KR102528159B1 - Turn-over and transport module of wafer - Google Patents

Turn-over and transport module of wafer Download PDF

Info

Publication number
KR102528159B1
KR102528159B1 KR1020210077573A KR20210077573A KR102528159B1 KR 102528159 B1 KR102528159 B1 KR 102528159B1 KR 1020210077573 A KR1020210077573 A KR 1020210077573A KR 20210077573 A KR20210077573 A KR 20210077573A KR 102528159 B1 KR102528159 B1 KR 102528159B1
Authority
KR
South Korea
Prior art keywords
arm
wafer
rail beam
outside air
rotating member
Prior art date
Application number
KR1020210077573A
Other languages
Korean (ko)
Other versions
KR20220168230A (en
Inventor
박우진
김경원
박다정
최우각
이원구
Original Assignee
(주)대성하이텍
주식회사 테크엑스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)대성하이텍, 주식회사 테크엑스 filed Critical (주)대성하이텍
Priority to KR1020210077573A priority Critical patent/KR102528159B1/en
Publication of KR20220168230A publication Critical patent/KR20220168230A/en
Application granted granted Critical
Publication of KR102528159B1 publication Critical patent/KR102528159B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B25J18/007—Arms the end effector rotating around a fixed point
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

웨이퍼의 반전이송모듈에 대한 발명이 개시된다. 개시된 웨이퍼의 반전이송모듈은: 수직레일빔에 왕복 이동 가능하게 구비되는 수평레일빔, 수평레일빔에 축 방향으로 왕복 이동 가능하게 구비되는 이송체, 및 이송체에 구비되고 웨이퍼를 고정한 채 반전시키는 반전엔드이펙터를 포함하는 것을 특징으로 한다.Disclosed is an invention for a reverse transfer module of a wafer. The disclosed wafer reversing transfer module includes: a horizontal rail beam provided to be reciprocally movable on a vertical rail beam, a transfer member provided to be reciprocally movable in an axial direction on a horizontal rail beam, and a transfer member provided on the transfer member and inverting the wafer while fixing it It is characterized in that it includes an inverted end effector.

Description

웨이퍼의 반전이송모듈{TURN-OVER AND TRANSPORT MODULE OF WAFER}Wafer reverse transfer module {TURN-OVER AND TRANSPORT MODULE OF WAFER}

본 발명은 웨이퍼의 반전이송모듈에 관한 것으로서, 더욱 상세하게는 웨이퍼의 반전이송모듈로써 반전엔드이펙터를 구비하여 웨이퍼를 흡착하여 고정한 채 뒤집기 허용하는 웨이퍼의 반전이송모듈에 관한 것이다.The present invention relates to a wafer reversing transfer module, and more particularly, to a wafer reversing transfer module having an inverting end effector as a wafer reversing transfer module and allowing flipping while adsorbing and fixing a wafer.

반도체 웨이퍼는 웨이퍼에 전기적인 특성을 형성하는 증착 공정, 웨이퍼에 미세한 회로 패턴을 형성하는 노광 공정, 형성된 회로 패턴을 제외한 나머지 부분을 제거하는 식각 공정 및 제거된 부분을 씻어 내는 세정 공정 등을 거치며 가공된다.Semiconductor wafers are processed through a deposition process to form electrical characteristics on the wafer, an exposure process to form fine circuit patterns on the wafer, an etching process to remove the remaining parts except for the formed circuit patterns, and a cleaning process to wash the removed parts. do.

이러한 웨이퍼 가공 공정은 여러 반도체 장비가 연결되어 일련의 단계로 진행된다. 각 단계의 웨이퍼 공정라인은 복수 개의 장비가 하나로 연결되어 작동하며 가공된 웨이퍼를 다음 단계의 공정으로 자동 이동시킨다.This wafer processing process proceeds in a series of steps by connecting several semiconductor equipment. The wafer processing line at each stage operates by connecting multiple equipment as one, and automatically moves the processed wafer to the next stage of processing.

통상, 각 단계의 공정라인은 복수 개의 웨이퍼가 담긴 풉(FOUP;Front Opening Unified Pod)을 이송하는 이송용 로봇, 풉을 고정한 후 풉의 커버를 여는 로드포트모듈(LPM;Load Port Module), 풉에서 복수 개의 웨이퍼를 순차적으로 빼내어 로드락 챔버(Loadlock Chamber)로 이송시키는 이에프이엠(EFEM;Equipment Front End Module) 및 로드락 챔버로부터 웨이퍼를 이송하여 프로세스 챔버(Process Chamber)로 이송하는 트랜스퍼모듈 챔버(Transfer Module Chamber)가 연결된 구조이다.Normally, the process line at each stage includes a transfer robot that transports a FOUP (Front Opening Unified Pod) containing multiple wafers, a Load Port Module (LPM) that opens the cover of the FOUP after fixing the FOUP, and a FOUP. EFEM (Equipment Front End Module) that sequentially takes out a plurality of wafers from the loadlock chamber and transfers them to the loadlock chamber, and transfer module chamber that transfers wafers from the loadlock chamber to the process chamber (process chamber) Transfer Module Chamber) is connected.

관련기술로는 대한민국 등록특허공보 제10-1776166호에 제안된 바 있다.As a related technology, Korean Patent Registration No. 10-1776166 has been proposed.

상기한 기술구성은 본 발명의 이해를 돕기 위한 배경기술로서, 본 발명이 속하는 기술 분야에서 널리 알려진 종래기술을 의미하는 것은 아니다.The above technical configuration is a background art for helping understanding of the present invention, and does not mean the prior art widely known in the technical field to which the present invention belongs.

기존 웨이퍼의 처리장치는 엘피엠과 이에프이엠, 로드락 챔버, 트랜스퍼모듈 챔버가 결합되어 있는 구성으로써, 각 구성들이 차지하는 설치면적이 과다하여 한정된 공간에 다수의 공정라인 설비를 설치하기 어려운 문제점 있다. 따라서, 웨이퍼가 이에프이엠 내부에서 검사공정이 실시되기 어려운 문제점이 있다.Existing wafer processing devices have a configuration in which LPM, EPM, load lock chamber, and transfer module chamber are combined, and the installation area occupied by each component is excessive, making it difficult to install multiple process line facilities in a limited space. Therefore, there is a problem in that it is difficult for the wafer to be inspected inside the EFM.

따라서, 이를 개선할 필요성이 요청된다.Therefore, there is a need to improve this.

본 발명은 상기와 같은 문제점들을 개선하기 위하여 안출된 것으로서, 웨이퍼의 반전이송모듈로써 반전엔드이펙터를 구비하여 웨이퍼를 흡착하여 고정한 채 뒤집기 허용하여, 별도로 웨이퍼를 검사하는 장비를 구비하지 않도록 하는 웨이퍼의 반전이송모듈을 제공하는데 그 목적이 있다.The present invention has been made to improve the above problems, and is provided with an inversion end effector as a reverse transfer module of the wafer to adsorb the wafer and allow it to be reversed while fixing, so as not to have a separate wafer inspection equipment. Its purpose is to provide a reverse transfer module.

본 발명에 따른 웨이퍼의 반전이송모듈은: 수직레일빔; 상기 수직레일빔에 왕복 이동 가능하게 구비되는 수평레일빔; 상기 수평레일빔에 축 방향으로 왕복 이동 가능하게 구비되는 이송체; 및 상기 이송체에 구비되고, 상기 웨이퍼를 고정한 채 반전시키는 반전엔드이펙터를 포함한다.The reverse transfer module of the wafer according to the present invention includes: a vertical rail beam; a horizontal rail beam provided to be reciprocally movable to the vertical rail beam; a conveying member provided to be reciprocally movable in an axial direction on the horizontal rail beam; and an inversion end effector provided on the transfer member and inverting the wafer while fixing it.

상기 수직레일빔은 거치브라켓을 축 방향을 따라 왕복 이동 가능하게 구비하고, 상기 수평레일빔은 상기 거치브라켓에 고정 설치되는 것을 특징으로 한다.The vertical rail beam is provided with a mounting bracket capable of reciprocating along an axial direction, and the horizontal rail beam is characterized in that it is fixed to the mounting bracket.

상기 반전엔드이펙터는, 상기 이송체에 고정되고, 구동부를 구비하는 고정부재; 상기 구동부의 구동력을 전달받아 양방향 회전되는 회전부재; 상기 회전부재에 고정되게 연결되는 제 1암; 상기 웨이퍼를 안착하도록 흡착패드를 구비하는 제 2암; 및 상기 제 1암과 상기 제 2암의 동일측에 포개진 채, 상기 제 1암과 상기 제 2암을 고정 연결하는 연결브라켓을 포함한다.The reversal end effector may include a fixing member fixed to the conveying member and having a driving unit; a rotating member that rotates in both directions by receiving the driving force of the driving unit; a first arm fixedly connected to the rotating member; a second arm having a suction pad to seat the wafer; and a connection bracket for fixing and connecting the first arm and the second arm while being overlapped on the same side of the first arm and the second arm.

상기 회전부재와 제 1암은 서로 연결되어 외기의 유동을 허용하는 전방통로를 형성하고, 상기 회전부재는 상기 전방통로와 연결되도록 둘레면에 외기토출구를 형성하며, 상기 외기토출구를 통해 토출된 외기가 설정 위치로 배기 유동될 수 있도록 상기 회전부재의 주변부를 밀봉하는 밀폐케이싱을 구비하는 것을 특징으로 한다. The rotating member and the first arm are connected to each other to form a front passage allowing the flow of outside air, and the rotating member forms an outside air outlet on a circumferential surface so as to be connected to the front passage, and the outside air is discharged through the outside air outlet. It is characterized in that it is provided with a sealed casing for sealing the periphery of the rotary member so that the exhaust flow to the set position.

상기 제 2암은 상기 흡착패드로부터 유입되는 외기의 유동을 허용하는 후방통로를 형성하며, 상기 제 1암의 전방통로와 상기 제 2암의 후방통로는 에어튜브로 연결되는 것을 특징으로 한다.The second arm forms a rear passage allowing the flow of outside air introduced from the suction pad, and the front passage of the first arm and the rear passage of the second arm are connected by an air tube.

이상에서 설명한 바와 같이, 본 발명에 따른 웨이퍼의 반전이송모듈은 종래 기술과 달리 웨이퍼의 반전이송모듈로써 반전엔드이펙터를 구비하여 웨이퍼를 흡착하여 고정한 채 뒤집기 허용하여, 별도로 웨이퍼를 검사하는 장비를 구비하지 않아도 됨에 따라 설치비용을 줄일 수 있다.As described above, the wafer reverse transfer module according to the present invention, unlike the prior art, is equipped with an inverted end effector as a wafer reverse transfer module to allow the wafer to be flipped while adsorbed and fixed, and is provided with equipment for inspecting the wafer separately. Installation cost can be reduced by not having to do it.

도 1은 본 발명의 일 실시예에 따른 이에프이엠의 내부 구성도이다.
도 2는 본 발명의 일 실시예에 따른 이에프이엠의 내부 측면도이다.
도 3은 본 발명의 일 실시예에 따른 이에프이엠의 반전이송모듈의 사시도이다.
도 4는 본 발명의 일 실시예에 따른 반전이송모듈의 측면도이다.
도 5는 본 발명의 일 실시예에 따른 반전이송모듈의 분해 사시도이다.
도 6은 본 발명의 일 실시예에 따른 이동모듈의 요부 확대 사시도이다.
도 7은 본 발명의 일 실시예에 따른 이동모듈의 요부 확대 저면 사시도이다.
도 8은 본 발명의 일 실시예에 따른 반전이송모듈의 단면도이다.
도 9는 본 발명의 일 실시예에 따른 반전이송모듈의 반전 작동 상태도이다.1 is an internal configuration diagram of an EFM according to an embodiment of the present invention.
2 is an internal side view of an EFM according to an embodiment of the present invention.
3 is a perspective view of a reverse transfer module of EFM according to an embodiment of the present invention.
4 is a side view of a reverse transfer module according to an embodiment of the present invention.
5 is an exploded perspective view of a reverse transfer module according to an embodiment of the present invention.
6 is an enlarged perspective view of a main part of a moving module according to an embodiment of the present invention.
7 is an enlarged bottom perspective view of a main part of a moving module according to an embodiment of the present invention.
8 is a cross-sectional view of a reverse transfer module according to an embodiment of the present invention.
9 is a reverse operation state diagram of a reverse transfer module according to an embodiment of the present invention.

이하, 첨부된 도면들을 참조하여 본 발명에 따른 웨이퍼의 반전이송모듈의 실시예를 설명한다. 이 과정에서 도면에 도시된 선들의 두께나 구성요소의 크기 등은 설명의 명료성과 편의상 과장되게 도시되어 있을 수 있다. 또한, 후술되는 용어들은 본 발명에서의 기능을 고려하여 정의된 용어들로서 이는 사용자, 운용자의 의도 또는 관례에 따라 달라질 수 있다. 그러므로 이러한 용어들에 대한 정의는 본 명세서 전반에 걸친 내용을 토대로 내려져야 할 것이다.Hereinafter, an embodiment of a wafer reverse transfer module according to the present invention will be described with reference to the accompanying drawings. In this process, the thickness of lines or the size of components shown in the drawings may be exaggerated for clarity and convenience of explanation. In addition, terms to be described later are terms defined in consideration of functions in the present invention, which may vary according to the intention or custom of a user or operator. Therefore, definitions of these terms will have to be made based on the content throughout this specification.

도 1은 본 발명의 일 실시예에 따른 이에프이엠의 내부 구성도이고, 도 2는 본 발명의 일 실시예에 따른 이에프이엠의 내부 측면도이다.1 is an internal configuration diagram of an EFM according to an embodiment of the present invention, and FIG. 2 is an internal side view of an EFM according to an embodiment of the present invention.

도 3은 본 발명의 일 실시예에 따른 이에프이엠의 반전이송모듈의 사시도이고, 도 4는 본 발명의 일 실시예에 따른 반전이송모듈의 측면도이다.3 is a perspective view of a reverse transfer module of EFM according to an embodiment of the present invention, and FIG. 4 is a side view of the reverse transfer module according to an embodiment of the present invention.

도 5는 본 발명의 일 실시예에 따른 반전이송모듈의 분해 사시도이고, 도 6은 본 발명의 일 실시예에 따른 이동모듈의 요부 확대 사시도이며, 도 7은 본 발명의 일 실시예에 따른 이동모듈의 요부 확대 저면 사시도이다.5 is an exploded perspective view of a reverse transfer module according to an embodiment of the present invention, Figure 6 is an enlarged perspective view of a main part of a movement module according to an embodiment of the present invention, Figure 7 is a movement according to an embodiment of the present invention It is an enlarged bottom perspective view of the main part of the module.

도 8은 본 발명의 일 실시예에 따른 반전이송모듈의 단면도이고, 도 9는 본 발명의 일 실시예에 따른 반전이송모듈의 반전 작동 상태도이다.8 is a cross-sectional view of a reverse transfer module according to an embodiment of the present invention, and FIG. 9 is a reverse operation state diagram of the reverse transfer module according to an embodiment of the present invention.

도 1 내지 도 9를 참조하면, 본 발명의 일 실시예에 따른 웨이퍼(30)의 반전이송모듈(200)은 수직레일빔(210), 수평레일빔(220), 이송체(230) 및 반전엔드이펙터(240)를 포함한다.1 to 9, the reverse transfer module 200 of the wafer 30 according to an embodiment of the present invention includes a vertical rail beam 210, a horizontal rail beam 220, a transfer member 230, and an inversion It includes an end effector 240.

특히, 본 발명에 따른 반전이송모듈(200)은 이에프이엠(EFEM:Equipment Front End Module,100)의 본체(110) 내부에 구비된다.In particular, the inversion transfer module 200 according to the present invention is provided inside the main body 110 of an Equipment Front End Module (EFEM) 100.

이때, 이에프이엠(100)은 반도체용 웨이퍼(30)의 처리 장치 중 풉(FOUP;Front Opening Unified Pod,20)을 갖는 엘피엠(LPM;Load Port Module,10)을 일측에 구비한다. At this time, the EFM 100 includes a Load Port Module (LPM) 10 having a Front Opening Unified Pod (FOUP) 20 among semiconductor wafer 30 processing devices on one side.

본체(110)는 이에프이엠(100)의 외형을 형성한다. 그리고, 본체(110)는 웨이퍼(30)를 보관하는 풉(20)을 일측에 연결되게 구비한다.The main body 110 forms the outer shape of the EFM 100 . In addition, the main body 110 is provided with a FOUP 20 for storing the wafer 30 connected to one side.

물론, 본체(110)는 다양한 형상 및 다양한 재질로 적용 가능하다.Of course, the main body 110 can be applied in various shapes and materials.

또한, 반전이송모듈(200)은 본체(110)의 내부에 구비되고, 놓인 웨이퍼(30)를 초기 상태 또는 뒤집은 반전한 상태로 풉(20) 내부의 설정 위치로 이송하는 역할을 한다.In addition, the reverse transfer module 200 is provided inside the main body 110 and serves to transfer the placed wafer 30 to a set position inside the foo 20 in an initial state or an inverted state.

특히, 반전이송모듈(200)은 본체(110) 내부에서 웨이퍼(30)를 초기 상태와 뒤집은 상태로 불량 여부 등을 검사하고 나서, 해당 웨이퍼(30)를 풉(20) 내부의 설정 위치로 이송한다.In particular, the reverse transfer module 200 inspects the wafer 30 in the initial state and inverted state inside the main body 110 for defects, etc., and then transfers the wafer 30 to the set position inside the pool 20 do.

상세히, 수직레일빔(210)은 본체(110)의 내부에 구비되고, 본체(110)의 축 방향(높이 방향)으로 세워진 상태를 유지한다. 수직레일빔(210)은 다양한 형상으로 적용 가능하고, 다양한 방식으로 본체(110)에 고정 설치된다.In detail, the vertical rail beam 210 is provided inside the main body 110, and maintains a state erected in the axial direction (height direction) of the main body 110. The vertical rail beam 210 can be applied in various shapes and is fixed to the main body 110 in various ways.

수평레일빔(220)은 수직레일빔(210)의 축 방향(높이 방향)을 따라, 수직레일빔(210)에 왕복 이동 가능하게 구비된다. The horizontal rail beam 220 is provided to be reciprocally movable to the vertical rail beam 210 along the axial direction (height direction) of the vertical rail beam 210 .

이때, 수평레일빔(220)은 전기력 등 외력에 의해 수직레일빔(210)을 따라 자동적으로 왕복 이동되도록 제어된다.At this time, the horizontal rail beam 220 is controlled to automatically reciprocate along the vertical rail beam 210 by an external force such as electric power.

특히, 수직레일빔(210)은 거치브라켓(212)을 축 방향을 따라 왕복 이동 가능하게 구비하고, 수평레일빔(220)은 거치브라켓(212)에 고정 설치되는 것으로 한다. 따라서, 수평레일빔(220)은 거치브라켓(212)과 함께 수직레일빔(210)을 따라 왕복 이동된다.In particular, the vertical rail beam 210 is provided with a mounting bracket 212 capable of reciprocating along the axial direction, and the horizontal rail beam 220 is fixed to the mounting bracket 212. Accordingly, the horizontal rail beam 220 is reciprocally moved along the vertical rail beam 210 together with the mounting bracket 212 .

수평레일빔(220)이 거치브라켓(212)에 분리 가능하게 결합됨으로써, 수평레일빔(220)의 유지 보수작업이 용이하다.Since the horizontal rail beam 220 is detachably coupled to the mounting bracket 212, the maintenance work of the horizontal rail beam 220 is easy.

그리고, 이송체(230)는 수평레일빔(220)에 축 방향으로 왕복 이동 가능하게 구비된다. 이때, 이송체(230)는 전기력 등 외력에 의해 자동적으로 수평레일빔(220)을 따라 왕복 이동하게 된다. 물론, 이송체(230)는 다양한 형상으로 적용 가능하다.In addition, the conveying member 230 is provided to be reciprocally movable in the axial direction on the horizontal rail beam 220. At this time, the conveying member 230 automatically reciprocates along the horizontal rail beam 220 by an external force such as electric force. Of course, the conveying body 230 can be applied in various shapes.

이에 따라, 이송체(230)가 상하 및 전후 방향으로 이동되며, 웨이퍼(30)를 풉(20) 내부로 반송 또는 풉(20) 내부의 웨이퍼(30)를 인출할 수 있도록 움직이게 된다.Accordingly, the transfer member 230 is moved in the up-down and forward-rear directions, and is moved to transport the wafer 30 into the foop 20 or to take out the wafer 30 inside the foop 20 .

한편, 반전엔드이펙터(240)는 이송체(230)에 연결되어 웨이퍼(30)를 직접적으로 풉(20) 내부로 반송 또는 풉(20) 내부의 웨이퍼(30)를 인출하는 역할을 한다.Meanwhile, the inversion end effector 240 is connected to the transfer member 230 and serves to directly transfer the wafer 30 into the foop 20 or to take out the wafer 30 from the inside of the foop 20 .

아울러, 반전엔드이펙터(240)는 본체(110) 내부에서 웨이퍼(30)를 고정한 채 반전시키고, 웨이퍼(30)를 정위치 또는 뒤집어 역위치로 반전한 후, 풉(20)으로 반송하는 역할을 한다.In addition, the inversion end effector 240 reverses the wafer 30 while fixing it inside the main body 110, reverses the wafer 30 to its normal position or reverses it, and then transfers it to the foo 20. do.

이를 위해, 반전엔드이펙터(240)는 고정부재(241), 회전부재(242), 제 1암(243), 제 2암(244) 및 연결브라켓(245)을 포함한다.To this end, the inverted end effector 240 includes a fixing member 241, a rotating member 242, a first arm 243, a second arm 244, and a connecting bracket 245.

고정부재(241)는 이송체(230)에 고정된다. 그리고, 고정부재(241)는 스텝모터 등 구동부(246)를 구비한다. 고정부재(241)는 다양한 형상으로 적용 가능하고, 이송체(230)에 고정되는 구성에 한정하지 않는다.The fixing member 241 is fixed to the conveying member 230 . In addition, the fixing member 241 includes a driving unit 246 such as a stepper motor. The fixing member 241 can be applied in various shapes, and is not limited to a configuration fixed to the conveying member 230 .

회전부재(242)는 고정부재(241)에 연결되고, 구동부(246)의 구동력을 전달받아 양방향 회전된다. 물론, 회전부재(242)는 다양한 형상으로 적용 가능하다.The rotating member 242 is connected to the fixing member 241 and rotates in both directions by receiving the driving force of the driving unit 246 . Of course, the rotating member 242 can be applied in various shapes.

아울러, 제 1암(arm,243)은 회전부재(242)에 고정 연결된다. 그래서, 제 1암(243)은 회전부재(242)와 동일방향으로 함께 회전된다. 제 1암(243)은 다양한 형상으로 적용 가능하다.In addition, the first arm (arm, 243) is fixedly connected to the rotating member (242). Thus, the first arm 243 is rotated together with the rotating member 242 in the same direction. The first arm 243 can be applied in various shapes.

그리고, 제 2암(244)은 제 1암(243)과 이격되고, 웨이퍼(30)를 일측이 안착하도록 흡착패드(247)를 구비한다. 흡착패드(247)는 복수 개가 구비된다. 제 2암(244)은 하중을 줄이도록 다양한 형상으로 적용 가능하다. 물론, 제 1암(243)과 제 2암(244)은 대향하는 테두리끼리 근접되게 배치될 수도 있다.Also, the second arm 244 is spaced apart from the first arm 243 and includes a suction pad 247 so that one side of the wafer 30 is seated thereon. A plurality of suction pads 247 are provided. The second arm 244 can be applied in various shapes to reduce the load. Of course, the first arm 243 and the second arm 244 may be disposed close to each other with opposing edges.

또한, 연결브라켓(245)은 제 1암(243)과 제 2암(244)의 동일측에 포개진 채, 제 1암(243)과 제 2암(244)을 볼팅 등에 의해 고정 연결한다.In addition, the connection bracket 245 fixes and connects the first arm 243 and the second arm 244 by bolting or the like while being overlapped on the same side of the first arm 243 and the second arm 244 .

이때, 제 1암(243)과 제 2암(244)은 동일 평면상에 배치된 채 연결브라켓(245)에 의해 상호 구속될 수 있다.At this time, the first arm 243 and the second arm 244 may be mutually constrained by the connection bracket 245 while being disposed on the same plane.

따라서, 반전엔드이펙터(240)가 연결브라켓(245)에 의해 연결되는 제 1암(243)과 제 2암(244)으로 나뉘어짐에 따라 부분적 교체가 가능하여 유지보수비용이 절감된다.Accordingly, as the inverted end effector 240 is divided into the first arm 243 and the second arm 244 connected by the connection bracket 245, partial replacement is possible, thereby reducing maintenance costs.

한편, 본체(110) 내부에서, 웨이퍼(30)는 정위치와 뒤집힌 역위치가 되도록, 제 1암(243)과 제 2암(244)은 정해진 회전각도 범위 내에서 양방향 회전된다. 아울러, 흡착패드(247)는 외부에서 외기를 흡입함으로써, 제 2암(244)의 흡착패드(247)에 놓인 웨이퍼는 정위치 및 역위치에서 고정된다.Meanwhile, inside the main body 110, the first arm 243 and the second arm 244 are rotated in both directions within a predetermined rotation angle range so that the wafer 30 is in a normal position and an inverted reverse position. In addition, the suction pad 247 sucks air from the outside, so that the wafer placed on the suction pad 247 of the second arm 244 is fixed in the normal and reverse positions.

이를 위해, 회전부재(242) 및 제 1암(243)은 서로 연결되어 외기의 유동을 허용하는 전방통로(252)를 일치되는 중심축 상에 형성한다.To this end, the rotating member 242 and the first arm 243 are connected to each other to form a front passage 252 that allows the flow of outside air on the central axis.

그리고, 제 2암(244)은 흡착패드(247)로부터 유입되는 외기의 유동을 허용하는 후방통로(254)를 중심축 상에 형성한다. 즉, 후방통로(254)는 제 2암(244)의 일단에서 각 흡착패드(247)까지 형성된다.And, the second arm 244 forms a rear passage 254 on the central axis allowing the flow of outside air introduced from the suction pad 247 . That is, the rear passage 254 is formed from one end of the second arm 244 to each suction pad 247 .

아울러, 제 1암(243)과 제 2암(244)이 이격된 상태에서, 제 1암(243)의 전방통로(252)와 제 2암(244)의 후방통로(254)는 에어튜브(256)로 연결된다.In addition, in a state where the first arm 243 and the second arm 244 are spaced apart, the front passage 252 of the first arm 243 and the rear passage 254 of the second arm 244 are air tubes ( 256) is connected.

특히, 회전부재(242)는 전방통로(252)와 연결되도록 둘레면에 외기토출구(248)를 형성한다. 이때, 외기토출구(248)는 회전부재(242)의 둘레면에 원주방향을 따라 연속되게 형성된다. In particular, the rotating member 242 forms an outside air outlet 248 on its circumferential surface so as to be connected to the front passage 252 . At this time, the outside air outlet 248 is continuously formed on the circumferential surface of the rotating member 242 along the circumferential direction.

그리고, 회전부재(242)는 외기토출구(248)를 통해 토출된 외기가 설정 위치로 배기 유동될 수 있도록 외기토출구(248)의 주변부를 밀봉하도록 구비된다.And, the rotating member 242 is provided to seal the periphery of the outside air discharge port 248 so that the outside air discharged through the outside air discharge port 248 can be exhausted and flowed to a set position.

즉, 밀폐케이싱(260)은 고정부재(241)에 고정되고, 회전부재(242)의 둘레면을 감싸도록 외기토출구(248)의 주변부를 밀봉한다. 이때, 베어링이 밀폐케이싱(260)과 회전부재(242) 사이에 구비될 수 있다.That is, the sealed casing 260 is fixed to the fixing member 241 and seals the periphery of the outside air outlet 248 so as to surround the circumferential surface of the rotating member 242 . At this time, a bearing may be provided between the sealed casing 260 and the rotating member 242 .

아울러, 밀폐케이싱(260)은 외기토출구(248)의 개방측에 연결되거나 또는 외기토출구(248) 측으로 개방되는 외기토출포트(262)를 구비한다. 그리고, 외기토출포트(262)는 외기토출튜브(264)가 연결되고, 외기토출튜브(264)는 고정부재(241)에 연결된다. In addition, the airtight casing 260 is connected to the open side of the air outlet 248 or has an air discharge port 262 open to the air outlet 248. Also, the outside air discharge port 262 is connected to the outside air discharge tube 264, and the outside air discharge tube 264 is connected to the fixing member 241.

따라서, 전방통로(252), 후방통로(254) 및 에어튜브(256)가 회전부재(242), 제 1암(243) 및 제 2암(244)의 중심축 상에 형성된다. 이로써, 제 1암(243)과 제 2암(244)이 회전부재(242)와 함께 회전되더라도, 에어튜브(256)가 비틀어지거나 간섭이 발생되지 않게 된다.Accordingly, the front passage 252, the rear passage 254 and the air tube 256 are formed on the central axes of the rotating member 242, the first arm 243 and the second arm 244. Thus, even if the first arm 243 and the second arm 244 are rotated together with the rotating member 242, the air tube 256 is not twisted or interfered with.

이때, 도시하지 않았지만, 흡착패드(247)를 통해 외기를 강제 흡입하기 위한 흡입유닛이 외기토출튜브(264)에 연결된다. 이로써, 밀폐케이싱(260)에 의해 밀봉된 회전부재(242)의 둘레면에서, 외기가 외기토출포트(262)를 통해 흡입될 경우, 흡착패드(247)는 접한 웨이퍼(30)를 흡착 고정한다. At this time, although not shown, a suction unit for forcibly sucking in external air through the suction pad 247 is connected to the external air discharge tube 264 . Thus, when outside air is sucked through the outside air discharge port 262 on the circumferential surface of the rotating member 242 sealed by the airtight casing 260, the suction pad 247 adsorbs and fixes the wafer 30 in contact therewith. .

아울러, 회전부재(242) 및 제 1암(243)의 중심축을 잇도록 형성되는 전방통로(252)는 자체적으로 외기의 유동을 안내할 수도 있고, 별도의 튜브를 삽입할 수도 있다.In addition, the front passage 252 formed to connect the central axes of the rotating member 242 and the first arm 243 may guide the flow of outside air by itself or may insert a separate tube.

마찬가지로, 제 2암(244)의 내부에서 복수 개의 흡착패드(247)를 잇는 후방통로(254)는 자체적으로 외기의 유동을 안내할 수도 있고, 별도의 튜브를 삽입할 수도 있다.Similarly, the rear passage 254 connecting the plurality of suction pads 247 inside the second arm 244 may guide the flow of outside air by itself or may insert a separate tube.

그래서, 흡입유닛이 구동시, 웨이퍼(30)는 제 2암(244)의 흡착패드(247)에 흡착되어 고정된다.Thus, when the suction unit is driven, the wafer 30 is adsorbed and fixed to the suction pad 247 of the second arm 244 .

결과적으로, 반전엔드이펙터(240)는 본체(110) 내부에서 수직레일빔(210)에 의해 상하 이동되며 풉(20) 내부로 진입하는 위치가 설정된 후, 제 2암(244)에 놓인 웨이퍼(30)를 검사하고 나서 회전부재(242)에 의해 회전(반전)된 해당 웨이퍼(30)를 검사할 수 있도록 안내한다.As a result, the inversion end effector 240 is moved up and down by the vertical rail beam 210 inside the main body 110, and after the position entering the inside of the foo 20 is set, the wafer placed on the second arm 244 ( 30) is inspected, and then the wafer 30 rotated (inverted) by the rotating member 242 is guided to be inspected.

그리고 나서, 반전엔드이펙터(240)는 수평레일빔(220)에 의해 전진 이동되며 해당 웨이퍼(30)를 풉(20) 내부로 진입한다.Then, the inversion end effector 240 is moved forward by the horizontal rail beam 220 and enters the wafer 30 into the foop 20 .

본 발명은 도면에 도시된 실시예를 참고로 하여 설명되었으나, 이는 예시적인 것에 불과하며, 당해 기술이 속하는 분야에서 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 타 실시예가 가능하다는 점을 이해할 것이다. 따라서 본 발명의 진정한 기술적 보호범위는 아래의 청구범위에 의해서 정하여져야 할 것이다.The present invention has been described with reference to the embodiments shown in the drawings, but this is only exemplary, and those skilled in the art can make various modifications and equivalent other embodiments. will understand Therefore, the true technical protection scope of the present invention should be determined by the claims below.

10: 엘피엠(LPM) 20: 풉(FOUP)
30: 웨이퍼 100: 이에프이엠(EFEM)
110: 본체 200: 반전이송모듈
210: 수직레일빔 212: 거치브라켓
220: 수평레일빔 230: 이송체
240: 반전엔드이펙터 241: 고정부재
242: 회전부재 243: 제 1암
244: 제 2암 245: 연결브라켓
252: 전방통로 254: 후방통로
256: 에어튜브 260: 밀폐케이싱10: LPM 20: FOUP
30: wafer 100: EFEM
110: main body 200: inversion transfer module
210: vertical rail beam 212: mounting bracket
220: horizontal rail beam 230: conveying body
240: inverted end effector 241: fixed member
242: rotating member 243: first arm
244: second arm 245: connection bracket
252: front passage 254: rear passage
256: air tube 260: sealed casing

Claims (4)

수직레일빔; 상기 수직레일빔에 왕복 이동 가능하게 구비되는 수평레일빔; 상기 수평레일빔에 축 방향으로 왕복 이동 가능하게 구비되는 이송체; 및 상기 이송체에 구비되고, 웨이퍼를 고정한 채 반전시키는 반전엔드이펙터를 포함하고,
상기 반전엔드이펙터는, 상기 이송체에 고정되고, 구동부를 구비하는 고정부재; 상기 구동부의 구동력을 전달받아 양방향 회전되는 회전부재; 상기 회전부재에 고정되게 연결되는 제 1암; 상기 웨이퍼를 안착하도록 흡착패드를 구비하는 제 2암; 및 상기 제 1암과 상기 제 2암의 동일측에 포개진 채, 상기 제 1암과 상기 제 2암을 고정 연결하는 연결브라켓을 포함하며,
상기 회전부재와 제 1암은 서로 연결되어 외기의 유동을 허용하는 전방통로를 형성하고, 상기 제 2암은 상기 흡착패드로부터 유입되는 외기의 유동을 허용하는 후방통로를 형성하며,
상기 제 1암과 상기 제 2암은 동일 평면상에 배치된 채 상기 연결브라켓에 분리 가능하게 구속되고,
상기 제 1암의 전방통로와 상기 제 2암의 후방통로는 에어튜브로 연결되어,
상기 전방통로, 상기 후방통로 및 상기 에어튜브가 상기 회전부재, 상기 제 1암 및 상기 제 2암과 동일 중심축 상에 형성됨으로써, 상기 제 1암과 상기 제 2암이 상기 회전부재와 함께 회전시에, 상기 에어튜브가 비틀어지거나 간섭이 발생되는 것이 방지되는 것을 특징으로 하는 웨이퍼의 반전이송모듈.
vertical rail beam; a horizontal rail beam provided to be reciprocally movable to the vertical rail beam; a conveying member provided to be reciprocally movable in an axial direction on the horizontal rail beam; and an inversion end effector provided on the transfer body and inverting the wafer while fixing it,
The reversal end effector may include a fixing member fixed to the conveying member and having a driving unit; a rotating member that rotates in both directions by receiving the driving force of the driving unit; a first arm fixedly connected to the rotating member; a second arm having a suction pad to seat the wafer; And a connection bracket for fixing and connecting the first arm and the second arm while being overlapped on the same side of the first arm and the second arm,
The rotating member and the first arm are connected to each other to form a front passage allowing the flow of outside air, and the second arm forms a rear passage allowing the flow of outside air from the suction pad,
The first arm and the second arm are detachably constrained to the connecting bracket while being disposed on the same plane,
The front passage of the first arm and the rear passage of the second arm are connected by an air tube,
The front passage, the rear passage, and the air tube are formed on the same central axis as the rotation member, the first arm, and the second arm, so that the first arm and the second arm rotate together with the rotation member. At this time, the wafer reverse transfer module, characterized in that the air tube is prevented from being twisted or interference occurs.
 제 1항에 있어서,
상기 수직레일빔은 거치브라켓을 축 방향을 따라 왕복 이동 가능하게 구비하고,
상기 수평레일빔은 상기 거치브라켓에 고정 설치되는 것을 특징으로 하는 웨이퍼의 반전이송모듈.
According to claim 1,
The vertical rail beam is provided with a mounting bracket capable of reciprocating movement along the axial direction,
The horizontal rail beam is a wafer reversal transfer module, characterized in that fixedly installed in the mounting bracket.
 삭제delete 제 1항에 있어서,
상기 회전부재는 상기 전방통로와 연결되도록 둘레면에 외기토출구를 형성하며, 상기 외기토출구를 포함한 상기 회전부재의 주변부를 밀봉하여 설정 위치로 외기를 배기 유도하기 위해 밀폐케이싱을 구비하는 것을 특징으로 하는 웨이퍼의 반전이송모듈.According to claim 1,
The rotating member forms an outside air outlet on the circumferential surface to be connected to the front passage, and has a sealed casing to seal the periphery of the rotating member including the outside air outlet to exhaust the outside air to a set position. Characterized in that Wafer reverse transfer module.
KR1020210077573A 2021-06-15 2021-06-15 Turn-over and transport module of wafer KR102528159B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020210077573A KR102528159B1 (en) 2021-06-15 2021-06-15 Turn-over and transport module of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020210077573A KR102528159B1 (en) 2021-06-15 2021-06-15 Turn-over and transport module of wafer

Publications (2)

Publication Number Publication Date
KR20220168230A KR20220168230A (en) 2022-12-23
KR102528159B1 true KR102528159B1 (en) 2023-05-08

Family

ID=84536329

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020210077573A KR102528159B1 (en) 2021-06-15 2021-06-15 Turn-over and transport module of wafer

Country Status (1)

Country Link
KR (1) KR102528159B1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003527737A (en) * 1998-07-11 2003-09-16 セミトゥール・インコーポレイテッド Robot for handling microelectronic workpieces
JP2004090186A (en) * 2002-09-02 2004-03-25 Aitec Corp Clean transfer robot
JP2018024140A (en) 2016-08-09 2018-02-15 アピックヤマダ株式会社 Resin supply device, press unit and resin molding device
KR101980137B1 (en) * 2018-06-28 2019-05-20 (주)밸류테크 Wafer transfer robot

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090070658A (en) * 2007-12-27 2009-07-01 세메스 주식회사 Robot and method for reversing a substrate, unit for reversing a substrate and apparatus for treating a substrate with the robot

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003527737A (en) * 1998-07-11 2003-09-16 セミトゥール・インコーポレイテッド Robot for handling microelectronic workpieces
JP2004090186A (en) * 2002-09-02 2004-03-25 Aitec Corp Clean transfer robot
JP2018024140A (en) 2016-08-09 2018-02-15 アピックヤマダ株式会社 Resin supply device, press unit and resin molding device
KR101980137B1 (en) * 2018-06-28 2019-05-20 (주)밸류테크 Wafer transfer robot

Also Published As

Publication number Publication date
KR20220168230A (en) 2022-12-23

Similar Documents

Publication Publication Date Title
USRE48792E1 (en) Wafer transfer apparatus and substrate transfer apparatus
TWI475629B (en) Substrate processing apparatus
CN1217386C (en) Blade-type substrate cleaning method and apparatus
CN107564835B (en) Substrate processing apparatus
CN1212646C (en) Vane type substrate cleaning method and its apparatus
US7306002B2 (en) System and method for wet cleaning a semiconductor wafer
KR20090039629A (en) Substrate cleaning apparatus
JP2011517134A (en) Clean transfer robot
TW201338941A (en) Robot arm structure and robot
US6305895B1 (en) Transfer system for vacuum process equipment
KR102528159B1 (en) Turn-over and transport module of wafer
US7651311B2 (en) Substrate container opener and opener-side door drive mechanism thereof
JP2021052169A (en) Substrate holding device and substrate transport device including the same
TW201601877A (en) Substrate processing apparatus
KR102081706B1 (en) Method for treating a substrate and an apparatus for treating a substrate
KR102563973B1 (en) Equipment front end module
TW201530643A (en) Substrate transfer method and substrate transfer device
KR20200009400A (en) Method for treating a substrate and an apparatus for treating a substrate
JP6345474B2 (en) Substrate polishing equipment
JP3950745B2 (en) Clean assembly module device and production system configured thereby
TW202218021A (en) Substrate handling systems
KR102623541B1 (en) Coaxial rotation reversing apparatus for strip-shaped product
JP2001244231A (en) Horizontal shaft substrate rotary drying device
US20240162056A1 (en) Apparatus for processing substrate
US20230302476A1 (en) Substrate processing apparatus and substrate processing method

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right