KR102584329B1 - Manufacturing method for tighten cookie-waffle and tighten cookie kkook-waffle thereof - Google Patents

Abstract

The present invention relates to a method for manufacturing waffles using choux dough and cookie dough. More specifically, by coating the surface of the choux dough with cookie dough and baking it in a waffle maker, moisture in the dough can be removed through direct heat action, allowing it to be baked in the oven. This is a waffle-type cookie manufacturing method that can provide a crispier texture than when cooked.
The present invention's waffle-type cookie manufacturing method includes a first step of preparing cookie dough ingredients, mixing and homogenizing them to produce cookie dough; A second step of maturing the homogenized cookie dough; A third step of preparing the choux dough ingredients including unsalted butter, water, milk, salt, and sugar, then mixing and homogenizing them to produce the first shoe dough; A fourth step of heating the first shoe dough; A fifth step of adding gravity flour to the heated first shoe dough and gelatinizing it to produce a second shoe dough; A sixth step of preparing choux dough by adding eggs to the gelatinized second choux dough and homogenizing it; And a seventh step of baking the homogenized choux dough and the cookie dough aged in the second step in a waffle maker. The seventh step is characterized by arranging the choux dough and the cookie dough side by side or stacking them up and down to prevent them from mixing.

Description

Method for manufacturing waffle-type cookies and waffle-type cookies manufactured using the same {MANUFACTURING METHOD FOR TIGHTEN COOKIE-WAFFLE AND TIGHTEN COOKIE KKOOK-WAFFLE THEREOF}

The present invention relates to a method of manufacturing waffle-type cookies using choux dough and cookie dough. More specifically, by coating the surface of the choux dough with cookie dough and baking it in a waffle maker, the flavor of the cookie can be felt in a gustatory sense. In addition, unlike the indirect heat action of the existing chou production method, moisture in the dough can be removed through direct heat action, so it is a waffle-type cookie manufacturing method that can provide a crispier texture than when baked in the oven.

'Chou', which means 'cabbage' in French, was named so because its swollen shape resembles cabbage. It can be enjoyed in a variety of tastes and shapes by serving it with various creams, fruits, salads, ganache, ice cream, etc. It belongs to the bread category.

In addition, cookies are a snack made by adding flour and various favorite foods to creamed butter, and are a typical Western snack that boasts a rich butter flavor and the cookie's crunchy texture due to its high butter content.

Choux baked in a conventional oven is crispy on the outside and moist on the inside when freshly baked. It tastes crunchy overall, but as time passes after making it, the inside of the choux dough is moist, so the choux dough itself without cream becomes soggy, and the choux filled with cream becomes even more soggy due to the cream. Drinkers who purchase choux that has been made for a long time have the inconvenience of having to eat soggy choux.

The reason why this problem occurs is because choux is generally made by removing moisture from the indirect heat of an oven, and choux made with indirect heat from an oven retains some moisture. And because the choux was filled with a moisturizing cream, the choux, which was crispy on the outside and moist on the inside, soon became soggy on the outside as well.

In addition, in the case of conventional choux, the dough is baked in an oven, so it is difficult to align the choux dough and cookie dough to form a shape, and because moisture is removed through indirect heat, air bubbles are formed between different types of dough as moisture is removed. An empty space is created inside. The outside of the choux, which has an empty space inside and is higher in height, allows heat to be easily transferred to the outside, but the inside, where the space has been created and the height has been increased, does not transfer heat effectively, so it is not baked crispy and is baked with moisture remaining.

Therefore, the present invention was proposed to solve the conventional problem. By baking the choux in a waffle machine and applying direct heat, moisture in the dough is efficiently removed to provide a crispy texture and it does not become soggy even after a long time. The aim is to provide a waffle-shaped cookie manufacturing method that increases the visual image of the waffle shape and improves the flavor and crispy texture of the cookie dough.

Korean Patent Publication No. 10-2015-0113486

The present invention uses a waffle machine to make choux dough and cookie dough into a waffle-shaped outer shell, and uses a waffle machine to apply direct heat to the upper and lower surfaces of the dough, so that both the outside and inside of the dough are crispy, and the consumer can enjoy the choux dough. We aim to provide a method for manufacturing waffle-shaped cookies with a new waffle shape that improves consumer preference by allowing them to enjoy the nutty and crispy flavor that is the essence of cookie dough.

The technical problems to be solved by the invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description below. You will be able to.

The method for manufacturing waffle-type cookies according to the present invention is,

A first step of preparing cookie dough by preparing cookie dough ingredients, mixing and homogenizing them;

A second step of maturing the homogenized cookie dough;

A third step of preparing the choux dough ingredients including unsalted butter, water, milk, salt, and sugar, then mixing and homogenizing them to produce the first shoe dough;

A fourth step of heating the first shoe dough;

A fifth step of adding gravity flour to the heated first shoe dough and gelatinizing it to produce a second shoe dough;

A sixth step of preparing choux dough by adding eggs to the gelatinized second choux dough and homogenizing it; and

A seventh step of baking the homogenized choux dough and the cookie dough aged in the second step in a waffle maker,

The cookie dough is,

Containing 100 to 200 parts by weight of unsalted butter, 100 to 200 parts by weight of sugar powder, and 10 to 50 parts by weight of almond powder, based on 100 parts by weight of cake flour,

The Schnife porridge is,

Based on 100 parts by weight of the flour, 100 to 200 parts by weight of the egg, 50 to 100 parts by weight of the unsalted butter, 100 to 150 parts by weight of the water, 100 to 150 parts by weight of the milk, 1 to 5 parts by weight of the salt, and the sugar. Containing 10 to 20 parts by weight,

The seventh step is characterized by arranging the choux dough and the cookie dough side by side or stacking them up and down to prevent them from mixing.

By solving the above problem, the waffle-type cookie of the present invention can efficiently remove moisture by applying direct heat to the choux dough and maintain a crispy texture for a long time.

As a means of solving the above problem, the waffle-type cookie of the present invention is made by placing cookie dough full of savory flavor on choux dough and applying direct heat to the upper and lower surfaces of the dough using a waffle machine to efficiently remove moisture, creating a crispy texture without a soggy texture over time. can be maintained for a long time. In addition, it has a new choux form that improves the taste of eaters by making the choux dough into a waffle shape and providing visual enjoyment.

1 is a flow chart showing a method for manufacturing waffle-type cookies of the present invention.
Figure 2 shows cookie dough at the top, and a waffle-type cookie made from choux dough at the bottom.
In Figure 3, the left side (beige part) is choux dough, and the right side (red part) is a waffle-type cookie made with cookie dough.
Figure 4 is a photo showing the manufactured waffle-type cookie decorated with chocolate.
Figure 5 is a cross-sectional photograph of a waffle-shaped cookie baked in a waffle machine, showing that moisture has been removed, internal pores are small, and the cookie is completely crispy.
Figure 6 is a cross-sectional photo of choux dough baked in a conventional oven. It can be seen in the cross section that the outside is crispy, but the internal pores are large and the inside, where moisture has not been removed, is moist.
Figure 7 is a photo showing sugar being baked in an oven.

The terms used in this specification will be briefly explained, and the present invention will be described in detail.

The terms used in the present invention are general terms that are currently widely used as much as possible while considering the function in the present invention, but this may vary depending on the intention or precedent of a person working in the art, the emergence of new technology, etc. Therefore, the terms used in the present invention should be defined based on the meaning of the term and the overall content of the present invention, rather than simply the name of the term.

When a part in the entire specification is said to “include” a certain element, this means that it does not exclude other elements but may further include other elements, unless specifically stated to the contrary.

Below, with reference to the attached drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily implement the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein.

Specific details, including the problem to be solved by the present invention, the means for solving the problem, and the effect of the invention, are included in the examples and drawings described below. The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings.

Hereinafter, the present invention will be described in more detail with reference to the attached drawings.

The present invention relates to a method of manufacturing waffle-type cookies using choux dough and cookie dough. More specifically, the moisture of the dough can be removed through direct heat action by coating the surface of the choux dough with cookie dough and baking it in a waffle machine, making it possible to remove moisture from the dough in an oven. This is a waffle-type cookie manufacturing method that can effectively provide a much crispier texture than when baked.

As shown in Figure 1, the present invention's waffle-type cookie manufacturing method can be performed by the first step (S100) to the seventh step (S700) below.

First, in the first step (S100), cookie dough ingredients including cake flour and unsalted butter are prepared, mixed and homogenized, and cookie dough is manufactured. The cookie dough ingredients are preferably composed of main ingredients including the cake flour and unsalted butter, and auxiliary ingredients including sugar powder and almond powder.

More specifically, the first step (S100) includes a 1-1 step (S101) of sieving to even out the powder particles including the cake flour, sugar powder, and almond powder and prevent agglomeration, and the sieve. It is preferable that it consists of the first and second steps (S102) of adding the unsalted butter to the beaten powder and mixing for 1 to 3 minutes at a stirring speed of 50 rpm to homogenize it.

In addition, it is preferable to prepare it by including 100 to 200 parts by weight of the unsalted butter, 100 to 200 parts by weight of the sugar powder, and 10 to 50 parts by weight of the almond powder with respect to 100 parts by weight of the cake flour.

Next, in the second step (S200), the homogenized cookie dough is aged. More specifically, in the second step (S200), the homogenized cookie dough is rolled out with a rolling pin to a thickness of 0.2 mm to 0.5 mm, and the cookie dough is shaped by cutting the cookie dough with a circular cookie cutter with a diameter of 2 cm to 5 cm. Aged at a freezing temperature of -19°C to -17°C for 1 hour to 1.5 hours.

When maturing at a temperature of -17°C or higher in the second step (S200), the hardness of the cookie dough is not hard and the shape is not fixed, so it may be difficult to hold the cookie dough by hand, so it is preferable to carry out the above conditions.

In addition, if the mixed ingredients are aged for less than 1 hour, the hardness of the cookie dough is not hard and the shape is not fixed, so it may be difficult to hold the cookie dough by hand. If the mixed ingredients are aged for more than 1.5 hours, the cookie dough may not be hard and the shape is not fixed. Since the cookie dough may harden, it is preferable to carry out the procedure under the above conditions.

Next, in the third step (S300), the first choux dough is prepared by preparing choux dough ingredients including unsalted butter, water, milk, salt, and sugar, then mixing and homogenizing them.

More specifically, the shoe dough ingredients include 50 to 100 parts by weight of the unsalted butter, 100 to 150 parts by weight of the water, 100 to 150 parts by weight of the milk, and the above, based on 100 parts by weight of the flour mixed in the fifth step (S500). It is preferable to include 1 to 5 parts by weight of salt, 10 to 20 parts by weight of sugar, and 100 to 200 parts by weight of eggs mixed in the sixth step (S600).

Next, in the fourth step (S400), the homogenized first choux dough is heated. More specifically, the first shoe dough is heated at 100°C to 110°C for 2 to 5 minutes.

If the first shoe dough is heated at a temperature below 100°C, a problem may occur where the gravity powder mixed in the fifth step (S500) below clumps up, and if the first shoe dough is heated at a temperature exceeding 110°C, the gravity powder may clump together. When heated, excessive moisture may evaporate, so it is preferable to perform under the above conditions.

In addition, when the first choux dough is heated for less than 2 minutes, too much moisture remains in the dough, and when heated for more than 5 minutes, the moisture evaporates excessively, resulting in waffle-type cookies produced because the moisture in the dough is not adequate. It is advisable to carry out the above-mentioned conditions as it can cause problems with the dough expanding to both sides and create an unfavorable texture.

Next, in the fifth step (S500), gravity flour is added to the heated first shoe dough and gelatinized to produce a second shoe dough. The gelatinization process involves adding flour to boiling water and heating it, causing the starch particles of the flour to absorb water and swell, becoming soft and forming a paste-like consistency.

More specifically, the fifth step (S500) is a 5-1 step (S501) of sieving the gravity flour to even out the particles of the powder and prevent agglomeration, and the sieved flour is mixed with the heated first shoe. It is preferably comprised of the 5-2 step (S502) of adding it to the dough, scraping it with a wooden spoon for 2 to 5 minutes at a temperature of 70°C to 90°C, and frying the dough uniformly until a thin film is formed and gelatinizing it.

In step 5-2 (S502), when gelatinizing at a temperature below 70℃, no film is formed on the bottom of the pot, so the dough must be stir-fried evenly until a thin film is formed. However, it is difficult to check the condition, so the exact time of gelatinization is missed, and the temperature is 90℃. When heated at an excessive temperature, the unsalted butter mixed in the third step (S300) may ooze out of the dough due to the high heat, and a film may be formed before the gelatinization is completed, preventing proper gelatinization.

In addition, if gelatinization is performed for less than 2 minutes in step 5-2 (S502), there is a risk of forming a soggy dough with moisture not escaping properly, and if gelatinization is performed for more than 5 minutes, the dough becomes dry due to excessive moisture evaporation. This may cause problems with expansion of the waffle-type cookie later, so it is preferable to carry out the above conditions.

Next, in the sixth step (S600), eggs are added to the gelatinized second choux dough and homogenized to prepare choux dough.

More specifically, the 6th step (S600) includes the 6-1 step (S601) of preparing the eggs into whole egg liquid, adding the whole egg liquid to the second choux dough, and stirring for 2 minutes at a stirring speed of 1 rpm to 50 rpm. It is preferable that it consists of the 6-2 step (S602) of mixing for 5 minutes.

The cookie dough aged in the second step (S200) and the homogenized choux dough can be stored at a freezing temperature of -19°C to -17°C and then performed in the seventh step (S700) below. When stored at the above-mentioned freezing temperature, the taste and flavor of the cookie dough and choux dough are not significantly altered, so they can be used after frozen storage.

Next, in the seventh step (S700), the homogenized choux dough and the cookie dough matured in the second step (S200) are baked in a waffle maker to produce waffle-type cookies.

More specifically, after panning the choux dough in the waffle machine, the cookie dough cut with a circular cookie cutter in the second step (S200) is removed and panned together in the waffle machine. It is preferable to arrange the shoe dough and cookie dough side by side so as not to mix, or to stack them up and down and bake them at a temperature of 170°C to 180°C for 10 to 15 minutes.

It is preferable to prepare the cookie dough in an amount of 40 to 60 parts by weight based on 100 parts by weight of the shoe dough. When manufactured with less than 40 parts by weight of the cookie dough based on 100 parts by weight of the choux dough, a problem may arise in which the flavor of the cookie dough is insignificant, and when manufactured with more than 60 parts by weight of the cookie dough with respect to 100 parts by weight of the choux dough. In this case, the shoe dough may be blocked from expanding to both sides, causing problems such as inability to expand properly.

In the seventh step (S700), when baking below 170°C, it takes a long time to bake properly due to the low temperature, and a problem may occur in that a lot of moisture is lost over time, creating a crumbly texture rather than a crispy texture. If baking exceeds 180°C, the inside may not cook properly and only the outside will burn due to the high temperature, which may cause the problem of not being able to maintain the crispy texture on the outside and inside, which is the advantage of waffle-type cookies, so it is preferable to carry out the above conditions.

In addition, in the seventh step (S700), if baked for less than 10 minutes, the produced waffle-type cookie may be undercooked, and if baked for more than 15 minutes, it may be overcooked or burned, which is an advantage of the waffle-type cookie. Since it is impossible to maintain a crispy texture on the outside and inside, it is preferable to carry out the process under the above conditions.

Figure 2 shows the choux dough and cookie dough stacked and arranged vertically in the waffle-type cookie manufactured according to the present invention, and Figure 3 shows the choux dough and cookie dough arranged left and right in the waffle-type cookie manufactured according to the present invention. These are photos arranged side by side.

In the conventional case, dough is generally placed in an oven and baked at a high temperature to produce choux or cookies. Baking in the oven causes indirect thermal contact with the dough through convection heat, so when the moisture between the choux dough and the cookie dough is removed, underbaked areas occur depending on the panning position in the oven pan, and the outside of the choux dough is baked crispy. However, because the inside of the choux dough is not exposed to much heat, it is baked with a lot of moisture.

In the seventh step (S700), custard cream and whipped cream can be added to the baked waffle-shaped cookie. More specifically, it can be completed by removing the waffle-shaped cookie from the waffle maker and topping it with the custard cream and whipped cream, or by adding any one or more of green tea powder, chocolate, cocoa powder, and peanut butter.

The custard cream is preferably prepared by the following steps. First, add 0.15 to 0.2 parts by weight of vanilla bean per 100 parts by weight of milk in a pot and heat at 40°C to 50°C for 1 minute. Next, pour 10 to 30 parts by weight of sugar and 5 to 15 parts by weight of cake flour for 15 to 25 parts by weight of pre-mixed egg yolk into the pot, mix, and reheat at 95°C for 5 minutes to confirm that the viscosity is complete. . Next, add 70 to 90 parts by weight of unsalted butter and mix to create a smooth custard cream.

The fresh cream is prepared by mixing 10 parts by weight of sugar with 100 parts by weight of animal fresh cream.

Below is an example testing the manufacturing process of the waffle-type cookie manufactured according to the present invention.

1) Custard cream production

① Add milk and vanilla bean to a pot and boil.

② Pour part 1 into the previously mixed egg yolk, sugar, and cake flour, mix well, then put part 1 back into the pot and boil.

③ Boil the cream until it becomes soft, then mix in the unsalted butter.

2) Whipped cream production

① Add fresh cream and sugar and whip using a machine.

3) Cookie dough manufacturing

① Mix unsalted butter and sugar powder, then mix in cake flour and almond powder.

② Ripen in the freezer for 1 hour.

③ Place in a pan and bake in a waffle pan.

4) Production of choux dough

① Mix unsalted butter, water, milk, salt, and sugar in a pot and heat.

② Add all-purpose flour and gelatinize.

③ Add eggs and mix.

④ Place in a pan and bake in a waffle pan.

5) Chocolate melting

① Melt the chocolate in a microwave-safe container.

division composition Weight (g) shell 1 choux dough unsalted butter 400 water 500 milk 500 salt 20 sugar 60 gravity flour 500 egg 800 shell 2 cookie dough unsalted butter 600 Sugar powder 500 weak flour 600 Almond powder 200 cream custard cream milk 1200 vanilla bean 4 egg yolk 240 sugar 240 weak flour 120 unsalted butter 80 whipping cream Animal fresh cream 400 sugar 40 Deco Cream chocolate 100

ingredient Weight (g) ratio(%) unsalted butter 1080 15.21% water 500 7.04% milk 1700 23.94% salt 20 0.28% sugar 340 4.79% gravity flour 500 7.04% egg 800 11.26% Sugar powder 500 7.04% weak flour 720 10.14% Almond powder 200 2.82% vanilla bean 2 0.03% egg yolk 240 3.38% Animal fresh cream 400 5.63% chocolate 100 1.41% Sum 7102 100%

Below, an example will be described in detail through an experiment in which a product manufactured under the conditions of the present invention was set as a control group and a waffle-type cookie manufactured in the present invention was set as an experimental group.

[Comparative Example 1]

A waffle-type cookie manufactured by the manufacturing method of the present invention, but manufactured in an oven.

[Example 1]

A waffle-type cookie manufactured by the waffle-type cookie manufacturing method of the present invention.

[Example 2]

A waffle-type cookie manufactured by the present invention's waffle-type cookie manufacturing method, after aging at -25°C for 1.3 hours in the second step (S200).

[Example 3]

A waffle-type cookie manufactured by the present invention's waffle-type cookie manufacturing method, after aging at -10°C for 1.3 hours in the second step (S200).

[Example 4]

A waffle-type cookie manufactured by the waffle-type cookie manufacturing method of the present invention, after aging at -18°C for 40 minutes in the second step (S200).

[Example 5]

A waffle-type cookie manufactured by the present invention's waffle-type cookie manufacturing method, after aging for 1.7 hours at -18°C in the second step (S200).

[Example 6]

A waffle-type cookie manufactured by the present invention's waffle-type cookie manufacturing method, after heating the first shoe dough at 80° C. for 3 minutes in the fourth step (S400).

[Example 7]

A waffle-type cookie manufactured by the present invention's waffle-type cookie manufacturing method, after heating the first shoe dough at 130°C for 3 minutes in the fourth step (S400).

[Example 8]

A waffle-type cookie manufactured by the present invention's waffle-type cookie manufacturing method, after heating the first shoe dough at 103° C. for 1 minute in the fourth step (S400).

[Example 9]

A waffle-type cookie manufactured by the present invention's waffle-type cookie manufacturing method, after heating the first shoe dough at 103°C for 6 minutes in the fourth step (S400).

[Example 10]

A waffle-type cookie manufactured by the waffle-type cookie manufacturing method of the present invention, after gelatinizing at 60°C for 3 minutes in the fifth step (S500).

[Example 11]

A waffle-type cookie manufactured by the waffle-type cookie manufacturing method of the present invention, after gelatinizing at 100°C for 3 minutes in the fifth step (S500).

[Example 12]

A waffle-type cookie manufactured by the waffle-type cookie manufacturing method of the present invention, after gelatinizing at 80° C. for 1 minute in the fifth step (S500).

[Example 13]

A waffle-type cookie manufactured by the present invention's waffle-type cookie manufacturing method, after gelatinizing at 80°C for 6 minutes in the fifth step (S500).

[Example 14]

A waffle-type cookie manufactured by the waffle-type cookie manufacturing method of the present invention, after baking at 160°C for 13 minutes in the seventh step (S700).

[Example 15]

A waffle-type cookie manufactured by the present invention's waffle-type cookie manufacturing method, after baking at 190°C for 13 minutes in the seventh step (S700).

[Example 16]

A waffle-type cookie manufactured by the present invention's waffle-type cookie manufacturing method, and baked at 1750°C for 8 minutes in the seventh step (S700).

[Example 17]

A waffle-type cookie manufactured by the present invention's waffle-type cookie manufacturing method, and baked at 1750°C for 17 minutes in the seventh step (S700).

(a) Sensory test

A sensory test of waffle-type cookies manufactured through comparative and experimental examples was conducted with a score out of 7, and the sensory evaluation results were statistically processed on 20 panelists in their 20s to 50s through the statistical program SAS, and the results are as follows. It is shown in [Table 3] and [Figure 2].

taste Texture zest overall preference Comparative Example 1 6.1 5.9 6.0 6.0 Example 1 6.2 6.8 6.3 6.8 Example 2 5.8 5.3 5.3 5.2 Example 3 5.7 5.6 5.3 5.4 Example 4 5.8 5.0 5.2 5.0 Example 5 5.8 4.8 4.8 4.9 Example 6 5.3 5.6 5.3 5.2 Example 7 4.8 5.5 4.9 4.9 Example 8 5.2 5.6 4.9 5.0 Example 9 4.8 5.6 5.0 4.9 Example 10 4.6 4.5 4.8 4.7 Example 11 4.5 4.6 4.9 4.8 Example 12 4.6 4.2 4.8 4.6 Example 13 4.8 4.6 4.5 4.8 Example 14 5.0 5.1 4.6 5.5 Example 15 5.3 5.2 4.3 5.0 Example 16 5.0 5.2 4.2 5.1 Example 17 5.4 5.2 4.3 5.4

[Example 2] to [Example 5] were aged under conditions different from those of the present invention in the second step (S200), and compared to [Example 1] prepared according to the present invention, the ripening of the cookie dough was minimal and the texture was poor. It was confirmed that the flavor was lowered and the overall preference was low.

In addition, [Example 6] to [Example 9] are compared with [Example 1], which was prepared according to the present invention by preparing the first shoe dough under conditions different from those of the present invention in the fourth step (S400). It was confirmed that the heating conditions of the first choux dough were different, resulting in lower taste and flavor and lower overall preference.

In addition, [Example 10] to [Example 13] have taste compared to [Example 1] prepared according to the present invention by gelatinizing the first choux dough under conditions different from those of the present invention in the fifth step (S500). , it was confirmed that the texture and flavor were lowered and the overall preference was low.

In addition, [Example 14] to [Example 17] have a lower flavor compared to [Example 1] prepared according to the present invention by baking the waffle-type cookie under conditions different from those of the present invention in the seventh step (S700). It was confirmed that overall preference was low.

(B) Sensory test after 1 hour

The waffle-type cookies prepared through [Comparative Example 1] and [Experimental Example 1] were left at room temperature for 1 hour and then subjected to a sensory test with a score out of 7, and the sensory evaluation results were given to 20 panelists in their 20s to 50s using a statistical program. Statistical processing was performed through SAS, and the results are shown in [Table 4] below.

taste Texture zest overall preference Comparative Example 1 5.3 4.3 5.0 4.8 Example 1 6.0 6.2 6.0 6.0

When comparing the waffle-type cookies prepared through [Comparative Example 1] and [Experimental Example 1] after leaving them at room temperature for 1 hour, in the case of [Comparative Example 1], the taste increased from 6.1 to 5.3 and the texture increased from 5.9 to 4.3. As it decreased from 6.0 to 5.0, the overall preference decreased from 6.0 to 4.8. In the case of [Comparative Example 1], it is judged that the evaluation of the texture was lowered due to the fact that it was manufactured in an oven and the crispy texture disappeared after a certain period of time and the texture became soggy.

Meanwhile, in the case of [Example 1], the taste decreased from 6.2 to 6.0, the texture decreased from 6.8 to 6.2, and the flavor decreased from 6.3 to 6.0, and the overall preference decreased from 6.8 to 6.8. In the case of [Example 1], the taste, texture, flavor, and overall preference decreased slightly after a certain period of time, but compared to [Comparative Example 1], the reduction rate was not relatively high, and in particular, the texture was still crispy even after a certain period of time had passed. It was confirmed that the texture and overall preference were high as it was possible to maintain the texture.

By solving the above problem, the waffle-type cookie of the present invention can efficiently remove moisture by applying direct heat to the choux dough and maintain a crispy texture for a long time.

As a means of solving the above problem, the waffle-type cookie of the present invention is made by placing cookie dough full of savory flavor on choux dough and applying direct heat to the upper and lower surfaces of the dough using a waffle machine to efficiently remove moisture, creating a crispy texture without a soggy texture over time. can be maintained for a long time. In addition, it has a new choux form that improves the taste of eaters by making the choux dough into a waffle shape and providing visual enjoyment.

As such, a person skilled in the art will understand that the technical configuration of the present invention described above can be implemented in other specific forms without changing the technical idea or essential features of the present invention.

Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive, and the scope of the present invention is indicated by the claims described later rather than the detailed description above, and the meaning and scope of the claims and their All changes or modified forms derived from the equivalent concept should be construed as falling within the scope of the present invention.

S100. The first step of preparing the cookie dough by preparing the cookie dough ingredients, mixing and homogenizing them.
S101. Step 1-1 of sieving to even out the powder particles including the cake flour, sugar powder, and almond powder and prevent agglomeration.
S102. Step 1-2 of adding the unsalted butter to the sifted powder and mixing for 0.1 to 3 minutes at a stirring speed of 50 rpm to homogenize
S200. Second step of maturing the homogenized cookie dough
S300. The third step of preparing the first choux dough by preparing choux dough ingredients including unsalted butter, water, milk, salt, and sugar, then mixing and homogenizing them.
S400. Fourth step of heating the first shoe dough
S500. Step 5: Add gravity flour to the heated first shoe dough and gelatinize it to produce the second shoe dough.
S501. Step 5-1 of sieving the gravity flour to even out the particles and prevent agglomeration.
S502. Step 5-2 of adding the sieved flour into the heated first choux dough, scraping it with a wooden spoon for 2 to 5 minutes at a temperature of 70°C to 90°C, and frying the dough uniformly and gelatinizing it.
S600. Step 6 of producing choux dough by adding eggs to the gelatinized second choux dough and homogenizing it.
S601. Step 6-1 of preparing the eggs with whole egg liquid
S602. Step 6-2 of adding the whole egg liquid to the second choux dough and mixing for 2 to 5 minutes at a stirring speed of 1 rpm to 50 rpm.
S700. The seventh step of baking the homogenized choux dough and the cookie dough aged in the second step in a waffle maker.

Claims (5)

A first step of preparing cookie dough by preparing cookie dough ingredients, mixing and homogenizing them;
A second step of maturing the homogenized cookie dough at a temperature of -19°C to -17°C for 1 hour to 1.5 hours;
A third step of preparing the choux dough ingredients including unsalted butter, water, milk, salt, and sugar, then mixing and homogenizing them to produce the first shoe dough;
A fourth step of heating the first shoe dough to 100°C to 110°C for 2 to 5 minutes;
A fifth step of preparing a second shoe dough by adding gravity flour to the heated first shoe dough and gelatinizing it at a temperature of 70°C to 90°C for 2 to 5 minutes;
A sixth step of preparing choux dough by adding eggs to the gelatinized second choux dough and homogenizing it; and
The homogenized choux dough and the cookie dough matured in the second step are baked in a waffle maker, arranged side by side or stacked up and down so that the choux dough and cookie dough do not mix, and then heated at a temperature of 170°C to 180°C for 10 minutes. Manufactured including a 7th step of baking for 15 minutes,
The cookie dough is,
Containing 100 to 200 parts by weight of unsalted butter, 100 to 200 parts by weight of sugar powder, and 10 to 50 parts by weight of almond powder, based on 100 parts by weight of cake flour,
The Schnife porridge is,
Based on 100 parts by weight of the flour, 100 to 200 parts by weight of the egg, 50 to 100 parts by weight of the unsalted butter, 100 to 150 parts by weight of the water, 100 to 150 parts by weight of the milk, 1 to 5 parts by weight of the salt, and the sugar. Containing 10 to 20 parts by weight,
The first step is,
Step 1-1 of sieving the flour particles including the cake flour, sugar powder, and almond powder to even out the particles and prevent agglomeration; and
It consists of steps 1 and 2 of adding the unsalted butter to the sifted powder and mixing it for 1 to 3 minutes at a stirring speed of 50 rpm to homogenize it,
The fifth step is,
Step 5-1 of sieving the gravity flour to even out the particles and prevent agglomeration; and
The sifted flour is added to the heated first shoe dough, scraped with a wooden spoon for 2 to 5 minutes at a temperature of 70°C to 90°C, and the dough is stirred uniformly until a thin film is formed, and then gelatinized. It consists of 2 stages;
The sixth step is,
Step 6-1 of preparing the eggs with whole egg liquid; and
It consists of step 6-2 of adding it to the second shoe dough and mixing for 2 to 5 minutes at a stirring speed of 1 rpm to 50 rpm,
A waffle-type cookie manufacturing method, characterized in that the cookie dough is manufactured in an amount of 40 to 60 parts by weight based on 100 parts by weight of the choux dough.
delete delete delete A waffle-type cookie manufacturing method, characterized in that it is manufactured by the method of claim 1.

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