KR102494259B1 - Antenna structure and display device including the same - Google Patents

Abstract

The antenna structure of the embodiments of the present invention includes a film antenna including a dielectric layer and an antenna electrode layer formed on an upper surface of the dielectric layer, and a flexible circuit board including a power supply wire electrically connected to the antenna electrode layer. A bonding area is defined by an area where the antenna electrode layer and the feed wire overlap in a planar direction, and the length of the bonding area is 1.5 mm or less. Signal efficiency and radiation reliability may be improved by adjusting the length of the bonding region.

Description

Antenna structure and display device including the same {ANTENNA STRUCTURE AND DISPLAY DEVICE INCLUDING THE SAME}

The present invention relates to an antenna structure and a display device including the same. More specifically, it relates to an antenna structure including an electrode and a dielectric layer and a display device including the same.

Recently, as the information society develops, wireless communication technologies such as Wi-Fi and Bluetooth are combined with display devices and implemented in the form of, for example, smart phones. In this case, an antenna may be coupled to the display device to perform a communication function.

As mobile communication technology has recently evolved, it is necessary to combine an antenna for communication in an ultra-high frequency band with the display device.

In addition, as the display device on which the antenna is mounted becomes thinner and lighter, the space occupied by the antenna may also decrease. Accordingly, it is not easy to simultaneously implement transmission and reception of high-frequency and broadband signals within a limited space.

Accordingly, it is necessary to develop an antenna inserted into the thin display device in the form of a film or a patch and ensuring reliability of radiation characteristics despite the thin structure.

For example, when power is supplied to an antenna from a driving integrated circuit (IC) chip, unintentional radiation may occur from a wire through which power is distributed. Due to this, noise may occur and radiation efficiency of the antenna may decrease.

For example, Korean Patent Publication No. 2013-0095451 discloses an antenna integrated with a display panel, but fails to provide an alternative to the above problems.

Korean Patent Publication No. 2013-0095451

One object of the present invention is to provide an antenna structure with improved signal efficiency and reliability.

One object of the present invention is to provide a display device including an antenna structure having improved signal efficiency and reliability.

1. A film antenna comprising a dielectric layer and an antenna electrode layer formed on a top surface of the dielectric layer; and a flexible circuit board including a power supply wire electrically connected to the antenna electrode layer,

A bonding area is defined by an area where the antenna electrode layer and the feed wire overlap in a planar direction, and the length of the bonding area is 1.5 mm or less, the antenna structure.

2. The antenna structure according to 1 above, wherein the bonding area has a length of 1.1 mm or less.

3. The antenna structure according to 1 above, wherein the bonding area has a length of 50 μm to 0.7 mm.

4. The method of 1 above, wherein the antenna electrode layer includes a radiation pattern and a signal pad electrically connected to the radiation pattern,

The feed wire is electrically connected to the signal pad, the antenna structure.

5. The antenna structure according to 4 above, wherein the feed wire and the signal pad have the same bonding width.

6. The method of 5 above, further comprising a conductive intermediate structure disposed between the power supply line and the signal pad,

The conductive intermediate structure has the same bonding width as the feed wire and the signal pad, the antenna structure.

7. The method of 1 above, wherein the flexible circuit board further includes a core layer and a power supply ground disposed on an upper surface of the core layer,

The power supply wiring is disposed on the bottom surface of the core layer, the antenna structure.

8. The method of 7 above, wherein the antenna electrode layer includes a radiation pattern, a signal pad electrically connected to the radiation pattern, and a ground pad disposed around the signal pad, and the feed ground is electrically connected to the ground pad , the antenna structure.

9. The antenna structure according to 1 above, wherein the flexible circuit board is disposed on the antenna electrode layer of the film antenna.

10. The antenna structure according to 1 above, wherein the flexible circuit board is disposed under the lower surface of the dielectric layer of the film antenna.

11. The antenna structure according to 10 above, wherein the film antenna further comprises an antenna ground layer disposed on the bottom surface of the dielectric layer.

12. The antenna structure according to 10 above, wherein the antenna electrode layer is bent and extends onto the bottom surface of the dielectric layer.

13. The antenna structure according to 12 above, wherein the flexible circuit board further comprises a power supply contact electrically connecting the antenna electrode layer and the power supply line.

14. The antenna structure according to 1 above, further comprising a driving integrated circuit chip disposed on the flexible circuit board and supplying power to the antenna electrode layer through the power supply wiring.

15. The antenna structure according to 14 above, which is driven at a frequency of 20 to 30 GHz, and power corresponding to a range of 40 to 70 Ω is supplied through the driving integrated circuit chip.

16. The antenna structure according to 1 above, wherein the antenna electrode layer includes a mesh structure.

17. The antenna structure according to 16 above, wherein the film antenna further comprises a dummy mesh layer disposed around the antenna electrode layer.

18. A display device comprising the antenna structure according to any one of 1 to 17 above.

In the antenna structure according to embodiments of the present invention, the bonding length of the antenna electrode layer connected to the feed line of the flexible circuit board may be adjusted within a predetermined range. In addition, bonding widths of the feed wire and the antenna electrode layer may be substantially the same. Accordingly, impedance matching in the bonding area of the antenna electrode layer and the power supply line can be improved, and self-radiation in the power supply line can be suppressed. Thus, for example, the efficiency and reliability of signal supply from the driver IC chip to the antenna electrode can be improved.

In some embodiments, the flexible circuit board may further include a power supply ground disposed on an upper layer of the power supply line. Accordingly, self-radiation from the power supply wiring may be further shielded or reduced.

In some embodiments, transmittance of the antenna structure may be improved by forming at least a portion of the antenna electrode layer in a mesh structure. For example, the antenna structure can be applied to a display device including a mobile communication device capable of transmitting and receiving in a 3G or higher, eg, 5G high-frequency band, thereby improving optical characteristics such as radiation characteristics and transmittance.

1 is a schematic cross-sectional view illustrating an antenna structure according to example embodiments.
2 is a schematic plan view for explaining an antenna electrode layer structure of an antenna structure according to exemplary embodiments.
3 is a partially enlarged cross-sectional view illustrating a connection between a power supply wire and an antenna electrode layer in a bonding area according to some embodiments.
4 is a schematic cross-sectional view illustrating an antenna structure according to some exemplary embodiments.
5 is a schematic plan view for explaining an antenna electrode layer structure of an antenna structure according to some exemplary embodiments.
6 is a schematic plan view illustrating a display device according to example embodiments.
7 is a graph showing changes in S parameters according to changes in the length of a bonding area of an antenna structure according to example embodiments.

Embodiments of the present invention include a flexible circuit board including a dielectric layer, an antenna electrode, and a power supply wiring layer electrically connected to the antenna electrode, and radiation is obtained by adjusting the length of a bonding area to which the power supply wiring layer and the antenna electrode are connected. An antenna structure with improved reliability is provided. The antenna structure may be, for example, a microstrip patch antenna manufactured in the form of a transparent film. The antenna structure may be applied to, for example, a communication device for 3G to 5G mobile communication.

In addition, embodiments of the present invention provide a display device including the antenna structure.

With reference to the following drawings, embodiments of the present invention will be described in more detail. However, the following drawings attached to this specification illustrate preferred embodiments of the present invention, and serve to further understand the technical idea of the present invention together with the contents of the above-described invention, so the present invention is described in such drawings should not be construed as limited to

In the drawings below, for example, two directions that are parallel to the upper surface of the dielectric layer 110 and cross each other are defined as a first direction and a second direction. For example, the first direction and the second direction may perpendicularly cross each other. A direction perpendicular to the upper surface of the dielectric layer 110 is defined as a third direction. For example, the first direction may correspond to the length direction of the antenna structure, the second direction may correspond to the width direction of the antenna structure, and the third direction may correspond to the thickness direction of the antenna structure. The definition of the direction may be equally applied to the remaining drawings.

1 is a schematic cross-sectional view illustrating an antenna structure according to example embodiments.

Referring to FIG. 1 , the antenna structure may include a film antenna 100 and a flexible circuit board (FPCB) 200 . The antenna structure may further include a drive integrated circuit (IC) chip electrically connected to the film antenna 100 through the flexible circuit board 200 .

The film antenna 100 may include a dielectric layer 110 and an antenna electrode layer 120 disposed on an upper surface of the dielectric layer 110 . In some embodiments, the antenna ground layer 130 may be disposed on the lower surface of the dielectric layer 110 .

The dielectric layer 110 may include, for example, a transparent resin material. For example, the dielectric layer 110 may be a polyester-based resin such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, or polybutylene terephthalate; cellulosic resins such as diacetyl cellulose and triacetyl cellulose; polycarbonate-based resin; acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate; styrenic resins such as polystyrene and acrylonitrile-styrene copolymer; polyolefin-based resins such as polyethylene, polypropylene, polyolefins having a cyclo-based or norbornene structure, and ethylene-propylene copolymers; vinyl chloride-based resins; amide resins such as nylon and aromatic polyamide; imide-based resins; polyethersulfone-based resins; sulfone-based resins; polyether ether ketone-based resins; sulfurized polyphenylene-based resins; vinyl alcohol-based resin; vinylidene chloride-based resins; vinyl butyral-based resins; allylate-based resins; polyoxymethylene-based resin; A thermoplastic resin such as an epoxy resin may be included. These may be used alone or in combination of two or more.

In addition, a transparent film made of a thermosetting resin or an ultraviolet curable resin such as (meth)acrylic, urethane, acrylurethane, epoxy, or silicone may be used as the dielectric layer 110 . In some embodiments, an adhesive film such as optically clear adhesive (OCA) or optically clear resin (OCR) may be included in the dielectric layer 110 .

In some embodiments, the dielectric layer 110 may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, glass, or the like.

In one embodiment, dielectric layer 110 may be provided as a substantially single layer. In one embodiment, the dielectric layer 110 may include a multilayer structure of at least two or more layers.

Capacitance or inductance is formed between the antenna electrode layer 120 and the antenna ground layer 130 by the dielectric layer 110, and the frequency band in which the film antenna can be driven or sensed can be adjusted. there is. In some embodiments, the permittivity of the dielectric layer 110 may be adjusted to a range of about 1.5 to about 12. When the permittivity exceeds about 12, the driving frequency is excessively reduced, and driving in a desired high-frequency band may not be implemented.

The antenna electrode layer 120 may include a radiation pattern of the film antenna 100 . According to example embodiments, the antenna electrode layer 120 further includes a transmission line and a pad electrode, and the pad electrode and the radiation pattern may be electrically connected to each other by the transmission line. The pad electrode may include a signal pad and a ground pad. The configuration and structure of the antenna electrode layer 120 will be described later in detail with reference to FIG. 2 .

The antenna ground layer 130 may be disposed on the lower surface of the dielectric layer 110 . In some embodiments, the antenna ground layer 130 may be disposed to entirely overlap the antenna electrode layer 120 in a planar direction.

The antenna electrode layer 120 and the antenna ground layer 130 are made of silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium ( Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin ( Sn) or alloys thereof. These may be used alone or in combination of two or more. For example, silver (Ag) or a silver alloy (eg, a silver-palladium-copper (APC) alloy) may be used to implement low resistance.

In some embodiments, the antenna electrode layer 120 and the antenna ground layer 130 are transparent materials such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (ITZO), or zinc oxide (ZnOx). It may also contain metal oxides.

The flexible circuit board 200 may be disposed on the antenna electrode layer 120 to be electrically connected to the film antenna 100 . The flexible circuit board 200 may include a core layer 210 , a power supply line 220 and a power supply ground 230 . An upper coverlay film 250 and a lower coverlay film 240 may be formed on the upper and lower surfaces of the core layer 210 to protect wires, respectively.

The core layer 210 may include, for example, a flexible resin material such as polyimide, epoxy resin, polyester, cyclo olefin polymer (COP), or liquid crystal polymer (LCP).

The power supply wiring 220 may be disposed on the lower surface of the core layer 210 , for example. The power supply wiring 220 may be provided as a wiring that distributes power from the driving integrated circuit (IC) chip 280 to the antenna electrode layer 120 .

According to example embodiments, the power supply wire 220 may be electrically connected to the antenna electrode layer 120 (eg, the signal pad 126 shown in FIG. 2 ) through the conductive intermediate structure 150 .

The conductive intermediate structure 150 may be manufactured from, for example, an anisotropic conductive film (ACF). In this case, the conductive intermediate structure 150 may include conductive particles (eg, silver particles, copper particles, carbon particles, etc.) dispersed in the resin layer.

As shown in FIG. 1 , a bonding area BA may be defined by an area where the antenna electrode layer 120, the conductive intermediate structure 150, and the feed wire 220 are sequentially contacted or stacked in the third direction. there is.

For example, a portion of the power supply line 220 having a size corresponding to the bonding area BA may be exposed by partially cutting or removing the lower coverlay film 240 . A bonding structure in the bonding area BA may be implemented by pressure bonding the exposed portion of the power supply line 220 and the antenna electrode layer 120 to each other through the conductive intermediate structure 150 .

A power supply ground 230 may be disposed on the upper surface of the core layer 210 . The feed ground 230 may have a line shape or a plate shape. The feed ground 230 may function as a barrier for shielding or suppressing noise generated from the feed wire 220 or self-radiation.

The feed wire 220 and the feed ground 230 may include the metal and/or alloy described for the antenna electrode layer 120 .

In some embodiments, the feed ground 230 is electrically connected to the ground pads 123 and 125 (see FIG. 2 ) of the antenna electrode layer 120 through a ground contact (not shown) penetrating the core layer 210 . can be connected to

A driving IC chip 280 may be disposed on the flexible circuit board 200 . Power may be supplied from the driving IC chip 280 to the antenna electrode layer 120 through the power supply line 220 . For example, a circuit or contact electrically connecting the driving IC chip 280 and the power supply line 220 may be further included in the flexible circuit board 200 .

2 is a schematic plan view for explaining an antenna electrode layer structure of an antenna structure according to exemplary embodiments. 3 is a partially enlarged cross-sectional view illustrating the connection between a power supply wire and an antenna electrode layer in a bonding area.

Referring to FIG. 2 , as described above, the antenna electrode layer 120 shown in FIG. 1 may include a radiation pattern 122 , a transmission line 124 , and pad electrodes. The pad electrodes may include a signal pad 126 and ground pads 123 and 125 .

The transmission line 124 may branch into the radiation pattern 122 and extend in the first direction. In one embodiment, the transmission line 124 may be substantially integrally connected to the radiation pattern 122 and provided as a single member.

In some embodiments, a distal end of the transmission line 124 may serve as a signal pad 126 . The ground pads may include a first ground pad 123 and a second ground pad 125 . The first ground pad 123 and the second ground pad 125 may be disposed to face each other in the second direction with the signal pad 126 interposed therebetween.

An area covering the signal pad 126 and the ground pads 123 and 125 in the planar direction may be provided as a bonding area BA where a connection is performed with the flexible circuit board 200 described in FIG. 1 .

In some embodiments, the power supply line 220 of the flexible circuit board 200 may be selectively connected to the signal pad 126, in which case the bonding area BA covers the signal pad 126 in FIG. 2 . It can also be defined as an area that

The length of the bonding area (hereinafter, may be abbreviated as the bonding length) BL may be substantially the same as the length of the portion of the power supply line 220 connected to the signal pad 126 (length in the first direction). there is. Also, the bonding length BL may be substantially equal to the length of the signal pad 126 .

The bonding width BW may be substantially the same as the width (width in the second direction) of the portion of the power supply line 220 connected to the signal pad 126 . Also, the bonding width BW may be substantially equal to the width of the signal pad 126 .

According to example embodiments, the bonding length BL may be about 1.5 mm or less. Within the above range, impedance matching between the power supply line 220 and the signal pad 126 can be practically implemented.

For example, during high-frequency communication in the range of about 20 GHz to 30 GHz, the resistance or impedance is about 40 to 70 Ω, preferably about 50 to 60 Ω, more preferably about 50 to 60 Ω for resonance without signal reflection through the driving IC chip 280. It can be set around 50Ω.

In this case, the power supply wire 220 and the signal pad 120 also need to implement impedance matching within the above range. If the impedance matching is not implemented, radiation may occur on its own in the power supply line 220 , resulting in signal loss and reduced signal efficiency to the antenna electrode layer 120 .

In addition, when an intermediate structure made of a different material is inserted, such as the conductive intermediate structure 150, a more precise design of the bonding area BA may be required for the impedance matching.

According to example embodiments, by limiting the bonding length BL to about 1.5 mm or less, signal reflection or self-radiation from the feed wire 220 may be removed or significantly reduced.

In one embodiment, the bonding length BL may be about 1.1 mm or less. In a preferred embodiment, the bonding length BL may be about 0.7 mm or less. Also, the bonding length BL may be greater than or equal to about 50 μm in order to implement a practical electrical connection.

3 is a partially enlarged cross-sectional view illustrating a connection between a feed wiring layer and an antenna electrode layer in a bonding area according to some embodiments.

Referring to FIG. 3 , a bonding structure may be defined by sequentially contacting or stacking the signal pad 126 , the conductive intermediate structure 150 , and the power supply line 220 in the bonding area BA.

The feed wire 220 and the conductive intermediate structure 150 may have substantially the same width as the signal pad 126 . Accordingly, the bonding structure including the signal pad 126, the conductive intermediate structure 150, and the feed wire 220 may have a single pattern shape having a bonding width BW.

"Substantially equal width" as used in this application should be understood to mean allowing for processing errors or alignment errors. For example, the substantially equal width includes a range of about 70 to 130%, preferably about 80 to 120%, more preferably about 90 to 110% of the width of the signal pad 126 or the bonding width (BW). can do.

By matching the widths of the power supply line 220 and the conductive intermediate structure 150 to the bonding width BW, the impedance matching secured through the above-described bonding length BL adjustment can be more easily implemented or maintained for a long time.

In some embodiments, the feed ground 230 may have substantially the same width as and overlap the ground pads 123 and 125 . For example, the feed ground 230 may range from about 70 to 130% of the width of the ground pads 123 and 125, preferably from about 80 to 120%, and more preferably from about 90 to 110%.

4 is a schematic cross-sectional view illustrating an antenna structure according to some exemplary embodiments.

Referring to FIG. 4 , the flexible circuit board 200 may be disposed below the film antenna 100a. For example, the flexible circuit board 200 may be coupled with the film antenna 100a as a bottom layer of the dielectric layer 110 .

In this case, as shown in FIG. 4 , the feed wire 220 may be electrically connected to the antenna electrode layer 120a through the feed contact 260 . In some embodiments, the antenna electrode layer 120a may be bent along a sidewall of the dielectric layer 110 and extended onto a bottom surface of the dielectric layer 110 . For example, a signal pad of the antenna electrode layer 120a may extend onto the bottom surface of the dielectric layer 110, and thus, a connection with the power supply wire 220 through the power supply contact 260 can be easily implemented. there is.

A bonding area may be defined by an area where the antenna electrode layer 120a and the feed wire 220 overlap in the bottom direction of the dielectric layer 110, and a bonding length BL may be defined as shown in FIG. 4 . As described above, the bonding length BL may be adjusted to about 1.5 mm or less, preferably 1.1 mm or less, and more preferably 0.7 mm or less.

Although not shown in detail in FIG. 4, the ground pad of the antenna electrode layer 120a is also bent along the side surface of the dielectric layer 110 and extends to the bottom surface of the dielectric layer 110, and the power supply ground 230 of the flexible circuit board 200 ) and electrically connected. In one embodiment, a portion of the ground pad extending to the bottom surface of the dielectric layer 110 may be integrally connected to the antenna ground layer 130a.

5 is a schematic plan view for explaining an antenna electrode layer structure of an antenna structure according to some exemplary embodiments.

Referring to FIG. 5 , the antenna electrode layer 120 may include a mesh structure. As shown in FIG. 5 , the radiation pattern 122 , the transmission line 124 , the signal pad 126 , and the ground pads 123 and 125 may all include a mesh structure.

In some embodiments, the signal pad 126 and the ground pads 123 and 125 may be formed in a solid pattern to prevent signal loss due to an increase in resistance.

As the antenna electrode layer 120 includes the mesh structure, transmittance of the film antenna 100 may be improved. In some embodiments, a dummy mesh layer 129 may be disposed around the antenna electrode layer 120 . By using the dummy mesh layer 129 to uniformize the electrode arrangement around the antenna electrode layer 120 (for example, around the radiation pattern 122), the mesh structure or the electrode lines included therein are prevented from being visible to the user of the display device. can do.

For example, a mesh metal layer is formed on the dielectric layer 110, and the mesh metal layer is cut along a predetermined area to electrically electrically connect the dummy mesh layer 129 from the radiation pattern 122, the transmission line 124, and the like. , can be physically separated.

6 is a schematic plan view illustrating a display device according to example embodiments. For example, FIG. 6 shows an external shape including a window of a display device.

Referring to FIG. 6 , a display device 300 may include a display area 310 and a peripheral area 320 . The peripheral area 320 may be disposed on both sides and/or both ends of the display area 310 , for example.

In some embodiments, the film antenna 100 included in the antenna structure described above may be inserted into the peripheral area 320 of the display device 300 in the form of a patch. In some embodiments, the pad electrodes 123 , 125 , and 126 of the film antenna 100 may be disposed to correspond to the peripheral area 320 of the display device 300 .

The peripheral area 320 may correspond to, for example, a light blocking portion or a bezel portion of an image display device. According to example embodiments, the flexible circuit board 200 of the antenna structure may be disposed in the peripheral area 320 to prevent image deterioration in the display area 310 of the display device 300 .

In addition, the driving IC chip 280 may be disposed together on the flexible circuit board 200 in the peripheral area 320 . By disposing the pad electrodes 123, 125, and 126 of the film antenna adjacent to the flexible circuit board 200 and the driver IC chip 280 within the peripheral area 320, the signal transmission/reception path is shortened to reduce signal loss. can be suppressed

Radiation patterns 122 of the film antenna 100 may at least partially overlap the display area 310 . For example, as shown in FIG. 5 , the visibility of the radiation pattern 122 to a user may be reduced by utilizing a mesh structure.

Hereinafter, preferred embodiments are presented to aid understanding of the present invention, but these embodiments are only illustrative of the present invention and do not limit the scope of the appended claims, and embodiments within the scope and spirit of the present invention It is obvious to those skilled in the art that various changes and modifications to the are possible, and it is natural that these variations and modifications fall within the scope of the appended claims.

Experimental example : bonding S11 measurement with change in domain length

A signal pad containing silver-palladium-copper alloy (APC) and having a bonding width (BW) of 250 μm was formed on the polyimide dielectric layer. An ACF layer was formed on the signal pads with the same bonding width, and copper power supply lines of the flexible circuit board were exposed and bonded to each other.

For the flexible circuit board-signal pad connection structure, S-parameter (S11) was extracted while changing the bonding length at a frequency of about 26 GHz using a network analyzer with an impedance of 50 Ω. The simulation result was obtained as a graph in FIG. 7 . In the graph S11, as the depth of the peak increases, it means that the radiation efficiency of the antenna is high and the impedance matching is good.

Referring to FIG. 7 , a resonance frequency substantially appears at a bonding length of about 1.1 mm, and the resonance frequency is clearly observed as the bonding length decreases to 0.7 mm.

Specifically, the resonant frequency and S11 value according to each bonding length in FIG. 7 are as shown in Table 1 below.

Bonding length (mm) Resonant frequency (GHz) S11 (dB) Gain (dB) 0.5 26.8 -33.7 +4.5 0.7 26.4 -14.0 +3.9 1.1 25.9 -4.2 +0.8

100, 100a: antenna structure 110: dielectric layer
120, 120a: antenna electrode layer 130, 130a: antenna ground layer
200: flexible circuit board 210: core layer
220: power supply wiring 230: power supply ground
240: lower coverlay film 250: upper coverlay film
280: drive IC chip

Claims (15)

a film antenna including a dielectric layer and an antenna electrode layer formed on a top surface of the dielectric layer; and
a circuit board including a power supply wire and a power supply ground electrically connected to the antenna electrode layer; and
An anisotropic conductive film bonding the circuit board and the antenna electrode layer;
The antenna electrode layer includes a radiation pattern, a transmission line integrally connected to the radiation pattern on the same layer and having a smaller width than the radiation pattern, and a bonding area provided at an end of the transmission line and overlapping the power supply wire in a planar direction. Including a signal pad that
The power supply wire and the signal pad are electrically connected to each other by directly contacting the anisotropic conductive film in the bonding area. The method according to claim 1, wherein the antenna electrode layer further comprises a ground pad disposed around the signal pad and spaced apart from the signal pad on the same layer,
The feed ground of the circuit board is electrically connected to the ground pad, the antenna structure. The antenna structure according to claim 2, wherein a width of the feeding ground is 70 to 130% of a width of the ground pad. The antenna structure according to claim 2, wherein a width of the feed ground is 80 to 120% of a width of the ground pad. The antenna structure according to claim 2, wherein a width of the feeding ground is equal to a width of the ground pad. The antenna structure according to claim 1, wherein the bonding area has a length of 1.5 mm or less. The antenna structure according to claim 6, wherein the bonding area has a length of 50 μm to 0.7 mm. The antenna structure according to claim 1, wherein the feed wire and the signal pad have the same bonding width. The antenna structure according to claim 8, wherein the anisotropic conductive film has the same bonding width as that of the feed wire and the signal pad. The antenna structure according to claim 1, further comprising a driving integrated circuit chip disposed on the circuit board and supplying power to the antenna electrode layer through the power supply wiring. The method according to claim 10, driven at a frequency of 20 to 30 GHz,
An antenna structure in which power corresponding to a range of 40 to 70 Ω is supplied through the driving integrated circuit chip. The method according to claim 1, wherein the circuit board further comprises a core layer,
The feed wire is disposed on the bottom surface of the core layer, the feed ground is disposed on the upper surface of the core layer, the antenna structure. A display device comprising the antenna structure according to claim 1 . delete delete

Images