KR102508399B1 - Electronic control device and its manufacturing method - Google Patents

Abstract

Provided is an electronic control device capable of efficient heat dissipation with a wide heat dissipation area and a manufacturing method thereof.
An electronic control device according to an embodiment of the present invention includes a housing and a printed circuit board inserted through an opening of the housing and coupled to at least one electronic element on a first surface, wherein the housing includes the printed circuit board. It is formed in a direction of a second surface opposite to the first surface of the board, and includes at least one caulking portion that penetrates the printed circuit board and comes into contact with the first surface of the electronic device.

Description

Electronic control device and its manufacturing method {ELECTRONIC CONTROL DEVICE AND ITS MANUFACTURING METHOD}

The present invention relates to an electronic control device and a method for manufacturing the same, and more particularly, to an electronic control device capable of efficiently dissipating heat by increasing a contact area between an electronic element and a housing, and a method for manufacturing the same.

In general, an electronic control device such as an ECU that electronically controls various devices is mounted in a vehicle. These electronic control devices receive information from sensors or switches installed in each part of the vehicle. The electronic control device functions to control the vehicle by processing the information provided in this way, or to perform various electronic controls to improve riding comfort and safety of the vehicle, or to provide various conveniences to the driver and passengers.

For example, electronic control devices, such as ECUs, that control the status of a vehicle's engine, automatic transmission, and ABS (Anti-Lock Brake System) with a computer, along with the development of vehicle and computer performance, control the automatic transmission as well as the drive system, It even plays a role in controlling all parts of the vehicle, such as the braking system and steering system.

An electronic control device such as an ECU includes a case composed of an upper cover and a lower base, a PCB (Printed Circuit Board) accommodated inside the case, and a connector coupled to the front end of the PCB for connection to an external socket. It consists of a structure that includes

The PCB may be assembled by being inserted into a one-piece slot type housing in a slide form.

On the other hand, the electronic control device using the currently widely used slot-type housing cannot dissipate heat over a wide area, and the position of the electronic element generating heat and the size of each electronic element are different for each PCB inserted into the housing. There is a disadvantage that the housing must be separately developed.

Registered Patent Publication No. 10-1575268

An object of the present invention is to provide an electronic control device capable of efficient heat dissipation with a wide heat dissipation area and a method for manufacturing the same.

An electronic control device according to an embodiment of the present invention is characterized in that it includes a housing and a printed circuit board inserted through an opening of the housing and coupled to at least one electronic element on a first surface.

Preferably, the housing is formed in a direction of a second surface opposite to the first surface of the printed circuit board, and includes at least one caulking portion that penetrates the printed circuit board and comes into contact with the first surface of the electronic device. to be characterized

Preferably, the printed circuit board may further include at least one perforated portion formed to pass through the first and second surfaces of the printed circuit board.

Preferably, the electronic element is formed at a position corresponding to at least a part of the perforated part, and coupled to the perforated part in the direction of the first surface of the printed circuit board.

Preferably, the housing is formed on a side of the housing, and includes a pair of substrate support portions supporting the printed circuit board from both sides, and a pair of convex portions connected to the substrate support portion and formed convexly in a vertical direction. and a concave portion formed between the convex portions and facing the second surface of the printed circuit board.

Preferably, the perforated portion is formed at a position corresponding to the concave portion with a predetermined size and spacing.

Preferably, the caulking part is formed on the concave part in the direction of the second surface of the printed circuit board, and is inserted into a perforated part to which the electronic element is coupled, among the perforated parts, to come into contact with the first surface of the electronic element. to be

Preferably, the second surface of the electronic device, which is opposite to the first surface of the electronic device, faces the inner surface of the housing.

A method of manufacturing an electronic control device according to an embodiment of the present invention includes inserting a printed circuit board into a housing of the electronic control device, disposing a jig in the housing, and placing the printed circuit board with respect to the housing. It is characterized in that it comprises the step of selectively performing caulking at a position corresponding to the part where the electronic element is formed.

Preferably, the jig is formed on a body, a lower surface of the body to support the body, and a body support part disposed on the housing so as to face each other with respect to the center of the body and a part inserted into the inside of the body. And, it is formed extending downward of the body, characterized in that it comprises a pin portion disposed between the body support portion.

Preferably, the pin unit has one end connected to a pin accommodating part formed inside the body, coupled between a plurality of pins drawn out from the inside of the body when crimping is performed, and a lower surface of the body and the other end of the pin. And, characterized in that it comprises a pin guide through which the pin passes.

Preferably, the pin is selectively lowered to a position corresponding to a portion where the electronic element is formed with respect to the housing to perform caulking.

Preferably, the pin guide is characterized in that it guides the ascending and descending of the pin during the crimping.

Preferably, the pin unit further includes an elastic member connecting one end of the pin and an inner end of the pin accommodating part, and the elastic member imparts an elastic force to the pin when the pin moves up and down.

According to the present invention, since the caulking part is inserted into the perforated part on the printed circuit board to which the electronic element is coupled and comes into contact with the electronic element, the contact area between the housing and the electronic element can be increased.

Accordingly, since a wide heat dissipation area of the electronic device is formed, heat dissipation from the printed circuit board can be performed more efficiently through the caulking portion formed in the housing.

1 is a diagram showing an electronic control device according to an embodiment of the present invention.
2 is a diagram showing the state of the electronic control device before the coking process.
3 is a view showing a state in which a jig for a caulking process is disposed in an electronic control device.
4 is a diagram illustrating a process of performing a caulking process on an electronic control device.
5 is a diagram showing the state of the electronic control device before and after the caulking process.
6 is a view showing a state in which the caulking part and the electronic element are in contact after the caulking process.
7 is a flowchart illustrating a manufacturing method of an electronic control device according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. First, in adding reference numerals to components of each drawing, it should be noted that the same components have the same numerals as much as possible even if they are displayed on different drawings. In addition, in describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description will be omitted. In addition, although preferred embodiments of the present invention will be described below, the technical idea of the present invention is not limited or limited thereto and can be modified and implemented in various ways by those skilled in the art.

1 is a diagram showing an electronic control device 100 according to an embodiment of the present invention, and FIG. 2 is a diagram showing a state of the electronic control device 100 before a caulking process.

Referring to FIGS. 1 and 2 , an electronic control device 100 according to an embodiment of the present invention includes a housing 10 and a printed circuit board 20 inserted through an opening of the housing 10 .

The housing 10 may be formed by an extrusion or injection process.

In addition, at least one electronic element 24 may be coupled to the first surface (lower surface of the printed circuit board 20) of the printed circuit board 20, and an external electronic device (not shown) may be connected through a connector (not shown). ) to allow the electronic control device 100 to perform various electronic controls. At this time, the electronic element 24 may emit heat to the outside when driven.

Referring to FIG. 2 , the printed circuit board 20 has a first surface of the printed circuit board 20 and a second surface opposite to the first surface of the printed circuit board 20 (upper surface of the printed circuit board 20). It further includes at least one perforated portion 22 formed to penetrate.

The electronic element 24 may be formed at a position corresponding to at least a part of the perforated part 22 . In this case, the first surface of the electronic device 24 may be coupled to the first surface of the printed circuit board 20 .

Preferably, the electronic device 24 may be inserted into and coupled to the perforated part 22 in the direction of the first surface of the printed circuit board 20 .

Meanwhile, the second surface of the electronic element 24 opposite to the first surface of the electronic element 24 may be disposed to face the inner surface of the housing 10 .

Referring to FIGS. 1 and 2 , the housing 10 includes a pair of board support parts 12 formed on the side of the housing 10 and supporting the printed circuit board 20 from both sides, and the board support part 12 A pair of convex portions 14 connected to and formed convexly in the vertical direction, and a concave portion 16 formed concavely between the convex portions 14 and facing the second surface of the printed circuit board 20 includes

At this time, the perforated part 22 may be formed at a position corresponding to the concave part 16 with a certain size and interval.

1 and 2, the housing 10 is formed in the direction of the second surface of the printed circuit board 20, and further includes at least one caulking part 162 in contact with the first surface of the electronic element 24. include Preferably, the caulking part 162 may be formed by a caulking process of the jig 200 to be described later.

In detail, the caulking portion 162 is formed on the concave portion 16 in the direction of the second surface of the printed circuit board 20, and the perforated portion 22 to which the electronic device 24 is coupled among the perforated portions 22 It can be inserted into and come into contact with the first surface of the electronic element 24.

As described above, since the caulking part 162 is inserted into the perforated part 22 to which the electronic element 24 is coupled and comes into contact with the electronic element 24, the contact area between the housing 10 and the electronic element 24 is increased. can

3 is a view showing a state in which the jig 200 for the caulking process is disposed in the electronic control device 100.

Referring to FIGS. 3(a) and 3(b) of FIG. 3 , the jig 200 may be disposed above the housing 10 .

The jig 200 includes a body 210, a body support part 220, and a pin part 230.

The body support 220 is formed on the lower side of the body 210 to support the body 210, and may be disposed on the housing 10 so as to face each other based on the center of the body 210.

Preferably, the body support part 220 may be disposed on the convex part 14 of the housing 10 described above.

The fin unit 230 extends downward from the body 210 and may be disposed between the body support units 220 . Preferably, the pin part 230 may be disposed at a substantially central portion on the lower surface of the body 210 .

In addition, the pin unit 230 includes a plurality of pins 232 that are selectively lowered to a position corresponding to the portion where the electronic element 24 is formed with respect to the housing 10 during caulking to perform caulking.

Preferably, the pin part 230 may perform caulking with respect to the concave part 16 of the housing 10 described above.

At this time, the pin 232 of the pin part 230 may be disposed at a position corresponding to the aforementioned perforated part 22 .

According to the caulking process of the pin part 230, the aforementioned caulking part 162 may be formed on the housing 10 (specifically, the concave part 16) at a position corresponding to the part where the electronic element 24 is formed. .

4 is a diagram showing a process of performing a coking process on the electronic control device 100. At this time, FIG. 4 (a) of FIG. 4 is a diagram showing the state of the electronic control device 100 and the jig 200 before the caulking process, and FIG. 4 (b) of FIG. 4 is the electronic control device 100 after the caulking process. ) and the state of the jig 200.

Referring to FIG. 4 , a portion of the pin unit 230 may be inserted into the body 210 and extended downward of the body 210 .

At this time, one end of the pin 232 of the pin unit 230 is connected to the pin receiving portion 212 formed inside the body 210, and as shown in FIG. 4 (b), the body 210 It can be configured to be withdrawn from the inside of.

Preferably, the pin 232 may ascend or descend under the control of a driving control unit (not shown).

In addition, the pin unit 230 is coupled between the lower surface of the body 210 and the other end of the pin 232, and further includes a pin guide 234 through which the pin passes. At this time, the other end of the pin 232 may be a portion in contact with the concave portion 16 of the housing 10 .

The pin guide 234 is coupled between one end and the other end of the pin 232 to guide the pin 232 to rise and fall stably during crimping.

Meanwhile, the pin unit 230 further includes an elastic member 236 connecting one end of the pin 232 and an inner end of the pin receiving unit 212 .

The elastic member 236 may provide an elastic force to the pin 232 when the pin 232 is moved up and down by controlling the drive controller to move the pin 232 up and down. Preferably, the elastic member 236 may be a spring having an elastic restoring force.

In detail, as shown in FIG. 4 (b), the elastic member 236 is tensioned when the driving control unit controls the pin 232 to descend in the direction of the housing 10 to perform the caulking process. When controlling the elevation of the pin 232 after performing the caulking process on the housing 10, the elevation of the pin 232 can be smoothly performed while returning to the original state.

Referring to the enlarged view of FIG. 4( b ), the pin 232 may descend toward the concave portion 16 of the housing 10 .

Preferably, the above-described driving controller may selectively lower the plurality of pins 232 to a position corresponding to a portion where the electronic element 24 is formed without lowering the entirety of the plurality of pins 232 with respect to the housing 10 .

As such, the selectively lowered pin 232 may press the concave portion 16 formed at a position corresponding to the perforated portion 22 to which the electronic element 24 is coupled among the perforated portions 22 .

Accordingly, as shown in FIG. 4(b), the caulking portion 162 is formed in the direction of the second surface of the printed circuit board 20 on the concave portion 16, and the electronic element 24 of the perforated portion 22 ) may be inserted into the coupled perforated part 22 to come into contact with the first surface of the electronic element 24.

5 is a view showing the state of the electronic control device 100 before and after the caulking process, and FIG. 6 is a view showing a state in which the caulking part 162 and the electronic element 24 are in contact after the caulking process. At this time, FIG. 5 (a) of FIG. 5 is a diagram showing the state of the electronic control device 100 before the caulking process, and FIG. 5 (b) is a diagram showing the state of the electronic control device 100 after the caulking process.

Referring to FIG. 5(b) , the caulking portion 162 may be selectively formed in the concave portion 16 of the housing 10 according to the caulking process using the jig 200 described above.

More specifically, as shown in FIG. 6, the caulking portion 162 is formed on the concave portion 16 in the direction of the second surface of the printed circuit board 20, and the electronic element 24 of the perforated portion 22 may be inserted into the coupled perforated part 22 to come into contact with the first surface of the electronic element 24.

As described above, since the caulking part 162 is inserted into the perforated part 22 to which the electronic element 24 is coupled and comes into contact with the electronic element 24, the contact area between the housing 10 and the electronic element 24 increases. It can be.

Accordingly, since a wide heat dissipation area of the electronic element 24 is formed, heat dissipation from the printed circuit board 20 can be performed more efficiently through the caulking portion formed in the housing.

7 is a flowchart illustrating a manufacturing method of the electronic control device 100 according to an embodiment of the present invention.

Referring to FIG. 7 , first, the printed circuit board 20 is inserted into the housing 10 of the electronic control device 100 (Step S1).

Next, the jig 200 is placed on the housing 10 (Step S2).

After the jig 200 is placed on the housing 10, caulking is selectively performed at a position corresponding to a portion of the printed circuit board 20 where electronic elements are formed with respect to the housing 10 (step S3).

The above description is merely an example of the technical idea of the present invention, and those skilled in the art can make various modifications, changes, and substitutions without departing from the essential characteristics of the present invention. will be. Therefore, the embodiments disclosed in the present invention and the accompanying drawings are not intended to limit the technical idea of the present invention, but to explain, and the scope of the technical idea of the present invention is not limited by these embodiments and the accompanying drawings. . The protection scope of the present invention should be construed according to the claims below, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

100: electronic control device
200: jig
10: housing
162: caulking part
20: printed circuit board
22: punched hole
24: electronic element

Claims (13)

housing 10; and
A printed circuit board 20 inserted through the opening of the housing 10 and coupled to at least one electronic device 24 on a first surface,
The printed circuit board 20 includes at least one perforated portion 22 formed to penetrate the first and second surfaces of the printed circuit board 20,
The housing 10 is formed in the direction of a second surface opposite to the first surface of the printed circuit board 20, and penetrates the perforated portion 22 of the printed circuit board 20 to form the electronic element ( 24) the electronic control device (100) characterized in that it comprises at least one caulking portion (162) in contact with the first surface. delete According to claim 1,
The electronic element 24,
The electronic control device (100), characterized in that formed at a position corresponding to at least a part of the perforated part (22) and coupled to the perforated part (22) in the direction of the first surface of the printed circuit board (20). According to claim 1,
The housing 10,
A pair of board support parts 12 formed on the side of the housing 10 and supporting the printed circuit board 20 from both sides;
A pair of convex portions 14 connected to the substrate support portion 12 and convexly formed in a vertical direction; and
The electronic control device (100) further comprises a concave portion (16) formed concavely between the pair of convex portions (14) and facing the second surface of the printed circuit board (20). According to claim 4,
The perforated part 22,
The electronic control device (100), characterized in that it is formed with a certain size and spacing at a position corresponding to the concave portion (16). According to claim 4,
The caulking part 162,
It is formed on the concave portion 16 in the direction of the second surface of the printed circuit board,
The electronic control device (100), characterized in that inserted into the perforated portion (22) to which the electronic element (24) is coupled, of the perforated part (22) to come into contact with the first surface of the electronic element (24). According to claim 1,
The electronic control device (100), characterized in that the second surface of the electronic element (24) opposite to the first surface of the electronic element (24) faces the inner surface of the housing (10). In the manufacturing method of the electronic control device (100) according to any one of claims 1 and 3 to 7,
inserting the printed circuit board 20 into the housing 10 of the electronic control device 100 (S1);
Placing a jig 200 on the housing 10 (S2); and
A step (S3) of performing caulking on the housing 10 at a position corresponding to the part where the electronic element 24 of the printed circuit board 20 is formed (S3); manufacturing method of an electronic control device comprising a . According to claim 8,
The jig 200,
With the body 210,
A body support part 220 formed on the lower side of the body 210 to support the body 210 and disposed on the housing 10 so as to face each other with respect to the center of the body 210, and
An electronic control device comprising a pin part 230 partially inserted into the body 210, extending downward from the body 210, and disposed between the body support parts 220 manufacturing method. According to claim 9,
The pin part 230,
A plurality of pins 232 having one end connected to the pin accommodating portion 212 formed inside the body 210 and being drawn out from the inside of the body 210 when crimping is performed;
A method of manufacturing an electronic control device comprising a pin guide 234 coupled between the lower surface of the body 210 and the other end of the pin 232 and through which the pin 232 passes. According to claim 10,
The pin 232,
The method of manufacturing an electronic control device, characterized in that the caulking is performed by descending to a position corresponding to the portion where the electronic element 24 is formed with respect to the housing 10. According to claim 10,
The pin guide 234,
Method of manufacturing an electronic control device, characterized in that for guiding the ascending and descending of the pin (232) when the crimping is performed. According to claim 10,
The pin part 230,
Further comprising an elastic member 236 connecting one end of the pin 232 and an inner end of the pin receiving portion 212,
The method of manufacturing an electronic control device, characterized in that the elastic member (236) imparts an elastic force to the pin (232) when the pin (232) moves up and down.

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