KR102463839B1 - Shocking absorber for packing having low dust and static electricity - Google Patents

Abstract

The present invention discloses a packaging cushioning material capable of minimizing dust generation with an antistatic effect by including an antistatic agent throughout the inside and surface of a pulp mold.

Description

Shocking absorber for packing having low dust and static electricity}

The present invention relates to a cushioning material for packaging a low dust and low static generation pulp mold.

Pulp mold (Pulp mold) is a pulp slurry in which water and waste paper or pure pulp are decomposed into various types of molds. Depending on the shape of the mold, various shapes of three-dimensional molding are possible, and a buffer rib is formed to have excellent buffering power and load capacity.

In the case of electronic parts or semiconductor parts in the past, static electricity and dust generation was small and plastic material buffers capable of forming a fine structure were used, but the use of plastic material buffers is prohibited due to recent regulations due to environmental issues.

Accordingly, there has recently been an attempt to prevent product damage by using a pulp mold for packaging electronic components or semiconductor components. However, since these electronic parts or semiconductor parts contain highly integrated circuits, there is a problem that product damage occurs due to static electricity generated in a pulp mold, and thus it is necessary to solve this problem.

In order to reduce the generation of static electricity, it must be stored in a humid environment, but even in this case, damage to the product occurs.

Accordingly, a technique of spraying an antistatic agent on the surface of a pulp mold has been proposed.

KR 10-2010-0122771A discloses that generation of static electricity from a pulp mold can be reduced by adding and diluting an antistatic agent to pregelatinized starch and then spraying it on the surface of the pulp mold. At this time, the antistatic agent refers to the use of an anionic surfactant, a cationic surfactant, or a nonionic surfactant.

For the antistatic effect, the use of a large amount of antistatic agent is required, and in this case, as the antistatic agent remains on the surface of the pulp mold, it contaminates the surface of the electronic component or semiconductor component in contact therewith.

In addition to these types of surfactants, known antistatic agents include alkali metal salts such as lithium compounds, sodium aluminate and sodium chloride, anionic polymers, cationic polymers, conductive polymers, and conductive fillers. Although these materials have excellent functions as antistatic agents, they also contaminate the surface of electronic parts or semiconductor parts because they remain on the mold surface or bleed due to low miscibility with other additives when molding in a pulp mold.

On the other hand, the pulp material used for the pulp mold inherently causes a large amount of dust. Even if an excessive amount of substances such as fixatives are added thereto, these problems still remain.

The dust of the pulp mold contaminates the surface of electronic parts or semiconductor parts and causes product damage. In addition, it remains on the mold surface during the molding process of the pulp mold, reducing the quality of the pulp mold of the mold, increasing the defect rate, shortening the cleaning cycle of the mold, and causing damage or failure of the mold device. It also adversely affects the working environment.

In particular, the dust of the pulp mold is related to static electricity, and the generation amount tends to increase as the static electricity increases. Therefore, no special treatment process has been proposed for the dust suppression technology of the pulp mold yet.

KR 10-2010-0122771A (2010.11.23. Publication)

In the present invention, research has been conducted to minimize static electricity and dust generation even when using a pulp mold to replace a cushioning material for plastic packaging, and to minimize static electricity and dust generation through a specific combination of various additives used in the pulp mold. discovered that it could be done. In addition, it was found that a cushioning material for packaging made of a pulp mold can be manufactured through a dissociation step and a stationary process of the antistatic agent.

Accordingly, an object of the present invention is to provide a cushioning material for packaging an eco-friendly pulp mold that minimizes static electricity and dust generation and can be used for packaging electronic components and semiconductor components, and a method for manufacturing the same.

In order to achieve the above object, the present invention provides a packaging cushioning material made of a pulp mold that can safely accommodate products and has a surface resistance of 10 ¹⁰ Ω/sq or less under 23° C. and 50% RH conditions.

The pulp mold contains pulp, an antistatic agent, a fixative, a water repellent, a strength enhancer and a degassing agent.

Preferably, the antistatic agent is a quaternary ammonium salt, the fixative is a polyamine-polyamide-based resin, the water repellent is an alkyl ketene dimer, the strength enhancer is a polyacrylamide-based resin, and the degassing agent is an alcohol-based degassing agent. .

In addition, the present invention

(a) dissolving the pulp in an aqueous solution comprising an antistatic agent, a fixative agent, a water repellent agent, a strength enhancer and a degassing agent;

(b) adding an antistatic liquid to the pulp slurry obtained after dissociation and then allowing it to stand; and

(c) molding the pulp by introducing the pulp slurry into a mold; cast

Including, it provides a method for manufacturing a cushioning material for packaging.

The cushioning material for packaging according to the present invention includes an antistatic agent throughout the inside and surface of the pulp mold to minimize dust generation with an antistatic effect.

As a result, product damage and surface contamination caused by static electricity and dust are minimized during packaging of electronic and semiconductor components, and static electricity and dust generated during handling are minimized to improve work environment. In addition, contamination of the mold is minimized with a low dust generation rate, so that the mold cleaning cycle can be extended and the defective rate of the resulting pulp mold can be reduced.

In addition, there is an advantage of being environmentally friendly while being able to reduce costs by using waste pulp as a raw material.

Disclosed is a cushioning material for packaging that is suitable for packaging electronic components or semiconductor components due to its antistatic effect and can minimize the generation of scattering dust and a manufacturing method thereof.

The cushioning material for packaging according to the present invention may be manufactured with a pulp mold for packaging electronic components or semiconductor components. At this time, the pulp mold may have a plurality of irregularities for stable packaging of the part.

At this time, the pulp mold has a surface resistance of 10 ¹⁰ Ω/sq or less under conditions of 23° C. and 50% RH.

Surface resistance means the resistance at the surface of the pulp mold.

The pulp mold has a surface resistance of 10 ¹⁰ Ω/sq or less. The surface resistance of the pulp mold can be achieved by spraying an antistatic agent on the surface, but as the antistatic agent is excessively present on the surface of the pulp mold, contamination of the surface of the electronic component or semiconductor component cannot be avoided.

In the present invention, the antistatic agent is uniformly distributed not only on the surface of the pulp mold but also on the entire inside of the pulp mold to secure an antistatic effect and minimize the generation of dust due to the static electricity.

Specifically, the surface resistance is measured under conditions of 23 ° C and 50% RH, at which time the surface resistance is 10 ¹⁰ Ω / sq or less, preferably 10 ⁸ to 10 ¹⁰ Ω / sq, more preferably 10 ⁸ to 10 ⁹ Ω It has a range of /sq. If the resistance value within the above range is exceeded, there is a high probability that static electricity will be generated. In particular, static electricity may be generated in low humidity such as in winter or dry weather.

By having the surface resistance of the above value, it is possible to minimize dust due to static electricity generation, thereby solving various problems caused by the generation of dust.

Dust generation can be known through cleanliness measurement.

The measurement of the cleanliness of the pulp mold was designed and performed in the present invention.

Five specimens of 10 cm * 0.5 cm * 5 cm were prepared in a pulp mold, mounted on a vibrator, and then vibrated 500 times per second to measure the number of particles of 0.3 μm or more generated when the specimens collided with each other. The measurement was performed with a defect detector that detects fine defects and stains on the surface of a stationary or high-speed flowing product using a charge coupled device (CCD) image sensor. Since particles generated during vibration cannot be completely prevented, it is necessary to minimize the number of particles, and it is preferable that the degree of cleanliness is 10 particles/m 2 or less.

It can be seen that the pulp mold used as the material of the packaging cushioning material according to the present invention has a cleanness of 10 pieces/m2 or less, and the amount of dust generation is very small.

The surface resistance and cleanliness as described above limit the composition of the chemicals used in the manufacture of the pulp mold, including the antistatic agent, and the antistatic agent is added during the dissociation of the pulp in the manufacturing process, and then the resulting pulp slurry is added with an antistatic liquid It can be achieved by performing the step of settling after doing.

Specifically, the pulp mold used for the packaging cushioning material according to the present invention uses waste pulp as a main raw material, and uses a fixative, a water repellent, a strength enhancer, and a degassing agent as chemicals together with an antistatic agent. Each composition is described in detail below.

First, the pulp mold according to the present invention uses waste pulp as a main raw material.

The waste pulp may be obtained from waste paper. At this time, the paper may include newspaper, writing paper and printing paper, such as uncoated mechanical, total coated paper, coated free sheet, coated mechanical, uncoated free sheet, and the like; industrial paper; tissue paper such as sanitary tissue, household tissue, industrial tissue, facial tissue, cosmetic tissue, soft tissue, absorbent tissue, medicinal tissue, toilet tissue, paper towel, paper napkin, paper cloth, and paper linen; cardboard such as semi-chemical cardboard, liner base paper, container board, corrugated medium, folding box board, and cartonboard; Cardboard, packaging paper such as unbleached kraft paper, bleached kraft paper, or wrapping paper, paper adhesive tape, paper bag, paper cloth, towel, wallpaper, carpet backing, paper filter, paper mat, pattern paper, disposable including linens and clothing; As waste pulp is used as a raw material, it is possible to solve issues such as the conventional waste pulp disposal problem and the resulting cost and environmental problems.

If necessary, it is possible to mix and use known virgin pulp in waste pulp.

The virgin pulp is a cellulosic fibrous material obtained by mechanically or chemically treating wood or other plants. For example, classification by manufacturing method includes ground pulp, refiner ground pulp, thermo mechanical pulp, chemical ground pulp, cold soda pulp, and neutral sulfite half. There are Neutral Sulfite Semi-chemical Pulp, High Yield Sulfite Pulp, Kraft Pulp, Sulfite Pulp, Soda Pulp, Bleached Pulp, etc. Classification includes softwood pulp (Nodelholz Pulp), hardwood pulp (Laubholz Pulp), softwood hardwood mixed pulp (Nodelholz Laubholz Pulp), and straw pulp (Straw Pulp). Other pulps include non-wood pulp such as bast fiber, leaf fiber, and seed fiber, as well as ink-removed pulp and synthetic pulp made from waste paper.

For the above-mentioned surface resistance and cleanliness, the antistatic agent of the present invention uses a quaternary ammonium salt.

Known antistatic agents include alkali metal salts such as lithium compounds, sodium aluminate and sodium chloride, anionic polymers, cationic polymers, conductive polymers, and conductive fillers. These materials have excellent functions as antistatic agents, but have a problem of remaining on the mold surface or bleeding due to low miscibility with other additives when molding in a pulp mold, contaminating the surface of electronic or semiconductor parts.

Therefore, in the present invention, a quaternary ammonium salt is used as an antistatic agent to solve the above problems. The quaternary ammonium salt can be applied in a completely dissolved state in a solution, so that it can be stably maintained while being uniformly dispersed in the pulp mold. In addition, since there is no problem of being separated from the surface, there is no problem of surface contamination of electronic or semiconductor parts.

As the quaternary ammonium salt, ammonium hydrochloride, ammonium sulfate, ammonium nitrate, and ammonium phosphate containing higher fatty acids may be used, and methyl bis(2-hydroxyethyl) cocoalkyl quaternary ammonium nitrate is preferably used.

The antistatic agent of the present invention is added during the pulp dissociation process in the pulp mold manufacturing process of the packaging buffer material, and is added through a two-step process in which the antistatic liquid is added to the pulp slurry and then allowed to stand. Due to this, unlike the conventional method of applying the antistatic agent only on the surface, excellent antistatic effect can be secured by the presence of the antistatic agent throughout the inside and surface of the pulp mold.

Such an antistatic agent is used in the range of 3 to 15 parts by weight based on 100 parts by weight of raw pulp. If the content is less than the above range, proper antistatic effect cannot be secured, and if it exceeds the above range, there is a risk of contamination of electronic components and semiconductor components by the antistatic agent, and a cost increase problem occurs.

The cushioning material for packaging includes additives such as fixatives, water repellents, strength enhancers and degassing agents. In the present invention, a combination of a specific composition was developed along with the pulp and an antistatic agent of a quaternary ammonium salt in order to have appropriate physical properties as a packaging material, uniformly mix each composition, and ensure ease of molding.

The fixative serves as a binder, and in the present invention, a polyamine-polyamide-based resin, preferably a non-formalin-based epoxy, which is a wet strength resin to further improve the wet strength and paper strength of the pulp mold A polyamine-polyamide-based resin, more preferably a polyamine-polyamide-epichlorohydrin resin is used. These polyamine-polyamide-based resins are more suitable as binders compared to other anionic resins, cationic resins, or melamine-formaldehyde resins, and can improve strength as a packaging buffer material.

The water repellent exhibits hydrophobicity and is used to control the moisture of the pulp mold and impart water resistance. Among usable water repellents, an alkyl ketene dimer represented by Chemical Formula 1 is used in the present invention.

[Formula 1]

(Wherein, R1 and R2 are independently C12-22 alkyl groups)

Preferably, R1 and R2 may be a C12-17 alkyl group, preferably a stearyl group (C16) or a palmitic group, more preferably a stearyl group.

The above-described alkyl ketene dimer has a superior water repellent effect compared to paraffin wax or PE wax, which are conventional wax-based water repellents for pulp molds, or rosin or ASA (alkyl succinic anhydride) known as a sizing agent. Can further improve the water resistance of pulp molds have.

The strength improver is used to improve the dry strength and temporary wet strength of the pulp mold, and a cationic polyacrylamide-based resin is preferably used. The cationic polyacrylamide-based resin is acrylamide or another primary amine-containing monomer such as methacrylamide, ethylacrylamide, N-ethyl methacrylamide, N-butyl methacrylamide or N-ethylmethacrylamide Or it has a structure in which a cationic monomer is bonded to a combination thereof. The cationic monomer is diallyl dimethyl ammonium chloride (DADMAC).

The degassing agent not only defoaps the fine bubbles (colloidal air) in the pulp slurry, but also includes the meaning of foam suppression, and shows an effect of inhibiting the generation of bubbles. Specifically, fine air bubbles adhering to the surface of the pulp fibers are removed from the fibers, and the fine air bubbles are combined and converted into large air bubbles to destroy the air bubbles floating on the surface.

In the present invention, a higher alcohol-based degassing agent is used as the degassing agent, and more specifically, a mixture of octadecanol, hexadecanol, ecosanol, and stearic acid at a ratio of 2:2:1:1 is used. This higher alcohol-based degassing agent has an effect of improving dehydration rate, suppressing pinhole generation, and improving strength compared to silicone oil, mineral oil, or surfactant.

By adjusting the content of the above-mentioned fixer, water repellent, strength enhancer and degassing agent together with the selection, the physical properties of the pavement cushioning material can be improved.

The content of the fixative is used in the range of 1 to 10 parts by weight based on 100 parts by weight of the raw pulp. If the content is less than the above range, proper strength cannot be secured, and if it exceeds the above range, the strength of the pulp mold may be too strong and the buffering property may be lowered, so it is appropriately used within the above range.

The content of the water repellent agent is used in the range of 1 to 10 parts by weight based on 100 parts by weight of the raw pulp. If the content is less than the above range, the water resistance of the pulp mold is insufficient, so that an effective antistatic effect cannot be expected. It is appropriately used within the above range.

The content of the strength enhancer is used in the range of 4 to 15 parts by weight based on 100 parts by weight of the raw material pulp. If the content is less than the above range, it is not possible to secure the desired level of strength, and if it exceeds the above range, the strength of the pulp mold may be too strong and the buffering property may be lowered, so it is appropriately used within the above range.

The amount of the deaerator is used in the range of 1 to 10 parts by weight based on 100 parts by weight of the raw material pulp. If the content is less than the above range, there is a risk of generating voids in the pulp mold due to insufficient bubble removal, and conversely, even if the content exceeds the above range, there is no significant increase in effect, so it is uneconomical, so it is appropriately used within the above range. .

Additionally, dyes such as artificial or natural pigments may be used in the present invention to impart color to the pulp mold. At this time, a cationic dye may be further included in order to improve the dyeing efficiency of the dye.

A method for manufacturing a cushioning material for packaging according to the present invention using the composition described above will be described.

Specifically, the packaging cushioning material of the present invention

(a) dissolving the pulp in an aqueous solution comprising an antistatic agent, a fixative agent, a water repellent agent, a strength enhancer and a degassing agent;

(b) adding an antistatic solution to the pulp slurry obtained after dissociation and then allowing it to stand; and

(c) molding the pulp by introducing the pulp slurry into a mold; includes

Each step is described below.

First, in step (a), an antistatic agent, a fixative, a water repellent, a strength enhancer and a degassing agent are added to the pulp to obtain a pulp slurry.

The pulp may be waste pulp, and the waste pulp is used after washing and cutting.

In the dissociation step, 50 to 1000 parts by weight of water is added to 100 parts by weight of pulp, and the mixture is stirred at a high speed for 15 minutes to 1 hour at a temperature of 10° C. to 60° C. Thereafter, an additional composition is added, followed by high-speed stirring at the same temperature for 5 to 30 minutes to obtain a pulp slurry.

At this time, an antistatic agent, a fixing agent, a water repellent, a strength enhancer, and a degassing agent are added in the above-described composition. If necessary, each composition can be diluted in water and used. For example, an antistatic agent is diluted in water and injected at a concentration of 20% aqueous solution.

Next, in step (b), the pulp slurry obtained after dissociation is allowed to stand after adding an antistatic solution.

An antistatic agent, specifically an antistatic liquid, is added to the pulp slurry obtained in step (a) and allowed to stand (or is left) for a certain period of time to maintain an even distribution of the antistatic agent throughout the inside and outside of the pulp mold.

Stationary is carried out at a temperature of 10 ° C to 60 ° C for 15 minutes or more, preferably 15 minutes to 30 minutes. Stationary means to stand without performing a separate stirring process.

The antistatic agent is diluted in water for uniform mixing, and is added after being diluted at a concentration of 10 to 30% by weight, preferably 15 to 25% by weight.

The total amount of the antistatic agent in step (a) and step (b) is appropriately used within the range of 3 to 15 parts by weight based on 100 parts by weight of pulp, and used in the range of 1:1 in each step or 3:1 to 1 It is added in a weight ratio of 3.

Conventionally, for the antistatic effect, a process of spraying an antistatic liquid on the pulp mold has been performed, but in the present invention, the antistatic agent is sufficiently present on the surface and inside of the pulp mold through the process of adding the antistatic liquid and leaving it still .

Since the spraying causes distortion or strength reduction of the pulp mold, in the present invention, the tensile strength or torsional strength of the pulp mold is excellent because it is performed before the pulp mold manufacturing process, so that the above problem occurs even if an antistatic agent is added. I never do that.

Next, in step (c), the pulp slurry left in the antistatic liquid is put into a mold forming machine and molded to produce a pulp mold.

The mold forming machine may use a mold capable of producing a product having a plurality of irregularities, and the shape is not particularly limited in the present invention.

After the pulp slurry is supplied to the mold, water is discharged by vacuum adsorption, and molding is performed while the pulp is stuck in the mold. The mold molding may be thermoforming performed at a temperature of 150 ° C or more, preferably 200 to 300 ° C, and, if necessary, thermoforming in a hot press. The mold forming may be performed in one-step or through a three-step process including a first pressing step, a second pressing step, and a third pressing step.

Additionally, the pulp mold obtained through mold molding in step (c) is subjected to a drying process. This drying process is not essential and can be omitted depending on the process.

For drying, known methods such as a hot air drying method in which several hot air fans are installed and dried, a method of drying with hot air using an electric heater or a combustion type heater, a dielectric heating method, or a microwave heating method may be used. The drying process may be performed one or more times, and a combination of the above methods may be used.

The thickness of the packaging cushioning material prepared through the above steps is not particularly limited, but is preferably 0.1 mm to 0.7 mm, and more preferably 0.2 mm to 0.5 mm. If it is less than the above range, sufficient strength may not be expressed. On the other hand, conversely, when the above range is exceeded, the dehydration and drying efficiency is greatly reduced, making it difficult to manufacture pulp molds.

As described above, the cushioning material for packaging according to the present invention has an effect of reducing scattering dust with an excellent antistatic effect as the antistatic agent is present throughout the inside and outside of the pulp mold. As a result, there is no generation of static electricity even when in contact with electronic or semiconductor components during packaging, and no surface contamination of the electronic or semiconductor components occurs due to no scattering dust in the handling process.

In particular, by limiting the content of each composition, the physical property test as a packaging buffer material, that is, 10 ℃ × 10% Rh × 24HRs + low-humidity transport test of vibration, 60 ℃ × 80% Rh × 24HRs + high-temperature and high-humidity transport test of vibration, 40 ℃ × 10% Rhs × 24HRs + vibration + drop low-temperature transportation test, 60 ℃ × 80% Rh × 100HRs high temperature and high humidity test, it can be seen that it can be properly used for packaging of products with good results.

Through this, when used as a shock absorber for packaging, it is possible to reliably protect electronic components or semiconductor components even when an external force such as vibration or shock due to contact is input.

[Example]

Hereinafter, the present invention will be described in more detail through examples. These examples are only for explaining the present invention in more detail, and it will be apparent to those skilled in the art that the scope of the present invention is not limited by these examples.

Example 1

As the pulp, 100% Korean Old Newspaper (KONP) pulp was used. 100 parts by weight of KONP and an antistatic solution (methyl bis (2-hydroxyethyl) cocoalkyl quaternary ammonium nitrate, 20% aqueous solution, 3 parts by weight of solid content) in 500 parts by weight of water at room temperature, fixative (polyamine-poly Amide-epichlorohydrin resin, 3 parts by weight), water repellent (alkyl ketene dimer (C16), 3 parts by weight), strength improver (cationic (DADMAC) polyacrylamide resin, 5 parts by weight) and higher alcohol-based degassing Each (3 parts by weight) was added and completely dissociated at 7,200 rpm using a valley beater, which is a standard laboratory disintegrator.

An antistatic solution (solid content: 3 parts by weight), which is a 20% aqueous solution, was added to the resulting pulp slurry, and allowed to stand at room temperature for 15 minutes.

After putting the obtained pulp slurry into a mold, it was pressed three times at a pressure of 3.5 kgf/cm ² and a temperature of 260° C. to form a pulp mold to prepare a flat plate-shaped cushioning material for packaging.

Example 2

In the same manner as in Example 1, a packaging cushioning material was prepared by using 0.5 parts by weight of an antistatic agent in dissociation and stationary processes, respectively.

Example 3

In the same manner as in Example 1, a packaging cushioning material was prepared by using 10 parts by weight of an antistatic agent in the dissociation and stationary processes, respectively.

Comparative Example 1

It was carried out in the same manner as in Example 1, but without adding an antistatic agent (6 parts by weight) in the dissociation and stationary process, and after making the pulp mold, it was sprayed on the surface of the pulp mold to prepare a cushioning material for packaging.

Comparative Example 2

In the same manner as in Comparative Example 1, a packaging buffer was prepared using Uniplus A-500 (SY Chem), a surfactant, as an antistatic agent.

Comparative Example 3

A buffer material for packaging was prepared in the same manner as in Example 1, except that melamine-formaldehyde resin was used as a fixative.

Comparative Example 4

A packaging buffer was prepared in the same manner as in Example 1, except that alkyl succinic anhydride (ASA) was used as a water repellent.

Comparative Example 5

A packaging cushioning material was prepared in the same manner as in Example 1, except that an anionic polyacrylamide-based resin was used as the strength enhancer.

Comparative Example 6

A cushioning material for packaging was prepared in the same manner as in Example 1, except that a silicon-based degassing agent was used as the degassing agent.

Test Example 1

The physical properties of the packaging cushioning materials obtained in the above Examples and Comparative Examples were measured as follows.

(Surface resistance) The surface resistance was measured at 23°C and 50% RH using a high resistance meter manufactured by Mitsubishi Chemical Corporation: trade name "Hi Raster UP MCP-JB03". In addition, as for the conditions of the measuring device, the surface electrical resistance value (Ω/sq) was measured after 30 seconds at an applied voltage of 100 V.

(clean degree)

Five specimens of 10 cm * 0.5 cm * 5 cm were prepared, mounted on the vibrator, and vibrated 500 times per second to measure the number of particles of 0.3 μm or more generated when the specimens collided with each other. At this time, it is preferable that the degree of cleanliness is 10 pieces/m 2 or less.

(Evaluation of contamination on product surface)

After placing the semiconductor PCB board between a pair of packaging buffer materials, use a pressurization jig to apply a load of 5 kg/cm ₂ from above, and leave it for 5 days in an environment with a temperature of 80 ° C and a humidity of 90%. An accelerated test was performed. Thereafter, the degree of contamination remaining on the surface of the PCB substrate was visually evaluated according to the following criteria.

○: It is a level that is not contaminated at all.

Δ: This is a level partially contaminated.

x: This is a level at which the entire surface is contaminated.

Surface resistance (Ω/sq) Clean degree (pcs) Pollution degree Example 1 7x10 ⁸ 3 ○ Example 2 9 x 10 ⁹ 8 ○ Example 3 6 x 10 ⁹ 5 △ Comparative Example 1 9 x 10 ¹¹ 18 × Comparative Example 2 8 x 10 ¹¹ 15 × Comparative Example 3 6 x 10 ¹⁰ 7 ○ Comparative Example 4 4 x 10 ¹⁰ 6 △ Comparative Example 5 7 x 10 ¹⁰ 7 ○ Comparative Example 6 9 x 10 ¹¹ 8 ○

Referring to Table 1, it can be seen that the packaging cushioning material of Example 1 has a surface resistance of 10 ¹⁰ Ω/sq or less to have an antistatic effect, and the results of cleanliness and contamination were also excellent.

As in Comparative Examples 1 and 2, it can be seen that when the antistatic agent was used in the spraying method, the surface resistance was low, but a lot of dust was generated, and the PCB substrate was also contaminated.

The packaging cushioning materials of Comparative Examples 3 to 6 were excellent in terms of cleanliness and contamination, but showed low surface resistance.

Test Example 2

The physical properties of the packaging cushioning material prepared in the above Examples and Comparative Examples were measured.

(Low humidity transport test) 10℃ × 10% Rh × 24HRs + Vibration: In the dry state of winter, external factors such as vibration peel off the fibers of the Fine Pulp Mold to check if fluff is generated.

(High-temperature, high-humidity transport test) 60℃ × 80% Rh × 24HRs + Vibration: Check for maladaptive properties such as deformation due to external factors such as vibration and shock in high-temperature, high-humidity conditions in summer

(Low temperature transport test) 40℃ × 10% Rhs × 24HRs + Vibration + Drop: Check whether maladaptive properties such as deformation appear due to external factors such as vibration and shock in low humidity conditions in winter

(High-temperature and high-humidity test) 60℃ × 80% Rh × 100HRs: Check for maladaptive properties such as deformation during storage

At this time, if peeling, deformation or discoloration of the packaging buffer did not occur, it was marked as 'good', and if any of these occurred, it was marked as 'defective'.

low humidity transport test High temperature and high humidity transport test cold transport test high temperature and humidity test Example 1 Good Good Good Good Example 2 bad (lint) Good Good Good Example 3 Good Bad (discolored) Good Bad (discolored) Comparative Example 1 Good Bad (discolored) bad (deformed) Bad (discolored) Comparative Example 2 Bad (discolored) Bad (discolored) bad (deformed) Bad (discolored) Comparative Example 3 Good Good bad (deformed) Bad (discolored) Comparative Example 4 Good Bad (peeling) bad (deformed) Bad (peeling) Comparative Example 5 bad (lint) Good Bad (discolored) Bad (discolored) Comparative Example 6 bad (lint) Bad (peeling) Bad (peeling) bad (deformed)

Referring to Table 2, in the case of the packaging cushioning material of Example 1, good results were shown in all tests.

However, it can be seen that the packaging buffer materials of Examples 2 and 3 and Comparative Examples 3 to 6 have different contents of antistatic agents or product defects occur when different compositions are used as chemical compositions.

In addition, the packaging cushioning materials of Comparative Examples 1 and 2 prepared by the spraying process showed severe discoloration due to the high content of the antistatic agent on the surface.

Through these results, it can be seen that the selection of the composition and the content should also be controlled in the process of manufacturing the cushioning material for packaging.

Claims (5)

For 100 parts by weight of pulp,
3 to 15 parts by weight of methyl bis(2-hydroxyethyl)cocoalkyl quaternary ammonium nitrate as an antistatic agent;
1 to 10 parts by weight of a polyamine-polyamide-epichlorohydrin resin as a fixative;
1 to 10 parts by weight of an alkyl ketene dimer of Formula 1 as a water repellent;
4 to 15 parts by weight of a cationic polyacrylamide-based resin as a strength enhancer, and
Contains 1 to 10 parts by weight of an alcohol-based degassing agent as a degassing agent,
23 ° C., surface resistance under 50% RH conditions of 10 ¹⁰ Ω / sq or less, a cushioning material for packaging pulp mold for electronic parts or semiconductor parts.
[Formula 1]

(Wherein, R1 and R2 are independently C12-22 alkyl groups)
delete delete delete For 100 parts by weight of pulp,
3 to 15 parts by weight of methyl bis(2-hydroxyethyl)cocoalkyl quaternary ammonium nitrate as an antistatic agent;
1 to 10 parts by weight of a polyamine-polyamide-epichlorohydrin resin as a fixative;
1 to 10 parts by weight of an alkyl ketene dimer of Formula 1 as a water repellent;
4 to 15 parts by weight of a cationic polyacrylamide-based resin as a strength enhancer, and
Contains 1 to 10 parts by weight of an alcohol-based degassing agent as a degassing agent,
(a) dissolving the pulp in an aqueous solution comprising an antistatic agent, a fixative agent, a water repellent agent, a strength enhancer and a degassing agent;
(b) adding an antistatic solution to the pulp slurry obtained after dissociation and then allowing it to stand; and
(c) mold molding by introducing the pulp slurry into a mold; including,
Method for producing a cushioning material for packaging pulp molds for electronic parts or semiconductor parts having a surface resistance of 10 ¹⁰ Ω/sq or less under conditions of 23° C. and 50% RH:
[Formula 1]

(Wherein, R1 and R2 are independently C12-22 alkyl groups)