KR102457246B1 - Display device and method of manufacturing the same - Google Patents

Abstract

The display device includes a display area on which an image is displayed and a non-display area provided around the display area. The display device includes a first substrate including a touch sensor provided in the display area and a touch sensor pad provided on the non-display area, the first substrate facing the first substrate, and on the non-display area and a pixel provided in the display area. a second substrate including a connection pad portion provided, an intermediate layer provided in the display area between the first substrate and the second substrate, conductive balls connecting the touch sensor pad portion and the connection pad portion, and the first substrate; and an interlayer bar provided in the non-display area between the second substrates and adjacent to the connection pad part. The average diameter of the conductive balls is greater than the height of the interlayer bar.

Description

Display device and manufacturing method thereof

The present invention relates to a display device and a manufacturing method thereof, and more particularly, to a display device including a touch sensor and a manufacturing method thereof.

Recent display devices have a touch recognition function for receiving a user's touch as well as an image display function.

Since such a display device does not require a separate input device such as a keyboard or a mouse, the range of its use is gradually expanding.

Conventionally, a display device is manufactured by separately manufacturing a display panel and a touch panel, and then attaching the touch panel to the display panel.

However, since the above method requires a manufacturing process of the touch panel separately from the display panel, there is a problem in that it is inefficient in terms of process time and process cost. Accordingly, integration of the touch panel and the display panel is required.

An object of the present invention is to provide a display device including a touch sensor having reduced defects.

An object of the present invention is to provide a method for manufacturing a display device including a touch sensor, in which defects are reduced.

A display device according to an exemplary embodiment includes a display area on which an image is displayed and a non-display area provided around the display area. The display device includes a first substrate including a touch sensor provided in the display area and a touch sensor pad provided on the non-display area, the first substrate facing the first substrate, and on the non-display area and a pixel provided in the display area. a second substrate including a connection pad portion provided, an intermediate layer provided in the display area between the first substrate and the second substrate, conductive balls connecting the touch sensor pad portion and the connection pad portion, and the first substrate; and an interlayer bar provided in the non-display area between the second substrates and adjacent to the connection pad part. The average diameter of the conductive balls is greater than the height of the interlayer bar.

In one embodiment of the present invention, the conductive balls are provided in a spherical or oval shape, and the height of the interlayer bar may be 50% to 65% of an average diameter of the conductive balls.

In an embodiment of the present invention, the average diameter of the conductive balls may be 16 micrometers to 24 micrometers, and the height of the interlayer bar may be 10 micrometers to 13 micrometers. Here, the difference between the average diameter of the conductive balls and the height of the interlayer bar may be 3 micrometers or more.

In an embodiment of the present invention, the interlayer bar may include spacers and a binder including the spacers therein.

The spacer controls the height and width of the interlayer bar ITB. The spacers may be spherical, and the spacers may have a diameter less than or equal to the height of the interlayer bar. A ratio of the average diameter of the conductive balls to the diameter of the spacers may be 10:2 to 10:3.

In one embodiment of the present invention, the first substrate may have a rectangular shape having first to fourth sides sequentially connected, and the touch sensor pad unit may be provided to correspond to the first side. In the present embodiment, a side surface of the intermediate layer may be exposed to the outside at at least one of the second to fourth sides. For example, the side of the intermediate layer may be exposed to the outside at the second to fourth sides.

In an embodiment of the present invention, at least a portion of the interlayer bar may extend along an extension direction of the first side. The interlayer bar may extend from the fourth side to the second side along the first side. The interlayer bar may be provided between the display area and the connection pad part when viewed in a plan view.

In an embodiment of the present invention, the connection pad part includes a first connection pad part and a second connection pad part spaced apart from each other, and the interlayer bar includes a plurality of spaced apart from each other corresponding to the first connection pad part and the second connection pad part. Can be provided for dogs.

In an embodiment of the present invention, the second substrate may further include a driving pad unit that transmits an image signal to the display area. In the present embodiment, the interlayer bar may be provided between the display area and the driving pad part. In this case, the interlayer bar is spaced apart from the display area with the connection pad part interposed therebetween.

In an embodiment of the present invention, the interlayer bar includes a first interlayer bar provided between the display area and the connection pad part when viewed in a plan view, and a second interlayer bar spaced apart from the display area with the connection pad part therebetween. It may include a bar. The connection pad part may include a first connection pad part and a second connection pad part spaced apart from each other, and a plurality of first interlayer bars may be provided to correspond to the first and second connection pad parts and spaced apart from each other.

In an embodiment of the present invention, the first substrate may further include a driving pad unit that transmits an image signal to the display area, and in this case, the second interlayer bar is disposed between the display area and the driving pad unit. can be provided on

In an embodiment of the present invention, connection lines connecting the touch sensor and the touch sensor pad unit may be further included. The touch sensor includes a first sensing unit and a second sensing unit that cross each other, and the touch sensor pad unit includes a first touch sensor pad connected to the first sensing unit and a second touch sensor pad connected to the second sensing unit. may include wealth. The connection pad unit may include a first connection pad unit corresponding to the first touch sensor pads and a second connection pad unit corresponding to the second touch sensor pads.

In one embodiment of the present invention, it may further include an insulator surrounding the conductive ball.

In an embodiment of the present invention, in the display device, a first substrate including a touch sensor on the display area and a touch sensor pad on the non-display area is manufactured, and a pixel on the display area is connected to the non-display area A second substrate including a pad part is manufactured, an intermediate layer is formed in a display area of one of the first substrate or the second substrate, and an interlayer bar is formed in a non-display area of one of the first substrate or the second substrate and forming conductive balls on the connection pad part or the touch sensor pad part, and bonding the first substrate to the second substrate. In this case, the diameter of the conductive balls is greater than the height of the interlayer bar.

In an embodiment of the present invention, the manufacturing of the first substrate includes providing a first carrier substrate on a rear surface of the first base substrate, and the touch sensor and the touch sensor on an upper surface of the first base substrate. It may include forming a pad part. In addition, the manufacturing of the second substrate may include providing a second carrier substrate on a rear surface of the second base substrate, and forming the pixel and the connection pad unit on an upper surface of the second base substrate. can In this case, the method further includes the step of removing the first carrier substrate and the second carrier substrate after bonding the first substrate and the second substrate.

The present invention prevents contamination of the pad part (the touch sensor pad part, the connection pad part, and the driving pad part) by providing an interlayer bar for preventing the intermediate layer from flowing to other regions during the manufacturing process. In addition, the interlayer bar prevents separation of the conductive member and the pad part by supporting adhesion between the conductive member and the pad part (the touch sensor pad part, the connection pad part, and the driving pad part) when the carrier substrate is removed. Accordingly, a high-quality display device is provided by preventing a contact failure between the conductive member and the pad parts.

1 is a plan view illustrating a display device according to an exemplary embodiment.
FIG. 2 is a cross-sectional view taken along line II′ of FIG. 1 .
FIG. 3 is a plan view illustrating the first substrate of FIG. 1 , and FIG. 4 is a plan view illustrating the second substrate of FIG. 1 .
FIG. 5A is a plan view illustrating one pixel, and FIG. 5B is a cross-sectional view taken along line II-II′ of FIG. 5A.
6A to 6G are cross-sectional views sequentially illustrating a method of manufacturing a display device according to an exemplary embodiment.
7A to 7C are cross-sectional views for explaining the relationship between the height of the first interlayer bar and the diameter of the conductive ball.
8 is a graph showing a ratio between an average diameter of conductive balls and a height of an interlayer bar when no current failure occurs.
9 is a plan view illustrating a display device according to another exemplary embodiment.
10 is a cross-sectional view taken along line III-III' of FIG. 9 .
11 is a plan view illustrating a display device according to another exemplary embodiment.
12 is a cross-sectional view taken along line IV-IV' of FIG. 11 .
13A to 13C are plan views illustrating a display device according to still another exemplary embodiment of the present invention.

Since the present invention can have various changes and can have various forms, specific embodiments are illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention.

In describing each figure, like reference numerals have been used for like elements. In the accompanying drawings, the dimensions of the structures are enlarged than the actual size for clarity of the present invention. Terms such as first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component. The singular expression includes the plural expression unless the context clearly dictates otherwise.

In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It is to be understood that it does not preclude the possibility of the presence or addition of numbers, steps, operations, components, parts, or combinations thereof. Also, when a part of a layer, film, region, plate, etc. is said to be “on” another part, this includes not only cases where it is “directly on” another part, but also cases where another part is in between. In addition, in the present specification, when a portion such as a layer, film, region, or plate is formed on another portion, the formed direction is not limited only to the upper direction, and includes those formed in the side or lower direction. . Conversely, when a part, such as a layer, film, region, plate, etc., is "under" another part, it includes not only cases where it is "directly under" another part, but also a case where another part is in between.

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

1 is a plan view illustrating a display device according to an exemplary embodiment, and FIG. 2 is a cross-sectional view taken along line II′ of FIG. 1 . FIG. 3 is a plan view illustrating the first substrate SUB1 of FIG. 1 , and FIG. 4 is a plan view illustrating the second substrate SUB2 of FIG. 1 .

1 to 4 , a display device DSP according to an exemplary embodiment includes a display area DA and a non-display area NDA provided around the display area DA.

The display area DA is an area in which an image is displayed, and the image includes arbitrary visual information, for example, text, video, photo, 2D or 3D image.

The non-display area NDA is provided around the display area DA. In an embodiment of the present invention, the non-display area NDA may be formed on at least one side of the display area DA, and may be formed along the circumference of the display area DA. Pad portions in which pads of wirings are provided may be provided in the non-display area NDA. The pad parts may be formed on one side of the display area DA. The pad parts include a touch sensor pad part, a connection pad part, a driving pad part, etc., which will be described later, and their shapes may vary depending on the shapes of the touch sensor pad part, the connection pad part, the driving pad part, and the like.

The display device DSP includes a first substrate SUB1 , a second substrate SUB2 , an intermediate layer CTL provided between the first substrate SUB1 and the second substrate SUB2 , and conductive members CM , and an interlayer bar (ITB, denoted ITB1 in the figure).

The first substrate SUB1 and the second substrate SUB2 may have various shapes, for example, a rectangular plate shape having two pairs of sides parallel to each other. When the display device DSP is provided in a rectangular plate shape, one pair of sides may be longer than the other pair of sides. In an exemplary embodiment of the present invention, for convenience of explanation, the display device DSP has a rectangular shape having a pair of long sides and a pair of short sides, and the extension direction of the short sides is defined as the first direction D1 ), an extension direction of the long side is indicated as a second direction D2. Here, for convenience of explanation, one of the short sides of the display substrate DSP is set as the first side S1 , and the three sequentially connected sides of the first substrate SUB1 are connected to the second to fourth sides S2 , S3, S4).

In an embodiment of the present invention, the first substrate SUB1 may have a smaller area than the second substrate SUB2 . The second substrate SUB2 may include an overlapping portion OV overlapping the first substrate SUB1 and a non-overlapping portion NOV not overlapping the first substrate when viewed in a plan view.

In one embodiment of the present invention, the first side of the first substrate SUB1 and the first side of the second substrate SUB2 may not coincide with each other in a plan view. In one embodiment of the present invention, in particular, the first substrate SUB1 may have the same length as the second substrate SUB2 with respect to the first direction D1, and may extend in the second direction D2. As a reference, it may have a shorter length than the second substrate SUB2. Accordingly, the non-overlapping portion between the first side S1 of the first substrate SUB1 and the corresponding side of the second substrate SUB2) (NOV) may be provided. When viewed in a plan view, the remaining second to fourth sides S2 , S3 , and S4 may substantially coincide with the first substrate SUB1 and the second substrate SUB2 .

The first side S1 of the first substrate SUB1 may have the same shape as the corresponding side of the second substrate SUB2 . For example, the first side S1 of the first substrate SUB1 and the corresponding side of the second substrate SUB2 may have a linear shape extending in the first direction D1 .

In an exemplary embodiment, the overlapping portion OV is provided with a portion of the display area DA and the non-display area NDA. A portion of the non-display area NDA is provided in the non-overlapping area NOV.

The non-overlapping part NOV may be provided as a place to which a flexible printed circuit board for connecting to an external driving part is attached (eg, a place where a driving pad part OP to be described later is provided). In an embodiment of the present invention, an inspection pad part for inspecting whether the pixels or other components are defective may be further provided on the top surface of the non-overlapping part of the second substrate SUB2 .

Although not shown, in another embodiment of the present invention, the first side S1 of the first substrate SUB1 may have a shape different from that of the corresponding side of the second substrate SUB2 . The shape of the first side S1 of the first substrate SUB1 may be variously deformed according to the type and arrangement of the pad part.

The first substrate SUB1 includes a first base substrate BS1, a touch sensor SR provided on the first base substrate BS1, connection lines connected to the touch sensor SR, and the connection lines. It includes a touch sensor pad portion provided at the end.

The first base substrate BS1 may be formed of an insulating material having flexibility. The first base substrate BS1 may be formed of, for example, various materials such as glass, polymer, and metal. The first base substrate BS1 may be, in particular, an insulating substrate made of an organic polymer. Examples of the insulating substrate material containing the organic polymer include polystyrene, polyvinyl alcohol, polymethyl methacrylate, polyethersulfone, polyacrylate, and polyether. Polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, tri Acetate cellulose (triacetate cellulose), cellulose acetate propionate (cellulose acetate propionate) and the like. However, the material constituting the first substrate BS1 is not limited thereto, and for example, the first substrate BS1 may be formed of fiber glass reinforced plastic (FRP).

The touch sensor SR is configured to sense the user's touch and/or pressure upon the user's touch when there is a user's touch on the display device DSP, and the display area ( DA) is provided. The touch sensor SR may be formed using a mutual capacitance method for sensing a change in capacitance due to an interaction between two types of sensing electrodes.

The touch sensor SR includes a plurality of first sensing units SR1 extending in a first direction D1 to which a sensing voltage is applied, and different from the first direction D1, for example, in the first direction. A plurality of second sensing units SR2 extending in a second direction D2 intersecting the D1 are included. The first sensing units SR1 are electrostatically coupled to the second sensing units SR2, and a voltage is changed by the electrostatic coupling.

Each of the first sensing units SR1 includes a plurality of first sensing electrodes SSE1 arranged in the first direction D1 and a plurality of first bridges BR1 connecting the first sensing electrodes SSE1 adjacent to each other. ) is included. The first sensing electrodes SSE1 may be provided in various shapes, for example, a polygonal shape including a rectangular shape such as a bar shape or a rhombus.

In one embodiment of the present invention, the first sensing electrodes SSE1 and the first bridges BR1 may be provided in a plate shape or a mesh shape made of fine wires.

Each second sensing unit SR2 includes a plurality of second bridges connecting the plurality of second sensing electrodes SSE2 arranged in the second direction D2 and the second sensing electrodes SSE2 adjacent to each other. BR2). The second sensing electrodes SSE2 may also be provided in various shapes, for example, polygons including a rectangular shape such as a bar shape or a rhombus.

The second sensing electrodes SSE2 and the second bridges BR2 may also be provided in a plate shape or a mesh shape made of fine wires.

The first sensing electrodes SSE1 and the second sensing electrodes SSE2 may be alternately disposed on the first base substrate BS1 in a matrix form.

The first sensing unit SR1 and the second sensing unit SR2 are insulated from each other. In particular, in the drawing of FIG. 3 , the first bridges BR1 and the second bridges BR2 are shown to cross each other, but in reality they are insulated from each other with an insulating layer interposed therebetween. The first sensing unit SR1 and the second sensing unit SR2 may be provided on different layers, but are not limited thereto. In an embodiment of the present invention, the first sensing electrodes SSE1 and the second sensing electrodes SSE2 may be provided on the same layer, and the first bridges BR1 and the second bridge The groups BR2 may be provided on different layers.

The connection lines CL1 and CL2 (hereinafter CL) are provided in the non-display area NDA to connect the touch sensor SR to a driver (not shown) that drives the touch sensor SR. The driving unit may be provided on a second substrate SUB2 to be described later or may be provided externally, for example, on a separate printed circuit board, and may include a position detection circuit. The connection lines CL transmit the sensing input signal from the driver to the first sensing units SR1 and the second sensing units SR2, or the first sensing units SR1 and the second sensing units. The sensing output signal from the units SR2 may be transmitted to the driving unit.

In an embodiment of the present invention, the connection lines CL may include a plurality of first connection lines CL1 and a plurality of second connection lines CL2 . The first connection lines CL1 are connected to the first sensing units SR1 . Each first connection line CL1 may be connected to a corresponding row of the first sensing unit SR1 . The first connection lines CL1 may be bent a plurality of times in the non-display area NDA when viewed in a plan view.

The second connection lines CL2 are connected to the second sensing units SR2 . Each second connection line CL2 may be connected to a corresponding column of the second sensing unit SR2 . The second connection lines CL2 may be bent a plurality of times in the non-display area NDA when viewed in a plan view.

The touch sensor pad units SP1 and SP2 (hereinafter referred to as SP) are for transmitting signals to or from the driving unit between the touch sensor SR and the driving unit. The touch sensor pad part SP is provided in the non-display area NDA and is connected to ends of the connection lines CL. The touch sensor pad part SP includes a plurality of touch sensor pads provided at the ends of the connection lines CL. The touch sensor pad part SP is electrically connected to connection pad parts CP1 and CP2 (hereinafter CP) of the second substrate SUB2 to be described later through a conductive member to be described later. The touch sensor SR is connected to the connection lines CL, the touch sensor pad unit SP is connected to the ends of the connection lines CL, and the touch sensor pad unit SP includes a conductive member. It is connected to the connection pad part CP through the connection pad part CP, and the connection pad part CP is finally connected to the driving part via a driving pad part OP, which will be described later. Through this, a signal related to a touch may be mutually transmitted from the driving unit to the touch sensor.

The touch sensor pad part SP is provided in the non-display area NDA adjacent to at least one of the four sides of the first substrate SUB1 . In one embodiment of the present invention, it is illustrated that the touch sensor pad part SP is provided in the non-display area NDA adjacent to the first side S1.

The touch sensor pad unit SP includes a first touch sensor pad unit SP1 provided at ends of the first connection lines CL1 and a second touch sensor pad provided at ends of the second connection lines CL2. It may include a part SP2. The first touch sensor pad unit SP1 and the second touch sensor pad unit SP2 may be provided at positions adjacent to each other in a plan view, or may be provided at positions spaced apart from each other. In an embodiment of the present invention, the first touch sensor pad unit SP1 and the second touch sensor pad unit SP2 are disposed on both sides of the first substrate SUB1 along the first direction D1. provided in each and may be spaced apart from each other.

In an embodiment of the present invention, the touch sensor SR, the connection lines CL, and the touch sensor pad part SP may be made of a conductive material. As the conductive material, a metal, an alloy thereof, a conductive polymer, a conductive metal oxide, a nano conductive material, and the like may be used. In one embodiment of the present invention, the metal includes copper, silver, gold, platinum, palladium, nickel, tin, aluminum, cobalt, rhodium, iridium, iron, ruthenium, osmium, manganese, molybdenum, tungsten, niobium, tantel. , titanium, bismuth, antimony, lead, and the like. Examples of the conductive polymer include polythiophene-based, polypyrrole-based, polyaniline-based, polyacetylene-based, polyphenylene-based compounds, and mixtures thereof. In particular, PEDOT/PSS compounds may be used among polythiophene-based compounds. Examples of the conductive metal oxide include Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), Antimony Zinc Oxide (AZO), Indium Tin Zinc Oxide (ITZO), Zinc Oxide (ZnO), Tin Oxide (SnO2), and the like. have. In addition, silver nanowires (AgNW), carbon nanotubes (Carbon Nano Tube), graphene (graphene), etc. may be mentioned as a nano-conductive compound.

The second substrate SUB2 faces the first substrate SUB1 and displays an image.

The second substrate SUB2 includes a second base substrate BS2 , a pixel PXL provided on the second base substrate BS2 , an encapsulation layer SL covering the pixel PXL, and the pixel PXL It includes signal lines SGL connected to , a driving pad unit OP provided at ends of the signal lines SGL, and a connection pad unit CP corresponding to the touch sensor pad unit SP.

The second base substrate BS2 has a substantially identical shape to that of the first base substrate BS1 . The second base substrate BS2 is provided to have the same area as the first base substrate BS1 or to have a larger area than the second base substrate BS2 .

The pixel PXL is provided in plurality in the display area DA and implements an image.

FIG. 5A is a plan view illustrating one pixel, and FIG. 5B is a cross-sectional view taken along line II-II′ of FIG. 5A.

4, 5A, and 5B , the pixel PXL is connected to the signal lines SGL. The signal lines provide a signal to each pixel PXL and may include a gate line GL, a data line DL, and a driving voltage line DVL, and may further include other wirings as necessary. .

The gate line GL may extend in one of the first direction D1 and the second direction D2 . The data line DL may extend in a direction crossing the gate line GL. The driving voltage line DVL may extend in substantially the same direction as the data line DL. The gate line GL transfers a scan signal to the thin film transistor, the data line DL transfers a data signal to the thin film transistor, and the driving voltage line DVL provides a driving voltage to the thin film transistor. do.

The gate line GL, the data line DL, and the driving voltage line DVL are provided in plurality.

Each of the signal lines SGL is provided across the display area and the non-display area NDP.

The pixel PXL displays an image and is provided in the display area DA. The plurality of pixels PXL may be provided and arranged in a matrix form. In the exemplary embodiment of the present invention, only one pixel PXL is illustrated in FIGS. 2A and 2B for convenience of description. Here, each pixel PXL is illustrated as having a rectangular shape, but is not limited thereto, and may be deformed into various shapes. Also, the pixels PXL may be provided to have different areas. For example, in the case of pixels having different colors, the pixels PXL may be provided with different areas or different shapes for each color.

Each pixel PXL includes a thin film transistor connected to a corresponding one of the signal lines SGL, a light emitting element connected to the thin film transistor, and a capacitor Cst.

The thin film transistor may include a driving thin film transistor TR2 for controlling the light emitting device and a switching thin film transistor TR1 for switching the driving thin film transistor TR2. In one embodiment of the present invention, it is described that one pixel PXL includes two thin film transistors TR1 and TR2, but the present invention is not limited thereto, and one thin film transistor and capacitor in one pixel PXL, or Three or more thin film transistors and two or more capacitors may be included in one pixel PXL.

The switching thin film transistor TR1 includes a first gate electrode GE1 , a first source electrode SE1 , and a first drain electrode DE1 . The first gate electrode GE1 is connected to the gate line GL, and the first source electrode SE1 is connected to the data line DL. The first drain electrode DE1 is connected to the gate electrode (ie, the second gate electrode GE2 ) of the driving thin film transistor TR2 . The switching thin film transistor TR1 transmits a data signal applied to the data line DL to the driving thin film transistor TR2 according to a scan signal applied to the gate line GL.

The driving thin film transistor TR2 includes a second gate electrode GE2 , a second source electrode SE2 , and a second drain electrode DE2 . The second gate electrode GE2 is connected to the switching thin film transistor TR1 , the second source electrode EL2 is connected to the driving voltage line DVL, and the second drain electrode DE2 is the light emission. connected to the device.

The light emitting device includes an emission layer EML and a first electrode EL1 and a second electrode EL2 facing each other with the emission layer EML interposed therebetween. The first electrode EL1 is connected to the second drain electrode DE2 of the driving thin film transistor TR2 . A common voltage is applied to the second electrode EL2 , and the light emitting layer EML emits light according to an output signal of the driving thin film transistor TR2 , thereby emitting or not emitting light to display an image. Here, the light emitted from the emission layer EML may vary depending on the material of the emission layer, and may be color light or white light.

In an embodiment of the present invention, the light emitting device, particularly the light emitting layer EML, may be provided in various forms in an area in which each pixel PXL is provided. In one embodiment of the present invention, although it is illustrated in a form that does not overlap the thin film transistor, the present invention is not limited thereto. The emission layer EML may partially overlap the thin film transistors or may overlap most of the thin film transistors. Of course, the shape or area of a region in which the light emitting device is provided within the region in which the pixel PXL is provided may be set differently according to an image output direction of the display device.

The capacitor Cst is connected between the second gate electrode GE2 and the second source electrode SE2 of the driving thin film transistor TR2, and the second gate electrode GE2 of the driving thin film transistor TR2. ) to charge and maintain the input data signal.

Hereinafter, pixels according to an embodiment of the present invention will be described in a stacking order.

The pixel according to an embodiment of the present invention is provided on the second base substrate BS2.

A buffer layer BFL is formed on the second base substrate BS2. The buffer layer BFL prevents impurities from diffusing into the switching and driving thin film transistors TR1 and TR2. The buffer layer BFL may be formed of silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiOxNy), etc., and may be omitted depending on the material and process conditions of the base substrate BS.

A first active pattern ACT1 and a second active pattern ACT2 are provided on the buffer layer BFL. The first active pattern ACT1 and the second active pattern ACT2 are formed of a semiconductor material. The first active pattern ACT1 and the second active pattern ACT2 have a source region SCA, a drain region DRA, and a channel region provided between the source region SCA and the drain region DRA, respectively. CNA). The first active pattern ACT1 and the second active pattern ACT2 may be semiconductor patterns made of polysilicon, amorphous silicon, oxide semiconductor, or the like. In particular, the channel region CNA is a semiconductor pattern that is not doped with an impurity, and may be an intrinsic semiconductor. The source region SCA and the drain region DRA may be semiconductor patterns doped with impurities. The impurities may be doped with impurities such as n-type impurities, p-type impurities, and other metals.

A first insulating layer INS1 is provided on the first active pattern ACT1 and the second active pattern ACT2 .

A first gate electrode GE1 and a second gate electrode GE2 connected to the gate line GL are provided on the first insulating layer INS1 . The first gate electrode GE1 and the second gate electrode GE2 are formed to cover regions corresponding to the channel regions CNA of the first and second active patterns ACT1 and ACT2, respectively.

A second insulating layer INS2 is provided on the first and second gate electrodes GE1 and GE2 to cover the first and second gate electrodes GE1 and GE2 .

A first source electrode SE1 , a first drain electrode DE1 , a second source electrode SE2 , and a second drain electrode DE2 are provided on the second insulating layer INS2 . The first source electrode SE1 and the first drain electrode DE1 are connected to a source region of the first active pattern ACT1 by a contact hole formed in the first insulating layer INS1 and the second insulating layer INS2 . They are respectively in contact with the SCA and the drain region DRA. The second source electrode SE2 and the second drain electrode DE2 are connected to a source region of the second active pattern ACT2 by a contact hole formed in the first insulating layer INS1 and the second insulating layer INS2 . They are respectively in contact with the SCA and the drain region DRA.

Meanwhile, a portion of the second gate electrode GE2 and a portion of the driving voltage line DVL are a first capacitor electrode CE1 and a second capacitor electrode CE2 , respectively, and are disposed between the second insulating layer INS2 to configure the capacitor Cst.

A third insulating layer INS3 is provided on the first source electrode SE1 , the first drain electrode DE1 , the second source electrode SE2 , and the second drain electrode DE2 . The third insulating layer INS3 may serve as a protective layer to protect the switching and driving thin film transistors TR1 and TR2 , or as a planarization layer to planarize an upper surface of the third insulating layer INS3 .

A first electrode EL1 is provided as an anode of the light emitting device on the third insulating layer INS3 . The first electrode EL1 is connected to the second drain electrode DE2 of the driving thin film transistor TR2 through a contact hole formed in the third insulating layer INS3 . Here, the first electrode EL1 may also be used as a cathode, but in the following embodiments, an anode will be described as an example.

The first electrode EL1 may be formed of a material having a high work function, and in the figure, when an image is provided in a downward direction of the base substrate BS, indium tin oxide (ITO), IZO It may be formed of a transparent conductive layer such as (indium zinc oxide), zinc oxide (ZnO), or indium tin zinc oxide (ITZO). In the figure, when an image is to be provided in the upper direction of the base substrate BS, the first electrode EL1 is Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, It may be formed of a metal reflective film such as Cr and a transparent conductive film such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO).

A pixel defining layer PDL dividing a pixel area to correspond to each pixel PXL is provided on the second base substrate BS2 on which the first electrode EL1 and the like are formed. The pixel defining layer PDL exposes a top surface of the first electrode EL1 and protrudes from the base substrate BS along the periphery of the pixel PXL.

An emission layer EML is provided in a pixel region surrounded by the pixel defining layer PDL, and a second electrode EL2 is provided on the emission layer EML.

The encapsulation layer SL is provided on the second electrode EL2 to cover the second electrode EL2 . The encapsulation layer SL may be formed of a single layer or may be formed of multiple layers. In an embodiment of the present invention, the encapsulation layer SL may include a first encapsulation layer SL1 and a second encapsulation layer SL2, and the first encapsulation layer SL1 and the second encapsulation layer (SL1) SL2) may contain different materials. For example, the first encapsulation layer SL1 may be formed of an organic material, and the second encapsulation layer SL2 may be formed of an inorganic material. However, whether the encapsulation layer SL is multi-layered or the material thereof is not limited thereto, and may be variously changed. For example, the encapsulation layer SL may include a plurality of organic material layers and a plurality of inorganic material layers alternately stacked.

Referring back to FIGS. 1 to 4 , 5A and 5B , the connection pad part CP corresponds to the touch sensor pad part SP of the first substrate SUB1 in the non-display area NDA. It is provided in a position where it is used and is provided in substantially the same shape. The connection pad part CP overlaps the touch sensor pad part SP when viewed in a plan view. The connection pad unit CP may include connection pads corresponding to each of the touch sensor pads of the touch sensor pad unit SP one-to-one. The connection pad part CP is for transmitting a signal to or from the driving part, and is electrically connected to the touch sensor pad part SP of the first substrate SUB1 through a conductive member CM to be described later. .

The connection pad part CP includes a first connection pad part CP1 corresponding to the first touch sensor pad part SP1 and a second connection pad part CP2 corresponding to the second touch sensor pad part SP2. ) may be included.

Additional connection lines are connected to the connection pad part CP. A third connection line CL3 is connected to the first connection pad part CP1 , and a fourth connection line CL4 is connected to the second connection pad part CP2 .

The signal lines SGL are connected to the pixels PXL. The signal lines SGL provide an image related signal to the pixels PXL. For example, the gate line GL transfers a scan signal from the driver to the thin film transistor, the data line DL transfers a data signal to the thin film transistor, and the driving voltage line DVL transfers the A driving voltage is provided to the thin film transistor. Here, although not shown, the signal lines may additionally include various lines related to implementing an image, and various signals may be applied to each signal line.

The driving pad part OP is provided in the non-display area NDA, and the signal lines SGL and the additional connection lines, that is, the third connection lines CL3 and the fourth connection lines ( CL4). The driving pad part OP includes a plurality of driving pads provided at ends of the signal lines SGL. The driving pad unit OP is configured to transmit a signal to or from the driving unit to the pixels PXL and the connection pad unit CP.

The driving pad part OP is provided in the non-display area NDA adjacent to at least one of the four sides of the first substrate SUB1 . Specifically, the driving pad part OP may be provided in a region on the second substrate SUB2 that does not overlap the first substrate SUB2 .

Although not shown, the driving pad part OP may be connected to another component, for example, a flexible printed circuit board, with a separate conductive member interposed therebetween.

The connection pad part CP, the signal lines SGL, the additional connection lines, and the driving pad part OP may be made of a conductive material. As the conductive material, a metal, an alloy thereof, a conductive polymer, a conductive metal oxide, a nano conductive material, and the like may be used. In one embodiment of the present invention, the metal includes copper, silver, gold, platinum, palladium, nickel, tin, aluminum, cobalt, rhodium, iridium, iron, ruthenium, osmium, manganese, molybdenum, tungsten, niobium, tantel. , titanium, bismuth, antimony, lead, and the like. Examples of the conductive polymer include polythiophene-based, polypyrrole-based, polyaniline-based, polyacetylene-based, polyphenylene-based compounds, and mixtures thereof. In particular, PEDOT/PSS compounds may be used among polythiophene-based compounds. Examples of the conductive metal oxide include Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), Antimony Zinc Oxide (AZO), Indium Tin Zinc Oxide (ITZO), Zinc Oxide (ZnO), Tin Oxide (SnO2), and the like. have. In addition, silver nanowires (AgNW), carbon nanotubes (Carbon Nano Tube), graphene (graphene), etc. may be mentioned as a nano-conductive compound.

The connection pad part CP, the signal lines SGL, the additional connection lines, and the driving pad part OP may be manufactured together when forming the above-described pixels PXL.

As described above, a first substrate SUB1 and a second substrate SUB2 are provided in the display device DSP according to an exemplary embodiment, and the first substrate SUB1 and the second substrate SUB2 are provided. An intermediate layer CTL, conductive members CM, and an interlayer bar ITB are provided therebetween.

The intermediate layer CTL is provided in the display area DA between the first substrate SUB1 and the second substrate SUB2 .

The intermediate layer CTL may serve to protect the touch sensor SR of the first substrate SUB1 and to bond the first substrate SUB1 and the second substrate SUB2 together. The intermediate layer CTL may have adhesiveness or adhesiveness in order to perform a bonding function.

The intermediate layer CTL may be made of a transparent material to transmit an image from the second substrate SUB2 . In addition, the intermediate layer CTL may be made of an insulating material and may have flexibility.

The material of the intermediate layer (CTL) is used to protect the touch sensor of the first substrate and serves to bond the first substrate and the second substrate, and the type thereof is not limited. In one embodiment of the present invention, the intermediate layer may be made of an organic material. The organic material may be photocured or thermally cured, and may be selected from various organic polymer materials. For example, the organic material may include a polymer of an acrylic acid ester. Alternatively, the organic material may include an epoxy resin. Examples of the epoxy resin include bisphenol A type, bisphenol F type, bisphenol AD type, bisphenol S type, xylenol type, phenol novolak type, cresol novolak type, polyfunctional type, tetraphenylolmethane type, polyethylene glycol type, polypropylene glycol type, hexanediol type, trimethylolpropane type, propylene oxide bisphenol type A, or mixtures thereof and the like can be used.

The intermediate layer CTL may extend not only to the display area DA but also to the non-display area NDA adjacent to the display area DA. For example, a side surface corresponding to at least one of the second to fourth sides S1 , S2 , S3 , and S4 of the intermediate layer CTL may be exposed to the outside. That is, other components are not provided on the outside of the intermediate layer CTL, and the side surface of the intermediate layer CTL may be disposed at the outermost side. Sides thereof may be exposed to the outside at the second to fourth sides S2, S3, and S4 except for the first side S1.

The intermediate layer CTL may have a side surface corresponding to the first side S1 of the first substrate SUB1 in contact with an interlayer bar ITB, which will be described later. This will be described later.

The conductive member CM is provided between the first substrate SUB1 and the second substrate SUB2, and the touch sensor pad part SP of the first substrate SUB1 and the second substrate SUB2 Connect the connection pad part CP of The conductive member CM is formed in a region where the touch sensor pad part SP and the connection pad part CP are formed when viewed in a plan view. Accordingly, the conductive member CM overlaps the touch sensor pad part SP and the connection pad part CP.

The conductive member CM may include a plurality of conductive balls CB and an insulator RS surrounding the conductive balls CB.

As a material of the conductive balls CB, a material capable of electrical conduction is used, and the type thereof is not particularly limited. In one embodiment of the present invention, the conductive balls (CB) are a metal such as nickel, iron, copper, aluminum, tin, zinc, chromium, cobalt, silver, gold, antimony, or a compound containing the metal, Electroconductive particles themselves, such as oxides of the above metals, solder, and carbon, may be used. In another embodiment of the present invention, the conductive balls CB may be particles in which a metal foil layer is formed on the surface of a nucleus material such as glass, ceramic, or polymer through a thin layer forming method such as an electroless plating method. An organic polymer may be used as the polymer, for example, various kinds of epoxy resins may be used. In one embodiment of the present invention, bisphenol-F epoxy resin may be used as the epoxy resin. Alternatively, the conductive balls CB may use the conductive particles themselves or particles coated with an insulating insulator on the surface of the particle in which a metal foil layer is formed on the surface of the nucleus material as conductive particles.

The insulator RS has adhesive properties and is capable of firmly bonding the touch sensor pad part SP and the connection pad part CP, and the type thereof is not particularly limited. In one embodiment of the present invention, the insulator RS may include a rubber-based resin and/or a polymer resin. The polymer resin may include a thermoplastic polymer resin, a thermosetting polymer resin, a radical polymerizable polymer resin, and the like.

The thermoplastic resin includes styrene butadiene resin, ethylene vinyl resin, ester resin, silicone resin, phenoxy resin, acrylic resin, amide resin, acrylate resin, or polyvinyl butyral resin, and the thermosetting resin is an epoxy resin, a phenol resin, or a melamine resin. The radically polymerizable resin is methyl acrylate, ethyl acrylate, bisphenol A ethylene glycol modified diacrylate, isocyanuric acid ethylene glycol modified diacrylate, tripropylene glycol diacrylate, tetraethylene glycol diacrylate, polyethyl glycol Diacrylate, pentaerythritol triacrylate, trimethylol propane triacrylate, trimethylol propane propylene glycol triacrylate, trimethylol propane ethylene glycol triacrylate, isocyanuric acid ethylene glycol modified triacrylate, di Acrylates, such as pentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, pentaerythritol tetraacrylate, dicyclopentenyl acrylate, and tricyclodecanyl acrylate, methacrylates, maleimide compounds, unsaturated poly Esters, acrylic acid, vinyl acetate, or acrylonitrile, methacrylonitrile compounds and the like can be used.

In the drawings, one conductive ball CB is shown, but this is for convenience of description, and a plurality of conductive balls CB are provided in the conductive member CM.

Each conductive ball CB may be provided between the first substrate SUB1 and the second substrate SUB2 in a substantially circular or elliptical shape. The conductive balls CB may be provided in an elliptical shape between the touch sensor pads and the connection pads facing each other, and may be provided in an approximately circular shape at other portions. Although the conductive ball CB is provided in a circular shape, it is deformed into an elliptical shape by being pressed in the vertical direction between the first substrate SUB1 and the second substrate SUB2 during the manufacturing process of the display device. Since the distance between the touch sensor pads and the connection pads that face each other is narrower than that of the part where it is not, the conductive member CM between the touch sensor pads and the connection pads facing each other is formed between the two substrates. It may be provided in an approximately elliptical shape depending on the spacing therebetween.

The average diameter of the conductive balls CB may be selected to have a different value according to a distance between the first substrate SUB1 and the second substrate SUB2 in a display device to be manufactured. In addition, when another component such as an insulating layer is interposed between the conductive member CM and the upper surface of the first base substrate BS1 or the second base substrate BS2, the first substrate SUB1 and the second An interval between the two substrates SUB2 may be further narrowed. In one embodiment of the present invention, the average diameter of each conductive ball CB may be about 16 micrometers to about 24 micrometers. Here, the “average diameter” means an average of all diameters passing through the center of each conductive ball. For example, when the conductive balls CB are provided in an ellipse having a minor axis in the vertical direction between the first substrate SUB1 and the second substrate SUB2, in the ellipse, the diameter in the vertical direction is Assuming that the first diameter RD1 and the left-right diameter are the second diameter RD2, the first diameter RD1 is the shortest axis, the second diameter RD2 is the longest axis, and the other diameters are the long axis and the long axis. It represents the value between shortenings.

Accordingly, the average diameter of the conductive balls CB is an average value of the diameters, and may be approximately an intermediate value between the first diameter RD1 and the second diameter RD2, and the conductive balls CB are compressed. It may be substantially the same as the diameter in the previous circular shape.

The interlayer bar ITB is provided in the non-display area NDA between the first substrate SUB1 and the second substrate SUB2 and adjacent to the connection pad part CP. Here, in order to avoid confusion with other embodiments, the interlayer bar in this embodiment is referred to as a first interlayer bar ITB1.

In one embodiment of the present invention, the first interlayer bar ITB1 is provided between the display area DA and the touch sensor pad part SP when viewed in a plan view. In other words, the first interlayer bar ITB1 is provided between the display area DA and the connection pad part CP.

The first interlayer bar ITB1 adheres between the first substrate SUB1 and the second substrate SUB2, and the intermediate layer CTL forms the touch sensor pad part SP and the connection pad part CP. It is provided between the intermediate layer CTL and the conductive member CM when viewed in a cross-sectional view to prevent it from extending laterally. A side surface of the first interlayer bar ITB on the display area DA side may directly contact the intermediate layer CTL.

The first interlayer bar ITB1 is also adjacent to the conductive member CM and stably bonds the first substrate SUB1 and the second substrate SUB2 so that the conductive member CM is connected to the first substrate. It prevents separation from SUB1 or the second substrate SUB2.

The first interlayer bar ITB1 may extend in the same direction as the first side S1 to correspond to the first side S1 . The first interlayer bar ITB1 may not be provided on the side of the second to fourth sides S2 , S3 , and S4 , but may be provided only on the side of the first side S1 . In one embodiment of the present invention, the first interlayer bar ITB1 is integrally formed along the first side S1 so that one end meets the fourth side S4 and the other end is the It may meet the second side S2.

The first interlayer bar ITB1 includes an insulating material having adhesive properties, but the type thereof is not particularly limited. In an embodiment of the present invention, the first interlayer bar ITB1 may include the above-described rubber-based resin and/or polymer resin.

In an exemplary embodiment, a height H1 of the first interlayer bar ITB1 is smaller than an average diameter of the conductive balls CB. In an embodiment of the present invention, the average diameter of the conductive balls CB may be 16 micrometers to 24 micrometers, and the height H1 of the first interlayer bar ITB1 may be 10 micrometers to 13 micrometers. may be micrometers. Also, in one embodiment of the present invention, the height H1 of the first interlayer bar ITB1 may be about 50% to about 65% of the diameter of the conductive balls CB. In this case, a difference between the average diameter of the conductive balls CB and the height H1 of the first interlayer bar ITB1 may be 3 micrometers or more.

The conductive balls CB are initially provided in a circular shape, but are compressed in the vertical direction between the first substrate SUB1 and the second substrate SUB2 during the display device manufacturing process to be deformed into an elliptical shape. After being deformed to , the vertical diameter, that is, the length of the first diameter RD1 may be substantially the same as or similar to the height H1 of the first interlayer bar ITB1. Here, the difference between the first diameter RD and the height H1 of the first interlayer bar ITB1 is a slight difference of the thickness of the connection pad part CP unless a separate insulating layer is added. may exist, but their size is relatively small.

In an embodiment of the present invention, the first interlayer bar ITB1 may include spacers and a binder (not shown) surrounding the spacers (not shown).

The spacer may be provided in various shapes. In an embodiment of the present invention, the spacer is provided in a spherical shape, and may not have elasticity or may have some elasticity. The spacer allows the first substrate SUB1 and the second substrate SUB2 to maintain a minimum distance when the first substrate SUB1 and the second substrate SUB2 are pressed together during the manufacturing process. A plurality of the spacers may be provided in the binder and may have a diameter equal to or smaller than the overall height of the first interlayer bar ITB1. In an embodiment of the present invention, the diameter of the spacer may be about 20% to 30% of the average diameter of the conductive balls CB. For example, when the diameter of the conductive balls CB is about 20 micrometers, the spacer may have a diameter of about 6 micrometers.

The spacer may be made of a polymer material including silicon oxide, but the material is not limited thereto.

The display device having the above structure may be manufactured by the following method. 6A to 6G are cross-sectional views sequentially illustrating a method of manufacturing a display device according to an exemplary embodiment.

1 to 4 and 6A , a first substrate SUB1 is manufactured. The first substrate SUB1 prepares a first base substrate BS1, and a touch sensor SR, connection lines CL, and a touch sensor pad part SP are disposed on the first base substrate BS1. comprising the step of forming

In order to effectively form the touch sensor SR and the like on the first base substrate BS1 , a first carrier capable of supporting the first base substrate BS1 under the first base substrate BS1 . A substrate CR1 may be provided.

The first base substrate BS1 may be coated on the first carrier substrate CR1 and then manufactured by curing.

The touch sensor SR, the connection lines CL, and the touch sensor pad part SP may be formed on the first base substrate BS1 by various processes, for example, the touch sensor SR. , the connection lines CL, and the touch sensor pad unit SP may be formed using at least one photolithography.

1 to 4 and 6B , a second substrate SUB2 is manufactured. The manufacturing of the second substrate SUB2 includes the pixels PXL, the encapsulation layer SL, the signal lines SGL, the driving pad unit OP, and the connection on the second base substrate BS2 . and forming the pad part CP. In order to effectively form the pixels PXL and the like on the second base substrate BS2 , a second carrier capable of supporting the second base substrate BS2 is provided under the second base substrate BS2 . A substrate CR2 may be provided.

The pixels PXL and the like may be formed by various processes, for example, by using a plurality of photolithography.

1 to 4 and 6C , an intermediate layer CTL is provided on at least one of the first substrate SUB1 and the second substrate SUB2 . In one embodiment of the present invention, the intermediate layer CTL is formed on the first substrate SUB1 , but in another embodiment, it may be formed on the second substrate SUB2 .

In addition, the intermediate layer CTL may be formed on the first substrate SUB1 in various ways, and any one of a printing method, a coating method, and a dispensing method may be used. For example, the intermediate layer (CTL) may be formed by any one of a printing method such as screen printing, inkjet printing, and nozzle printing, a coating method such as slit coating, spin coating and spray coating, and a dispensing method using a dispenser. . In one embodiment of the present invention, when the intermediate layer is formed by the screen printing method, the intermediate layer may be formed by printing the intermediate layer in a planar shape.

In an exemplary embodiment, the intermediate layer CTL is provided in the display area DA of the first substrate SUB1 in an uncured state. The area in which the intermediate layer CTL is formed may not exactly match the display area DA in a plan view. During the curing process of forming the intermediate layer CTL, the intermediate layer CTL may spread outward, and the intermediate layer CTL may be formed in consideration of this portion.

Thereafter, the intermediate layer CTL is semi-cured. The semi-hardening process is performed to ensure that the intermediate layer CTL has an appropriate degree of elasticity and fluidity.

1 to 4 and 6D , the conductive member CM and the first interlayer bar ITB1 are formed in the non-display area NDA of the first substrate SUB1 on which the intermediate layer CTL is formed. . In one embodiment of the present invention, the conductive member CM and the first interlayer bar ITB1 may be formed on the first substrate SUB1, but the present invention is not limited thereto. When formed on the second substrate SUB1 , the conductive member CM and the first interlayer bar ITB1 may also be formed on the second substrate SUB2 . The formation order of the conductive member CM and the first interlayer bar ITB1 is not particularly limited, and may be formed simultaneously.

In an embodiment of the present invention, the conductive member CM includes an uncured or semi-cured insulator RS having a certain degree of fluidity containing conductive balls CB to the first substrate SUB1 . It can be formed by coating. The conductive member CM may be formed by a screen printing method or a dispensing method using a dispenser. In one embodiment of the present invention, when the conductive member CM is formed using a dispenser, the conductive balls CB while moving the dispenser from one side to the other side of the touch sensor pad unit SP. It can be formed by discharging the insulator RS contained therein. Here, the discharge start point and the discharge end point of the dispenser may be disposed outside the touch sensor pad unit SP when viewed in a plan view.

In the conductive member CM, the diameter of each conductive ball CB may be variously changed according to a distance between the first and second substrates SUB1 and SUB2 to be conductive. In one embodiment of the present invention, each conductive ball CB provided on the first substrate SUB1 has a substantially circular shape, and a diameter thereof may be about 16 micrometers to about 24 micrometers. .

The first interlayer bar ITB1 may be formed on the first side S1 of the first substrate SUB1 . In detail, it is formed between the display area DA and the touch sensor pad unit SP, and is not formed on the second to fourth sides S2, S3, and S4.

The first interlayer bar ITB1 is formed to prevent the intermediate layer CTL from flowing in the direction of the touch sensor pad part SP when the intermediate layer CTL is cured. In addition, the first interlayer bar ITB1 is formed to enhance adhesion between the first substrate SUB1 and the second substrate SUB2 .

The first interlayer bar ITB1 may be formed by applying an uncured or semi-cured insulator having a certain degree of fluidity to the first substrate ITB1. The first interlayer bar ITB1 may be formed by a screen printing method or a dispensing method using a dispenser. In an embodiment of the present invention, when the first interlayer bar ITB1 is formed by a screen printing method, the first interlayer bar ITB1 may be formed by printing the insulator RS in a linear shape. In one embodiment of the present invention, when the first interlayer bar ITB1 is formed using a dispenser, the dispenser is directed in a first direction from the second side S2 side to the fourth side S4 side or the opposite side. It may be formed by discharging the insulator RS while moving along (D1).

In an embodiment of the invention, the height H1 of the first interlayer bar ITB1 prevents abnormal flow of the intermediate layer while strengthening the adhesive force between the first substrate SUB1 and the second substrate SUB2 to be smaller than the diameter of the conductive balls CB.

7A to 7C are cross-sectional views for explaining the relationship between the height of the interlayer bar (ITB) and the diameter of the conductive balls. 8 shows the ratio of the average diameter of the conductive balls to the height of the interlayer bar when the conductive balls have a diameter of 20 micrometers and an interlayer bar (ITB) height of 10 micrometers to 13 micrometers, and no conduction failure occurs. is the graph shown. 7A to 7C, for convenience of explanation, a conductive ball close to the interlayer bar ITB is referred to as a first conductive ball CB1, and a conductive ball far from the interlayer bar ITB is referred to as a second conductive ball CB2. is called

Referring to FIG. 7A , when the height of the interlayer bar ITB is excessively higher than the diameters of the first conductive ball CB1 and the second conductive ball CB2, the first substrate SUB1 and the second substrate SUB2 are separated. During bonding, the first conductive ball CB1 does not contact the second substrate SUB2 . For example, when the height of the interlayer bar ITB is greater than 65% of the diameter of the conductive balls CB1 and CB2, the conductive balls CB1 and CB2 adjacent to the interlayer bar ITB are energized after bonding. This can be difficult.

Referring to FIG. 7B , when the height of the interlayer bar ITB is excessively lower than the diameters of the first conductive ball CB1 and the second conductive ball CB2 , the first substrate SUB1 and the second substrate SUB2 are separated. During bonding, the second conductive ball CB2 does not contact the second substrate SUB2 . For example, when the height of the interlayer bar ITB is less than 50% of the diameter of the conductive balls CB1 and CB2, the conductive balls CB1 and CB2 far from the interlayer bar ITB after bonding It can be difficult to conduct electricity.

Referring to FIG. 7C , when the height of the interlayer bar ITB is smaller than the diameters of the first conductive ball CB1 and the second conductive ball CB2 , but has a height of 50% to 65%, most of the Conductive balls CB1 and CB2 may be energized.

Again, referring to FIGS. 1 to 4 and 6E , the first substrate SUB1 and the second substrate SUB2 are formed of an intermediate layer CTL, a first interlayer bar ITB1, and a conductive member CM. are joined to each other with the

In the bonding process, the first substrate SUB1 and the second substrate SUB2 are pressed in a direction facing each other (a vertical direction in the drawing). The compression may be performed in a manner of applying pressure from the top to the bottom direction, that is, from the second substrate SUB2 to the first substrate SUB1 direction. In one embodiment of the present invention, when the intermediate layer CTL, the first interlayer bar IBT1, and the conductive member CM are formed on the second substrate SUB2, the first substrate SUB1 is It may be positioned on the upper portion, and compression may be performed by applying pressure from the first substrate SUB1 to the second substrate SUB2 direction.

In one embodiment of the present invention, the surface of the first substrate SUB1 is in contact with the upper surface of the first interlayer bar ITB1 by the compression. Here, since the intermediate layer CTL, the first interlayer bar ITB1, and the conductive member CM are formed of an uncured or semi-cured material, they have a certain degree of fluidity and elasticity. Accordingly, when pressure is applied from the top, it may be applied until the surface of the first substrate SUB1 contacts the spacer in the first interlayer bar ITB1. The presence of the spacer prevents direct contact between the surface of the first substrate SUB1 and the surface of the second substrate SUB2 .

When the pressure is removed, the volume is partially restored by the elastic force of the intermediate layer CTL, the first interlayer bar ITB1, and the conductive member CM. In this case, the intermediate layer CTL, the first interlayer bar ITB1, and the conductive member CM are subjected to external atmospheric pressure and the intermediate layer CTL, the first interlayer bar ITB1, and the conductive member CM. The elastic force of can be restored to the volume at which the force is balanced.

In addition, as the first substrate SUB1 and the second substrate SUB2 are pressed in the vertical direction, the conductive balls CB between the touch sensor pad part SP and the connection pad part CP have an elliptical shape. is transformed That is, the first diameter RD1 after compression becomes smaller than the first diameter RD1' before compression, and the second diameter RD2 after compression becomes larger than the second diameter RD2' before compression. However, both before and after compression, the average values of the total diameters have substantially the same or similar values.

Electricity may be passed between the touch sensor pad part SP and the connection pad part CP by the deformed conductive balls CB.

1 to 4 and 6F , the first substrate SUB1 and the second substrate SUB2 are interposed between the intermediate layer CTL, the first interlayer bar ITB1, and the conductive member CM. The intermediate layer CTL, the first interlayer bar ITB1, and the conductive member CM are cured in a state where they are bonded to each other.

During the curing process, the intermediate layer CTL, the first interlayer bar ITB1, and the conductive member CM are all cured, and the first substrate SUB1 and the second substrate SUB2 are firmly adhered to each other. . Here, the intermediate layer CTL may spread outward in a partial region during the curing. However, the intermediate layer CTL is blocked by the first interlayer bar ITB1 and cannot spread in the direction in which the touch sensor pad part SP and the connection pad part CP are formed. When the intermediate layer CTL extends to a portion blocked by the first interlayer bar ITB1 , the side surface of the first interlayer bar ITB1 on the display area DA side is in direct contact with the material of the intermediate layer CTL can do. Accordingly, contamination of the touch sensor pad part SP and the connection pad part CP by the intermediate layer CTL is prevented. If the first interlayer bar ITB1 is not provided, the intermediate layer CTL extends to the pad part including the touch sensor pad part SP, the connection pad part CP, and the driving pad part OP. can spread The conductive balls CB may be swept away by the spread intermediate layer CTL, and may penetrate between the conductive balls CB and the pad part to prevent contact between the conductive balls CB and the pad part. can As a result, a defect in which the touch sensor pad part SP and the connection pad part CP are not energized may occur despite the formation of the conductive member CM.

1 and 6G , the manufactured display device is inverted, and the first carrier substrate CR1 and the second carrier substrate CR2 are removed. When the first carrier substrate CR1 is separated from the first substrate SUB1 and the second carrier substrate CR2 is separated from the second substrate SUB2, the first substrate SUB1 and the second substrate SUB2 ) can be stressed in an outward direction on each. However, since the first interlayer bar ITB1 is provided between the first substrate SUB1 and the second substrate SUB2, between the conductive member CM and the first substrate SUB1 due to the stress, the conductive member Separation between the CM and the second substrate SUB2 is prevented. Accordingly, contact failure between the conductive member CM and the pad part is prevented.

9 is a plan view illustrating a display device according to another exemplary embodiment, and FIG. 10 is a cross-sectional view taken along line III-III′ of FIG. 9 .

Hereinafter, in other embodiments of the present invention, differences from the above-described embodiments will be mainly described in order to avoid duplication of description.

9 and 10 , in another embodiment of the present invention, the display device DSP is disposed in the non-display area NDA between the first substrate SUB1 and the second substrate SUB2. , a second interlayer bar ITB2 provided between the display area DA and the driving pad unit OP. The second interlayer bar ITB2 is provided between the connection pad part CP (or the touch sensor pad part SP) and the driving pad part OP in a plan view, and the connection pad part CP. is spaced apart from the display area DA with interposed therebetween.

The second interlayer bar ITB2 serves to adhere between the first substrate SUB1 and the second substrate SUB2 and to prevent the intermediate layer CTL from extending toward the driving pad part OP, It is provided between the intermediate layer CTL and the driving pad unit OP when viewed in cross section, specifically, between the touch sensor pad unit SP and the connection pad unit CP and the driving pad unit OP. A side surface of the second interlayer bar ITB2 on the display area DA side may directly contact the material of the intermediate layer CTL.

The second interlayer bar ITB2 is also adjacent to the first conductive member CM and stably adheres the first substrate SUB1 and the second substrate SUB2 so that the first conductive member CM is formed. Separation from the first substrate SUB1 or the second substrate SUB2 is prevented.

The second interlayer bar ITB2 may extend in the same direction as the first side S1 to correspond to the first side S1 . The second interlayer bar ITB2 may not be provided on the side of the second to fourth sides S2 , S3 , and S4 , but may be provided only on the side of the first side S1 . In an embodiment of the present invention, the interlayer bar is integrally formed along the first side S1 so that one end meets the fourth side S4 and the other end has the second side S2. ) can be encountered.

As described above, the second interlayer bar ITB2 prevents the intermediate layer CTL from flowing to the driving pad part OP and firmly fixes the first substrate SUB1 and the second substrate SUB2 between them. By doing so, poor contact of the conductive member CM is prevented.

11 is a plan view illustrating a display device DSP according to still another exemplary embodiment, and FIG. 12 is a cross-sectional view taken along line IV-IV′ of FIG. 11 .

11 and 12 , in another embodiment of the present invention, the display device DSP is disposed in the non-display area NDA between the first substrate SUB1 and the second substrate SUB2. , a first interlayer bar ITB1 provided between the display area DA and the touch sensor pad unit SP/connection pad unit CP, and between the display area DA and the driving pad unit OP The provided second interlayer bar ITB2 may be included. In detail, the second interlayer bar ITB2 may be provided between the connection pad part CP (or the touch sensor pad part SP) and the driving pad part OP when viewed in a plan view, It is spaced apart from the display area DA with the connection pad part CP interposed therebetween.

The first interlayer bar ITB1 and the second interlayer bar ITB2 adhere between the first substrate SUB1 and the second substrate SUB2, and at the same time, the intermediate layer CTL forms a touch sensor during the manufacturing process. This is to prevent extension toward the pad part SP/connection pad part CP and the driving pad part OP.

The first interlayer bar ITB1 and the second interlayer bar ITB2 may respectively correspond to the first side S1 and extend in the same direction as the first side S1 . The second interlayer bar ITB2 may not be provided on the side of the second to fourth sides S2 , S3 , and S4 , but may be provided only on the side of the first side S1 . In one embodiment of the present invention, the first interlayer bar ITB1 and the second interlayer bar ITB2 are integrally formed along the first side S1 and are not separated so that one end is formed on the fourth side ( S4) and the other end may meet the second side S2.

13A to 13C are plan views illustrating a display device DSP according to still another exemplary embodiment of the present invention.

13A and 13B , the first interlayer bar ITB1 and the second interlayer bar ITB2 may prevent the intermediate layer CTL from flowing during manufacturing, and the first substrate SUB1 and the second substrate SUB1 and the second substrate ( SUB2) may have various shapes within the range that can improve the adhesion between them.

For example, the first interlayer bar ITB1 depends on the shape of the touch sensor pad part SP/connection pad part CP, and the second interlayer bar ITB2 depends on the shape of the driving pad part OP. It may be formed in a shape corresponding to this.

Referring to FIG. 13A , the first interlayer bars ITB11 and ITB12 may be separated into a plurality. For example, the touch sensor pad unit SP may include a first touch sensor pad unit SP1 and a second touch sensor pad unit SP2 extending long in the first direction D1, in this case , The first interlayer bars ITB11 and ITB12 include two second pieces extending in a first direction D1 to correspond to the first touch sensor pad unit SP1 and the second touch sensor pad unit SP2, respectively. It may include interlayer bars ITB11 and ITB12. The first interlayer bars ITB11 and ITB12 respectively corresponding to the first touch sensor pad unit SP1 and the second touch sensor pad unit SP2 are connected to the first interlayer bars ITB11 and ITB12 by the first interlayer bars ITB11 and ITB12. The length of the first touch sensor pad unit SP1 and the second touch sensor pad unit SP2 is substantially equal to the length of the first touch sensor pad unit SP1 and the second touch sensor pad unit SP2 so that the touch sensor pad unit SP1 and the second touch sensor pad unit SP2 can be sufficiently covered. Or it can have a longer length than this.

The separated portions of the first interlayer bars ITB11 and ITB12 may correspond to portions of the first and second touch sensor pad units SP1 and SP2 spaced apart from each other. In the present exemplary embodiment, the second interlayer bar ITB2 may be integrally and elongated along the first side S1 .

Referring to FIG. 13B , the first interlayer bars ITB11 and ITB12 may be separated into two pieces spaced apart from each other as shown in FIG. 13A . In the present embodiment, the second interlayer bar ITB2 may be provided only in the portion where the driving pad part OP is formed. In this case, the second interlayer bar ITB2 has substantially the same length as the driving pad part OP so that the driving pad part OP can be sufficiently covered by the second interlayer bar ITB2 . Or it can have a longer length than this.

Referring to FIG. 13C , the first interlayer bar ITB1 and the second interlayer bar ITB2 may be separated into three or more pieces arranged in a first direction, respectively.

The display devices having the above-described structure and manufactured by the above-described method additionally have the following advantages. By forming the interlayer bar, the intermediate layer is prevented from overflowing into the components of the non-display area, for example, the touch sensor pad part, the connection pad part, the driving pad part, and/or the inspection pad part, thereby preventing poor contact in the pad part. do. In addition, since there is no need to form a separate interlayer overflow prevention structure, the process is simplified and cost is reduced. In addition, the interlayer bar supports the adjacent conductive member to be firmly fixed between the first substrate and the second substrate, thereby preventing a contact failure of the pad portion between the first substrate and the second substrate. In addition, since the first substrate and the second substrate are firmly attached, both sides of the first base substrate and the second base substrate may be etched after the bonding is completed. An ultra-slim display device may be realized by etching both sides of the first and second base substrates.

Although the above has been described with reference to the preferred embodiment of the present invention, those skilled in the art or those having ordinary knowledge in the technical field will not depart from the spirit and technical scope of the present invention described in the claims to be described later. It will be understood that various modifications and variations of the present invention can be made without departing from the scope of the present invention.

Accordingly, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

CB: conductive balls CP1, CP2: first and second connection pad parts
CTL: middle layer DA: display area
DSP: Display device ITB: Interlayer bar
NDA: non-display area OP: driving pad part
PXL: Pixel SL: Encapsulation layer
SP1, SP2: first and second touch sensor pad part SR: touch sensor
SR1, SR2: first and second sensing units SUB1, SUB2: first and second substrates

Claims (42)

A display device comprising: a display area on which an image is displayed; and a non-display area provided around the display area;
a first substrate including a touch sensor provided on the display area and a touch sensor pad unit provided on the non-display area;
a second substrate facing the first substrate and including a pixel provided in the display area and a connection pad provided on the non-display area;
an intermediate layer provided in the display area between the first substrate and the second substrate;
conductive balls connecting the touch sensor pad unit and the connection pad unit; and
an interlayer bar provided in the non-display area between the first substrate and the second substrate and adjacent to the connection pad portion;
An average diameter of the conductive balls positioned outside the interlayer bar with respect to the intermediate layer is greater than a height of the interlayer bar. The method of claim 1,
The conductive balls are provided in a spherical shape or an oval shape, and a height of the interlayer bar is 50% to 65% of an average diameter of the conductive balls. 3. The method of claim 2,
The average diameter of the conductive balls is 16 micrometers to 24 micrometers. 3. The method of claim 2,
The height of the interlayer bar is 10 micrometers to 13 micrometers. 3. The method of claim 2,
A difference between the average diameter of the conductive balls and the height of the interlayer bar is 3 micrometers or more. The method of claim 1,
The interlayer bar includes spacers and a binder including the spacers therein. 7. The method of claim 6,
The spacers have a spherical shape. 8. The method of claim 7,
The spacers have a diameter less than or equal to a height of the interlayer bar. 9. The method of claim 8,
A ratio of the average diameter of the conductive balls to the diameter of the spacers is 10:2 to 10:3. The method of claim 1,
The first substrate has a rectangular shape having first to fourth sides sequentially connected, and the touch sensor pad unit is provided to correspond to the first side. 11. The method of claim 10,
A side surface of the intermediate layer is exposed to the outside at at least one of the second to fourth sides. 12. The method of claim 11,
The intermediate layer has side surfaces exposed to the outside at the second to fourth sides. 11. The method of claim 10,
At least a portion of the interlayer bar extends along an extension direction of the first side. 14. The method of claim 13,
The interlayer bar extends from the fourth side to the second side along the first side. The method of claim 1,
The interlayer bar is provided between the display area and the connection pad part in a plan view. 16. The method of claim 15,
The connection pad part includes a first connection pad part and a second connection pad part spaced apart from each other, and a plurality of interlayer bars are provided to correspond to the first and second connection pad parts and are spaced apart from each other. The method of claim 1,
The second substrate further includes a driving pad unit for transmitting an image signal to the display area,
The interlayer bar is provided between the display area and the driving pad part. 18. The method of claim 17,
The interlayer bar is spaced apart from the display area with the connection pad part interposed therebetween. The method of claim 1,
The interlayer bar includes a first interlayer bar provided between the display area and the connection pad part and a second interlayer bar spaced apart from the display area with the connection pad part therebetween when viewed in a plan view. 20. The method of claim 19,
The connection pad part includes a first connection pad part and a second connection pad part spaced apart from each other, and the first interlayer bar is spaced apart from each other corresponding to the first and second connection pad parts. 20. The method of claim 19,
The first substrate further includes a driving pad unit for transmitting an image signal to the display area,
The second interlayer bar is provided between the display area and the driving pad part. The method of claim 1,
The display device further comprising connection lines connecting the touch sensor and the touch sensor pad unit. 23. The method of claim 22,
The touch sensor includes a first sensing unit and a second sensing unit crossing each other,
The touch sensor pad unit includes a first touch sensor pad unit connected to the first sensing unit and a second touch sensor pad unit connected to the second sensing unit. 24. The method of claim 23,
The display device includes a first connection pad unit corresponding to the first touch sensor pads and a second connection pad unit corresponding to the second touch sensor pads. The method of claim 1,
The display device further comprising an insulator surrounding the conductive ball. A method of manufacturing a display device having a display area and a non-display area, the method comprising:
manufacturing a first substrate including a touch sensor on the display area and a touch sensor pad on the non-display area;
manufacturing a second substrate including a pixel on the display area and a connection pad on the non-display area;
forming an intermediate layer in a display area of one of the first substrate and the second substrate;
forming an interlayer bar in a non-display area of one of the first substrate and the second substrate;
forming conductive balls on the connection pad part or the touch sensor pad part; and
bonding the first substrate to the second substrate;
A diameter of the conductive balls positioned outside the interlayer bar with respect to the intermediate layer is greater than a height of the interlayer bar. 27. The method of claim 26,
The conductive balls are provided in a spherical shape, and a height of the interlayer bar is 50% to 65% of a diameter of the conductive balls. 28. The method of claim 27,
The conductive balls have a diameter of 16 micrometers to 24 micrometers. 28. The method of claim 27,
The height of the interlayer bar is 10 micrometers to 13 micrometers. 28. The method of claim 27,
The difference between the average diameter of the conductive balls and the height of the interlayer bar is 3 micrometers or more. 27. The method of claim 26,
The interlayer bar includes spacers and a binder including the spacers therein. 32. The method of claim 31,
The spacers have a spherical shape. 33. The method of claim 32,
The spacers have a diameter less than or equal to a height of the interlayer bar. 33. The method of claim 32,
A ratio of a diameter of the conductive balls to a diameter of the spacers is 10:2 to 10:3. 27. The method of claim 26,
The first substrate has a rectangular shape having first to fourth sides sequentially connected, and the non-display area corresponds to the first side. 36. The method of claim 35,
At least a portion of the interlayer bar extends along an extension direction of the first side. 37. The method of claim 36,
The interlayer bar is not formed on the second side to the fourth side. 27. The method of claim 26,
The interlayer bar is provided between the display area and the connection pad in a plan view. 27. The method of claim 26,
The second substrate further includes a driving pad unit for transmitting an image signal to the display area,
The interlayer bar is provided between the display area and the driving pad part. 27. The method of claim 26,
The method of claim 1 , wherein the interlayer bar includes a first interlayer bar provided between the display area and the connection pad part and a second interlayer bar spaced apart from the display area with the connection pad part therebetween when viewed in a plan view. 27. The method of claim 26,
The step of manufacturing the first substrate
providing a first carrier substrate on a rear surface of the first base substrate; and
Comprising the step of forming the touch sensor and the touch sensor pad portion on the upper surface of the first base substrate,
The step of manufacturing the second substrate is
providing a second carrier substrate on a rear surface of the second base substrate; and
and forming the pixel and the connection pad part on an upper surface of the second base substrate. 42. The method of claim 41,
and removing the first carrier substrate and the second carrier substrate after bonding the first substrate and the second substrate.

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