KR102501427B1 - Wafer transferring robot diagnostics method and wafer transferring robot diagnostics apparatus - Google Patents

Abstract

The present invention relates to a wafer transfer robot diagnostics method and a wafer transfer robot diagnostics apparatus. In particular, the wafer transfer robot diagnostics method according to one embodiment of the present invention comprises: a step of deducing and storing a first operating pattern by using robot operating information; a step of matching the robot operating information to the first operating pattern; and a step of, when the robot operating information exceeds a normative range of the first operating pattern, providing related information to the user. The step of deducing and storing the first operating pattern may comprise: a step of determining the operation starting point of a robot by collecting acceleration information; a step of determining the constant velocity operating section and the operation finishing time of the robot from the constant velocity information; a step of determining the return operation starting time of the robot by collecting the acceleration information; a step of determining the return constant velocity operating section and the return operation finishing time of the robot from the acceleration information; and a step of storing the operation starting time, the constant velocity operating section, the operation finishing time, the return operation starting time, the return constant velocity operating section and the return operation finishing time as a first operation pattern. Therefore, convenience of the user may be increased.

Description

Wafer transferring robot diagnostics method and wafer transferring robot diagnostics apparatus

The present invention relates to a method for diagnosing a wafer transfer robot and an apparatus for diagnosing a wafer transfer robot.

Semiconductor manufacturing equipment used for manufacturing semiconductors includes a photo equipment, an etching equipment, a cleaning equipment, a heat treatment equipment, a thin film forming equipment, a CMP equipment, and the like. These semiconductor manufacturing devices are grafted with various automation technologies, and in particular, a wafer transfer robot is used to transfer wafers into the device and perform a process. The wafer transfer robot generally includes at least one joint and can operate in several axes.

Recently, as the size and weight of semiconductor wafers increase and fine processes are applied, precise operation of wafer transfer robots is required. If the moving path of the wafer transfer robot is distorted or fails to safely hold the wafer, the wafer is damaged and a lot of time and money are required to restore the semiconductor manufacturing equipment to its original state, resulting in enormous damage to the semiconductor manufacturer.

In order to prevent such a problem, conventionally, electrical signals collected from a motor of a wafer transfer robot are analyzed to determine abnormality. However, in this method, there is a problem in that malfunction due to other factors cannot be confirmed even though the electrical signal of the motor is within a normal range. In addition, since the abnormality is determined only for the first motion input by the user, it is inconvenient for the user to input and test a new motion every time.

Korean Patent Publication No. 10-2019-0036699

An object of the present invention is to provide a method for diagnosing a wafer transfer robot and a device for diagnosing a wafer transfer robot capable of checking abnormal operation of the wafer transfer robot.

In addition, it can be applied by mounting on an existing wafer transfer robot, so the usability is high.

In addition, user convenience can be enhanced by patterning and storing the wafer transfer path.

In addition, it is possible to accurately know the section or time point where the wafer transfer robot has an error.

In addition, it is possible to accurately know the location where the wafer transfer robot has an error.

A method for diagnosing a wafer transfer robot according to an embodiment of the present invention includes deriving and storing a first operation pattern using robot operation information; matching robot motion information with the first motion pattern; and providing related information to a user when the robot motion information is out of the reference range of the first motion pattern, wherein the step of deriving and storing the first motion pattern includes collecting acceleration information and operating the robot. Determining the start time, determining the constant speed operation section and operation end point of the robot from the constant velocity information, determining the start point of the robot's return operation by collecting acceleration information, and performing the robot's return constant speed operation from the constant velocity information Determining the interval and the end point of the regression operation, and storing the operation start point, the constant velocity operation section, the operation end point, the regression operation start point, the regression constant speed operation section, and the regression operation end point as a first operation pattern. do.

In the step of providing the related information to the user, if the time information of each section of the robot motion information is out of the reference range of the first motion pattern, it is determined as an abnormal motion and the abnormal motion information may be provided to the user.

The time information of each section may be at least one of the operation start time, constant speed operation section, operation end time, regression operation start time, regression constant speed operation section, and regression operation end time.

In the step of matching the robot motion information with the first motion pattern, when the robot motion information corresponds to a reference range, the robot motion information may be updated to the first motion pattern.

An apparatus for diagnosing a wafer transfer robot according to an embodiment of the present invention includes an information collection unit; and a controller including a storage unit and a control unit, wherein the control unit performs the following method.

deriving a first operation pattern using the robot motion information collected by the information collection unit and storing it in the storage unit; matching robot motion information with the first motion pattern; and providing related information to a user when the robot motion information is out of the reference range of the first motion pattern.

Here, the step of deriving and storing the first operating pattern includes the step of collecting acceleration information from the information collection unit to determine the starting point of operation of the robot, and collecting constant velocity information from the information collection unit to determine the constant speed operation section of the robot. And determining the operation end point, collecting acceleration information from the information collection unit to determine the start point of the robot's regression operation, collecting constant velocity information from the information collection unit to perform the recursive constant velocity operation section and regression operation of the robot. Determining an end time point, and storing the operation start time, constant speed operation section, operation end time, regression operation start time, recursion registration operation section, and regression operation end time as a first operation pattern.

A further step of determining whether the wafer transfer robot is holding the wafer using the acceleration information, and storing the first operation pattern as the first operation pattern may include determining whether the wafer transfer robot is holding the wafer. It can be stored including information about.

The robot may include at least two or more arms. In this case, the step of deriving and storing the first operating pattern using the robot motion information may include deriving and storing the first operating pattern for each of the robot arms using the robot motion information for each of the robot arms. there is. In the matching of the robot motion information with the first motion pattern, motion information for each of the robot arms may be matched with the first motion pattern for each of the robot arms. In addition, in the step of providing related information to the user when the robot motion information is out of the reference range of the first operation pattern, related information for each of the robot arms may be provided to the user.

A wafer transfer robot according to an embodiment of the present invention includes a first arm, a second arm, and a joint disposed between the first arm and the second arm, and is attached to at least one of the first arm and the second arm. and an arranged wafer transfer robot diagnostic device. Here, the wafer transfer robot diagnosis device has been described above.

An apparatus for manufacturing a semiconductor according to an embodiment of the present invention includes a wafer transfer robot including a first arm, a second arm, and a joint disposed between the first arm and the second arm, and a device for diagnosing the wafer transfer robot. Here, the wafer transfer robot diagnosis device has been described above.

The method for diagnosing a wafer transfer robot and the apparatus for diagnosing a wafer transfer robot according to embodiments of the present invention may check abnormal operation of the wafer transfer robot.

In addition, it can be applied by mounting on an existing wafer transfer robot, so the usability is high.

In addition, user convenience can be enhanced by patterning and storing the wafer transfer path.

In addition, it is possible to accurately know the section or time point where the wafer transfer robot has an error.

In addition, it is possible to accurately know the location where the wafer transfer robot has an error.

1 illustrates an apparatus for diagnosing a wafer transfer robot according to an embodiment of the present invention.
2 shows a wafer transfer robot.
3 illustrates a state in which a wafer transfer robot transfers a wafer.
4 to 6 show that the control unit generates and applies an operation pattern.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention may be modified in various forms, and the scope of the present invention is not limited to the embodiments described below. In addition, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shape and size of elements in the drawings may be exaggerated for clearer description, and elements indicated by the same reference numerals in the drawings are the same elements. In addition, the same reference numerals are used throughout the drawings for parts having similar functions and actions. In addition, "include" a component in the entire specification means that other components may be further included without excluding other components unless otherwise stated.

1 illustrates an apparatus 100 for diagnosing a wafer transfer robot according to an embodiment of the present invention. Referring to FIG. 1 , an apparatus for diagnosing a wafer transfer robot 100 according to an embodiment of the present invention includes an information collection unit 110; and a controller 120 including a storage unit and a control unit. There may be one or more information collection units 110 communicating with the controller 120 .

The information collection unit 110 may be a sensor mounted on the wafer transfer robot 10 to collect information related to the movement of the wafer transfer robot 10 . For example, the information collection unit 110 may include at least one of an acceleration sensor, a velocity sensor, and a displacement sensor. The information collection unit 110 may have its own power source or operate using an external power source, and may use the power source of the wafer transfer robot 10 .

The information collection unit 110 may be mounted on at least some of the plurality of arms 11 , 12 , and 13 of the wafer transfer robot 10 to collect information related to the operation of the corresponding arms. In general, the arm of the wafer transfer robot 10 surrounds components such as motors and wires with outer shells made of metal or polymer so that components such as motors and wires are not exposed to the outside. At this time, the information collection unit 110 may be free from external shocks by being disposed inside the shell of the arm.

The information collection unit 110 may further include a communication module for transmitting information collected from the sensor to the controller 120 . The communication module may be a wired or wireless communication module used for transmitting and receiving information in the relevant technical field, and is not particularly limited.

The controller 120 is a device for storing and calculating the information collected by the information collection unit 110 and includes a control unit and a storage unit. The controller 120 may be an electronic device such as a computer, tablet, or smart phone, and is not particularly limited.

The control unit may include at least one processor, and the methods of the present invention may be performed by executing a program stored in a computer-readable storage medium by the processor.

The storage unit may include at least one memory semiconductor, and may store information collected by the information collection unit 110 or information derived by a method executed by the control unit.

The controller 120 may further include a communication module for communicating with the information collection unit 110 or an external electronic device. The communication module may be a wired or wireless communication module used for transmitting and receiving information in the relevant technical field, and is not particularly limited.

In another embodiment, the information collection unit 110 and the controller 120 may be integrally manufactured and attached to at least one of the arms 11 , 12 , and 13 of the wafer transfer robot 10 . The user can collect information from the controller 120 through a storage medium such as USB or collect information through communication using an external electronic device.

A method for diagnosing a wafer transfer robot performed by the apparatus 100 for diagnosing a wafer transfer robot according to an embodiment of the present invention includes deriving and storing a first operation pattern using robot motion information; matching robot motion information with the first motion pattern; and providing related information to a user when the robot motion information is out of the reference range of the first motion pattern. Here, the robot motion information refers to information such as acceleration, time, speed, and the like according to the motion of the robot collected through the information collection unit 110 . Through this, the user can determine whether the motion of the wafer transfer robot 10 is within a normal range and take appropriate measures, such as repairing the wafer transfer robot 10 . In general, the wafer transfer robot 10 moves between a number of defined destinations and thus operates along a number of fixed paths. Referring to FIG. 3, in order to transfer the wafer 1 from (a) to (b), the wafer transfer robot 10 moves the plurality of arms 11, 12, and 13 in the same way along the same path ( 1) will be transferred. In an embodiment of the present invention, the control unit can determine at least one path (operation pattern) by continuously collecting information related to the operation path of the wafer transfer robot 10 through the information collection unit 110, When the operating time, speed, acceleration, etc. of the wafer transfer robot 10 deviate from these operating patterns, a user may be warned.

The step of deriving and storing the first operation pattern is performed by the control unit receiving the information collected by the information collecting unit 110 . More specifically, the step of deriving and storing the first operating pattern may include collecting acceleration information and determining a robot operation start time, determining a constant speed operation section and an operation end time of the robot from constant velocity information, Collecting acceleration information to determine the start time of the robot's regression operation, determining the robot's return constant speed operation section and the end time of the regression operation from the constant velocity information, and the operation start time, constant speed operation section, operation end time, and storing the start point of the regression operation, the constant speed return operation section, and the end point of the regression operation as a first operation pattern.

In this step, the control unit may derive a result value by calculating necessary information by applying various equations as necessary. For example, information such as acceleration, speed, distance, and time may be derived through the equation below.

[mathematical expression]

where A is acceleration, t is time, h is height or distance, and v is velocity.

When the wafer transfer robot 10 starts operating, the speed and acceleration increase from zero. Accordingly, the time when the acceleration changes from 0 may be defined as the time point at which the wafer transfer robot 10 starts to operate.

While the wafer transfer robot 10 is operating, the acceleration may converge to zero when reaching a specific value. This is a section in which the wafer transfer robot 10 moves at a constant speed. Thereafter, the wafer transfer robot 10 reaches the final destination while reducing its speed. At this time, the acceleration increases again and becomes 0, so that the wafer transfer robot 10 stops. This time can be defined as the end point of operation.

Next, the wafer transfer robot 10 may move to a starting position or a next destination. In this case, the velocity and acceleration increase again from zero. Accordingly, the time when the acceleration changes from 0 may be defined as the time point at which the wafer transfer robot 10 starts the regression operation.

Similarly, while the wafer transfer robot 10 is regressing, the acceleration may converge to zero when reaching a specific value. This is a section in which the wafer transfer robot 10 moves at a constant speed. Thereafter, the wafer transfer robot 10 reaches the starting position or the next destination while reducing speed. At this time, the acceleration increases again and becomes 0, so that the wafer transfer robot 10 stops. This time can be defined as the end point of the regression operation.

The control unit collects information on the operation start time, constant speed operation section, operation end time, regression operation start time, regression constant speed operation section, and regression operation end time collected in this way, and stores it in the storage unit as a first operation pattern. . Information on each section and time point may include time information, for example, required time of the section, required time from the start point to each section or time point, and the like. In addition, information on acceleration or velocity may be included in matching information at each time. 4 is an example showing a stored first operation pattern as a graph. Operation start point S, constant speed operation section SU, operation end point E1, return operation start time point B, return constant speed operation section BU, and return operation end point E2 are distinguished by acceleration and displayed in matching with respect to the time axis. In addition, referring to FIG. 4 , the first operation pattern information includes a section SA1 in which the wafer transfer robot 10 accelerates from the operation start time S to the constant speed operation section SU, and a deceleration from the constant speed operation section SU to the operation end time E1. Section SA2, section BA1 accelerating from the regression operation start point B to the return constant speed operation section BU, and section BA2 decelerating from the return constant speed operation section BU to the regression operation end point E2 may further be included. In addition, it can be seen that the first operation pattern information includes time information and acceleration information.

When the user requests the controller to store the first operating pattern information, the controller may collect information from the information collection unit 110 for a time set by the user to calculate and store the first operating pattern information. In another embodiment, when a motion pattern corresponding to a predetermined criterion is detected multiple times while the wafer transfer robot 10 is operating, the control unit may store the motion pattern as first motion pattern information. In this case, time and acceleration information at each time point and section fall within a certain range, but may have different values. The control unit may determine a specific value or a specific range by calculating the average value or the median value of these different values. Referring to FIG. 6, the control unit extracts specific time information and acceleration information for a section and time point from a plurality of pieces of collected information and stores them as a first operation pattern (time) and a second operation pattern (acceleration), respectively. It can be seen that the allowable range (time) and allowable range (acceleration) were calculated by determining a certain range from the first operation pattern (time) and the first operation pattern (acceleration).

In this step, after checking whether the wafer transfer robot 10 is holding the wafer, the control unit may collect, calculate, and store different operation pattern information for each. When the wafer transfer robot 10 grips the wafer, there may be a difference in acceleration and movement time when the wafer transfer robot 10 moves due to the weight of the wafer. Also, when holding a wafer, the acceleration and speed of the wafer transfer robot 10 may be set slowly for safety. For this reason, by storing operation pattern information differently depending on whether the wafer transfer robot 10 is holding a wafer, it is possible to more accurately monitor whether or not the wafer transfer robot 10 is abnormal. Referring to FIG. 5 , it can be seen that operation pattern information is set when there is a wafer and when there is no wafer.

After the first operation pattern is stored and set in this way, information about the operation of the wafer transfer robot 10, specifically, the step of matching acceleration or time information corresponding to the information of the first operation pattern with the first operation pattern. do In this step, in addition to acceleration and time, values calculated by the above equation, such as speed and distance, may be matched with values of the first operation pattern.

In this step, the control unit can determine whether the wafer transfer robot 10 is holding the wafer from the information collected from the information collection unit 110, and whether the wafer transfer robot 10 is holding the wafer. According to this, operation pattern information corresponding to each condition can be matched. For example, in FIG. 5 , the control unit determines whether or not to grip the wafer based on the acceleration and time information collected in the initial acceleration section SA1, and if it is determined that the wafer is gripped, the first operation pattern information on the existence of the wafer and the current robot operation matching information.

When the robot motion information falls within the allowable range, the controller may not perform a special task because the wafer transfer robot 10 is normally operating. In another embodiment, when the robot motion information falls within an acceptable range, the robot motion information may be updated to the first motion pattern. Through this, the first operation pattern information can be corrected to a more accurate range, thereby preventing the controller from making an erroneous determination.

If the time information of each section of the robot motion information is out of the permissible range of the first motion pattern, it may be determined as an abnormal motion and the abnormal motion information may be provided to the user.

In this step, there is a case where a plurality of robot motion information out of the permissible range of the first operation pattern forms a new operation pattern in the same or similar range. This may be that a new destination for the wafer transfer robot 10 is created or an operation algorithm is created. In this way, when a new operation pattern is recognized, the controller can generate a second operation pattern that is a new operation pattern distinguished from the first operation pattern. More specifically, in the step of matching the robot motion information with the first motion pattern, if the robot motion information is out of the reference range, the robot motion information is stored as a non-pattern DB of the storage unit, and stored in the non-pattern DB. Among robot motion information, a plurality of robot motion information having the same information within a predetermined time range may be stored as a second motion pattern. At this time, the control unit may store in advance the number of repetitions, the acceleration range, and the time range, which are criteria for determining whether to generate a new operation pattern, and the robot motion information deviating from the first operation pattern meets the above criteria. In this case, the user may be requested whether to allow the second operation pattern by generating the second operation pattern and providing related information to the user.

In one embodiment, the wafer transfer robot 10 may include at least two arms 11, 12, and 13 (see FIGS. 2 and 3). In this case, the control unit receives information on each of the arms 11, 12, and 13 from the information collection unit 110 and generates operation pattern information on each of the arms 11, 12, and 13 through this. Then, it is possible to check whether there is an abnormality by matching with the operation information of each of the arms 11, 12, and 13. Through this, it is possible to more accurately determine which arm of the plurality of arms 11, 12, and 13 of the wafer transfer robot 10 has a problem.

Specifically, the step of deriving and storing the first operation pattern using the robot motion information may include the robot arms 11, 12, and 13 using the robot motion information for each of the robot arms 11, 12, and 13. ) It is possible to derive and store the first operation pattern for each of. To this end, the information collection unit 110 may be disposed on each of the arms 11, 12, and 13. In addition, the step of matching the robot motion information with the first motion pattern may include the motion information for each of the robot arms 11, 12, and 13 as a first motion information for each of the robot arms 11, 12, and 13. It can be matched with the working pattern. At this time, only the operation information of some arms may deviate from the first operation pattern. In addition, in the step of providing related information to the user when the robot motion information is out of the reference range of the first operation pattern, related information for each of the robot arms may be provided to the user.

The wafer transfer robot 10 according to an embodiment of the present invention includes a first arm 11, a second arm 12, and a joint disposed between the first arm 11 and the second arm 12. and a wafer transfer robot diagnostic device 100 disposed on at least one of the first arm 11 and the second arm 12. At this time, both the information collection unit 110 and the controller 120 of the wafer transfer robot diagnosis device 100 may be disposed on the arms 11 and 12 of the wafer transfer robot 10, and the information collection unit 110 Only the arms 11 and 12 are disposed and the controller 120 may be disposed outside. Here, the wafer transfer robot diagnosis device 100 has been described above.

An apparatus for manufacturing a semiconductor according to an embodiment of the present invention transfers a wafer including a first arm 11, a second arm 12, and a joint disposed between the first arm 11 and the second arm 12. It includes a robot 10 and a wafer transfer robot diagnostic device 100 . Here, the wafer transfer robot diagnosis device 100 has been described above. The semiconductor manufacturing device includes a photo device, a thin film deposition device, a CMP device, a cleaning device, an etching device, an inspection device, and the like, and is not particularly limited.

The present invention is not limited by the above-described embodiments and accompanying drawings, but is intended to be limited by the appended claims. Therefore, various forms of substitution, modification, and change will be possible by those skilled in the art within the scope of the technical spirit of the present invention described in the claims, which also falls within the scope of the present invention. something to do.

100: wafer transfer robot diagnosis device, 110: information collection unit, 120: controller, 10: wafer transfer robot, 11: first arm, 12: second arm, 13: third arm, 1: wafer

Claims (11)

Deriving and storing a first operation pattern using robot operation information of a wafer transfer robot; matching robot motion information with the first motion pattern; And providing related information to a user when the robot motion information is out of the reference range of the first operation pattern; includes,
The step of deriving and storing the first operation pattern,
Collecting acceleration information to determine when the robot starts to operate;
Determining the constant speed operation section and operation end point of the robot from the constant speed information;
Collecting acceleration information to determine the starting point of the robot's regression operation;
Determining the return constant speed operation section of the robot and the end point of the return operation from the constant speed information, and
Storing the operation start time, constant speed operation section, operation end time, regression operation start time, regression constant speed operation section, and regression operation end time as a first operation pattern,
In the step of matching the robot motion information with the first motion pattern, if the robot motion information is out of the reference range, the robot motion information is stored in a non-pattern DB, and among the robot motion information stored in the non-pattern DB, a certain time Storing a plurality of robot motion information having the same information within a range as a second operation pattern,
Wafer transfer robot diagnosis method.
According to claim 1,
The step of providing relevant information to the user,
When the time information of each section of the robot motion information is out of the reference range of the first operation pattern, it is determined as an abnormal operation and the abnormal operation information is provided to the user,
Wafer transfer robot diagnosis method.
According to claim 2,
The time information of each section is at least one of the operation start time, constant speed operation section, operation end time, regression operation start time, regression constant speed operation section, and regression operation end point,
Wafer transfer robot diagnosis method.
According to claim 1,
In the step of matching the robot motion information with the first motion pattern, when the robot motion information corresponds to a reference range, updating the robot motion information to the first motion pattern.
Wafer transfer robot diagnosis method.
delete According to claim 1,
The operation start time, constant speed operation section, operation end time, regression operation start time, regression constant speed operation section, and regression operation end point stored in the step of storing as the first operation pattern are at least one,
Wafer transfer robot diagnosis method.
According to claim 1,
Further comprising determining whether the wafer transfer robot is holding a wafer by using the acceleration information,
The step of storing as the first operation pattern is to include and store information on whether or not the wafer transfer robot is holding a wafer,
Wafer transfer robot diagnosis method.
According to claim 1,
The wafer transfer robot includes at least two arms,
In the step of deriving and storing a first operating pattern using robot operation information of the wafer transfer robot, the first operating pattern for each of the robot arms is derived and stored using robot operation information for each of the robot arms. do,
The matching of the robot operation information with the first operation pattern matches the operation information for each of the robot arms with the first operation pattern for each of the robot arms,
In the case where the robot motion information is out of the reference range of the first operation pattern, the step of providing related information to the user includes providing related information to the user for each of the robot arms.
Wafer transfer robot diagnosis method.
information collection department; and
In the wafer transfer robot diagnostic device comprising a; controller including a storage unit and a control unit,
The control unit,
deriving a first operation pattern using the robot motion information of the wafer transfer robot collected by the information collection unit and storing it in the storage unit; matching robot motion information with the first motion pattern; And when the robot motion information is out of the reference range of the first operation pattern, providing related information to the user;
The step of deriving the first operation pattern and storing it in the storage unit,
Collecting acceleration information from the information collection unit to determine an operating start point of the robot;
Collecting constant speed information from the information collection unit to determine a constant speed operating section and an end point of operation of the robot;
Collecting acceleration information from the information collection unit to determine a starting point of the robot's regression operation;
Collecting constant velocity information from the information collection unit to determine the return constant velocity operation section and the end point of the return operation of the robot; and
Storing the operation start time, the constant speed operation section, the operation end time, the regression operation start time, the return registration operation section, and the regression operation end time as a first operation pattern,
In the step of matching the robot motion information with the first motion pattern, if the robot motion information is out of the reference range, the robot motion information is stored in a non-pattern DB, and among the robot motion information stored in the non-pattern DB, a certain time Storing a plurality of robot motion information having the same information within a range as a second operation pattern,
Wafer transfer robot diagnosis device.
A first arm, a second arm, and a joint disposed between the first arm and the second arm,
A wafer transfer robot diagnostic device disposed on at least one of the first arm and the second arm,
The wafer transfer robot diagnostic device of claim 9,
A wafer transfer robot comprising a wafer transfer robot diagnosis device.
A wafer transfer robot including a first arm, a second arm, and a joint disposed between the first arm and the second arm; and
Including the wafer transfer robot diagnostic device of claim 9,
Devices for semiconductor manufacturing.

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