KR102582147B1 - Method for mounting electro device of 2 dimensional film type - Google Patents

Abstract

The present application relates to a method of disposing a two-dimensional film-type electronic device on an object to be inspected, wherein the electronic device includes a substrate and a signal measuring unit formed on the substrate, and the electronic device is disposed at a predetermined angle with the object to be inspected. , The predetermined angle is an angle at which the stress acting on the electronic device in the horizontal direction is 0. The method relates to a method of arranging a two-dimensional film-type electronic device.

Description

{METHOD FOR MOUNTING ELECTRO DEVICE OF 2 DIMENSIONAL FILM TYPE}

This disclosure relates to methods of placing two-dimensional film-type electronic devices.

Electronic device refers to parts used to construct electronic circuits. These electronic devices can perform functions with specific purposes depending on their internal structure and chemical composition of constituent materials. Specifically, devices such as pressure sensors and actuators generate signal changes through deformation of the internal structure, and devices such as bio-chemical sensors, resistors, capacitors, etc. generate signal changes through the constituent materials themselves. It can occur.

However, if unexpected deformation occurs in the internal structure of an electronic device, incorrect signals may be output due to changes in the efficiency of the operating mechanism. Therefore, in electronic devices that output signals through changes in their internal structure, structural changes should occur only when necessary, and if not, changes in the internal structure should be suppressed as much as possible. In this regard, unintentional changes in the internal structure may occur due to the surrounding dynamic environment.

Specifically, because electronic devices in the past were large and hard, they only performed specific functions without being affected by the surrounding environment, even if they were completely damaged by the surrounding environment. However, while recent electronic devices have become smaller and more flexible, dynamic noise may be generated under the influence of surrounding dynamic environments, such as compression, tension, bending, and temperature.

Japanese Patent Publication No. 2020-171368, which is the background technology of this application, relates to a body-mounted sensor device, a biometric information measurement device, a biometric information measurement system, and a control method of a human body-mounted sensor device.

The purpose of the present application is to solve the problems of the prior art described above, and to provide a method of arranging two-dimensional film-type electronic devices to minimize dynamic noise applied to various electronic devices.

Additionally, the object is to provide a system that minimizes dynamic noise using the method of arranging the two-dimensional film-type electronic devices.

However, the technical challenges sought to be achieved by the embodiments of the present application are not limited to the technical challenges described above, and other technical challenges may exist.

As a technical means for achieving the above-mentioned technical problem, the first aspect of the present application is a method of disposing a two-dimensional film-type electronic device on an object to be inspected, wherein the electronic device includes a substrate and a signal measuring unit formed on the substrate. And, the electronic device is arranged to form a predetermined angle with the object to be inspected, and the predetermined angle is an angle at which the stress acting on the electronic device in the horizontal direction is 0. Disposing a two-dimensional film-type electronic device. It's about the method.

According to one implementation of the present application, the predetermined angle may be determined according to the angle θ calculated according to Equation 1 below, but is not limited thereto.

[Equation 1]

(In Equation 1, ν means Poisson's ratio of the substrate).

According to one embodiment of the present application, the predetermined angle may be 80% to 120% of the angle θ, but is not limited thereto.

According to one embodiment of the present application, the Poisson's ratio of the substrate may be greater than 0 and less than or equal to 0.5, but is not limited thereto.

According to one embodiment of the present application, the two-dimensional film-type electronic device is disposed on the object to be measured at a predetermined angle to minimize the change in signal intensity due to dynamic noise applied to the object. However, it is not limited to this.

According to one embodiment of the present application, the stress applied to the electronic device may include a stress selected from the group consisting of tensile stress, compressive stress, bending stress, shear stress, torsional stress, and combinations thereof. However, it is not limited to this.

According to one embodiment of the present application, the signal measuring unit may include a two-dimensional film selected from the group consisting of graphene, transition metal chalcogenide, black phosphorus, h-BN, and combinations thereof, but is not limited thereto. .

According to one embodiment of the present application, the substrate is PET (Polyethylene terephthalate), PE (Polyethylene), PUA (polyurethaneacrylate), PA (Polyamide), PP (Polypropylene), PBT (Polybutylene terephthalate), PTT (polytrimethylene terephthalate), PI (Polyimide), PU (poly urethane), PVDF (Polyvinylidene fluoride), PDMS (Polydimethylsiloxane), PB (Polybutadiene), PUA (polyurethane-acrylate), SBR (Styrene Butadiene Rubber), PVDF-TrFE (Polyvinylidene fluoride-trifluoroethylene) and It may include, but is not limited to, those selected from the group consisting of combinations thereof.

According to one embodiment of the present application, the test object may include, but is not limited to, one selected from the group consisting of skin, artificial skin, and combinations thereof.

In addition, the second aspect of the present application includes a two-dimensional film-type electronic device so as to form a predetermined angle with the object to be inspected, and the two-dimensional film-type electronic device is configured to detect a change in signal intensity due to dynamic noise applied to the object to be inspected. A dynamic noise minimization system is provided, which is arranged to form a predetermined angle with the object to be measured and analyzes electronic signals generated from the two-dimensional film-type electronic device.

According to one embodiment of the present application, the dynamic noise minimization system may be applied to a device selected from the group consisting of a pressure sensor, a speed sensor, an acceleration sensor, a vibration sensor, a flow sensor, a heat sensor, a resistor, a capacitor, a transistor, and combinations thereof. However, it is not limited to this.

The above-described means of solving the problem are merely illustrative and should not be construed as intended to limit the present application. In addition to the exemplary embodiments described above, additional embodiments may be present in the drawings and detailed description of the invention.

As conventional bulk electronic devices have become smaller and more flexible, the use of electronic devices in various dynamic environments such as bio-implantable devices, skin-attached devices, wearable devices, and soft robotics has increased. However, this dynamic environment causes dynamic noise such as shrinkage, tension, and bending, which may adversely affect the operation of electronic devices.

According to the means for solving the problem of the present application described above, the method of arranging a two-dimensional film-type electronic device according to the present application is to arrange the electronic device in a space with dimensions independent of the space where dynamic noise occurs, thereby improving the operation of the electronic device. The impact of dynamic noise can be minimized.

In addition, the method of arranging a two-dimensional film-type electronic device according to the present application minimizes the influence of dynamic noise through the correlation between the device and the environment in which the device is placed, and can also be applied to previously invented devices.

In addition, the method of arranging a two-dimensional film-type electronic device according to the present application can extend the lifespan of the electronic device by preventing damage and aging of the device from damage caused by dynamic noise.

In addition, the dynamic noise minimization system according to the present application monitors biological signals such as brain waves, electrocardiogram, pulse, and respiration in real time and has high accuracy due to less influence by dynamic noise compared to conventional technology.

Additionally, the dynamic noise minimization system according to the present application can be used in virtual reality games and rehabilitation treatment technology.

However, the effects that can be obtained herein are not limited to the effects described above, and other effects may exist.

Figure 1 is a diagram simulating a signal generated from a conventional electronic device.
Figure 2 is an illustration of stress transformation theory.
Figure 3 is a schematic diagram of a change in structure of a two-dimensional film-type electronic device depending on the angle between the two-dimensional film-type electronic device and an object to be inspected according to an embodiment of the present application.
Figure 4 is a diagram simulating the structural change of a two-dimensional film-type electronic device according to an embodiment of the present application.
Figure 5 is a diagram simulating the structural change of a two-dimensional film-type electronic device according to an embodiment of the present application.
FIG. 6 is a graph showing the relationship between the arrangement angle of a two-dimensional film-type electronic device and noise generated by tension according to an embodiment of the present application.
FIG. 7 is a graph showing the relationship between the arrangement angle of a two-dimensional film-type electronic device and noise generated by compression according to an embodiment of the present application.
Figure 8 is a graph showing the relationship between the angle and the degree of structural change of a two-dimensional film-type electronic device according to an embodiment of the present application.
FIG. 9 is a graph showing the relationship between noise generated by bending and an arrangement angle of a two-dimensional film-type electronic device according to an embodiment of the present application.
Figure 10 is a graph expressing the sensitivity to noise by angle of a two-dimensional film-type electronic device according to an embodiment of the present application.
11 (a) is a diagram showing noise applied to a two-dimensional film-type electronic device according to an embodiment of the present application, and (b) is a diagram showing noise applied to a two-dimensional film-type electronic device according to an embodiment of the present application and the noise generated. This is a graph showing the relationship between signals.
12 (a) is a diagram showing noise applied to a two-dimensional film-type electronic device according to an embodiment of the present application, and (b) is a diagram showing noise applied to a two-dimensional film-type electronic device according to an embodiment of the present application and the noise generated. This is a graph showing the relationship between signals.

Below, with reference to the attached drawings, embodiments of the present application will be described in detail so that those skilled in the art can easily implement them.

However, the present application may be implemented in various different forms and is not limited to the embodiments described herein. In order to clearly explain the present application in the drawings, parts that are not related to the description are omitted, and similar reference numerals are assigned to similar parts throughout the specification.

Throughout this specification, when a part is said to be “connected” to another part, this includes not only the case where it is “directly connected,” but also the case where it is “electrically connected” with another element in between. do

Throughout this specification, when a member is said to be located “on”, “above”, “at the top”, “below”, “at the bottom”, or “at the bottom” of another member, this means that a member is located on another member. This includes not only cases where they are in contact, but also cases where another member exists between two members.

Throughout the specification of the present application, when a part "includes" a certain component, this means that it may further include other components rather than excluding other components unless specifically stated to the contrary.

As used herein, the terms “about,” “substantially,” and the like are used to mean at or close to a numerical value when manufacturing and material tolerances inherent in the stated meaning are presented, and to aid understanding of the present application. It is used to prevent unscrupulous infringers from unfairly exploiting disclosures in which precise or absolute figures are mentioned. Additionally, throughout the specification herein, “a step of” or “a step of” does not mean “a step for.”

Throughout this specification, the term "combination thereof" included in the Markushi format expression means a mixture or combination of one or more components selected from the group consisting of the components described in the Markushi format expression, It means including one or more selected from the group consisting of.

Throughout this specification, description of “A and/or B” means “A or B, or A and B.”

Hereinafter, the method of arranging the two-dimensional film-type electronic device of the present application will be described in detail with reference to implementation examples, examples, and drawings. However, the present application is not limited to these embodiments, examples, and drawings.

As a technical means for achieving the above-mentioned technical problem, the first aspect of the present application is a method of disposing a two-dimensional film-type electronic device on an object to be inspected, wherein the electronic device includes a substrate and a signal measuring unit formed on the substrate. And, the electronic device is arranged to form a predetermined angle with the object to be inspected, and the predetermined angle is an angle at which the stress acting on the electronic device in the horizontal direction is 0. Disposing a two-dimensional film-type electronic device. It's about the method.

As conventional bulk electronic devices have become smaller and more flexible, small electronic devices have been developed. These small electronic devices can be implemented in various forms such as skin-attached devices, wearable devices, and soft robotics that can be used in a dynamic environment. However, electronic devices located in the dynamic environment change their shape due to the dynamic environment, and are similar to conventional bulk electronic devices. There is a problem that the signal strength changes irregularly compared to the device.

Figure 1 is a diagram simulating a signal generated from a conventional electronic device. Specifically, (a) in FIG. 1 refers to a signal generated by an electronic device in an environment without dynamic noise, and (b) refers to a signal generated by an electronic device in an environment with dynamic noise. Referring to FIG. 1, even in the same electronic device, uneven signals may be generated due to dynamic noise, so research is needed to minimize such dynamic noise.

The present application provides a method to solve the above-mentioned problems by providing a method of placing a two-dimensional film-type electronic device, which is a miniaturized electronic device and can be used as a skin-attached device, wearable device, soft robotics, etc., on an object to be inspected. .

Dynamic noise according to the present application refers to force, speed, acceleration, flow rate, vibration, etc. that change the shape of an electronic device, and may provide errors in signals generated from the two-dimensional film-type electronic device according to the present application. Specifically, two-dimensional electronic devices can be classified into two-dimensional film-type devices that measure signals through deformation of the device, and two-dimensional film-type devices that measure signals regardless of deformation of the device.

A two-dimensional film-type device that measures signals through deformation of the device can measure the target signal by changing its shape depending on the object of observation. At this time, when a mixed signal of dynamic noise and target signal is applied to the two-dimensional film-type electronic device, when the dynamic noise is converted into stress, the force due to the dynamic noise acts on the two-dimensional film in a horizontal or vertical direction. And, the target signal can be applied to the two-dimensional film at an angle of 90° to cause a change in shape. However, when the force caused by the dynamic noise changes the shape of the two-dimensional film, errors may occur in the signal measured from the two-dimensional film-type electronic device.

Meanwhile, in the case of a two-dimensional film-type device that measures or generates a signal regardless of the deformation of the device, errors may occur in the measured or generated signal due to changes in the shape of the device.

For example, if the shape of the bulk pressure sensor does not change when pressure is applied to the bulk pressure sensor, the bulk pressure sensor can only measure the applied pressure. However, when pressure is applied to a flexible pressure sensor, which is a miniaturized and flexible electronic device such as the two-dimensional film-type electronic device of the present application, the shape of the flexible pressure sensor may change due to the applied pressure, and accordingly, the flexible pressure sensor In addition to signals for applied pressure, signals can also be generated depending on changes in the shape of the device. Therefore, there is a need to minimize signals resulting from changes in the shape of the device.

In this regard, when the dynamic noise is applied to an electronic device as a force, the force applied to the electronic device can be decomposed according to stress transformation theory.

Figure 2 is an illustration of stress transformation theory.

Referring to FIG. 2, unlike an object placed without being tilted on the xy plane, an object placed tilted on the xy plane receives a force in the x'-axis direction and a force in the y'-axis direction, and is applied in the x'-axis direction. The force in the y'-axis direction and the force in the y'-axis direction can be expressed as a combination of the force in the x-axis direction and the force in the y-axis direction, respectively. At this time, if certain conditions are met, an object tilted and placed on the xy plane can minimize force in the x'-axis or y'-axis direction depending on the tilt angle.

Although not depicted in FIG. 2, if a force in the y-axis direction only acts on both ends of the object and no force in the y-axis direction acts on the center of the object, the object may be bent.

According to one implementation of the present application, the predetermined angle may be determined according to the angle θ calculated according to Equation 1 below, but is not limited thereto.

[Equation 1]

(In Equation 1, ν means Poisson's ratio of the substrate).

Poisson's ratio according to the present application refers to the ratio between the transverse strain and the longitudinal strain when a specific object is stretched in that direction under the action of tensile force.

As will be described later, the predetermined angle is determined not only according to the angle calculated according to Equation 1, but also according to the operating target (e.g., tension, compression, bending, temperature, speed, flow rate, etc.) of the two-dimensional film-type electronic device. It can happen.

According to one embodiment of the present application, the predetermined angle may be 80% to 120% of the angle θ, but is not limited thereto.

According to one embodiment of the present application, the Poisson's ratio of the substrate may be greater than 0 and less than or equal to 0.5, but is not limited thereto.

According to one embodiment of the present application, the predetermined angle may be 30° to 90°, but is not limited thereto.

For example, when the Poisson's ratio of the test object is 0.45 to 0.5 and only compression noise caused by the test object acts on the two-dimensional film-type electronic device, the predetermined angle is preferably closer to 30°, and the two-dimensional When only the tensile noise caused by the object to be measured acts on the film-type electronic device, it is preferable that the predetermined angle is closer to 70°, and the compression noise and the tensile noise caused by the object to be measured are simultaneously applied to the two-dimensional film-type electronic device. When the noise is interrupted by two noises, the predetermined angle may be 50° to 70°.

In this regard, the angle between a two-dimensional film-type electronic device that generates a signal only by compression noise and the object to be inspected exceeds 80°, or the angle between a two-dimensional film-type electronic device that generates a signal only by tensile noise and the object to be inspected exceeds 80°. If the angle is less than 20°, a buckling effect occurs and the shape of the two-dimensional film-type electronic device is excessively deformed due to compression or tension, resulting in a signal not being generated in the signal measuring unit or the device being damaged. Problems may arise.

The buckling effect according to the present application means that a specific object cannot withstand forces applied from the inside or outside and is deformed from its original shape.

For example, when the angle between a two-dimensional film-type electronic device that generates a signal only by tension and the object to be measured is close to parallel, the signal measuring unit is stretched by stress acting on the two-dimensional film-type electronic device in the horizontal direction. may be, and the signal generated from the signal measurement unit may be distorted due to tension of the signal measurement unit. To solve this problem, as the angle between the tensile sensor-type two-dimensional film-type electronic device and the object to be measured increases, the stress acting in the horizontal direction decreases, thereby reducing the degree of tensile strain of the signal measuring unit, thereby reducing the signal measurement. Only signals resulting from additional tension can be measured. However, if the angle exceeds 80°, a buckling effect may occur and the signal measuring unit may be damaged by shear stress during tensioning.

Also, for example, when the angle between a two-dimensional film-type electronic device that generates a signal only by compression and the object to be tested is close to vertical, the signal is measured by stress acting in the vertical direction on the two-dimensional film-type electronic device. Additional compression may occur, and the signal generated from the signal measurement unit may be distorted due to compression of the signal measurement unit. To solve this problem, as the angle between the compression sensor-type two-dimensional film-type electronic device and the object to be measured decreases, the stress acting in the vertical direction decreases, thereby reducing the degree of compression strain of the signal measurement unit, thereby reducing the signal measurement. Only signals resulting from additive compression can be measured. However, if the angle is less than 20°, a buckling effect may occur and the signal measuring unit may be damaged by shear stress during compression.

In the case of a two-dimensional film-type electronic device that generates a signal by both compression and tension, the angle between the two-dimensional film-type electronic device and the object to be tested can be determined by considering both the influence of compression and the influence of tension.

According to one embodiment of the present application, the two-dimensional film-type electronic device is disposed on the object to be measured at a predetermined angle to minimize the change in signal intensity due to dynamic noise applied to the object. However, it is not limited to this.

As described above, dynamic noise applied to the object may take the form of a force to change the shape of the two-dimensional film-type electronic device. At this time, the force applied to the object can be converted into stress and applied to the two-dimensional film-type electronic device, and the two-dimensional film-type electronic device has a minimal change in shape to minimize the change in signal intensity. There is a need.

According to one implementation of the present application, the signal measuring unit may include a crack, but is not limited thereto.

Figure 3 is a schematic diagram of the structural change of a two-dimensional film-type electronic device according to the angle between the two-dimensional film-type electronic device and the object to be tested according to an embodiment of the present application, and Figures 4 and 5 are schematic diagrams according to an embodiment of the present application. This is a picture simulating the structural change of a two-dimensional film-type electronic device. In this regard, FIGS. 3 to 5 include cracks to change the structure of a two-dimensional film-type electronic device, and by observing the change in the crack, the angle between the two-dimensional film-type electronic device and the object to be tested is determined by measuring the two-dimensional film. The impact of changes in the structure of electronic devices can be analyzed.

Referring to FIG. 3, when a tensile force is applied to an object on which a two-dimensional film-type electronic device is disposed, it shows the relationship between the angle between the electronic device and the object and the crack of the two-dimensional film-type electronic device. (bottom left of Figure 3). At this time, unlike the case where the electronic device is positioned vertically (top left of FIG. 3), the case where the electronic device is positioned obliquely (top right of FIG. 3) and the case where the electronic device is positioned parallel to the object to be tested (top left of FIG. 3) In the lower right corner, a problem occurs where the width of the crack becomes wider.

Also, referring to FIG. 4, when applying a tensile force to the object to be inspected, if the angle between the electronic device and the object to be inspected is small, the width of the crack widens, and as the angle increases, the width of the crack passes the angle without deformation. It's getting narrower again. In addition, referring to Figure 5, when the angle is small, the width becomes narrow, but as the angle increases, the width of the crack increases through a point where no deformation occurs, and when a compressive force is applied to the object to be inspected, the electronic device and the test object are separated. A problem occurs in which the crack is deformed depending on the angle between the water.

According to one embodiment of the present application, the two-dimensional film-type electronic device may be disposed in a space having dimensions independent of the space in which the dynamic noise occurs, but is not limited thereto.

As described above, the two-dimensional film-type electronic device is arranged to form a predetermined angle with the object to be inspected. At this time, the influence of the dynamic noise on the signal measurement unit of the two-dimensional film-type electronic device is removed or minimized by the predetermined angle. In other words, the space where the dynamic noise occurs and the space where the two-dimensional film-type electronic device is placed can be interpreted as having independent dimensions.

According to one embodiment of the present application, the stress applied to the electronic device may include a stress selected from the group consisting of tensile stress, compressive stress, bending stress, shear stress, torsional stress, and combinations thereof. However, it is not limited to this. For example, when dynamic noise occurs in the object and a force is applied to the electronic device, the electronic device experiences tensile stress, compressive stress, bending stress, shear stress, etc., depending on the angle between the center of the electronic device and the force. Stress such as torsional stress may be applied.

According to one embodiment of the present application, the signal measuring unit may include a two-dimensional film selected from the group consisting of graphene, transition metal chalcogenide, black phosphorus, h-BN, and combinations thereof, but is not limited thereto. .

Additionally, the signal measuring unit may include one selected from the group consisting of Pt, Au, Cr, Cu, Mg, Ti, Al, Mo, C, Si, and combinations thereof, but is not limited thereto.

The signal measuring unit may include any material that can be used as a sensor.

According to one embodiment of the present application, the substrate is PET (Polyethylene terephthalate), PE (Polyethylene), PUA (polyurethaneacrylate), PA (Polyamide), PP (Polypropylene), PBT (Polybutylene terephthalate), PTT (polytrimethylene terephthalate), PI (Polyimide), PU (poly urethane), PVDF (Polyvinylidene fluoride), PDMS (Polydimethylsiloxane), PB (Polybutadiene), PUA (polyurethane-acrylate), SBR (Styrene Butadiene Rubber), PVDF-TrFE (Polyvinylidene fluoride-trifluoroethylene) and It may include, but is not limited to, those selected from the group consisting of combinations thereof.

Additionally, the substrate may include a two-dimensional film made of the same material as the signal measuring unit, but is not limited thereto.

For example, the two-dimensional film-type electronic device may include a polymer substrate and a two-dimensional film formed on the polymer substrate, but is not limited thereto.

According to one embodiment of the present application, the specimen may include, but is limited to, one selected from the group consisting of skin, artificial skin, biological tissue, PDMS, ecoflex, hydrogel, Tegaderm, and combinations thereof. That is not the case. Preferably, the test object may include skin, biological tissue, artificial skin, gel, and bandage.

According to one embodiment of the present application, the signal measured by the signal measuring unit is a group consisting of the two-dimensional film-type electronic device or resistance, current, voltage, capacitor, impedance, and combinations thereof measured by the signal measuring unit. It may be expressed as selected from, but is not limited to this.

As described above, the two-dimensional film-type electronic device can be divided into devices that measure the target signal through deformation of the device and devices that measure the target signal regardless of deformation of the device. In the case where the two-dimensional film-type electronic device measures a target signal regardless of deformation of the device, there may be a temperature, illuminance, chemical sensor, etc. For example, the temperature sensor can measure temperature by using the phenomenon that the electrical conductivity of a two-dimensional film-type electronic device of a material changes as the temperature increases.

In addition, when the two-dimensional film-type electronic device is a device that measures a target signal through deformation of the device, the physical shape of the electronic device is determined by the target signal (e.g., pressure, force, speed, acceleration, flow rate, vibration, etc.). This change allows the target signal to be measured in the form of resistance, current, voltage, capacitor, impedance, etc.

In this regard, the signal may be generated not only by the object that the electronic device is intended to measure, but also by changes that occur in the surrounding environment of the electronic device. In general, the signal generated by a change in the surrounding environment may be smaller than the signal generated by the object that the electronic device is intended to measure, but the internal structure of the electronic device changes due to the environmental change, resulting in an incorrect signal from the electronic device. It can happen. In order to prevent this problem, the present invention adjusts the angle between the two-dimensional film-type electronic device and the object to be inspected.

The resistance of the two-dimensional film-type electronic device changes depending on the measurement object (e.g., tension, compression, bending, temperature, speed, flow rate, etc.), and as the resistance changes, the current flowing in the two-dimensional film-type electronic device changes. Since the intensity of the signal becomes weaker or stronger as it changes, the intensity of the signal generated from the two-dimensional film-type electronic device is determined by the resistance of the two-dimensional film-type electronic device or the signal measurement unit or the intensity of the current flowing in the signal measurement unit. can be expressed.

According to one embodiment of the present application, the two-dimensional film-type electronic device may be a transistor or a two-dimensional thin film, but is not limited thereto.

When the two-dimensional film-type electronic device includes an electrode, such as a transistor, a change in current flowing through a signal measuring unit including the two-dimensional film can be measured. On the other hand, when the two-dimensional film-type electronic device is a simple two-dimensional thin film. The two-dimensional thin film can be connected to an external power source to measure resistance or current strength.

In addition, the second aspect of the present application includes a two-dimensional film-type electronic device so as to form a predetermined angle with the object to be inspected, and the two-dimensional film-type electronic device is configured to detect a change in signal intensity due to dynamic noise applied to the object to be inspected. A dynamic noise minimization system is provided, which is arranged to form a predetermined angle with the object to be measured and analyzes electronic signals generated from the two-dimensional film-type electronic device.

Regarding the dynamic noise minimization system according to the second aspect of the present application, detailed description of parts overlapping with the first aspect of the present application has been omitted. However, even if the description is omitted, the content described in the first aspect of the present application is the same as the second aspect of the present application. The same can be applied to the side.

According to one embodiment of the present application, the dynamic noise minimization system may be applied to a device selected from the group consisting of a pressure sensor, a speed sensor, an acceleration sensor, a vibration sensor, a heat sensor, a flow rate sensor, a resistor, a capacitor, a transistor, and combinations thereof. However, it is not limited to this.

Additionally, the dynamic noise minimization system can monitor biological signals such as brain waves, electrocardiogram, pulse, and respiration, but is not limited thereto.

As described above, the dynamic noise may include force, temperature, speed, flow rate, etc. that change the shape of the electronic device, and the two-dimensional film-type electronic device is connected to the object to be measured to minimize the influence of the dynamic noise. It is arranged to form a predetermined angle.

The present invention will be described in more detail through the following examples. However, the following examples are for illustrative purposes only and are not intended to limit the scope of the present application.

[Example 1]

[Example 1-1]: Manufacturing of two-dimensional film-type electronic device

PUA was applied on PET with a thickness of 6 μm, and the PUA was cured. Next, Pt with a thickness of 20 nm was deposited on the PUA using a shadow mask, a crack was formed on the Pt through banding, alignment was performed using a shadow mask, and a Cr-Au electrode was deposited.

[Example 1-2]: Arrangement of two-dimensional film-type electronic device

The two-dimensional film-type electronic device of Example 1-1 was placed on the object to be tested. Then, while adjusting the angle between the test object and the two-dimensional film-type electronic device, the test object or the two-dimensional film-type electronic device is simultaneously compressed, stretched, or bent, and the intensity of the signal generated from the two-dimensional film-type electronic device is adjusted. etc. were analyzed.

[Experimental Example 1]

Compression or tension was applied to the two-dimensional film-type electronic device according to Example 1, and the intensity of the generated signal was analyzed.

FIG. 6 is a graph showing the relationship between the arrangement angle of a two-dimensional film-type electronic device and noise generated by tension according to an embodiment of the present application, and FIG. 7 is a graph showing a two-dimensional film-type electronic device according to an embodiment of the present application. It is a graph showing the relationship between the arrangement angle of and noise generated by compression, and FIG. 8 is a graph showing the relationship between the angle and the degree of structural change of a two-dimensional film-type electronic device according to an embodiment of the present application. Specifically, FIG. 8 is a graph when compression and tension are simultaneously applied to the two-dimensional film-type electronic device.

Referring to FIG. 6, the closer the angle between the two-dimensional film-type electronic device and the object to be inspected, the greater the resistance, and the closer the angle is to 70°, the smaller the resistance. This is because the two-dimensional film-type electronic device is deformed in shape by tension, so the resistance changes. When the angle between the two-dimensional film-type electronic device and the object is 0°, the two-dimensional film-type electronic device It can be difficult to measure tension through

Also, referring to FIG. 7, the closer the angle between the two-dimensional film-type electronic device and the object to be tested is to 90°, the greater the resistance is, and the closer it is to 30°, the smaller the resistance is. This is because the two-dimensional film-type electronic device is deformed in shape by compression, so the resistance changes. When the angle between the two-dimensional film-type electronic device and the object is 90°, the two-dimensional film-type electronic device Compression can be difficult to measure through

Buckling phenomenon when tension is applied when the angle between the two-dimensional film-type electronic device and the object to be inspected is 80° or more, or compression is applied when the angle between the two-dimensional film-type electronic device and the object to be inspected is 20° or less. This may cause the two-dimensional electronic device to be damaged and no strain to occur.

Referring to FIG. 8, when the angle between the two-dimensional film-type electronic device and the object to be tested is small, the stress (crack stress) applied to the two-dimensional film-type electronic device is small, but the deformation of the two-dimensional film-type electronic device ( Crack Gap) can be large. As the angle increases, stress increases and deformation decreases. In theory, it is about 55°, where the influence of both deformation and stress is minimal. However, in reality, problems such as bending of the two-dimensional film-type electronic device may occur due to the compression and tension, so the effects of both strain and stress can be minimized at about 70°.

[Experimental Example 2]

The two-dimensional film-type electronic device according to Example 1 was bent, and the intensity of the generated signal was analyzed.

FIG. 9 is a graph showing the relationship between noise generated by bending and an arrangement angle of a two-dimensional film-type electronic device according to an embodiment of the present application. Specifically, the left side of Figure 9 represents sensitivity to tension and compression, and the right side represents sensitivity to bending.

Referring to FIG. 9, it can be seen that as the arrangement angle of the two-dimensional film-type electronic device approaches 90°, the influence of bending decreases.

[Experimental Example 3]

Figure 10 is a graph expressing the sensitivity to noise by angle of a two-dimensional film-type electronic device according to an embodiment of the present application.

Referring to FIG. 10, it can be seen that as the arrangement angle of the two-dimensional film-type electronic device increases, sensitivity due to tension and bending decreases, but sensitivity due to compression increases. Accordingly, the angle between the two-dimensional film-type electronic device and the object to be tested may be 50° to 60°, where the effects of compression and tension are similar.

[Experimental Example 4]

11 and 12 (a) is a diagram showing noise applied to a two-dimensional film-type electronic device according to an embodiment of the present application, and (b) is a diagram showing noise applied to a two-dimensional film-type electronic device according to an embodiment of the present application This is a graph showing the relationship between generated signals. Specifically, the left side of FIG. 11 (a) shows the object being stretched when the angle between the object and the two-dimensional film-type electronic device is 0° (corresponding to 0° in FIG. 11 (b)), and the right side of FIG. The object is stretched when the angle between the object and the two-dimensional film-type electronic device is 57° (corresponding to 57° in (b) of FIG. 11), and the left side of (a) of FIG. 12 is between the object and the test object. The object to be tested is bent when the angle between the two-dimensional film-type electronic device is 0° (corresponding to 0° in (b) of FIG. 12), and on the right, the angle between the test object and the two-dimensional film-type electronic device is 57 degrees. When °, the object is bent (corresponding to 57° in (b) of Figure 12).

Referring to Figures 11 and 12, it can be seen that when the angle between the test object and the two-dimensional film-type electronic device is 0°, the error between the theoretical value (expectation, dotted line) and the measured value (solid line) is very large. . However, it can be seen that when the angle between the test object and the two-dimensional film-type electronic device is 57°, the error between the theoretical value and the measured value is reduced.

The description of the present application described above is for illustrative purposes, and those skilled in the art will understand that the present application can be easily modified into other specific forms without changing its technical idea or essential features. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive. For example, each component described as unitary may be implemented in a distributed manner, and similarly, components described as distributed may also be implemented in a combined form.

The scope of the present application is indicated by the claims described below rather than the detailed description above, and all changes or modified forms derived from the meaning and scope of the claims and their equivalent concepts should be construed as being included in the scope of the present application.

Claims (11)

In a method of placing a two-dimensional film-type electronic device on an object to be inspected,
The electronic device includes a substrate and a signal measurement unit formed on the substrate,
The electronic device is disposed on one side of the test object, and one side of the test object and one side of the electronic device form a predetermined angle,
The predetermined angle is an angle at which the stress acting on the electronic device in the horizontal direction is 0,
Method for placing two-dimensional film-type electronic devices.
According to claim 1,
The predetermined angle is determined according to the angle θ calculated according to Equation 1 below,
How to place two-dimensional film-type electronic devices:
[Equation 1]

(In Equation 1, ν means Poisson's ratio of the substrate).
According to claim 2,
A method of arranging a two-dimensional film-type electronic device, wherein the predetermined angle is 80% to 120% of the angle θ.
According to claim 2,
A method of arranging a two-dimensional film-type electronic device, wherein the Poisson's ratio of the substrate is greater than 0 and less than or equal to 0.5.
According to claim 1,
The two-dimensional film-type electronic device is disposed on the object to be measured at a predetermined angle to minimize the change in signal intensity due to dynamic noise applied to the object. How to place elements.
According to claim 1,
The stress applied to the electronic device includes a stress selected from the group consisting of tensile stress, compressive stress, bending stress, shear stress, torsional stress, and combinations thereof. How to place elements.
According to claim 1,
Wherein the signal measuring unit includes a two-dimensional film selected from the group consisting of graphene, transition metal chalcogenide, black phosphorus, h-BN, and combinations thereof.
According to claim 1,
The substrate includes PET (Polyethylene terephthalate), PE (Polyethylene), PUA (polyurethaneacrylate), PA (Polyamide), PP (Polypropylene), PBT (Polybutylene terephthalate), PTT (polytrimethylene terephthalate), PI (Polyimide), PU (poly urethane) ), PVDF (Polyvinylidene fluoride), PDMS (Polydimethylsiloxane), PB (Polybutadiene), PUA (polyurethane-acrylate), SBR (Styrene Butadiene Rubber), PVDF-TrFE (Polyvinylidene fluoride-trifluoroethylene), and combinations thereof. A method of placing a two-dimensional film-type electronic device, comprising the selected:
According to claim 1,
A method of placing a two-dimensional film-type electronic device, wherein the object includes one selected from the group consisting of skin, artificial skin, and combinations thereof.
It includes a two-dimensional film-type electronic element so as to form a predetermined angle with the object to be inspected,
The two-dimensional film-type electronic device is disposed on one side of the test object to minimize changes in signal intensity due to dynamic noise applied to the test object, and one side of the test object and the two-dimensional film-type electronic device are One side forms a predetermined angle,
Analyzing the electronic signal generated from the two-dimensional film-type electronic device,
Dynamic noise minimization system.
According to claim 10,
The dynamic noise minimization system is applied to a device selected from the group consisting of a pressure sensor, a speed sensor, an acceleration sensor, a flow sensor, a heat sensor, a vibration sensor, a resistor, a capacitor, a transistor, and combinations thereof. .