KR102501547B1 - laminate - Google Patents

Abstract

Provided is a layered product in which a protective film is bonded to the back surface of a base material of an adhesive film, which is excellent in the effect of suppressing curling and is difficult to cause lifting of the protective film. A laminate according to an embodiment of the present invention is a laminate of five or more layers including a resin film (1), an adhesive layer (1), a resin film (2), an adhesive layer (2), and a resin film (3) in this order. , and the resin film (2) and the pressure-sensitive adhesive layer (2) are directly laminated, and a sample cut out to a size of 50 mm × 150 mm is left for 24 hours in an environment of a temperature of 23 ° C. and a humidity of 50% RH, and then measured. One long side curl value is 2.20 mm or less.

Description

laminate

The present invention relates to a laminate. Preferably, the present invention relates to a laminate suitable for sticking to a foldable member or a rollable member.

BACKGROUND ART Adhesive films are used for reinforcement or surface protection of members of various shapes.

For example, when bonding an integrated circuit (IC) or a flexible printed circuit board (FPC) to a semiconductor element substrate (eg, TFT substrate), thermal compression bonding is usually performed with an anisotropic conductive film (ACF). . When performing such thermal compression bonding, an adhesive film may be previously bonded to the back side of the substrate of the semiconductor element to reinforce (for example, Patent Literature 1).

In addition, as a method for manufacturing a flexible device or a rollable device, which has been developed in recent years, generally, a release layer and a flexible or rollable film substrate are formed on a support substrate such as glass, and a TFT is formed on the film substrate. A substrate, and furthermore, an organic EL layer is formed thereon. And the support substrate is peeled off, and a flexible device and a rollable device are manufactured. However, since the flexible display layer or the rollable display layer is very thin, problems arise in devices due to handling or the like. For this reason, there is a case where an adhesion film is bonded to the back side to reinforce it (for example, Patent Document 2).

Substrates of semiconductor elements, flexible devices, and rollable devices may be repeatedly bent, and if the bending properties of the adhesive film bonded to the back side of the substrate are poor, recovery after bending is deteriorated, or in the worst case, repeated bending There are cases where it is broken or thrown away by . In particular, when the adhesive film is bonded to the movable bend portion, since the bend is frequently repeated, a crease (so-called "mark") is formed in the adhesive film on the movable bend portion.

As a means for suppressing the above fold marks, it is conceivable to use a material having excellent bending resistance for the base material of the adhesive film. For example, the coexistence of high elasticity properties, which are difficult to deform even by stress application/tension, and low tanδ, which is difficult to cause plastic deformation and does not relieve deformation caused by deformation, have an effect on suppression of folds and shape recovery. think it can work. For this reason, it is considered effective to use a material of high elasticity and low tan δ for the base material of the adhesive film in which bending is frequently repeated. However, since such a material has high elasticity and low tan δ, there is a problem that it is easily scratched due to friction or the like during transportation or stacked storage. Such flaws may lead to deterioration in inspectability after bonding to an adherend or poor appearance of the display layer.

In order to prevent scratches on an adhesive film having a base material having excellent bending resistance, a method of bonding a protective film (SPV) to the back surface of the base material can be considered. However, due to the rigidity of the base material of the adhesive film, if the adhesive strength of the adhesive of the SPV is not appropriate, there is a problem that lifting occurs during transportation or handling. In addition, when the rigidity of the protective film is low, there is a problem that it becomes difficult to adjust minute curls and the like that occur during production of an adhesive film having high rigidity. There is a problem with losing.

Japanese Patent No. 5600039 Japanese Patent No. 6376271

An object of the present invention is to provide a layered product in which a protective film is bonded to the back surface of a base material of an adhesive film, which is excellent in the effect of suppressing curling and does not cause lifting of the protective film.

The laminate according to the embodiment of the present invention,

A laminate of five or more layers having a resin film (1), an adhesive layer (1), a resin film (2), an adhesive layer (2), and a resin film (3) in this order,

The resin film (2) and the pressure-sensitive adhesive layer (2) are directly laminated,

The long side curl value measured after leaving a sample cut out to a size of 50 mm x 150 mm in an environment of a temperature of 23 ° C. and a humidity of 50% RH for 24 hours is 2.20 mm or less.

In one embodiment, a laminate composed of a 50 mm × 50 mm resin film (1), an adhesive layer (1), and a resin film (2) is formed in an environment of a temperature of 23 ° C. and a humidity of 50% RH. In the state attached to the central part of the laminate (SPV) composed of the x75 mm pressure-sensitive adhesive layer (2) and the resin film (3), the SPV lifting value when the 3-inch winding core is attached and fixed is 7.0 mm. below

In one embodiment, tanδ (0.7%) of the resin film 2 at a strain of 0.7% measured in a tensile mode of a viscoelasticity measuring device is 0.1 or less.

In one embodiment, the difference between tanδ (0.7%) at a strain of 0.7% and tanδ (0.1%) at a strain of 0.1% measured in the tensile mode of the viscoelasticity measuring device of the resin film (2) ( tanδ(0.7%)-tanδ(0.1%)) is 0.05 or less.

In one embodiment, the Young's modulus of the resin film 2 at a temperature of 23°C is 6.0×10 ⁷ Pa or more.

In one embodiment, the adhesive force (1) to glass in an atmosphere of a temperature of 23 ° C. and a humidity of 50% RH of the pressure-sensitive adhesive layer (1) at a tensile speed of 300 mm / min and a 180-degree peel is The pressure-sensitive adhesive layer (2) is greater than the adhesive strength (2) to glass in an atmosphere of a temperature of 23°C and a humidity of 50% RH at a tensile speed of 300 mm/min and a 180-degree peel.

In one embodiment, the said adhesive force (1) is 1 N/25 mm or more.

In one embodiment, the said adhesive force (2) is less than 1 N/25 mm.

In one embodiment, the pressure-sensitive adhesive layer 1 contains an acrylic pressure-sensitive adhesive.

In one embodiment, the pressure-sensitive adhesive layer 2 contains an acrylic pressure-sensitive adhesive.

In one embodiment, the laminate according to the embodiment of the present invention has a total light transmittance of 20% or more.

In one embodiment, the layered product according to the embodiment of the present invention has a haze of 20% or less.

In one embodiment, the laminate according to the embodiment of the present invention is for sticking to a foldable member.

In one embodiment, the foldable member is an OLED.

In one embodiment, the laminate according to the embodiment of the present invention is for sticking to a rollable member.

In one embodiment, the rollable member is an OLED.

ADVANTAGE OF THE INVENTION According to this invention, the curl suppression effect is excellent, the lift-off of a protective film is hard, and the protective film is bonded to the back surface of the base material of an adhesive film can be provided.

1 is a schematic cross-sectional view of one embodiment of a laminate of the present invention.

When there is an expression "weight" in this specification, you may replace it with "mass" commonly used as an SI system unit which expresses weight.

When there is an expression "(meth)acryl" in this specification, it means "acryl and/or methacryl", and when there is an expression "(meth)acrylate", it means "acrylate and/or methacryl rate", and when there is the expression "(meth) allyl", it means "allyl and/or methallyl", and when there is the expression "(meth)acrolein", it means "acrolein and/or meta Crawlane” means.

≪≪1. Laminate»»

A laminate according to an embodiment of the present invention is a laminate of five or more layers including a resin film (1), an adhesive layer (1), a resin film (2), an adhesive layer (2), and a resin film (3) in this order. , and the resin film 2 and the pressure-sensitive adhesive layer 2 are directly laminated.

The laminate according to the embodiment of the present invention has a resin film (1), an adhesive layer (1), a resin film (2), an adhesive layer (2), and a resin film (3) in this order, and the resin film ( As long as 2) and the pressure-sensitive adhesive layer 2 are directly laminated, any appropriate other layer may be provided within a range not impairing the effect of the present invention.

The number of layers of the laminate according to the embodiment of the present invention is preferably 5 to 10 layers, more preferably 5 to 8 layers, still more preferably 5 to 10 layers, depending on the number of the other layers. It is 7 layers, especially preferably 5 to 6 layers, most preferably 5 layers.

One embodiment of the laminate of the present invention, as shown in Fig. 1, in the laminate 100, a resin film (1) (10), an adhesive layer (1) (20), a resin film (2) ) (30), the pressure-sensitive adhesive layer (2) (40), and the resin film (3) (50) are directly laminated in this order.

In one embodiment of the laminate of the present invention shown in Fig. 1, the laminate portion of the resin film 1, the pressure-sensitive adhesive layer 1, and the resin film 2 is a surface protection film or a reinforcing film. can In this case, the resin film 1 can serve as a separator.

In one embodiment of the laminate of the present invention shown in Fig. 1, the laminate portion of the pressure-sensitive adhesive layer 2 and the resin film 3 may be a carrier sheet. The carrier sheet can also be handled as a surface protection film.

In the laminate according to the embodiment of the present invention, the resin film 1 may have a mold release layer on at least one surface thereof.

In the laminate according to the embodiment of the present invention, the resin film 1 may have an antistatic layer on at least one side thereof.

In the laminate according to the embodiment of the present invention, the resin film 2 may have an antistatic layer on at least one side thereof.

In the laminate according to the embodiment of the present invention, the resin film 3 may have an antistatic layer on at least one side thereof.

In the laminate according to the embodiment of the present invention, the pressure-sensitive adhesive layer 1 may contain a conductive component.

In the laminate according to the embodiment of the present invention, the pressure-sensitive adhesive layer 2 may contain a conductive component.

Since the laminate according to the embodiment of the present invention can express the effect of the present invention, after leaving a sample cut out to a size of 50 mm × 150 mm in an environment of a temperature of 23 ° C. and a humidity of 50% RH for 24 hours, The measured long side curl value is preferably 2.20 mm or less, more preferably 2.00 mm or less, still more preferably 1.80 mm or less, still more preferably 1.60 mm or less, still more preferably 1.40 mm or less. , More preferably 1.20 mm or less, still more preferably 1.00 mm or less, still more preferably 0.80 mm or less, still more preferably 0.60 mm or less, particularly preferably 0.40 mm or less, most preferably It is 0.20 mm or less.

Since the laminate according to the embodiment of the present invention can further express the effect of the present invention, a sample cut out to a size of 50 mm × 150 mm is left for 24 hours in an environment of a temperature of 23 ° C. and a humidity of 50% RH. After that, the long side curl value measured after leaving it to stand for another 1 hour in an environment with a temperature of 80 ° C., returned to an environment with a temperature of 23 ° C. and humidity of 50% RH and left for 1 hour is preferably 3.10 mm or less, more preferably is 2.70 mm or less, more preferably 2.50 mm or less, still more preferably 2.30 mm or less, still more preferably 2.00 mm or less, still more preferably 1.70 mm or less, still more preferably 1.50 mm or less , More preferably, it is 1.30 mm or less, still more preferably 1.00 mm or less, still more preferably 0.70 mm or less, particularly preferably 0.50 mm or less, and most preferably 0.30 mm or less.

Since the laminate according to the embodiment of the present invention can more express the effect of the present invention, a 50 mm × 50 mm resin film (1), an adhesive layer in an environment of a temperature of 23 ° C. and a humidity of 50% RH. (1), the laminate made of the resin film (2) is affixed to the center of the laminate (SPV) made of the adhesive layer (2) and the resin film (3) of 150 mm × 75 mm, 3 inches The SPV lift value when fixed along the winding core is preferably 7.0 mm or less, more preferably 5.0 mm or less, still more preferably 4.0 mm or less, and particularly preferably 3.0 mm or less. , most preferably 2.5 mm or less.

In the laminate according to the embodiment of the present invention, tanδ (0.7%) of the resin film 2 at a strain of 0.7% measured in the tensile mode of a viscoelasticity measuring device is preferably 0.1 or less, more preferably is 0.09 or less, more preferably 0.08 or less, particularly preferably 0.07 or less, and most preferably 0.06 or less. When the tanδ (0.7%) of the resin film 2 at a strain of 0.7% measured in the tension mode of the viscoelasticity measuring device is within the above range, the effect of the present invention can be more expressed.

Tan δ (0.7%) at a strain of 0.7% measured in the tension mode of the viscoelasticity measuring device of the resin film 2 is an index showing the loss tangent when the resin film 2 is greatly bent. In completing the present invention, it was discovered based on various experimental data that the effect of the present invention could be more expressed if this value was within the above range. A method for measuring tan δ (0.7%) at a strain of 0.7% measured in the tensile mode of a viscoelasticity measuring device will be described in detail later.

In the laminate according to the embodiment of the present invention, tanδ (0.1%) of the resin film 2 at a strain of 0.1% measured in the tensile mode of a viscoelasticity measuring device is preferably 0.1 or less, more preferably is 0.08 or less, more preferably 0.06 or less, particularly preferably 0.05 or less, and most preferably 0.04 or less. When the tan δ (0.1%) of the resin film 2 at a strain of 0.1% measured in the tensile mode of the viscoelasticity measuring device is within the above range, the effect of the present invention can be more expressed.

Tan δ (0.1%) at a strain of 0.1% measured in the tension mode of the viscoelasticity measuring device of the resin film 2 is an index showing the loss tangent when the resin film 2 is bent small. In completing the present invention, it was discovered based on various experimental data that the effect of the present invention could be more expressed if this value was within the above range. A method for measuring tan δ (0.1%) at a strain of 0.1% measured in the tensile mode of a viscoelasticity measuring device will be described in detail later.

In the laminate according to the embodiment of the present invention, tanδ (0.7%) at a strain rate of 0.7% and tanδ (0.1%) at a strain rate of 0.1% measured in the tensile mode of a viscoelasticity measuring device of the resin film (2). The difference (tanδ(0.7%)-tanδ(0.1%)) is preferably 0.05 or less, more preferably 0.04 or less, still more preferably 0.03 or less, particularly preferably 0.02 or less, and most preferably It is preferably less than 0.01. The difference between tanδ (0.7%) at a strain of 0.7% and tanδ (0.1%) at a strain of 0.1% (tanδ (0.7%) -tanδ ( 0.1%)) is within the above range, the effect of the present invention can be more expressed.

The difference between tanδ (0.7%) at a strain of 0.7% and tanδ (0.1%) at a strain of 0.1% (tanδ (0.7%) -tanδ ( 0.1%)) is an index showing the difference between the loss tangent when the resin film 2 is greatly bent and the loss tangent when the resin film 2 is bent small. In completing the present invention, it was found based on various experimental data that the effect of the present invention can be more expressed when this value is within the above range.

In the laminate according to the embodiment of the present invention, the Young's modulus of the resin film 2 at a temperature of 23°C is preferably 6.0 × 10 ⁷ Pa or more, more preferably 1.0 × 10 ⁸ Pa to 1.0 × 10 ¹¹ Pa, more preferably 1.0 × 10 ⁹ Pa to 1.0 × 10 ¹⁰ Pa, particularly preferably 1.5 × 10 ⁹ Pa to 9.0 × 10 ⁹ Pa, most preferably 2.0 × 10 ⁹ Pa to 8.0 ×10 ⁹ Pa. When the Young's modulus of the resin film 2 at a temperature of 23°C is within the above range, the effect of the present invention can be more expressed.

In the laminate according to the embodiment of the present invention, the adhesive force of the pressure-sensitive adhesive layer (1) to glass in an atmosphere of a temperature of 23 ° C. and a humidity of 50% RH at a tensile speed of 300 mm / min and a 180-degree peel (1) This is preferably greater than the adhesive strength (2) of the pressure-sensitive adhesive layer (2) to glass in an atmosphere of a temperature of 23°C and a humidity of 50% RH at a tensile speed of 300 mm/min and a 180-degree peel. That is, it is preferable that adhesive force (1)>adhesive force (2). When adhesive force (1)>adhesive force (2), the effect of the present invention can be more expressed. A method for measuring the adhesive force will be described later.

Since the laminate according to the embodiment of the present invention can further express the effect of the present invention, the pressure-sensitive adhesive layer 1 has a tensile speed of 300 mm/min in an atmosphere of a temperature of 23 ° C. and a humidity of 50% RH, Adhesion to glass (1) at 180 degree peel is preferably 1 N/25 mm or more, more preferably 2 N/25 mm to 40 N/25 mm, still more preferably 5 N/25 mm to 30 N /25 mm, particularly preferably 8 N/25 mm to 25 N/25 mm, most preferably 8 N/25 mm to 20 N/25 mm.

Since the laminate according to the embodiment of the present invention can further express the effect of the present invention, the pressure-sensitive adhesive layer 2 has a tensile speed of 300 mm/min in an atmosphere of a temperature of 23° C. and a humidity of 50% RH; The adhesive force (2) to glass at 180 degree peel is preferably less than 1 N/25 mm, more preferably 0.02 N/25 mm to 0.50 N/25 mm, still more preferably 0.02 N/25 mm to 0.10 N/25 mm, particularly preferably 0.03 N/25 mm to 0.08 N/25 mm, and most preferably 0.04 N/25 mm to 0.08 N/25 mm.

The laminate according to the embodiment of the present invention has a total light transmittance of preferably 20% or more, more preferably 30% to 100%, still more preferably 50% to 100%, particularly preferably 83% to 100%, most preferably 85% to 100%. A method for measuring the total light transmittance will be described later.

The laminate according to the embodiment of the present invention has a haze of preferably 20% or less, more preferably 0% to 20%, still more preferably 0% to 15%, and particularly preferably 0%. to 12%, most preferably 0% to 10%. A method for measuring the haze will be described later.

The laminate according to the embodiment of the present invention can be employed for various uses. From the viewpoint of being able to utilize the effect of the present invention more effectively, the laminate according to the embodiment of the present invention is preferably for sticking to a foldable member or a rollable member. In this case, a typical example of a foldable member or a rollable member is an OLED.

≪1-1. Resin film (1)≫

The resin film 1 is typically used as a separator.

The thickness of the resin film 1 is preferably 1 µm to 300 µm, more preferably 10 µm to 200 µm, still more preferably 20 µm to 300 µm, from the viewpoint of enabling the effects of the present invention to be more expressed. 150 μm, more preferably 35 μm to 100 μm, particularly preferably 50 μm to 80 μm, and most preferably 55 μm to 80 μm. When the thickness of the resin film 1 is too small compared with the said range, there exists a possibility that the curl suppression effect may fall. If the thickness of the resin film 1 is too large compared to the above range, there is a possibility that the protective film may be easily lifted during bending.

The resin film 1 contains the resin base film 1a.

Examples of the resin base film 1a include plastic films made of polyester resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT); Plastics composed of olefinic resins containing α-olefins as monomer components, such as polyethylene (PE), polypropylene (PP), polymethylpentene (PMP), ethylene-propylene copolymer, and ethylene-vinyl acetate copolymer (EVA) film; A plastic film made of polyvinyl chloride (PVC); plastic film composed of vinyl acetate-based resin; plastic film composed of polycarbonate (PC); A plastic film composed of polyphenylene sulfide (PPS); plastic films composed of amide-based resins such as polyamide (nylon) and wholly aromatic polyamide (aramid); plastic film composed of polyimide-based resin; a plastic film composed of polyetheretherketone (PEEK); plastic films made of olefinic resins such as polyethylene (PE) and polypropylene (PP); Fluorine-based resins such as polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, chlorofluoroethylene-vinylidene fluoride copolymer, etc. The plastic film etc. which are comprised are mentioned.

The resin base film 1a may have only one layer or may have two or more layers. The resin base film 1a may be stretched.

The resin base film 1a may be subjected to surface treatment. Examples of the surface treatment include corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, ionizing radiation treatment, coating treatment with a primer, and the like.

Arbitrary suitable additives may be contained in the resin base film 1a within the range which does not impair the effect of this invention.

The resin film 1 may have a mold release layer 1b in order to enhance the peelability from the pressure-sensitive adhesive layer 1. When the resin film 1 has the release layer 1b, the side of the release layer 1b is directly laminated on the pressure-sensitive adhesive layer 1.

As the material for forming the release layer 1b, any suitable material can be employed within a range not impairing the effects of the present invention. Examples of such a forming material include silicone type release agents, fluorine type release agents, long-chain alkyl type release agents, fatty acid amide type release agents and the like. Among these, a silicone type release agent is preferable. The release layer 1b can be formed as a coating layer.

As the thickness of the release layer 1b, any appropriate thickness can be employed depending on the purpose within a range that does not impair the effects of the present invention. Such a thickness is preferably 10 nm to 2000 nm, more preferably 10 nm to 1500 nm, even more preferably 10 nm to 1000 nm, and particularly preferably 10 nm to 500 nm.

The release layer 1b may have only one layer or may have two or more layers.

As a silicone type release layer, addition reaction type silicone resin is mentioned, for example. Specific examples of the addition reaction type silicone resin include KS-774, KS-775, KS-778, KS-779H, KS-847H, and KS-847T manufactured by Shin-Etsu Chemical Co., Ltd.; TPR-6700, TPR-6710, TPR-6721 manufactured by Toshiba Silicon Co., Ltd.; SD7220 by Toray Dow Corning, SD7226, etc. are mentioned. The application amount of the silicone-based release layer (after drying) is preferably 0.01 g/m 2 to 2 g/m 2 , more preferably 0.01 g/m 2 to 1 g/m 2 , still more preferably 0.01 g/m 2 to 0.5 g/m 2 . m².

Formation of the release layer 1b is usually carried out at about 120 to 200° C. after applying, for example, the above forming material on any appropriate layer by a conventionally known coating method such as reverse gravure coating, bar coating, die coating, or the like. It can be performed by hardening by performing heat treatment in Moreover, you may use together heat treatment and active energy ray irradiation, such as ultraviolet irradiation, as needed.

The resin film 1 may have an antistatic layer 1c.

As the thickness of the antistatic layer 1c, any suitable thickness can be employed within a range that does not impair the effects of the present invention. Such a thickness is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, still more preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm.

The antistatic layer 1c may have only one layer or two or more layers.

As the antistatic layer 1c, any appropriate antistatic layer can be employed as long as it can exhibit an antistatic effect within a range not impairing the effects of the present invention. As such an antistatic layer, it is preferably an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on an arbitrary suitable substrate layer. Specifically, it is an antistatic layer formed by coating, for example, a conductive coating liquid containing a conductive polymer on the resin base film 1a. As a specific coating method, a roll coating method, a bar coating method, a gravure coating method, etc. are mentioned.

As the conductive polymer, any suitable conductive polymer can be employed within a range not impairing the effects of the present invention. Examples of such a conductive polymer include a conductive polymer obtained by doping a π-conjugated conductive polymer with a polyvalent anion. Examples of the π-conjugated conductive polymer include chain-shaped conductive polymers such as polythiophene, polypyrrole, polyaniline, and polyacetylene. Examples of the polyvalent anion include polystyrene sulfonic acid, polyisoprene sulfonic acid, polyvinyl sulfonic acid, polyallyl sulfonic acid, ethyl polyacrylate sulfonic acid, and polymethacryl carboxylic acid. 1 type of conductive polymer may be sufficient as it, and 2 or more types may be sufficient as it.

One embodiment of the resin film 1 includes the resin base film 1a and the release layer 1b in this order. Typically, this embodiment consists of the resin base film 1a and the release layer 1b.

One embodiment of the resin film 1 includes the resin base film 1a, the antistatic layer 1c, and the release layer 1b in this order. Typically, this embodiment consists of the resin base film 1a, the antistatic layer 1c, and the release layer 1b.

Another embodiment of the resin film 1 includes an antistatic layer 1c, a resin base film 1a, an antistatic layer 1c, and a release layer 1b in this order. Typically, this embodiment consists of an antistatic layer (1c), a resin base film (1a), an antistatic layer (1c), and a release layer (1b).

«1-2. Adhesive layer (1)≫

Any suitable pressure-sensitive adhesive layer can be employed for the pressure-sensitive adhesive layer 1 within a range not impairing the effects of the present invention. The pressure-sensitive adhesive layer 1 may have only one layer or may have two or more layers.

The thickness of the pressure-sensitive adhesive layer 1 is preferably 0.5 μm to 150 μm, more preferably 1 μm to 100 μm, still more preferably 3 μm to 150 μm, from the viewpoint of enabling the effect of the present invention to be more expressed. 80 μm, particularly preferably 5 μm to 50 μm, and most preferably 5 μm to 30 μm.

The pressure-sensitive adhesive layer 1 is preferably composed of at least one type selected from the group consisting of acrylic pressure-sensitive adhesives, urethane-based pressure-sensitive adhesives, rubber-based pressure-sensitive adhesives, and silicone pressure-sensitive adhesives. The pressure-sensitive adhesive layer 1 is more preferably an acrylic pressure-sensitive adhesive from the viewpoint of enabling the effect of the present invention to be more expressed.

The pressure-sensitive adhesive layer 1 can be formed by any suitable method. As such a method, for example, a pressure-sensitive adhesive composition (at least one selected from the group consisting of an acrylic pressure-sensitive adhesive composition, a urethane-based pressure-sensitive adhesive composition, a rubber-based pressure-sensitive adhesive composition, and a silicone-based pressure-sensitive adhesive composition) is mixed with any suitable substrate (for example, a resin film ( 2)) Applying on top, heating and drying as needed, and making it harden as needed, and the method of forming the adhesive layer on the said base material is mentioned. As such a coating method, for example, gravure roll coater, reverse roll coater, kiss roll coater, dip roll coater, bar coater, knife coater, air knife coater, spray coater, comma coater, direct coater, roll blush coater, etc. way can be

The pressure-sensitive adhesive layer 1 may contain a conductive component. 1 type of conductive component may be sufficient as it, and 2 or more types may be sufficient as it.

<1-2-1. Acrylic adhesive>

The acrylic pressure-sensitive adhesive is formed from the acrylic pressure-sensitive adhesive composition (1).

The acrylic adhesive composition (1) contains an acrylic polymer.

The acrylic polymer may be referred to as a so-called base polymer in the field of acrylic pressure sensitive adhesives. One type of acrylic polymer may be sufficient as it, and two or more types may be sufficient as it.

The content ratio of the acrylic polymer in the acrylic pressure-sensitive adhesive composition (1) is, in terms of solid content, preferably 60% by weight to 99.9% by weight, more preferably 65% by weight to 99.9% by weight, still more preferably 70% by weight. to 99.9 wt%, particularly preferably 75 wt% to 99.9 wt%, and most preferably 80 wt% to 99.9 wt%.

As the acrylic polymer, any appropriate acrylic polymer can be employed within a range not impairing the effects of the present invention.

The weight average molecular weight of the acrylic polymer is preferably 300,000 to 2.5 million, more preferably 350,000 to 2,000,000, still more preferably 400,000 to 180, from the viewpoint of enabling the effect of the present invention to be more expressed. 10,000, and particularly preferably 500,000 to 1,500,000.

The acrylic pressure-sensitive adhesive composition (1) may contain a crosslinking agent. By using a crosslinking agent, the cohesive force of the acrylic pressure-sensitive adhesive can be improved, and the effect of the present invention can be more expressed. 1 type of crosslinking agent may be sufficient as it, and 2 or more types may be sufficient as it.

Examples of the crosslinking agent include a polyfunctional isocyanate crosslinking agent, an epoxy crosslinking agent, a melamine crosslinking agent, a peroxide crosslinking agent, a urea crosslinking agent, a metal alkoxide crosslinking agent, a metal chelate crosslinking agent, a metal salt crosslinking agent, a carbodiimide crosslinking agent, and an oxazoline crosslinking agent. , an aziridine-based crosslinking agent, an amine-based crosslinking agent, and the like. Among these, it is preferably at least one kind (component c) selected from the group consisting of a polyfunctional isocyanate-based crosslinking agent and an epoxy-based crosslinking agent from the viewpoint of being able to express the effect of the present invention more.

Examples of the polyfunctional isocyanate-based crosslinking agent include lower aliphatic polyisocyanates such as 1,2-ethylene diisocyanate, 1,4-butylene diisocyanate, and 1,6-hexamethylene diisocyanate; alicyclic polyisocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate, isophorone diisocyanate, hydrogenated tolylene diisocyanate, and hydrogenated xylene diisocyanate; and aromatic polyisocyanates such as 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, and xylylene diisocyanate. As the polyfunctional isocyanate-based crosslinking agent, for example, trimethylolpropane/tolylene diisocyanate adduct (manufactured by Nippon Polyurethane Kogyo Co., Ltd., trade name "Coronate L"), trimethylolpropane/hexamethylene diisocyanate adduct (Nippon Polyurethane Kogyo Co., Ltd.) Manufactured by Urethane Kogyo Co., Ltd., trade name "Coronate HL"), trade name "Coronate HX" (Nippon Polyurethane Kogyo Co., Ltd.), trimethylolpropane/xylylenediisocyanate adduct (manufactured by Mitsui Chemicals Co., Ltd., Commercial items, such as a brand name "Takenate 110N"), are also mentioned.

Examples of the epoxy-based crosslinking agent (polyfunctional epoxy compound) include N,N,N',N'-tetraglycidyl-m-xylenediamine, diglycidylaniline, and 1,3-bis(N,N- Diglycidylaminomethyl) cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol di Glycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan polyglycidyl Dyl ether, trimethylolpropane polyglycidyl ether, adipic acid diglycidyl ester, o-phthalic acid diglycidyl ester, triglycidyl-tris (2-hydroxyethyl) isocyanurate, resorcin diglycidyl In addition to cydyl ether and bisphenol-S-diglycidyl ether, epoxy resins having two or more epoxy groups in the molecule may be used. As an epoxy-type crosslinking agent, commercial items, such as a brand name "Tetrade C" (made by Mitsubishi Gas Chemical Co., Ltd.), are also mentioned.

Arbitrary suitable content can be employ|adopted for content of the crosslinking agent in acrylic adhesive composition (1) in the range which does not impair the effect of this invention. As such a content, it is preferably 30 parts by weight or less, and more preferably 0.05 parts by weight to 0.05 parts by weight to the solid content (100 parts by weight) of the acrylic polymer, for example, from the point where the effects of the present invention can be more expressed. 20 parts by weight, more preferably 0.1 part by weight to 18 parts by weight, particularly preferably 0.5 part by weight to 15 parts by weight, and most preferably 0.5 part by weight to 10 parts by weight.

The acrylic pressure-sensitive adhesive composition (1) may contain any suitable other components within a range not impairing the effects of the present invention. Examples of such other components include polymer components other than acrylic polymers, crosslinking accelerators, crosslinking catalysts, silane coupling agents, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), antioxidants, and inorganic fillers. , organic filler, metal powder, colorant (pigment or dye, etc.), thin material, ultraviolet absorber, antioxidant, light stabilizer, chain transfer agent, plasticizer, softener, surfactant, antistatic agent, conductive agent, stabilizer, surface lubricant, leveling agent , corrosion inhibitors, heat-resistant stabilizers, polymerization inhibitors, lubricants, solvents, catalysts and the like.

[1-2-1-1. Preferred Embodiment (1) of Acrylic Polymer]

As a preferable embodiment (1) of the acrylic polymer, from the point where the effect of the present invention can be more expressed, preferably (a component) a (meth)acrylic acid alkyl ester having 4 to 12 carbon atoms in the alkyl ester portion of the alkyl group, ( Component b) An acrylic polymer (A) formed by polymerization from a composition (A) containing at least one selected from the group consisting of (meth)acrylic acid esters and (meth)acrylic acids having an OH group.

As the acrylic polymer (A), from the point where the effect of the present invention can be further expressed, preferably (meth)acrylic acid alkyl ester having 4 to 12 carbon atoms in the alkyl group of the alkyl ester moiety as (a component), ( As component b), it is an acrylic polymer (A) formed by polymerization from the composition (A) containing (meth)acrylic acid without containing (meth)acrylic acid ester having an OH group, more preferably, (component a) ), a (meth)acrylic acid alkyl ester having 4 to 8 carbon atoms in the alkyl group of the alkyl ester moiety, and a composition (A) containing acrylic acid without containing (meth)acrylic acid ester having an OH group as (b component) It is an acrylic polymer (A) formed by polymerization.

(component a) and (component b) may be each independently of one type or two or more types.

Examples of (meth)acrylic acid alkyl esters (component a) having 4 to 12 carbon atoms in the alkyl group of the alkyl ester moiety include n-butyl (meth)acrylate, isobutyl (meth)acrylate, s-butyl (meth)acrylate, ( t-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, (meth) nonyl acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, and the like. Among these, n-butyl (meth)acrylate and 2-ethylhexyl (meth)acrylate are preferred, and n-butyl acrylate and 2-ethylhexyl (meth)acrylate are more preferred, from the viewpoint of enabling the effect of the present invention to be more expressed. It is ethylhexyl.

As at least one kind (component b) selected from the group consisting of (meth)acrylic acid esters and (meth)acrylic acid having an OH group, for example, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, (meth) (meth)acrylic acid esters having an OH group such as hydroxybutyl acrylate, (meth)acrylic acid, and the like are exemplified. Among these, hydroxyethyl (meth)acrylate and (meth)acrylic acid are preferred, and hydroxyethyl acrylate and acrylic acid are more preferred, from the viewpoint of enabling the effect of the present invention to be more expressed.

Composition (A) may contain a copolymerizable monomer other than (a) component and (b) component. 1 type may be sufficient as a copolymerizable monomer, and 2 or more types may be sufficient as it. Examples of such a copolymerizable monomer include (meth)acrylic acid alkyl esters having 1 to 3 carbon atoms in the alkyl group of the alkyl ester moiety; Carboxyl group-containing monomers such as itaconic acid, maleic acid, fumaric acid, crotonic acid, isocrotonic acid, and acid anhydrides thereof (eg, acid anhydride group-containing monomers such as maleic anhydride and itaconic anhydride) (with the exception of (meth)) except for acrylic acid); (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N-methylol(meth)acrylamide, N-methoxymethyl(meth)acrylamide, N-butoxymethyl(meth)acrylamide, N - Amide group-containing monomers such as hydroxyethyl (meth)acrylamide; amino group-containing monomers such as aminoethyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, and t-butylaminoethyl (meth)acrylate; epoxy group-containing monomers such as glycidyl (meth)acrylate and methylglycidyl (meth)acrylate; cyano group-containing monomers such as acrylonitrile and methacrylonitrile; N-vinyl-2-pyrrolidone, (meth)acryloylmorpholine, N-vinylpiperidone, N-vinylpiperazine, N-vinylpyrrole, N-vinylimidazole, vinylpyridine, vinylpyrimidine, heterocycle-containing vinyl monomers such as vinyloxazole; sulfonic acid group-containing monomers such as sodium vinyl sulfonate; phosphoric acid group-containing monomers such as 2-hydroxyethyl acryloyl phosphate; imide group-containing monomers such as cyclohexyl maleimide and isopropyl maleimide; isocyanate group-containing monomers such as 2-methacryloyloxyethyl isocyanate; (meth)acrylic acid esters having alicyclic hydrocarbon groups such as cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, and isobornyl (meth)acrylate; (meth)acrylic acid esters having aromatic hydrocarbon groups such as phenyl (meth)acrylate, phenoxyethyl (meth)acrylate, and benzyl (meth)acrylate; vinyl esters such as vinyl acetate and vinyl propionate; aromatic vinyl compounds such as styrene and vinyltoluene; olefins and dienes such as ethylene, butadiene, isoprene, and isobutylene; vinyl ethers such as vinyl alkyl ether; Vinyl chloride etc. are mentioned.

As the copolymerizable monomer, a polyfunctional monomer can also be employed. A polyfunctional monomer refers to a monomer having two or more ethylenically unsaturated groups in one molecule. As the ethylenically unsaturated group, any suitable ethylenically unsaturated group can be employed within a range not impairing the effects of the present invention. As such an ethylenically unsaturated group, radical polymerizable functional groups, such as a vinyl group, a propenyl group, an isopropenyl group, a vinyl ether group (vinyloxy group), and an allyl ether group (allyloxy group), are mentioned, for example. As a polyfunctional monomer, for example, hexanediol di(meth)acrylate, butanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neo Pentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, trimethylolpropane tri(meth)acrylate, Tetramethylolmethanetri(meth)acrylate, allyl(meth)acrylate, vinyl(meth)acrylate, divinylbenzene, epoxy acrylate, polyester acrylate, urethane acrylate, etc. are mentioned. 1 type may be sufficient as such a polyfunctional monomer, and 2 or more types may be sufficient as it.

As the copolymerizable monomer, (meth)acrylic acid alkoxyalkyl esters can also be employed. Examples of (meth)acrylic acid alkoxyalkyl esters include 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, methoxytriethylene glycol (meth)acrylate, and 3-methoxy (meth)acrylate. Propyl, (meth)acrylate 3-ethoxypropyl, (meth)acrylate 4-methoxybutyl, (meth)acrylate 4-ethoxybutyl, etc. are mentioned. (meth)acrylic-acid alkoxyalkyl ester may be 1 type or 2 or more types may be sufficient as it.

The content of the (meth)acrylic acid alkyl ester (component a) having 4 to 12 carbon atoms in the alkyl ester moiety is the total amount of the monomer components constituting the acrylic polymer (A) from the viewpoint that the effect of the present invention can be more expressed ( 100% by weight), preferably 30% by weight or more, more preferably 35% by weight to 99% by weight, even more preferably 40% by weight to 98% by weight, particularly preferably 50% by weight to 99% by weight 95% by weight.

The content of at least one (component b) selected from the group consisting of (meth)acrylic acid esters and (meth)acrylic acids having an OH group constitutes the acrylic polymer (A) from the viewpoint that the effect of the present invention can be more expressed. It is preferably 1% by weight or more, more preferably 1% by weight to 30% by weight, still more preferably 2% by weight to 20% by weight, and particularly preferably 2% by weight to 100% by weight of the total amount of monomer components to be added. is 3% by weight to 15% by weight.

The composition (A) may contain any appropriate other component within a range not impairing the effects of the present invention. As such another component, a polymerization initiator, a chain transfer agent, a solvent, etc. are mentioned, for example. Any suitable content can be employed for the content of these other components within a range not impairing the effect of the present invention.

As the polymerization initiator, a thermal polymerization initiator, a photopolymerization initiator (photoinitiator), or the like can be employed depending on the type of polymerization reaction. 1 type of polymerization initiator may be sufficient as it, and 2 or more types may be sufficient as it.

A thermal polymerization initiator can preferably be employed when obtaining an acrylic polymer by solution polymerization. As such a thermal polymerization initiator, an azo type polymerization initiator, a peroxide type polymerization initiator (for example, dibenzoyl peroxide, tert- butyl permaleate, etc.), a redox type polymerization initiator, etc. are mentioned, for example. Among these thermal polymerization initiators, the azo-type initiator disclosed in Japanese Unexamined Patent Publication No. 2002-69411 is particularly preferable. Such an azo-based polymerization initiator is preferable because decomposition products of the polymerization initiator do not remain in the acrylic polymer as a source of heating-generated gas (out gas). As the azo polymerization initiator, 2,2'-azobisisobutyronitrile (hereinafter sometimes referred to as AIBN), 2,2'-azobis-2-methylbutyronitrile (hereinafter sometimes referred to as AMBN) present), 2,2'-azobis(2-methylpropionic acid)dimethyl, 4,4'-azobis-4-cyanovaleric acid, and the like.

The photopolymerization initiator can preferably be employed when obtaining an acrylic polymer by active energy ray polymerization. Examples of the photopolymerization initiator include benzoin ether photopolymerization initiators, acetophenone photopolymerization initiators, α-ketol photopolymerization initiators, aromatic sulfonyl chloride photopolymerization initiators, photoactive oxime photopolymerization initiators, benzoin photopolymerization initiators, and benzyl photopolymerization initiators. initiators, benzophenone-based photopolymerization initiators, ketal-based photopolymerization initiators, thioxanthone-based photopolymerization initiators, and the like.

Examples of the benzoin ether photopolymerization initiator include benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and 2,2-dimethoxy-1,2-di Phenylethane-1-one, anisole methyl ether, etc. are mentioned. Examples of the acetophenone-based photopolymerization initiator include 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexylphenylketone, 4-phenoxydichloroacetophenone, and 4. -(t-butyl)dichloroacetophenone etc. are mentioned. Examples of the α-ketol photopolymerization initiator include 2-methyl-2-hydroxypropiophenone and 1-[4-(2-hydroxyethyl)phenyl]-2-methylpropan-1-one. there is. As an aromatic sulfonyl chloride type photoinitiator, 2-naphthalene sulfonyl chloride etc. are mentioned, for example. Examples of the photoactive oxime photopolymerization initiator include 1-phenyl-1,1-propanedione-2-(o-ethoxycarbonyl)-oxime and the like. As a benzoin type photoinitiator, benzoin etc. are mentioned, for example. As a benzyl type photoinitiator, benzyl etc. are mentioned, for example. Examples of the benzophenone-based photopolymerization initiator include benzophenone, benzoylbenzoic acid, 3,3'-dimethyl-4-methoxybenzophenone, polyvinylbenzophenone, and α-hydroxycyclohexylphenyl ketone. As a ketal type photoinitiator, benzyl dimethyl ketal etc. are mentioned, for example. As a thioxanthone type photoinitiator, for example, thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-diiso Propyl thioxanthone, dodecyl thioxanthone, etc. are mentioned.

[1-2-1-2. Preferred Embodiment (2) of Acrylic Polymer]

As a preferable embodiment (2) of the acrylic polymer, from the point where the effects of the present invention can be more expressed, preferably polymerization from a composition (B) containing as a monomer component a (meth)acrylic acid ester having a cyclic structure in the molecule. It is an acrylic polymer formed by, more preferably, a (meth)acrylic acid ester having a cyclic structure in the molecule and a (meth)acrylic acid alkylester having a linear or branched alkyl group as monomer components (B) It is an acrylic polymer (B) formed by polymerization from

The cyclic structure (ring) of the (meth)acrylic acid ester having a cyclic structure in the molecule (hereinafter sometimes referred to as "ring-containing (meth)acrylic acid ester") may be either an aromatic ring or a non-aromatic ring. Examples of the aromatic ring include aromatic carbocycles (for example, monocyclic carbocycles such as benzene rings, condensed carbocycles such as naphthalene rings, etc.), various aromatic heterocycles, and the like. Examples of the non-aromatic ring include a non-aromatic aliphatic ring (non-aromatic alicyclic ring) (eg, a cycloalkane ring such as a cyclopentane ring, a cyclohexane ring, a cycloheptane ring, and a cyclooctane ring; a cyclohexene ring, etc.) cycloalkene ring, etc.), non-aromatic bridge exchange (eg, bicyclic hydrocarbon rings such as pinane, bornane, norbornane, norbornene; tricyclic aliphatic hydrocarbon rings such as adamantane ( bridged hydrocarbon ring), etc.), non-aromatic heterocycles (eg, epoxy ring, oxolane ring, oxetane ring, etc.), and the like.

As a tricyclic or more aliphatic hydrocarbon ring (tricyclic or more ring bridged hydrocarbon ring), a dicyclopentanyl group, a dicyclopentenyl group, an adamantyl group, a tricyclopentanyl group, a tricyclopentenyl group etc. are mentioned, for example.

That is, examples of ring-containing (meth)acrylic acid esters include (meth)acrylic acid cycloalkyl esters such as cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, cycloheptyl (meth)acrylate, and cyclooctyl (meth)acrylate. ; (meth)acrylic acid esters having a bicyclic aliphatic hydrocarbon ring such as isobornyl (meth)acrylate; Dicyclopentanyl (meth)acrylate, dicyclopentanyloxyethyl (meth)acrylate, tricyclopentanyl (meth)acrylate, 1-adamantyl (meth)acrylate, 2-methyl-2-adamantyl ( (meth)acrylic acid esters having three or more aliphatic hydrocarbon rings such as meth)acrylate and 2-ethyl-2-adamantyl (meth)acrylate; Aromatic rings such as (meth)acrylate aryl esters such as phenyl (meth)acrylate, (meth)acrylate aryloxyalkyl esters such as phenoxyethyl (meth)acrylate, and (meth)acrylate arylalkyl esters such as benzyl (meth)acrylate (meth)acrylic acid esters having Among these, the ring-containing (meth)acrylic acid ester is preferably a non-aromatic ring-containing (meth)acrylic acid ester, more preferably cyclohexyl acrylate (CHA), cyclohexyl methacrylate (CHMA), or dicyclo acrylate. They are fentanyl (DCPA) and dicyclopentanyl methacrylate (DCPMA), more preferably dicyclopentanyl acrylate (DCPA) and dicyclopentanyl methacrylate (DCPMA).

1 type may be sufficient as ring-containing (meth)acrylic acid ester, and 2 or more types may be sufficient as it.

The content of the ring-containing (meth)acrylic acid ester is preferably 10% by weight or more relative to the total amount (100% by weight) of the monomer components constituting the acrylic polymer (B) from the viewpoint of enabling the effects of the present invention to be more expressed. , more preferably 20% by weight to 90% by weight, still more preferably 30% by weight to 80% by weight, particularly preferably 40% by weight to 70% by weight.

Examples of the (meth)acrylic acid alkyl ester having a linear or branched chain alkyl group include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, Isobutyl (meth)acrylate, s-butyl (meth)acrylate, t-butyl (meth)acrylate, pentyl (meth)acrylate, isopentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, (meth)acrylate ) Octyl acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, (meth) Undecyl acrylate, dodecyl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate, heptadecyl (meth)acrylate, (meth)acrylic acid and (meth)acrylic acid alkyl esters having 1 to 20 carbon atoms in an alkyl group such as octadecyl, nonadecyl (meth)acrylate, eicosyl (meth)acrylate, and lauryl (meth)acrylate. Among these, as the (meth)acrylic acid alkyl ester having a linear or branched chain alkyl group, methyl methacrylate (MMA) and lauryl (meth)acrylate are preferable.

One type or two or more types of (meth)acrylic acid alkyl esters having a linear or branched chain alkyl group may be used.

The content of the (meth)acrylic acid alkyl ester having a linear or branched chain alkyl group is from the point where the effect of the present invention can be more expressed, relative to the total amount of monomer components constituting the acrylic polymer (B) (100% by weight), Preferably it is 10% by weight or more, more preferably 20% by weight to 90% by weight, still more preferably 25% by weight to 80% by weight, particularly preferably 30% by weight to 70% by weight, most preferably Preferably it is 30% by weight to 60% by weight.

The composition (B) may contain a copolymerizable monomer other than a ring-containing (meth)acrylic acid ester and a (meth)acrylic acid alkyl ester having a linear or branched alkyl group. 1 type may be sufficient as a copolymerizable monomer, and 2 or more types may be sufficient as it. Examples of such a copolymerizable monomer include 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, methoxytriethylene glycol (meth)acrylate, 3-methoxypropyl (meth)acrylate, (meth)acrylic acid alkoxyalkyl esters such as 3-ethoxypropyl (meth)acrylate, 4-methoxybutyl (meth)acrylate, and 4-ethoxybutyl (meth)acrylate; 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, hydroxyl group (hydroxyl group)-containing monomers such as (meth)acrylic acid 6-hydroxyhexyl, vinyl alcohol, and allyl alcohol; (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N-methylol(meth)acrylamide, N-methoxymethyl(meth)acrylamide, N-butoxymethyl(meth)acrylamide, N -Amide group-containing monomers such as hydroxyethyl (meth)acrylamide; amino group-containing monomers such as aminoethyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, and t-butylaminoethyl (meth)acrylate; cyano group-containing monomers such as acrylonitrile and methacrylonitrile; sulfonic acid group-containing monomers such as sodium vinyl sulfonate; phosphoric acid group-containing monomers such as 2-hydroxyethyl acryloyl phosphate; isocyanate group-containing monomers such as 2-methacryloyloxyethyl isocyanate; and imide group-containing monomers such as cyclohexyl maleimide and isopropyl maleimide.

As the copolymerizable monomer, a polyfunctional monomer can also be employed. A polyfunctional monomer refers to a monomer having two or more ethylenically unsaturated groups in one molecule. As the ethylenically unsaturated group, any suitable ethylenically unsaturated group can be employed within a range not impairing the effects of the present invention. As such an ethylenically unsaturated group, radical polymerizable functional groups, such as a vinyl group, a propenyl group, an isopropenyl group, a vinyl ether group (vinyloxy group), and an allyl ether group (allyloxy group), are mentioned, for example. As a polyfunctional monomer, for example, hexanediol di(meth)acrylate, butanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neo Pentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, trimethylolpropane tri(meth)acrylate, Tetramethylolmethanetri(meth)acrylate, allyl(meth)acrylate, vinyl(meth)acrylate, divinylbenzene, epoxy acrylate, polyester acrylate, urethane acrylate, etc. are mentioned. 1 type may be sufficient as such a polyfunctional monomer, and 2 or more types may be sufficient as it.

Composition (B) may contain any appropriate other component within a range not impairing the effects of the present invention. As such another component, a polymerization initiator, a chain transfer agent, a solvent, etc. are mentioned, for example. Any suitable content can be employed for the content of these other components within a range not impairing the effect of the present invention.

As the polymerization initiator, a thermal polymerization initiator, a photopolymerization initiator (photoinitiator), or the like can be employed depending on the type of polymerization reaction. 1 type of polymerization initiator may be sufficient as it, and 2 or more types may be sufficient as it.

[1-2-1-1. The explanation in the term of [preferable embodiment (1) of acrylic polymer] can be used.

<1-2-2. Urethane-based adhesive>

As the urethane-based pressure-sensitive adhesive, any suitable urethane-based pressure-sensitive adhesive such as known urethane-based pressure-sensitive adhesive described in, for example, Japanese Patent Laid-Open No. 2017-039859 etc. can be employed within a range not impairing the effect of the present invention. Such a urethane-based pressure-sensitive adhesive is, for example, a urethane-based pressure-sensitive adhesive formed from a urethane-based pressure-sensitive adhesive composition, and the urethane-based pressure-sensitive adhesive composition contains at least one selected from the group consisting of urethane prepolymers and polyols, and a crosslinking agent. One type of urethane-type adhesive may be sufficient as it, and two or more types may be sufficient as it. The urethane-based pressure-sensitive adhesive may contain any suitable component within a range not impairing the effects of the present invention.

<1-2-3. Rubber-Based Adhesive>

As the rubber-based pressure-sensitive adhesive, any appropriate rubber-based pressure-sensitive adhesive such as known rubber-based pressure-sensitive adhesives described in, for example, Japanese Patent Laid-Open No. 2015-074771 etc. can be employed within a range that does not impair the effect of the present invention. 1 type may be sufficient as these, and 2 or more types may be sufficient as them. The rubber-based pressure-sensitive adhesive may contain any suitable component within a range not impairing the effects of the present invention.

<1-2-4. Silicone-Based Adhesive>

As the silicone pressure-sensitive adhesive, any suitable silicone-based pressure-sensitive adhesive, such as a known silicone-based pressure-sensitive adhesive disclosed in, for example, Japanese Patent Laid-Open No. 2014-047280 etc., can be employed within a range not impairing the effect of the present invention. 1 type may be sufficient as these, and 2 or more types may be sufficient as them. The silicone pressure-sensitive adhesive may contain any suitable component within a range not impairing the effects of the present invention.

<1-2-5. Conductive Ingredients>

The pressure-sensitive adhesive layer 1 may contain a conductive component. Typically, the pressure-sensitive adhesive composition (at least one selected from the group consisting of an acrylic pressure-sensitive adhesive composition, a urethane-based pressure-sensitive adhesive composition, a rubber-based pressure-sensitive adhesive composition, and a silicone-based pressure-sensitive adhesive composition) used as a material of the pressure-sensitive adhesive layer 1 may contain a conductive component. .

As the conductive component, any appropriate conductive component can be employed within a range not impairing the effects of the present invention. As such a conductive component, it is preferably at least one compound selected from ionic liquids, ion conductive polymers, ion conductive fillers, and electrically conductive polymers.

In the case where the pressure-sensitive adhesive composition contains a conductive component, the ratio of the base polymer (eg, acrylic polymer, polyol, urethane prepolymer, rubber polymer, silicone polymer) to the conductive component is 100 parts by weight of the base polymer , preferably 0.01 part by weight to 10 parts by weight, more preferably 0.05 part by weight to 9.0 parts by weight, still more preferably 0.075 part by weight to 8.0 parts by weight, particularly preferably 0.1 part by weight to 7.0 parts by weight. is a weight part.

As the ionic liquid, any appropriate ionic liquid can be employed within a range not impairing the effects of the present invention. Here, the ionic liquid means a molten salt (ionic compound) that exhibits a liquid phase at 25°C. One type of ionic liquid may be sufficient as it, and two or more types may be sufficient as it.

Such an ionic liquid is preferably an ionic liquid composed of an organic fluoro anion and an onium cation.

As the onium cation capable of constituting the ionic liquid, any suitable onium cation can be employed within a range not impairing the effects of the present invention. As such an onium cation, it is preferably at least one selected from nitrogen-containing onium cations, sulfur-containing onium cations, and phosphorus-containing onium cations.

The onium cation capable of constituting the ionic liquid is preferably at least one selected from cations having structures represented by general formulas (1) to (5), from the viewpoint of which the effects of the present invention can be more expressed. am.

In the general formula (1), Ra represents a hydrocarbon group having 4 to 20 carbon atoms and may contain a hetero atom, Rb and Rc may be the same or different, and represent hydrogen or a hydrocarbon group having 1 to 16 carbon atoms, A hetero atom may be included. However, when a nitrogen atom contains a double bond, there is no Rc.

In the general formula (2), Rd represents a hydrocarbon group having 2 to 20 carbon atoms and may contain a hetero atom, and Re, Rf and Rg may be the same or different, and represent hydrogen or a hydrocarbon group having 1 to 16 carbon atoms. It is shown and may contain a hetero atom.

In the general formula (3), Rh represents a hydrocarbon group having 2 to 20 carbon atoms and may contain a hetero atom, and Ri, Rj and Rk may be the same or different, and represent hydrogen or a hydrocarbon group having 1 to 16 carbon atoms. It is shown and may contain a hetero atom.

In the general formula (4), Z represents a nitrogen atom, a sulfur atom, or a phosphorus atom, and Rl, Rm, Rn, and Ro, which may be the same or different, represent a hydrocarbon group having 1 to 20 carbon atoms, and include a hetero atom. You can do it. However, when Z is a sulfur atom, there is no Ro.

In the general formula (5), X represents a Li atom, a Na atom or a K atom.

As a cation represented by General formula (1), a pyridinium cation, a pyrrolidinium cation, a piperidinium cation, a cation with a pyrroline skeleton, a cation with a pyrrole skeleton, etc. are mentioned, for example.

Specific examples of the cation represented by the general formula (1) include, for example, 1-ethylpyridinium cation, 1-butylpyridinium cation, 1-hexylpyridinium cation, 1-ethyl-3-methylpyridinium cation, 1 -pyridinium cations such as butyl-3-methylpyridinium cation, 1-hexyl-3-methylpyridinium cation, 1-butyl-4-methylpyridinium cation, and 1-octyl-4-methylpyridinium cation; 1-ethyl-1-methylpyrrolidinium cation, 1-methyl-1-propylpyrrolidinium cation, 1-methyl-1-butylpyrrolidinium cation, 1-methyl-1-pentylpyrrolidinium cation, 1- Methyl-1-hexylpyrrolidinium cation, 1-methyl-1-heptylpyrrolidinium cation, 1-ethyl-1-propylpyrrolidinium cation, 1-ethyl-1-butylpyrrolidinium cation, 1-ethyl- Pyrrolidinium cations such as 1-pentylpyrrolidinium cation, 1-ethyl-1-hexylpyrrolidinium cation, and 1-ethyl-1-heptylpyrrolidinium cation; 1-methyl-1-ethylpiperidinium cation; 1-methyl-1-propylpiperidinium cation, 1-methyl-1-butylpiperidinium cation, 1-methyl-1-pentylpiperidinium cation, 1-methyl-1-hexylpiperidinium cation, 1- Methyl-1-hexylpiperidinium cation, 1-ethyl-1-propylpiperidinium cation, 1-ethyl-1-butylpiperidinium cation, 1-ethyl-1-pentylpiperidinium cation, 1-ethyl- and piperidinium cations such as 1-hexylpiperidinium cation, 1-ethyl-1-hexylpiperidinium cation, and 1-propyl-1-butylpiperidinium cation. More preferably, 1- Hexylpyridinium cation, 1-ethyl-3-methylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-octyl-4-methylpyridinium cation, 1-methyl-1-propylpyrrolidinium cation , 1-methyl-1-propylpiperidinium cation.

As a cation represented by General formula (2), an imidazolium cation, a tetrahydropyrimidinium cation, a dihydropyrimidinium cation, etc. are mentioned, for example.

Specific examples of the cation represented by the general formula (2) include, for example, 1,3-dimethylimidazolium cation, 1,3-diethylimidazolium cation, 1-ethyl-3-methylimidazolium cation, 1 -Butyl-3-methylimidazolium cation, 1-hexyl-3-methylimidazolium cation, 1-octyl-3-methylimidazolium cation, 1-decyl-3-methylimidazolium cation, 1-dodecyl An imidazolium cation such as syl-3-methylimidazolium cation or 1-tetradecyl-3-methylimidazolium cation, more preferably 1-ethyl-3-methylimidazolium cation or 1-hexyl -3-methylimidazolium cation.

As a cation represented by General formula (3), a pyrazolium cation, a pyrazolinium cation, etc. are mentioned, for example.

Specific examples of the cation represented by the general formula (3) include, for example, 1-methylpyrazolium cation, 3-methylpyrazolium cation, 1-ethyl-2-methylpyrazolium cation, 1-ethyl-2,3,5 - Pyrazolium cations such as trimethylpyrazolium cation, 1-propyl-2,3,5-trimethylpyrazolium cation, and 1-butyl-2,3,5-trimethylpyrazolium cation; Pyrazolinium cations such as 1-ethyl-2,3,5-trimethylpyrazolium cation, 1-propyl-2,3,5-trimethylpyrazolium cation, 1-butyl-2,3,5-trimethylpyrazolium cation etc. can be mentioned.

As the cation represented by the general formula (4), for example, tetraalkylammonium cation, trialkylsulfonium cation, tetraalkylphosphonium cation, a part of the alkyl group substituted with an alkenyl group, an alkoxyl group, or an epoxy group, etc. can be heard

Specific examples of the cation represented by the general formula (4) include, for example, triethylmethylammonium cation, tributylethylammonium cation, trimethyldecylammonium cation, diethylmethylsulfonium cation, dibutylethylsulfonium cation, and dimethyldecylsulfonium. Asymmetric tetraalkylammonium cations such as phonium cations, triethylmethylphosphonium cations, tributylethylphosphonium cations, and trimethyldecylphosphonium cations, trialkylsulfonium cations, tetraalkylphosphonium cations, and N,N-diethyl -N-methyl-N-(2-methoxyethyl)ammonium cation, glycidyltrimethylammonium cation, diaryldimethylammonium cation, N,N-dimethyl-N-ethyl-N-propylammonium cation, N,N- Dimethyl-N-ethyl-N-butylammonium cation, N,N-dimethyl-N-ethyl-N-pentylammonium cation, N,N-dimethyl-N-ethyl-N-hexylammonium cation, N,N-dimethyl- N-ethyl-N-heptylammonium cation, N,N-dimethyl-N-ethyl-N-nonylammonium cation, N,N-dimethyl-N,N-dipropylammonium cation, N,N-diethyl-N- Propyl-N-butylammonium cation, N,N-dimethyl-N-propyl-N-pentylammonium cation, N,N-dimethyl-N-propyl-N-hexylammonium cation, N,N-dimethyl-N-propyl- N-heptylammonium cation, N,N-dimethyl-N-butyl-N-hexylammonium cation, N,N-diethyl-N-butyl-N-heptylammonium cation, N,N-dimethyl-N-pentyl-N -Hexylammonium cation, N,N-dimethyl-N,N-dihexylammonium cation, trimethylheptylammonium cation, N,N-diethyl-N-methyl-N-propylammonium cation, N,N-diethyl-N -Methyl-N-pentylammonium cation, N,N-diethyl-N-methyl-N-heptylammonium cation, N,N-diethyl-N-propyl-N-pentylammonium cation, triethylpropylammonium cation, tri Ethylpentylammonium cation, triethylheptylammonium cation, N,N-dipropyl-N-methyl-N-ethylammonium cation, N,N-dipropyl-N-methyl-N-pentylammonium cation, N,N-di Propyl-N-butyl-N-hexylammonium cation, N,N-dipropyl-N,N-dihexylammonium cation, N,N-dibutyl-N-methyl-N-pentylammonium cation, N,N-di butyl-N-methyl-N-hexylammonium cation, Trioctylmethylammonium cation, N-methyl-N-ethyl-N-propyl-N-pentylammonium cation, etc. are mentioned, and trimethylpropylammonium cation is more preferable.

As the fluoroorganic anion capable of constituting the ionic liquid, any suitable fluoroorganic anion can be employed within a range not impairing the effects of the present invention. Such fluoroorganic anions may be completely fluorinated (perfluorinated) or partially fluorinated.

Examples of such fluoro organic anions include perfluoroalkylsulfonate, bis(fluorosulfonyl)imide, and bis(perfluoroalkanesulfonyl)imide, and more specifically, for example, tri They are fluoromethanesulfonate, pentafluoroethanesulfonate, heptafluoropropanesulfonate, nonafluorobutanesulfonate, bis(fluorosulfonyl)imide, and bis(trifluoromethanesulfonyl)imide.

As a specific example of the ionic liquid, it may be appropriately selected and used from a combination of the cationic component and the anionic component. Specific examples of such ionic liquids include 1-hexylpyridinium bis(fluorosulfonyl)imide, 1-ethyl-3-methylpyridinium trifluoromethanesulfonate, and 1-ethyl-3- Methylpyridinium pentafluoroethanesulfonate, 1-ethyl-3-methylpyridinium heptafluoropropanesulfonate, 1-ethyl-3-methylpyridinium nonafluorobutanesulfonate, 1-butyl-3-methylpyridinium Dinium trifluoromethanesulfonate, 1-butyl-3-methylpyridinium bis(trifluoromethanesulfonyl)imide, 1-octyl-4-methylpyridinium bis(fluorosulfonyl)imide, 1- Methyl-1-propylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-propylpyrrolidinium bis(fluorosulfonyl)imide, 1-methyl-1-propylpiperidinium Bis (trifluoromethanesulfonyl) imide, 1-methyl-1-propylpiperidinium bis (fluorosulfonyl) imide, 1-ethyl-3-methylimidazolium trifluoromethanesulfonate, 1 -Ethyl-3-methylimidazolium heptafluoropropanesulfonate, 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide, 1-ethyl-3-methylimidazolium bis( Fluorosulfonyl) imide, 1-hexyl-3-methylimidazolium bis (fluorosulfonyl) imide, trimethylpropylammonium bis (trifluoromethanesulfonyl) imide, lithium bis (trifluoromethane sulfonyl)imide, and lithium bis(fluorosulfonyl)imide.

As the ionic liquid, a commercially available one may be used, but it is also possible to synthesize it as follows. The method for synthesizing the ionic liquid is not particularly limited as long as the desired ionic liquid is obtained, but is generally described in the literature “Ionic Liquids -The Frontiers of Development and the Future-” (published by CMC Publishing Co., Ltd.) A halide method, a hydroxide method, an acid ester method, a complexing method and a neutralization method, etc., as there are, are used.

In the following, for the halide method, the hydroxide method, the acid ester method, the complex formation method, and the neutralization method, the nitrogen-containing onium salt is shown as an example of the synthesis method, but other sulfur-containing onium salts, phosphorus-containing onium salts, etc. An ionic liquid can also be obtained by the same method.

The halide method is a method performed by reactions as shown in reaction formulas (1) to (3). First, a tertiary amine and an alkyl halide are reacted to obtain a halide (reaction formula (1), chlorine, bromine, and iodine are used as the halogen).

Acids ( ^HA ) or salts (MA, M are cations that form salts with target anions such as ammonium, lithium, sodium, potassium, etc.) By reacting, the target ionic liquid (R ₄ NA) is obtained.

The hydroxide method is a method performed by reactions as shown in reaction formulas (4) to (8). First, a halide (R ₄ NX) is converted into a hydroxide by ion exchange membrane electrolysis (reaction formula (4)), OH type ion exchange resin method (reaction formula (5)), or reaction with silver oxide (Ag ₂ O) (reaction formula (6)) (R ₄ NOH) (chlorine, bromine and iodine are used as halogen).

The target ionic liquid (R ₄ NA) is obtained by using the reactions of reaction formulas (7) to (8) in the same way as in the halogenation method for the obtained hydroxide.

The acid ester method is a method performed by reactions as shown in reaction formulas (9) to (11). First, a tertiary amine (R ₃ N ) is reacted with an acid ester to obtain an acid ester product (reaction formula (9), as the acid ester, esters of inorganic acids such as sulfuric acid, sulfurous acid, phosphoric acid, phosphorous acid, carbonic acid, methanesulfonic acid, methyl phosphate) esters of organic acids such as phonic acid and formic acid are used).

The target ionic liquid (R ₄ NA) is obtained by using the reactions of reaction formulas (10) to (11) in the same way as in the halogenation method for the obtained acid ester product. In addition, an ionic liquid can also be obtained directly by using methyltrifluoromethanesulfonate, methyltrifluoroacetate or the like as an acid ester.

The neutralization method is a method performed by a reaction as shown in reaction formula (12). It can be obtained by reacting tertiary amines with organic acids such as CF ₃ COOH, CF ₃ SO ₃ H, (CF ₃ SO ₂ ) ₂ NH, (CF ₃ SO ₂ ) ₃ CH, and (C ₂ F ₅ SO ₂ ) ₂ NH there is.

R described in the above reaction formulas (1) to (12) represents hydrogen or a hydrocarbon group having 1 to 20 carbon atoms, and may contain a hetero atom.

As the ion conductive polymer, any appropriate ion conductive polymer can be employed within a range not impairing the effects of the present invention. Examples of such an ion conductive polymer include an ion conductive polymer obtained by polymerizing or copolymerizing a monomer having a quaternary ammonium base group; and conductive polymers such as polythiophene, polyaniline, polypyrrole, polyethyleneimine, and allylamine-based polymers. The ion conductive polymer may be one type or two or more types.

As the ion conductive filler, any appropriate ion conductive filler can be employed within a range that does not impair the effects of the present invention. Examples of such ion conductive fillers include tin oxide, antimony oxide, indium oxide, cadmium oxide, titanium oxide, zinc oxide, indium, tin, antimony, gold, silver, copper, aluminum, nickel, chromium, titanium, iron, Cobalt, copper iodide, ITO (indium oxide/tin oxide), ATO (antimony oxide/tin oxide), etc. are mentioned. The ion conductive filler may be one type or two or more types.

As the electrically conductive polymer, any suitable electrically conductive polymer can be employed within a range not impairing the effects of the present invention. Examples of such electrically conductive polymers include (3,4-ethylenedioxythiophene)-poly(styrenesulfonic acid) and the like.

<1-2-6. other ingredients>

The pressure-sensitive adhesive composition (at least one selected from the group consisting of an acrylic pressure-sensitive adhesive composition, a urethane-based pressure-sensitive adhesive composition, a rubber-based pressure-sensitive adhesive composition, and a silicone-based pressure-sensitive adhesive composition) used as a material of the pressure-sensitive adhesive layer (1) is within a range that does not impair the effects of the present invention, It may contain any suitable other ingredients. Examples of such other components include other polymer components, crosslinking accelerators, crosslinking catalysts, silane coupling agents, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), antioxidants, inorganic fillers, and organic fillers. , metal powder, colorant (pigment or dye, etc.), thin material, UV absorber, antioxidant, light stabilizer, chain transfer agent, plasticizer, softener, surfactant, antistatic agent, conductive agent, stabilizer, surface lubricant, leveling agent, corrosion inhibitor , heat-resistant stabilizers, polymerization inhibitors, lubricants, solvents, catalysts and the like.

«1-3. Resin film (2)≫

As the thickness of the resin film 2, any appropriate thickness can be employed depending on the purpose within a range not impairing the effects of the present invention. Such a thickness is preferably 20 μm to 500 μm, more preferably 20 μm to 300 μm, still more preferably 20 μm to 200 μm, from the viewpoint of enabling the effect of the present invention to be more expressed. Particularly preferably, it is 20 μm to 100 μm, and most preferably 20 μm to 80 μm.

The resin film 2 includes the resin base film 2a.

Examples of the resin base film 2a include plastic films made of polyester resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT); Plastics composed of olefinic resins containing α-olefins as monomer components, such as polyethylene (PE), polypropylene (PP), polymethylpentene (PMP), ethylene-propylene copolymer, and ethylene-vinyl acetate copolymer (EVA) film; A plastic film made of polyvinyl chloride (PVC); plastic film composed of vinyl acetate-based resin; plastic film composed of polycarbonate (PC); A plastic film composed of polyphenylene sulfide (PPS); plastic films composed of amide-based resins such as polyamide (nylon) and wholly aromatic polyamide (aramid); plastic film composed of polyimide-based resin; a plastic film composed of polyetheretherketone (PEEK); plastic films made of olefinic resins such as polyethylene (PE) and polypropylene (PP); Fluorine-based resins such as polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, chlorofluoroethylene-vinylidene fluoride copolymer, etc. The plastic film etc. which are comprised are mentioned.

The resin base film 2a may have only one layer or may have two or more layers. The resin base film 2a may be stretched.

The resin base film 2a may be subjected to surface treatment. Examples of the surface treatment include corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, ionizing radiation treatment, coating treatment with a primer, and the like.

Arbitrary suitable additives may be contained in the resin base film 2a according to the purpose within the range which does not impair the effect of this invention.

The resin film 2 may have a conductive layer 2b. The conductive layer 2b may be disposed between the pressure-sensitive adhesive layer 1 and the resin base film 2a.

The conductive layer 2b may consist of only one layer or two or more layers.

The conductive layer 2b can be provided by forming on any appropriate substrate. As such a base material, it is preferably a resin base film (2a).

The conductive layer 2b is formed on any suitable substrate (preferably) by any appropriate thin film formation method such as, for example, a vacuum deposition method, sputtering method, ion plating method, spray pyrolysis method, chemical plating method, electroplating method, or a combination thereof. Preferably, a conductive film is formed on the resin base film 2a. Among these thin film formation methods, from the viewpoint of the speed of formation of a conductive film, the formability of a large area film, and productivity, a vacuum deposition method or a sputtering method is preferable.

Examples of the material for forming the conductive film include metal-based materials made of gold, silver, platinum, palladium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin, alloys thereof, and the like; metal oxide materials made of indium oxide, tin oxide, titanium oxide, cadmium oxide, mixtures thereof, and the like; Other metal compounds composed of copper iodide or the like are used.

As the thickness of the conductive layer 2b, any appropriate thickness can be employed depending on the purpose within a range that does not impair the effects of the present invention. Such a thickness is, for example, preferably 30 Å to 600 Å when formed from a metal-based material, and preferably 80 Å to 5000 Å when formed from a metal oxide-based material.

The surface resistance of the conductive layer 2b is preferably 1.0×10 ¹⁰ Ω/□ or less, more preferably 1.0×10 ⁹ Ω/□ or less, still more preferably 1.0×10 ⁸ Ω/□ or less. , and is particularly preferably 1.0×10 ⁷ Ω/□ or less.

When the conductive film is formed on any suitable substrate (preferably, the resin substrate film 2a), the surface of the substrate (preferably, the resin substrate film 2a) is subjected to corona discharge treatment, ultraviolet irradiation treatment, or plasma The adhesiveness between the conductive film and the substrate (preferably, the resin substrate film 2a) may be improved by performing any appropriate pretreatment such as treatment, sputter etching treatment, undercoating treatment, or the like.

The resin film 2 may have an antistatic layer 2c. The antistatic layer 2c may be disposed between the pressure-sensitive adhesive layer 1 and the resin base film 2a, and/or between the resin base film 2a and the pressure-sensitive adhesive layer 2.

The antistatic layer 2c may have only one layer or two or more layers.

As the thickness of the antistatic layer 2c, any suitable thickness can be employed depending on the purpose within a range that does not impair the effects of the present invention. Such a thickness is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, still more preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm.

The surface resistance value of the antistatic layer 2c is preferably 1.0×10 ⁹ Ω/□ or less, more preferably 8.0×10 ⁹ Ω/□ or less, and even more preferably 5.0×10 ⁹ Ω/□ or less. , and is particularly preferably 1.0×10 ⁹ Ω/□ or less.

As the antistatic layer 2c, any appropriate antistatic layer can be employed as long as it is a layer capable of exhibiting an antistatic effect within a range not impairing the effects of the present invention. As such an antistatic layer, it is preferably an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on an arbitrary suitable substrate layer. Specifically, it is an antistatic layer formed by coating, for example, a conductive coating liquid containing a conductive polymer on the resin base film 2a. After coating, drying is performed as necessary, and curing treatment (heat treatment, ultraviolet treatment, etc.) is performed as necessary. As a specific coating method, a roll coating method, a bar coating method, a gravure coating method, etc. are mentioned.

As the conductive coating liquid containing the conductive polymer, any appropriate conductive coating liquid can be employed within a range not impairing the effects of the present invention. Such a conductive coating liquid preferably contains a conductive polymer, a binder, a crosslinking agent, and a solvent. Since this solvent is substantially lost by volatilization or evaporation by heating or the like in the process of forming the antistatic layer 2c, the antistatic layer 2c preferably contains a conductive polymer, a binder, and a crosslinking agent.

As a solvent, an organic solvent, water, or these mixed solvents are mentioned, for example. Examples of organic solvents include esters such as ethyl acetate; ketones such as methyl ethyl ketone, acetone, and cyclohexanone; cyclic ethers such as tetrahydrofuran (THF) and dioxane; aliphatic or alicyclic hydrocarbons such as n-hexane and cyclohexane; Aromatic hydrocarbons, such as toluene and xylene; aliphatic or alicyclic alcohols such as methanol, ethanol, n-propanol, isopropanol, and cyclohexanol; Glycol ethers, such as an alkylene glycol monoalkyl ether (For example, ethylene glycol monomethyl ether and ethylene glycol monoethyl ether) and dialkylene glycol monoalkyl ether, etc. are mentioned. As the solvent, it is preferably water or a mixed solvent containing water as a main component (for example, a mixed solvent of water and ethanol).

The content of the conductive polymer in the antistatic layer 2c is preferably 3% by weight to 80% by weight, more preferably 5% by weight to 60% by weight.

As the conductive polymer, any suitable conductive polymer can be employed within a range not impairing the effects of the present invention. Examples of such a conductive polymer include a conductive polymer obtained by doping a π-conjugated conductive polymer with a polyvalent anion. Examples of the π-conjugated conductive polymer include chain-shaped conductive polymers such as polythiophene, polypyrrole, polyaniline, and polyacetylene. Examples of the polyvalent anion include polystyrene sulfonic acid, polyisoprene sulfonic acid, polyvinyl sulfonic acid, polyallyl sulfonic acid, ethyl polyacrylate sulfonic acid, and polymethacryl carboxylic acid.

1 type of conductive polymer may be sufficient as it, and 2 or more types may be sufficient as it.

The content of the binder in the antistatic layer 2c is preferably 50% by weight to 95% by weight, more preferably 60% by weight to 90% by weight.

As the binder that can be included in the conductive coating liquid, any appropriate binder can be employed within a range that does not impair the effects of the present invention. 1 type of binder may be sufficient as it, and 2 or more types may be sufficient as it. Such a binder is preferably a resin, more preferably a polyester resin. The ratio of the polyester resin to the binder is preferably 90% by weight to 100% by weight, more preferably 98% by weight to 100% by weight.

The polyester resin contains polyester as the main component (preferably more than 50% by weight, more preferably 75% by weight or more, still more preferably 90% by weight or more, particularly preferably substantially 100% by weight) It is preferable to include as a component occupied).

As the polyester, any appropriate polyester can be employed within a range not impairing the effects of the present invention. As such a polyester, preferably polyhydric carboxylic acids having two or more carboxyl groups in one molecule (e.g., dicarboxylic acid compounds) and derivatives thereof (e.g., anhydrides and esters of polyhydric carboxylic acids) . It is preferable to have a structure in which the above compound (polyhydric alcohol component) is condensed.

As the polyhydric carboxylic acid component, any suitable polyhydric carboxylic acid can be employed within a range not impairing the effect of the present invention. Examples of such a polyhydric carboxylic acid component include oxalic acid, malonic acid, difluoromalonic acid, alkylmalonic acid, succinic acid, tetrafluorosuccinic acid, alkylsuccinic acid, (±)-malic acid, meso-tartaric acid, itaconic acid, Maleic acid, methylmaleic acid, fumaric acid, methyl fumaric acid, acetylenedicarboxylic acid, glutaric acid, hexafluoroglutaric acid, methylglutaric acid, glutaconic acid, adipic acid, dithioadipic acid, methyladip acid, dimethyladipic acid, tetramethyladipic acid, methyleneadipic acid, muconic acid, galactaric acid, pimelic acid, suberic acid, perfluorosuberic acid, 3,3,6,6-tetramethyl water aliphatic dicarboxylic acids such as beric acid, azelaic acid, sebacic acid, perfluorosebacic acid, brassylic acid, dodecyldicarboxylic acid, tridecyldicarboxylic acid, and tetradecyldicarboxylic acid; cycloalkyl dicarboxylic acids (eg 1,4-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid), 1,4-(2-norbornene)dicarboxylic acid, alicyclic dicarboxylic acids such as 5-norbornene-2,3-dicarboxylic acid (hymic acid), adamantane dicarboxylic acid, and spiroheptane dicarboxylic acid; Phthalic acid, isophthalic acid, dithioisophthalic acid, methylisophthalic acid, dimethylisophthalic acid, chloroisophthalic acid, dichloroisophthalic acid, terephthalic acid, methylterephthalic acid, dimethylterephthalic acid, chloroterephthalic acid, bromoterephthalic acid, naphthalenedicarboxylic acid, oxofluorenedica carboxylic acid, anthracene dicarboxylic acid, biphenyldicarboxylic acid, biphenylenedicarboxylic acid, dimethyl biphenylene dicarboxylic acid, 4,4"-p-telephenylenedicarboxylic acid, 4 ,4"-p-Quarrelphenyldicarboxylic acid, bibenzyldicarboxylic acid, azobenzenedicarboxylic acid, homophthalic acid, phenylene diacetic acid, phenylenedipropionic acid, naphthalenedicarboxylic acid, naphthalenedipropionic acid, Biphenyl2acetic acid, biphenyldipropionic acid, 3,3'-[4,4'-(methylenedi-p-biphenylene)]dipropionic acid, 4,4'-bibenzyldiacetic acid, 3,3'( aromatic dicarboxylic acids such as 4,4'-bibenzyl)dipropionic acid and oxydi-p-phenylene diacetic acid; acid anhydrides of any of the above polyhydric carboxylic acids; esters of any of the above polyhydric carboxylic acids (for example, alkyl esters, monoesters, diesters, etc.); acid halides (for example, dicarboxylic acid chloride) corresponding to any of the above polyvalent carboxylic acids; and the like.

As a polyhydric carboxylic acid component, Preferably, aromatic dicarboxylic acids, such as terephthalic acid, isophthalic acid, and naphthalene dicarboxylic acid, and its acid anhydride; aliphatic dicarboxylic acids and their acid anhydrides, such as adipic acid, sebacic acid, azelaic acid, succinic acid, fumaric acid, maleic acid, hymic acid, and 1,4-cyclohexanedicarboxylic acid; and lower alkyl esters of these dicarboxylic acids (for example, esters with monoalcohols having 1 to 3 carbon atoms).

As the polyhydric alcohol component, any appropriate polyhydric alcohol can be employed within a range not impairing the effects of the present invention. Examples of such a polyhydric alcohol component include ethylene glycol, propylene glycol, 1,2-propanediol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, and 1,5-propanediol. Pentanediol, 1,6-hexanediol, 3-methylpentanediol, diethylene glycol, 1,4-cyclohexanedimethanol, 3-methyl-1,5-pentanediol, 2-methyl-1,3-propanediol diols such as 2,2-diethyl-1,3-propanediol, 2-butyl-2-ethyl-1,3-propanediol, xylylene glycol, hydrogenated bisphenol A, and bisphenol A; Alkylene oxide adducts (for example, ethylene oxide adducts, propylene oxide adducts, etc.) of these diols, etc. are mentioned.

The molecular weight of the polyester resin, as a weight average molecular weight (Mw) in terms of standard polystyrene measured by gel permeation chromatography (GPC), is preferably 5×10 ³ to 1.5×10 ⁵ , more preferably 1×10 5 . 10 ⁴ to 6×10 ⁴ .

The glass transition temperature (Tg) of the polyester resin is preferably 0°C to 120°C, more preferably 10°C to 80°C.

As a polyester resin, commercially available Toyobo Co., Ltd. brand name "Vironal" etc. can be used, for example.

The conductive coating liquid is a resin other than the polyester resin (e.g., acrylic resin, acrylic urethane resin, acrylic styrene resin, acrylic silicone resin, silicone resin, polysilazane) as a binder within a range that does not impair the effects of the present invention. resin, polyurethane resin, fluorine resin, and at least one resin selected from polyolefin resin) may be further contained.

As the crosslinking agent that can be included in the conductive coating liquid, any suitable crosslinking agent can be employed within a range not impairing the effect of the present invention. 1 type of crosslinking agent may be sufficient as it, and 2 or more types may be sufficient as it. Examples of such a crosslinking agent include isocyanate-based crosslinking agents, epoxy-based crosslinking agents, melamine-based crosslinking agents, and peroxide-based crosslinking agents, as well as urea-based crosslinking agents, metal alkoxide-based crosslinking agents, metal chelate-based crosslinking agents, metal salt-based crosslinking agents, carbodiimide-based crosslinking agents, and oxa A zoline-type crosslinking agent, an aziridine-type crosslinking agent, an amine-type crosslinking agent, etc. are mentioned. Among them, a melamine-based crosslinking agent is preferred.

The content of the crosslinking agent in the antistatic layer 2c is preferably 1% by weight to 30% by weight, more preferably 2% by weight to 20% by weight.

Any appropriate other component may be contained in the antistatic layer 2c within a range not impairing the effect of the present invention.

«1-4. Adhesive layer (2)≫

Any appropriate pressure-sensitive adhesive layer can be employed for the pressure-sensitive adhesive layer 2 within a range that does not impair the effects of the present invention. The pressure-sensitive adhesive layer 2 may have only one layer or may have two or more layers.

The thickness of the pressure-sensitive adhesive layer 2 is preferably 0.5 μm to 150 μm, more preferably 1 μm to 100 μm, still more preferably 2 μm to 150 μm, from the viewpoint of enabling the effect of the present invention to be more expressed. 80 μm, more preferably 3 μm to 50 μm, still more preferably 5 μm to 24 μm, still more preferably 8 μm to 22 μm, particularly preferably 10 μm to 20 μm, most preferably Preferably, it is 12 μm to 18 μm. When the thickness of the pressure-sensitive adhesive layer 2 is within the above range, the curl suppressing effect can be more exhibited.

The pressure-sensitive adhesive layer 2 can be formed by any suitable method. As such a method, for example, the pressure-sensitive adhesive composition for forming the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 2 is applied onto any suitable substrate (eg, the resin film 3), and heating and drying are performed as necessary. and a method of forming a pressure-sensitive adhesive layer on the substrate by curing as necessary. As such a coating method, for example, gravure roll coater, reverse roll coater, kiss roll coater, dip roll coater, bar coater, knife coater, air knife coater, spray coater, comma coater, direct coater, roll brush coater, etc. way can be

<1-4-1. Acrylic adhesive>

The pressure-sensitive adhesive layer (2) is preferably composed of an acrylic pressure-sensitive adhesive (2).

The acrylic pressure-sensitive adhesive (2) is formed from the acrylic pressure-sensitive adhesive composition (2).

The acrylic pressure-sensitive adhesive composition (2) preferably contains an acrylic polymer (C) from the viewpoint of enabling the effect of the present invention to be more expressed.

The acrylic polymer (C) can be referred to as a so-called base polymer in the field of acrylic pressure-sensitive adhesives. One type of acrylic polymer may be sufficient as it, and two or more types may be sufficient as it.

The content ratio of the acrylic polymer (C) in the acrylic adhesive composition (2), in terms of solid content, is preferably 60% by weight to 99.9% by weight, more preferably 65% by weight to 99.9% by weight, still more preferably 70 wt% to 99.9 wt%, particularly preferably 75 wt% to 99.9 wt%, and most preferably 80 wt% to 99.9 wt%.

As the acrylic polymer (C), any suitable acrylic polymer can be employed within a range not impairing the effects of the present invention.

The weight average molecular weight of the acrylic polymer (C) is preferably 300,000 to 2.5 million, more preferably 350,000 to 2,000,000, still more preferably 40 10,000 to 1,800,000, particularly preferably 500,000 to 1,500,000.

The acrylic adhesive composition (2) may contain a crosslinking agent. By using a crosslinking agent, the cohesive force of the acrylic pressure-sensitive adhesive can be improved, and the effect of the present invention can be more expressed. 1 type of crosslinking agent may be sufficient as it, and 2 or more types may be sufficient as it.

As a crosslinking agent, <1-2-1. Acrylic pressure-sensitive adhesive> can be used for the explanation in the term.

Arbitrary suitable content can be employ|adopted for content of the crosslinking agent in the acrylic adhesive composition (2) within the range which does not impair the effect of this invention. As such a content, it is preferably 0.05 part by weight to 20 parts by weight, more preferably, relative to the solid content (100 parts by weight) of the acrylic polymer (C) from the viewpoint of being able to express the effect of the present invention more, for example. It is preferably 0.1 part by weight to 18 parts by weight, more preferably 0.5 part by weight to 15 parts by weight, and particularly preferably 0.5 part by weight to 10 parts by weight.

The acrylic pressure-sensitive adhesive composition (2) may contain any suitable other components within a range not impairing the effects of the present invention. Examples of such other components include polymer components other than acrylic polymers, crosslinking accelerators, crosslinking catalysts, silane coupling agents, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), antioxidants, and inorganic fillers. , organic filler, metal powder, colorant (pigment or dye, etc.), thin material, ultraviolet absorber, antioxidant, light stabilizer, chain transfer agent, plasticizer, softener, surfactant, antistatic agent, conductive agent, stabilizer, surface lubricant, leveling agent , corrosion inhibitors, heat-resistant stabilizers, polymerization inhibitors, lubricants, solvents, catalysts and the like.

The acrylic polymer (C) is preferably (meth)acrylic acid alkyl ester having 4 to 12 carbon atoms in the alkyl group of the alkyl ester moiety (component a), and OH (component b) from the viewpoint of being able to express the effect of the present invention more. It is an acrylic polymer (C) formed by polymerization from a composition (C) containing at least one selected from the group consisting of group-containing (meth)acrylic acid esters and (meth)acrylic acid. (component a) and (component b) may be each independently of one type or two or more types.

Examples of (meth)acrylic acid alkyl esters (component a) having 4 to 12 carbon atoms in the alkyl group of the alkyl ester moiety include n-butyl (meth)acrylate, isobutyl (meth)acrylate, s-butyl (meth)acrylate, ( t-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, (meth) nonyl acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, and the like. Among these, n-butyl (meth)acrylate and 2-ethylhexyl (meth)acrylate are preferred, and n-butyl acrylate and 2-ethylhexyl (meth)acrylate are more preferred, from the viewpoint of enabling the effect of the present invention to be more expressed. It is ethylhexyl.

As at least one kind (component b) selected from the group consisting of (meth)acrylic acid esters and (meth)acrylic acid having an OH group, for example, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, (meth) (meth)acrylic acid esters having an OH group such as hydroxybutyl acrylate, (meth)acrylic acid, and the like are exemplified. Among these, hydroxyethyl (meth)acrylate and (meth)acrylic acid are preferred, and hydroxyethyl acrylate and acrylic acid are more preferred, from the viewpoint of enabling the effect of the present invention to be more expressed.

Composition (C) may contain a copolymerizable monomer other than component (a) and component (b). 1 type may be sufficient as a copolymerizable monomer, and 2 or more types may be sufficient as it. Examples of such a copolymerizable monomer include itaconic acid, maleic acid, fumaric acid, crotonic acid, isocrotonic acid, acid anhydrides thereof (eg, acid anhydride group-containing monomers such as maleic anhydride and itaconic acid anhydride), etc. carboxyl group-containing monomers of (except for (meth)acrylic acid); (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N-methylol(meth)acrylamide, N-methoxymethyl(meth)acrylamide, N-butoxymethyl(meth)acrylamide, N - Amide group-containing monomers such as hydroxyethyl (meth)acrylamide; amino group-containing monomers such as aminoethyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, and t-butylaminoethyl (meth)acrylate; epoxy group-containing monomers such as glycidyl (meth)acrylate and methylglycidyl (meth)acrylate; cyano group-containing monomers such as acrylonitrile and methacrylonitrile; N-vinyl-2-pyrrolidone, (meth)acryloylmorpholine, N-vinylpiperidone, N-vinylpiperazine, N-vinylpyrrole, N-vinylimidazole, vinylpyridine, vinylpyrimidine, heterocycle-containing vinyl monomers such as vinyloxazole; sulfonic acid group-containing monomers such as sodium vinyl sulfonate; phosphoric acid group-containing monomers such as 2-hydroxyethyl acryloyl phosphate; imide group-containing monomers such as cyclohexyl maleimide and isopropyl maleimide; isocyanate group-containing monomers such as 2-methacryloyloxyethyl isocyanate; (meth)acrylic acid esters having alicyclic hydrocarbon groups such as cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, and isobornyl (meth)acrylate; (meth)acrylic acid esters having aromatic hydrocarbon groups such as phenyl (meth)acrylate, phenoxyethyl (meth)acrylate, and benzyl (meth)acrylate; vinyl esters such as vinyl acetate and vinyl propionate; aromatic vinyl compounds such as styrene and vinyltoluene; olefins and dienes such as ethylene, butadiene, isoprene, and isobutylene; vinyl ethers such as vinyl alkyl ether; Vinyl chloride etc. are mentioned.

As the copolymerizable monomer, a polyfunctional monomer can also be employed. A polyfunctional monomer refers to a monomer having two or more ethylenically unsaturated groups in one molecule. As the ethylenically unsaturated group, any suitable ethylenically unsaturated group can be employed within a range not impairing the effects of the present invention. As such an ethylenically unsaturated group, radical polymerizable functional groups, such as a vinyl group, a propenyl group, an isopropenyl group, a vinyl ether group (vinyloxy group), and an allyl ether group (allyloxy group), are mentioned, for example. As a polyfunctional monomer, for example, hexanediol di(meth)acrylate, butanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neo Pentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, trimethylolpropane tri(meth)acrylate, Tetramethylolmethanetri(meth)acrylate, allyl(meth)acrylate, vinyl(meth)acrylate, divinylbenzene, epoxy acrylate, polyester acrylate, urethane acrylate, etc. are mentioned. 1 type may be sufficient as such a polyfunctional monomer, and 2 or more types may be sufficient as it.

As the copolymerizable monomer, (meth)acrylic acid alkoxyalkyl esters can also be employed. Examples of (meth)acrylic acid alkoxyalkyl esters include 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, methoxytriethylene glycol (meth)acrylate, and 3-methoxy (meth)acrylate. Propyl, (meth)acrylate 3-ethoxypropyl, (meth)acrylate 4-methoxybutyl, (meth)acrylate 4-ethoxybutyl, etc. are mentioned. (meth)acrylic-acid alkoxyalkyl ester may be 1 type or 2 or more types may be sufficient as it.

The content of the alkyl (meth)acrylic acid alkyl ester (component a) having 4 to 12 carbon atoms in the alkyl ester moiety is the total amount of the monomer components constituting the acrylic polymer (C) from the viewpoint that the effect of the present invention can be more expressed ( 100% by weight), preferably 30% by weight or more, more preferably 50% by weight to 99% by weight, still more preferably 70% by weight to 98% by weight, particularly preferably 90% by weight to 98% by weight.

The content of at least one (component b) selected from the group consisting of (meth)acrylic acid esters and (meth)acrylic acids having an OH group constitutes the acrylic polymer (C) from the viewpoint that the effect of the present invention can be more expressed. It is preferably 1 wt% or more, more preferably 1 wt% to 30 wt%, still more preferably 2 wt% to 20 wt%, and particularly preferably is 3% by weight to 10% by weight, most preferably 3% by weight to 6% by weight.

Composition (C) may contain any appropriate other component within a range not impairing the effects of the present invention. As such another component, a polymerization initiator, a chain transfer agent, a solvent, etc. are mentioned, for example. Any suitable content can be employed for the content of these other components within a range not impairing the effect of the present invention.

As the polymerization initiator, a thermal polymerization initiator, a photopolymerization initiator (photoinitiator), or the like can be employed depending on the type of polymerization reaction. 1 type of polymerization initiator may be sufficient as it, and 2 or more types may be sufficient as it.

[1-2-1-1. The explanation in the term of [preferable embodiment (1) of acrylic polymer] can be used.

<1-4-2. Conductive Ingredients>

The pressure-sensitive adhesive layer 2 may contain a conductive component. Regarding the conductive component, <1-2-5. The description in the section of “Electrical Conductive Component” can be used.

<1-4-3. other ingredients>

The pressure-sensitive adhesive composition (preferably, an acrylic pressure-sensitive adhesive composition) used as a material for the pressure-sensitive adhesive layer 2 may contain any appropriate other components within a range not impairing the effects of the present invention. Examples of such other components include other polymer components, crosslinking accelerators, crosslinking catalysts, silane coupling agents, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), antioxidants, inorganic fillers, and organic fillers. , metal powder, colorant (pigment or dye, etc.), thin material, UV absorber, antioxidant, light stabilizer, chain transfer agent, plasticizer, softener, surfactant, antistatic agent, conductive agent, stabilizer, surface lubricant, leveling agent, corrosion inhibitor , heat-resistant stabilizers, polymerization inhibitors, lubricants, solvents, catalysts and the like.

«1-5. Resin film (3)≫

The thickness of the resin film 3 is preferably 10 µm to 300 µm, more preferably 20 µm to 200 µm, still more preferably 30 µm to 300 µm, from the viewpoint of enabling the effects of the present invention to be more expressed. 150 μm, more preferably 35 μm to 100 μm, still more preferably 40 μm to 80 μm, particularly preferably 45 μm to 80 μm, and most preferably 50 μm to 80 μm. If the thickness of the resin film 3 is in the said range, a curl suppression effect can be expressed more. If the thickness of the resin film 3 deviates from the above range, there is a fear that the effect of suppressing curling may decrease, and the protective film may be easily lifted during bending.

The resin film 3 contains the resin base film 3a.

As the resin base film 3a, <<1-3. The explanation about the resin base film (2a) in the term of resin film (2) >> can be used.

The resin film 3 may have a conductive layer 3b. The conductive layer 3b may be disposed between the pressure-sensitive adhesive layer 2 and the resin base film 3a.

The conductive layer 3b may consist of only one layer or two or more layers.

As the conductive layer 3b, <<1-3. The explanation about the conductive layer 2b in the term of resin film (2) >> can be used.

The resin film 3 may have an antistatic layer 3c. The antistatic layer 3c may be disposed between the pressure-sensitive adhesive layer 2 and the resin base film 3a and/or on the opposite side of the pressure-sensitive adhesive layer 2 of the resin base film 3a.

The antistatic layer 3c may have only one layer or two or more layers.

As the thickness of the antistatic layer 3c, any appropriate thickness can be employed depending on the purpose within a range not impairing the effects of the present invention. Such a thickness is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, still more preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm.

As the antistatic layer 3c, <<1-3. The explanation about the antistatic layer 2c in the term of resin film (2) >> can be used.

Any appropriate other component may be contained in the antistatic layer 3c within a range not impairing the effects of the present invention.

≪≪2. Manufacturing method of laminated body»»

The laminate according to the embodiment of the present invention can be manufactured by any suitable method within a range not impairing the effects of the present invention.

As a representative example of a method for manufacturing a laminate according to an embodiment of the present invention, a laminate according to an embodiment of the present invention comprises a resin film (1), an adhesive layer (1), a resin film (2), and an adhesive layer (2). , the resin film 3 in this order, and the case of a laminate composed of these components will be described.

One embodiment of the method for manufacturing a laminate according to an embodiment of the present invention includes a resin film (1), an adhesive layer (1), and a resin film (2) in this order, and a laminate composed of these components ( I), an adhesive layer (2), and a resin film (3) in this order, and a laminate (II) composed of these components is prepared, respectively, and then the resin film (2) of the laminate (I) ) and the surface of the pressure-sensitive adhesive layer (2) of the layered product (II).

Laminate (I) is, for example, a pressure-sensitive adhesive composition (at least one selected from the group consisting of an acrylic pressure-sensitive adhesive composition, a urethane-based pressure-sensitive adhesive composition, a rubber-based pressure-sensitive adhesive composition, and a silicone-based pressure-sensitive adhesive composition) forming the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer (1). is applied on a resin film (2), heated and dried as necessary, and cured as necessary to form the pressure-sensitive adhesive layer (1) on the resin film (2), and then the pressure-sensitive adhesive layer (1). It can manufacture by sticking the resin film 1 (when it has the release layer 1b, the side) to the surface on the opposite side to the said resin film 2 of).

In the layered product (II), for example, a pressure-sensitive adhesive composition (preferably, an acrylic pressure-sensitive adhesive composition) forming the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 2 is applied onto the resin film 3, and heating and drying are performed as necessary. It is carried out and cured as necessary to form the pressure-sensitive adhesive layer (2) on the resin film (3). In addition, in order to protect the exposed surface of the adhesive layer (2) until the laminated body (I) and the laminated body (II) are attached, any suitable separator (for example, similar to the resin film (1) A film of) may be affixed.

Example

Hereinafter, the present invention will be specifically described by examples, but the present invention is not limited to these examples at all. In addition, the test and evaluation method in Examples etc. are as follows. In addition, when described as "part", it means "part by weight" unless otherwise noted, and when described as "%", it means "% by weight" unless otherwise noted.

<Measurement of weight average molecular weight>

The weight average molecular weight was measured by a gel permeation chromatography (GPC) method. Specifically, it was measured under the following conditions using a trade name "HLC-8120GPC" (manufactured by Tosoh Co., Ltd.) as a GPC measuring device, and calculated according to a standard polystyrene conversion value.

(molecular weight measurement conditions)

Sample concentration: 0.2% by weight (tetrahydrofuran solution)

・Sample injection amount: 10μL

・Column: Trade name "TSKguardcolumn SuperHZ-H (1 pc) + TSKgel SuperHZM-H (2 pcs)" (manufactured by Tosoh Co., Ltd.)

・Reference column: Trade name "TSKgel SuperH-RC (1 piece)" (manufactured by Tosoh Co., Ltd.)

・Eluent: tetrahydrofuran (THF)

・Flow: 0.6mL/min

Detector: Differential refractometer (RI)

Column temperature (measurement temperature): 40°C

<tanδ>

A viscoelasticity measuring device "RSA-G2" (manufactured by TA Instruments Japan Co., Ltd.) was measured in a tensile mode with a sample size width of 5 mm x distance of 15 mm and an axial force of 100 g. In the strain sweep mode, the frequency was 1 Hz, the measurement temperature was 90°C, the immersion time was 60 seconds, and the strain measurement range was set to 0.01% to 1.0%, and the measurement was performed at the strain during that time. The value of tan δ at each strain was graphed, and the tan δ of the 0.1% strain and the 0.7% strain was determined from the graph. Regarding the thickness, the stiffness of the substrate is large for both the storage modulus and the loss modulus with respect to the adhesive film, and the influence of the adhesive is negligible. Measurement was performed by inputting only the thickness of the substrate excluding the thickness of the adhesive.

tan-delta was calculated|required by the following formula.

tanδ = loss modulus/storage modulus

<Curl evaluation (temperature 23°C, humidity 50% RH)>

A laminate composed of the resin film (1), the adhesive layer (1), and the resin film (2) and a laminate composed of the adhesive layer (2) and the resin film (3) were prepared, respectively, at a temperature of 23°C and a humidity of 50%. It was allowed to stand for 24 hours in an RH environment. Next, a laminate composed of the resin film (1), the pressure-sensitive adhesive layer (1), the resin film (2), the pressure-sensitive adhesive layer (2), and the resin film (3) was produced by bonding the two kinds of laminates together with a laminator. . The produced laminate was cut into a size of 50 mm x 150 mm, and the long side curl value after being left for 24 hours in an environment of a temperature of 23°C and a humidity of 50% RH was measured according to the stainless steel value rule. The sample was placed on a flat test table with the resin film (1) facing up, and the heights of the four corners from the test table were measured and averaged.

<Curl evaluation (temperature 80°C)>

Resin film (1), pressure-sensitive adhesive layer (1), resin film (2), pressure-sensitive adhesive layer (2), and resin film (3) in the same procedure as in the above <curl evaluation (temperature: 23°C, humidity: 50% RH)> A laminate was prepared, and a sample cut out to a size of 50 mm × 150 mm was left for 24 hours in an environment of a temperature of 23 ° C. and a humidity of 50% RH, and then left for 1 hour in an environment of 80 ° C. and a temperature of 23 ° C. After returning to the environment of °C and 50% RH and leaving it to stand for 1 hour, the long side curl value measured was measured according to the stainless steel value rule. The sample was placed on a flat test table with the resin film (1) facing up, and the heights of the four corners from the test table were measured and averaged.

<SPV Excitation Evaluation>

A laminate composed of the resin film (1), the adhesive layer (1), and the resin film (2) and a laminate composed of the adhesive layer (2) and the resin film (3) were prepared, respectively, at a temperature of 23°C and a humidity of 50%. It was allowed to stand for 24 hours in an RH environment. Next, a laminate consisting of the resin film (1), the pressure-sensitive adhesive layer (1), and the resin film (2) of 50 mm × 50 mm is laminated with the pressure-sensitive adhesive layer (2) and the resin film (3) of 150 mm × 75 mm. In the state attached to the central part of the sieve SPV, the SPV lifting value when the resin film 1 was fixed along a 3-inch winding core so as to be on the outside was measured according to the stainless steel value rule. The excitation values of the four sides were measured and averaged.

<SPV Peel Evaluation>

A laminate composed of the resin film (1), the adhesive layer (1), and the resin film (2) and a laminate composed of the adhesive layer (2) and the resin film (3) were prepared, respectively, at a temperature of 23°C and a humidity of 50%. It was allowed to stand for 24 hours in an RH environment. Next, a laminate composed of the resin film (1), the pressure-sensitive adhesive layer (1), and the resin film (2) of 50 mm × 50 mm was formed, and the pressure-sensitive adhesive layer (2) and the resin film (3) of 150 mm × 75 mm were formed. A sample in the state of being attached to the center of the laminate was prepared, the resin film (1) was peeled off, and the pressure-sensitive adhesive layer (1) was applied to a glass plate (manufactured by Matsunami Glass Kogyo Co., Ltd., trade name: Microslide Glass S), 2.0 It was affixed by reciprocating 1 kg roller. Next, the adhesive layer 2 and the resin film 3 were peeled, and at that time, whether or not the adhesive layer 1 and the glass plate were peeled was confirmed.

Peeling evaluation was performed based on the following criteria.

○: During the above operation, the pressure-sensitive adhesive layer (1) did not peel from the glass plate, and the laminate composed of the pressure-sensitive adhesive layer (2) and the resin film (3) could be peeled off.

×: During the above operation, the pressure-sensitive adhesive layer (1) is peeled off from the glass plate, and the laminate made of the pressure-sensitive adhesive layer (2), the pressure-sensitive adhesive layer (1), and the resin film (2) is attached to the laminate made of the resin film (3) had been

<Measurement of haze and total light transmittance>

Using a haze meter HM-150 (manufactured by Murakami Shikisai Research Institute, Inc.), haze (%) = (Td/Tt) × 100 (Td: diffuse transmittance, Tt: total light transmittance). The measurement was performed using a laminate of the resin film (1), the pressure-sensitive adhesive layer (2), the resin film (2), the pressure-sensitive adhesive layer (2), and the resin film (3) so that the resin film (3) came to the light source side. The sample was placed and measured. In addition, the total light transmittance was measured based on JIS-K-7316.

<Young's modulus of resin film (2)>

A sample piece was cut into a rectangle with a width of 10 mm, and measured by pulling the rectangular sample piece in the longitudinal direction at a distance between chucks of 100 mm with a universal tensile compression tester (Tensilon) in a temperature environment of 25 ° C. S-S ( The Young's modulus was obtained from the Strain-Strength) curve. As measurement conditions, the tensile speed was 200 mm/min, and the distance between chucks was 50 mm. The method for obtaining the Young's modulus from the S-S curve is to create a graph of the S-S curve, draw a tangent (linear equation) on the graph in a displacement range of 1 mm to 2 mm, and obtain the Young's modulus from the slope of the tangent.

<Measurement of adhesive force (1)>

The layered product (I) composed of resin film (1)/adhesive layer (1)/resin film (2) was cut to a width of 25 mm and a length of 150 mm to prepare samples for evaluation. In an atmosphere of a temperature of 23°C and a humidity of 50% RH, the resin film (1) is peeled off from the prepared evaluation sample, and 2.0 kg is applied to a glass plate (manufactured by Matsunami Glass Kogyo Co., Ltd., trade name: Microslide Glass S). It was affixed by roller 1 reciprocation. After curing for 30 minutes in an atmosphere of a temperature of 23°C and a humidity of 50% RH, it was peeled at a peel angle of 180 degrees and a peel rate of 300 mm/min using a universal tensile tester, and the adhesive strength (1) was measured.

<Measurement of adhesive force (2)>

A laminate (II) having a separator composed of a separator/adhesive layer (2)/resin film (3) was cut to a width of 25 mm and a length of 150 mm to prepare a sample for evaluation. Separately, after peeling the resin film (1) from the layered product (I) described in the section of <Measurement of adhesive force (1)>, an adherend attached to a glass plate was prepared, and an atmosphere of a temperature of 23 ° C. and a humidity of 50% RH was prepared. , The separator was peeled off from the sample for evaluation, and attached to the adherend by reciprocating a 2.0 kg roller 1. After curing for 30 minutes in an atmosphere of a temperature of 23°C and a humidity of 50% RH, it was peeled at a peel angle of 180 degrees and a peel rate of 300 mm/min using a universal tensile tester, and the adhesive force (2) was measured.

[Production Example 1]

As a separator, a PET film having a thickness of 25 μm, 50 μm, or 75 μm having a silicone release layer provided on the surface thereof was prepared.

[Production Example 2]: Preparation of pressure-sensitive adhesive composition A

As monomer components, 2-ethylhexyl acrylate (2EHA): 63 parts by weight, N-vinyl-2-pyrrolidone (NVP): 15 parts by weight, methyl methacrylate (MMA): 9 parts by weight, 2-hydroxy acrylate Ethyl (HEA): 13 parts by weight, 2,2'-azobisisobutyronitrile as a polymerization initiator: 0.2 parts by weight, and ethyl acetate as a polymerization solvent: 233 parts by weight were put into a separable flask, and nitrogen gas was introduced. While stirring for 1 hour, nitrogen substitution was performed. After removing oxygen in the polymerization system in this way, the temperature was raised to 60°C and reacted for 7 hours to prepare an adhesive composition A, which is a solution of acrylic polymer A having a weight average molecular weight (Mw) of 1,200,000.

[Production Example 3]: Preparation of pressure-sensitive adhesive layer A composed of pressure-sensitive adhesive A

The pressure-sensitive adhesive composition A prepared in Production Example 2 was applied to the release layer surface of any of the separators prepared in Production Example 1 so that the thickness after drying was 25 μm, and dried and aged at 130 ° C. for 3 minutes. In this way, a pressure-sensitive adhesive layer A having a thickness of 25 μm composed of the pressure-sensitive adhesive A formed of the pressure-sensitive adhesive composition A was formed on the separator.

[Production Example 4]: Preparation of pressure-sensitive adhesive composition B

<Preparation of acrylic oligomer B>

Dicyclopentanyl methacrylate (DCPMA) as a monomer component: 60 parts by weight and methyl methacrylate (MMA): 40 parts by weight, α-thioglycerol as a chain transfer agent: 3.5 parts by weight, toluene as a polymerization solvent: 100 parts by weight, , and stirred at 70°C for 1 hour under a nitrogen atmosphere. Subsequently, 0.2 parts by weight of 2,2'-azobisisobutyronitrile (AIBN) was added as a thermal polymerization initiator, and the mixture was reacted at 70°C for 2 hours, then heated to 80°C and reacted for 2 hours. Thereafter, the reaction solution was heated to 130°C, and toluene, chain transfer agent, and unreacted monomer were removed by drying to obtain solid acrylic oligomer B. The acrylic oligomer B had a weight average molecular weight (Mw) of 5100 and a glass transition temperature (Tg) of 130°C.

<Preparation of prepolymer composition B>

As a monomer component for forming a prepolymer, lauryl acrylate (LA): 35 parts by weight, 2-ethylhexyl acrylate (2EHA): 49 parts by weight, 4-hydroxybutyl acrylate (4HBA): 7 parts by weight, N- Vinyl-2-pyrrolidone (NVP): 9 parts by weight, and "Irgacure 184" manufactured by BASF as a photopolymerization initiator: 0.015 parts by weight were mixed, and polymerization was performed by irradiation with ultraviolet rays, prepolymer composition B (polymerization rate = about 10%) was obtained.

<Preparation of pressure-sensitive adhesive composition B>

The prepolymer composition B: 100 parts by weight, as post-added components, 1,6-hexanediol diacrylate (HDDA): 0.07 parts by weight, acrylic oligomer B: 3 parts by weight, and a silane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd.) , "KBM403"): After adding 0.3 weight part, they were mixed uniformly and the adhesive composition B was prepared.

[Production Example 5]: Preparation of pressure-sensitive adhesive layer B composed of pressure-sensitive adhesive B

An application layer was formed by applying the pressure-sensitive adhesive composition B prepared in Production Example 4 to a release layer surface of a separator prepared in Production Example 1 so that the thickness after drying was 25 µm. On this coating layer, as a cover sheet, a 75 μm-thick PET film (manufactured by Mitsubishi Chemical Corporation, “diaphragm MRF75”) subjected to silicone release treatment on one side was bonded. This laminate was irradiated with ultraviolet rays from the side of the cover sheet by a black light positioned so that the irradiation intensity on the irradiation surface immediately below the lamp was 5 mW/cm 2 , and photocuring was performed, and the cover sheet was removed. , A pressure-sensitive adhesive layer B having a thickness of 25 μm composed of the pressure-sensitive adhesive B formed of the pressure-sensitive adhesive composition B was formed on the separator.

[Production Example 6] Production of pressure-sensitive adhesive composition C

To a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas inlet pipe, and a condenser, butyl acrylate (manufactured by Nippon Shokubai Co., Ltd.): 95 parts by weight, acrylic acid (manufactured by Toagosei Co., Ltd.) 5 parts by weight, 2 as a polymerization initiator, 2'-Azobisisobutyronitrile (manufactured by Wako Pure Chemical Industries, Ltd.): 0.2 parts by weight, ethyl acetate: 156 parts by weight were added, nitrogen gas was introduced while gently stirring, and the liquid temperature in the flask was maintained at around 63 ° C. A polymerization reaction was performed for 10 hours to prepare a solution (40% by weight) of acrylic polymer C having a weight average molecular weight of 700,000. To the solution of the prepared acrylic polymer C, 6 parts by weight of TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) as a crosslinking agent in terms of solid content was added to 100 parts by weight of the solid content of the solution of acrylic polymer C, and the total solid content was 20 parts by weight It diluted with ethyl acetate so that it might become %, and stirred with the disper, and obtained the adhesive composition C.

[Production Example 7]: Preparation of pressure-sensitive adhesive layer C composed of pressure-sensitive adhesive C

The pressure-sensitive adhesive composition C prepared in Production Example 6 was applied to one of the release layers of the separator prepared in Production Example 1 to a thickness of 25 μm after drying, and dried and aged at 130° C. for 3 minutes. In this way, a pressure-sensitive adhesive layer C having a thickness of 25 μm composed of the pressure-sensitive adhesive C formed of the pressure-sensitive adhesive composition C was formed on the separator.

[Production Example 8] Production of pressure-sensitive adhesive composition D

2-ethylhexyl acrylate (manufactured by Nippon Shokubai Co., Ltd.): 100 parts by weight, 2-hydroxyethyl acrylate (manufactured by Toagosei Co., Ltd.): 4 parts by weight, 2,2'-azobisisobutyronitrile (manufactured by Wako Pure Chemical Industries, Ltd.) as a polymerization initiator: 0.2 parts by weight, ethyl acetate: 156 parts by weight, nitrogen gas was introduced while gently stirring, and the flask A polymerization reaction was performed for 8 hours while maintaining the solution temperature in the vicinity of 65°C to prepare a solution (40% by weight) of acrylic polymer D having a weight average molecular weight of 550,000. In the solution of acrylic polymer D, 4 parts by weight of Coronate HX (manufactured by Tosoh Corporation) in terms of solid content as a crosslinking agent, based on 100 parts by weight of the solid content of the solution of acrylic polymer D, Envirizer OL-1 (Tokyo Fine Chemical Co., Ltd.) as a crosslinking catalyst Inc.) was added in 0.01 parts by weight in terms of solid content, diluted with ethyl acetate so that the total solid content was 25% by weight, and stirred with a disper to obtain PSA composition D.

[Production Example 9] Production of pressure-sensitive adhesive composition E

As a polyfunctional polyol, 100 parts by weight of Preminol S3011 (manufactured by Asahi Glass Co., Ltd., Mn = 10000) in terms of solid content, 18 parts by weight of Coronate HX (manufactured by Nippon Polyurethane Kogyo Co., Ltd.) as a crosslinking agent in terms of solid content, As a cross-linking catalyst, 0.04 parts by weight of ferric iron (manufactured by Nihon Chemical Industry Co., Ltd.) in terms of solid content and as an anti-deterioration agent, 0.5 part by weight of Irganox 1010 (manufactured by BASF Corporation) in terms of solid content were added so that the total solid content was 35% by weight. It was diluted with ethyl acetate and stirred with a disper to obtain an adhesive composition E containing a urethane-based resin.

[Example 1]

<Manufacture of laminate (1-a)>

As the resin film 2, a polyimide-based substrate (trade name "Upilex-50S", manufactured by Ube Industries Co., Ltd.) having a thickness of 50 µm was prepared. The pressure-sensitive adhesive layer A obtained in Production Example 3 (LT25E was used as a separator) was bonded to one side of the resin film (2). The separator was left on the pressure-sensitive adhesive layer A as it was, and was used to protect the surface (pressure-sensitive adhesive layer surface) of the pressure-sensitive adhesive layer A. After passing the obtained structure once through a laminator (0.3 MPa, speed 0.5 m/min) at 80°C, it was aged in an oven at 50°C for one day. In this way, a laminate (1-a) having a configuration of separator (LT25E)/adhesive layer A/resin film (2) (Upilex-50S) was obtained.

<Manufacture of laminate (1-b)>

The pressure-sensitive adhesive composition C obtained in Production Example 6 was applied as a resin film (3) to "Lumiror S10" (thickness: 50 µm, manufactured by Toray Co., Ltd.) made of a polyester resin so that the thickness after drying with a fountain roll was 5 µm, and dried. It was cured and dried under conditions of a temperature of 130°C and a drying time of 30 seconds. In this way, the pressure-sensitive adhesive layer C (thickness: 5 μm) was prepared on the resin film 3 (thickness: 50 μm). Then, to the surface of the pressure-sensitive adhesive layer C, the silicone-treated surface of a base material made of a polyester resin with a thickness of 25 µm, which was silicone-treated on one side, was bonded to the laminated body composed of separator / pressure-sensitive adhesive layer C / resin film (3). (1-b) was obtained.

<Manufacture of laminate (1)>

The separator was peeled off from the obtained layered product (1-b), and the resin film (2) side of the layered product (1-a) was attached to the exposed pressure-sensitive adhesive layer C. Separator (LT25E) (thickness: 25 μm) / adhesive Layer A (thickness 25 μm) / resin film (2) (Upilex-50S) (thickness 50 μm) / pressure-sensitive adhesive layer C (thickness 5 μm) / resin film (3) (thickness 50 μm) laminate ( 1) was obtained.

The results are shown in Table 1.

[Examples 2 to 14]

It carried out similarly to Example 1 except having changed as shown in Table 1.

The results are shown in Table 1.

[Comparative Examples 1 and 2]

It carried out similarly to Example 1 except having changed as shown in Table 1.

The results are shown in Table 1.

The laminate of the present invention can be suitably used in manufacturing steps of optical members and electronic members.

Resin film (1): 10
Adhesive layer (1): 20
Resin film (2): 30
Adhesive layer (2): 40
Resin film (3): 50
Stacks: 100

Claims (16)

A five-layer laminate having a resin film (1), an adhesive layer (1), a resin film (2), an adhesive layer (2), and a resin film (3) in this order,
The resin film (2) and the pressure-sensitive adhesive layer (2) are directly laminated,
The resin film 1 is a separator having a thickness of 20 μm to 80 μm,
The pressure-sensitive adhesive layer 1 is an acrylic pressure-sensitive adhesive having a thickness of 5 μm to 30 μm,
The resin film 2 is a plastic film composed of a polyimide-based resin having a thickness of 20 μm to 80 μm,
The pressure-sensitive adhesive layer 2 is an acrylic pressure-sensitive adhesive having a thickness of 3 μm to 24 μm,
The resin film 3 is a plastic film composed of a polyester-based resin having a thickness of 40 μm to 80 μm,
tanδ (0.7%) of the resin film (2) at a strain of 0.7% measured in a tensile mode of a viscoelasticity measuring device is 0.1 or less;
A laminate having a long side curl value of 2.20 mm or less, measured after a sample cut out to a size of 50 mm x 150 mm was left for 24 hours in an environment of a temperature of 23°C and a humidity of 50% RH. According to claim 1,
In an environment of a temperature of 23 ° C. and a humidity of 50% RH, a laminate consisting of a 50 mm × 50 mm resin film (1), an adhesive layer (1), and a resin film (2) was formed into a 150 mm × 75 mm adhesive layer ( 2) A laminate having an SPV lifting value of 7.0 mm or less when the laminate (SPV) made of the resin film (3) is adhered to the central portion and fixed along a 3-inch winding core. According to claim 1 or 2,
The difference between tanδ (0.7%) at a strain of 0.7% and tanδ (0.1%) at a strain of 0.1% (tanδ (0.7%) - tanδ of the resin film (2) measured in the tensile mode of the viscoelasticity measuring device. (0.1%)) is 0.05 or less, a laminate. According to claim 1 or 2,
The laminated body in which the Young's modulus of the said resin film (2) at a temperature of 23 degreeC is 6.0x10 ^<7> Pa or more. According to claim 1 or 2,
The adhesive force (1) of the pressure-sensitive adhesive layer (1) to glass in an atmosphere of a temperature of 23 ° C. and a humidity of 50% RH, a tensile speed of 300 mm / min, and a 180-degree peel, of the pressure-sensitive adhesive layer (2), A laminate having a higher adhesive strength to glass (2) at a tensile speed of 300 mm/min and a 180-degree peel under an atmosphere of a temperature of 23°C and a humidity of 50% RH. According to claim 5,
The laminated body in which the said adhesive force (1) is 1 N/25 mm or more. According to claim 5,
The laminated body in which the said adhesive force (2) is less than 1 N/25 mm. According to claim 1 or 2,
A laminate whose total light transmittance of the laminate is 20% or more. According to claim 1 or 2,
A layered product wherein the haze of the layered product is 20% or less. According to claim 1 or 2,
A laminate for attaching to a foldable member. According to claim 10,
A laminate in which the foldable member is an OLED. According to claim 1 or 2,
A laminate for sticking to a rollable member. According to claim 12,
The laminate, wherein the rollable member is an OLED. delete delete delete

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