KR102486743B1 - High Quality Phosphor Plate and Manufacturing Method Thereof - Google Patents

Abstract

A high-quality phosphor plate and a manufacturing method thereof are disclosed.
According to an embodiment of the present invention, a mixing process of mixing the sol-gel solution, phosphor particles, and a crosslinking agent, a first batch process of disposing the mixed mixture on a temporary substrate, and a temporary substrate on which the mixture is disposed are placed in a vacuum environment. An exposure process of exposing, a compression process of compressing the mixture with a plurality of temporary substrates, a curing process of curing the crosslinking agent, a second arrangement process of separating the mixture from the temporary substrate and disposing it on the main substrate, and a second arrangement process of separating the mixture from the temporary substrate and placing it on the main substrate. A phosphor plate manufacturing method comprising a first heat treatment process of heat-treating the placed mixture in a first preset environment and a second heat treatment process of heat-treating the mixture that has undergone the first heat treatment process in a second preset environment. to provide.

Description

High quality phosphor plate and manufacturing method thereof {High Quality Phosphor Plate and Manufacturing Method Thereof}

The present invention relates to a method for manufacturing a high-quality phosphor plate and a phosphor plate manufactured according to the method.

The contents described in this part merely provide background information on the present embodiment and do not constitute prior art.

Conventional lighting devices used a method of combining a light source (typically, an LED), an encapsulant, and a phosphor in order to emit white light or light of a specific wavelength band. For example, a conventional lighting device outputs a combination of a blue LED chip and a yellow phosphor to output white light.

However, this type of lighting device has a problem of low reliability due to low heat resistance. This is because the encapsulant is directly affected by heat generated during operation of the light source since the phosphor is included in the device together with the light source. Accordingly, conventional lighting devices have a problem in that it is difficult to output highly reliable light.

Accordingly, the technology being developed is a method using a phosphor plate. The technology does not directly combine the phosphor with the encapsulant as in the conventional lighting device, but manufactures the phosphor in the form of a plate and places it in front of the direction in which the light source irradiates light. In this case, the phosphor plate must have heat resistance to the extent that it is not affected by self-heating by heat generated while the light source operates.

Conventionally, a phosphor plate was manufactured in the order shown in FIG. 7 .

7 is a flowchart illustrating a method of manufacturing a conventional phosphor plate.

Glass frit and phosphor particles are mixed (S710).

The mixed mixture is prepared in the form of a film (S720).

The mixture in the form of a film is heated to a first predetermined temperature and sintered (S730). In this case, the first preset temperature may be 600°C or higher. Typically, heat of 600° C. or higher must be applied to the mixture in which the glass frit is mixed so that it can be sintered. At this time, YAG, which is a yellow phosphor, can withstand a temperature of 600° C. or higher, so that a problem of poor characteristics does not occur during the sintering process. However, red phosphors such as SCASN, CASN, KSF, or SrLiAl ₃ N ₄ can only withstand temperatures up to about 400° C., and their properties deteriorate at higher temperatures. When the red phosphor particles are included in the manufacture of the phosphor plate, a problem in which the optical properties of the plate are significantly deteriorated occurs during the sintering process.

Accordingly, a method of mixing a separate sol-gel solution with phosphor particles without including a glass frit has been proposed. In this case, since it can be performed at a relatively low temperature, the problem of poor optical properties can be solved. However, when manufacturing proceeds in the above-described method, a problem occurs in that the phosphor plate cannot be completely manufactured as shown in FIGS. 8A to 8C.

8 is a view showing a phosphor plate manufactured by a conventional method.

When manufactured by the above method, the prepared phosphor plate has a crumbly surface as shown in FIG. 8a, bubbles are generated as shown in FIG. 8b, or a phenomenon in which the phosphor and the sol-gel solution are separated as shown in FIG. 8c occurs.

Therefore, there is a need for a method for manufacturing a phosphor plate that retains optical properties.

An object of one embodiment of the present invention is to provide a phosphor plate having perfect quality while maintaining optical properties and a manufacturing method thereof.

According to one aspect of the present invention, a mixing process of mixing a sol-gel solution, phosphor particles, and a crosslinking agent, a first batch process of disposing the mixed mixture on a temporary substrate, and exposing the temporary substrate on which the mixture is disposed to a vacuum environment Exposure process, compression process of compressing the mixture with a plurality of temporary substrates, curing process of curing the crosslinking agent, and second arrangement process of separating the mixture from the temporary substrate and disposing it on the main substrate and disposing on the main substrate Provides a phosphor plate manufacturing method comprising a first heat treatment process of heat-treating the mixture in a first preset environment and a second heat treatment process of heat-treating the mixture that has undergone the first heat treatment process in a second preset environment. do.

According to one aspect of the present invention, the temperature of the second preset environment is higher than that of the first preset environment.

According to one aspect of the present invention, the curing process is characterized in that the crosslinking agent in the mixture is cured by applying light, electron beam or heat to the mixture.

According to one aspect of the present invention, the temporary substrate is characterized in that it is implemented with a material that passes light or electron beams and has a releasability greater than or equal to a predetermined reference value.

According to one aspect of the present invention, a mixing process of mixing a sol-gel solution, phosphor particles, and a crosslinking agent, a first batch process of disposing the mixed mixture on a temporary substrate, and exposing the temporary substrate on which the mixture is disposed to a vacuum environment An exposure process for curing, a curing process for curing the crosslinking agent, a second arrangement process for separating the mixture from the temporary substrate and disposing it on the main substrate, and a manufacturing process for preparing the mixture in the form of a film and the mixture disposed on the main substrate Provided is a phosphor plate manufacturing method comprising a first heat treatment process of heat-treating in a first preset environment and a second heat treatment process of heat-treating the mixture that has undergone the first heat treatment process in a second preset environment.

According to one aspect of the present invention, the temperature of the second preset environment is higher than that of the first preset environment.

According to one aspect of the present invention, the curing process is characterized in that the crosslinking agent in the mixture is cured by applying light, electron beam or heat to the mixture.

According to one aspect of the present invention, the temporary substrate is characterized in that it is implemented with a material that passes light or electron beams and has a releasability greater than or equal to a predetermined reference value.

According to one aspect of the present invention, a mixing process of mixing a sol-gel solution, phosphor particles, and a crosslinking agent, a batch process of disposing the mixed mixture on a main substrate, and an exposure of exposing the main substrate on which the mixture is disposed to a vacuum environment process, a compression process of compressing the mixture, a curing process of curing the crosslinking agent in the compressed mixture, a first heat treatment process of heat-treating the mixture disposed on the main substrate in a first preset environment, and the first heat treatment process It provides a phosphor plate manufacturing method comprising a second heat treatment step of heat treating the mixture in a second preset environment.

According to one aspect of the present invention, the main substrate is characterized in that it is implemented with a material that passes light or electron beams, has a releasability greater than a predetermined reference value, and does not change even in the second predetermined environment.

According to one aspect of the present invention, the main substrate is characterized in that implemented as a glass or silicon wafer.

According to one aspect of the present invention, a mixing process of mixing a sol-gel solution, phosphor particles, and a crosslinking agent, a batch process of disposing the mixed mixture on a main substrate, and an exposure of exposing the main substrate on which the mixture is disposed to a vacuum environment process, a curing process of curing the crosslinking agent, a manufacturing process of preparing the mixture in the form of a film, a first heat treatment process of heat-treating the mixture disposed on the main substrate in a first preset environment, and the first heat treatment process It provides a phosphor plate manufacturing method comprising a second heat treatment step of heat treating the mixture in a second preset environment.

According to one aspect of the present invention, the main substrate is characterized in that it is implemented with a material that passes light or electron beams, has a releasability greater than a predetermined reference value, and does not change even in the second predetermined environment.

According to one aspect of the present invention, the main substrate is characterized in that implemented as a glass or silicon wafer.

According to one aspect of the present invention, a phosphor plate manufactured by the above manufacturing method is provided.

According to one aspect of the present invention, in the phosphor plate for shifting the wavelength of incident light, a phosphor plate characterized by including titanium oxide and silicon oxide is provided.

According to one aspect of the present invention, the phosphor plate provides a phosphor plate characterized in that it further comprises aluminum oxide.

As described above, according to one aspect of the present invention, there is an advantage in that the manufactured phosphor plate can have intact quality while maintaining optical characteristics.

1 is a flowchart illustrating a method of manufacturing a phosphor plate according to a first embodiment of the present invention.
2 is a flowchart illustrating a method of manufacturing a phosphor plate according to a second embodiment of the present invention.
3 is a flowchart illustrating a method of manufacturing a phosphor plate according to a third embodiment of the present invention.
4 is a flowchart illustrating a method of manufacturing a phosphor plate according to a fourth embodiment of the present invention.
5 is a view showing a phosphor plate manufactured according to an embodiment of the present invention.
6 is a graph showing the relationship between temperature and size applied to a phosphor plate according to an embodiment of the present invention.
7 is a flowchart illustrating a method of manufacturing a conventional phosphor plate.
8 is a view showing a phosphor plate manufactured by a conventional method.
9 is a graph illustrating a spectrum of light output from a light source and light output after a phosphor plate according to an embodiment of the present invention is mounted.
10 is a diagram illustrating a state in which a light source mounted with a phosphor plate according to an embodiment of the present invention emits light.

Since the present invention can make various changes and have various embodiments, specific embodiments will be illustrated in the drawings and described in detail. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all modifications, equivalents, or substitutes included in the spirit and technical scope of the present invention. Like reference numerals have been used for like elements throughout the description of each figure.

Terms such as first, second, A, and B may be used to describe various components, but the components should not be limited by the terms. These terms are only used for the purpose of distinguishing one component from another. For example, a first element may be termed a second element, and similarly, a second element may be termed a first element, without departing from the scope of the present invention. The terms and/or include any combination of a plurality of related recited items or any of a plurality of related recited items.

It is understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, but other elements may exist in the middle. It should be. On the other hand, when an element is referred to as “directly connected” or “directly connected” to another element, it should be understood that no intervening element exists.

Terms used in this application are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. It should be understood that terms such as "include" or "having" in this application do not exclude in advance the possibility of existence or addition of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification. .

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs.

Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined in the present application, they should not be interpreted in an ideal or excessively formal meaning. don't

In addition, each configuration, process, process or method included in each embodiment of the present invention may be shared within a range that does not contradict each other technically.

1 is a flowchart illustrating a method of manufacturing a phosphor plate according to an embodiment of the present invention.

The phosphor plate is disposed in front of the light source based on the direction in which the light is incident, and shifts the wavelength of light to be output. Since the phosphor plate is included in the light source and does not change the wavelength, it has higher heat resistance than conventional phosphors. In addition, since the phosphor plate according to an embodiment of the present invention is manufactured through the following process, it can be mass-produced with excellent optical properties and excellent quality.

The sol-gel solution, phosphor particles and crosslinking agent are mixed (S110).

The sol-gel solution supports the phosphor particles. The sol-gel solution supports the phosphor particles in a matrix form or the like so that the phosphor particles can be prepared in a plate form by a later process.

The sol-gel solution is a solution containing Si and Ti, and may further contain In or Zn. Si, Ti, In or Zn may exist in the form of an oxide in a solution. The sol-gel solution enables the crosslinking agent and phosphor particles to be mixed, and improves the heat resistance of the final product during the preparation process of the mixture. A sol-gel solution contains a solvent together in order to lower the viscosity.

As the sol-gel solution is included, the phosphor plate can be manufactured even if the mixture is heat-treated at a temperature (around 300° C.) in a second preset environment in a process to be described later. As a conventional phosphor plate includes a glass frit instead of a sol-gel solution, it is contrasted with having to be heat treated at a temperature of 600° C. or higher.

A transparent polymer may be included instead of the sol-gel solution. The transparent polymer also supports the phosphor particles, similar to the sol-gel solution. The transparent polymer is a polymer having a light transmittance of light, in particular, a visible light wavelength band having a predetermined reference value or more, for example, COP (Cyclo-Olefin Polymer), COC (Cyclo-Olefin Copolymer), silicon (Silicone) or polyimide ( Polymide) and the like. When the transparent polymer is mixed instead of the sol-gel solution, a solvent may be added together with the transparent polymer, the phosphor particles, and the crosslinking agent.

The phosphor particle is a component that receives excitation light of a specific wavelength and emits light in a predetermined wavelength band. A representative example of the phosphor particle is a garnet-based phosphor. YAG (Y ₃ Al ₃ O ₁₂ ), the name of yttrium aluminum garnet, a compound in which the lattice position of yttrium (Y) in YAG is replaced with another metal element, in particular, a rare earth element, and the lattice position of aluminum (Al) is replaced by another metal, especially , a compound substituted with gallium (Ga), an ion that functions as a luminescent center based on YAG, for example, Ce ³⁺ , Tb ³⁺ , Eu ³⁺ , Mn ²⁺ , Mn ⁴⁺ , Fe ³⁺ , Cr ³⁺ Inorganic fluorescent materials obtained by adding typical rare earth ions or transition metal ions, compounds in which yttrium (Y) is substituted with lutetium (Lu) (LuAG-based phosphors), and LuAG:Ce-based phosphors in which LuAG-based phosphors are doped with Ce ³⁺ including phosphors and the like. Garnet-based phosphor particles can withstand a temperature of 600° C. or higher without any change in properties. However, garnet-based phosphor particles have a problem of relatively poor color rendering.

Meanwhile, the phosphor particles may include various phosphor particles according to a wavelength band of light to be output, as well as garnet-based phosphor particles. For example, if the aforementioned garnet-based phosphor mainly emits light in a yellow wavelength band, it may be implemented with components such as SCASN, CASN, KSF, and SrLiAl ₃ N ₄ to output light in a red wavelength band. Phosphor particles implemented with these components have high color rendering properties, but relatively low heat resistance compared to garnet-based phosphor particles. For example, the characteristics of phosphor particles for outputting light in a red wavelength band are remarkably changed at a temperature of 400° C. or higher.

According to this feature, since heat treatment at 600° C. was required in the conventional phosphor plate manufacturing method, only garnet-based phosphor particles could be included in order to maintain intact optical characteristics during the manufacturing process. However, as described above, since the garnet-based phosphor particles have relatively low color rendering properties, it is difficult for conventional phosphor plates to have sufficient light characteristics. On the other hand, as the phosphor plate according to an embodiment of the present invention is mixed with a sol-gel solution or a transparent polymer, only heat treatment as much as the second preset environment (around 300° C.) is required. Accordingly, the phosphor plate according to an embodiment of the present invention may be manufactured by including not only garnet-based phosphor particles but also phosphor particles having excellent color rendering properties, and thus may have excellent optical properties.

A crosslinking agent is further included along with the sol-gel solution/transparent polymer and phosphor particles. The crosslinking agent causes a crosslinking reaction by light, beam or heat and crosslinks the sol-gel solution and the phosphor particles. The crosslinking agent can be crosslinked by light. The light may be radiation, particularly beta rays, and may also be ultraviolet rays if an initiator for initiating a crosslinking reaction is additionally included with the crosslinking agent. When irradiated with light, the cross-linking agent causes a cross-linking reaction and cross-links the sol-gel solution and the phosphor particles. The crosslinking agent may be crosslinked by electron beam (E-Beam). Alternatively, if a thermal initiator for initiating a crosslinking reaction is additionally included with the crosslinking agent, the crosslinking agent may cause a crosslinking reaction by heat.

The crosslinking agent produces the following effects.

First, the crosslinking agent prevents separation of the sol-gel solution and the phosphor particles while the heat treatment process to be described later proceeds. A heat treatment process to be described later is performed, and the viscosity of the sol-gel solution is lowered. The decrease in the viscosity of the sol-gel solution induces precipitation of the phosphor particles mixed with the sol-gel solution, causing the sol-gel solution and the phosphor particles to form layers and separate. The crosslinking agent undergoes a curing process to be described later, and allows the phosphor particles to be finally heat-treated while maintaining a dispersed state in the sol-gel solution. A phosphor plate having excellent quality in a state in which phosphor particles are dispersed by a crosslinking agent can finally be produced.

In addition, the crosslinking agent is crosslinked with the sol-gel solution by causing a crosslinking reaction by light, beam or heat. A crosslinking agent is added, and the effect of buffering the contraction of the sol-gel solution occurs due to the crosslinking reaction caused by the crosslinking agent later. As described above, the sol-gel solution includes Si, Ti, In, or Zn, and each component may exist as an oxide depending on the case. In the process of sintering these components by receiving heat, the organic matter is separated. As the organic matter is separated, the volume of the sol-gel solution shrinks compared to the original volume. As such, the volumetric shrinkage of the sol-gel solution during the sintering process causes problems on the surface or component separation as shown in FIGS. 5A to 5C. In order to prevent such a problem from occurring, in the manufacturing method according to an embodiment of the present invention, a crosslinking agent is additionally included and mixed in the process S110. The crosslinking agent is cured by being irradiated with light (mainly, radiation) in a process to be described later and crosslinked with the sol-gel solution. By cross-linking with the sol-gel solution, the cross-linking agent mitigates the (volume) shrinkage of the sol-gel solution and allows the mixed mixtures to be made into full-quality fluorescent plates.

The crosslinking agent may be implemented as TAC, TAIC, TMPTMA or Acrylo POSS. If the crosslinking agent causes a crosslinking reaction by radiation having strong energy, the reaction may occur even when irradiated for a short time (eg, several milliseconds (ms) to several seconds (s)). Thus, the production yield of the phosphor plate can be remarkably improved. In addition, radiation with strong energy can cause a crosslinking reaction regardless of molecular bonds (eg, double bonds) between sol-gel solutions or transparent polymers or bonds between specific components, so that the transparent polymers included in the manufacture of the phosphor plate There is no restriction on the type. That is, the sol-gel solution or the transparent polymer only needs to have light transmittance in the visible light wavelength range equal to or higher than a predetermined reference value, and there are no restrictions such as having to include molecules having specific molecular bonds or having a bonding structure between specific components.

The sol-gel solution and the phosphor particles may be included in a ratio of 5:5 to 4:6, and the crosslinking agent may be included in an amount of 0.1 to 5% by weight based on the total mixture to be mixed.

In addition to the sol-gel solution, the phosphor particles and the crosslinking agent, a filler may be further added. When the phosphor plate is manufactured by including only the sol-gel solution, the phosphor particles, and the crosslinking agent, there is a concern that the color of the phosphor plate may become too dark. In order to solve this problem, a filler may be additionally included, and thus, the color of the manufactured phosphor plate may be prevented from becoming excessively dark. The filler may be aluminum oxide.

A sol-gel solution or transparent polymer, phosphor particles and a crosslinking agent are mixed. Since impurities may be included in the mixing process, filtering of the impurities may be performed on the mixed mixture.

The mixed mixture is placed on the temporary substrate (S120).

The mixed mixture is placed on a temporary substrate. Here, the temporary substrate transmits the irradiated light or beam and is implemented with a material having high releasability. For example, the temporary substrate may be implemented with Teflon. The mixed mixture is placed on a temporary substrate made of such a material.

The temporary substrate on which the mixture is disposed is exposed to a vacuum environment (S130). When the mixed mixture is placed on the temporary substrate, the temporary substrate is exposed to a vacuum environment. It is exposed to a vacuum environment, and air bubbles remaining inside the mixture disposed on the temporary substrate are evacuated. When air bubbles remain inside the mixture, the air bubbles inside are discharged to the outside during the curing process of the mixture, and the surface may become incomplete. In order to completely solve this problem, all air bubbles in the mixture are removed by exposing the temporary substrate on which the mixture is placed to a vacuum environment.

The mixture is compressed with a plurality of temporary substrates (S140). The mixture is compressed with a plurality of temporary substrates to prepare the mixture in a plate form.

The crosslinking agent is cured by applying light, beam or heat (S150). In order to express the effect of the aforementioned crosslinking agent, light, beam or heat is applied to the mixture compressed by the temporary substrate. As described above, since the temporary substrate is made of a material that transmits light or beams, the mixture can be cured even in a compressed state by the temporary substrates. As the crosslinking agent is cured by light, beam or heat, separation of the sol-gel solution and phosphor particles is prevented, and shrinkage of the sol-gel solution is prevented.

The mixture is separated from the temporary substrate and placed on a metal substrate (S160). As described above, since the temporary substrate has releasability, the mixture can be smoothly separated on the temporary substrate. The mixture separated from the temporary substrate is placed onto a metal substrate. High heat is applied to the mixture through a heat treatment process to be described later, and as the high heat is applied, shrinkage of the sol-gel solution in the mixture may occur. If the shrinkage rate of the sol-gel solution is different from the shrinkage rate of the temporary substrate, the quality of the plate to be manufactured is affected, such as cracks on the surface of the sol-gel solution. To avoid this problem, the mixture is separated from the temporary substrate and placed on a metal substrate.

The mixture disposed on the metal substrate is heat treated in a first preset environment (S170). As mentioned above, a solvent is included in the sol-gel solution to lower the viscosity. In this heat treatment process, the solvent contained in the mixture is volatilized by heat treatment in a first preset environment. Here, the first preset environment may be around 80°C. In terms of volatilizing the solvent, the temperature of the first preset environment may be relatively lower than that of the second preset environment.

The mixture that has undergone the heat treatment process is heat treated in a second preset environment (S180). By heat-treating the mixture in a second preset environment, it is sintered into a plate shape. The second preset environment may be an environment in which a temperature of about 300° C. is provided for about 30 minutes. As described above, since the mixture contains a sol-gel solution rather than a glass frit, the mixture can be sintered at a temperature around 300°C. Heat treatment is performed in a second preset environment, and the sol-gel solution in the mixture is also hardened and the mixture is hardened. According to this feature, even if the mixture contains phosphor particles having lower heat resistance than garnet-based phosphor particles, it can be sintered in the form of a plate of excellent quality without deterioration in optical properties. In addition, since the volumetric shrinkage of the sol-gel solution is maximally prevented by curing (crosslinking reaction) of the crosslinking agent, a phosphor plate with perfect quality can be manufactured.

Furthermore, the second preset environment may provide a temperature of about 120° C. for about 30 minutes before providing a temperature of about 300° C. for about 30 minutes. Although the solvent is primarily volatilized through the S170 process, there is a possibility that all solvents included in the mixture may not be volatilized. The solvent may affect the optical properties of the phosphor plate to be finally manufactured and must be removed. Therefore, before sintering the mixture at a temperature of around 300 °C, the solvent included in the mixture is completely volatilized by providing a temperature of around 120 °C for about 30 minutes.

By heat-treating the mixture in a second preset environment, a phosphor plate is produced.

Since the phosphor plate manufactured in this way is manufactured including the sol-gel solution, it includes silicon oxide and titanium oxide, which are some of the components of the sol-gel solution. In addition, when a filler is included in the manufacture of the phosphor plate, the phosphor plate further includes aluminum oxide, which is a part of the filler component, in addition to silicon oxide and titanium oxide. included

2 is a flowchart illustrating a method of manufacturing a phosphor plate according to a second embodiment of the present invention.

Among the methods for manufacturing the phosphor plate according to the second embodiment of the present invention, a detailed description of the same process as the process of manufacturing the phosphor plate according to the first embodiment of the present invention will be omitted.

The sol-gel solution, phosphor particles and crosslinking agent are mixed (S210).

The mixed mixture is placed on the temporary substrate (S220).

The temporary substrate on which the mixture is disposed is exposed to a vacuum environment (S230).

The crosslinking agent is cured by applying light, beam or heat (S240).

The mixture is separated from the temporary substrate and placed on a metal substrate (S250).

The mixture is prepared in the form of a film (S260). A printing process or a casting process is performed on the placed mixture, and the mixture is produced in the form of a film.

The mixture disposed on the metal substrate is heat-treated in a first preset environment (S270).

The mixture that has undergone the heat treatment process is heat treated in a second preset environment (S280).

Through the above process, a phosphor plate or a phosphor film is manufactured.

3 is a flowchart illustrating a method of manufacturing a phosphor plate according to a third embodiment of the present invention.

Among the methods of manufacturing the phosphor plate according to the third embodiment of the present invention, a detailed description of the same process as the process of manufacturing the phosphor plate according to the first embodiment of the present invention will be omitted.

The sol-gel solution, phosphor particles and crosslinking agent are mixed (S310).

A mixture is disposed on the main substrate (S320). Unlike the first or second embodiment, in the manufacturing method according to the third embodiment, the temporary substrate is not directly disposed on the main substrate. Here, the main substrate transmits irradiated light or beams like a temporary substrate and has a characteristic of being made of a material with high releasability, and is additionally made of a material that withstands at least a second preset environmental temperature. For example, the main substrate may be implemented as a glass or silicon wafer. The mixture is placed directly on this main substrate.

The main substrate on which the mixture is disposed is exposed to a vacuum environment (S330).

The mixture is compressed (S340). The mixture may be compressed using a plurality of main substrates.

The crosslinking agent is cured by applying light, beam or heat (S350).

The mixture disposed on the main substrate is heat treated in a first preset environment (S360).

The mixture that has undergone the heat treatment process is heat treated in a second preset environment (S370).

4 is a flowchart illustrating a method of manufacturing a phosphor plate according to a fourth embodiment of the present invention. Among the methods for manufacturing the phosphor plate according to the fourth embodiment of the present invention, a detailed description of the same process as the process of manufacturing the phosphor plate according to the second and third embodiments of the present invention will be omitted.

The sol-gel solution, phosphor particles and crosslinking agent are mixed (S410).

A mixture is disposed on the main substrate (S420).

The main substrate on which the mixture is disposed is exposed to a vacuum environment (S430).

The crosslinking agent is cured by applying light, beam or heat (S440).

The mixture is prepared in the form of a film (S450).

The mixture disposed on the main substrate is heat treated in a first preset environment (S460).

The mixture that has undergone the heat treatment process is heat treated in a second preset environment (S470).

Through the above process, a phosphor plate or a phosphor film is manufactured.

Since they are manufactured with the same components as the phosphor plate manufacturing method according to the first embodiment, the phosphor film according to the second or fourth embodiment or the phosphor plate according to the third embodiment also includes silicon oxide and titanium oxide.

5 is a view showing a phosphor plate manufactured according to an embodiment of the present invention.

5A shows a phosphor plate prepared when 2 kGy of radiation is irradiated, FIG. 5B shows a phosphor plate prepared when 4 kGy of radiation is irradiated, and FIG. 5C shows a phosphor plate prepared when 8 kGy of radiation is irradiated. It is an illustrated drawing. Regardless of which drawings are referred to, it can be confirmed that an externally intact phosphor plate is manufactured if radiation is irradiated with an intensity within a predetermined range.

6 is a graph showing the relationship between temperature and size applied to a phosphor plate according to an embodiment of the present invention.

FIG. 6A is a graph of a phosphor plate prepared with 1 wt% of a sol-gel solution, and FIG. 6B is a graph of a phosphor plate prepared with 3 wt% of a sol-gel solution. Changes in temperature and size are shown for the phosphor plate prepared by radiation irradiated with various intensities within a range. Even after the addition of the crosslinking agent and irradiation with radiation of any intensity within a predetermined range, it can be confirmed that the volume change of the phosphor plate produced hardly occurs up to 350 ° C. That is, by mixing the crosslinking agent together, the change in volume of the sol-gel solution can be minimized during the manufacturing process according to an embodiment of the present invention, so that a phosphor plate that is intact in terms of shape and optical characteristics can be manufactured (mass-produced).

9 is a graph showing a spectrum of light output from a light source and light output after a phosphor plate according to an embodiment of the present invention is mounted, and FIG. 10 is a light source with a phosphor plate according to an embodiment of the present invention mounted thereon. This is a drawing showing the state of light emission.

Referring to the graph of FIG. 9 , it can be seen that the light source (Bare in the graph) outputs blue light between 400 and 500 nm before the phosphor plate is mounted. At this time, after the phosphor plate according to an embodiment of the present invention is mounted (placed) in the corresponding light source, it can be confirmed that the output light is white light having all wavelength bands. This can be confirmed in FIG. 10 .

10 is a diagram illustrating light actually output after a phosphor plate according to an embodiment of the present invention is mounted (placed) in a light source that emits blue light. As can be seen in FIG. 10 , it can be seen that perfect white light is being output.

9 and 10, it can be confirmed that the phosphor plate according to an embodiment of the present invention has excellent light characteristics and quality.

1 to 4 describe that each process is sequentially executed, but this is merely an example of the technical idea of one embodiment of the present invention. In other words, those skilled in the art to which an embodiment of the present invention pertains may change and execute the order described in each drawing or perform one or more processes of each process without departing from the essential characteristics of an embodiment of the present invention. Since it will be possible to apply various modifications and variations by executing in parallel, FIGS. 1 to 4 are not limited to a time-series order.

Meanwhile, the processes shown in FIGS. 1 to 4 can be implemented as computer readable codes on a computer readable recording medium. A computer-readable recording medium includes all types of recording devices in which data that can be read by a computer system is stored. That is, computer-readable recording media include storage media such as magnetic storage media (eg, ROM, floppy disk, hard disk, etc.) and optical reading media (eg, CD-ROM, DVD, etc.). In addition, the computer-readable recording medium may be distributed to computer systems connected through a network to store and execute computer-readable codes in a distributed manner.

The above description is merely an example of the technical idea of the present embodiment, and various modifications and variations can be made to those skilled in the art without departing from the essential characteristics of the present embodiment. Therefore, the present embodiments are not intended to limit the technical idea of the present embodiment, but to explain, and the scope of the technical idea of the present embodiment is not limited by these embodiments. The scope of protection of this embodiment should be construed according to the claims below, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of rights of this embodiment.

Claims (17)

Mixing process of mixing the sol-gel solution, the phosphor particles and the crosslinking agent;
a first arrangement process of disposing the mixed mixture on a temporary substrate;
an exposure process of exposing the temporary substrate on which the mixture is placed to a vacuum environment;
a compression process of compressing the mixture with a plurality of temporary substrates;
A curing process of curing the crosslinking agent;
a second arrangement step of separating the mixture from the temporary substrate and disposing it on the main substrate;
a first heat treatment process of volatilizing a solvent by heat treatment of the mixture disposed on the main substrate in a first preset environment; and
A second heat treatment process of heat treating the mixture that has undergone the first heat treatment process in a second preset environment,
The sol-gel solution is a solution containing Si and Ti,
The crosslinking agent causes a crosslinking reaction and crosslinks the sol-gel solution and the phosphor particles,
The first preset environment is an environment having a temperature within a preset error range based on 80 ° C,
The second preset environment is an environment in which a temperature within a preset error range based on 300 ° C. is provided for a time within a preset error range based on 30 minutes. delete According to claim 1,
The curing process is
A method for producing a phosphor plate, characterized in that a crosslinking agent in the mixture is cured by applying light, electron beam, or heat to the mixture. According to claim 1,
The temporary board,
A method for manufacturing a phosphor plate, characterized in that it is implemented with a material that passes light or electron beams and has release properties greater than or equal to a predetermined reference value. Mixing process of mixing the sol-gel solution, the phosphor particles and the crosslinking agent;
a first arrangement process of disposing the mixed mixture on a temporary substrate;
an exposure process of exposing the temporary substrate on which the mixture is placed to a vacuum environment;
A curing process of curing the crosslinking agent;
a second arrangement step of separating the mixture from the temporary substrate and disposing it on the main substrate;
A manufacturing process of preparing the mixture in the form of a film;
a first heat treatment process of volatilizing a solvent by heat treatment of the mixture disposed on the main substrate in a first preset environment; and
A second heat treatment process of heat treating the mixture that has undergone the first heat treatment process in a second preset environment,
The sol-gel solution is a solution containing Si and Ti,
The crosslinking agent causes a crosslinking reaction and crosslinks the sol-gel solution and the phosphor particles,
The first preset environment is an environment having a temperature within a preset error range based on 80 ° C,
The second preset environment is an environment in which a temperature within a preset error range based on 300 ° C. is provided for a time within a preset error range based on 30 minutes. delete According to claim 5,
The curing process is
A method for producing a phosphor plate, characterized in that a crosslinking agent in the mixture is cured by applying light, electron beam, or heat to the mixture. According to claim 5,
The temporary board,
A method for manufacturing a phosphor plate, characterized in that it is implemented with a material that passes light or electron beams and has release properties greater than or equal to a predetermined reference value. Mixing process of mixing the sol-gel solution, the phosphor particles and the crosslinking agent;
a disposition process of disposing the mixture that has undergone the mixing process on a main substrate;
an exposure process of exposing the main substrate on which the mixture is disposed to a vacuum environment;
a compression process of compressing the mixture;
A curing process of curing the crosslinking agent in the compressed mixture;
a first heat treatment process of volatilizing a solvent by heat treatment of the mixture disposed on the main substrate in a first preset environment; and
A second heat treatment process of heat treating the mixture that has undergone the first heat treatment process in a second preset environment,
The sol-gel solution is a solution containing Si and Ti,
The crosslinking agent causes a crosslinking reaction and crosslinks the sol-gel solution and the phosphor particles,
The first preset environment is an environment having a temperature within a preset error range based on 80 ° C,
The second preset environment is an environment in which a temperature within a preset error range based on 300 ° C. is provided for a time within a preset error range based on 30 minutes. According to claim 9,
The main board,
A method of manufacturing a phosphor plate, characterized in that it is implemented with a material that passes light or electron beams, has release properties greater than a predetermined reference value, and does not change even in the second predetermined environment. According to claim 10,
The main board,
A method for manufacturing a phosphor plate, characterized in that it is implemented as a glass or silicon wafer. Mixing process of mixing the sol-gel solution, the phosphor particles and the crosslinking agent;
a disposition process of disposing the mixture that has undergone the mixing process on a main substrate;
an exposure process of exposing the main substrate on which the mixture is disposed to a vacuum environment;
A curing process of curing the crosslinking agent;
A manufacturing process of preparing the mixture in the form of a film;
a first heat treatment process of volatilizing a solvent by heat treatment of the mixture disposed on the main substrate in a first preset environment; and
A second heat treatment process of heat treating the mixture that has undergone the first heat treatment process in a second preset environment,
The sol-gel solution is a solution containing Si and Ti,
The crosslinking agent causes a crosslinking reaction and crosslinks the sol-gel solution and the phosphor particles,
The first preset environment is an environment having a temperature within a preset error range based on 80 ° C,
The second preset environment is an environment in which a temperature within a preset error range based on 300 ° C. is provided for a time within a preset error range based on 30 minutes. According to claim 12,
The main board,
A method of manufacturing a phosphor plate, characterized in that it is implemented with a material that passes light or electron beams, has release properties greater than a predetermined reference value, and does not change even in the second predetermined environment. According to claim 13,
The main board,
A method for manufacturing a phosphor plate, characterized in that it is implemented as a glass or silicon wafer. A phosphor plate manufactured by the manufacturing method of any one of claims 1, 3 to 5, and 7 to 14.


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