KR102469785B1 - A fixing apparatus for a heat sink and fixing method of the heatsink using the same - Google Patents

Abstract

The present invention relates to a heat sink fixing device, which uses a unique shape and structure to stably fasten a heat sink to a substrate without performing any special processing for fixing the heat sink to the inside or outside of the heat sink corresponding to the fixing target. It is about a sink fixture.
A heat sink fixing device according to the present invention includes a contact portion contacting a contact surface of a heat sink, an inclined portion formed outside the contact portion, and including an inclined portion formed in a direction away from the contact surface toward the outside, and the inclined portion. It includes a bent portion extending from one end of the portion and curved in a direction opposite to the inclination, and a hook-shaped fixing portion formed extending from the bent portion and curved to one side.

Description

Heat sink fixing device and heat sink fixing method using the same {A FIXING APPARATUS FOR A HEAT SINK AND FIXING METHOD OF THE HEATSINK USING THE SAME}

The present invention relates to a heat sink fixing device, which uses a unique shape and structure to stably fasten a heat sink to a substrate without performing any special processing for fixing the heat sink to the inside or outside of the heat sink corresponding to the fixing target. It's about the sink fixture.

In general, a heat sink is an auxiliary device for dissipating heat generated from an electronic component to the outside, and a lug is provided as a fixing device for fixing the heat sink to a printed circuit board (PCB).

Korean Patent Publication No. 10-2011-0131392 and the like (hereinafter referred to as the prior art) exist as prior art for this. In the case of the prior art, a printed circuit board 102 and provided on the printed circuit board 102 , a heat sink 104 including a first fastening groove g1 to dissipate driving heat generated in an electronic component to the outside, and to the first fastening groove g1 while supporting the end of the heat sink 104 It includes a heat sink lug 106 fastened to secure the heat sink 104 .

And, as shown in FIG. 1 , the first fastening groove g1 is formed in a central part of the ends of the heat sink 104, and the heat sink lug 106 supports the end of the heat sink 104 and first By being fastened to the fastening groove g1, the heat sink 104 can be fixed on the printed circuit board 102. It is stated in advance that it has nothing to do with the code.)

However, in the case of the prior art, a processing process of forming a fastening groove into which a heat sink lug is fastened is additionally required to fix the heat sink. In particular, when the heat sink is made of a ceramic material, the heat sink This can cause problems such as cracking or fragmentation.

In addition, due to these problems, the use of materials for the heat sink is limited, and the manufacturing yield is significantly reduced due to fragments generated in the processing process, and safety accidents or malfunctions frequently occur. it will happen

Therefore, there is an urgent need for a fixing member capable of stably fixing the heat sink on the substrate without additional processing.

The present invention has been made to solve the above problems, and based on a reliable fastening force through a unique structure, regardless of the material of the heat sink to be fixed, the heat sink can be stably fastened on the substrate. An object of the present invention is to provide a heat sink fixing device capable of obtaining versatility in adopting a heat sink material.

In addition, since it can be stably fastened on a substrate without applying deformation to the originally intended heat sink structure, it is an object of the present invention to provide a heat sink fixing device capable of securing the same heat dissipation reliability and heat dissipation function for the heat sink. .

In addition, it is possible to secure a wide fastening tolerance for securing a certain fastening force through the unique structure, so even if an unintended gap occurs in the part where the central fastening force acts during the fastening process, it does not affect the expected fastening force, so heat sink fastening An object of the present invention is to provide a heat sink fixing device capable of improving process yield.

A heat sink fixing device according to the present invention for the purpose of solving the above problems is formed on the outside of the contact portion in contact with the contact surface of the heat sink, and the contact portion, and the inclination formed in a direction away from the contact surface toward the outer direction. It includes a slanted portion, a bent portion extending from one end of the slanted portion and curved in a direction opposite to the slanted portion, and a hook-shaped fixing portion formed extending from the bent portion and curved to one side.

In addition, the height of the inflection point where the inclined portion and the curved portion meet is configured to be located below the protruding surface of the heat sink.

In addition, the inflection point where the inclined portion and the curved portion meet is positioned such that the side portion of the contact surface and the curved portion have a minimum separation space.

In addition, the contact part is configured to form one or more contact points that come into contact with the contact surface.

Also, when there are two or more contact points, a curve line curved in a direction corresponding to the bent portion is formed between the contact points.

In addition, the curve line is configured to be located below the protruding surface.

In addition, the fixing part is configured to have a curved hook shape in the direction of the heat sink.

In addition, the inclined portion includes a bending line in which the inclined portion is bent in an 'S' shape.

In addition, a heat sink fixing method of fixing the heat sink on an integrated circuit using a heat sink fixing device includes a fixing preparation angle forming step of forming a fixing preparation angle by pulling the bent portion toward the side of the contact surface, and a first fixing unit. A first fixing step of fixing to the fixing surface, a contacting step of contacting the contact part to the contact surface of the heat sink, and a second fixing step of fixing the second fixing part to the fixing surface.

In addition, the fixing preparation angle forming step is performed by grounding a bent portion formed outside the side of the contact surface.

The present invention having the above configuration, steps, and characteristics can stably fasten the heat sink on the substrate regardless of the material of the heat sink corresponding to the fixing target based on the reliable fastening force through the unique structure, so that the heat sink It has the advantage of being able to acquire the versatility of material adoption.

In addition, depending on the working environment, if work is required from the upper side, upper workability can be maximized, or if work is required from the side side, side workability can be maximized. As it is provided separately, it has the advantage of significantly improving workability.

In addition, since it can be stably fastened on the substrate without applying deformation to the originally intended heat sink structure, it has the advantage of securing the same heat dissipation reliability and heat dissipation function for the heat sink.

In addition, it is possible to secure a wide fastening tolerance for securing a certain fastening force through the unique structure, so even if an unintended gap occurs in the part where the central fastening force acts during the fastening process, it does not affect the expected fastening force, so heat sink fastening It has the advantage of improving process yield.

1 is a view showing the prior art.
2 is a perspective view in which a metal wire method is employed;
Figure 3 is a perspective view in which the plate spring method is employed.
4 is a front view of an M-type heat sink fixing device;
5 is a front view of a Y-type heat sink fixing device;
6 is a front view of a heat sink fixing device having a fixing part formed outwardly;
7 is a front view of a heat sink fixing device having a one-point contact portion;
8 is a front view of a heat sink fixing device having an 'S' shaped bending line;
9 is a front view of a heat sink fixing device having a two-point contact portion and a curve line between the two-point contact portion.

Since the present invention can have various changes and various forms, the implementation examples (or embodiments) will be described in detail in the text. However, this is not intended to limit the present invention to a specific form disclosed, and should be understood to include all modifications, equivalents, or substitutes included in the spirit and scope of the present invention.

Terms used in this specification are only used to describe a specific embodiment (aspect, aspect, aspect) (or embodiment), and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, terms such as ~comprising~ or ~consisting of are intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that it does not preclude the possibility of the presence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined in the present application, they should not be interpreted in an ideal or excessively formal meaning. don't

~First~, ~Second~, etc. described in this specification will only be referred to to distinguish different components from each other, regardless of the manufacturing order, and the names in the detailed description and claims of the invention may not match.

And (a) in FIGS. 4 to 9 shows the heat sink fixing device (F) before fixing, and (b) shows the heat sink fixing device (F) after fixing the heat sink (H).

The present invention relates to a heat sink fixing device (F), and more particularly, to a heat sink fixing device (F) capable of stably fixing a heat sink (H) on an integrated circuit (I) regardless of its constituent material. ) is about.

The heat sink (H) is provided above the PCB substrate (P) and the integrated circuit (I), and is provided to dissipate driving heat generated from electronic components such as FET components to the outside.

And Figures 2 and 3 correspond to a perspective view in which the heat sink (H) is fixed using the heat sink fixing device (F) according to the present invention. 2 is an embodiment employing the metal wire method (F1), and FIG. 3 is an embodiment employing the leaf spring method (F2). The embodiment of the metal wire method (F1) can perform more precise fixing than the embodiment of the leaf spring method (F2), and the embodiment of the leaf spring method (F2) is more detailed than the embodiment of the metal wire method (F1). There is an advantage that strong fixation can be performed.

The important point here is not the difference between the above embodiments, but the difference from the prior art. The difference from the prior art is that the heat sink (H) can be universally fixed on the integrated circuit (I) through the heat sink fixing device (F) according to the present invention regardless of the constituent material of the heat sink (H). that there is

In particular, as the heat sink (H) is a configuration provided to add a heat dissipation function, it can be seen that heat dissipation performance is the most important criterion for distinguishing the above heat sink (H). Therefore, employing various constituent materials of the heat sink (H) in order to obtain a desired heat dissipation performance corresponds to one of the important methods for improving the performance of the heat sink (H) itself.

However, in the conventional case, as described above, a fixing hole is provided on the heat sink (H) to fix the heat sink (H), and a fixing pin is inserted into the fixing hole to fix the heat dissipation performance. It was impossible to produce a heat sink (H) with this relatively excellent ceramic material such as SiC and alumina. This is because, due to the characteristics of ceramic material, the material is very brittle, and the heat sink H is broken in the process of providing the fixing hole.

However, in the case of the heat sink fixing device (F) according to the present invention, the heat sink (H) is not subjected to additional processing to create a fixing hole on the heat sink (H) for fixing, and the heat sink fixing device (F) Since the heat sink (H) is fixed through the shape and structure, it is possible to stably fix the heat sink (H) on the integrated circuit (I) regardless of the material of the heat sink (H).

In addition, the additional processing used in the prior art has nothing to do with improving the heat dissipation performance, and is simply a processing performed to fix the heat sink (H), and rather acts as a factor impairing the heat dissipation performance or yield. In the case of the present invention, the above As a result, there is an advantage in that heat dissipation performance or yield of the heat sink (H) can be improved because there is no need to perform additional processing.

In the following, fixing devices having different shapes and structures will be described using the above-described embodiment of the metal wire method (F1) as a representative embodiment.

And it can be largely divided into two embodiments. First, the inflection point 31 where the inclined part 2 and the bent part 3 meet to obtain side workability is the side part of the contact surface H1 and the bent part 3 ) is an embodiment (see FIGS. 4 and 7) positioned to have a minimum separation space (G) (hereinafter referred to as an M-type embodiment), and the second is the inclined portion 2 and the bent portion 3 to obtain upper workability The height of the inflection point 31 is an embodiment (see FIGS. 5, 6, 8 and 9) located below the protruding surface H3 of the heat sink H (hereinafter referred to as a Y-type embodiment). The above embodiment will be described in detail below.

First, the heat sink fixing device (F) according to the present invention includes a contact portion (1) that contacts the contact surface (H1) of the heat sink (H). Here, as shown in FIG. 4, the contact surface H1 of the heat sink H is on the opposite side of the fixing surface H4 formed by extending from the bent part 3 and fixed by a hook-shaped fixing part curved to one side. means the surface formed. That is, it means a surface facing the opposite direction, not the surface facing the PCB substrate P or the integrated circuit I. In addition, the contact surface H1 typically has a fin type groove-protrusion structure (hereinafter referred to as a concave surface H2 and a protruding surface H3) in order to obtain excellent heat dissipation performance. The contact surface H1 means the concave surface H2 part among these. Of course, in the case of a flat plate type rather than a pin type, the flat surface corresponds to the contact surface H1.

And, the contact part 1 forms one or more contact points H11 that come into contact with the contact surface H1. There are a total of three embodiments of the contact part 1, and specifically, the flat contact part 11 corresponding to the planar type (see FIGS. 4 to 6 and 8) and the one-point type with one contact point (see FIG. 7) There is a corresponding one-point contact portion 12 and a two-point contact portion 13 corresponding to the two-way contact type (see FIG. 9).

First, in the case of the one-point method, it is preferable that the contact point H11 is located at the center of the fixing point H41, and this is to perform fixing more stably by making contact at the center of the fixing point H41. And when compared with this method, as shown in FIG. 9, there is no separate curve line 131 in the center, and thus, by pulling the curved part 3 toward the side of the contact surface H1, the fixing preparation angle is increased. When forming, there is an advantage that the maximum rotation angle at which the fixing part rotates can be made larger. However, the disadvantages are that there are fewer contact points H11 than the two-point method, and since the contact points H11 are located at a greater distance than each fixed point H41, contact stability is relatively low.

Next, in the case of the two-way method, it is preferable that the contact points H11 are formed symmetrically with respect to the center of each fixed point H41. A characteristic feature of this method is that a curve line 131 curved in a direction corresponding to the bent portion 3 may be formed between the contact points H11. Here, the corresponding direction means that the direction in which the convexly protruding part due to the shape of the curved portion 3 or the curve line 131 is directed upward.

Of course, as described above, there is a side surface where the maximum rotation angle of the fixing part is reduced, but once fixed, the inward movement of the inclined part 2 can be restricted by an external force acting inward from the side side. there will be

To explain this in more detail, unlike the flat contact part 11 of the flat type, in the case of the curve line 131, since there is a surface facing the inclined part 2 or the bent part 3, the inclined part 2 Even if a force is received in the inward direction, it is possible to limit the movement displacement due to the external force by a predetermined elastic force or restoring force by the facing surface.

And, as shown in FIG. 8 , the curve line 131 may be configured to be located below the protruding surface H3, which is to obtain upper workability.

And, of course, in the case of adopting the planar contact unit 11, there is an advantage in that it is superior in terms of manufacturability because the curve line 131, which is difficult to process, is not added, and the contact surface H1 is better than the one-point or two-point method. Since it is formed wider and more evenly, there is an aspect that the stability of the contact force can be secured.

Next, the inclined portion 2 is formed on the outer side of the contact portion 1 and includes an inclined portion 21 formed in a direction away from the contact surface H1 toward the outside. Therefore, as shown in FIGS. 4 to 9 , it has an upward slope 21 toward the side of the contact surface H1.

And, as shown in FIG. 8 , the inclined portion 2 may include a bending line 22 in which the inclined portion 21 is bent in an 'S' shape. And this bending line 22 can obtain the same effect as the effect of adopting the curve line 131 described above (an effect in which the movement of the fixing device according to the present invention in the inward direction is restricted by an external force), The negative point corresponds to a configuration that can be added to add an effect according to the adoption of the curve line 131 even when the flat contact unit 11 of the planar type is employed. This is because when the flat contact unit 11 is employed, the curve line 131 cannot be employed due to its structural characteristics.

Next, a curved portion 3 formed by extending from one end of the inclined portion 2 and bent in a direction opposite to the inclined portion 21 is included. As described above, before fixing the fixing part to the fixing surface H4, it is necessary to pull the bent part 3 toward the side of the contact surface H1 to form a fixing preparation angle. At this time, the fixing preparation angle is formed. The step needs to be performed by grounding the bent portion 3 formed outside the side of the contact surface H1.

This is, of course, to easily form a fixed preparation angle, and for this, as shown in FIGS. 5, 6, 8, and 9, the inflection point where the curved portion 3, the inclined portion 2, and the curved portion 3 meet. (31) needs to secure a predetermined separation space (G) from the side of the contact surface (H1). In Figures 4 and 7, the separation space (G) is shown so that there is almost no separation space (G) to indicate that the above-described separation space (G) has a minimum separation space, as described above, exaggerated to maximize side workability This is for illustration only, and it does not mean that the separation space G does not exist at all.

In addition, the height of the inflection point 31 where the inclined portion 2 and the curved portion 3 meet is positioned lower than the protruding surface H3 of the heat sink H to maximize workability on the top. The upper part here is not a term used to limit the direction of the upper part, but means the side where the contact surface H1 of the heat sink H is provided. That is, since the height of the inflection point 31 corresponding to the maximum protrusion point of the heat sink fixing device F according to the present invention is located below the protrusion surface H3 corresponding to the maximum protrusion point of the heat sink H, the upper Since there are no obstructive parts during operation, the workability of the upper part can be maximized. However, due to the nature of the structure, since the above-described separation space (G) is wider than in the M-type embodiment to obtain upper workability, there is a disadvantage that side workability may be reduced.

Conversely, in the case of the M-type embodiment, side workability can be maximized based on the aforementioned minimum separation space. Unlike the Y-type, the height of the inflection point 31 is located above the protruding surface H3. Therefore, there is a disadvantage that the upper workability is lowered.

Next, a hook-shaped fixing portion formed by extending from the bent portion 3 and curved to one side is included, where one side is in an inward direction corresponding to the heat sink H direction (FIG. 4, 5, 7, 8 and 9) or an outward direction corresponding to the opposite direction (see FIG. 6). A characteristic point here is that the fixing point H41 can be formed more inward when it is curved inward, and the fixing point H41 can be formed more outward when it is curved outward.

In other words, if it is formed inward, it is possible to specialize in securing stable holding power by collecting the fixing force inward, whereas if it is formed outward, the part where the fixing force acts is widely distributed in the width direction, thereby increasing the effect of preventing fall-off in the height direction. There is an advantage that it can be taken widely.

Next, a heat sink (H) fixing method of fixing the heat sink (H) on the integrated circuit using the heat sink fixing device (F) will be described below.

First, a heat sink (H) preparation step of preparing the heat sink (H) is included. A characteristic point is that, as described above, in this step, processing for fixing on the heat sink (H) is not separately included.

Next, a fixing preparation angle forming step of forming a fixing preparation angle by pulling the bent part 3 toward the side of the contact surface H1 is included. As described above, the fixing preparation angle forming step is performed by grounding the bent portion 3 formed outside the side of the contact surface H1.

Next, a first fixing step of fixing the first fixing part to the fixing surface H4 is included. As shown in FIGS. 4 to 9 , there are two fixing points H41 formed on one side and the other side of the fixing surface H4, which means a step of fixing them to one fixing point H41.

Next, a contact step of contacting the contact part 1 to the contact surface H1 of the heat sink H is included. In the contact step, the contact point H11 will be formed differently depending on whether the contact part 1 is a flat contact part 11, a one-point contact part 12, or a two-point contact part 13.

Next, a second fixing step of fixing the second fixing part to the fixing surface H4 is included. Here, the second fixing part means a step of fixing to the other fixing point H41.

The present invention described above with reference to the accompanying drawings can be variously modified and changed by those skilled in the art, and these modifications and changes should be construed as being included in the scope of the present invention.

F: Heat sink fixture F1: Metal wire method
F2: leaf spring method
H: heat sink H1: contact surface
H2: concave surface H3: protruding surface
H4: fixed face
I: integrated circuit P: PCB board
G: separation space
1: contact part 11: flat contact part
12: one-point contact portion 13: two-point contact portion
2: slope 21: slope
22: bending line
3: bend 31: inflection point
4: fixed part

Claims (10)

In the heat sink fixing device for fixing the heat sink on the integrated circuit,
a contact portion contacting the contact surface of the heat sink;
an inclination portion formed outside the contact portion and including an inclination portion formed in a direction away from the contact surface in an outward direction;
a bent portion extending from one end of the inclined portion and curved in a direction opposite to the inclined portion; and
A hook-shaped fixing portion formed extending from the bent portion and curved to one side;
including,
The height of the inflection point where the inclined portion and the curved portion meet is located below the protruding surface of the heat sink,
The contact part forms one or more contact points that come into contact with the contact surface,
In the case of two or more contact points
A curve line curved in a direction corresponding to the bent portion is formed between the contact points,
The curve line is located below the protruding surface,
The heat sink fixing device, characterized in that the fixing portion has a hook shape curved outward from the bent portion

delete The method of claim 1,
Heat sink fixing device, characterized in that the inflection point where the inclined portion and the curved portion meet is positioned so that the side portion of the contact surface and the curved portion have a minimum separation space.
delete delete delete delete The method of claim 1,
The heat sink fixing device, characterized in that the inclined portion comprises a bending line in which the inclined portion is bent in an 'S' shape.
In the heat sink fixing method of fixing the heat sink on an integrated circuit using the heat sink fixing device according to claim 1,
a fixing preparation angle forming step of forming a fixing preparation angle by pulling the curved part toward the side of the contact surface;
A first fixing step of fixing the first fixing part to the fixing surface;
a contact step of contacting the contact part to the contact surface of the heat sink; and
A second fixing step of fixing the second fixing part to the fixing surface;
including,
The height of the inflection point where the inclined portion and the curved portion meet is located below the protruding surface of the heat sink,
The contact part forms one or more contact points that come into contact with the contact surface,
In the case of two or more contact points
A curve line curved in a direction corresponding to the bent portion is formed between the contact points,
The curve line is located below the protruding surface,
The heat sink fixing method, characterized in that the fixing portion has a hook shape curved outward from the bent portion.
delete

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