KR102482167B1 - System and Method for Monitoring Sub-component - Google Patents

Abstract

The present invention relates to a sub-component monitoring system and method. The sub-component monitoring system according to an embodiment of the present invention comprises: a sub-component management device allowing a setting operation when there is a setting request for setting the operation of the sub-component from a user device managing a plurality of sub-components that supply manufacturing materials to each semiconductor production device and notifying the user device of an alarm when the operation is out of the range of the permitted operation setting; and an EAP device receiving analysis data related to the operation status of the plurality of sub-components from the sub-component management device and providing the analyzed data to the user device when there is a monitoring request for the plurality of sub-components from the user device. According to the present invention, the collected data of a supply device can be stored for a long period of time as the data is stored through a separate server.

Description

Sub-component monitoring system and method {System and Method for Monitoring Sub-component}

The present invention relates to a sub-component monitoring system and method, and more particularly, to a sub-component monitoring system and method for monitoring by increasing the processing accuracy of status information of a manufacturing material supply device, such as a manufacturing material supply device connected to a semiconductor main production facility.

The manufacture of semiconductor devices requires a high level of precision, and for the manufacture of semiconductor devices, each semiconductor manufacturing facility according to the manufacturing process of the semiconductor device, for example, thin film deposition equipment, etching equipment, etc. Most of the manufacturing process is carried out. These semiconductor manufacturing facilities include process facilities in which a predetermined process for wafers is actually performed, that is, semiconductor production facilities, and supply facilities that are connected to the process facilities and assist in the smooth execution of a predetermined process in the process facilities, that is, attached chemical equipment. It is common to install a separate water supply system. At this time, process facilities and supply facilities are separated and arranged in an interconnected state in order to prevent unexpected accidents that may occur in terms of space utilization or during the process. Accordingly, the process facility is provided in a fabrication facility (FAB) line, and the supply facility is disposed in an underground tank or service area.

On the other hand, the process facility is connected online with a host computer having a predetermined data collection function, and various data related to the process facility are input and stored in the host computer. At this time, the process equipment may perform continuous data exchange through a predetermined communication port responsible for data communication with the host computer, for example, by SECS (Semi Equipment Communications Standard) protocol. On the other hand, when managing data on raw and subsidiary materials inputted into process facilities and supply facilities, workers manually record data on raw and subsidiary materials in a record book before inputting raw and subsidiary materials into process facilities and supply facilities, or use a keyboard. stored on the host computer.

However, since the existing system had to adapt the supply devices, that is, supply facilities to the existing system, it is not easy to collect data again because a converter that needs to be changed according to the communication method is required. Manufacturers of each supply device do not use a standardized method, and in order to view the data of the supply device, the user configures the system independently or even if he/she sees the data, it is difficult to monitor because it cannot be monitored on a single screen interface. .

Accordingly, there is an urgent need for a method for reducing the economic burden generated while integrating systems and enabling users to conveniently monitor and manage data when the system is installed.

Korean Registered Patent Publication No. 10-1988596 (2019.06.05) Korean Registered Patent Publication No. 10-2272028 (2021.06.28) Korean Registered Patent Publication No. 10-2054936 (2019.12.05)

An object of the present invention is to provide a sub-component monitoring system and method for monitoring by increasing the processing accuracy of state information of a manufacturing material supply device, such as a manufacturing material supply device connected to a semiconductor main production facility.

In the sub-component monitoring system according to an embodiment of the present invention, a setting request for setting the operation of the sub-component is received from a user device that manages a plurality of sub-components that supply manufacturing materials to each semiconductor production equipment. A sub-component management device that allows a set operation when there is a setting operation and notifies the user device of an alarm when the operation is out of the range set by the permission, and the sub-component management device when there is a monitoring request for the plurality of sub-components from the user device. and an EAP device that receives analysis data related to operating states of the plurality of subcomponents from a component management device and provides the analyzed data to the user device.

The sub-component management device analyzes the standardization data transmitted from a plurality of data collection devices that automatically convert status data related to the supply status of the manufacturing material to the plurality of sub-components with different specifications and automatically convert them into standardized data. The analytical data obtained can be provided.

The subcomponent management device may perform SECS-2 communication to provide the analyzed data to the EAP device.

The subcomponent management device may record and manage a value in a SECS-2 table when the EAP device takes the analyzed data.

In addition, in the sub-component monitoring method according to an embodiment of the present invention, a sub-component management device sets the operation settings of the sub-components from a user device that manages a plurality of sub-components that supply manufacturing materials to each semiconductor production equipment. Allowing a set operation when requested, and notifying an alarm to the user device when the operation is out of the range set by the permission, and when the EAP device receives a monitoring request for the plurality of subcomponents from the user device. and receiving analysis data related to operating states of the plurality of subcomponents from the subcomponent management device and providing the analyzed data to the user device.

According to an embodiment of the present invention, in the past, each supply device had to be viewed separately to view or monitor the information of the supply devices, but if the monitoring data collection device is installed, the information of the supply devices to which the data collection device is connected can be seen at a glance. And with that information, the administrative user can help configure it the way he or she wants.

In addition, in an embodiment of the present invention, on a user interface screen provided to view data, the user may configure the screen to view the data he or she wants to see, or set several data to meet specific conditions at the same time, and may be able to compare data. By providing tools on the user interface screen that enable processing, it can be converted to display and compare various shapes of graphs.

Furthermore, in the embodiment of the present invention, the collected data of the supply device is stored through a separate server (eg, management device, etc.) and can be preserved for a long time, and the results of past data can also be retrieved from the server to view information. For example, it is possible to monitor (supplied) equipment sensor values enterprise-wide by sending values to the EAP server through the SECS-2 protocol, and to improve the accuracy of monitoring and alarm function processing by separating monitoring, detailed settings, and alarm functions. will be.

1 is a diagram showing a sub-component monitoring system according to an embodiment of the present invention;
2 is a S/W logic configuration diagram of the sub-component monitoring system of FIG. 1;
3 to 9 are diagrams showing scenarios of user interface (UI) screens;
Figure 10 is a block diagram illustrating the detailed structure of the sub-component management device (server) of Figure 1, and
11 is a flowchart of a subcomponent monitoring method according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

1 is a diagram showing a sub-component monitoring system according to an embodiment of the present invention, and FIG. 2 is a S/W logic configuration diagram of the sub-component monitoring system of FIG.

As shown in FIG. 1, the sub-component monitoring system 90 according to an embodiment of the present invention includes a sub-component 100, a data collection device 110, a sub-component management device (or sub-component server) 120, It includes some or all of the EAP (Enterprise Application Platform) device 130 and the user device 140, and may further include a separate communication network.

Here, "including some or all" means that some components such as the EAP device 130 are omitted to configure the sub-component monitoring system 90 or some components such as the sub-component management device 120 are included in the EAP device. It means that it can be configured by being integrated with other components such as (130), and will be described as including all to help a sufficient understanding of the invention.

The subcomponent 100 means a supply device or supply equipment necessary for semiconductor production. In other words, the production equipment 99 includes various equipment installed in the production line. In particular, in the case of a semiconductor process, the production equipment 99 may be installed in a clean room. The production equipment 99 according to the embodiment of the present invention may typically include exposure equipment, and may be ASML's equipment. In the case of exposure equipment, since it occupies the largest portion in the semiconductor process and is expensive, it needs to be strictly managed. Exposure equipment may simply refer to a chamber that applies photoresist (hereinafter referred to as photo) on a wafer, applies a mask, and then exposes it to light, but equipment that performs all of the above series of processes is referred to as exposure equipment. can do. More precisely, it may be referred to as lithography equipment. In other words, after applying the photo and applying the mask, the process of exposing to light and etching is all done.

The sub-component 100, that is, the supply device, is connected to the semiconductor production facility, that is, the production equipment 99, and supplies various subsidiary chemicals. Currently, there is no standardized information communication connection method because one company does not supply all supplies. In particular, in order to form conditions necessary for semiconductor production, a device capable of controlling and monitoring the conditions of each supply device in real time is required, and the data collection device 110 according to an embodiment of the present invention can be considered to perform this role. can Of course, if the data collection device 110 performs an operation of standardizing data because the supply devices are not standardized, the sub-component management device 120 that integrates and manages the supply devices is standardized from the plurality of data collection devices 110. It can be seen that data is received, in other words, a kind of big data is formed, and the big data is analyzed to provide analysis results to users or managers who manage supply devices, that is, subcomponents.

Each of the supply devices may be located adjacent to the semiconductor production equipment 99 or at a distance from each other. The data collection device 110 is connected to the data output ports of supply devices without being limited by distance and place.

The data collection device 110 is manufactured in a small size and does not occupy much space. The power of the data collection device 110 is supplied with power using Power Of Ethernet (PoE), which receives power through a network cable. PoE is a technology that simultaneously transmits data and power through a single cable. Therefore, a landfill of a separate power outlet is not required. When the data collection device 110 and a network cable are connected, the collected data can be viewed in a networked environment regardless of distance.

The sub-component monitoring system 90 according to an embodiment of the present invention binds and monitors several sub-chemical supply devices, that is, sub-components 100 required for semiconductor production, in a single system, and is It is directly connected and serves to provide information to users in real time. Currently, one company does not supply all supplies, so there is no standardized information communication connection method. In particular, in order to form conditions necessary for semiconductor production, a device capable of controlling and monitoring the conditions of each supply device in real time is required. Therefore, the monitoring data collection device 110 according to an embodiment of the present invention allows the data values of these sub-component devices to be seen at a glance and at the same time helps to prevent supply problems through data analysis, thereby improving semiconductor production. can be raised In addition, by providing an additional analysis system, it can help to know the influence of real-time or past data values.

Regardless of the type of information output from the supply device, the data collection device 110 automatically converts and recognizes the information (in the device) to collect information when connected to the output port. Here, recognition may mean device identification information or a standardized data format. Even if the main system of the supply devices, for example, a control device such as a CPU or an MPU, is nearby or far away, if the data collection device 110 is present, information can be transmitted wired or wirelessly, and the user can transmit the information in real time on a PC, smartphone, etc. connected to the network. it becomes possible to check In addition, the collected data can be set in the desired direction by the user, processed, expressed in various graphs, and stored to automatically set the reference point for the next produced numerical value. When a user collects data values of the subcomponents 100 in real time and sets an alarm range, when an abnormal value occurs, it is possible to determine the exact cause and establish countermeasures in the future.

The sub-component 100 of the semiconductor equipment communicates with RS232, RS485, and Modbus protocols. A communication interface is set in the hardware of the data collection device 110 to select a protocol so that sensors of various subcomponents 100 can be accurately collected. It is possible to collect data from various equipment with one hardware prototype. The protocol of the data collection device 110 generates a packet with identification information (ID), equipment name, sensor key, and sensor value, and transmits data to the subcomponent management device 120 through the TCP/IP network. send. Of course, a TCP/IP network is a network consisting of a set of communication protocols used to connect computers with different systems and transmit data. This may be a separate communication network.

The sub-component management device 120 may be connected to a plurality of data collection devices 110 to integrate and manage collected data. For example, big data can be formed to perform analysis operations. The subcomponent management device 120 may be named 'subcomponent server' according to an embodiment of the present invention. The sub-component management device 120 simultaneously supports SECS-2 communication so that data can be transmitted to the EAP device 130, which is composed of its own web server and DB and operates as an EAP server. Continuous data exchange can be performed by the SECS protocol. Real-time data is stored in the subcomponent management device 120 and DB, and values are registered (or recorded) in the SECS-2 table so that the EAP device 130 can take related data. In other words, it can be seen that the EAP device 130 leaves a record in the SECS-2 table when taking data or analysis data from the subcomponent management device 120.

The user device 140 of each user, that is, the administrator who manages the subcomponent 100, monitors related data (eg, operation state data) through the EAP device 130, and monitors the subcomponent management device 120, which is a subcomponent web server. ), the administrator can set the alarm setting range for the sensor value limits, etc., and based on this, an alarm can be delivered to each user when abnormal data is received outside the alarm setting range. Here, the EAP device 130 may mean an open source Jakarta EE compatible application server.

The subcomponent management device 120 and the EAP device 130 according to an embodiment of the present invention can operate as a master server (or master device) as shown in FIG. 2 . The sub-component management device 120 receives and analyzes standardized state data from the data collection device 110, controls the plurality of sub-components 100 based on the analysis results, and upon request from the user device 140, the EAP device A monitoring screen for a plurality of subcomponents 100 may be provided through 140 .

The user device 140 may refer to a terminal device of persons related to the subcomponent 100 or the data collection device 110 of FIGS. It can also mean an administrator device. Of course, the terminal device of the person concerned or the manager device includes various devices such as a desktop computer, a laptop computer, a tablet PC, a smart phone, and a smart TV. By accessing the service provided by the sub-component management device 120 through the user device 140, it becomes possible to bundle and monitor sub-components 100 of various auxiliary chemicals required for semiconductor production in one system. More precisely, the user device 140 allows the manager to set limits of sensor values through the subcomponent management device 120, so that an alarm can be delivered to each user when abnormal data is received.

In other words, in order to set the operation of the sub-component 100, the user device 140 according to the embodiment of the present invention performs the setting operation by directly connecting to the sub-component management device 120, and the setting operation is performed. An alarm can be received when it is out of a set range through the first communication path. On the other hand, the user device 140 accesses the EAP device 130 through the second communication path to monitor the operating state of the subcomponent 100 and performs a monitoring operation. Through this, it can be seen that the user device 140 indirectly accesses the subcomponent management device 120 . In this way, by separately processing the monitoring, detailed setting, and alarm functions, it is possible to increase the accuracy of processing the monitoring and alarm functions.

Meanwhile, in the subcomponent monitoring system 90 according to an embodiment of the present invention, the data collection devices 110, the subcomponent management device 120, the EAP device 130, and the user device 140 each communicate through a communication network. can be performed. The communication network includes both wired and wireless communication networks. For example, as a communication network, a wired or wireless Internet network may be used or interlocked. Here, the wired network includes an Internet network such as a cable network or a public switched telephone network (PSTN), and the wireless communication network includes CDMA, WCDMA, GSM, EPC (Evolved Packet Core), LTE (Long Term Evolution), and Wibro networks. meaning to include Of course, the communication network according to the embodiment of the present invention is not limited thereto, and can be used as an access network of a next-generation mobile communication system to be implemented in the future, for example, a cloud computing network under a cloud computing environment, a 5G network, and the like. For example, if the communication network is a wired communication network, an access point within the communication network can access an exchange center of a telephone company. It can process data by connecting to various repeaters such as Transceiver Station), NodeB, and e-NodeB.

A communication network may include an access point. Access points include small base stations such as femto or pico base stations that are often installed in buildings. Here, the femto or pico base stations are classified according to the maximum number of data collection devices 110 or user devices 140 that can be connected to the small base stations. Of course, the access point includes a short-range communication module for performing short-range communication such as ZigBee and Wi-Fi with the data collection device 110 or the user device 140. The access point may use TCP/IP or Real-Time Streaming Protocol (RTSP) for wireless communication. Here, short-range communication may be performed in various standards such as Bluetooth, ZigBee, infrared (IrDA), RF (Radio Frequency) such as UHF (Ultra High Frequency) and VHF (Very High Frequency), and ultra-wideband communication (UWB) in addition to Wi-Fi. can Accordingly, the access point extracts the location of the data packet, designates the best communication path for the extracted location, and sends the data packet along the designated communication path to the next device, for example, a subcomponent management device (or data analysis service device) 120 ) can be transmitted. An access point may share several lines in a general network environment, and includes, for example, a router, a repeater, and a repeater.

As a result of the configuration described above, in the embodiment of the present invention, data values can be seen at a glance through the data collection device 110 and at the same time, there can be no problem in supply through data analysis. Through this, it is possible to increase the improvement of semiconductor production. Furthermore, by separating the monitoring, detailed setting, and alarm functions, the accuracy of processing the monitoring and alarm functions can be improved.

3 to 9 are diagrams showing scenarios of user interface (UI) screens.

For convenience of explanation, referring to FIGS. 3 to 9 together with FIGS. 1 and 2 , for example, the user device 140 of FIG. 1 logs in and accesses the sub-component management device 120 through the login button 300, And if a password is input, the initial screen may enter the sub-component main screen. This is well shown in FIG. 3 . As can be seen in (b) of FIG. 3, items such as user management, sub registration, equipment registration, and settings are displayed on the main screen.

If an administrator logs in as Admin, as shown in FIG. 4, it is possible for the user to select rights such as 'view mode' and 'alarm setting rights'. Sub-component registration, equipment registration, and user password change are possible through the manager (mode). This can be done by selecting the user management item 310 as seen in (a) of FIG. 4 .

Also, the user device 140 may input a sub-component name. Also, enter the collection device IP. You can also enter the subcomponent port name. Each subcomponent is identified with a unique value as IP and port name. Figure 5 shows this process. To this end, the corresponding operation can be performed by selecting the Sub registration item on the main screen. When a specific port item of a subcomponent is selected in (b) of FIG. 5, a screen similar to that in (c) of FIG. 5 may be displayed.

6 shows a screen for inputting a device name. Of course, this can be done by selecting the equipment registration item 330 on the main screen. Here, the subcomponents 100 included in the equipment are grouped. When the subcomponent 100 is added to the equipment, the newly registered subcomponent 100 in the related equipment is updated. As shown in (c) of FIG. 6, an additional operation may be performed by selecting an additional button.

When subcomponent 100 and equipment registration are completed, parameters related to each subcomponent 100 are displayed on the main screen. When the alarm setting button 340 on the left in the parameter item of FIG. 7 is clicked, the alarm setting screen is displayed. This is shown in Figure 8.

On the other hand, when an alarm is clicked as shown in FIG. 7, the main screen is converted to a single screen for the selected parameter as shown in FIG. 8, and an alarm setting screen is displayed. Set the minimum/maximum allowed values in the alarm window, and set whether to blink in line color and alarm state.

Figure 9 shows that when an alarm occurs, pop-up equipment, sub-component location and generation time, and the cause of the alarm are expressed.

10 is a block diagram illustrating a detailed structure of the subcomponent management device of FIG. 1 .

As shown in FIG. 10, the subcomponent management apparatus 120 according to an embodiment of the present invention is a part of the communication interface unit 1000, the control unit 1010, the subcomponent management unit 1020, and the storage unit 1030, or Including everything.

Here, "including part or all" means that some components such as the storage unit 1030 are omitted to configure the sub-component management device 120, or some components such as the sub-component management unit 1020 are the control unit ( 1010), which can be integrated into other components such as, etc., and will be described as including all of them to help a sufficient understanding of the invention.

The communication interface unit 1000 communicates with the data collection device 110 and the EAP device 130 through a TCP/IP communication network or an internal network, respectively. During communication, the communication interface unit 1000 may perform operations such as modulation/demodulation, encryption/decryption, encoding/decoding, muxing/demuxing, and the like. The communication interface unit 1000 may receive standardized (or standardized, standardized, or unified) data of subcomponents 100 having various specifications (or standards) from the data collection device 110 . The communication interface unit 1000 may include a first communication unit and a second communication unit that communicate according to different communication protocols.

The control unit 1010 is in charge of overall control operations of the communication interface unit 1000 of FIG. 10 , the subcomponent management unit 1020 and the storage unit 1030 . The controller 1010 may include a CPU or an MPU, and the controller 1010 typically separates and processes an alarm function according to operation settings of the subcomponent 100 and a monitoring operation for monitoring the subcomponent 100. do. Of course, this is done at the request of the subcomponent management unit 1020, but the control unit 1010 performs communication with the user device 140 of FIG. 1 through the first communication path for this purpose, and also through the second communication path. 1's EAP device 130. More precisely, the controller 1010 may control the communication interface 1000 to communicate with the data collection device 110, the EAP device 130, and the user device 140, respectively, according to a request of the subcomponent manager 1020. there is.

The subcomponent management unit 1020 performs various operations according to an embodiment of the present invention. The operating state of each subcomponent 100 can be analyzed by integrating the standardized data provided from the data collection device 110, and the analysis data related to the operating state can be analyzed by the user device 140 through the EAP device 130. ) to enable monitoring. To this end, the subcomponent management unit 1020 operates in conjunction with the control unit 1020.

In addition, the sub-component manager 1020 detects an abnormal operation outside the set operating range as a result of data analysis when there is an operation setting and alarm request for the sub-component 100 managed by the user device 140, the corresponding user An alarm is provided to the device 140 . For example, the user device 140 may perform a monitoring operation by accessing the EAP device 130 based on the corresponding alarm.

In addition, the subcomponent management unit 1020 may provide a user interface (UI) screen for operation setting and monitoring, or may increase data analysis accuracy by installing an artificial intelligence (AI) deep learning program. For example, through this, the subcomponent management unit 1020 analyzes the motion data according to the time change of the subcomponents 100, that is, the motion data from the past to the present, so as to know the influence of real-time or past data values. In the case of artificial intelligence, compared to existing rule-based programs, since the present can be predicted based on past data, it is possible to predict the abnormal operation of the subcomponent 100. .

In addition, the subcomponent manager 1020 may be able to compare a plurality of subcomponents 100 managed by one manufacturer or operating company through one screen through the UI screen, and at this time, comparison of graph display, etc. To make it possible to manage easily. Furthermore, by setting various data to meet specific conditions, comparison can be made as much as possible. For example, when a specific parameter is selected, operating states of a plurality of subcomponents 100 based on the corresponding parameter are displayed on a single screen as a graph, thereby facilitating manager management. The subcomponent management unit 1020 may be involved in these operations by performing graphic processing such as a GUI.

The storage unit 1030 may temporarily store data processed under the control of the control unit 1020 . For example, the control unit 1020 may temporarily store the data collected by the data collection device 110 in the storage unit 1030, call it out, classify it systematically in a separate DB, and store the data.

In addition to the above, the communication interface unit 1000, the control unit 1010, the subcomponent management unit 1020, and the storage unit 1030 of FIG. 10 according to an embodiment of the present invention can perform various operations, and other details. has been fully explained above, so we will replace it with the contents.

The communication interface unit 1000, the control unit 1010, the subcomponent management unit 1020, and the storage unit 1030 of FIG. 10 according to an embodiment of the present invention are composed of physically separated hardware modules, but each module is internally It will be possible to store and execute software for performing the above operation in . However, since the corresponding software is a set of software modules, and each module can be formed of hardware, it will not be particularly limited to the configuration of software and hardware. For example, the storage unit 1030 may be hardware storage or memory. However, since it is possible to store information in a software manner (repository), the above content will not be particularly limited.

Meanwhile, as another embodiment of the present invention, the control unit 1010 may include a CPU and a memory, and may be formed as a single chip. The CPU includes a control circuit, an arithmetic unit (ALU), a command interpreter, and a registry, and the memory may include RAM. The control circuit performs control operations, the operation unit performs operation of binary bit information, and the instruction interpretation unit performs an operation of converting high-level language into machine language and machine language into high-level language, including an interpreter or compiler. , the registry may be involved in software data storage. According to the above configuration, for example, at the beginning of operation of the sub-component management device 120, the program stored in the sub-component management unit 1020 is copied, loaded into a memory, that is, RAM, and then executed, thereby increasing data operation processing speed. can increase rapidly. In the case of a deep learning model, it can be loaded into GPU memory rather than RAM, and can be executed by accelerating the execution speed using the GPU.

11 is a flowchart illustrating a subcomponent data collection method of the subcomponent data collection system of FIG. 1 .

Referring to FIG. 11 together with FIG. 1 for convenience of explanation, the sub-component management apparatus 120 of FIG. 1 according to an embodiment of the present invention includes a plurality of sub-components 100 supplying manufacturing materials to each semiconductor production equipment. When there is a setting request for operation setting from the managing user device 140, the setting operation is allowed, and an alarm is notified to the user device when the operation setting range is exceeded by permission (S1100).

The subcomponent management device 120 and the user device 140 may directly perform a setting operation and an alarm notification operation of the subcomponent 100 through the first communication path. Here, the first communication path may mean communication according to the first communication protocol. The first communication protocol may include a communication protocol on a web such as TCP/IP.

In addition, the EAP device 130 receives analysis data related to operating states of the plurality of subcomponents 100 from the subcomponent management device 120 when there is a monitoring request for the plurality of subcomponents 100 from the user device 140. It is provided and provided to the user device 140 (S1010).

Although communication is performed according to the SECS protocol between the EAP device 130 and the subcomponent management device 120, the user device 140 directly connects to the EAP device 130 through the second communication path in the case of a monitoring operation and communicates with it. can be performed. Of course, the second communication path can use a communication protocol different from that of the first communication path, but only the identification information of connected devices (eg, subcomponent management device and EAP device) can be distinguished while using the same communication protocol. In the embodiment of will not be particularly limited in any one form.

In conclusion, the user device 140 of the user or manager who manages the sub-component 100 accesses the sub-component management device 120 to set the operation of the sub-component 100, and when abnormal data is detected, that is, the operation is performed. An alarm may be notified from the subcomponent management device 120 when a set operation is out of range. In addition, if monitoring is required according to the notification of the alarm, of course, monitoring may be performed by periodic connection other than that, but in this case, the monitoring operation may be performed by accessing the EAP device 130 . Through this, it is possible to increase the accuracy of monitoring and alarm function processing operations.

In addition to the above, the subcomponent 100, data collection device 110, subcomponent management device 120, EAP device 130, and user device 140 of FIG. 1 can perform various operations, and other detailed Since the contents have been sufficiently explained above, we will replace them with the contents.

On the other hand, even if all the components constituting the embodiment of the present invention are described as being combined or operated as one, the present invention is not necessarily limited to these embodiments. That is, within the scope of the object of the present invention, all of the components may be selectively combined with one or more to operate. In addition, although all of the components may be implemented as a single independent hardware, some or all of the components are selectively combined to perform some or all of the combined functions in one or a plurality of hardware. It may be implemented as a computer program having. Codes and code segments constituting the computer program can be easily inferred by a person skilled in the art. Such a computer program may implement an embodiment of the present invention by being stored in a computer-readable non-transitory computer readable media, read and executed by a computer.

Here, the non-transitory readable recording medium means a medium that stores data semi-permanently and can be read by a device, not a medium that stores data for a short moment, such as a register, cache, or memory. . Specifically, the above-described programs may be provided by being stored in a non-transitory readable recording medium such as a CD, DVD, hard disk, Blu-ray disk, USB, memory card, or ROM.

Although the preferred embodiments of the present invention have been shown and described above, the present invention is not limited to the specific embodiments described above, and is common in the art to which the present invention pertains without departing from the gist of the present invention claimed in the claims. Of course, various modifications and implementations are possible by those with knowledge of, and these modifications should not be individually understood from the technical spirit or perspective of the present invention.

100: subcomponent (or supply device) 110: data collection device
120: Subcomponent management device (or server) 130: EAP device (or server)
140: user device

Claims (5)

When there is a setting request for setting the operation of the sub-component from a user device that manages a plurality of sub-components that supply manufacturing materials to each semiconductor production equipment, the setting operation is allowed, and the operation by the permission a sub-component management device that is a web server that notifies the user device of an alarm when it is out of a set range; and
An EAP device that is an application server that receives analysis data related to the operation status of the plurality of subcomponents from the subcomponent management device and provides the analyzed data to the user device when there is a monitoring request for the plurality of subcomponents from the user device. include,
The user device directly connects to the sub-component management device to set an operation, performs a setting operation, and receives an alarm when the user device is out of the setting range through a first communication path through which the setting operation was performed;
The user device performs a monitoring operation by accessing the EAP device through a second communication path in relation to monitoring the operating state of the subcomponent,
The subcomponent management device and the EAP device operate as a master device;
The EAP device performs TCP/IP communication with the user device,
The sub-component management device,
performing SECS-2 communication to provide the analysis data to the EAP device;
The sub-component management device,
Provides a monitoring screen for the plurality of subcomponents through the EAP device upon request of the user device;
The sub-component management device,
By selecting the equipment registration item 330 on the main screen provided to the user device, the sub-components included in the equipment are grouped, and when a sub-component is added to the equipment, the newly registered sub-component in the related equipment is updated, and the sub-component and equipment are added. When equipment registration is completed, parameters related to each subcomponent are displayed on the main screen, and when the alarm setting button 340 is clicked in the displayed parameter item, the alarm setting screen is displayed, but when the alarm setting button is clicked The main screen converts to a single screen for the selected parameter and displays the alarm setting screen. On the alarm setting screen, the minimum and maximum allowable values related to the alarm range are set, and the line color and To set whether or not to blink in an alarm state,
The sub-component management device,
A sub-component monitoring system that displays a pop-up device, a sub-component location and occurrence time, and a cause of an alarm to the user device when an alarm occurs. According to claim 1,
The sub-component management device analyzes the standardization data transmitted from a plurality of data collection devices that automatically convert status data related to the supply status of the manufacturing material to the plurality of sub-components with different specifications and automatically convert them into standardized data. A sub-component monitoring system providing the analytical data obtained. delete According to claim 1,
wherein the subcomponent management device records and manages a value in a SECS-2 table when the EAP device takes the analyzed data. A sub-component management device, which is a web server, allows a setting operation when there is a setting request for setting the operation of the sub-component from a user device that manages a plurality of sub-components that supply manufacturing materials to each semiconductor production equipment. notifying an alarm to the user device when the permitted operation is out of the set range; and
An EAP device, which is an application server, receives analysis data related to operating states of the plurality of subcomponents from the subcomponent management device when there is a request to monitor the plurality of subcomponents from the user device, and provides the analyzed data to the user device. step; including,
The user device directly connects to the sub-component management device to set an operation, performs a setting operation, and receives an alarm when the user device is out of the setting range through a first communication path through which the setting operation was performed;
The user device performs a monitoring operation by accessing the EAP device through a second communication path in relation to monitoring the operating state of the subcomponent,
The subcomponent management device and the EAP device operate as a master device;
The EAP device performs TCP/IP communication with the user device,
performing, by the subcomponent management device, SECS-2 communication to provide the analyzed data to the EAP device;
providing, by the sub-component management device, a monitoring screen for the plurality of sub-components through the EAP device upon request of the user device;
The sub-component management device groups the sub-components included in the equipment by selecting the equipment registration item 330 on the main screen provided to the user device, and when a sub-component is added to the equipment, the sub-component newly registered in the related equipment is displayed. and when the sub-component and equipment registration is completed, the parameters related to each sub-component are displayed on the main screen, and when the alarm setting button 340 is clicked in the displayed parameter item, the alarm setting screen is displayed, but when the alarm setting button is clicked At this time, the main screen converts to a single screen for the selected parameter and displays the alarm setting screen. On the alarm setting screen, the minimum and maximum allowable values related to the alarm range are set and the line color related to the alarm color is set. and setting whether or not to blink in an alarm state. and
displaying, by the sub-component management device, a pop-up device, a sub-component location and occurrence time, and an alarm occurrence cause to the user device when an alarm occurs;
A sub-component monitoring method further comprising:

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