KR102518368B1 - Lighting apparatus - Google Patents

Abstract

A lighting device according to an exemplary embodiment of the present invention includes a fixture having a fastening hole including a first hole and a second hole having a smaller size than the first hole and connected to the first hole; a light source module having a fastening pin detachably fastened to the fastening hole; and an electrode terminal placed on the fixture and connected to the light source module. As the light source module slides along the surface of the fixture in a structure in which the fastening pin moves from the state inserted into the first hole to the second hole, the light source module is mechanically fixed with the fixture and connected to the electrode terminal. of electrical connection can be implemented.

Description

Lighting device {LIGHTING APPARATUS}

The present invention relates to a lighting device.

Conventional lighting devices are manufactured by fastening substrates on which light emitting elements are mounted to a frame and additionally fastening optical elements such as lenses covering the light emitting elements to the frame. At this time, the fastening of the substrate and the optical element was carried out in a bolt fastening method using screws, and there was a disadvantage that the process was not easy and cumbersome because a plurality of screws had to be individually inserted into positions.

In addition, when a defect occurs in the light emitting element and repair is required, since the assembled screw must be removed again to separate the light emitting element and the substrate, there is a disadvantage in that maintenance is not easy.

In addition, an additional cabling process is performed to electrically connect the substrates, and accordingly, the manufacturing process becomes complicated and costs and time increase.

Therefore, in the art, there is a demand for a method that can easily mount and electrically connect the light source module.

However, the object of the present invention is not limited thereto, and even if not explicitly mentioned, it will be said that the object or effect that can be grasped from the solution or embodiment of the problem described below is also included therein.

A lighting device according to an exemplary embodiment of the present invention includes a fixture having a fastening hole including a first hole and a second hole having a smaller size than the first hole and connected to the first hole; a light source module having a fastening pin detachably fastened to the fastening hole; and an electrode terminal disposed on the fixture and connected to the light source module, wherein the light source module slides along the surface of the fixture in a structure in which the fastening pin moves to the second hole while being inserted into the first hole. As it moves, the light source module may be mechanically fixed to the fixture and electrically connected to the electrode terminal.

A lighting device according to an exemplary embodiment of the present invention includes a fixture having a fastening hole; A light source module including a plurality of light emitting elements and a substrate having the plurality of light emitting elements arranged on one surface, the substrate protruding from the other surface and having a fastening pin detachably fastened to the fastening hole; and an electrode terminal disposed on the fixture and connected to the light source module, wherein the light source module slides on the surface of the fixture along the fastening hole while the fastening pin is inserted into the fastening hole. may realize mechanical fixation with the fixture and electrical connection with the electrode terminal.

According to one embodiment of the present invention, a lighting device that can be easily mounted and electrically connected through a standardized light source module can be provided.

Various advantageous advantages and effects of the present invention are not limited to the above description, and will be more easily understood in the process of describing specific embodiments of the present invention.

1 is an exploded perspective view schematically illustrating a lighting device according to an exemplary embodiment.
FIG. 2 is a plan view schematically illustrating a fixture in the lighting device of FIG. 1 .
FIG. 3 is an exploded perspective view schematically illustrating a light source module in the lighting device of FIG. 1 .
FIG. 4 is a perspective view schematically illustrating a view of the light source module of FIG. 3 viewed from the bottom direction.
5A and 5B are cross-sectional and bottom views schematically illustrating a state in which a fastening pin is inserted into a first hole of a fastening hole.
6A and 6B are cross-sectional and bottom views schematically illustrating a state in which a fastening pin is moved from a first hole to a second hole.
FIG. 7A is a perspective view schematically illustrating electrode terminals in the lighting device of FIG. 1 .
7B is a perspective view schematically illustrating a modified example of the electrode terminal of FIG. 7A.
8A and 8B are perspective views schematically illustrating an electrode terminal according to an exemplary embodiment, respectively.
9 to 10 are perspective views schematically illustrating a step-by-step process of fastening light source modules to fixtures.
11 is a cross-sectional view schematically illustrating a state in which light source modules are electrically connected.
12 is an exploded perspective view schematically illustrating a lighting device according to an exemplary embodiment.
FIG. 13 is a perspective view schematically illustrating a light source module in the lighting device of FIG. 12 .
14 is an exploded perspective view schematically illustrating a lighting device according to an exemplary embodiment.
15 is an exploded perspective view schematically illustrating a light source module in the lighting device of FIG. 14 .
16A to 16C are perspective views schematically showing step-by-step processes in which light source modules are fastened to a fixture and electrically connected to each other.
17 is a perspective view schematically illustrating a state in which a driving circuit is mounted on a fixture.
18 is a perspective view schematically illustrating a state in which a sensor is mounted on a fixture.
19A and 19B are cross-sectional views schematically illustrating an example of an LED package that can be used as a light emitting device.
20A and 20B are cross-sectional views schematically illustrating an LED package according to an exemplary embodiment of the present invention, respectively.
21A and 21B are cross-sectional views schematically illustrating an LED package according to an exemplary embodiment of the present invention, respectively.
22 is a CIE1931 coordinate system for explaining phosphors employable in the present invention.
23A and 23B are side cross-sectional views schematically illustrating an LED chip according to an exemplary embodiment of the present invention, respectively.
24 is an exploded perspective view of a bar-type lamp employing a light source module according to an exemplary embodiment.
25 is an indoor lighting control network system that may employ a light source module according to example embodiments.
26 is an open network system that may employ a light source module according to example embodiments.
27 is a block diagram illustrating a communication operation between a smart engine of a lighting fixture and a mobile device through visible light wireless communication that may employ a light source module according to example embodiments.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention can be modified in many different forms, and the scope of the present invention is not limited to the embodiments described below.

In addition, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Accordingly, the shapes and sizes of elements in the drawings may be exaggerated for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements. In this specification, terms such as 'upper', 'upper', 'top', 'lower', 'lower', 'lower', 'side' are based on the drawings, and elements or components are actually arranged. It may vary depending on which direction it is going.

A lighting device according to an exemplary embodiment of the present invention will be described with reference to FIG. 1 . 1 is an exploded perspective view schematically illustrating a lighting device according to an exemplary embodiment.

Referring to FIG. 1 , a lighting device 1 according to an exemplary embodiment of the present invention includes a fixture 100 having a fastening hole 110 and a fastening pin 210 detachably fastened to the fastening hole 110. It may include a light source module 200 having and an electrode terminal 300 placed on the fixture 100 and connected to the light source module 200 .

The light source module 200 is detachably fixed to the fixture 100 through a structure in which the fastening pin 210 slides along the fastening hole 110 while being inserted into the fastening hole 110. It can be.

2 is a plan view schematically showing the fixture. Referring to FIGS. 1 and 2 , the fixture 100 corresponds to a frame on which the light source module 200 is mounted, and can mechanically fix the light source module 200 and electrically connect it.

The fixture 100 may be made of a solid material to support the light source module 200 . In addition, the fixture 100 may be made of a material capable of dissipating heat generated from the light source module 200 to the outside. For example, the fixture 100 may be made of a metal material. However, the material of the fixture 100 is not limited thereto.

A surface of the fixture 100 on which the light source module 200 is mounted may reflect light generated from the light source module 200 . In order to improve light extraction efficiency, the surface may be treated for light reflection.

In this embodiment, the fixture 100 is illustrated as having a generally rectangular shape, but is not limited thereto. Depending on the design of the lighting device 1, the shape of the fixture 100 may be changed to a polygonal shape such as a triangle, a pentagon, a hexagon, or the like, a circle, or the like.

The fastening hole 110 may be formed in a structure penetrating the fixture 100 . A plurality of the fastening holes 110 may be arranged spaced apart from each other at predetermined intervals.

The fastening hole 110 may include a first hole 111 and a second hole 112 having a smaller size than the first hole 111 and connected to the first hole 111 . The first hole 111 may have a diameter of a size into which the fastening pin 210 can be inserted. The second holes 112 may have intervals smaller than the diameter of the first holes 111 and extend in the sliding direction of the light source module 200 from the first holes 111 .

The sliding movement direction of the light source module 200 may be understood as a direction in which the light source modules 200 come closer to each other. For example, when two light source modules 200 are mounted, the sliding movement direction of the light source module 200 may be a direction toward the center Z of the fixture 100 as shown in FIG. 2 (arrow). indicated by ). That is, the light source modules 200 respectively disposed on the left and right sides of the center Z of the fixture 100 may slide in a direction closer to each other toward the center Z of the fixture 100.

The fastening pin 210 may be inserted into or extracted from the fastening hole 110 through the first hole 111 . The fastening pin 210 may move along the second hole 112 while being inserted into the first hole 111 .

A plurality of light source modules 200 may be mounted on the fixture 100 . In addition, the light source modules 200 may be electrically connected to each other while being mounted on the fixture 100 .

In this embodiment, two light source modules 200 are mounted on the fixture 100 and are connected to each other along the longitudinal direction. However, it is not limited thereto, and the quantity and arrangement structure of the light source modules 200 may be variously changed.

3 is an exploded perspective view schematically illustrating a light source module according to an exemplary embodiment of the present invention. Referring to FIG. 3 , a light source module 200 according to an exemplary embodiment of the present invention may include a plurality of light emitting devices 220 , a substrate 230 , and an optical device 240 .

The light emitting device 220 may be an optoelectronic device that generates light of a predetermined wavelength by driving power applied from the outside. For example, it may include a semiconductor light emitting diode (LED) having an n-type semiconductor layer and a p-type semiconductor layer and an active layer disposed therebetween.

The light emitting device 220 may emit blue light, green light, or red light, or may emit ultraviolet light or the like. White light can be emitted by combining with a wavelength conversion material such as a phosphor, if necessary.

The light emitting device 220 may be a light emitting diode (LED) chip having various structures or an LED package equipped with the LED chip. In this embodiment, the LED package is described as being used as a light emitting element, but is not limited thereto.

The plurality of light emitting devices 220 may be mounted on one surface, for example, an upper surface of the substrate 230 . The plurality of light emitting devices 220 may be arranged along the length direction of the substrate 230 .

The plurality of light emitting devices 220 may be of the same type that emits light of the same wavelength or of different types that emit light of different wavelengths. In addition, the light emitting elements 220 may be configured in various ways according to power, such as for example 0.5W and 1W. In addition, the light emitting elements 220 may be composed of at least two types having different color temperatures, such as 2700K and 6500K, and alternately arranged.

The substrate 230 may be a printed circuit board. For example, it may be a FR4 type printed circuit board (PCB) or a flexible printed circuit board that is easy to deform. These printed circuit boards are formed of organic resin materials and other organic resin materials containing epoxy, triazine, silicon, and polyimide, ceramic materials such as silicon nitride, AlN, and Al ₂ O ₃ , or MCPCB. , MCCL, etc. may be formed of metals and metal compounds.

In this embodiment, the substrate 230 is illustrated as having a rectangular shape elongated along the longitudinal direction, but is not limited thereto. The substrate 230 may be deformed into various shapes according to the shape of the fixture 100 .

The substrate 230 may have an insertion groove 231 into which the fastening pin 210 is inserted. The insertion groove 231 may be formed at a position corresponding to the fastening pin 210 . And, it may be formed in a quantity corresponding to the fastening pin 210 .

4 schematically shows a view of the light source module 200 from the bottom direction.

Referring to FIG. 4 together with FIG. 3 , electrode pads 250 capable of supplying driving power to the plurality of light emitting devices 220 mounted on the upper surface of the substrate 230 are provided at both ends of the substrate 230 , respectively. can be placed. The electrode pad 250 may be exposed to the outside through the surface of the substrate 230 .

The electrode pad 250 may be connected to the electrode pad 250 of another light source module 200 disposed adjacently or connected to an external power source.

The optical device 240 may be disposed on one surface of the substrate 230 to cover the plurality of light emitting devices 220 .

The optical element 240 may have the fastening pin 210 . The fastening pin 210 may extend from the bottom surface of the optical element 240 toward the substrate 230 . A plurality of fastening pins 210 may be spaced apart from each other at regular intervals along the longitudinal direction of the optical element 240 .

The optical element 240 may be detachably coupled to the substrate 230 through the fastening pin 210 . For example, the optical element 240 may be coupled to or separated from the substrate 230 by inserting or extracting the coupling pin 210 into the insertion groove 231 of the substrate 230 .

The fastening pin 210 may include a rod 211 extending from the optical element 240 and a locking protrusion 212 protruding radially from an end of the rod 211 .

The rod 211 may have a length greater than the total thickness of the substrate 230 and the fixture 100 . Specifically, the rod 211 may further protrude downward from the bottom surface of the fixture 100 while penetrating the substrate 230 and the fixture 100 . In addition, the locking protrusion 212 may be disposed on the bottom surface of the fixture 100 and exposed to the outside.

The rod 211 may have a smaller diameter than the first hole 111 and the second hole 112 . Thus, the rod 211 can pass through both the first hole 111 and the second hole 112 .

The locking protrusion 212 may have a diameter smaller than that of the first hole 111 but larger than the distance between the second holes 112 . Accordingly, the locking protrusion 212 can pass through the first hole 111 but cannot pass through the second hole 112 .

5A and 5B are cross-sectional and bottom views schematically illustrating a state in which the fastening pin is inserted into the first hole of the fastening hole. As shown in FIGS. 5A and 5B , the fastening pin 210 may pass through the first hole 111 and be inserted into or extracted from the fastening hole 110 .

6A and 6B are cross-sectional and bottom views schematically illustrating a state in which the fastening pin is moved from the first hole to the second hole. As shown in FIGS. 6A and 6B, in a state where the fastening pin 210 passes through the first hole 111 and the locking protrusion 212 is exposed to the outside of the bottom surface of the fixture 100, the fastening pin ( When the 210 moves to the second hole 112, the locking protrusion 212 is caught on the bottom surface of the fixture 100 in the second hole 112. Therefore, the fastening pin 210 can be locked and fixed at the position of the second hole 112 without being extracted from the fixture 100 .

In this way, the substrate 230 on which the plurality of light emitting elements 220 are mounted is fastened to the optical element 240 having the fastening pins 210, and the fastening pins 210 are connected to the fastening holes 110 of the fixture 100. The substrate 230 and the optical element 240 slide on the surface of the fixture 100 along the fastening hole 110 in the inserted state, so that the light source module 200 is easily fixed to the fixture 100 or the fixture 100 ) can be separated from

In the light source module 200 according to an exemplary embodiment of the present invention, mechanical fixation with the fixture 100 and electrical connection with other light source modules 200 can be implemented simultaneously through sliding movement. Electrical connection between these light source modules 200 may be made through the electrode terminal 300 .

The electrode terminal 300 may be attached to the fixture 100 to electrically connect the light source modules 200 to each other.

As shown in FIG. 1 , the electrode terminal 300 may be disposed on the surface of the fixture 100 . Specifically, the electrode terminal 300 may be disposed at a position where a pair of light source modules 200 come into contact with each other, eg, between the light source modules 200 and the light source modules 200 in contact with each other. And, it may be connected to the electrode pad 250 exposed to the surface of the substrate 230 of each light source module 200, for example, the bottom surface.

7A schematically shows an electrode terminal 300 according to an exemplary embodiment. Referring to FIG. 7A , the electrode terminal 300 may include a body portion 310 detachably attached to the fixture 100 and a terminal portion 320 partially exposed from the body portion 310. there is.

The body portion 310 may be made of an insulating material, for example, a thermosetting resin. The body portion 310 may be detachably attached to the fixture 100 using an adhesive means A such as double-sided tape or Velcro (see FIG. 1 ).

The terminal portion 320 may be partially exposed from the body portion 310 and electrically connected to the electrode pad 250 of the substrate 230 . The terminal part 320 protrudes upward from the body part 310 and is exposed and has a pair of contact parts 321 having a plate spring type structure and a connecting part connecting the pair of contact parts 321. (322).

The terminal unit 320 may have a structure in which the pair of contact parts 321 and the connection part 322 extend in a straight line.

The terminal unit 320 may be made of, for example, a metal material such as aluminum or copper.

7B schematically shows a modified example of the electrode terminal 300a. Referring to FIG. 7B , the electrode terminal 300a may include a body portion 330 detachably attached to the fixture 100 and a terminal portion 340 partially exposed from the body portion 330. there is.

The body portion 330 may be made of an insulating material. And, it can be detachably attached to the fixture 100 using the adhesive means (A).

The terminal part 340 protrudes upward from the body part 330 and is exposed and has a pair of contact parts 341 having a plate spring type structure and a connection part connecting the pair of contact parts 341. (342).

The terminal unit 340 may have a structure in which the pair of contact parts 341 are bent and connected to the connection part 342 in a zigzag shape. That is, the terminal portion 320 of FIG. 7A extends in a straight line and has a structure in which the pair of contact parts 321 are located on the same straight line, but the terminal portion 340 of FIG. 7B has a structure in which the pair of contact parts 341 ) is different in that it has a structure located on two parallel straight lines.

8A and 8B schematically show an electrode terminal according to an exemplary embodiment.

Referring to FIG. 8A , the electrode terminal 300b may include a terminal portion 320 detachably attached to the fixture 100 through an adhesive means A. That is, unlike the electrode terminal 300 according to the embodiment of FIG. 7A including the body portion 310 and the terminal portion 320, the electrode terminal 300b according to the present embodiment has a terminal portion in which the body portion 310 is omitted. There is a difference in that it includes only (320).

Also, referring to FIG. 8B , the electrode terminal 300c may include a terminal portion 340 detachably attached to the fixture 100 through an adhesive means A. That is, unlike the electrode terminal 300a according to the embodiment of FIG. 7B including the body portion 330 and the terminal portion 340, the electrode terminal 300c according to the present embodiment has the body portion 330 omitted. There is a difference in

As described above, the electrode terminals 300, 300a, 300b, and 300c electrically connecting the pair of light source modules 200 to each other by contacting the electrode pads 250 of the substrate 230 are terminal units 320 having different structures, Through 340, the light source modules 200 may be connected in series or in parallel.

The light source module 200 according to an exemplary embodiment of the present invention may be mechanically fixed to the fixture 100 through a sliding movement and electrically connected to another light source module 200 at the same time.

For example, looking at the case where two light source modules 200 are mounted as shown in FIG. 1 , as shown in FIG. 9 , the two light source modules 200 may be disposed on the fixture 100 in a structure facing each other. there is. The two light source modules 200 may be disposed at positions where the fastening pins 210 of each light source module face the fastening holes 110 of the fixture 100 .

An electrode terminal 300 may be attached to and disposed in the central region of the fixture 100 . For example, when the two light source modules 200 are fixed to the fixture 100, the electrode terminal 300 may be placed at a position corresponding to the position between the two light source modules 200.

As shown in FIG. 10, in a state in which one of the two light source modules 200 is first fixed to the fixture 100 through sliding movement, the remaining light source modules 200 are fixed to the fixture 100 through sliding movement. can Of course, it is also possible to simultaneously slide and move the two light source modules 200 and fix them to the fixture 100 .

11 schematically shows a connection state between the electrode pad 250 of the light source module 200 and the electrode terminal 300 .

As shown in FIG. 11, when the two light source modules 200 slide and are fixed to the fixture 100, the electrode pads 250 exposed to the lower surface of the substrate 230 of each light source module 200 are the electrodes. It comes into contact with the protruding terminal portion 320 of the terminal 300 . Accordingly, the two light source modules 200 may be electrically connected to each other through the electrode terminal 300 .

That is, the two light source modules 200 may be electrically connected to each other through sliding movement and mechanically fixed to the fixture 100 at the same time.

In this way, the light source modules 200 can be fixed and the light source modules 200 can be electrically connected to each other at the same time through one process of sliding movement, so that the entire manufacturing process can be simplified and time can be shortened. In addition, since a conventional cabling process for connecting light source modules can be omitted, cost and time for such a cabling process can be reduced.

In addition, the light source module 200 according to an exemplary embodiment of the present invention is an optical element having a fastening pin 210 for fixing the light source module 200 to the substrate 230 on which the plurality of light emitting elements 220 are mounted. Since it has a structure that is detachably fastened to the 240, even if a problem occurs in some of the light emitting elements 220, the substrate 230 is separated from the optical element 240 and maintained by replacing the substrate 230 with another substrate 230 and fastening the same. easy to repair In addition, since there is no need to replace the entire light source module 200, maintenance costs can be reduced.

A lighting device according to an exemplary embodiment of the present invention will be described with reference to FIGS. 12 and 13 . 12 is an exploded perspective view schematically illustrating a lighting device according to an exemplary embodiment, and FIG. 13 is a perspective view schematically illustrating a light source module in the lighting device of FIG. 12 .

12 and 13, the lighting device 2 according to an exemplary embodiment of the present invention includes a fixture 100 having a fastening hole 110, an electrode terminal 300 placed on the fixture, and the fastening hole ( A light source module 400 having a fastening pin 410 detachably fastened to 110 and a cover 500 may be included.

The light source module 400 is detachably fixed to the fixture 100 through a structure in which the fastening pin 410 slides along the fastening hole 110 while being inserted into the fastening hole 110. and can be electrically connected to each other through the electrode terminal 300.

The lighting device 2 according to the embodiment shown in FIGS. 12 and 13 has substantially the same basic configuration as the lighting device 1 according to the embodiment shown in FIGS. 1 to 11 . However, since the structure of the light source module is different from the embodiment shown in FIGS. 1 to 11 , descriptions of overlapping parts with the above-described embodiment will be omitted and the differences will be mainly described.

The fixture 100 may have a fastening hole 110 for fastening with the light source module 400 . The fastening hole 110 may be formed in a structure penetrating the fixture 100 . The fastening hole 110 has a gap smaller than the diameter of the first hole 111 into which the fastening pin 410 is inserted and the first hole 111, and is connected to the first hole 111. A second hole 112 extending in the sliding direction of the light source module 400 may be included.

The electrode terminal 300 is detachably attached to the fixture 100 to electrically connect the light source modules 400 to each other.

The electrode terminal 300 may be disposed between a pair of light source modules 400 on the surface of the fixture 100 in contact with each other. In addition, it may be electrically connected to the pair of light source modules 400 disposed on both left and right sides, respectively.

The electrode terminal 300 may include a body portion 310 detachably attached to the fixture 100 and a terminal portion 320 partially exposed from the body portion 310 .

A plurality of light source modules 400 may be mounted on the fixture 100 . In addition, the light source modules 400 may be electrically connected to each other via the electrode terminal 300 while being mounted on the fixture 100 .

The light source module 400 may include a plurality of light emitting devices 420 and a substrate 410 .

The light emitting device 420 may be a light emitting diode (LED) chip having various structures or an LED package equipped with an LED chip. In this embodiment, it will be described that an LED package is used as a light emitting device.

The plurality of light emitting devices 420 may be mounted on one surface of the substrate 430, for example, an upper surface. The plurality of light emitting devices 420 may be arranged along the length direction of the substrate 430 .

In this embodiment, the substrate 430 is illustrated as having a rectangular shape elongated along the longitudinal direction, but is not limited thereto. The substrate 430 may be deformed into various shapes according to the shape of the fixture 100 .

Electrode pads 450 capable of supplying driving power to the plurality of light emitting elements 420 mounted on the upper surface of the substrate 430 may be respectively disposed at both ends of the substrate 430 . The electrode pad 450 may be exposed to the outside through the surface of the substrate 430 .

The electrode pad 450 may be connected to an electrode pad 450 of another light source module 400 disposed adjacent thereto or connected to an external power source.

The substrate 430 may have a fastening pin 410 detachably fastened to the fastening hole 110 . The fastening pin 410 may protrude and extend from the other surface of the substrate 430, for example, the bottom surface, in a direction opposite to that of the plurality of light emitting elements 420.

A plurality of the fastening pins 410 may be spaced apart from each other at regular intervals along the longitudinal direction of the substrate 430 .

The fastening pin 410 may include a rod 411 extending from the substrate 430 and a locking protrusion 412 protruding radially from an end of the rod 411 .

The rod 411 may have a longer length than the thickness of the fixture 100 . Specifically, the rod 411 may further protrude downward from the bottom surface of the fixture 100 while penetrating the fixture 100 . Also, the locking protrusion 412 may be disposed on the bottom surface of the fixture 100 and exposed to the outside.

The rod 411 may have a smaller diameter than the first hole 111 and the second hole 112 . Thus, the rod 411 can pass through both the first hole 111 and the second hole 112 .

The locking protrusion 412 may have a diameter smaller than that of the first hole 111 but larger than that of the second hole 112 . Accordingly, the locking protrusion 412 can pass through the first hole 111 but cannot pass through the second hole 112 .

In the light source module 400 according to the present embodiment, the fastening pin 410 fastened to the fastening hole 110 of the fixture 100 is provided on the substrate 430, as shown in FIGS. 1 to 11 above. It is different from the light source module 200 according to the embodiment. That is, the light source module 200 according to the embodiments shown in FIGS. 1 to 11 further includes an optical element 240 disposed on the substrate 230 as a component, and the fastening pin 210 is the optical element 240. It has a structure provided in the element 240. On the other hand, the light source module 400 according to the present embodiment is different in that it does not have an optical element as a component and has a structure in which the fastening pin 410 is provided on the substrate 430 .

In this way, in a state where the fastening pin 410 of the substrate 430 is inserted into the fastening hole 110 of the fixture 100, the substrate 430 slides on the surface of the fixture 100 along the fastening hole 110. By doing so, the light source module 400 can be easily fixed to the fixture 100 or separated from the fixture 100 . In addition, by fixing the light source module 400 to the fixture 100, electrical connection between the light source modules 400 may be implemented. That is, mechanical fixation and electrical connection of the light source module 400 may be simultaneously performed. Accordingly, a separate procedure such as a cabling process for additionally electrically connecting the light source module in a state in which the light source module is fixed may be omitted.

The cover 500 may be mounted on the fixture 100 to cover the light source modules 400 . The cover 500 covers the light source modules 400 to protect them from the external environment, while diffusing light generated from each light source module 400 to the outside.

The cover 500 may be made of a resin material having light transmittance, and may include, for example, polycarbonate (PC), polymethyl methacrylate (PMMA), acryl, and the like.

The cover 500 may have a surface on which a concavo-convex structure is formed through surface treatment. Through this, the light emitted to the outside can be more widely and uniformly diffused.

A lighting device according to an exemplary embodiment of the present invention will be described with reference to FIG. 14 . 14 is an exploded perspective view schematically illustrating a lighting device according to an exemplary embodiment.

Referring to FIG. 14 , the lighting device 3 according to an exemplary embodiment of the present invention includes a fixture 100 having a fastening hole 110 and a fastening pin 610 detachably fastened to the fastening hole 110 . It may include a light source module 600 having a.

The light source module 600 is detachably fixed to the fixture 100 through a structure in which the fastening pin 610 slides along the fastening hole 110 while being inserted into the fastening hole 110. It can be.

A configuration constituting the lighting device 3 according to the embodiment shown in FIG. 14 is substantially the same as the basic configuration of the lighting device 1 according to the embodiment shown in FIG. 1 . However, since the electrical connection structure of the light source modules is different from that of the embodiment shown in FIG. 1 , descriptions of overlapping parts with the above-described embodiment will be omitted and the differences will be mainly described.

The fixture 100 may have a fastening hole 110 for fastening with the light source module 600 . The fastening hole 110 may be formed in a structure penetrating the fixture 100 . The fastening hole 110 has a gap smaller than the diameter of the first hole 111 into which the fastening pin 610 is inserted and the first hole 111, and is connected to the first hole 111. A second hole 112 extending in the sliding direction of the light source module 600 may be included.

A plurality of light source modules 600 may be mounted on the fixture 100 . Also, the light source modules 600 may be electrically connected to each other while being mounted on the fixture 100 .

In this embodiment, it is illustrated that two light source modules 600 are mounted on the fixture 100 and connected to each other along the longitudinal direction. However, it is not limited thereto, and the quantity and arrangement structure of the light source modules 600 may be variously changed.

15 is an exploded perspective view schematically illustrating a light source module according to an exemplary embodiment of the present invention. Referring to FIG. 15 , the light source module 600 may include a plurality of light emitting devices 620 , a substrate 630 and an optical device 640 .

The light emitting device 620 may be a light emitting diode (LED) chip having various structures or an LED package equipped with an LED chip.

The plurality of light emitting devices 620 may be mounted on one surface, for example, the upper surface of the substrate 630 . The plurality of light emitting devices 620 may be arranged along the length direction of the substrate 630 .

The substrate 630 may be a printed circuit board. For example, it may be a FR4 type printed circuit board (PCB) or a flexible printed circuit board that is easy to deform. These printed circuit boards are formed of organic resin materials and other organic resin materials containing epoxy, triazine, silicon, and polyimide, ceramic materials such as silicon nitride, AlN, and Al ₂ O ₃ , or MCPCB. , MCCL, etc. may be formed of metals and metal compounds.

In this embodiment, the substrate 630 is illustrated as having a rectangular shape elongated along the longitudinal direction, but is not limited thereto. The substrate 630 may be deformed into various shapes according to the shape of the fixture 100 .

The substrate 630 may have an insertion groove 631 into which the fastening pin 610 is inserted. The insertion groove 631 may be formed at a position corresponding to the fastening pin 610 . And, it may be formed in a quantity corresponding to the fastening pin 610 .

Connectors 650 capable of supplying driving power to the plurality of light emitting elements 620 may be respectively disposed at both ends of the substrate 630 . The connector 650 may include a female connector 651 and a male connector 652 .

The connector 650 may be connected to the connector 650 of another light source module 600 disposed adjacent thereto or connected to an external power source.

The optical device 640 may be disposed on one surface of the substrate 630 to cover the plurality of light emitting devices 620 .

The optical element 640 may have the fastening pin 610 . The fastening pin 610 may extend from the bottom surface of the optical element 640 toward the substrate 630 . A plurality of fastening pins 610 may be spaced apart from each other at regular intervals along the longitudinal direction of the optical element 640 .

The optical element 640 may be detachably coupled to the substrate 630 through the fastening pin 610 . Specifically, the optical element 640 may be coupled to or separated from the substrate 630 by inserting or extracting the coupling pin 610 into the insertion groove 631 of the substrate 630 .

The fastening pin 610 may include a rod 611 extending from the optical element 640 and a locking protrusion 612 protruding radially from an end of the rod 611 .

The rod 611 may have a length greater than the total thickness of the substrate 630 and the fixture 100 . Specifically, the rod 611 may further protrude downward from the bottom surface of the fixture 100 while passing through the substrate 630 and the fixture 100 . Also, the locking protrusion 612 may be disposed on the bottom surface of the fixture 100 and exposed to the outside.

The rod 611 may have a smaller diameter than the first hole 111 and the second hole 112 . Thus, the rod 611 can pass through both the first hole 111 and the second hole 112 .

The locking protrusion 612 may have a diameter smaller than that of the first hole 111 but larger than the distance between the second holes 112 . Accordingly, the locking protrusion 612 can pass through the first hole 111 but cannot pass through the second hole 112 .

Meanwhile, the light source module 600 according to an exemplary embodiment of the present invention can realize mechanical fixation with the fixture 100 as well as electrical connection with other light source modules 600 through sliding movement.

For example, looking at the case where two light source modules 600 are mounted as shown in FIG. 14, as shown in FIG. 16A, the two light source modules 600 may be disposed on the fixture 100 in a structure facing each other. . The two light source modules 600 may be disposed at positions where the fastening pins 610 of each light source module face the fastening holes 110 of the fixture 100 .

As shown in FIG. 16B, the two light source modules 600 are mounted on the fixture 100 so that the fastening pins 610 of each light source module 600 are inserted into the first holes 111 of the fastening holes 110. can be placed on

As shown in FIG. 16C, the two light source modules 600 are connected to the fixture 100 so that the fastening pins 610 of each light source module 600 move from the first hole 111 to the second hole 112. ) can slide along the surface.

The two light source modules 600 may be electrically connected through the connector 650 of each light source module 600 by sliding toward each other. For example, the male connector 652 of the light source module 600 on one side may be fastened in a structure in which the female connector 651 of the light source module 600 on the other side is inserted.

Accordingly, the two light source modules 600 may be electrically connected to each other through sliding movement and mechanically fixed to the fixture 100 at the same time.

Of course, when one of the two light source modules 600 is first fixed to the fixture 100 through sliding movement, and the other light source modules 600 are fixed to the fixture 100 through sliding movement, the light source module ( It is also possible to connect the connector 650 of the 600 and the connector 650 of the first fixed light source module 600 .

That is, since the light source modules 600 are fixed and the light source modules 600 are electrically connected to each other through one process of sliding movement, the whole manufacturing process can be simplified and time can be shortened. In addition, since a cabling process for connecting the light source modules as in the prior art can be omitted, cost and time for such a cabling process can be reduced.

Meanwhile, the lighting devices 1 , 2 , and 3 according to an exemplary embodiment of the present invention may further include a driving circuit 700 . The driving circuit 700 may include, for example, a power supply unit (PSU).

17 is a perspective view schematically illustrating a state in which a driving circuit is mounted on a fixture.

Referring to FIG. 17 together with FIG. 1 , the fixture 100 may include an electrode terminal 300 connected to the light source module 200 and an electrode terminal 300d connected to the driving circuit 700 . The electrode terminal 300 and the electrode terminal 300d may be electrically connected to each other through a circuit pattern (not shown) provided on the inside or surface of the body parts 310 and 310d, for example.

The driving circuit 700 may have a fastening pin 710 and a pad 720 exposed to the outside.

The driving circuit 700 may be mechanically fixed to the fixture 100 by sliding in a state in which the fastening pin 710 is inserted into the fastening hole 110 of the fixture 100 . Also, the pad 720 may contact and electrically connect to the terminal portion 320d exposed above the body portion 310d of the electrode terminal 300d.

The driving circuit 700 and the light source modules 200 may be electrically connected to each other through the electrode terminals 300 and 300d.

According to this embodiment, the driving circuit 700 can be coupled to the fixture in a simple slide fixing method and electrically connected to the light source module 200 at the same time. Therefore, a separate cabling process for connecting the conventional PSU to the light source module is omitted, and thus cost and time can be reduced.

In this embodiment, the driving circuit 700 is illustrated as being coupled to one surface of the fixture 100 like the light source module 200, but is not limited thereto. For example, the driving circuit 700 may be coupled to the other surface of the fixture 100 to which the light source module 200 is coupled. That is, the light source module 200 may be disposed on an upper surface of the fixture 100 and the driving circuit 700 may be disposed on a lower surface of the fixture 100 .

Meanwhile, the lighting devices 1 , 2 , and 3 according to an exemplary embodiment of the present invention may further include a sensor 800 in addition to the driving circuit 700 . 18 is a perspective view schematically illustrating a state in which a sensor is mounted on a fixture.

Referring to FIG. 18 together with FIG. 17 , the fixture 100 may include an electrode terminal 300e connected to the sensor 800 . The electrode terminals 300, 300d, and 300e may be electrically connected to each other through circuit patterns (not shown) provided on the inside or surface of the body parts 310, 310d, and 310e, for example.

The sensor 800 may have a fastening pin 810 and a pad 820 exposed to the outside on a lower surface.

The sensor 800 may be mechanically fixed to the fixture 100 by sliding in a state in which the fastening pin 810 is inserted into the fastening hole 110 of the fixture 100 . In addition, the pad 820 may contact and electrically connect to the terminal portion 320e exposed above the body portion 310e of the electrode terminal 300e.

The sensor 800 and the light source module 200 may be electrically connected to each other through the electrode terminals 300, 300d, and 300e.

Meanwhile, it is also possible to combine a communication module other than the driving circuit 700 and the sensor 800 . Home-network communication can be implemented through this communication module. In addition to the function as a lighting, various modules or parts that can further perform various additional functions may be appropriately additionally combined.

A light emitting device according to an exemplary embodiment of the present invention will be described with reference to FIGS. 19A and 19B. 19A and 19B are cross-sectional views schematically illustrating an example of an LED package that can be used as a light emitting device.

As mentioned above, the light emitting device 220 may be a light emitting diode (LED) chip or an LED package equipped with an LED chip. Hereinafter, LED packages of various structures that can be employed as light emitting devices will be described.

Referring to FIG. 19A , an LED package 220 according to an exemplary embodiment of the present invention may have, for example, a package structure in which an LED chip 20 is mounted in a package body 10 having a reflective cup. . Also, the LED chip 20 may be covered by an encapsulation portion 30 made of a resin containing a phosphor.

The package body 10 corresponds to a base member on which the LED chip 20 is mounted and supported, and may be made of a white molding compound having a high light reflectance. This has an effect of increasing the amount of light emitted to the outside by reflecting light emitted from the LED chip 20 .

The white molded composite material may include a thermosetting resin series or a silicone resin series with high heat resistance. In addition, a white pigment and a filler, a curing agent, a release agent, an antioxidant, an adhesion improver, and the like may be added to the thermoplastic resin series. In addition, it may be made of FR-4, CEM-3, epoxy material or ceramic material. In addition, it is also possible to be made of a metal material.

The package body 10 may include a lead frame 40 for electrical connection with an external power source. The lead frame 40 may be made of a material having excellent electrical conductivity, for example, a metal material such as aluminum or copper.

At least one pair of the lead frames 40 may be separated from each other and face each other for electrical insulation. For example, the lead frame 40 may include a first lead frame 41 having a first polarity and a second lead frame 42 having a second polarity different from the first polarity. Here, the first polarity and the second polarity may be an anode and a cathode, respectively (or vice versa). Also, the first lead frame 41 and the second lead frame 42 may be separated from each other and electrically insulated by the package body 10 .

Bottom surfaces of the first and second lead frames 41 and 42 may be exposed to the outside through the bottom surface of the body 10 . Through this, by dissipating the heat generated in the LED chip 20 to the outside, heat dissipation efficiency can be improved.

The package body 10 may have a reflective cup 11 recessed to a predetermined depth on an upper surface. The reflective cup 11 may have a tapered cup structure with an inner surface inclined toward the bottom surface of the package body 10 . Also, a cross section of the reflective cup 11 exposed to the upper surface of the package body 10 may define a light emitting surface of the LED package 220 .

The first and second lead frames 41 and 42 may be partially exposed on the bottom surface of the reflection cup 11 . The LED chip 20 may be electrically connected to the first and second lead frames 41 and 42 .

The LED chip 20 may be an optoelectronic device that generates light of a predetermined wavelength by driving power applied from the outside through the lead frame 40 .

The LED chip 20 may emit blue light, green light, or red light according to a combination of materials or phosphors contained therein, and may also emit white light, ultraviolet light, or the like.

The encapsulation part 30 may cover the LED chip 20 . The encapsulation portion 30 may be formed by curing a phosphor-containing resin.

The encapsulation portion 30 may be made of a transparent or translucent material so that light generated from the LED chip 20 may be emitted to the outside, and may be formed of, for example, resin such as silicone or epoxy.

In this embodiment, the sealing portion 30 is illustrated as having a convex dome-shaped lens structure, but is not limited thereto. The sealing portion 30 may also be formed to have a flat shape corresponding to the upper surface of the package body 10 . And, it is also possible that a separate lens is additionally attached to the upper surface.

19B schematically shows a modified example of the LED package 220A. As shown in FIG. 19B , the LED package 220A may have, for example, a COB (Chip on Board) structure in which the LED chip 20 is mounted on a substrate 50 . Then, the LED chip 20 may be covered by an encapsulation 30 made of a resin containing a phosphor.

20A and 20B schematically show an LED package according to an exemplary embodiment of the present invention. 20A and 20B are cross-sectional views schematically illustrating an LED package according to an exemplary embodiment of the present invention, respectively.

Referring to FIG. 20A , the LED package 220B may include a package body 10 and an LED chip 20 mounted on the package body 10 .

The LED chip 20 may include, for example, a substrate 25, a light emitting structure, and first and second electrodes 21a and 22a disposed on the light emitting structure.

The substrate 25 may be provided as a substrate for semiconductor growth, and may be made of an electrically insulating and conductive material such as sapphire, SiC, MgAl ₂ O ₄ , MgO, LiAlO ₂ , LiGaO ₂ , GaN, or the like.

The light emitting structure may include first and second conductive semiconductor layers 21 and 22 and an active layer 23 disposed therebetween. Although not limited thereto, the first and second conductivity-type semiconductor layers 21 and 22 may be n-type and p-type semiconductor layers, respectively. In this embodiment, the first and second conductivity-type semiconductor layers 21 and 22 are Al _x In _y Ga _(1-xy) N composition formula (where 0≤x<1, 0≤y<1, 0≤ x+y<1), and for example, materials such as GaN, AlGaN, and InGaN may correspond to this. The active layer 23 formed between the first and second conductivity-type semiconductor layers 21 and 22 emits light having a predetermined energy by recombination of electrons and holes, and the quantum well layer and the quantum barrier layer alternate with each other. A multi-quantum well (MQW) structure stacked with , for example, an InGaN/GaN structure may be used.

The first and second electrodes 21a and 22a are formed on the first and second conductivity-type semiconductor layers 21 and 22, respectively, and are an electrically conductive material known in the art, such as Ag, Al, Ni, and Cr. , Cu, Au, Pd, Pt, Sn, W, Rh, Ir, Ru, Mg, Zn, Ti, or one or more alloy materials including these.

The package body 10 may include first and second lead frames 41 and 42 . The package body 10 may perform a function of supporting the first and second lead frames 41 and 42 and may be formed of opaque or highly reflective resin. For example, it may be provided using a polymer resin that is easy to perform an injection process. However, it is not limited thereto, and may be formed of various non-conductive materials.

The first and second lead frames 41 and 42 may be made of a metal material having excellent electrical conductivity, and are electrically connected to the first and second electrodes 21a and 22a of the LED chip 20, so that they can be accessed from the outside. The applied driving power may be transmitted to the LED chip 20 .

Although not limited thereto, in this embodiment, the first and second electrodes 21a and 22a of the LED chip 20 are arranged to face the second and first lead frames 42 and 41, and the first and the second bumps 60a and 60b may be electrically connected to each other.

The upper LED chip 20 may be sealed by an encapsulation portion 30 formed by curing a phosphor-containing resin discharged through the dispenser.

Referring to FIG. 20B , an LED package 220C according to an exemplary embodiment of the present invention may include a package substrate 50a and an LED chip 20A mounted on the package substrate 50a.

The package substrate 50a may include upper pads 41a and 42a, lower pads 41b and 42b, and through-vias 41c and 42c that penetrate the package substrate 50a and electrically connect them.

The LED chip 20A includes a light emitting structure and first and second electrodes respectively disposed on opposite surfaces of the light emitting structure, and the first and second electrodes are respectively disposed on upper and lower surfaces of the light emitting structure, respectively. It may have a vertical structure in which it is placed. A detailed structure of the LED chip 20A will be described later (see FIG. 23B).

The LED chip 20A is, for example, connected to one upper pad 41a of the upper pads through a second electrode disposed on the lower side, and another upper pad 42a through a first electrode disposed on the upper side. ) and the bonding wire (w).

The LED chip 20A may be sealed by an encapsulation portion 30 formed by curing a phosphor-containing resin discharged through the dispenser.

21A and 21B schematically show an LED package according to an exemplary embodiment of the present invention. 21A and 21B are cross-sectional views schematically illustrating an LED package according to an exemplary embodiment of the present invention, respectively.

An LED package 220D shown in FIG. 21A may include an LED chip 20B and a package body 10 . The package body 10 may include first and second lead frames 41 and 42, and the LED chip 20B is disposed on a substrate 25 and the first and second lead frames 25. It may include a light emitting structure in which two electrodes 21a and 22a are formed.

The light emitting structure may include first and second conductive semiconductor layers 21 and 22 and an active layer 23 disposed therebetween. A transparent electrode layer 22b may be formed between the second conductive semiconductor layer 22 and the second electrode 22a.

Unlike the LED package 220B shown in FIG. 20A, the LED package 220D according to this embodiment has the first and second electrodes 21a and 22a facing the first and second lead frames 41 and 42. It is not disposed, and may be electrically connected through a bonding wire (w).

The LED chip 220B may be sealed by an encapsulation portion 30 formed by curing a phosphor-containing resin discharged through a dispenser.

The LED chip 20C provided in the LED package 220E shown in FIG. 21B includes a conductive substrate 26 and a light emitting structure disposed on the conductive substrate 26, and the light emitting structure is of a first conductivity type. It may include a semiconductor layer 21, an active layer 23, and a second conductivity type semiconductor layer 22.

In this embodiment, a conductive via (v) passing through the second conductivity type semiconductor layer 22 and the active layer 23 and connected to the first conductivity type semiconductor layer 21 may be included. An insulating portion s may be formed on a side surface of the conductive via v to prevent an unwanted electrical short circuit.

The conductive via (v) may be electrically connected to the conductive substrate 26, and thus the conductive substrate 26 may perform the same function as a first electrode connected to the first conductive semiconductor layer 21. there is.

A second electrode 22a may be provided on the second conductivity type semiconductor layer 22 . The conductive via (v) may be electrically connected to the first lead frame 41, and the second electrode 22a may be electrically connected to the second lead frame 42 through the bonding wire (w). In this case, a more uniform current may be provided to the light emitting structure using the conductive via (v).

Meanwhile, the encapsulation part 30 may contain, for example, at least one kind of phosphor excited by light generated from the LED chip 20 and emitting light of a different wavelength. Through this, it can be adjusted so that white light and various colors of light can be emitted.

For example, when the LED chip 20 emits blue light, yellow, green, red and/or orange phosphors may be combined to emit white light. In addition, it may be configured to include at least one of LED chips emitting purple, blue, green, red or infrared light. In this case, the LED chip 20 can adjust the color rendering index (CRI) from '40' to '100', and can generate various white lights with a color temperature of about 2000K to 20000K. In addition, if necessary, the color can be adjusted according to the surrounding atmosphere or mood by generating visible light or infrared light of purple, blue, green, red, or orange. In addition, light of a special wavelength capable of promoting plant growth may be generated.

White light produced by a combination of yellow, green, and red phosphors in a blue LED chip and/or a combination of a green LED chip and a red LED chip has two or more peak wavelengths, and (x, y) of the CIE 1931 coordinate system shown in FIG. The coordinates may be located on a line segment connecting (0.4476, 0.4074), (0.3484, 0.3516), (0.3101, 0.3162), (0.3128, 0.3292), and (0.3333, 0.3333). Alternatively, it may be located in a region surrounded by the line segment and the blackbody radiation spectrum. The color temperature of the white light corresponds to approximately 2000K to 20000K.

In FIG. 22, the white light around point E (0.3333, 0.3333) at the lower part of the blackbody radiation spectrum is in a state in which the light of the yellow-series component is relatively weakened, and it is a region where the human eye can feel more vivid or fresh. can be used as a light source for Accordingly, a lighting product using white light around point E (0.3333, 0.3333) in the lower part of the blackbody radiation spectrum is effective as a lighting product for stores selling foodstuffs, clothes, and the like.

The phosphor may have the following composition formula and color.

Oxides: yellow and green Y ₃ Al ₅ O ₁₂ :Ce, Tb ₃ Al ₅ O ₁₂ :Ce, Lu ₃ Al ₅ O ₁₂ :Ce

Silicates: yellow and green (Ba,Sr) ₂ SiO ₄ :Eu, yellow and orange (Ba,Sr) ₃ SiO ₅ :Ce

Nitride system: green β-SiAlON:Eu, yellow La ₃ Si ₆ N ₁₁ :Ce, orange α-SiAlON:Eu, red CaAlSiN ₃ :Eu, Sr ₂ Si ₅ N ₈ :Eu, SrSiAl ₄ N ₇ :Eu, SrLiAl ₃ N ₄ :Eu, Ln _{4 -x} (Eu _z M _{1 -z} ) _x Si _{12- y} Al _y O _{3 +x+ y} N _{18 -xy} (0.5≤x≤3, 0<z<0.3, 0<y ≤ 4) (provided that Ln is at least one element selected from the group consisting of group IIIa elements and rare earth elements, and M is at least one element selected from the group consisting of Ca, Ba, Sr, and Mg. there is.)

Fluoride type: KSF type red K ₂ SiF ₆ :Mn ^{4 +} , K ₂ TiF ₆ :Mn ^{4 +} , NaYF ₄ :Mn ^{4 +} , NaGdF ₄ :Mn ⁴⁺ , K ₃ SiF ₇ :Mn ^{4 +}

The phosphor composition must basically conform to stoichiometry, and each element can be substituted with another element in each group on the periodic table. For example, Sr can be substituted with alkaline earth (II) group Ba, Ca, Mg, etc., and Y can be substituted with lanthanide group Tb, Lu, Sc, Gd, etc. In addition, Eu, etc. as an activator may be substituted with Ce, Tb, Pr, Er, Yb, etc. according to a desired energy level, and an activator alone or an auxiliary activator may be additionally applied to modify properties.

In particular, the fluorite-based red phosphor may be coated with Mn-free fluoride or further include an organic coating on the phosphor surface or Mn-free fluoride-coated surface to improve reliability at high temperature/high humidity. In the case of the fluorite-based red phosphor as described above, unlike other phosphors, since it can implement a narrow half-width of 40 nm or less, it can be used for high-resolution TVs such as UHD TVs.

In addition, materials such as quantum dots (Quantum Dot, QD) may be applied to the wavelength conversion material as a substitute for phosphor, and phosphor and QD may be mixed or QD alone may be used.

QDs may have a core-shell structure using III-V or II-VI compound semiconductors. For example, it may have a core such as CdSe or InP and a shell such as ZnS or ZnSe. In addition, the QD may include a ligand for stabilizing the core and the shell. For example, the core diameter may be approximately 1 to 30 nm, and further approximately 3 to 10 nm. The shell thickness may be approximately 0.1 to 20 nm, and further 0.5 to 2 nm.

The quantum dot can implement various colors depending on its size, and can be used as a red or green phosphor when used as a phosphor replacement material. In the case of using quantum dots, a narrow half-width (for example, about 35 nm) can be implemented.

23a and 23b schematically show an LED chip 20 according to an exemplary embodiment. 23a and 23b are side cross-sectional views schematically illustrating one embodiment of an LED chip that can be employed in the present invention, respectively.

Although not limited to this, for example, as shown in FIG. 23A, the LED chip 20 is disposed between the first conductivity type semiconductor layer 21 and the second conductivity type semiconductor layer 22 and these It may have a stacked structure of the active layer 23 .

The first conductivity-type semiconductor layer 21 placed on the light-transmitting growth substrate 25 may include a semiconductor doped with n-type impurities and may include an n-type nitride semiconductor layer. The second conductivity-type semiconductor layer 22 may include a semiconductor doped with a p-type impurity and may include a p-type nitride semiconductor layer. However, depending on the embodiment, the first and second conductivity type semiconductor layers 21 and 22 may be stacked with their positions reversed.

The first and second conductivity-type semiconductor layers 21 and 22 have the Al _x In _y Ga _(1-xy) N composition formula (where 0≤x<1, 0≤y<1, 0≤x+y<1 ), and for example, materials such as GaN, AlGaN, InGaN, and AlInGaN may correspond to this.

The active layer 23 disposed between the first and second conductivity-type semiconductor layers 21 and 22 emits light having a predetermined energy by recombination of electrons and holes. The active layer 23 may include a material having an energy band gap smaller than that of the first and second conductivity type semiconductor layers 21 and 22 . For example, when the first and second conductivity-type semiconductor layers 21 and 22 are GaN-based compound semiconductors, the active layer 23 may include an InGaN-based compound semiconductor having an energy band gap smaller than that of GaN. can

In addition, the active layer 23 may have a multiple quantum well (MQW) structure in which quantum well layers and quantum barrier layers are alternately stacked, for example, an InGaN/GaN structure. However, since the active layer 23 is not limited thereto, a single quantum well structure (SQW) may be used.

On the exposed surface of the first conductivity type semiconductor layer 21 where portions of the second conductivity type semiconductor layer 22, the active layer 23, and the first conductivity type semiconductor layer 21 are etched and exposed, a first An electrode 21a may be disposed and connected to the first conductivity type semiconductor layer 21 . A second electrode 22a may be disposed on an upper surface of the second conductivity type semiconductor layer 22 to be connected to the second conductivity type semiconductor layer 22 .

The LED chip 20A shown in FIG. 23B may include a conductive substrate 26 and a light emitting structure disposed on the conductive substrate 26 .

The light emitting structure may include a second conductivity type semiconductor layer 22 , an active layer 23 , and a first conductivity type semiconductor layer 21 . Here, the first and second conductivity types may be n-type and p-type, respectively.

A transparent electrode layer 21b and a first electrode 21a may be disposed on the first conductive semiconductor layer 21 . The transparent electrode layer 21b may be, for example, a transparent conductive oxide such as ITO.

The conductive substrate 26 performs the same function as the second electrode 22a for applying an electrical signal to the second conductive semiconductor layer 22, and is Au, Ni, Al, Cu, W, Si, Se, GaAs. It may be a material containing any one of.

The conductive substrate 26 may be bonded to the second conductive semiconductor layer 22 via a conductive bonding layer 27 .

24 is an exploded perspective view schematically illustrating a bar-type lamp as a lighting device according to an exemplary embodiment.

Referring to FIG. 24 , the lighting device 1000 includes a heat dissipation member 1100, a cover 1200, a fixture 1300, light source modules 1400, a first socket 1510 and a second socket 1520. can do.

A plurality of heat dissipation fins 1110 and 1120 may be formed in a concavo-convex shape on an inner or/or outer surface of the heat dissipation member 1100, and the heat dissipation fins 1110 and 1120 may be designed to have various shapes and intervals. there is.

A protruding support 1130 is formed inside the heat dissipation member 1100 . The fixture 1300 may be fixed to the support 1130 . In this embodiment, the fixture 1300 and the heat dissipation member 1100 are illustrated as being separate components separated from each other, but are not limited thereto. For example, it is also possible for the fixture 1300 to be integral with the heat dissipation member 1100 . Locking protrusions 1140 may be formed at both ends of the heat dissipation member 1100 .

In this embodiment, the fixture 1300 may have a structure substantially corresponding to the fixture 100 of FIG. 1 . Therefore, a detailed description of each component of the fixture 100 may be understood with reference to the previously described embodiment, and a detailed description thereof will be omitted.

A locking groove 1210 is formed in the cover 1200, and the locking protrusion 1140 of the heat dissipation member 1100 can be coupled to the locking groove 1210 in a hook coupling structure. Positions where the catching groove 1210 and the catching protrusion 1140 are formed may be interchanged.

The light source modules 1400 may be detachably coupled to the fixture 1300 . The light source module 1400 may include a substrate 1410 , a plurality of light emitting devices 1420 , and an optical device 1430 .

In this embodiment, the light source module 1400 may have a structure substantially corresponding to the light source modules 200, 300, and 400 of FIGS. 1 to 18. Therefore, a detailed description of each component of the light source module 1400 can be understood with reference to the previously described embodiments, and detailed descriptions thereof will be omitted.

The first and second sockets 1510 and 1520 are a pair of sockets and have a structure coupled to both ends of a cylindrical cover unit composed of the heat dissipation member 1100 and the cover 1200 . For example, the first socket 1510 may include an electrode terminal 1511 and a power supply 1512 , and a dummy terminal 1521 may be disposed on the second socket 1520 .

Meanwhile, an optical sensor and/or a communication module may be mounted in the lighting device 1000 according to the present embodiment.

Such an optical sensor and/or communication module may be mounted together with the light emitting device 1420 on the substrate 1410 of the light source module 1400 . Alternatively, it may be mounted on the fixture 1300 together with the light source module 1400 . Alternatively, an optical sensor and/or a communication module may be embedded in any one of the first and second sockets 1510 and 1520. For example, an optical sensor and/or a communication module may be embedded in the second socket 1520 where the dummy terminal 1521 is disposed.

The lighting device 1000 may implement home-network communication through a communication module. For example, the communication module may be a wireless communication module using Zigbee, WiFi, or LiFi, and the lighting device can be turned on/off through a smart phone or a wireless controller. It is possible to control lighting installed inside and outside the home, such as , brightness control, etc. In addition, by using a Li-Fi communication module using visible light wavelengths of lighting devices installed inside and outside the home, it is possible to control electronic products and automobile systems inside and outside the home, such as TVs, refrigerators, air conditioners, door locks, and automobiles.

In the present invention, an Internet Of Things (IoT) device may include devices that have an accessible wired or wireless interface and communicate with at least one other device through the wired/wireless interface to transmit or receive data. . The accessible interface may be a wired local area network (LAN), a wireless local area network (WLAN) such as Wi-Fi (Wireless Fidelity), or a wireless personal area network (Wireless Personal Area Network) such as Bluetooth. Network; WPAN), wireless USB (Wireless Universal Serial Bus), Zigbee, NFC (Near Field Communication), RFID (Radio-frequency identification), PLC (Power Line communication), or 3G (3rd Generation), 4G (4th Generation) , a modem communication interface accessible to a mobile cellular network such as LTE (Long Term Evolution), and the like. The Bluetooth interface may support Bluetooth Low Energy (BLE).

25 is an indoor lighting control network system that may employ a light source module according to example embodiments.

The network system 2000 according to this embodiment may be a complex smart lighting-network system in which a lighting technology using a semiconductor light emitting device such as an LED, an Internet of Things (IoT) technology, and a wireless communication technology are converged. The network system 2000 may be implemented using various lighting devices and wired/wireless communication devices, and may be implemented by sensors, controllers, communication means, and software for network control and maintenance.

The network system 2000 can be applied not only to closed spaces defined within buildings, such as homes and offices, but also to open spaces such as parks and streets. The network system 2000 may be implemented based on the Internet of Things (IoT) environment so that various information may be collected/processed and provided to users. At this time, the LED lamp 2200 included in the network system 2000 receives information about the surrounding environment from the gateway 2100 to control the lighting of the LED lamp 2200 itself, as well as to control the lighting of the LED lamp 2200. Based on functions such as visible light communication, it may also perform a role such as checking and controlling operating states of other devices 2300 to 2800 included in the IoT environment.

Referring to FIG. 25, a network system 2000 includes a gateway 2100 for processing data transmitted and received according to different communication protocols, and an LED lamp that is communicatively connected to the gateway 2100 and includes an LED as a light source ( 2200), and a plurality of devices 2300 to 2800 connected to communicate with the gateway 2100 according to various wireless communication methods. In order to implement the network system 2000 based on the IoT environment, each of the devices 2300 to 2800 including the LED lamp 2200 may include at least one communication module. In one embodiment, the LED lamp 2200 may be communicatively connected to the gateway 2100 through a wireless communication protocol such as WiFi, Zigbee, or LiFi, and for this purpose, at least one lamp communication module 2210 can have

As described above, the network system 2000 can be applied not only to closed spaces such as homes and offices, but also to open spaces such as streets and parks. When the network system 2000 is applied to a home, a plurality of devices 2300 to 2800 included in the network system 2000 and communicatively connected to the gateway 2100 based on IoT technology include a refrigerator 2320, Home appliances 2300 such as a television 2310, a digital door lock 2400, a garage door lock 2500, a light switch 2600 installed on a wall, etc., a router 2700 for relaying a wireless communication network, and a smart phone, tablet, or laptop A mobile device 2800 such as a computer may be included.

In the network system 2000, the LED lamp 2200 checks the operation status of various devices (2300 to 2800) using a wireless communication network (Zigbee, WiFi, LiFi, etc.) installed in the home, or according to the surrounding environment/circumstances. The intensity of illumination of the LED lamp 2200 itself may be automatically adjusted. In addition, the LED lamp 2200 may control devices 2300 to 2800 included in the network system 2000 using LiFi (LED WiFi) communication using visible light emitted from the LED lamp 2200 .

First of all, the LED lamp 2200 is an LED lamp 2200 based on the surrounding environment transmitted from the gateway 2100 through the lamp communication module 2210 or the surrounding environment information collected from the sensor mounted on the LED lamp 2200. ) can be automatically adjusted. For example, the brightness of the LED lamp 2200 may be automatically adjusted according to the type of program being broadcast on the television 2310 or the brightness of the screen. To this end, the LED lamp 2200 may receive operation information of the television 2310 from the lamp communication module 2210 connected to the gateway 2100 . The lamp communication module 2210 may be integrally modularized with a sensor and/or a controller included in the LED lamp 2200.

For example, if the value of a program aired in a TV program is a human drama, the lighting is lowered to a color temperature of 12,000 K or less (for example, to 6,000 K) according to the preset setting value, and the color is adjusted to create a cozy atmosphere. You can create an atmosphere. Conversely, when the program value is a gag program, the network system 2000 may be configured such that the color temperature is increased to 6,000 K or more and adjusted to blue-based white light according to the set luminance value.

In addition, when a predetermined time elapses after the digital door lock 2400 is locked in a state in which no one is present in the home, all of the turned-on LED lamps 2200 are turned off to prevent power waste. Alternatively, when the security mode is set through the mobile device 2800 or the like, when the digital door lock 2400 is locked when no one is present in the home, the LED lamp 2200 may be maintained in a turned-on state.

The operation of the LED lamp 2200 may be controlled according to the surrounding environment collected through various sensors connected to the network system 2000 . For example, when the network system 2000 is implemented in a building, lighting, a location sensor, and a communication module are combined in the building, and location information of people in the building is collected to turn on or turn off the lights or collect the lights. Information can be provided in real time to enable facility management or efficient use of idle space. In general, since lighting devices such as the LED lamp 2200 are disposed in almost all spaces on each floor in a building, various information within the building is collected through sensors provided integrally with the LED lamp 2200, and this is used for facility management, idle It can be used for space utilization, etc.

On the other hand, the LED lamp 2200 can be used as a device capable of maintaining building security or detecting and responding to an emergency by combining an image sensor, a storage device, and a lamp communication module 2210. For example, when a smoke or temperature sensor is attached to the LED lamp 2200, damage can be minimized by quickly detecting whether or not a fire has occurred. In addition, it is possible to save energy and provide a pleasant lighting environment by adjusting the brightness of lighting in consideration of external weather or amount of sunlight.

26 is an open network system that may employ a light source module according to example embodiments.

Referring to FIG. 26, the network system 2000' according to the present embodiment includes a communication connection device 2100', a plurality of lighting devices (installed at predetermined intervals and connected to communicate with the communication connection device 2100') 2200', 2300'), a server 2400', a computer 2500' for managing the server 2400', a communication base station 2600', a communication network 2700' connecting the devices capable of communication, and a mobile device 2800' and the like.

Each of the plurality of lighting fixtures 2200' and 2300' installed in an open outdoor space such as a street or a park may include a smart engine 2210' and 2310'. The smart engines 2210' and 2310' may include a semiconductor light emitting device for emitting light and a driving driver for driving the semiconductor light emitting device, as well as a sensor for collecting information on a surrounding environment, and a communication module. With the communication module, the smart engines 2210' and 2310' can communicate with other devices around them according to communication protocols such as WiFi, Zigbee, and LiFi.

For example, one smart engine 2210' may be communicatively connected to another smart engine 2310'. At this time, WiFi extension technology (WiFi Mesh) may be applied to communication between the smart engines 2210' and 2310'. At least one smart engine 2210' may be connected to the communication connection device 2100' connected to the communication network 2700' through wired/wireless communication. In order to increase communication efficiency, several smart engines 2210' and 2310' may be grouped and connected to one communication connection device 2100'.

The communication connection device 2100' is an access point (AP) capable of wired/wireless communication, and can mediate communication between the communication network 2700' and other equipment. The communication connection device 2100' may be connected to the communication network 2700' by at least one of a wired/wireless method, and may be mechanically housed in one of the lighting fixtures 2200' and 2300', for example. there is.

The communication connection device 2100' may be connected to the mobile device 2800' through a communication protocol such as WiFi. The user of the mobile device 2800' collects information through a plurality of smart engines 2210' and 2310' through a communication connection device 2100' connected to the smart engine 2210' of the nearby lighting fixtures 2200'. A surrounding environment information may be received. The surrounding environment information may include surrounding traffic information, weather information, and the like. The mobile device 2800' may be connected to the communication network 2700' through a communication base station 2600' through a wireless cellular communication method such as 3G or 4G.

On the other hand, the server 2400' connected to the communication network 2700' receives information collected by the smart engines 2210' and 2310' mounted on the respective lighting fixtures 2200' and 2300', and simultaneously operates each lighting Operation states of the instruments 2200' and 2300' may be monitored. In order to manage each of the lighting fixtures 2200' and 2300' based on the monitoring result of the operating state of each lighting fixture 2200' and 2300', the server 2400' is a computer 2500' providing a management system. can be connected with The computer 2500' may execute software capable of monitoring and managing operating states of the respective lighting devices 2200' and 2300', in particular, the smart engines 2210' and 2310'.

27 is a block diagram illustrating a communication operation between a smart engine of a lighting fixture and a mobile device through visible light wireless communication that may employ a light source module according to example embodiments.

Referring to FIG. 27 , a smart engine 2210' may include a signal processing unit 2211', a control unit 2212', an LED driver 2213', a light source unit 2214', a sensor 2215', and the like. . The mobile device 2800' connected to the smart engine 2210' by visible light wireless communication includes a control unit 2801', a light receiving unit 2802', a signal processing unit 2803', a memory 2804', an input/output unit ( 2805') and the like.

Visible light wireless communication (LiFi) technology is a wireless communication technology that transmits information wirelessly using light in a visible light wavelength band that can be perceived by the human eye. This visible light wireless communication technology is distinguished from conventional wired optical communication technology and infrared wireless communication in that it uses light in the visible light wavelength band, that is, a specific visible light frequency from the light emitting package described in the above embodiment, and in that the communication environment is wireless. It is distinguished from wired optical communication technology. In addition, unlike RF wireless communication, visible light wireless communication technology can be freely used without regulation or permission in terms of frequency use, so it is convenient, has excellent physical security, and has a difference in that the user can visually check the communication link. Rather, it is characterized as a convergence technology that can obtain the original purpose of the light source and communication function at the same time.

The signal processor 2211' of the smart engine 2210' may process data to be transmitted and received through visible light wireless communication. As an embodiment, the signal processing unit 2211' may process information collected by the sensor 2215' into data and transmit it to the control unit 2212'. The controller 2212' can control the operation of the signal processor 2211' and the LED driver 2213', and in particular, the operation of the LED driver 2213' based on data transmitted by the signal processor 2211'. can control. The LED driver 2213' may transmit data to the mobile device 2800' by emitting light from the light source 2214' according to a control signal transmitted from the controller 2212'.

The mobile device 2800' includes a controller 2801', a memory 2804' for storing data, an input/output unit 2805' including a display, a touch screen, an audio output unit, and the like, a signal processing unit 2803', and data processing unit 2803'. may include a light receiving unit 2802' for recognizing visible light. The light receiving unit 2802' can detect visible light and convert it into an electrical signal, and the signal processing unit 2803' can decode data included in the electrical signal converted by the light receiving unit. The control unit 2801' can store the data decoded by the signal processing unit 2803' in the memory 2804' or output it through the input/output unit 2805' so that the user can recognize it.

The above description is only an illustrative example of the technical idea of the present invention, and those skilled in the art will be able to make various modifications and variations without departing from the essential characteristics of the present invention. .

Therefore, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments. The protection scope of the present invention should be construed according to the claims below, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

1, 2, 3... lighting devices
100... Fixtures
110... fastening hole
200, 300, 400... light module
210, 310, 410... fastening pins
220, 320, 420...light emitting element
230, 330, 430... substrate
240, 340... optical element
500... cover

Claims (10)

a fixture having a first hole and a fastening hole including a second hole having a smaller size than the first hole and connected to the first hole;
A plurality of light emitting elements, a substrate on which the plurality of light emitting elements are arranged on a first surface, an electrode pad disposed on a second surface of the substrate opposite to the first surface, and detachably fastened to the fastening hole A light source module having a fastening pin; and
an electrode terminal placed on the fixture;
including,
The light source module is mechanically fixed to the fixture and the electrode terminal as the light source module slides along the surface of the fixture in a structure in which the fastening pin moves from being inserted into the first hole to the second hole. Lighting device characterized in that the electrical connection is implemented by contacting the electrode pad.
According to claim 1,
The light source module further comprises an optical element detachably fastened to the substrate.
According to claim 2,
the optical element is disposed on the first surface of the substrate so as to cover the plurality of light emitting elements;
The lighting device, characterized in that the fastening pin extends from the bottom surface of the optical element toward the substrate.
According to claim 2,
The fastening pin comprises a rod extending from the optical element and a locking protrusion protruding radially from an end of the rod.
According to claim 4,
The rod has a diameter smaller than the sizes of the first hole and the second hole,
The lighting device, characterized in that the locking protrusion has a diameter smaller than the size of the first hole but larger than the size of the second hole.
According to claim 2,
The electrode pads are disposed at both ends of the substrate, respectively.
According to claim 1,
The electrode terminal comprises a body portion detachably attached to the fixture, and a terminal portion partially exposed from the body portion.
According to claim 1,
The electrode terminal includes a pair of contact parts protruding upward from the fixture and having a leaf spring type structure, and a connection part connecting the pair of contact parts.
According to claim 1,
A lighting device further comprising a driving circuit connected to the electrode terminal.
A fixture having a fastening hole;
It includes a plurality of light emitting elements and a substrate on which the plurality of light emitting elements are arranged on a first surface, and the substrate protrudes from a second surface opposite to the first surface and is fastened to the fastening hole in a detachable manner. a light source module having pins and electrode pads disposed on the second surface; and
an electrode terminal placed on the fixture;
including,
In a state where the fastening pin is inserted into the fastening hole, as the substrate slides along the fastening hole on the surface of the fixture, the light source module is mechanically fixed to the fixture and the electrode terminal and the electrode pad contact each other. A lighting device characterized in that the electrical connection is implemented by doing.

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