록산 8-12 중량부, 25℃에서의 점도가 1,200,000-1,500,000 mPaㆍs인 폴리오가노하이드로겐실록산 8-12 중량부, 실란 표면처리된 삼산화 안티모니(Sb2O3) 13-17 중량부, 알루미늄하이드레이트 13-17 중량부, 클로로술폰화 폴리에틸렌 고무 8-12 중량부, 소듐디헥실술포숙시네이트 2-6 중량부 및 백금계 촉매 0.1-2 중량부를 포함하는 것이 바람직하다.The silicone composition has a viscosity of 150,000-180,000 mPa·s at 25°C, 33-37 parts by weight of polydiorganosiloxane having at least two silicon-bonded alkenyl groups in the molecule, and a viscosity of 500-1,000 at 25°C. mPa·s, 8-12 parts by weight of a polydiorganosiloxane having at least 3 silicon-bonded hydrogen atoms in the molecule, 8-12 parts by weight of polyorganohydrogensiloxane having a viscosity at 25° C. of 1,200,000-1,500,000 mPa·s. parts, 13-17 parts by weight of silane surface-treated antimony trioxide (Sb 2 O 3 ), 13-17 parts by weight of aluminum hydrate, 8-12 parts by weight of chlorosulfonated polyethylene rubber, 2-6 parts by weight of sodium dihexyl sulfosuccinate. parts and 0.1-2 parts by weight of platinum-based catalyst.
상기 실리콘 조성물은 25℃에서의 점도가 150,000-180,000 mPaㆍs이고, 분자 내에 적어도 2개의 규소-결합된 알케닐기를 갖는 폴리다이오가노실록산을 포함한다. 상기 실리콘 조성물로, 상기 점도 범위를 나타내며, 분자 내에 적어도 2개의 규소-결합된 알케닐기를 갖는 폴리다이오가노실록산을 포함하여 우수한 접착성 및 내열성을 확보할 수 있다. 상기 알케닐기는 비닐, 알릴, 프로페닐, 이소프로페닐, 부테닐, 펜테닐, 헥세닐 등일 수 있으며, 바람직하게는 5-헥세닐이다.The silicone composition has a viscosity of 150,000-180,000 mPa·s at 25°C and includes a polydiorganosiloxane having at least two silicon-bonded alkenyl groups in the molecule. The silicone composition exhibits the above viscosity range and includes polydiorganosiloxane having at least two silicon-bonded alkenyl groups in the molecule, thereby ensuring excellent adhesion and heat resistance. The alkenyl group may be vinyl, allyl, propenyl, isopropenyl, butenyl, pentenyl, hexenyl, etc., and is preferably 5-hexenyl.
상기 실리콘 조성물은 25℃에서의 점도가 500-1,000 mPaㆍs이고, 분자 내에 적어도 3개의 규소-결합된 수소 원자를 갖는 폴리다이오가노실록산을 포함한다. 상기 실리콘 조성물로, 상기 점도 범위를 나타내며, 분자 내에 적어도 3개의 규소-결합된 수소 원자를 갖는 폴리다이오가노실록산을 포함하여 조성물의 내구성을 높인다. 상기 폴리다이오가노실록산은 폴리다이오가노실록산의 알케닐기와 반응하여 경화될 수 있다.The silicone composition has a viscosity of 500-1,000 mPa·s at 25°C and includes a polydiorganosiloxane having at least three silicon-bonded hydrogen atoms in the molecule. In the silicone composition, polydiorganosiloxane exhibiting the above viscosity range and having at least three silicon-bonded hydrogen atoms in the molecule is included to increase the durability of the composition. The polydiorganosiloxane can be cured by reacting with the alkenyl group of the polydiorganosiloxane.
상기 분자 내에 적어도 3개의 규소-결합된 수소 원자를 갖는 폴리다이오가노실록산은 트라이메틸실록시-종결된 폴리다이메틸실록산-메틸하이드로겐실록산 공중합체를 사용하는 것이 바람직하다.The polydiorganosiloxane having at least three silicon-bonded hydrogen atoms in the molecule is preferably a trimethylsiloxy-terminated polydimethylsiloxane-methylhydrogensiloxane copolymer.
상기 실리콘 조성물은 25℃에서의 점도가 1,200,000-1,500,000 mPaㆍs인 폴리오가노하이드로겐실록산을 포함한다. 상기와 같이 고점도의 가교결합제를 추가 적용하여 실리콘 조성물의 코팅 시 접착력을 높일 수 있다. 상기 폴리다이오가노하드로겐실록산은 폴리다이오가노실록산의 알케닐기와 반응하여 경화될 수 있다.The silicone composition includes polyorganohydrogensiloxane having a viscosity of 1,200,000-1,500,000 mPa·s at 25°C. As described above, adhesion can be increased when coating the silicone composition by additionally applying a high viscosity crosslinking agent. The polydiorganohydrogensiloxane can be cured by reacting with the alkenyl group of the polydiorganosiloxane.
상기 실란 표면처리된 삼산화 안티모니(Sb2O3)는 실리콘 조성물에 난연제로 적용되어 실리카섬유에 난연성을 더욱 높여준다.The silane surface-treated antimony trioxide (Sb 2 O 3 ) is applied as a flame retardant to the silicone composition to further increase the flame retardancy of the silica fiber.
상기 알루미늄하이드레이트는 실리카섬유의 내열 특성을 더욱 보강시켜준다.The aluminum hydrate further enhances the heat resistance properties of silica fiber.
상기 클로로술폰화 폴리에틸렌 고무는 내열 특성과 더불어 실리카섬유의 기계적 물성을 향상시켜준다.The chlorosulfonated polyethylene rubber improves the mechanical properties of silica fiber in addition to heat resistance properties.
상기 소듐디헥실술포숙시네이트는 고무 첨가제와 함께 도입되어 섬유의 인장신도, 열안정성을 개선하여 준다.The sodium dihexyl sulfosuccinate is introduced together with a rubber additive to improve the tensile elongation and thermal stability of the fiber.
상기 무기질층(240)은 산화마그네슘 28-32 중량부, 염화마그네슘 18-22 중량부, 활성탄소섬유 3-7 중량부, 토르말린 3-7 중량부, 일라이트 3-7 중량부, 흑운모 3-7 중량부, 제올라이트 3-7 중량부, 알루미늄실리케이트 1-5 중량부, 칼슘실리케이트 1-5 중량부 및 규산염 17-21 중량부를 포함하는 무기질층 형성용 조성물로 형성된 것이 바람직하고, 산화마그네슘 29-31 중량부, 염화마그네슘 19-21 중량부, 활성탄소섬유 4-6 중량부, 토르말린 4-6 중량부, 일라이트 4-6 중량부, 흑운모 4-6 중량부, 제올라이트 4-6 중량부, 알루미늄실리케이트 2-4 중량부, 칼슘실리케이트 2-4 중량부 및 규산염 18-20 중량부를 포함하는 무기질층 형성용 조성물로 형성된 것이 더욱 바람직하다.The inorganic layer 240 includes 28-32 parts by weight of magnesium oxide, 18-22 parts by weight of magnesium chloride, 3-7 parts by weight of activated carbon fiber, 3-7 parts by weight of tourmaline, 3-7 parts by weight of illite, and 3-7 parts by weight of biotite. It is preferably formed from a composition for forming an inorganic layer containing 7 parts by weight, 3-7 parts by weight of zeolite, 1-5 parts by weight of aluminum silicate, 1-5 parts by weight of calcium silicate, and 17-21 parts by weight of silicate, and 29- parts by weight of magnesium oxide. 31 parts by weight, 19-21 parts by weight of magnesium chloride, 4-6 parts by weight of activated carbon fiber, 4-6 parts by weight of tourmaline, 4-6 parts by weight of illite, 4-6 parts by weight of biotite, 4-6 parts by weight of zeolite, It is more preferable that it is formed of a composition for forming an inorganic layer containing 2-4 parts by weight of aluminum silicate, 2-4 parts by weight of calcium silicate, and 18-20 parts by weight of silicate.
규산염은 지각의 약 90%를 차지하는 조암 광물로 각기 다른 비율의 규소와 산소를 함유하고 있는 규산염군의 구조를 기반으로 분류된다. 액상 규산염(가용성 규산염, Soluble silicates)은 실리카(SiO2)와 알칼리금속(M2O)이 다양한 몰비(molar ratio)로 결합하고 있는 화합물로서, 일반적으로 구조 내에 일부 물을 함유하고 있어서 M2O-nSiO2-xH2O의 분자식으로 표현된다. 물에 대한 용해성이 있기 때문에 '물유리(water glass)'라고도 한다. 상기 규산염은 무기질 바인더로 적용된다.Silicates are coarse rock minerals that make up about 90% of the earth's crust and are classified based on the structure of the silicate group, which contains different proportions of silicon and oxygen. Liquid silicates (Soluble silicates) are compounds in which silica (SiO 2 ) and alkali metal (M 2 O) are combined in various molar ratios. They generally contain some water in the structure, so M 2 O It is expressed with the molecular formula of -nSiO 2 -xH 2 O. Because it is soluble in water, it is also called ‘water glass’. The silicate is applied as an inorganic binder.
이하, 본 발명을 하기의 실시예에 의해 보다 상세하게 설명한다.Hereinafter, the present invention will be explained in more detail by the following examples.
단, 하기 실시예는 본 발명의 내용을 예시하는 것일 뿐 발명의 범위가 실시예 및 실험예에 의해 한정되는 것은 아니다.However, the following examples only illustrate the content of the present invention and the scope of the invention is not limited by the examples and experimental examples.
<실시예 1> 준불연보드의 제조-1<Example 1> Manufacturing of semi-non-combustible board-1
도 1에 나타낸 바와 같이, 돌출부(10), 홈(20), 내부홈(22) 및 하부홀(23)을 포함하는 보드층으로 구성된 준불연보드를 제조하였다.As shown in Figure 1, a semi-non-combustible board consisting of a board layer including a protrusion 10, a groove 20, an internal groove 22, and a lower hole 23 was manufactured.
<실시예 2> 준불연보드의 제조-2<Example 2> Manufacturing of semi-non-combustible board-2
도 7에 나타낸 바와 같이, 돌출부(211) 및 홈(212)을 포함하는 보드층(210)을 제조하고, 상기 보드층(210) 하부에 접착층 형성용 조성물을 도포하여 접착층(220)을 형성하고, 상기 접착층(220) 하부에 부직포를 위치시켜 부직포층(230)을 형성하고, 상기 부직포층(230) 하부에 무기질층 형성용 조성물을 도포한 후 압착 결합, 가열 및 건조하여 무기질층(240)을 형성하여 준불연보드를 제조하였다.As shown in FIG. 7, a board layer 210 including protrusions 211 and grooves 212 is manufactured, and a composition for forming an adhesive layer is applied to the lower part of the board layer 210 to form an adhesive layer 220. , a non-woven fabric is placed below the adhesive layer 220 to form a non-woven fabric layer 230, and a composition for forming an inorganic layer is applied to the bottom of the non-woven fabric layer 230, followed by compression bonding, heating, and drying to form an inorganic layer 240. A semi-non-combustible board was manufactured by forming a semi-non-combustible board.
<실험예 1> 물성분석<Experimental Example 1> Physical property analysis
상기 실시예 1에서 제조된 준불연보드의 물성을 한국화학융합시험연구원에 의뢰하여 분석하였으며, 그 결과를 하기 표 1에 나타내었다.The physical properties of the semi-non-combustible board manufactured in Example 1 were analyzed by the Korea Testing and Research Institute, and the results are shown in Table 1 below.
질량손실 2.5Temperature rise 0.9
Mass loss 2.5
질량손실 2.0Temperature rise 0.6
Mass loss 2.0
상기 표 1에 나타낸 바와 같이, 본 발명에 따른 준불연보드는 준불연성을 나타내고 물성이 우수한 것을 확인할 수 있었다.As shown in Table 1 above, it was confirmed that the semi-incombustible board according to the present invention exhibited semi-incombustibility and had excellent physical properties.
Claims (3)
상기 보드층 하부에 형성된 접착층;
상기 접착층 하부에 형성된 부직포층; 및
상기 부직포층 하부에 형성된 무기질층;을 포함하고,
상기 접착층은 아크릴계 고분자 수지 48-52 중량부, 아크릴계 혼합물 8-12 중량부, 수산화알루미늄 18-22 중량부, 구아니딘 포스페이트 4-8 중량부, 탄소나노섬유 2-6 중량부, 탄산칼슘 1-5 중량부 및 메틸에틸케톤 5-9 중량부를 포함하는 접착층 형성용 조성물로 형성된 것이고,
상기 아크릴계 고분자 수지는 에틸메타크릴레이트 단량체 단위 23-27 중량부, 하이드록시메틸메타크릴레이트 단량체 단위 23-27 중량부, 글리시딜메타크릴레이트 단량체 단위 23-27 중량부 및 2-포스포노옥시에틸 메타크릴레이트(2-(phosphonooxy)ethyl methacrylate) 단량체 단위 23-27 중량부를 포함하는 제1 아크릴레이트계 공중합체 78-82 중량부 및 트리이소프로필실릴 메타크릴레이트 단량체 단위 23-27 중량부, 메틸메타크릴레이트 단량체 단위 23-27 중량부, n-부틸메타크릴레이트 단량체 단위 23-27 중량부 및 메타크릴산 단량체 단위 23-27 중량부를 포함하는 제2 아크릴레이트계 공중합체 18-22 중량부로 이루어지고,
상기 아크릴계 혼합물은 2-포스포노옥시에틸 메타크릴레이트, 글리시딜메타크릴레이트 및 디메타크릴레이트 디에틸렌글리콜이 3:3:4의 중량비율로 혼합된 혼합물이고,
상기 부직포층은 유리섬유와 실리카섬유의 복합사를 이용하여 형성된 것이고,
상기 무기질층은 산화마그네슘 28-32 중량부, 염화마그네슘 18-22 중량부, 활성탄소섬유 3-7 중량부, 토르말린 3-7 중량부, 일라이트 3-7 중량부, 흑운모 3-7 중량부, 제올라이트 3-7 중량부, 알루미늄실리케이트 1-5 중량부, 칼슘실리케이트 1-5 중량부 및 규산염 17-21 중량부를 포함하는 무기질층 형성용 조성물로 형성된 것을 특징으로 하는 준불연보드.A board layer including protrusions;
An adhesive layer formed below the board layer;
A non-woven fabric layer formed below the adhesive layer; and
It includes; an inorganic layer formed below the non-woven fabric layer,
The adhesive layer includes 48-52 parts by weight of acrylic polymer resin, 8-12 parts by weight of acrylic mixture, 18-22 parts by weight of aluminum hydroxide, 4-8 parts by weight of guanidine phosphate, 2-6 parts by weight of carbon nanofibers, and 1-5 parts by weight of calcium carbonate. It is formed of a composition for forming an adhesive layer containing 5-9 parts by weight of methyl ethyl ketone,
The acrylic polymer resin includes 23-27 parts by weight of ethyl methacrylate monomer units, 23-27 parts by weight of hydroxymethyl methacrylate monomer units, 23-27 parts by weight of glycidyl methacrylate monomer units, and 2-phosphonooxy 78-82 parts by weight of a first acrylate-based copolymer containing 23-27 parts by weight of 2-(phosphonooxy)ethyl methacrylate monomer units and 23-27 parts by weight of triisopropylsilyl methacrylate monomer units, 18-22 parts by weight of a second acrylate-based copolymer comprising 23-27 parts by weight of methyl methacrylate monomer units, 23-27 parts by weight of n-butyl methacrylate monomer units, and 23-27 parts by weight of methacrylic acid monomer units. It comes true,
The acrylic mixture is a mixture of 2-phosphonooxyethyl methacrylate, glycidyl methacrylate, and dimethacrylate diethylene glycol in a weight ratio of 3:3:4,
The non-woven layer is formed using a composite yarn of glass fiber and silica fiber,
The inorganic layer includes 28-32 parts by weight of magnesium oxide, 18-22 parts by weight of magnesium chloride, 3-7 parts by weight of activated carbon fiber, 3-7 parts by weight of tourmaline, 3-7 parts by weight of illite, and 3-7 parts by weight of biotite. A semi-non-combustible board, characterized in that it is formed of a composition for forming an inorganic layer containing 3-7 parts by weight of zeolite, 1-5 parts by weight of aluminum silicate, 1-5 parts by weight of calcium silicate, and 17-21 parts by weight of silicate.
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