KR102508582B1 - Substrate integrated waveguide horn antenna - Google Patents

Abstract

A substrate integrated waveguide horn antenna according to various embodiments includes a first surface, a second surface opposite to the first surface, and a thickness portion including a plurality of via holes formed between the first surface and the second surface. a substrate comprising a substrate, a first metal plate located on the first surface and connected to the plurality of via holes, and a plurality of first metal plates arranged on the first surface in a first direction of the substrate from the first metal plate; a first layer including a plurality of first parasitic element disposition structures each including parasitic elements and arranged in a second direction of the substrate intersecting the first direction, and the plurality of vias located on the second surface; a second metal plate connected to the holes, and a plurality of first parasitic elements arranged on the second surface asymmetrically with respect to the substrate in the first direction of the substrate from the second metal plate; and a second layer including a plurality of second parasitic element arrangement structures each including two parasitic elements and arranged in the second direction of the substrate.

Description

Substrate integrated waveguide horn antenna {SUBSTRATE INTEGRATED WAVEGUIDE HORN ANTENNA}

Various embodiments below relate to a substrate-integrated waveguide horn antenna, for example, a substrate-integrated waveguide horn antenna applicable to an ultra-high frequency band (eg, mmWave band) of a next-generation network (eg, 5G network).

A substrate integrated waveguide (SIW) horn antenna is a horn antenna that implements a waveguide on a printed circuit board and uses it. The substrate-integrated waveguide has characteristics of a waveguide and can transfer energy in a manner similar to that of a waveguide through, for example, a plurality of via holes arranged in a row. For example, US Patent Application Publication No. 2020/0287293 discloses a slot array antenna that includes a parasitic feature.

According to various embodiments, an antenna improving a bandwidth of a communication band may be provided.

A substrate integrated waveguide horn antenna according to various embodiments includes a first surface, a second surface opposite to the first surface, and a thickness portion including a plurality of via holes formed between the first surface and the second surface. a substrate comprising a substrate, a first metal plate located on the first surface and connected to the plurality of via holes, and a plurality of first metal plates arranged on the first surface in a first direction of the substrate from the first metal plate; a first layer including a plurality of first parasitic element disposition structures each including parasitic elements and arranged in a second direction of the substrate intersecting the first direction, and the plurality of vias located on the second surface; a second metal plate connected to the holes, and a plurality of first parasitic elements arranged on the second surface asymmetrically with respect to the substrate in the first direction of the substrate from the second metal plate; and a second layer including a plurality of second parasitic element arrangement structures each including two parasitic elements and arranged in the second direction of the substrate.

In an embodiment, at least one first parasitic element among the plurality of first parasitic elements and at least one second parasitic element among the plurality of second parasitic elements may overlap each other when viewed in a thickness direction of the substrate. can

In an embodiment, at least one second parasitic element among the plurality of second parasitic elements may be adjacent to a pair of adjacent first parasitic elements among the plurality of first parasitic elements when viewed in a thickness direction of the substrate. may overlap.

In an embodiment, the substrate-integrated waveguide horn antenna is located on the first surface and covers at least one first parasitic element among the plurality of first parasitic elements of each of the plurality of first parasitic element arrangement structures. a first dielectric configured to cover at least one second parasitic element of each of a plurality of second parasitic elements positioned on the second surface and respectively of the plurality of second parasitic element arrangement structures; can include more.

In one embodiment, the first dielectric and the second dielectric may be positioned asymmetrically with respect to the substrate.

In one embodiment, the first dielectric is configured not to cover a first parasitic element located farthest from the first metal plate among a plurality of first parasitic elements of each of the plurality of first parasitic element arrangement structures, The second dielectric may be configured not to cover a second parasitic element located farthest from the second metal plate among the plurality of second parasitic elements of each of the plurality of second parasitic element arrangement structures.

In an embodiment, the plurality of via holes may include a plurality of first parasitic elements of each of the plurality of first parasitic element arrangement structures and a plurality of second parasitic elements of each of the plurality of second parasitic element arrangement structures. A load pattern having a first size may be formed in a first area of the substrate adjacent to the first area, and a feed pattern having a second size smaller than the first size may be formed in a second area of the substrate opposite to the first area. there is.

In one embodiment, the substrate may further include a waveguide formed on the same plane as the substrate formed in the second region.

In an embodiment, the substrate-integrated waveguide horn antenna may further include a metal cover configured to cover at least a portion of the second region.

In one embodiment, the metal cover, a base plate located on the first surface, a cover plate spaced apart from the first surface, and connecting the base plate and the cover plate and between the base plate and the cover plate It may include a plurality of walls forming a connection space.

A substrate integrated waveguide horn antenna according to various embodiments includes a first surface, a second surface opposite to the first surface, and a thickness portion including a plurality of via holes formed between the first surface and the second surface. a substrate comprising a substrate, a first metal plate located on the first surface and connected to the plurality of via holes, and a plurality of first metal plates arranged on the first surface in a first direction of the substrate from the first metal plate; a first layer comprising parasitic elements, and a second metal plate located on the second side and connected to the plurality of via holes, and from the second metal plate to the substrate in the first direction of the substrate; A second layer including a plurality of first parasitic elements and a plurality of second parasitic elements arranged asymmetrically on the second surface may be included.

In an embodiment, at least one first parasitic element among the plurality of first parasitic elements and at least one second parasitic element among the plurality of second parasitic elements may overlap each other when viewed in a thickness direction of the substrate. can

In an embodiment, at least one second parasitic element among the plurality of second parasitic elements may be adjacent to a pair of adjacent first parasitic elements among the plurality of first parasitic elements when viewed in a thickness direction of the substrate. may overlap.

In an embodiment, the substrate integrated waveguide horn antenna includes a first dielectric positioned on the first surface and configured to cover at least one first parasitic element of the plurality of first parasitic elements, and a first dielectric material on the second surface. It may further include a second dielectric positioned and configured to cover at least one second parasitic element among the plurality of second parasitic elements.

In one embodiment, the first dielectric and the second dielectric may be positioned asymmetrically with respect to the substrate.

In an embodiment, the first dielectric is configured not to cover a first parasitic element located farthest from the first metal plate among the plurality of first parasitic elements, and the second dielectric is configured to cover the plurality of second parasitic elements. Among the elements, the second parasitic element located farthest from the second metal plate may not be covered.

In an embodiment, the plurality of via holes form a load pattern having a first size in a first region of the substrate adjacent to the plurality of first parasitic elements and the plurality of second parasitic elements, and A feed pattern having a second size smaller than the first size may be formed in a second area of the substrate opposite to the first area.

In one embodiment, the substrate may further include a waveguide formed on the same plane as the substrate formed in the second region.

In an embodiment, the substrate-integrated waveguide horn antenna may further include a metal cover configured to cover at least a portion of the second region.

In one embodiment, the metal cover, a base plate located on the first surface, a cover plate spaced apart from the first surface, and connecting the base plate and the cover plate and between the base plate and the cover plate It may include a plurality of walls forming a connection space.

According to various embodiments, an impedance bandwidth may be improved. According to various embodiments, a radiation pattern in one direction (eg, a boresight direction) may be stabilized. Effects of the substrate integrated waveguide horn antenna according to various embodiments are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below.

1 is a perspective view of an antenna according to an embodiment.
2 is a plan view of an antenna according to an exemplary embodiment.
3 is a side view of an antenna according to an embodiment.
4 is a rear view of an antenna according to an exemplary embodiment.
5 is a perspective view of an array antenna according to an exemplary embodiment.
6 is a plan view of an array antenna according to an exemplary embodiment.
7 is a side view of an array antenna according to an exemplary embodiment.
8 is a rear view of an array antenna according to an exemplary embodiment.
9 is a perspective view of an array antenna including a metal cover according to an exemplary embodiment.
10 is a front view of a metal cover according to an embodiment.
11 is a plan view of a metal cover according to an embodiment.
12 is a side view of a metal cover according to an embodiment.
13 is a rear view of a metal cover according to an embodiment.
14 illustrates a voltage standing wave ratio of an antenna including asymmetrically arranged parasitic elements, an antenna including symmetrically arranged parasitic elements, and an antenna not including parasitic elements according to an embodiment. This is a graph comparing VSWR).
15 is a graph comparing voltage standing wave ratios (VSWRs) according to overlap ratios of parasitic elements and dielectrics of antennas according to various embodiments.
16 is a graph comparing radiation efficiencies of antennas according to overlap ratios of parasitic elements and dielectrics of each of the antennas according to various embodiments.
17 is a diagram comparing normalized radiation patterns at about 24 GHz of an antenna including a metal cover and an antenna not including a metal cover according to an embodiment.
18 is a diagram comparing normalized radiation patterns at about 40.5 GHz of an antenna with a metal cover and an antenna without a metal cover according to an embodiment.
19 is a diagram comparing radiation patterns of antennas according to shapes of power feeding structures according to an exemplary embodiment.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. However, since various changes can be made to the embodiments, the scope of the patent application is not limited or limited by these embodiments. It should be understood that all changes, equivalents or substitutes to the embodiments are included within the scope of rights.

Terms used in the examples are used for descriptive purposes only and should not be construed as limiting. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, terms such as "include" or "have" are intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the embodiment belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined in the present application, they should not be interpreted in an ideal or excessively formal meaning. don't

In addition, in the description with reference to the accompanying drawings, the same reference numerals are given to the same components regardless of reference numerals, and overlapping descriptions thereof will be omitted. In describing the embodiment, if it is determined that a detailed description of a related known technology may unnecessarily obscure the subject matter of the embodiment, the detailed description will be omitted.

In addition, in describing the components of the embodiment, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and the nature, order, or order of the corresponding component is not limited by the term. When an element is described as being “connected,” “coupled to,” or “connected” to another element, that element may be directly connected or connected to the other element, but there may be another element between the elements. It should be understood that may be "connected", "coupled" or "connected".

Components included in one embodiment and components having common functions will be described using the same names in other embodiments. Unless stated to the contrary, descriptions described in one embodiment may be applied to other embodiments, and detailed descriptions will be omitted to the extent of overlap.

1 to 4, the antenna 100 according to an embodiment may be configured to operate in an increased communication frequency band (eg, mmWave band). The antenna 100 may include a substrate 110 , a first layer 120 , a second layer 130 , a first dielectric 140 , and a second dielectric 150 .

The substrate 110 includes a first surface 111A (eg, upper surface), a second surface 111B (eg, lower surface) opposite to the first surface 111A, and the first surface 111A and the second surface. It may include a thickness portion (111C) between (111B). In one embodiment, the substrate 110 may include a printed circuit board (PCB).

In one embodiment, the substrate 110 may include a plurality of via holes 112 formed between the first surface 111A and the second surface 111B. A plurality of via holes 112 may be formed in the thickness portion 111C in a thickness direction (eg, +/−Z direction) of the thickness portion 111C.

In one embodiment, the thickness portion 111C of the substrate 110 may have a reduced thickness within a space where the antenna 100 is disposed. For example, the thickness of the thickness portion 111C may have any suitable dimension that does not impair the radiation characteristics of the antenna 100. For example, considering that the characteristic impedance in the feed portion (eg, the second area A2) of the antenna 100 increases as the communication frequency band in which the antenna 100 operates increases, the thickness portion 111C The thickness of can be of any suitable dimension for which antenna 100 does not have a reduced bandwidth.

In one embodiment, the plurality of via holes 112 may form a feed horn pattern. For example, the plurality of via holes 112 have a variable first size D1 (eg, the distance between the pair of via holes 112 facing each other) in the first area A1 of the substrate 110. form a load pattern having a substantially constant second size D2 (eg, a pair of facing via holes 112) in a second area A2 different from the first area A1 of the substrate 110; distance) can be formed. In one embodiment, the first size D1 may be substantially equal to or larger than the second size D2. In an embodiment, the first size D1 and the second size D2 may be smaller than the size of a wavelength of a communication band. In one embodiment, the first area A1 and the second area A2 may be connected. In some embodiments, the first area A1 may be located closer to the center of the substrate 110 than the second area A2. In some embodiments, the second area A2 may be located at or close to the edge of the substrate 110 . In one embodiment, the first size D1 may be a first surface 111A and/or a second surface crossing the thickness direction (eg, +/-Z direction) of the thickness portion 111C of the substrate 110 ( 111B) may be substantially linearly variable in a tangential direction (eg, +/-Y direction). In another embodiment, the first size D1 may have a substantially curved profile. In an embodiment, the second area A2 may include a coplanar waveguide (CPW).

The first layer 120 may be positioned on the first surface 111A of the substrate 110 . The first layer 120 includes a first metal plate 121 located on the first surface 111A, and a first direction (eg, +Y direction) of the substrate 110 from the first metal plate 121. Alternatively, a plurality of (eg, four) first parasitic elements 122, 122A, and 122B spaced apart and arranged on the first surface 111A in a tangential direction of the first surface 111A may be included. The first metal plate 121 may be connected to first ends (eg, upper ends) of each of the plurality of via holes 112 .

In one embodiment, the plurality of first parasitic elements 122, 122A, and 122B may have any suitable shape. For example, the plurality of first parasitic elements 122, 122A, and 122B may be substantially polygonal (eg, quadrangular). In some examples, the plurality of first parasitic elements 122, 122A, and 122B may have substantially the same length, width, and/or height.

In one embodiment, the plurality of first parasitic elements 122, 122A, and 122B may be spaced at substantially equal intervals. In another embodiment, the distance between any one pair of adjacent first parasitic elements 122, 122A, 122B among the plurality of first parasitic elements 122, 122A, 122B is different from that of the pair of adjacent first parasitic elements. It may be different from the interval of (122, 122A, 122B).

The second layer 130 may be positioned on the second surface 111B of the substrate 110 . The second layer 130 includes a second metal plate 131 located on the second surface 111B, and a first direction (eg, +Y direction) of the substrate 110 from the second metal plate 131. Alternatively, a plurality of (eg, three) second parasitic elements 132, 132A, 132B, and 132C spaced apart and arranged on the second surface 111B in a tangential direction of the second surface 111B may be included. . The second metal plate 131 may be connected to a second end (eg, a lower end) opposite to the first end of each of the plurality of via holes 112 .

In one embodiment, the second metal plate 131 at least partially overlaps the first metal plate 121 when viewed in the thickness direction (eg, +/-Z direction) of the thickness portion 111C of the substrate 110. It can be. In some embodiments, the size of the area where the second metal plate 131 covers the second surface 111B (eg, the size of the second area of the second cover area) is such that the first metal plate 121 covers the first surface 111B. It may be substantially equal to or larger than the size of the area covering 111A (eg, the size of the first area of the first cover area). In some embodiments, the first cover area may belong to the second cover area when viewed in a thickness direction (eg, +/-Z direction) of the thickness portion 111C of the substrate 110 .

In one embodiment, the plurality of second parasitic elements 132, 132A, 132B, and 132C may have any suitable shape. For example, the plurality of second parasitic elements 132 may be substantially polygonal (eg, quadrangular). In some examples, the plurality of second parasitic elements 132, 132A, 132B, and 132C may have substantially the same length, width, and/or height.

In one embodiment, the plurality of second parasitic elements 132, 132A, 132B, and 132C may be spaced at substantially equal intervals. In another embodiment, the distance between any one pair of adjacent second parasitic elements 132 among the plurality of second parasitic elements 132, 132A, 132B, and 132C is different from that of a pair of adjacent second parasitic elements 132. , 132A, 132B, 132C) may be different from the interval.

In an embodiment, a first region A1 of the plurality of second parasitic elements 132, 132A, 132B, and 132C is close to the first metal plate 121, for example, the first metal plate 121. Close to , the second parasitic element 132A may have a width and/or length smaller than the width and/or length of the other second parasitic element(s) 132B and 132C. In some embodiments, the second parasitic element 132A close to the first metal plate 121 may be connected to the first metal plate 121 . In some embodiments, the second parasitic element 132A close to the first metal plate 121 may be integrally formed with the first metal plate 121 seamlessly.

In an embodiment, at least one of the plurality of first parasitic elements 122, 122A, and 122B includes at least one first parasitic element 122, 122A, and 122B and a plurality of second parasitic elements 132, 132A, 132B, and 132C. At least one of the second parasitic elements 132 , 132A, 132B, and 132C may overlap each other when viewed in the thickness direction (eg, +/−Z direction) of the thickness portion 111C of the substrate 110 . In some embodiments, at least one first parasitic element 122, 122A, 122B among the plurality of first parasitic elements 122, 122A, 122B is a plurality of second parasitic elements 132, 132A, 132B, 132C Among them, a pair of adjacent second parasitic elements 132, 132A, 132B, and 132C may overlap. In some embodiments, at least one second parasitic element 132, 132A, 132B, 132C among the plurality of second parasitic elements 132, 132A, 132B, 132C is a plurality of first parasitic elements 122, 122A, 122B) may overlap with a pair of adjacent second parasitic elements 122, 122A, and 122B. In some embodiments, the plurality of first parasitic elements 122, 122A, and 122B and the plurality of second parasitic elements 132, 132A, 132B, and 132C may all overlap each other.

The first dielectric 140 may be positioned on the first surface 111A of the substrate 110 . In one embodiment, the first dielectric 140 may be positioned so as not to substantially cover the first metal plate 121 . In another embodiment, the first dielectric 140 may at least partially cover the first metal plate 121 .

In an embodiment, the first dielectric 140 may be positioned to cover at least one of the plurality of first parasitic elements 122 , 122A and 122B. In some embodiments, the first dielectric 140 may be positioned to cover some (eg, three) of the first parasitic elements 122A among the plurality of first parasitic elements 122 , 122A, and 122B. For example, the first dielectric 140 has a ratio of at least a portion of the first surface 111A in regions where the plurality of first parasitic elements 122, 122A, and 122B are located from the first metal plate 121. (e.g., about 25%, about 50%, about 75%, or about 100%). In some examples, the first dielectric 140 covers about 75% to about 75% of the first surface 111A in regions where the plurality of first parasitic elements 122, 122A, and 122B are located from the first metal plate 121. About 78% can be covered. In some embodiments, the first dielectric 140 may include some (eg, three) first parasitic elements 122A close to the first metal plate 121 , for example, close to the first region A1 . ) can be positioned to cover them. For example, the first dielectric 140 covers the first parasitic element 122A(s) closest to the first metal plate 121 and the first parasitic element 122B furthest away from the first metal plate 121. ) may not be covered. In another embodiment, the first dielectric 140 may at least partially cover only the single first parasitic elements 122, 122A, and 122B. In an embodiment, the first dielectric 140 may substantially cover the entire area of the at least one first parasitic element 122 , 122A, or 122B. In another embodiment, the first dielectric 140 may cover a portion of at least one first parasitic element 122 , 122A, or 122B.

In one embodiment, the first dielectric 140 may be formed of a flame retardant material. For example, first dielectric 140 may include a type-4 woven glass-reinforced epoxy laminate used to build up substrate 110 .

In an embodiment, the thickness of the first dielectric 140 may be greater than the thickness of the first metal plate 121 and/or the thickness of the at least one first parasitic element 122 , 122A, or 122B. In another embodiment, the thickness of the first dielectric 140 may be substantially the same as the thickness of the first metal plate 121 and/or the thickness of the at least one first parasitic element 122 , 122A or 122B.

The second dielectric 150 may be positioned on the second surface 111B of the substrate 110 . In one embodiment, the second dielectric 140 may at least partially cover the second metal plate 121 . In another embodiment, the second dielectric 150 may be positioned so as not to substantially cover the second metal plate 131 .

In one embodiment, the second dielectric 150 is positioned to cover at least one second parasitic element 132, 132A, 132B, 132C among the plurality of second parasitic elements 132, 132A, 132B, 132C. can In some embodiments, the second dielectric 150 is positioned to cover some (eg, three) of the second parasitic elements 132A and 132B among the plurality of second parasitic elements 132, 132A, 132B, and 132C. It can be. For example, the second dielectric 150 may include at least a portion of the second surface 111B in regions where the plurality of second parasitic elements 132, 132A, 132B, and 132C are located from the second metal plate 131. A percentage (eg, about 25%, about 50%, about 75%, or about 100%) of the area may be covered. In some examples, the second dielectric 150 extends the second surface 111B from the second metal plate 131 to about 75° in regions where the plurality of second parasitic elements 132, 132A, 132B, and 132C are located. % to about 78%. In some embodiments, the second dielectric 150 may include some (eg, three) second parasitic elements 132A close to the second metal plate 131 , for example, close to the first region A1 . , 132B). For example, the second dielectric 150 covers the second parasitic element 132A, 132B(s) close to the second metal plate 131 and is furthest away from the second metal plate 131. (132C) may not be covered. In another embodiment, the second dielectric 150 may at least partially cover only the single second parasitic elements 132, 132A, 132B, and 132C. In one embodiment, the second dielectric 150 may substantially cover the entire area of the at least one second parasitic element 132, 132A, 132B, or 132C. In another embodiment, the second dielectric 150 may cover a portion of at least one second parasitic element 132, 132A, 132B, or 132C.

In one embodiment, the second dielectric 150 may be formed of a flame retardant material. For example, second dielectric 150 may include a type-4 woven glass-reinforced epoxy laminate used to build up substrate 110 .

In an embodiment, the thickness of the second dielectric 150 may be greater than the thickness of the second metal plate 131 and/or the thickness of the at least one second parasitic element 132 , 132A, 132B, or 132C. In another embodiment, the thickness of the second dielectric 150 may be substantially equal to the thickness of the second metal plate 131 and/or the thickness of the at least one second parasitic element 132, 132A, 132B, 132C. there is.

In one embodiment, the first dielectric 140 and the second dielectric 150 are relative to the substrate 110 when viewed in the thickness direction (eg, +/-Z direction) of the thickness portion 111C of the substrate 110. They may be positioned asymmetrically with each other. In one embodiment, the first dielectric 140 and the second dielectric 150 may at least partially overlap each other when viewed in the thickness direction (eg, +/-Z direction) of the thickness portion 111C of the substrate 110. can In some embodiments, the size of the area where the first dielectric 140 covers the first surface 111A is substantially equal to or larger than the size of the area where the second dielectric 150 covers the second surface 111B. can be big In some embodiments, the area where the second dielectric 150 covers the second surface 111B is the first thickness when viewed in the thickness direction (eg, +/-Z direction) of the thickness portion 111C of the substrate 110. The dielectric 140 may belong to a region covering the first surface 111A.

5 to 8, the antenna 200 (eg, the antenna 100 of FIGS. 1 to 4) according to an embodiment includes a substrate 210 (eg, the substrate 110), a first layer 220 (eg, first layer 120), second layer 230 (eg, second layer 130), first dielectric 240 (eg, first dielectric 140), and It may include 2 dielectrics 250 (eg, the second dielectrics 150).

In one embodiment, the substrate 210 may include a first surface 211A (eg, the first surface 111A), a second surface 211B (eg, the second surface 111B), and a thickness portion 211C. (eg, the thickness portion 111C), and a plurality of via holes 212 (eg, via holes 112). In one embodiment, the plurality of via holes 212 include a plurality of (eg, four) load patterns having variable sizes in the first area A1 of the substrate 210, and the substrate 210 A feed pattern having a substantially constant size may be included in a second area A2 (eg, a connector area) different from the first area A1 of the feed pattern.

In one embodiment, the substrate 210 includes at least one hole H configured to couple with a metal component (eg, the metal cover 360 of FIGS. 8 to 13) in an area adjacent to the second area A2. can include

In one embodiment, the first layer 220 may include a first metal plate 221 (eg, the first metal plate 121 ) and a first direction (eg, +/−X direction) of the substrate 210 . It may include a plurality of first parasitic element disposition structures 222A, 222B, 222C, and 222D arranged spaced apart from each other. The plurality of first parasitic element arrangement structures 222A, 222B, 222C, and 222D are spaced apart from the first metal plate 221 in a second direction (eg, +Y direction) crossing the first direction of the substrate 210, and It may include a plurality of first parasitic elements (eg, first parasitic elements 122, 122A, and 122B) that are arranged. Each of the plurality of first parasitic element arrangement structures 222A, 222B, 222C, and 222D may be positioned to correspond to each of the plurality of load patterns.

In one embodiment, the first layer 220 may include a waveguide 223 on the same plane positioned in the second area A2 of the substrate 210 . The waveguide 223 on the same plane may stabilize an increased impedance bandwidth and/or a radiation pattern in a boresight direction (eg, +Y direction) when power is supplied.

In one embodiment, the second layer 230 includes a second metal plate 231 (eg, the second metal plate 131) and a first direction (eg, +/-X direction) of the substrate 210. A plurality of second parasitic element disposition structures 232A, 232B, 232C, and 232D arranged and spaced apart from each other may be included. The plurality of second parasitic element arrangement structures 232A, 232B, 232C, and 232D are spaced apart from the second metal plate 231 in a second direction (eg, +Y direction) crossing the first direction of the substrate 210, and A plurality of arrayed second parasitic elements (eg, second parasitic elements 132, 132A, 132B, and 132C) may be included. Each of the plurality of second parasitic element arrangement structures 232A, 232B, 232C, and 232D may be positioned to correspond to each of the plurality of load patterns.

9 to 13, the antenna 300 (eg, the antenna 200 of FIGS. 5 to 8) according to an embodiment includes a substrate 310 (eg, the substrate 210), a first layer 320 (eg, first layer 220), second layer 330 (eg, second layer 230), first dielectric 340 (eg, first dielectric 240), second A dielectric 350 (eg, the second dielectric 250) and a metal cover 360 may be included.

The metal cover 360 allows current to flow along a metal wall surface of a connector (not shown) coupled to a power feeding portion (eg, the second area A2 or the connector area of FIGS. 5 to 8 ) on the board 310 . The radiation pattern due to can be made symmetrical when viewed in the boresight direction (eg, +Y direction).

In one embodiment, the metal cover 360 may be configured to at least partially cover at least a portion of the substrate 310 (eg, the second area A2). The metal cover 360 is a base plate 361 located on one surface of the substrate 310 (eg, the first surface 211A), one surface of the substrate 310 and one direction from the base plate 361 (eg, in the +Z direction), a cover plate 362 spaced apart, and a base plate 361 and a cover plate 362 are connected, and together with the base plate 361 and the cover plate 362, the base plate 361 and A plurality of walls 363 forming a connection space S between the cover plates 362 may be included.

In one embodiment, the base plate 361 is connected to a plurality of flanges 361A formed from a plurality of walls 363, and a plurality of flanges 361A and at least partially forms a connection space S. It may include a base portion (361B) to do. In some embodiments, the base portion 361B may extend in one direction (eg, +/−X direction) between the plurality of flanges 361A.

In one embodiment, the base plate 361 includes a plurality of coupling holes configured to couple with a plurality of (eg, two) holes (eg, holes H of FIGS. 5 to 8 ) of the substrate 310 . (361C). A plurality of coupling holes 361C may be formed in each of the plurality of flanges 361A.

In one embodiment, the cover plate 362 may include a flat portion 362A formed to be substantially flat, and an inclined portion 362B inclined with respect to the flat portion 362A. The inclined portion 362B may form a predetermined angle (eg, an acute angle) between the flat portion 362A and the plurality of flanges 361A.

Referring to FIG. 14, an antenna including asymmetrically arranged parasitic elements (eg, the antenna 200 of FIGS. 5 to 8), an antenna including symmetrically arranged parasitic elements, and A result of comparing each voltage standing wave ratio of an antenna not including parasitic elements can be confirmed. It can be seen that the antennas including the parasitic elements exhibit a relatively stable fluctuation width and a low voltage standing wave ratio in the frequency band of about 24 GHz to about 43 GHz, compared to the antennas not including the parasitic elements.

15 and 16, a dielectric covering parasitic elements in antennas (eg, the antenna 100 of FIGS. 1 to 4 and/or the antenna 200 of FIGS. 5 to 8) according to various embodiments Example: It is possible to check the voltage standing wave ratio according to the ratio (eg, length ratio) of the first dielectrics 140 and 240 and/or the second dielectrics 150 and 250. As the length of the dielectric increases, the voltage standing wave ratio, which is a reflection characteristic, tends to decrease, but considering the radiation efficiency of the antenna, it can be confirmed that about 75% is an appropriate voltage standing wave ratio.

Referring to FIG. 17, the E plane at about 24 GHz of an antenna (eg, antenna 300) including a metal cover (eg, metal cover 360) and an antenna not including a metal cover according to an embodiment (e.g. the vertical plane of the substrate) and the H plane (e.g. the horizontal plane of the substrate) normalized radiation patterns can be seen. Referring to FIG. 18, the E plane at about 40.5 GHz of an antenna (eg, antenna 300) including a metal cover (eg, metal cover 360) and an antenna without a metal cover according to an embodiment. and normalized radiation patterns of the H plane. As can be seen through the graphs of FIGS. 17 and 18 , the metal cover can help realize a stabilized radiation pattern in a boresight direction (eg, a frontal direction).

Referring to FIG. 19 , radiation patterns of antennas according to the shape of a power feeding structure can be confirmed. It can be seen that the radiation pattern of an antenna (eg, antenna 200) including a waveguide (CPW) on the same plane according to an embodiment is more stable than that of an antenna including a microstrip line. When using a connector attached to an antenna, if radiation occurs due to current flowing along the wall of the connector, as the frequency increases, the radiation pattern of the E plane of the antenna can be made asymmetric. This can relatively alleviate the asymmetrical radiation pattern.

As described above, although the embodiments have been described with limited drawings, those skilled in the art can apply various technical modifications and variations based on the above. For example, the described techniques may be performed in an order different from the method described, and/or components of the described system, structure, device, circuit, etc. may be combined or combined in a different form than the method described, or other components may be used. Or even if it is replaced or substituted by equivalents, appropriate results can be achieved.

Therefore, other implementations, other embodiments, and equivalents of the claims are within the scope of the following claims.

Claims (20)

a substrate including a first surface, a second surface opposite to the first surface, and a thickness portion including a plurality of via holes formed between the first surface and the second surface;
a first metal plate positioned on the first surface and connected to the plurality of via holes, and a plurality of first parasitic elements arranged on the first surface in a first direction of the substrate from the first metal plate, respectively; a first layer including a plurality of first parasitic element arrangement structures arranged in a second direction of the substrate crossing the first direction; and
a second metal plate located on the second surface and connected to the plurality of via holes, and asymmetrical with respect to the substrate from the second metal plate in the first direction of the substrate to the plurality of first parasitic elements; a second layer including a plurality of second parasitic elements arranged on the second surface of the substrate and including a plurality of second parasitic element arrangement structures arranged in the second direction of the substrate;
A substrate integrated waveguide horn antenna comprising a. According to claim 1,
At least one first parasitic element among the plurality of first parasitic elements and at least one second parasitic element among the plurality of second parasitic elements overlap each other when viewed in a thickness direction of the substrate, and the substrate integrated waveguide horn antenna . According to claim 2,
At least one second parasitic element among the plurality of second parasitic elements overlaps with a pair of adjacent first parasitic elements among the plurality of first parasitic elements when viewed in the thickness direction of the substrate. horn antenna. According to claim 1,
a first dielectric positioned on the first surface and configured to cover at least one first parasitic element of each of a plurality of first parasitic elements of each of the plurality of first parasitic element arrangement structures; and
a second dielectric positioned on the second surface and configured to cover at least one second parasitic element of each of a plurality of second parasitic elements of each of the plurality of second parasitic element arrangement structures;
A substrate integrated waveguide horn antenna further comprising a. According to claim 4,
The first dielectric and the second dielectric are positioned asymmetrically with respect to the substrate. According to claim 4,
The first dielectric is configured not to cover a first parasitic element located farthest from the first metal plate among a plurality of first parasitic elements of each of the plurality of first parasitic element arrangement structures, and the second dielectric comprises A substrate integrated waveguide horn antenna configured not to cover a second parasitic element located furthest from the second metal plate among the plurality of second parasitic elements of each of the plurality of second parasitic element arrangement structures. According to claim 1,
The plurality of via holes may be adjacent to the plurality of first parasitic elements of each of the plurality of first parasitic element arrangement structures and the plurality of second parasitic elements of each of the plurality of second parasitic element arrangement structures. A substrate integrated waveguide horn antenna forming a load pattern having a first size in a first area of a substrate and forming a feed pattern having a second size smaller than the first size in a second area of the substrate opposite to the first area. According to claim 7,
The substrate further includes a waveguide formed on the same plane as the substrate formed in the second region. According to claim 7,
and a metal cover configured to cover at least a portion of the second region. According to claim 9,
The metal cover,
a base plate positioned on the first side;
a cover plate spaced apart from the first surface; and
a plurality of walls connecting the base plate and the cover plate and forming a connection space between the base plate and the cover plate;
A substrate integrated waveguide horn antenna comprising a. a substrate including a first surface, a second surface opposite to the first surface, and a thickness portion including a plurality of via holes formed between the first surface and the second surface;
a first metal plate located on the first surface and connected to the plurality of via holes, and a plurality of first parasitic elements arranged on the first surface in a first direction of the substrate from the first metal plate; a first layer that; and
a second metal plate located on the second surface and connected to the plurality of via holes, and asymmetrical with respect to the substrate from the second metal plate in the first direction of the substrate to the plurality of first parasitic elements; a second layer including a plurality of second parasitic elements arranged on the second surface;
A substrate integrated waveguide horn antenna comprising a. According to claim 11,
At least one first parasitic element among the plurality of first parasitic elements and at least one second parasitic element among the plurality of second parasitic elements overlap each other when viewed in a thickness direction of the substrate, and the substrate integrated waveguide horn antenna . According to claim 12,
At least one second parasitic element among the plurality of second parasitic elements overlaps with a pair of adjacent first parasitic elements among the plurality of first parasitic elements when viewed in the thickness direction of the substrate. horn antenna. According to claim 11,
a first dielectric positioned on the first surface and configured to cover at least one first parasitic element of the plurality of first parasitic elements; and
a second dielectric positioned on the second surface and configured to cover at least one second parasitic element of the plurality of second parasitic elements;
A substrate integrated waveguide horn antenna further comprising a. 15. The method of claim 14,
The first dielectric and the second dielectric are positioned asymmetrically with respect to the substrate. 15. The method of claim 14,
The first dielectric is configured not to cover a first parasitic element located farthest from the first metal plate among the plurality of first parasitic elements, and the second dielectric is configured to cover the first parasitic element among the plurality of second parasitic elements. 2 A substrate integrated waveguide horn antenna configured not to cover the second parasitic element located farthest from the metal plate. According to claim 11,
The plurality of via holes form a load pattern having a first size in a first region of the substrate adjacent to the plurality of first parasitic elements and the plurality of second parasitic elements, and A substrate integrated waveguide horn antenna forming a feed pattern having a second size smaller than the first size in a second region of the substrate. 18. The method of claim 17,
The substrate further includes a waveguide formed on the same plane as the substrate formed in the second region. 18. The method of claim 17,
and a metal cover configured to cover at least a portion of the second region. According to claim 19,
The metal cover,
a base plate positioned on the first side;
a cover plate spaced apart from the first surface; and
a plurality of walls connecting the base plate and the cover plate and forming a connection space between the base plate and the cover plate;
A substrate integrated waveguide horn antenna comprising a.

Images