KR102490951B1 - Manufacturing method of metal plate including fine slit - Google Patents

Abstract

A method of manufacturing a metal plate in face-to-face contact with at least one conductor including a pattern is disclosed. The present manufacturing method includes a step of forming a gap corresponding to a slit by performing a cutting process on a partial section of a metal plate having a flat plate shape, a step of insulating both sides of the metal plate separated by the gap, and a step of restoring the flat plate shape of the metal plate so that the insulated both sides of the metal plate are formed side by side as before the cutting process is performed. According to the manufacturing method, it is possible to manufacture a metal plate having a slit narrower than in the prior art.

Description

Method for manufacturing a metal plate including fine slits { MANUFACTURING METHOD OF METAL PLATE INCLUDING FINE SLIT }

The present disclosure relates to a method for manufacturing a metal plate, and more particularly, to a method for manufacturing a metal plate in face-to-face contact with at least one conductor that performs communication based on a pattern.

When a conductor used as an antenna or coil is wrapped with a metal plate or the like to protect a conductor, the general metal surface may interfere with wireless communication (or wireless power transmission) of the conductor.

In this regard, referring to FIG. 1A, when a pattern (coil or antenna) made of a conductor approaches or contacts a metal surface, the pattern (coil or antenna) is induced by the radiated current (TX) to the pattern (coil or antenna). There is a problem that the current to be lost due to the eddy current generated on the metal surface. Specifically, when a metal approaches or contacts a conductor, eddy currents are generated on the surface of the metal, and current flows in a direction opposite to the current flow generated in the pattern (coil or antenna), resulting in eddy current loss. At this time, the performance of the antenna or coil of the conductor is degraded due to eddy current loss. That is, the closer the distance to the metal is, the greater the eddy current loss, and the function of the antenna or coil approaches zero.

Referring to FIG. 1B, when a conductor implemented as an antenna/coil faces a metal plate, wireless communication or wireless power transmission is impossible in the direction where the metal plate exists, whereas wireless communication and/or wireless power transmission is impossible in the direction where the metal plate does not exist. Wireless power transmission is possible.

In order to solve this problem, it is possible to improve by inserting a magnetic material (ex. Ferrite, Absorber, Nanocrystalline, etc.) between the metal plate and the conductor, but there is a problem of cost related to the manufacturing process and raw materials.

Therefore, it is necessary that the size of the pattern (coil or antenna) made of conductor is larger than that of the metal plate, or at least part of the pattern (coil or antenna) made of conductor needs to protrude outside the metal plate. Alternatively, a hole or gap may be formed in a partial region of the metal plate, through which wireless communication and/or wireless power transmission may be performed.

In this regard, referring to FIG. 1C , when there is an open area (ex. slot) in the metal plate, wireless communication and/or wireless power transmission may be performed through the corresponding area. At this time, the size of the antenna/coil implemented through a pattern or the like on the conductor needs to be similar to the size of the corresponding region.

Specifically, as shown in FIG. 1D, when there is one slit and one slot on the metal plate, wireless communication and/or wireless power transmission of the conductor is possible even through a direction facing the metal plate.

In this regard, in the past, slits in the metal plate were formed through simple cutting processing, electric discharge processing, laser processing, etc., but in the case of the slits created in this way, the width is generally implemented around 200 μm, and the inside [ ex. There were design problems such as the material of the pattern (coil or antenna)] being visible, and adhesive or adhesive liquid leaked through the slits during the assembly process, causing defects. For example, in the case of NC (Numerically Control) processing, a width of around 200 μm is realized, in the case of wire EDM (Electrical Discharge Machine) processing, a width of around 150 μm is realized, and in the case of laser processing, a width of around 200 μm is realized. is implemented

The present disclosure provides a method for manufacturing a metal plate including slits having a narrower width than those of the prior art. Specifically, the present disclosure provides a method of manufacturing a metal plate having a slit structure that is physically almost short but electrically open through an insulation process.

The objects of the present disclosure are not limited to the above-mentioned objects, and other objects and advantages of the present disclosure not mentioned above can be understood by the following description and will be more clearly understood by the embodiments of the present disclosure. Further, it will be readily apparent that the objects and advantages of the present disclosure may be realized by means of the instrumentalities and combinations indicated in the claims.

According to an embodiment of the present disclosure, in a method of manufacturing a metal plate in face-to-face contact with at least one conductor including a pattern, a gap corresponding to a slit is performed by performing a cutting process on a portion of the metal plate having a flat plate shape. Forming a step, insulating both side surfaces of the metal plate separated based on the gap, forming a flat plate shape of the metal plate so that the insulated both side surfaces are formed side by side as before the cutting process is performed. Includes recovery steps.

The method of manufacturing the metal plate may further include forming a hole corresponding to a slot by performing a cutting process on another section of the metal plate that is in contact with the partial section. In this case, in the insulating process, the entire surface of the metal plate may be insulated in a state in which gaps corresponding to the slits and holes corresponding to the slots are formed.

In the restoring, a press may be performed on a region including the slit of the insulated metal plate.

Alternatively, in the restoring step, the insulated metal plate may be stacked on the flat plate-shaped conductor.

The method of manufacturing a metal plate according to the present disclosure can manufacture a metal plate that facilitates communication or wireless charging of an antenna/coil of a conductor facing each other while including a very fine slit.

1A to 1D are diagrams for explaining an example in which a conventionally known eddy current, a conductor, and a physical relationship between a metal plate and a slit and a slot are utilized;
2 is a flowchart for explaining a method of manufacturing a metal plate according to an embodiment of the present disclosure;
3 is a view sequentially showing side views of a metal plate according to a method for manufacturing a metal plate according to an embodiment of the present disclosure;
4 is a view sequentially showing a side view and a front view of a metal plate according to a method for manufacturing a metal plate according to an embodiment of the present disclosure, and
5 is a view showing a comparison between a slit of a metal plate according to the prior art and a slit of a metal plate produced by a manufacturing method according to the present disclosure.

Prior to a detailed description of the present disclosure, the method of describing the present specification and drawings will be described.

First, terms used in the present specification and claims are general terms in consideration of functions in various embodiments of the present disclosure. However, these terms may vary depending on the intention of a technician working in the art, legal or technical interpretation, and the emergence of new technologies. In addition, some terms are arbitrarily selected by the applicant. These terms may be interpreted as the meanings defined in this specification, and if there is no specific term definition, they may be interpreted based on the overall content of this specification and common technical knowledge in the art.

In addition, the same reference numerals or numerals in each drawing attached to this specification indicate parts or components that perform substantially the same function. For convenience of description and understanding, the same reference numerals or symbols are used in different embodiments. That is, even if all components having the same reference numerals are shown in a plurality of drawings, the plurality of drawings do not mean one embodiment.

Also, in the present specification and claims, terms including ordinal numbers such as “first” and “second” may be used to distinguish between elements. These ordinal numbers are used to distinguish the same or similar components from each other, and the meaning of the term should not be construed as being limited due to the use of these ordinal numbers. For example, the order of use or arrangement of elements associated with such ordinal numbers should not be limited by the number. If necessary, each ordinal number may be used interchangeably.

In this specification, singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, the terms "comprise" or "consist of" are intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other It should be understood that the presence or addition of features, numbers, steps, operations, components, parts, or combinations thereof is not precluded.

In the embodiments of the present disclosure, terms such as “module,” “unit,” and “part” are terms used to refer to components that perform at least one function or operation, and these components are hardware or software. It may be implemented or implemented as a combination of hardware and software. In addition, a plurality of "modules", "units", "parts", etc. are integrated into at least one module or chip, except for cases where each of them needs to be implemented with separate specific hardware, so that at least one processor can be implemented as

In embodiments of the present disclosure, spatially relative terms such as "below", "beneath", "lower", "above", "upper", etc. are shown in the drawings. As noted, it can be used to easily describe the relationship of one component to other components. Spatially relative terms should be understood as including different orientations of elements in use or operation in addition to the orientations shown in the drawings. For example, if you flip a component that is shown in a drawing, a component described as "below" or "beneath" another component will be placed "above" the other component. can Thus, the exemplary term “below” may include directions of both below and above. Components may also be oriented in other orientations, and thus spatially relative terms may be interpreted according to orientation.

Also, in an embodiment of the present disclosure, when a part is said to be connected to another part, this includes not only a direct connection but also an indirect connection through another medium. In addition, the meaning that a certain part includes a certain component means that it may further include other components without excluding other components unless otherwise stated.

2 is a flowchart illustrating a method of manufacturing a metal plate according to an embodiment of the present disclosure.

The metal plate according to the present disclosure may face-to-face contact with at least one conductor including a pattern (coil or antenna) to form at least one chip or electronic device related to communication, wireless charging, or wireless power transmission. Specifically, it can be used in the production process of various products such as credit cards, car keys, smartphones, and tablet PCs.

Referring to FIG. 2 , in the present manufacturing method, a gap corresponding to a slit may be formed by performing a cutting process on a portion of a metal plate having a flat plate shape (S210).

Specifically, the present manufacturing method may form a gap corresponding to a slit by utilizing various cutting processes such as press cutting and sealing cutting.

Referring to FIG. 3 sequentially showing a side view of the metal plate step by step, a gap is formed in some sections of the metal plate as the step S210 is performed, while at least one side of both sides of the section is slightly pushed.

In addition, in the present manufacturing method, both side surfaces of the separated metal plate may be insulated based on the gap corresponding to the slit (S220). At this time, various insulation treatment techniques such as surface anodizing and coating may be used, and insulation treatment may be performed on the entire metal plate in addition to both sides separated by a gap.

As a result, referring to FIG. 3 , insulation coating may be performed on the entire metal plate through step S220, and as a result, insulation treatment may be performed on both sides of the metal plate with the gap therebetween.

In addition, the present manufacturing method may restore the flat plate shape of the metal plate so that both sides of the insulated side are formed side by side as before the cutting process (S210) is performed (S230).

In this case, a press process utilizing a flat press member may be performed, or the flat shape may be restored by laminating a metal plate on at least one other material having a flat plate shape.

Specifically, in step S230, when an insulated metal plate is laminated on a flat plate-shaped conductor [including a pattern (coil or antenna)], the production process of the product (ex. credit card, chip, etc.) proceeds and at the same time Restoration of the metal plate can be performed.

In this regard, the risk of damage to the metal plate during the shape recovery process is almost zero in that a part of the metal plate is separated through the cutting process (S210) and the thickness added by the insulation treatment is only about 5 to 7 μm at most. none.

As a result, referring to FIG. 3 , the metal plate that has passed through step S230 can be restored to its original state by a flat plate phenomenon.

In relation to this, FIG. 4 is a view sequentially showing a side view and a front view of a metal plate according to a method for manufacturing a metal plate according to an embodiment of the present disclosure.

Referring to FIG. 4 , in the above-described cutting process (S210), a hole corresponding to a slot may be formed together in addition to a gap corresponding to the slit, where an insulation treatment is performed on the entire metal plate to separate the metal plate based on the slit. Insulation treatment may be performed on both sides (S220). In addition, as the restoration of the flat shape of the metal plate (S230) is performed, as a result, a metal plate including a very narrow slit can be manufactured.

In relation to this, FIG. 5 is a view showing a comparison between a slit of a metal plate according to the prior art and a slit of a metal plate produced by a manufacturing method according to the present disclosure.

The left picture of FIG. 5 is a metal plate manufactured according to the prior art, and the right picture of FIG. 5 corresponds to a metal plate manufactured by the manufacturing method according to the present disclosure. The metal plate in the left figure has a relatively wide slit width, which is bad in terms of design and has a high defect rate, but the metal plate in the right figure has a very narrow slit width, which has a remarkable effect in that it is good in design and has a low defect rate.

Specifically, in the case of the metal plate manufactured by the manufacturing method according to the present disclosure, in that the width of the slit can be implemented within 100 μm (possibly within 50 μm), the effect is significantly superior to that of the prior art. have In particular, in that the gaps are formed electrically though they are physically attached through the insulation process, the actual gaps are formed narrowly and can contribute to the production of products with excellent appearance.

Meanwhile, the various embodiments described above may be implemented by combining two or more embodiments as long as they do not conflict or contradict each other.

Although the preferred embodiments of the present disclosure have been shown and described above, the present disclosure is not limited to the specific embodiments described above, and is common in the technical field belonging to the present disclosure without departing from the gist of the present disclosure claimed in the claims. Of course, various modifications and implementations are possible by those with knowledge of, and these modifications should not be individually understood from the technical spirit or perspective of the present disclosure.

S210: Cutting process S220: Insulation treatment process
S230: recovery process

Claims (4)

A method of manufacturing a metal plate in face-to-face contact with at least one conductor including a pattern,
forming a gap corresponding to at least one slit by performing a cutting process on a section of the metal plate having a flat plate shape;
Insulating both side surfaces of the metal plate separated based on the gap; and
Restoring the flat plate shape of the metal plate so that the insulated both side surfaces are formed side by side as before the cutting process is performed; including,
The manufacturing method of the metal plate,
Forming a hole corresponding to at least one slot by performing a cutting process on another section of the metal plate in contact with the partial section; further comprising,
In the insulating process,
Insulating the entire surface of the metal plate in a state in which the gap corresponding to the slit and the hole corresponding to the slot are formed. delete According to claim 1,
The recovery step is
A method of manufacturing a metal plate, wherein a press is performed on a region including the slit of the insulated metal plate. According to claim 1,
The recovery step is
A method of manufacturing a metal plate, wherein the insulated metal plate is laminated on the conductor having a flat plate shape.

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