KR102491806B1 - Electronic device for protecting components from electrostatic and structure thereof - Google Patents

Abstract

An electronic device is disclosed. In addition to this, various embodiments identified through the specification are possible. The electronic device includes at least a partial area of a side bezel structure, includes an antenna housing formed of a metal material, and is mounted inside the electronic device and configured to be connected to the side bezel structure. board, PCB), wherein the printed circuit board includes a ground area, a protection element disposed in one area of the printed circuit board and electrically connected to the antenna housing and the ground area, and the printed circuit board. A PCB layered capacitive member (PCLM) including at least a partial region of a plurality of layers forming a circuit board and electrically connected to the antenna housing may be included.

Description

Electronic device for protecting parts from static electricity and structure related thereto

Embodiments disclosed in this document relate to an electronic device and a related structure for protecting components from electrostatic.

The electronic device may include a frame (or housing) made of a metal material on at least one surface surrounding the electronic device. Since the frame formed of a metal material can transmit current, static electricity generated inside the electronic device may cause electric shock to the user, and static electricity generated outside the electronic device may cause malfunction of components mounted on the electronic device. there is.

In order to protect parts of an electronic device or a user from static electricity, the electronic device may include a protection component capable of performing an electrostatic discharging function. For example, the protection element may be disposed between a ground area of a printed circuit board (PCB) and a contact portion electrically connecting the PCB and the frame. For example, in the case of a housing antenna that performs an antenna function among some areas forming a frame, a primary protection element that primarily performs a function of electrostatic discharge is between the housing antenna and the ground area of the PCB. and a secondary protection element may be disposed between the housing antenna and the transceiver circuit in case the primary protection element does not sufficiently perform.

As the number of contacts electrically connecting the PCB and the frame increases, the number of protection elements may also increase. For example, when parts other than the transmission/reception circuit (eg, a tuner) are mounted on a PCB separately from the transmission/reception circuit, a secondary protection element may be additionally disposed between the antenna housing and the other parts. An increase in protection devices may cause an increase in design cost of an electronic device.

Various embodiments disclosed in this document intend to provide a structure capable of protecting components of an electronic device from static electricity while minimizing the number of protection elements included in the electronic device.

An electronic device according to an embodiment disclosed in this document includes a first plate configured to face one side of the electronic device, a second plate configured to face an opposite direction to the first plate, the first plate, and A side bezel structure connected to the second plate and configured to surround a side surface of the electronic device, the side bezel structure including an antenna housing formed of a metal material and including at least a partial area of the side bezel structure; and a printed circuit board (PCB) mounted inside the electronic device and configured to be connected to the side bezel structure, wherein the printed circuit board includes a ground area and one area of the printed circuit board. and a protection element electrically connected to the antenna housing and the ground area, and at least a partial area of a plurality of layers forming the printed circuit board, and electrically connected to the antenna housing. It may include a PCB layered capacitive member (PCLM).

An electronic device according to an embodiment disclosed in this document includes a first plate configured to face one side of the electronic device, a second plate configured to face an opposite direction to the first plate, the first plate, and A side bezel structure connected to the second plate and configured to surround a side surface of the electronic device, the side bezel structure including an antenna housing formed of a metal material and including at least a partial area of the side bezel structure; and a printed circuit board mounted inside the electronic device and configured to be connected to the side bezel structure, wherein the printed circuit board is disposed in a ground area and one area of the printed circuit board, and the antenna housing and a protection element electrically connected to the ground area, at least one part, and at least a partial area of a plurality of layers forming the printed circuit board, and electrically connected to the antenna housing and the at least one part. PCLM may be included.

According to the embodiments disclosed in this document, the design cost of an electronic device can be reduced by minimizing the number of protection elements while protecting components or users from static electricity.

In addition to this, various effects identified directly or indirectly through this document may be provided.

1 is an exploded perspective view of an electronic device according to various embodiments.
2A is a plan view illustrating a structure in which a PCB layered capacitive member (PCLM) is disposed between a housing antenna and a component of an electronic device according to various embodiments.
2B is a plan view illustrating a structure in which a plurality of PCLMs are disposed between a housing antenna and components of an electronic device according to various embodiments.
3A is a perspective view showing the structure of a PLCM according to various embodiments.
3B is a plan view showing the structure of a PLCM according to various embodiments.
4 is a cross-sectional view for explaining the structure of a PLCM mounted on an electronic device according to various embodiments.
5 is a cross-sectional view for explaining the structure of a PLCM forming a PCB according to various embodiments.
6 is a plan view illustrating an equivalent circuit of a PCLM and a protection device according to various embodiments.
7 is a plan view illustrating a structure in which an attachable capacitive member (ACM) is disposed according to various embodiments.
8 shows a diagram showing the configuration of an ACM according to various embodiments.
9 is a cross-sectional view for explaining the structure of an ACM mounted on an electronic device according to various embodiments.
10 is a block diagram of an electronic device in a network environment according to various embodiments.
In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar elements.

Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings. However, it should be understood that this is not intended to limit the present invention to the specific embodiments, and includes various modifications, equivalents, and/or alternatives of the embodiments of the present invention.

1 is an exploded perspective view of an electronic device 101 according to various embodiments.

Referring to FIG. 1 , the electronic device 101 includes at least one of a portable communication device such as a smartphone or tablet, a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or an artificial intelligence (AI) speaker. can be one

According to an embodiment, the electronic device 101 includes a side bezel structure 110, a support member 111, a front plate 120, a rear plate 130, and a printed circuit board (PCB) 140. can include According to an embodiment, the electronic device 101 may further include at least one other component in addition to the components shown in FIG. 1 . For example, the electronic device 101 may include a display, a battery, an antenna, an electromagnetic induction panel, a memory, an interface (eg, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or audio). interface), or at least one of a rear case. According to another embodiment, the electronic device 101 may omit at least one of the components shown in FIG. 1 .

According to one embodiment, the front plate 120 is configured to face the first surface (eg, the +z-axis direction) of the electronic device 101, and the rear plate 130 is a first surface corresponding to the opposite direction to the front plate. It can be configured to face 2 planes (e.g. -z axis).

According to one embodiment, the side bezel structure 110 may be referred to as a housing, a frame, or a case. The side bezel structure 110 may be connected to the front plate 120 and the rear plate 130 and may be configured to surround the side of the electronic device 101 . According to one embodiment, the side bezel structure 110 may be formed of a metal material. According to one embodiment, a partial area (eg, top, bottom, or side) of the side bezel structure 110 may perform an antenna function. For example, the housing antenna 150 may transmit or receive a signal so that the electronic device 101 performs a wireless communication function.

According to an embodiment, the support member 111 (eg, a bracket) may be disposed inside the electronic device 101 and connected to the side bezel structure 110 or integrally formed with the side bezel structure 110 . The support member 111 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. The support member 111 may have a display coupled to one surface (eg, +z-axis) and a printed circuit board 140 coupled to the other surface (eg, -z-axis). According to an embodiment, the electronic device 101 may omit the support member 111.

According to an embodiment, the printed circuit board 140 may include components for implementing functions of the electronic device 101 . For example, the printed circuit board 140 may include at least one of a communication circuit, processor, memory, or interface. The processor may be, for example, at least one of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor. For another example, the printed circuit board 140 may include at least one of the components of the electronic device 101 shown in FIG. 10 .

FIG. 2A is a plan view illustrating a structure in which a PCB layered capacitive member (PCLM) 220 is disposed between a housing antenna 150 and components of the electronic device 101 according to various embodiments.

Referring to FIG. 2A , the electronic device 101 may include a side bezel structure 110 and a printed circuit board 140 inside the side bezel structure 110 . According to one embodiment, the side bezel structure 110 may be made of a metal material.

According to an embodiment, the side bezel structure 110 may include a housing antenna 150, a mid plate 201, and a dielectric material 203. The housing antenna 150 may form a partial area of the side bezel structure 110 . Although FIG. 2A shows the housing antenna 150 disposed on top of the electronic device 101, the position where the housing antenna 150 is disposed in the side bezel structure 110 is not limited to the embodiment of FIG. 2A. According to an embodiment, a slit structure 202 using a dielectric is formed between the housing antenna 150 and the side bezel structure 110, so that the housing antenna 150 can be separated from the side bezel structure 110. there is.

According to an embodiment, components for performing functions of the electronic device 101 may be mounted on the printed circuit board 140 . For example, a communication circuit 210 configured to perform wireless communication may be mounted on the printed circuit board 140 . The communication circuit 210 may be electrically connected to the housing antenna 150 through a path 215 (eg, a conductive line). The communication circuit 210 may transmit or receive signals through the housing antenna 150 .

According to one embodiment, the printed circuit board 140 may include a ground area 230 and a protection device 240 to protect components from static electricity. The protection element 240 may be, for example, at least one of a shunt varistor and a shunt Zener diode. According to one embodiment, the protection element 240 may be electrically connected between the ground area 230 and the housing antenna 150 . According to an embodiment, when static electricity 250 is generated in the housing antenna 150, the static electricity 250 may be removed by the protection element 240 after flowing along paths 251 and 235.

According to an embodiment, since at least a portion of the static electricity 250 may flow to the communication circuit 210 through the path 215, the electronic device 101 is disposed between the communication circuit 210 and the housing antenna 150. A PCB layered capacitive member (PCLM) 220 may be included. According to one embodiment, the PLCM 220 may mean a layered structure forming the printed circuit board 140 . The PLCM 220 separates a plurality of inner conductive plates between the uppermost electrode plate and the lowermost electrode plate among a plurality of layers forming the printed circuit board 140, thereby generating capacitance. (capacitance). The PLCM 220 separates the odd-numbered plate groups from the even-numbered plate groups using inner vias connecting the internal conductive plates, thereby preventing transfer of static electricity between the plates. A more detailed description of the PLCM 220 is described in FIGS. 3A and 3B.

In the electronic device 101, a secondary electrostatic discharge effect is expected using the PLCM 220 in addition to the protection element 240 providing the primary electrostatic discharge effect, and an additional protection element 240 needs to be mounted. Since there is no, cost reduction effect can be expected.

2B is a plan view illustrating a structure in which a plurality of PCLMs 220-1 and 220-2 are disposed between a housing antenna 150 and components of the electronic device 101 according to various embodiments.

Referring to FIG. 2B , the electronic device 101 may include a PLCM between the component and the housing antenna 150 whenever components connected to the housing antenna 150 are added on the printed circuit board 140 . For example, the communication circuit 210 shown in FIG. 2A includes a control circuit 211 configured to process a signal to be transmitted or a received signal, and a transmit/receive configured to transmit or receive a signal, as shown in FIG. 2B. circuit 213 and an adjustment circuit 212 configured to tune the signal. When the transmit/receive circuit 213 and the adjustment circuit 212 are electrically connected to the housing antenna 150 through paths 215-2 and 215-1, respectively, the electronic device 101 (or the printed circuit board) 140) includes a PLCM 220-1 disposed between the steering circuit 212 and the housing antenna 150 and a PLCM 220-2 disposed between the transmit/receive circuit 213 and the housing antenna 150 can do. The PLCM 220-1 and PLCM 220-2 may each provide a secondary electrostatic discharge effect.

3A is a perspective view illustrating a structure of a PLCM 220 according to various embodiments.

Referring to FIG. 3A , the PLCM 220 may be formed of a plurality of layers. For example, although FIG. 3A shows a PLCM 220 structure formed of 12 layers, the number of layers is not limited to the embodiment of FIG. 3A. In the following description, the uppermost layer (layer with the largest z value in 3D coordinates) will be referred to as the first layer, and the lowest layer (layer with the smallest z value in 3D coordinates) will be referred to as the twelfth layer. can

According to an embodiment, the PLCM 220 includes a first electrode plate 310 forming the uppermost layer (first layer) and a second electrode plate 320 forming the lowermost layer (twelfth layer). and internal conductive plates 330 forming layers (second to eleventh layers) between the first electrode plate 310 and the second electrode plate 320 . According to an embodiment, the internal conductive plates 330 may be connected to the first electrode plate 310 and the second electrode plate 320 through separate contact members.

According to an embodiment, the internal conductive plates 330 include an odd plate group 331 composed of odd layers (third, fifth, 7, 9, and 11 layers) and even layers (second, fourth, and sixth layers). , 8, and 10 layers) may be separated into even-numbered plate groups 332. According to an embodiment, the odd plate group 331 and the even plate group 332 may be connected through separate inner vias. For example, odd-numbered plate groups 331 may be connected through first inner vias 333 and even-numbered plate groups 332 may be connected through second inner vias 334 . Since the odd-numbered plate group 331 and the even-numbered plate group 332 are separated, it is possible to prevent static electricity from being transferred to other plates. In addition, the PLCM 220 can prevent secondary static electricity from occurring between the first electrode plate 310 (or the second electrode plate 320) and the via by using an internal via instead of a through via. can

According to an embodiment, the first inner vias 333 and the second inner vias 334 may form a pair to reduce a potential difference between the odd-numbered plate group 331 and the even-numbered plate group 332 . The structure of the paired inner vias is shown in FIG. 3B.

According to an embodiment, in order to prevent secondary static electricity from being generated in the PLCM 220 having capacitance, the first inner via 333 or the second inner via 334 is formed by odd-numbered plate groups 331, respectively. Alternatively, it may be arranged at a designated gap with the even plate group 332 .

3B is a plan view illustrating a structure of a PLCM 220 according to various embodiments.

Referring to FIG. 3B , the first inner vias 333 and the second inner vias 334 may be formed in pairs to reduce a potential difference between the odd-numbered plate group 331 and the even-numbered plate group 332 . For example, the first inner via 331-2 is disposed on the opposite surface facing the first inner via 333-1, and the first inner via 333-3 is disposed on the opposite surface facing the first inner via 333-3. A via 331-4 may be disposed. In the same principle, some of the second inner vias 334-1, 334-2, 334-3, and 334-4 may be disposed on the first surface and the remaining part may be disposed on the second surface facing the first surface. there is.

4 is a cross-sectional view for explaining the structure of the PLCM 220 mounted on the electronic device 101 according to various embodiments.

Referring to FIG. 4 , the display 160 and the front plate 120 (or front window) are disposed on the top of the mid plate 201, and the rear plate 130 is placed on the bottom of the mid plate 201. (or a rear window) may be disposed. According to an embodiment, the mid plate 201 may be separated from the side bezel structure 110 using a dielectric material 203 . According to an embodiment, the housing antenna 150 forming a partial area of the side bezel structure 110 may transmit or receive signals.

According to an embodiment, the printed circuit board 140 and the side bezel structure 110 may be connected through a separate connection member. For example, the first connection member 410 may connect the PLCM 220 and the side bezel structure 110, and the second connection member 420 may connect the protection element 240 and the side bezel structure 110. there is.

5 is a cross-sectional view illustrating a structure of a PLCM 220 forming a printed circuit board 140 according to various embodiments.

Referring to FIG. 5 , a partial area of the printed circuit board 140 may be formed of a PLCM structure (eg, the PLCM 220 structure of FIG. 3A ). The PLCM structure may include structures having designated intervals to prevent secondary static electricity.

Referring to the vertical axis (eg, z-axis) of FIG. 5 according to an embodiment, the uppermost layer (eg, the first electrode plate 310) among the plurality of layers forming the printed circuit board 140 and The conductive plate structure 520 (eg, the inner conductive plates 330 of FIG. 3A ) may be disposed between the lowermost layer (eg, the second electrode plate 320 ). Included in the conductive plate structure 520 A dielectric material 550 may be inserted between the conductive plates (eg, 332-1, 331-1, 332-2, and 331-2) According to an embodiment, the conductive plate structure 520 and the printed In order to prevent generation of secondary static electricity between the remaining areas of the circuit board 140, a predetermined gap may be formed between a partial area (eg, 560) of the printed circuit board 140 and the conductive plate structure 520.

Referring to the horizontal axis (eg, y-axis) of FIG. 5 according to an embodiment, the conductive plates (eg, 331-1 and 331-2) forming the odd-numbered plate group include first inner vias (eg, 333-2). 1 and 333-2), and conductive plates (eg, 332-1 and 332-2) forming an even-numbered plate group may be connected through second inner vias 334-1 and 334-2. . According to an embodiment, the first inner vias 333-1 and 333-2 or the second inner vias 334-1 and 334-2 may be disposed on opposite surfaces. According to an embodiment, the conductive plate structure 510 and the internal via structure 530 may be disposed with a designated gap 540 therebetween.

6 is a plan view illustrating equivalent circuits of the PCLM 220 and the protection device 240 according to various embodiments.

According to one embodiment, as shown in FIG. 5, since the PLCM is formed of a plurality of conductive plates (or conductive layers) and a plurality of dielectric layers, it has capacitive characteristics and resistive properties. may have characteristics. The resistance characteristics of each of the PLCMs 220-1 and 220-2 can be expressed as equivalent series resistance (ESR), such as R1 and R2.

According to an embodiment, since the static electricity 250 is transferred to a resistor having a low resistance value, the resistance value of each of the resistors R1 and R2 of the PLCMs 220-1 and 220-2 is the resistance R3 of the protection element 240. may have a higher value than the resistance value of If the resistance value of R3 is higher than the resistance values of R1 and R2, static electricity 250 may be transferred to the resistance element 240 through paths 251 and 235. According to an embodiment, the resistance value of each of R1 and R2 is the number of internal conductive plates of each of the PLCMs 220-1 and 220-2, the interval between the even plate group and the odd plate group, or the even plate group and the odd plate group. It can be determined based on at least one of the materials of the dielectric inserted into. As another example, the resistance value of each of R1 and R2 is the conductivity of the first connecting member 410 connecting the side bezel structure 110 and the PLCM or the first connecting member 410 connecting the side bezel structure and the protection element 240. 2 may be determined based on at least one of the conductivity of the connecting member 420 .

According to an embodiment, since each of the PLCMs 220-1 and 220-2 has capacitive characteristics (eg, C1 and C2) due to the layer structure of the internal conductive plates, the PLCMs 220-1 and 220-2 ) Each may perform a low pass filter (LPF) function of transmitting a signal of a designated frequency band to the antenna housing 150. According to an embodiment, the capacitance characteristics of each of C1 and C2 may be determined by the number of internal conductive plates of the PLCM, the distance between the even plate group and the odd plate group, or the material of the dielectric inserted between the even plate group and the odd plate group. It can be determined based on at least one.

7 is a plan view illustrating a structure in which an attachable capacitive member (ACM) 710 is disposed according to various embodiments.

Referring to FIG. 7 , when the side bezel structure 110 is made of a metal material, static electricity 750 generated on the side bezel structure 110 is an internal part of the electronic device 101 such as the printed circuit board 140. can be delivered to In the protection element 750 disposed between the connection member 730 (eg, the second connection member 240 of FIG. 4 ) and the ground area 740, static electricity flows along the path 751, and the protection element 750 Electrostatic discharge can be caused by According to one embodiment, the connecting member 730 may be connected to the mid plate 201 forming the side bezel structure 110 . For example, a partial region (eg, 735 ) of the connecting member 730 may be attached to a boundary region between the side bezel structure 110 and the mid plate 201 .

According to one embodiment, the ACM 710 may be connected to the mid plate 201 and the printed circuit board 140 . For example, a partial region (eg, 715 ) of the ACM 710 may be attached to a boundary region between the side bezel structure 110 and the mid plate 201 . According to an embodiment, the ACM 710 may induce static electricity 750 to flow through a path (eg, 751) where the protection element 750 is disposed by using a difference in resistance value. According to an embodiment, since the ACM 710 may have capacitance, it may absorb noise signals of a high frequency band passing through the mid plate 201 . According to an embodiment, since the ACM 710 has a resistance value by ESR, it can play a role of blocking a signal (eg, a DC signal or static electricity 750) having a high voltage in a low frequency band.

8 shows a diagram showing the configuration of an ACM 710 according to various embodiments.

Referring to FIG. 8 , the ACM 710 may form a double electrode layered structure to have capacitance. For example, the ACM 710 includes a dielectric film 830, and conductive films 810 and 820 are attached to upper and lower ends of the dielectric film 830, respectively, so that the ACM 710 generates static electricity. can have capacity.

According to an embodiment, the material of the conductive film 810 attached to the top of the conductive films 810 and 820 may mainly include copper, and the material of the conductive film 820 attached to the bottom may mainly include copper. It may contain nickel. For another example, the conductive films 810 and 820 may be made of the same material.

According to an embodiment, the length #1 of the dielectric film 830 and the length #2 of the conductive films 810 and 820 may be the same or different from each other. For example, the length #1 of the dielectric film 830 may be longer than the length #2 of the conductive films 810 and 820 .

According to an embodiment, a material 850 for adhesion may be inserted between the dielectric film 830 and the conductive films 810 and 820 . According to an embodiment, materials 840 having adhesiveness and conductivity may be inserted into the top of the conductive film 810 and the bottom of the conductive film 820, respectively.

9 is a cross-sectional view for explaining the structure of an ACM 710 mounted on an electronic device according to various embodiments.

Referring to FIG. 9 , the ACM 710 may be disposed between the printed circuit board 140 and the side bezel structure 110 (eg, the mid plate 201 of FIG. 7 ). For example, a portion of the ACM 710 (eg, 715) is attached to the side bezel structure 110, and another portion of the ACM 710 is attached to the printed circuit board 140 (or the first connecting member 910). It can be.

According to an embodiment, the static electricity 750 generated in the side bezel structure 110 may be transferred to the second connection member 920 and the protection element 750 along the path 251 .

10 is a block diagram of an electronic device 101 in a network environment 1000 according to various embodiments.

Referring to FIG. 10 , in a network environment 1000, an electronic device 101 communicates with an electronic device 1002 through a first network 1098 (eg, short-range wireless communication) or through a second network 1099 ( For example, it may communicate with the electronic device 1004 or the server 1008 through long-distance wireless communication. According to an embodiment, the electronic device 101 may communicate with the electronic device 1004 through the server 1008. According to an embodiment, the electronic device 101 includes a processor 1020, a memory 1030, an input device 1050, an audio output device 1055, and a display device 1060 (eg, the display 1060 of FIG. 4 ). ), audio module 1070, sensor module 1076, interface 1077, haptic module 1079, camera module 1080, power management module 1088, battery 1089, communication module 1090, subscriber An identification module 1096 and an antenna module 1097 may be included. In some embodiments, in the electronic device 101, at least one of the components (eg, the display device 1060 or the camera module 1080) may be omitted or one or more other components may be added. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, the sensor module 1076 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented while being embedded in the display device 1060 (eg, a display).

The processor 1020, for example, drives software (eg, the program 1040) to operate at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 1020. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, processor 1020 transfers commands or data received from other components (eg, sensor module 1076 or communication module 1090) to volatile memory 1032. , process commands or data stored in the volatile memory 1032, and store resultant data in the non-volatile memory 1034. According to one embodiment, the processor 1020 may include a main processor 1021 (eg, a central processing unit or an application processor), and a secondary processor 1023 (eg, a graphic processing unit, an image signal processor) that may operate independently or together therewith. , sensor hub processor, or communication processor). Additionally or alternatively, the auxiliary processor 1023 may be configured to use less power than the main processor 1021 or to be specialized for a designated function. The auxiliary processor 1023 may be implemented separately from or as part of the main processor 1021 .

Secondary processor 1023 may, for example, take place of main processor 1021 while main processor 1021 is inactive (eg sleep), or main processor 1021 is active (eg run an application). state, together with the main processor 1021, at least one of the components of the electronic device 101 (eg, the display device 1060, the sensor module 1076, or the communication module 1090) It may control at least some of the related functions or states. According to one embodiment, the auxiliary processor 1023 (eg, image signal processor or communication processor) is implemented as a component of other functionally related components (eg, camera module 1080 or communication module 1090). It can be.

According to an embodiment, the memory 1030 may store various data used by at least one component (eg, the processor 1020 or the sensor module 1076) of the electronic device 101, for example, software (eg, : may store input data or output data for the program 1040) and commands related thereto. The memory 1030 may include volatile memory 1032 or non-volatile memory 1034 .

According to one embodiment, the program 1040 may be stored as software in the memory 1030 . The program 1040 may include, for example, an operating system 1042 , middleware 1044 , or an application 1046 .

According to an embodiment, the input device 1050 may receive a command or data to be used for a component (eg, the processor 1020) of the electronic device 101 from the outside of the electronic device 101 (eg, a user). there is. The input device 1050 may include, for example, a microphone, mouse, or keyboard.

According to an embodiment, the sound output device 1055 may output a sound signal to the outside of the electronic device 101. The audio output device 1055 may include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback, and the receiver can be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

According to an embodiment, the display device 1060 may visually provide information to the outside of the electronic device 101 (eg, a user). The display device 1060 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to an embodiment, the display device 1060 may include a touch circuitry set to sense a touch or a sensor circuit (eg, a pressure sensor) set to measure the strength of a force generated by a touch. can

According to an embodiment, the audio module 1070 may convert sound into an electrical signal or vice versa. According to an embodiment, the audio module 1070 acquires sound through the input device 1050, the audio output device 1055, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 1002 (eg, a speaker or a headphone).

According to an embodiment, the sensor module 1076 detects an operating state (eg, power or temperature) or an external environmental state (eg, a user state) of the electronic device 101, and the electricity corresponding to the detected state. It can generate signals or data values. The sensor module 1076 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a bio sensor, a temperature sensor, a humidity sensor, Alternatively, an illuminance sensor may be included.

According to an embodiment, the interface 1077 may support one or more specified protocols that may be used to connect the electronic device 101 with an external electronic device (eg, the electronic device 1002) in a wired or wireless manner. The interface 1077 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

According to an embodiment, the connection terminal 1078 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 1002). The connection terminal 1078 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

According to an embodiment, the haptic module 1079 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that a user can perceive through a tactile or kinesthetic sense. The haptic module 1079 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

According to an embodiment, the camera module 1080 may capture still images and moving images. According to one embodiment, the camera module 1080 may include one or more lenses, image sensors, image signal processors, or flashes.

According to an embodiment, the power management module 1088 may manage power supplied to the electronic device 101 . The power management module 1088 may be implemented as at least part of a power management integrated circuit (PMIC), for example.

According to an embodiment, the battery 1089 may supply power to at least one component of the electronic device 101. The battery 1089 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

According to an embodiment, the communication module 1090 is a direct (eg, wired) communication between the electronic device 101 and an external electronic device (eg, the electronic device 1002, the electronic device 1004, or the server 1008). Establishment of a channel or wireless communication channel, and communication through the established communication channel may be supported. The communication module 1090 may include one or more communication processors that operate independently of the processor 1020 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 1090 is a wireless communication module 1092 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1094 (eg, : a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module is a first network 1098 (eg, a short-range communication network such as Bluetooth, WiFi direct, or infrared data association (IrDA)) or a second network 1099 (eg, a cellular network, the Internet, or It may communicate with an external electronic device via a computer network (eg, a telecommunications network such as a LAN or WAN). These various types of communication modules may be integrated as one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). According to an embodiment, the wireless communication module 1092 uses subscriber information (eg, international mobile subscriber identity (IMSI)) stored in the subscriber identification module 1096 to connect to the first network 1098 or the second network 1098. 2 The electronic device 101 may be identified and authenticated within a communication network such as the network 1099 .

According to an embodiment, the antenna module 1097 may transmit or receive signals or power to the outside (eg, an external electronic device). According to one embodiment, the antenna module 1097 may include one or more antennas, from which at least one suitable for a communication method used in a communication network such as the first network 1098 or the second network 1099 of antennas may be selected by, for example, the communication module 1090. A signal or power may be transmitted or received between the communication module 1090 and an external electronic device through the at least one selected antenna.

Some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input/output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)), and signals ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 1004 through the server 1008 connected to the second network 1099 . Each of the electronic devices 1002 and 1004 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of operations executed in the electronic device 101 may be executed in one or more external electronic devices 1002 , 1004 , or 1008 . For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself. Alternatively, one or more external electronic devices may be additionally requested to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver an execution result to the electronic device 101 . The electronic device 101 may provide the received result as at least part of a response to the request as it is or after additional processing. To this end, for example, cloud computing, distributed computing, or client-server computing technology may be used.

As described above, the electronic device (eg, the electronic device 101 of FIG. 1) includes a first plate (eg, the front plate 120 of FIG. 1) configured to face one surface of the electronic device, the first plate A second plate configured to face the opposite direction to the first plate (eg, the back plate 130 of FIG. 1 ), a side surface connected to the first plate and the second plate, and configured to surround the side surface of the electronic device A bezel structure (eg, the side bezel structure 110 of FIG. 1 ), the side bezel structure, including at least a partial area of the side bezel structure, and an antenna housing formed of a metal material (eg, the antenna housing of FIG. 1 ( 150), and a printed circuit board (eg, the printed circuit board 140 of FIG. 1) mounted inside the electronic device and configured to be connected to the side bezel structure, the printed circuit board comprising: , a ground area (eg, the ground area 230 of FIG. 2A), a protection element disposed in one area of the printed circuit board and electrically connected to the antenna housing and the ground area (eg, the protection element of FIG. 2A ( 240)), and a PCLM (eg, the PLCM 220 of FIG. 2A ) including at least a partial region of a plurality of layers forming the printed circuit board and electrically connected to the antenna housing.

According to an embodiment, the printed circuit board may include at least one component (eg, components shown in FIG. 10 ), and the PLCM may be electrically connected to the at least one component and the antenna housing.

According to an embodiment, the PLCM includes a first electrode plate (eg, the first electrode plate 310 of FIG. 3A) and a second electrode plate (eg, the first electrode plate 310 of FIG. 3A) on the uppermost layer and the lowermost layer, respectively. a second electrode plate 320), and internal conductive plates (eg, the internal conductive plates 330 of FIG. 3A) may be included in layers between the first electrode plate and the second electrode plate. there is.

According to an embodiment, one surface of the first electrode plate may be connected to one surface of the side bezel structure.

According to an embodiment, the internal conductive plates may include a first plate group formed in odd-numbered layers (eg, odd-numbered plate group 331 of FIG. 3A ) and a second plate group formed in even-numbered layers (eg, odd-numbered plate group 331 in FIG. 3A ). The even plate group 332 of FIG. 3A), the first plate group is connected through a plurality of first inner vias (eg, inner via 333 of FIG. 3A), the second plate group The plurality of first inner vias may be connected through a plurality of second inner vias (eg, inner via 334 of FIG. 3A ) different from the plurality of first inner vias.

According to an embodiment, one inner via included in the plurality of first inner vias is disposed on one surface of the first plate group, and another inner via included in the plurality of first inner vias may be disposed on one side opposite to the one side.

According to an embodiment, the plurality of first inner vias may be disposed with a designated distance from the first plate group, and the plurality of second internal vias may be disposed with a designated distance from the second plate group.

According to an embodiment, the PLCM further includes a dielectric material (eg, dielectric 550 of FIG. 5 ) between the first electrode plate, the second electrode plate, the odd plate group, and the even plate group. can do.

According to an embodiment, the PLCM has a first resistance value (eg, R1 or R2 in FIG. 6) by equivalent series resistance (ESR), and the first resistance value is a second resistance value ( Example: It may be higher than R3 in FIG. 6).

According to an embodiment, the first resistance value may be determined by the number of internal conductive plates, a distance between the even-numbered plate group and the odd-numbered plate group, or a material of a dielectric material inserted between the even-numbered plate group and the odd-numbered plate group. It may be determined based on at least one of

According to an embodiment, the PLCM has a capacitance (eg, C1 or C2 in FIG. 6 ), and the capacitance is the number of internal conductive plates, the interval between the even-numbered plate group and the odd-numbered plate group, or the It may be determined based on at least one of the materials of the dielectric material inserted between the even-numbered plate group and the odd-numbered plate group.

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. An electronic device according to an embodiment of the present document is not limited to the aforementioned devices.

Various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, like reference numerals may be used for like or related elements. The singular form of a noun corresponding to an item may include one item or a plurality of items, unless the relevant context clearly dictates otherwise. In this document, “A or B”, “at least one of A and B”, “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “A Each of the phrases such as “at least one of , B, or C” may include all possible combinations of items listed together in the corresponding one of the phrases. Terms such as "first", "second", or "first" or "secondary" may simply be used to distinguish a given component from other corresponding components, and may be used to refer to a given component in another aspect (eg, importance or order) is not limited. A (e.g. first) component is said to be “coupled” or “connected” to another (e.g. second) component, with or without the terms “functionally” or “communicatively”. When mentioned, it means that the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term "module" used in this document may include a unit implemented by hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document describe one or more instructions stored in a storage medium (eg, internal memory 1036 or external memory 1038) readable by a machine (eg, electronic device 101). It may be implemented as software (eg, the program 1040) including them. For example, a processor (eg, the processor 1020) of a device (eg, the electronic device 101) may call at least one command among one or more instructions stored from a storage medium and execute it. This enables the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Device-readable storage media may be provided in the form of non-transitory storage media. Here, 'non-temporary' only means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.

According to one embodiment, the method according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products may be traded between sellers and buyers as commodities. A computer program product is distributed in the form of a device-readable storage medium (eg compact disc read only memory (CD-ROM)), or through an application store (eg Play Store ^TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) online, directly between smartphones. In the case of online distribution, at least part of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store server, or a relay server's memory.

According to various embodiments, each component (eg, module or program) of the components described above may include a singular object or a plurality of entities. According to various embodiments, one or more components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by modules, programs, or other components are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.

Claims (20)

In electronic devices,
a first plate configured to face one side of the electronic device;
a second plate configured to face an opposite direction to the first plate;
A side bezel structure connected to the first plate and the second plate and configured to surround a side surface of the electronic device, the side bezel structure including at least a portion of the side bezel structure, Includes an antenna housing formed of a material; and
A printed circuit board (PCB) mounted inside the electronic device and configured to be connected to the side bezel structure, the printed circuit board,
ground area;
a protection element disposed on one area of the printed circuit board and electrically connected to the antenna housing and the ground area; and
An electronic device comprising a PCB layered capacitive member (PCM) including at least a partial region of a plurality of layers forming the printed circuit board and electrically connected to the antenna housing. The method according to claim 1, wherein the PLCM,
A first electrode plate and a second electrode plate are respectively included in the uppermost layer and the lowermost layer,
and internal conductive plates in layers between the first electrode plate and the second electrode plate. The method of claim 2,
An electronic device wherein one surface of the first electrode plate is connected to one surface of the side bezel structure. The method according to claim 2, wherein the inner conductive plates,
A first plate group formed in odd-numbered layers and a second plate group formed in even-numbered layers,
The electronic device of claim 1 , wherein the first plate group is connected through a plurality of first inner vias, and the second plate group is connected through a plurality of second inner vias different from the plurality of first inner vias. The method of claim 4,
One inner via included in the plurality of first inner vias is disposed on one surface of the first plate group, and another inner via included in the plurality of first inner vias is disposed on a surface opposite to the one surface. An electronic device placed on one side to be used. The method of claim 4,
The plurality of first inner vias are disposed at a predetermined distance from the first plate group,
The plurality of second inner vias are disposed with a predetermined distance from the second plate group. The method according to claim 4, wherein the PLCM,
The electronic device of claim 1 , further comprising a dielectric material between the first electrode plate, the second electrode plate, the first plate group, and the second plate group. The method according to claim 7, wherein the PLCM has a first resistance value by equivalent series resistance (ESR),
The first resistance value is higher than the second resistance value of the protection element. The method according to claim 8, wherein the first resistance value,
Determined based on at least one of the number of internal conductive plates, the distance between the second plate group and the first plate group, or the material of the dielectric material inserted between the second plate group and the first plate group, electronic device. The method according to claim 7, wherein the PLCM has a capacitance,
The capacitance is dependent on at least one of the number of internal conductive plates, the distance between the second plate group and the first plate group, or the material of a dielectric material interposed between the second plate group and the first plate group. Electronic device, determined based on. ◈Claim 11 was abandoned when the registration fee was paid.◈ In electronic devices,
a first plate configured to face one side of the electronic device;
a second plate configured to face an opposite direction to the first plate;
A side bezel structure connected to the first plate and the second plate and configured to surround a side surface of the electronic device, the side bezel structure including at least a portion of the side bezel structure, Includes an antenna housing formed of a material; and
A printed circuit board (PCB) mounted inside the electronic device and configured to be connected to the side bezel structure, the printed circuit board,
ground area;
a protection element disposed on one area of the printed circuit board and electrically connected to the antenna housing and the ground area;
at least one part;
A PCB layered capacitive member (PLCM) including at least a partial region of a plurality of layers forming the printed circuit board and electrically connected to the antenna housing and the at least one component, electronic device. ◈Claim 12 was abandoned when the registration fee was paid.◈ The method according to claim 11, wherein the at least one component,
An electronic device comprising at least one of a communication circuit, processor, memory, camera, or sensor. ◈Claim 13 was abandoned when the registration fee was paid.◈ The method according to claim 11, wherein the PLCM,
A first electrode plate and a second electrode plate are respectively included in the uppermost layer and the lowermost layer,
An electronic device comprising internal conductive plates in layers between the first electrode plate and the second electrode plate. ◈Claim 14 was abandoned when the registration fee was paid.◈ The method according to claim 13, wherein the inner conductive plates,
A first plate group formed in odd-numbered layers and a second plate group formed in even-numbered layers,
The electronic device of claim 1 , wherein the first plate group is connected through a plurality of first inner vias, and the second plate group is connected through a plurality of second inner vias different from the plurality of first inner vias. ◈Claim 15 was abandoned when the registration fee was paid.◈ The method of claim 14,
One inner via included in the plurality of first inner vias is disposed on one surface of the first plate group, and another inner via included in the plurality of first inner vias is disposed on a surface opposite to the one surface. An electronic device placed on one side to be used. ◈Claim 16 was abandoned when the registration fee was paid.◈ The method of claim 14,
The plurality of first inner vias are disposed at a predetermined distance from the first plate group,
The plurality of second inner vias are disposed with a predetermined distance from the second plate group. ◈Claim 17 was abandoned when the registration fee was paid.◈ The method according to claim 14, wherein the PLCM,
The electronic device of claim 1 , further comprising a dielectric material between the first electrode plate, the second electrode plate, the first plate group, and the second plate group. ◈Claim 18 was abandoned when the registration fee was paid.◈ The method according to claim 17, wherein the PLCM has a first resistance value by equivalent series resistance (ESR),
The first resistance value is higher than the second resistance value of the protection element. ◈Claim 19 was abandoned when the registration fee was paid.◈ The method according to claim 18, wherein the first resistance value,
Determined based on at least one of the number of internal conductive plates, the distance between the second plate group and the first plate group, or the material of the dielectric material inserted between the second plate group and the first plate group, electronic device. ◈Claim 20 was abandoned when the registration fee was paid.◈ The method according to claim 17, wherein the PLCM has a capacitance,
The capacitance is dependent on at least one of the number of internal conductive plates, the distance between the second plate group and the first plate group, or the material of a dielectric material interposed between the second plate group and the first plate group. Electronic device, determined based on.

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