KR102490900B1 - Display device with integrated touch screen - Google Patents

Abstract

An object of the present invention is to provide a display device integrated with a touch screen capable of reducing the thickness. A touch screen integrated display device according to an embodiment of the present invention includes an organic light emitting device formed on a substrate, a first inorganic layer formed on the organic light emitting device, first touch electrodes and second touch electrodes formed on the first inorganic layer. and an encapsulation film formed on the first touch electrodes and the second touch electrodes.

Description

Touch screen integrated display {DISPLAY DEVICE WITH INTEGRATED TOUCH SCREEN}

The present invention relates to a display device integrated with a touch screen.

As the information society develops, demands for display devices for displaying images are increasing in various forms. Accordingly, in recent years, liquid crystal displays (LCDs), plasma display panels (PDPs), organic light emitting displays (OLEDs), and quantum dot light emitting displays (QLEDs) have been developed. Various display devices such as a light emitting display) are being utilized. Among them, the organic light emitting display device can be driven at a low voltage, is thin, has an excellent viewing angle, and has a fast response speed.

An organic light emitting display device includes data lines, scan lines, a display panel having a plurality of pixels formed at intersections of the data lines and scan lines, a scan driver supplying scan signals to the scan lines, and data lines. and a data driver supplying data voltages. Each of the pixels includes an organic light emitting element, a driving transistor that controls the amount of current supplied to the organic light emitting element according to the voltage of the gate electrode, and a gate of the driving transistor that controls the data voltage of the data line in response to the scan signal of the scan line. It includes a scan transistor that supplies the electrodes.

Recently, an organic light emitting display device is formed as a display device integrated with a touch screen including a touch screen panel capable of recognizing a user's touch. In this case, the organic light emitting display device also functions as a touch screen device. Recently, touch screen devices have been used in navigation, industrial terminals, notebook computers, financial automation devices, monitors such as game machines, smartphones, tablets, mobile phones, MP3 players, PDAs, PMPs, PSPs, handheld game machines, DMB receivers, and tablet PCs. It is applied to portable terminals such as the like, and home appliances such as refrigerators, microwave ovens, washing machines, and the like. In addition, applications of touch screen devices are gradually expanding due to the advantage that anyone can easily manipulate them.

A display device integrated with a touch screen forms first touch electrodes, second touch electrodes, and bridge electrodes for connecting the first touch electrodes or the second touch electrodes to each other in a display panel. The touch screen integrated display device forms first touch electrodes, second touch electrodes, and connection electrodes for connecting the first touch electrodes or the second touch electrodes to each other on an encapsulation film for encapsulating the organic light emitting element. . The first touch electrodes may be Tx electrodes, and the second touch electrodes may be Rx electrodes.

The first touch electrodes and the second touch electrodes may be formed on the same layer, and the connection electrodes may be formed on a different layer from the first touch electrodes and the second touch electrodes. In this case, an organic layer may be formed between the first and second touch electrodes and the connection electrodes to insulate the first and second touch electrodes from the connection electrodes. In addition, an overcoat layer may be formed on the upper portion to flatten a step caused by the first touch electrodes, the second touch electrodes, and the connection electrodes. Such a touch screen-integrated display device has a problem in that its thickness increases.

An object of the present invention is to provide a display device integrated with a touch screen capable of reducing the thickness.

A touch screen integrated display device according to an embodiment of the present invention includes an organic light emitting device formed on a substrate, a first inorganic layer formed on the organic light emitting device, first touch electrodes and second touch electrodes formed on the first inorganic layer. and an encapsulation film formed on the first touch electrodes and the second touch electrodes.

An embodiment of the present invention forms a touch sensing layer between the light emitting element layer and the encapsulation layer. Accordingly, in an embodiment of the present invention, a step caused by the first touch electrodes, the second touch electrodes, and the connection electrodes of the touch sensing layer may be flattened by using the organic film of the encapsulation layer.

In addition, the embodiment of the present invention can prevent oxygen or moisture from permeating into the light emitting element layer by using the first inorganic layer and the touch insulating layer of the touch sensing layer.

In addition, the embodiment of the present invention can reduce the thickness of the touch sensing layer and the encapsulation layer. As a result, embodiments of the present invention can reduce the thickness of the touch screen integrated display device.

In addition, in an embodiment of the present invention, a first inorganic film including a first low dielectric constant inorganic film is disposed between the light emitting element layer, the first touch electrodes, the second touch electrodes, and the connection electrodes. Accordingly, an embodiment of the present invention increases the parasitic capacitance between the first touch electrodes, the second touch electrodes, and the connection electrodes included in the touch sensing layer and the first electrode and the second electrode included in the light emitting element layer. that can be prevented

The effects obtainable in the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below. .

1 is a perspective view showing a display device integrated with a touch screen according to an embodiment of the present invention.
2 is a block diagram showing a display device integrated with a touch screen according to an embodiment of the present invention.
3 is a cross-sectional view of one side of the display panel of FIG. 1 .
4 is a plan view illustrating first and second touch electrodes, connection electrodes, and first and second touch lines of a touch screen integrated display device according to an exemplary embodiment.
FIG. 5 is an enlarged view showing an example of area A of FIG. 4 in detail.
6 is a cross-sectional view showing an example of line I-I' of FIG. 4 .
FIG. 7 is a cross-sectional view showing another example of line I-I' in FIG. 4 .
8A is a table showing simulator data for Examples 1 and 2.
8B is a graph showing simulator results for Examples 1 and 2.

Advantages and features of the present invention, and methods of achieving them, will become clear with reference to the detailed description of the following embodiments taken in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various different forms, only these embodiments make the disclosure of the present invention complete, and common knowledge in the art to which the present invention belongs. It is provided to fully inform the holder of the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present invention are illustrative, so the present invention is not limited to the details shown. Like reference numbers designate like elements throughout the specification. In addition, in describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted.

When 'includes', 'has', 'consists', etc. mentioned in this specification is used, other parts may be added unless 'only' is used. In the case where a component is expressed in the singular, the case including the plural is included unless otherwise explicitly stated.

In interpreting the components, even if there is no separate explicit description, it is interpreted as including the error range.

In the case of a description of a positional relationship, for example, 'on top of', 'on top of', 'at the bottom of', 'next to', etc. Or, unless 'directly' is used, one or more other parts may be located between the two parts.

In the case of a description of a temporal relationship, for example, 'immediately' or 'directly' when a temporal precedence relationship is described in terms of 'after', 'following', 'next to', 'before', etc. It can also include non-continuous cases unless is used.

Although first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Therefore, the first component mentioned below may also be the second component within the technical spirit of the present invention.

"X-axis direction", "Y-axis direction", and "Z-axis direction" should not be interpreted only as a geometric relationship in which the relationship between each other is made upright, and may be broader within the range in which the configuration of the present invention can function functionally. It can mean having a direction.

The term “at least one” should be understood to include all possible combinations from one or more related items. For example, "at least one of the first item, the second item, and the third item" means not only the first item, the second item, or the third item, respectively, but also two of the first item, the second item, and the third item. It may mean a combination of all items that can be presented from one or more.

Each feature of the various embodiments of the present invention can be partially or entirely combined or combined with each other, technically various interlocking and driving are possible, and each embodiment can be implemented independently of each other or can be implemented together in a related relationship. may be

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing a display device integrated with a touch screen according to an embodiment of the present invention. 2 is a block diagram showing a display device integrated with a touch screen according to an embodiment of the present invention.

Referring to FIGS. 1 and 2 , a touch screen integrated display device according to an embodiment of the present invention includes a display panel 110, a scan driver 120, a data driver 130, a timing controller 160, a host system ( 170), a touch driver 180, and a touch coordinate calculator 190.

A display device integrated with a touch screen according to an embodiment of the present invention includes a liquid crystal display (LCD), a field emission display (FED), a plasma display panel (PDP), and an organic light emitting display. It may be implemented as a flat panel display device such as an organic light emitting display (OLED) or an electrophoresis display (EPD). In the following embodiments, a touch screen integrated display device according to an embodiment of the present invention will be mainly described as being implemented as an organic light emitting display device, but it should be noted that the present invention is not limited thereto.

The display panel 110 includes a first substrate 111 and a second substrate 112 . The second substrate 112 may be an encapsulation substrate. The first substrate 111 may be a plastic film or a glass substrate. The second substrate 112 may be a plastic film, a glass substrate, or an encapsulation film (protective film).

The display panel 110 includes a display area in which sub-pixels SP are provided to display an image. Data lines (D1 to Dm, where m is a positive integer greater than or equal to 2) and scan lines (S1 to Sn, where n is a positive integer greater than or equal to 2) are formed on the display panel 110 . The data lines D1 to Dm may be formed to cross the scan lines S1 to Sn. The sub-pixels SP may be formed in an area defined by an intersection structure of gate lines and data lines.

Each of the sub-pixels SP of the display panel 110 may be connected to one of the data lines D1 to Dm and one of the scan lines S1 to Sn. Each of the sub-pixels SP of the display panel 110 is turned on by a driving transistor that adjusts the drain-to-source current according to the data voltage applied to the gate electrode and the scan signal of the scan line to turn on the data line. A scan transistor for supplying the data voltage of the driving transistor to the gate electrode of the driving transistor, an organic light emitting diode that emits light according to the drain-to-source current of the driving transistor, and a voltage of the gate electrode of the driving transistor. A capacitor may be included. Due to this, each of the sub-pixels SP may emit light according to the current supplied to the organic light emitting diode.

The scan driver 120 receives the scan control signal GCS from the timing controller 160 . The scan driver 120 supplies scan signals to the scan lines S1 to Sn according to the scan control signal GCS.

The scan driver 120 may be formed in a non-display area outside one or both sides of the display area of the display panel 110 in a gate driver in panel (GIP) method. Alternatively, the scan driver 120 may be manufactured as a driving chip, mounted on a flexible film, and attached to a non-display area outside one or both sides of the display area of the display panel 110 by a tape automated bonding (TAB) method.

The data driver 130 receives digital video data DATA and a data control signal DCS from the timing controller 160 . The data driver 130 converts the digital video data DATA into analog positive/negative polarity data voltages according to the data control signal DCS and supplies them to the data lines. That is, pixels to which data voltages are to be supplied are selected by the scan signals of the scan driver 120, and the data voltages are supplied to the selected pixels.

The data driver 130 may include a plurality of source drive ICs 131 as shown in FIG. 1 . Each of the plurality of source drive ICs 131 may be mounted on the flexible film 140 in a chip on film (COF) or chip on plastic (COP) method. The flexible film 140 is attached to the pads provided in the non-display area of the display panel 110 using an anisotropic conducting film, whereby a plurality of source drive ICs 131 are connected to the pads. can

The circuit board 150 may be attached to the flexible films 140 . A plurality of circuits implemented as driving chips may be mounted on the circuit board 150 . For example, the timing controller 160 may be mounted on the circuit board 150 . The circuit board 150 may be a printed circuit board or a flexible printed circuit board.

The timing controller 160 receives digital video data DATA and timing signals from the host system 170 . The timing signals may include a vertical synchronization signal, a horizontal synchronization signal, a data enable signal, a dot clock, and the like. The vertical synchronization signal is a signal defining one frame period. The horizontal synchronizing signal is a signal defining one horizontal period required to supply data voltages to pixels of one horizontal line of the display panel DIS. The data enable signal is a signal defining a period in which valid data is input. The dot clock is a signal that is repeated at a predetermined short period.

The timing controller 160 includes a data control signal DCS for controlling the operation timing of the data driver 130 based on the timing signals to control the operation timing of the scan driver 120 and the data driver 130 . A scan control signal GCS for controlling the operation timing of the scan driver 120 is generated. The timing controller 160 outputs the scan control signal GCS to the scan driver 120 and outputs digital video data DATA and data control signal DCS to the data driver 130 .

The host system 170 may be implemented as a navigation system, a set-top box, a DVD player, a Blu-ray player, a personal computer (PC), a home theater system, a broadcast receiver, a phone system, and the like. The host system 170 includes a system on chip (SoC) with a built-in scaler to convert digital video data (DATA) of an input image into a format suitable for display on the display panel 110 . The host system 170 transmits digital video data DATA and timing signals to the timing controller 160 .

In addition to the data lines D1 to Dm and the scan lines S1 to Sn, first and second touch electrodes may be formed on the display panel 110 . The first touch electrodes may be formed to cross the second touch electrodes. The first touch electrodes may be connected to the first touch driver 181 through the first touch lines T1 to Tj, where j is a positive integer greater than or equal to 2. The second touch electrodes may be connected to the second touch driver 182 through the second touch lines R1 to Ri, where i is a positive integer greater than or equal to 2. A touch sensor may be formed at each intersection of the first touch electrodes and the second touch electrodes. In the embodiment of the present invention, it is exemplified that the touch sensor is implemented with mutual capacitance, but it should be noted that it is not limited thereto. A detailed description of the arrangement of the first and second touch electrodes will be described later with reference to FIGS. 4 and 5 .

The touch driver 180 supplies a driving pulse to the first touch electrodes through the first touch lines T1 to Tj and senses a charge variation of each of the touch sensors through the second touch lines R1 to Ri. do. That is, in FIG. 3 , the first touch lines T1 to Tj are Tx lines that supply driving pulses, and the second touch lines R1 to Ri are Rx lines that sense charge variations of each of the touch sensors. centrally explained.

The touch driver 180 includes a first touch driver 181 , a second touch driver 182 , and a touch controller 183 . The first touch driver 181 , the second touch driver 182 , and the touch controller 183 may be integrated into one read-out IC (ROIC).

The first touch driver 181 selects a first touch line to output a driving pulse under the control of the touch controller 183 and supplies the driving pulse to the selected first touch line. For example, the first touch driver 181 may sequentially supply driving pulses to the first touch lines T1 to Tj.

The second touch driver 182 selects second touch lines to receive charge variations of the touch sensors under the control of the touch controller 183 and receives the charge variations of the touch sensors through the selected second touch lines. The second touch driver 182 samples charge variations of the touch sensors received through the second touch lines R1 to Ri and converts them into digital touch raw data (TRD).

The touch controller 183 includes a Tx setup signal for setting the first touch line to which the driving pulse is output from the first touch driver 181 and the second touch line for receiving the touch sensor voltage from the second touch driver 182 Rx setup signal for setting can be generated. Also, the touch controller 183 generates timing control signals for controlling operation timings of the first touch driver 181 and the second touch driver 182 .

The touch coordinate calculator 190 receives touch row data TRD from the touch driver 180 . The touch coordinate calculation unit 190 calculates touch coordinate(s) according to the touch coordinate calculation method and outputs touch coordinate data (HIDxy) including information of the touch coordinate(s) to the host system 170 .

The touch coordinate calculator 190 may be implemented as a Micro Controller Unit (MCU). The host system 170 analyzes the touch coordinate data (HIDxy) input from the touch coordinate calculation unit 190 and executes an application associated with the coordinates where the user touches. The host system 170 transmits digital video data DATA and timing signals to the timing controller 160 according to the executed application program.

The touch driver 180 may be included in the source drive ICs 131 or manufactured as a separate driving chip and mounted on the circuit board 150 . In addition, the touch coordinate calculator 190 may be manufactured as a driving chip and mounted on the circuit board 150 .

3 is a cross-sectional view of one side of the display panel of FIG. 1 .

Referring to FIG. 3 , the display panel 110 includes a first substrate 111, a second substrate 112, a thin film transistor layer 10 disposed between the first and second substrates 111 and 112, light emitting It may include an element layer 20 , a touch sensing layer 30 and an encapsulation layer 40 .

The first substrate 111 may be a plastic film or a glass substrate.

A thin film transistor layer 10 is formed on the first substrate 111 . The thin film transistor layer 10 may include scan lines, data lines, and thin film transistors. Each of the thin film transistors includes a gate electrode, a semiconductor layer, and source and drain electrodes. When the scan driver is formed in a gate driver in panel (GIP) method, the scan driver may be formed together with the thin film transistor layer 10 . A detailed description of the thin film transistor layer 10 will be described later in conjunction with FIG. 6 .

A light emitting element layer 20 is formed on the thin film transistor layer 10 . The light emitting element layer 20 includes first electrodes, a light emitting layer, a second electrode, and banks. The light emitting layer may be an organic light emitting layer containing an organic material. In this case, the light emitting layer may include a hole transporting layer, an organic light emitting layer, and an electron transporting layer. When a voltage is applied to the first electrode and the second electrode, holes and electrons move to the organic light emitting layer through the hole transport layer and the electron transport layer, respectively, and combine with each other in the organic light emitting layer to emit light. The light emitting element layer 20 may be a pixel array layer in which pixels are formed, and thus a region in which the light emitting element layer 20 is formed may be defined as a display area. An area around the display area may be defined as a non-display area. A detailed description of the light emitting element layer 20 will be described later in connection with FIG. 6 .

A touch sensing layer 30 is formed on the light emitting element layer 20 . The touch sensing layer 30 may include first and second touch electrode layers for sensing a user's touch. The first touch electrode layer may include first touch electrodes connected to the first touch lines T1 to Tj and second touch electrodes connected to the second touch lines R1 to Ri. The second touch electrode layer may include connection electrodes connecting the first touch electrodes or the second touch electrodes to each other. In the embodiment of the present invention, the touch sensing layer 30 for sensing a user's touch is formed between the light emitting element layer 20 and the encapsulation layer 40, so there is no need to separately attach the touch screen device on the display device. . A planar structure of the touch sensing layer 30 will be described later in conjunction with FIGS. 4 and 5 . In addition, the cross-sectional structure of the touch sensing layer 30 will be described later in connection with FIGS. 6 and 7 .

An encapsulation layer 40 is formed on the touch sensing layer 30 . The encapsulation layer 40 serves to prevent penetration of oxygen or moisture into the light emitting element layer 20 and the touch sensing layer 30 . The encapsulation layer 40 may include at least one inorganic layer and at least one organic layer. A detailed description of the cross-sectional structure of the encapsulation layer 40 will be described later with reference to FIG. 6 .

An adhesive layer (not shown) may be formed on the encapsulation layer 40 . The adhesive layer bonds the first substrate 111 and the second substrate 112 on which the thin film transistor layer 10, the light emitting device layer 20, the touch sensing layer 30, and the encapsulation layer 30 are provided. The adhesive layer may be an optically clear resin layer (OCR) or an optically clear adhesive film (OCA).

The second substrate 112 serves as a cover substrate or a cover window covering the first substrate 110 . The second substrate 112 may be a plastic film, a glass substrate, or an encapsulation film (protective film).

4 is a plan view illustrating first and second touch electrodes, connection electrodes, and first and second touch lines of a touch screen integrated display device according to an exemplary embodiment.

Referring to FIG. 4 , the first touch electrodes TE are arranged in a first direction (x-axis direction), and the second touch electrodes RE are arranged in a second direction (y) crossing the first direction (x-axis direction). axial direction). A first direction (x-axis direction) may be a direction parallel to the scan lines S1 to Sn, and a second direction (y-axis direction) may be a direction parallel to the data lines D1 to Dm. Alternatively, the first direction (x-axis direction) may be a direction parallel to the data lines D1 to Dm, and the second direction (y-axis direction) may be a direction parallel to the scan lines S1 to Sn. Although FIG. 4 illustrates that the first touch electrodes TE and the second touch electrodes RE have a diamond-shaped planar structure, it should be noted that the present invention is not limited thereto.

In order to prevent the first touch electrodes TE and the second touch electrodes RE from being short-circuited to each other at their crossing areas, the first touch electrodes TE adjacent to each other in the first direction (x-axis direction) are connected to each other. It may be electrically connected through the electrode BE. Mutual capacitance corresponding to the touch sensor may be formed in an intersection area between the first touch electrode TE and the second touch electrode RE.

In addition, since each of the first touch electrodes TE connected in the first direction (x-axis direction) is spaced apart from the neighboring first touch electrodes TE in the second direction (y-axis direction), they are electrically insulated. . Since each of the second touch electrodes RE connected in the second direction (y-axis direction) is spaced apart from neighboring second touch electrodes RE in the first direction (x-axis direction), they are electrically insulated.

Among the first touch electrodes TE connected to each other in the first direction (x-axis direction), the first touch electrode TE disposed at one end may be connected to the first touch line TL. The first touch line TL may be connected to the first touch driver 181 through the first touch pad TP. Accordingly, the first touch electrodes TE connected to each other in the first direction (x-axis direction) may receive a touch driving signal from the first touch driver 181 through the first touch line TL.

Among the second touch electrodes RE connected to each other in the second direction (y-axis direction), the second touch electrode RE disposed at one end may be connected to the second touch line RL. The second touch line RL may be connected to the second touch driver 182 through the second touch pad RP. Accordingly, the second touch driver 182 may receive charge variations of the touch sensors of the second touch electrodes TE2 connected to each other in the second direction (y-axis direction).

FIG. 5 is an enlarged view showing an example of area A of FIG. 4 in detail.

Referring to FIG. 5 , the pixels P may be formed in a pentile structure. Each of the pixels P includes a plurality of sub-pixels SP, for example, one red pixel R, two green pixels G, and one blue pixel B as shown in FIG. 5 . ) may be included. The red pixel R, the green pixel G, and the blue pixel B may be formed in an octagonal flat shape. Also, among the red pixels R, the green pixels G, and the blue pixels B, the size of the blue pixel B may be the largest and the size of the green pixel G may be the smallest. Although FIG. 5 illustrates that the pixels P are formed in a pentile structure, the exemplary embodiment of the present invention is not limited thereto.

To prevent the first touch electrodes TE and the second touch electrodes RE from overlapping with the red pixel R, the green pixel G, and the blue pixel B of the pixels P, respectively. It may be formed in a mesh structure. That is, the first touch electrodes TE and the second touch electrodes RE may be formed on a bank provided between the red pixel R, the green pixel G, and the blue pixel B.

First touch electrodes TE adjacent to each other in the first direction (x-axis direction) may be electrically connected through a plurality of connection electrodes BE. Each of the connection electrodes BE may be connected to adjacent first touch electrodes TE through first contact holes CNT1 exposing the first touch electrodes TE1 . The connection electrode BE may overlap the first touch electrode TE and the second touch electrode RE. The connection electrode BE may be formed on a bank provided between the red pixel R, the green pixel G, and the blue pixel B.

The first touch electrodes TE may be formed on the same layer as the second touch electrodes RE, and the connection electrode BE is connected to the first touch electrodes TE and the second touch electrodes RE. may be formed on other layers.

FIG. 6 is a cross-sectional view showing one example of line I-I' of FIG. 5, and FIG. 7 is a cross-sectional view showing another example of line I-I' of FIG.

Referring to FIGS. 6 and 7 , the thin film transistor layer 10 is formed on the first substrate 111 . The thin film transistor layer 10 includes thin film transistors 210 , a gate insulating film 220 , an interlayer insulating film 230 , a protective film 240 , and a planarization film 250 .

A first buffer layer may be formed on one surface of the first substrate 111 . The first buffer film is formed on one surface of the first substrate 111 to protect the thin film transistors 210 and the organic light emitting diodes 260 from moisture penetrating through the first substrate 111, which is vulnerable to moisture permeation. One surface of the first substrate 111 may be a surface facing the second substrate 112 . The first buffer layer may include a plurality of inorganic layers alternately stacked. For example, the first buffer layer may be formed of a multilayer in which one or more inorganic layers of a silicon oxide layer (SiO _x ), a silicon nitride layer (SiN _x ), and SiON are alternately stacked. The first buffer layer may be omitted.

A thin film transistor 210 is formed on the first buffer layer. The thin film transistor 210 includes an active layer 211 , a gate electrode 212 , a source electrode 214 and a drain electrode 215 . 6 and 7 illustrate that the thin film transistor 210 is formed in a top gate (top gate) method in which the gate electrode 212 is positioned on top of the active layer 211, but note that the present invention is not limited thereto. shall. That is, the thin film transistor 210 is a bottom gate (bottom gate) method in which the gate electrode 212 is positioned below the active layer 211 or the gate electrode 212 is located above and below the active layer 211. It may be formed in a double gate method located in both.

An active layer 211 is formed on the first buffer layer. The active layer 211 may be formed of a silicon-based semiconductor material or an oxide-based semiconductor material. A light blocking layer may be formed between the first buffer layer and the active layer 211 to block external light incident on the active layer 211 .

A gate insulating layer 220 may be formed on the active layer 211 . The gate insulating layer 220 may be formed of an inorganic layer, for example, a silicon oxide layer (SiO _x ), a silicon nitride layer (SiN _x ), or a multilayer thereof.

A gate electrode 212 and a gate line may be formed on the gate insulating layer 220 . The gate electrode 212 and the gate line are made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). It may be formed as a single layer or multiple layers made of one or an alloy thereof.

An interlayer insulating layer 230 may be formed on the gate electrode 212 and the gate line. The interlayer insulating layer 230 may be formed of an inorganic layer, for example, a silicon oxide layer (SiO _x ), a silicon nitride layer (SiN _x ), or a multilayer thereof.

A source electrode 214 , a drain electrode 215 , a data line, and first and second touch pads TP and RP may be formed on the interlayer insulating layer 230 . Each of the source electrode 214 and the drain electrode 214 may be connected to the active layer 211 through a contact hole passing through the gate insulating layer 220 and the interlayer insulating layer 230 . The source electrode 214, the drain electrode 215, the data line, and the first and second touch pads TP and RP are molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) can be formed of a single layer or multiple layers made of any one or alloys thereof.

A protective layer 240 to insulate the thin film transistor 220 may be formed on the source electrode 214 , the drain electrode 215 , the data line, and the first and second touch pads TP and RP. The protective layer 240 may be formed of an inorganic layer, for example, a silicon oxide layer (SiO _x ), a silicon nitride layer (SiN _x ), or a multilayer thereof.

A planarization layer 250 may be formed on the passivation layer 240 to flatten a level difference caused by the thin film transistor 210 . The planarization layer 250 may be formed of an organic layer such as acryl resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. there is.

A light emitting element layer 20 is formed on the thin film transistor layer 10 . The light emitting device layer 20 includes light emitting devices 260 and a bank 270 .

The light emitting elements 260 and the bank 270 are formed on the planarization film 250 . Each of the light emitting elements 260 includes a first electrode 261 , an organic light emitting layer 262 , and a second electrode 263 . The first electrode 261 may be an anode electrode, and the second electrode 263 may be a cathode electrode.

The first electrode 261 may be formed on the planarization layer 250 . The first electrode 261 is connected to the source electrode 214 of the thin film transistor 210 through a contact hole passing through the passivation layer 240 and the planarization layer 250 . The first electrode 261 may include a stacked structure of aluminum and titanium (Ti/Al/Ti), a stacked structure of aluminum and ITO (ITO/Al/ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO/APC /ITO) may be formed of a metal material with high reflectivity. An APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

The bank 270 may be formed to partition the first electrode 261 on the planarization layer 250 to serve as a pixel defining layer defining the sub-pixels SP. The bank 270 may be formed to cover an edge of the first electrode 261 .

In each of the sub-pixels P, a first electrode 261 corresponding to an anode electrode, a light emitting layer 262, and a second electrode 263 corresponding to a cathode electrode are sequentially stacked so as to obtain light from the first electrode 261. Holes and electrons from the second electrode 263 are coupled to each other in the light emitting layer 262 to indicate a region in which light is emitted.

An emission layer 262 is formed on the first electrode 261 and the bank 270 . The light emitting layer 262 may be an organic light emitting layer including an organic material and emitting light of a predetermined color. When the light emitting layer 262 is a white light emitting layer emitting white light, it may be a common layer formed in common with the pixels P. In this case, the light emitting layer 262 may be formed in a tandem structure of two or more stacks. Each of the stacks may include a hole transporting layer, at least one light emitting layer, and an electron transporting layer.

In addition, a charge generating layer may be formed between the stacks. The charge generation layer may include an n-type charge generation layer positioned adjacent to the lower stack and a p-type charge generation layer formed on the n-type charge generation layer and positioned adjacent to the upper stack. The n-type charge generation layer injects electrons into the lower stack, and the p-type charge generation layer injects holes into the upper stack. The n-type charge generation layer may be an organic layer in which an organic host material capable of transporting electrons is doped with an alkali metal such as Li, Na, K, or Cs, or an alkaline earth metal such as Mg, Sr, Ba, or Ra. The p-type charge generating layer may be an organic layer doped with a dopant in an organic host material having hole transport capability.

The second electrode 263 is formed on the light emitting layer 262 . The second electrode 263 may be formed to cover the light emitting layer 262 . The second electrode 263 may be a common layer formed in common with the pixels P.

The second electrode 263 is a transparent conductive material (TCO) such as ITO or IZO capable of transmitting light, or magnesium (Mg), silver (Ag), or magnesium (Mg) and silver (Ag). It may be formed of a semi-transmissive conductive material such as an alloy of. When the second electrode 263 is formed of a semi-transmissive metal material, light emission efficiency may be increased by a micro cavity. A capping layer may be formed on the second electrode 263 .

A touch sensing layer 30 is formed on the light emitting element layer 260 . The touch sensing layer 30 includes a first inorganic layer 280 , first touch electrodes TE, second touch electrodes RE, connection electrodes BE, and a touch insulating layer 290 .

A first inorganic film 280 is formed on the light emitting element layer 20 . The first inorganic film 280 may be formed to cover the light emitting elements 260 in order to prevent oxygen or moisture from penetrating the light emitting layer 262 and the second electrode 263 . The first inorganic film 280 may include a first low-k inorganic film 281 and a second low-k inorganic film 282 .

The first low dielectric constant inorganic layer 281 may be an inorganic layer having a dielectric constant lower than the first value. A touch screen integrated display device according to an embodiment of the present invention is characterized in that the touch sensing layer 30 is directly formed on the light emitting element layer 20 . Unlike the present invention, in a conventional touch screen integrated display device, an encapsulation layer is formed on the light emitting element layer, and a touch sensing layer is formed on the encapsulation layer. In the touch screen integrated display device according to the embodiment of the present invention, since the touch sensing layer 30 is directly formed on the light emitting element layer 20, the first touch electrode TE included in the touch sensing layer 30 is larger than in the prior art. A distance between the first electrode 261 and the second electrode 263 included in the light emitting device layer 20 and the second touch electrodes RE and the connection electrodes BE is reduced. Accordingly, the touch screen integrated display device according to the embodiment of the present invention includes the first touch electrodes TE, the second touch electrodes RE, and the connection electrodes BE included in the touch sensing layer 30. There is a problem in that parasitic capacitance increases between the first electrode 261 and the second electrode 263 included in the light emitting element layer 20 .

In order to solve this problem, in the touch screen integrated display device according to an embodiment of the present invention, a first low dielectric constant inorganic layer 281 having a dielectric constant equal to or smaller than the first value may be formed. In this case, the first value may be 2.5 F/m. The first low-k inorganic layer 281 may be formed of SiOC.

The second low dielectric constant inorganic layer 282 may be an inorganic layer having a dielectric constant greater than the first value and less than the second value. In this case, the first value may be 2.5 F/m, and the second value may be 6.0 F/m. The second low-k inorganic layer 282 may be formed of a silicon oxide layer (SiO _x ), a silicon nitride layer (SiN _x ), or a multilayer thereof.

The second low dielectric constant inorganic layer 282 may be disposed between the first low dielectric constant inorganic layer 281 and the second electrode 263 . Since the second low dielectric constant inorganic layer 282 has better barrier performance than the first low dielectric constant inorganic layer 281 , it is preferable to directly form it on the second electrode 263 .

Meanwhile, in FIG. 6 , the first inorganic film 280 includes a first low-k inorganic film 281 and a second low-k inorganic film 282, but is not limited thereto. In another embodiment, the first inorganic layer 280 may include a first low dielectric constant inorganic layer 281 as shown in FIG. 7 . In this case, the first low-k inorganic layer 281 may be thicker than the first low-k inorganic layer 281 shown in FIG. 6 . That is, the first low-k inorganic film 281 has the same thickness as the first inorganic film 280 including the first low-k inorganic film 281 and the second low-k inorganic film 282 shown in FIG. 6 . can have thickness. Through this, even if the second low-k inorganic film 282 is omitted, the first touch electrodes TE, the second touch electrodes RE, and the connection electrodes BE included in the touch sensing layer 30 Since the distance between the first electrode 261 and the second electrode 263 included in the light emitting element layer 20 is reduced, an increase in parasitic capacitance can be prevented.

First touch electrodes TE, second touch electrodes RE, connection electrodes BE, and a touch insulating layer 290 are formed on the first inorganic layer 280 .

Specifically, connection electrodes BE may be formed on the first low-k inorganic layer 281 . The connection electrodes BE may overlap the bank 270 . The connection electrodes BE may be any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or these It may be formed of a single layer or multiple layers made of an alloy of.

A touch insulating layer 290 may be formed on the connection electrodes BE. The touch insulating layer 290 may include a touch inorganic layer 291 and a touch organic layer 292 . The touch inorganic layer 291 may be formed of an inorganic layer, for example, a silicon oxide layer (SiO _x ), a silicon nitride layer (SiN _x ), or a multilayer thereof.

A touch organic layer 292 may be formed on the touch inorganic layer 291 . Since contact holes are formed in the touch organic layer 292 , a photosensitive material may be included. For example, the touch organic layer 292 may be formed of photo acrylate containing a photosensitive material.

The touch organic film 292 together with the organic film 310 of the encapsulation layer 40 serves as a particle cover layer for preventing particles from entering the light emitting element layer 20. do.

The touch inorganic layer 291 may prevent the organic layer from being lifted between the connection electrodes BE and the touch organic layer 292 . Since the interface adhesive force between the connection electrodes BE and the touch inorganic layer 291 is higher than the interface adhesive force between the connection electrodes BE and the touch organic layer 292, the connection electrodes BE and the touch organic layer 292 When the touch inorganic layer 291 is formed between the electrodes 292 , lifting of the touch organic layer 292 between the connection electrodes BE and the touch organic layer 292 may be prevented. In addition, the touch inorganic film 291 is a layer through which oxygen or moisture permeates the light emitting layer 262 and the second electrode 263 together with the first inorganic film 280 and the second inorganic film 320 of the encapsulation layer 40. It also serves to prevent

6 and 7 show that the touch insulating film 290 includes both the touch inorganic film 291 and the touch organic film 292, but is not limited thereto. In another embodiment, the touch insulating layer 290 may include any one of a touch inorganic layer 291 and a touch organic layer 292 .

First touch electrodes TE and second touch electrodes RE may be formed on the touch insulating layer 290 . The first touch electrodes TE and the second touch electrodes RE may be disposed on the same layer. The first touch electrodes TE and the second touch electrodes RE are spaced apart from each other and electrically insulated from each other.

As shown in FIGS. 6 and 7 , the first touch electrodes TE may be connected to the connection electrode BE through first contact holes CT1 exposing the connection electrode BE through the touch insulating layer 290 . . As a result, since the first touch electrodes TE are connected using the connection electrodes BE at intersections of the first touch electrodes TE and the second touch electrodes RE, the first touch electrode TE and the second touch electrodes RE are not shorted to each other. Also, the first and second touch electrodes TE and RE may be disposed to overlap the bank 270 in order to prevent the opening area of the sub-pixel SP from being reduced.

The first touch line TL may extend from the first touch electrode TE, and the second touch line RL may extend from the second touch electrode RE. The first touch line TL is connected to the first touch pad TP through the second contact hole CT2 exposing the first touch pad TP through the passivation layer 240 and the buffer layer 31. can The second touch line RL is connected to the second touch pad RP through the third contact hole CT3 exposing the second touch pad RP through the passivation layer 240 and the buffer layer 31. can

The first touch electrodes TE, the second touch electrodes RE, the first touch lines TL, and the second touch lines RL are made of molybdenum (Mo), aluminum (Al), or chromium (Cr). , Gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) can be formed of a single layer or multiple layers made of any one or alloys thereof.

Meanwhile, in FIGS. 6 and 7 , connection electrodes BE are formed on the first inorganic film 280 , a touch insulating film 290 is formed on the connection electrodes BE, and on the touch insulating film 290 Formation of the first touch electrodes TE and the second touch electrodes RE is exemplified, but is not limited thereto. In another embodiment, the first touch electrodes TE and the second touch electrodes RE are formed on the first inorganic layer 280, and the first touch electrodes TE and the second touch electrode RE A touch insulating layer 290 may be formed on the touch insulating layer 290 , and connection electrodes BE may be formed on the touch insulating layer 290 .

An encapsulation layer 40 is formed on the first touch electrodes TE and the second touch electrodes RE. The encapsulation layer 40 includes an encapsulation film, and the encapsulation film prevents oxygen or moisture from permeating into the first touch electrodes TE, the second touch electrodes RE, the light emitting layer 262 and the second electrode 263. To prevent this, an organic layer 310 and a second inorganic layer 320 are included.

Specifically, the organic layer 310 is formed on the first touch electrodes TE and the second touch electrodes RE. In the organic film 310, particles penetrate the encapsulation layer 40 and are applied to the first touch electrodes TE, the second touch electrodes RE, the light emitting layer 262, and the second electrode 263. It may be formed to a sufficient thickness, for example, about 7 to 8 μm to prevent this. The organic layer 310 is formed on the first touch electrodes TE and the second touch electrodes RE to flatten the step caused by the first touch electrodes TE and the second touch electrodes RE. also plays a role.

A second inorganic layer 320 is formed on the organic layer 310 . Each of the second inorganic layers 320 may be formed of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide.

A color filter layer (not shown) may be formed on the encapsulation layer 40 . The color filter layer may include color filters disposed to overlap the sub-pixels SP and a black matrix disposed to overlap the bank 270 . When the light emitting layer 262 includes organic light emitting layers emitting red, green, and blue light, the color filter layer may be omitted.

An adhesive layer (not shown) may be formed on the encapsulation layer 40 . The adhesive layer bonds the first substrate 111 and the second substrate 112 on which the thin film transistor layer 10, the organic light emitting device layer 20, the touch sensing layer 30, and the encapsulation layer 40 are provided. The adhesive layer may be an optically clear resin layer (OCR) or an optically clear adhesive film (OCA).

The second substrate 112 serves as a cover substrate or a cover window covering the first substrate 110 . The second substrate 112 may be a plastic film, a glass substrate, or an encapsulation film (protective film).

As described above, the embodiment of the present invention is characterized in that the touch sensing layer 30 is formed between the light emitting element layer 20 and the encapsulation layer 40 .

In an embodiment of the present invention, the first touch electrodes TE, the second touch electrodes RE, and the connection electrode BE of the touch sensing layer 30 are formed by using the organic film 310 of the encapsulation layer 40. It is possible to flatten the step difference due to the Accordingly, the organic layer disposed between the touch sensing layer 30 and the second substrate 112 may be omitted.

Also, in the embodiment of the present invention, penetration of oxygen or moisture into the light emitting element layer 20 can be prevented by using the first inorganic layer 280 and the touch insulating layer 290 of the touch sensing layer 30 . Accordingly, the encapsulation layer 40 may omit the inorganic film disposed on the light emitting element layer 20 .

In addition, the embodiment of the present invention can reduce the thickness of the touch sensing layer 30 and the encapsulation layer 40 compared to the prior art. As a result, embodiments of the present invention can reduce the thickness of the touch screen integrated display device.

In addition, in an embodiment of the present invention, a first low dielectric constant inorganic film 281 is formed between the light emitting element layer 20 and the first touch electrodes TE, the second touch electrodes RE, and the connection electrodes BE. By disposing the first inorganic film 280 including a, the first touch electrodes TE, the second touch electrodes RE, the connection electrodes BE and the light emitting element included in the touch sensing layer 30 An increase in parasitic capacitance between the first electrode 261 and the second electrode 263 included in the layer 20 may be prevented.

8A is a table showing simulator data for Examples 1 and 2, and FIG. 8B is a graph showing simulator results for Examples 1 and 2.

Referring to FIG. 8A , the existing structure represents a conventional touch screen integrated display device. That is, in the existing structure, an encapsulation layer is formed on the light emitting element layer, and a touch sensing layer is formed on the encapsulation layer. In the existing structure, the distance between the connection electrode and the second electrode is 10 μm. That is, the thickness of the encapsulation layer including the first inorganic layer, the organic layer, and the second inorganic layer is 10 μm, and the dielectric constant of the encapsulation layer including the first inorganic layer, the organic layer, and the second inorganic layer corresponds to 4.0 F/m. do.

Embodiment 1 represents a display device integrated with a touch screen shown in FIG. 6 . In Example 1, the distance between the connection electrode BE and the second electrode 263 is 2 μm. That is, the thickness of the first inorganic layer 280 including the first low-k inorganic layer 281 and the second low-k inorganic layer 282 is 2 μm, and the first low-k inorganic layer 281 and the second low-k inorganic layer 281 have a thickness of 2 μm. The dielectric constant of the first inorganic layer 280 including the low dielectric constant inorganic layer 282 corresponds to 3.53 F/m.

Embodiment 2 represents the display device integrated with a touch screen shown in FIG. 7 . In Example 2, the distance between the connection electrode BE and the second electrode 263 is 2 μm. That is, the thickness of the first inorganic layer 280 including only the first low-k inorganic layer 281 is 2 μm, and the dielectric constant of the first inorganic layer 280 including only the first low-k inorganic layer 281 is Corresponds to 2.5 F/m.

As shown in FIG. 8A , the distance between the connection electrode BE and the second electrode 263 is smaller than that of the existing structures in the first and second embodiments. In addition, in Examples 1 and 2, the permittivity of the insulator between the connection electrode BE and the second electrode 263 is smaller than that of the conventional structures.

Referring to FIG. 8B , the parasitic capacitance Cp between the connection electrode BE and the second electrode 263 for normal operation of the touch sensing layer 30 may be set to 1000 pF.

In this case, the parasitic capacitance Cp between the connection electrode BE and the second electrode 263 is less than 1000 pF in the first and second embodiments in the 1.56-inch and 6.0-inch display devices. Accordingly, Embodiments 1 and 2 can operate the touch sensing layer 30 normally while implementing a slim thickness in 1.56-inch and 6.0-inch display devices.

Meanwhile, in Example 1, the parasitic capacitance Cp between the connection electrode BE and the second electrode 263 is greater than 1000 pF in a 7.4-inch display device. Accordingly, in the first embodiment, the touch sensing layer 30 may not normally operate.

On the other hand, in Example 2, the parasitic capacitance Cp between the connection electrode BE and the second electrode 263 is smaller than 1000 pF even in a 7.4-inch display device. Accordingly, the second embodiment can operate the touch sensing layer 30 normally while implementing a slim thickness even in a 7.4-inch display device.

Although the embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and may be variously modified and implemented without departing from the technical spirit of the present invention. . Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, the embodiments described above should be understood as illustrative in all respects and not limiting. The protection scope of the present invention should be construed according to the scope of the claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

100: touch screen integrated display device 110: display panel
111: lower substrate 112: upper substrate
120: gate driver 130: data driver
131: source drive IC 140: flexible film
150: circuit board 160: timing controller
170: host system 180: touch driver
181: first touch driver 182: second touch driver
183: touch controller 190: touch coordinate calculator
10: thin film transistor layer 20: organic light emitting element layer
30: touch sensing layer 40: encapsulation layer
210: thin film transistor 220: gate insulating film
230: interlayer insulating film 240: protective film
250: planarization film 260: organic light emitting device
261: first electrode 262: organic light emitting layer
263: second electrode 270: bank
280: first inorganic film 281: first low dielectric constant inorganic film
282: second low dielectric constant inorganic film 290: touch insulating film
310: organic layer 320: second inorganic layer
TE: first touch electrode RE: second touch electrode
BE: connection electrode TL: first touch line
RL: second touch line

Claims (15)

a first substrate and a second substrate disposed to face each other;
an organic light emitting device formed on the first substrate;
a first inorganic layer formed directly on the organic light emitting device;
first touch electrodes and second touch electrodes directly formed on the first inorganic layer; and
An encapsulation film formed between the second substrate and the first touch electrodes and the second touch electrodes,
The first inorganic film includes a first low dielectric constant inorganic film having a dielectric constant of less than 2.5 F / m,
The encapsulation film,
an organic layer formed on the first touch electrodes and the second touch electrodes to flatten a level difference caused by the first touch electrodes and the second touch electrodes; and
A touch screen integrated display device comprising a second inorganic layer formed on the organic layer. delete According to claim 1,
The first low dielectric constant inorganic film is a touch screen integrated display device, characterized in that made of SiOC. delete According to claim 1,
The first inorganic film further comprises a second low dielectric constant inorganic film having a dielectric constant greater than 2.5 F / m and less than 6.0 F / m, the touch screen integrated display device. According to claim 5,
The second low dielectric constant inorganic film is a touch screen integrated display device, characterized in that disposed between the first low dielectric constant inorganic film and the organic light emitting element. According to claim 5,
The second low dielectric constant inorganic film is a touch screen integrated display device, characterized in that consisting of a silicon oxide film (SiO _x ), a silicon nitride film (SiN _x ), SiON or a multilayer thereof. delete According to claim 1,
The touch screen integrated display device, characterized in that the first touch electrodes and the second touch electrodes are formed on the same layer. According to claim 9,
a connection electrode formed on the first inorganic layer and electrically connecting the first touch electrodes; and
Further comprising a touch insulating film formed on the connection electrode,
The first touch electrodes and the second touch electrodes are formed on the touch insulating layer and are connected to the connection electrode through a contact hole penetrating the touch insulating layer. According to claim 10,
The connection electrode is a touch screen integrated display device, characterized in that formed directly on the first inorganic film. According to claim 10,
The touch screen integrated display device, characterized in that the touch insulating film comprises a touch inorganic film formed on the connection electrode. According to claim 12,
The touch screen integrated display device, characterized in that the touch insulating film further comprises a touch organic film formed on the touch inorganic film. According to claim 9,
a touch insulating layer formed on the first touch electrodes and the second touch electrodes; and
The touch screen integrated display device further includes a connection electrode formed on the touch insulating layer and connected to the first touch electrodes through a contact hole penetrating the touch insulating layer. According to claim 14,
The touch screen integrated display device, characterized in that the first touch electrodes and the second touch electrodes are formed directly on the first inorganic film.

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