KR102456500B1 - Method of manufacturing wire using conductive aramid fiber - Google Patents

Abstract

According to the present invention, disclosed is a wire using conductive aramid fibers using aramid fibers. The wire using conductive aramid fibers comprises: a core layer made of aramid fibers; a first plating layer formed on the outside of the core layer; and a graphene coating layer for coating graphene on the first plating layer. An embodiment of the present invention provides the wire using conductive aramid fibers, a coaxial cable, and a manufacturing method thereof which form a first plating layer on an aramid fiber and form a second plating layer after forming a graphene coating layer thereon so as to increase conductive efficiency of a signal.

Description

Method of manufacturing wire using conductive aramid fiber

The present invention relates to a wire using a conductive aramid fiber, a coaxial cable using the same, and a method of manufacturing a wire using the same. In particular, a first plating layer is formed on an aramid fiber, a graphene layer is formed thereon, and then a second plating layer is formed again to improve conductivity. It relates to a wire using a conductive aramid fiber having improved EMI shielding efficiency and improved solderability, a coaxial cable using the same, and a method of manufacturing the wire.

The content described below merely provides background information related to the present invention and does not constitute the prior art.

In general, a coaxial cable is widely used for transmission of an RF signal such as a cable television signal and a cellular phone broadcast signal.

The coaxial cable includes a central conductor, a dielectric layer having a predetermined thickness surrounding the central conductor, a primary shield layer formed coaxially with the central conductor, a secondary shield layer, and a shell surrounding the secondary shield layer surrounding the dielectric layer do.

The first shield layer is formed by overlapping and winding a dielectric layer with silver plating on copper foil, and the second shield layer is formed by wrapping the first shield layer by weaving it with silver plating on a copper wire.

However, when a signal is transmitted using the coaxial cable as described above, transmission signal loss occurs due to the conductivity of the central conductor and the primary shield layer and the permittivity of the dielectric layer. Effective reduction is paramount.

In the prior art, a method of improving shielding performance has been mainly used as a method for reducing transmission loss. Specifically, in order to lower the dielectric constant of the dielectric layer, the dimensional structure between the central conductor and the primary shield layer is improved and designed, or the dielectric of the dielectric layer is improved. In most cases, the characteristics are improved or the shielding characteristics of the primary shield layer are reinforced.

However, although the transmission loss of the coaxial cable can be reduced by improving the shielding performance using the above method, the transmission characteristics of the central conductor and the primary shield layer cannot be directly improved. In addition, even if the primary shield layer overlaps copper copper foil with silver plating and wraps Teflon, it is impossible to completely wind it. In the case of a thin coaxial cable, it is more difficult to perform primary shielding. It is very difficult to have high reliability in high-frequency, low-loss coaxial cables because tolerances are formed as the parts are widened.

On the other hand, with the advent of the 5G era in the mobile communication field, better signal characteristics of low-loss high-frequency coaxial cables are required.

In addition, this RF coaxial cable may be effectively applied to reduce weight for use in aircraft or electric vehicles.

In order to solve this conventional problem, Korean Patent Publication No. 2017-0142556 provides a high-frequency low-loss RF coaxial cable that can uniformly form the ground of the coaxial cable to stabilize the impedance and loss and improve the electromagnetic wave shielding performance. .

However, in this prior art, referring to FIG. 1 , a silver-plated copper braid layer 145 surrounding the silver-plated copper foil layer 140 is made of a silver-plated copper wire or a tin-plated copper wire. It is heavy and lacks electromagnetic wave shielding performance.

Republic of Korea Patent Publication No. 10-2017-0142556: 2017.12.28. open

The problem to be achieved by the present invention is to solve the conventional problem, by forming a first plating layer on aramid fiber, forming a graphene layer thereon, and then forming a second plating layer again to improve conductivity to increase EMI shielding efficiency and solder It is to provide a wire using an improved conductive aramid fiber, a coaxial cable using the same, and a method of manufacturing the wire.

In addition, the object to be achieved by the present invention is to solve the conventional problems, while reducing the weight while reducing the effect of electromagnetic wave shielding, to provide a wire using a conductive aramid fiber, a coaxial cable and a method of manufacturing the wire using the same.

In addition, the problem to be achieved by the present invention is to solve the conventional problems, and by using a wire plated on aramid fiber instead of a silver-plated copper wire or a tin-plated copper wire, the weight is reduced and the wire is flexible because it is flexible. It is to provide a wire using a conductive aramid fiber, which also improves lung properties, a coaxial cable using the same, and a method of manufacturing the wire.

Wire using aramid fiber according to the features of the present invention for achieving this technical problem,

A core layer made of aramid fibers;

a first plating layer formed outside the core layer;

a graphene coating layer coated with graphene on the first plating layer;

and a second plating layer formed on the graphene coating layer.

It further includes an antioxidant layer formed on the second plating layer.

The first plating layer is characterized in that it is formed of electroless copper in order to increase the conductivity.

The first plating layer is characterized in that it is formed by electroless nickel plating in order to improve corrosion resistance and environmental characteristics.

A coaxial cable using a wire according to the features of the present invention for achieving this technical problem,

central conductor;

a dielectric layer surrounding the central conductor and having a predetermined thickness;

a primary shield layer surrounding the dielectric layer and formed coaxially with the central conductor;

secondary shield layer;

and an outer skin surrounding the secondary shield layer,

The secondary shield layer has a structure in which a plurality of cables are wound,

The cable is

A core layer made of aramid fibers;

a first plating layer formed outside the core layer;

a graphene coating layer coated with graphene on the first plating layer;

and a second plating layer formed on the graphene coating layer.

A method of manufacturing a wire using an aramid fiber according to the features of the present invention for achieving this technical problem,

Surface-etching the surface of the core layer made of aramid fibers with alkali and attaching cations;

forming a first plating layer by plating the core layer to which the cations are attached by Pd metallization after treatment with a Pd/Sn colloidal solution;

coating a cation on the first plating layer;

forming a graphene oxide layer on the cation-coated first plating layer and reducing the graphene oxide;

and forming a second plating layer by electroplating on the graphene coating layer formed by forming the graphene oxide layer and reducing the graphene oxide.

The method is

The method further includes forming an antioxidant layer formed on the second plating layer.

The step of forming the first plating layer,

The first plating layer plated on the metal layer is characterized in that it is formed of electroless copper in order to increase conductivity.

The step of forming the first plating layer,

The first plating layer plated on the metal layer is characterized in that it is formed by electroless nickel plating in order to improve corrosion resistance and environmental characteristics.

Embodiments of the disclosed technology may have effects including the following advantages. However, since it does not mean that the embodiments of the disclosed technology should include all of them, the scope of the disclosed technology should not be understood as being limited thereby.

In an embodiment of the present invention, a first plating layer is formed on an aramid fiber, and a second plating layer is formed again after forming a graphene layer thereon. It is possible to provide a wire, a coaxial cable using the same, and a method of manufacturing the wire.

In addition, in an embodiment of the present invention, it is possible to provide a method of manufacturing a wire using a conductive aramid fiber, a coaxial cable and a wire using the same, reducing the effect of electromagnetic wave shielding while reducing the weight.

In addition, in the embodiment of the present invention, by using the wire plated on the aramid fiber instead of the silver-plated copper wire or the tin-plated copper wire, the weight is lighter and the wire shape is flexible so that the electromagnetic shielding properties are also improved. It is possible to provide a wire using the same, a coaxial cable using the same, and a method of manufacturing the wire.

1 is a view showing a general synchronous cable.
2 is a view showing a cross-section of a wire using a conductive aramid fiber according to an embodiment of the present invention.
3 is a view showing a method of manufacturing a wire using a conductive aramid fiber according to an embodiment of the present invention.
4 to 8 are views showing the state according to the manufacturing step of the wire using the conductive aramid fiber according to an embodiment of the present invention.

Since the present invention can have various changes and can have various embodiments, specific embodiments are illustrated in the drawings and described in detail in the detailed description. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention.

Terms such as first, second, A, and B may be used to describe various components, but the components are not limited by the above terms, and only for the purpose of distinguishing one component from other components. used only as For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component. and/or includes a combination of a plurality of related listed items or any of a plurality of related listed items.

A singular expression in terms used herein should be understood to include a plural expression unless the context clearly dictates otherwise. And terms such as "comprising" mean that the specified feature, number, step, operation, component, part, or a combination thereof exists, but one or more other features or number, step operation component, part It is to be understood that this does not exclude the possibility of the presence or addition of or combinations thereof.

Prior to a detailed description of the drawings, it is intended to clarify that the classification of the constituent parts in the present specification is merely a division according to the main function that each constituent unit is responsible for. That is, two or more components to be described below may be combined into one component, or one component may be divided into two or more for each more subdivided function.

In addition, each of the constituent units to be described below may additionally perform some or all of the functions of other constituent units in addition to the main function it is responsible for. Of course, it can also be performed by being dedicated to it. Therefore, the existence or non-existence of each component described through the present specification should be interpreted functionally.

2 is a view showing a cross-section of a wire using a conductive aramid fiber according to an embodiment of the present invention.

2, the wire using a conductive aramid fiber according to an embodiment of the present invention,

A core layer 210 made of aramid fibers;

a first plating layer 220 formed outside the core layer 210;

a graphene coating layer 230 coated with graphene on the first plating layer 220;

a second plating layer 240 formed on the graphene coating layer 230;

and an antioxidant layer 250 formed on the second plating layer 240 .

The first plating layer 220 is characterized in that it is formed of electroless copper in order to increase conductivity.

If necessary, the first plating layer 220 is characterized in that it is formed by electroless nickel plating to improve corrosion resistance and environmental characteristics.

A wire using a conductive aramid fiber using an aramid fiber according to an embodiment of the present invention having such a configuration, and a method of manufacturing the wire will be described as follows.

3 is a view showing a method of manufacturing a wire using a conductive aramid fiber according to an embodiment of the present invention, FIGS. 4 to 8 are a state according to the manufacturing step of a wire using a conductive aramid fiber according to an embodiment of the present invention the drawing shown.

Referring to FIG. 3 , first, the surface of the core layer 210 made of aramid fibers is etched with alkali and a step (S210) of attaching cations is performed.

Here, in the process of attaching the cations, the core layer 210 as shown in FIG. 4 may be immersed in a polyethyleneimine (PEI) solution exhibiting cationic properties and dried.

Next, the cation-attached core layer 210 is treated with a palladium/tin (Pd/Sn) colloidal solution, followed by palladium (Pd) metallization, and a step (S220) of forming the first plating layer 220 is performed.

Here, in order to form the first plating layer 220 on the aramid fiber or the like, a so-called catalizing treatment of precipitating a palladium-tin colloidal catalyst (hereinafter referred to as "Pd/Sn colloidal catalyst") on the surface is performed, and then, as necessary In accordance with the present invention, after a conductive treatment such as electroless plating or metallizing treatment is applied, metal electroplating may be performed.

Here, by adding a Pd/Sn colloidal catalyst adsorption accelerator, it is possible to increase the adsorption amount of the Pd/Sn colloidal catalyst on the surface of aramid fibers or the like. As a result, good plating can be performed by improving precipitation in subsequent electroplating.

The palladium/tin (Pd/Sn) colloidal catalyst adsorption promoter is lithium bromide, sodium bromide, aluminum bromide, potassium bromide, calcium bromide, strontium bromide, tin(II) bromide, cesium bromide, barium bromide, hydrobromic acid, silicon bromide ( IV), vanadium (III) bromide, manganese (II) bromide, iron (II) bromide, cobalt (II) bromide, nickel (II) bromide, palladium (II) bromide and gold (III) bromide Any one of the bromine compounds that generate bromine ions may be contained as an active ingredient. The amount of the bromine compound is 1-100 g/L as a bromine ion concentration.

If necessary, the first plating layer 220 may be formed of electroless copper to increase conductivity.

In addition, if necessary, the first plating layer 220 may be formed by electroless nickel plating in order to improve corrosion resistance and environmental characteristics.

Next, a step (S230) of coating the cations on the first plating layer 220 is performed. Here, since the graphene oxide (GO) is negative before processing in the graphene oxide (GO) solution in the following step, a cation attachment process is performed in advance on the surface of the first plating layer 220 in advance.

For example, the first plating layer 220 may be immersed in a cationic polyethyleneimine (PEI) solution to be coated, and then dried.

Next, a step (S240) of forming a graphene oxide layer on the cation-coated first plating layer 220 and reducing the graphene oxide is performed.

In this step, the graphene coating layer 230 of FIG. 7 is formed by the process of reduction to RGO, and there are various reducing agents used here.

Specifically, the cation-coated first plating layer 220 is brought into contact with an amine-based solution, the concentration is 0.1 to 3 g/L, the temperature is 40 to 80 degrees, and the time is 3 to 10 minutes.

Then, it is brought into contact with the graphene oxide solution, pH 3 to 6, 5 to 10 minutes, 35 to 80 degrees, 0.1 to 1 g/L. At this time, the graphene oxide is adsorbed to the amine compound.

Then, the reducing solution reduces the graphene oxide layer. At this time, the pH is 3 to 10, 5 to 10 minutes, 60 to 90 minutes, 0.5 to 2M.

And the reducing agent reduces GO to rGO to have a reduced layer. In this case, the reducing agent may be one of SnCl2, NaHPO4, Hl, HN2NH2, urea ascorbate, heparin, amino acid, gallic acid, thiophene, and aniline.

If necessary, the graphene coating layer 230 may be synthesized by chemical vapor deposition (CVD). For example, the catalyst metal wire such as the first plating layer 220 and a gas (CH4, C2H2, C2H4, CO, etc.) containing carbon are put into the chamber and heated, so that carbon is absorbed by the catalyst metal wire. Then, the graphene coating layer 230 may be synthesized by rapidly cooling to crystallize carbon.

Next, a step (S250) of forming the second plating layer 240 by electroplating on the graphene coating layer 230 formed by forming the graphene oxide layer and reducing the graphene oxide is performed.

Here, if it is used only as an electromagnetic shield (EMI shield), it is only necessary to perform only the above step (S240) of finishing the surface with RGO, and if it needs to be connected to the ground, soldering is required, so performing this step (S250) it is preferable

In this step ( S250 ), plating is performed with tin or silver as the second plating layer 240 as shown in FIG. 7 .

Next, the step of forming the antioxidant layer 250 formed on the second plating layer 240 (S260) is performed.

In this step (S260), an antioxidant is applied to the second plating layer 240 using an antioxidant to prevent oxidation, thereby forming the antioxidant layer 250 as shown in FIG. 8 .

Optionally, the antioxidant is an antioxidant consisting of 20-70% by weight of metallic chromium powder, 1-20% by weight of alumina powder, 2.5-25% by weight of a binder, 10-50% by weight of a solvent and 0.5-1.5% by weight of an antifoaming agent. It can be used to prevent oxidation, especially at high temperatures. In addition, various antioxidants are available.

The wire thus manufactured may be used in the coaxial cable of FIG. 1 .

A coaxial cable according to an embodiment of the present invention,

central conductor 110;

a dielectric layer 120 surrounding the central conductor and having a predetermined thickness;

a primary shield layer (130, 140) surrounding the dielectric layer and formed coaxially with the central conductor;

secondary shield layer 145;

and an outer shell 150 surrounding the secondary shield layer 145,

The secondary shield layer 145 has a structure in which a plurality of wires are wound,

The wire is

A core layer 210 made of aramid fibers;

a first plating layer 220 formed outside the core layer 210;

a graphene coating layer 230 coated with graphene on the first plating layer 220;

a second plating layer 240 formed on the graphene coating layer 230;

and an antioxidant layer 250 formed on the second plating layer 240 .

In an embodiment of the present invention, a first plating layer is formed on the aramid fiber, and a second plating layer is formed again after forming a graphene layer thereon to improve conductivity, thereby increasing EMI shielding efficiency and improving solderability.

In addition, in an embodiment of the present invention, by using a wire plated on an aramid fiber instead of a silver-plated copper wire or a tin-plated copper wire, the weight is lightened and the electromagnetic shielding properties are also improved because it is flexible in the form of a wire.

In addition, in the embodiment of the present invention, corrosion resistance and environmental characteristics can be improved.

In addition, in the embodiment of the present invention, it is possible to reduce the influence of electromagnetic wave shielding while reducing the weight.

One embodiment of the technology disclosed in the present invention has been described with reference to the embodiment shown in the drawings for better understanding, but this is only exemplary, and those of ordinary skill in the art may make various modifications and equivalents therefrom. It will be appreciated that embodiments are possible. Accordingly, the true technical protection scope of the disclosed technology should be defined by the appended claims.

Claims (7)

delete delete delete delete delete Surface-etching the surface of the core layer made of aramid fibers with alkali and attaching cations;
forming a first plating layer by plating the core layer to which the cations are attached by Pd metallization after treatment with a Pd/Sn colloidal solution;
coating a cation on the first plating layer;
forming a graphene oxide layer on the cation-coated first plating layer and reducing the graphene oxide;
forming the graphene oxide layer and forming a second plating layer on the graphene coating layer formed by reducing the graphene oxide by electroplating;
Forming an antioxidant layer on the second plating layer,

The step of forming the first plating layer,
In order to form the first plating layer on the aramid fiber, the palladium-tin colloidal catalyst is deposited on the surface of the catalyzing treatment to precipitate, and then, electroless plating or metallizing treatment is applied, followed by metal electroplating,
By adding the palladium-tin colloidal catalyst adsorption accelerator to increase the adsorption amount of the palladium-tin colloidal catalyst on the surface of the aramid fiber,
The palladium-tin colloidal catalyst adsorption promoter is lithium bromide, sodium bromide, aluminum bromide, potassium bromide, calcium bromide, strontium bromide, tin(II) bromide, cesium bromide, barium bromide, hydrobromic acid, silicon(IV) bromide, vanadium bromide. (III), manganese (II) bromide, iron (II) bromide, cobalt (II) bromide, nickel (II) bromide, any one of a compound selected from the group consisting of palladium (II) bromide and gold (III) bromide, It may contain a bromine compound that generates bromine ions as an active ingredient,

The step of forming a graphene oxide layer on the cation-coated first plating layer and reducing the graphene oxide,
After contacting the first plating layer coated with the cations with an amine-based solution,
It is characterized in that the graphene oxide layer is reduced by contacting the graphene oxide solution,

In the step of forming the graphene oxide layer and forming a second plating layer by electroplating on the graphene coating layer formed by reducing the graphene oxide,
The second plating layer is plated with tin or silver,

Used in the step of forming an antioxidant layer on the second plating layer,
The antioxidant is characterized in that it consists of metal chromium powder, alumina powder, a binder, a solvent and an antifoaming agent.
A method of manufacturing a wire using conductive aramid fibers. delete

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