KR102450596B1 - Nand-type flash memory and manufacturing method thereof - Google Patents

Abstract

[Problem] To provide a NAND-type flash memory capable of reducing the planar size of a memory cell.
[Solution] The NAND flash memory having a three-dimensional structure of the present invention has a substrate, an insulating layer, a lower conductive layer (source), a memory cell structure having a three-dimensional structure, and a bit line. The memory cell structure includes a plurality of strip-type gate stacks including stacks of insulators and conductors stacked in a vertical direction from a substrate, and a plurality of channels spaced apart along one side of the gate stacked body. including laminates. The upper end of the channel stack is electrically connected to the orthogonal bit lines, and the lower end of the channel stack is electrically connected to the lower conductive layer.

Description

NAND-type flash memory and manufacturing method thereof

The present invention relates to a NAND-type flash memory and a manufacturing method thereof, and more particularly, to a NAND-type flash memory having a three-dimensional structure.

In recent years, in order to improve the degree of integration of memory cells, a NAND flash memory having a three-dimensional structure in which memory cells are vertically stacked has been put to practical use. For example, a memory cell is formed using the semiconductor pillar extending in the vertical direction from a board|substrate (patent document 1).

Further, in Non-Patent Document 1, as shown in FIG. 1, a plurality of gates having a rectangular shape are stacked on a substrate, and an insulator including a charge storage layer (eg, a silicon nitride layer) is provided. and thin film channels are formed in a vertical direction along the ends of the gates. The thin film channel is made of polycrystalline silicon and has a U-shape. One NAND string is composed of one U-shaped thin film channel, an insulator including a charge accumulation layer, and a gate. One upper end of the thin film channel is connected to the local source line through a plug, and the other upper end is connected to the bit line through the plug. FIG. 2A is a cross-sectional view when the thin film channel of the flash memory of FIG. 1 is cut in a horizontal direction, and FIG. 2B is a cross-sectional view when the thin film channel is cut in a vertical direction. The black oval-shaped portion shown in Fig. 2A is a hole formed by etching, and this hole is an insulating region that insulates a thin film channel formed along the poly gate. This pitch is 100 nm. In addition, the pitch between adjacent poly gates is 220 nm.

[Patent Document 1] Japanese Patent Laid-Open No. 2015-176870

[Non-Patent Document 1] A Novel Double-density, Single-Gate Vertical Channel (SGVC) 3D NAND Flash That Is Tolerant to Deep Vertical Etching CD Variation and Process Robust Read-disturb Immunity, Hang-Ting Lue et al, IEEE International Electron Devices Meeting (IEDM) 15-44, P321-324

An object of the present invention is to provide a NAND-type flash memory capable of reducing the planar size of a memory cell compared to the prior art, and a method for manufacturing the same.

A NAND-type flash memory having a three-dimensional structure according to the present invention comprises a substrate, a lower conductive layer formed in or on the substrate, and a plurality of laminates extending in a first direction on the lower conductive layer, Each of the plurality of stacked bodies includes the plurality of stacked bodies including stacks of insulators and conductors stacked in a vertical direction from the substrate, and a plurality of stacked bodies arranged to be spaced apart along one side surface of the plurality of stacked bodies In the channel laminate of In the plurality of channel stacks, the lower end of the channel thin film is electrically connected to the lower conductive layer, and the plurality of upper conductive layers of strip type extending in a second direction orthogonal to the first direction, Each of the plurality of upper conductive layers includes the plurality of upper conductive layers disposed on the plurality of channel stacks and electrically connected to upper ends of the intersecting channel thin films.

A method for manufacturing a NAND-type flash memory having a three-dimensional structure according to the present invention comprises the steps of forming a lower conductive layer in or on a substrate, and alternately stacking an insulator and a conductor on the lower conductive layer. Forming a stack; etching the stack to a depth reaching the lower conductive layer to form a plurality of laminates extending in a first direction; Forming a channel stack in the stack, etching the channel stack so as to be spaced apart along one side of each of the plurality of stacks, and on the channel stack, orthogonal to a first direction forming a plurality of upper conductive layers in a strip shape extending in a second direction, and electrically connecting to an upper end of the channel stack that crosses each of the plurality of upper conductive layers.

According to the present invention, since the channel stacked body spaced apart along one side of the stacked body is arranged and electrically connected to the channel stacked body where the upper conductive layer intersects, the planar size of one memory cell is smaller than that of the prior art. can do. Accordingly, a NAND-type flash memory having a high degree of integration can be obtained.

[Fig. 1] Fig. 1 is a schematic perspective view of a conventional NAND-type flash memory having a three-dimensional structure.
[FIG. 2A] It is a top view of the flash memory shown in FIG.
[FIG. 2B] It is a cross-sectional view of the flash memory shown in FIG.
3A is a top view of a NAND-type flash memory according to an embodiment of the present invention, and FIG. 3B is a top view showing the positional relationship between the channel stack and the gate stack. it is do
4 is a schematic cross-sectional view taken along line AA of a NAND-type flash memory according to an embodiment of the present invention.
5 is a schematic cross-sectional view taken along line BB of a NAND-type flash memory according to an embodiment of the present invention.
6 is a schematic cross-sectional view taken along line CC of a NAND-type flash memory according to an embodiment of the present invention.
7 is a schematic perspective view for explaining a manufacturing process of a NAND-type flash memory according to an embodiment of the present invention.
8 is a schematic perspective view for explaining a manufacturing process of a NAND-type flash memory according to an embodiment of the present invention.
9 is a schematic cross-sectional view taken along line AA for explaining a manufacturing process of a NAND-type flash memory according to an embodiment of the present invention.
10 is a schematic cross-sectional view taken along line AA for explaining a manufacturing process of a NAND-type flash memory according to an embodiment of the present invention.
[FIG. 10A] It is a schematic cross-sectional view for demonstrating the manufacturing process of the channel stack shown in FIG.
[FIG. 10B] It is a schematic cross-sectional view for demonstrating the manufacturing process of the channel stack shown in FIG.
[FIG. 10C] It is a schematic sectional drawing for demonstrating the manufacturing process of the channel stack shown in FIG.
[FIG. 10D] It is a schematic cross-sectional view for demonstrating the manufacturing process of the channel stack shown in FIG.
[FIG. 11] A schematic cross-sectional view along the CC line for explaining a manufacturing process of a NAND-type flash memory according to an embodiment of the present invention.
12 is a schematic cross-sectional view taken along the CC line for explaining a manufacturing process of a NAND-type flash memory according to an embodiment of the present invention.
13 is a schematic cross-sectional view taken along the CC line for explaining a manufacturing process of a NAND-type flash memory according to an embodiment of the present invention.
14 is a schematic cross-sectional view taken along line AA for explaining a manufacturing process of a NAND-type flash memory according to an embodiment of the present invention.
[Fig. 15] A schematic cross-sectional view taken along line AA for explaining a manufacturing process of a NAND-type flash memory according to an embodiment of the present invention.
[Fig. 16] A schematic cross-sectional view taken along line AA for explaining a manufacturing process of a NAND-type flash memory according to an embodiment of the present invention.
[Fig. 17] A schematic cross-sectional view taken along line AA for explaining a manufacturing process of a NAND-type flash memory according to an embodiment of the present invention.
[Fig. 18] A schematic cross-sectional view taken along line AA for explaining a manufacturing process of a NAND-type flash memory according to an embodiment of the present invention.
[Fig. 19] Fig. 19 (A) is a top view of a NAND-type flash memory according to an embodiment of the present invention, schematically showing a state in which there is no contact with a bit line, and Fig. 19 (B) is, A top view of a state with bit lines and contacts is schematically shown.
[Fig. 20] Fig. 20 (A) is a top view of a conventional NAND-type flash memory, schematically showing a state without a bit line and a plug, and Fig. 20 (B) is a top view of a bit line and a plug. A top view of the present state is schematically shown.

The NAND-type flash memory having a three-dimensional structure according to the present invention is used as a memory medium in various semiconductor devices (for example, a microcontroller, microprocessor, logic, etc. incorporating such a flash memory).

[Example]

Next, an embodiment of the present invention will be described with reference to the drawings. It should be noted that the scale of the drawings is exaggerated to facilitate understanding of the invention, and does not necessarily represent the scale of an actual product.

The NAND type flash memory 100 of this embodiment has a substrate 1, an insulating layer 2 formed on the substrate 1, a lower conductive layer 3 formed on the insulating layer 2, and a lower conductive layer. It is configured to include a memory cell structure MC vertically stacked on the layer 3 and a bit line 8 formed on the memory cell structure MC.

Although the board|substrate 1 is not specifically limited, For example, it is comprised from a silicon substrate. The silicon substrate may be any of true, n-type, and p-type. In the case where peripheral circuits (for example, integrated circuits such as row selection driving circuits and page buffer/sense circuits) are formed on the surface of the silicon substrate, the silicon substrate may be configured as n-type or p-type. . In the following description, a case in which a silicon substrate is used as the substrate 1 is exemplified.

The insulating layer 2 formed on the silicon substrate 1 is composed of, for example, a silicon oxide film, a silicon nitride film, or the like. The lower conductive layer 3 is composed of, for example, n-type polycrystalline silicon or a lamination of a metal material and n-type polycrystalline silicon. The lower conductive layer 3 functions as a common source SL of the NAND string.

The memory cell structure MC includes a plurality of NAND strings formed on the lower conductive layer 3 in a vertical direction or in a vertical direction. As is known, one NAND string includes a plurality of memory cells connected in series, a bit line-side selection transistor connected to one end of the plurality of memory cells, and a source line connected to the other end of the plurality of memory cells. It includes a side select transistor. Note that the NAND string may include a dummy memory cell between the bit line side selection transistor and the memory cell or between the source line side selection transistor and the memory cell.

On the lower conductive layer 3, a gate stacked body 110 in which an insulator 4 and a conductor 5 are alternately stacked is formed. As shown in FIG. 3, the gate stacked body 110 is processed so that a planar view becomes a strip shape (spherical shape), and they are extended in a stripe pattern in the column direction. . The uppermost layer of the gate stack 110 is the insulator 6 contacting the bit line 8 through the insulator 7 , and the bottom layer is the insulator 4 contacting the lower conductive layer 3 . The insulators 4 and 6 are made of, for example, a silicon oxide film or a silicon nitride film. The conductor 5A directly below the insulator 6 constitutes the gate of the bit line side selection transistor, and the conductor 5B directly above the insulator 4 at the lowest layer is on the source line side. It constitutes the gate of the selection transistor. A plurality of conductors 5 between the conductors 5A and 5B respectively constitute a gate of the memory cell. The conductors 5, 5A, and 5B are made of, for example, n-type polycrystalline silicon. The conductor 5A constituting the gate of the bit line side selection transistor is connected to one or a plurality of selection gate lines SGD generated by a row selection driving circuit not shown or the like, and connects the gate of the source line side selection transistor. The constituent conductors 5B are connected to one or a plurality of selection gate lines SGS generated by the same row selection driving circuit or the like, and the plurality of conductors 5 are connected to the corresponding word lines WL. connected

The memory cell structure MC further includes a channel stack 9 . As shown in FIG. 3B, FIG. 4, and FIG. 6, the channel laminated body 9 is spaced apart in the column direction so that it may be along one side surface of the gate laminated body 110, and is formed. One channel stack 9 extends vertically from the lower conductive layer 3 to the bit line 8, and is connected to the bit line 8 where the upper end 9A of the channel stack 9 intersects. and the lower end 9B is connected to the lower conductive layer 3 . In this example, the upper end 9A of the channel stacked body 9 is formed so as to cover a part of the insulator 6 of the gate stacked body 110 . This is to increase the contact area between the channel stack 9 and the bit line 8 . However, such a structure is an example, and is not limited to this.

One NAND string includes one channel stack 9 extending in the vertical direction. The channel stacked body 9 includes a channel thin film constituting a channel, and a gate insulator formed between the channel thin film and the gate 5 . The channel thin film is made of, for example, polycrystalline silicon. The gate insulator includes a charge storage layer for accumulating electric charges and a plurality of insulating layers with the charge storage layer interposed therebetween. The gate insulator may have, for example, an ONO structure of silicon oxide film (O)/silicon nitride film (N)/silicon oxide film (O). It is also possible to use other high dielectric constant semiconductor materials in place of the silicon oxide film. In addition, the detail of the channel laminated body 9 is mentioned later.

As described above, on one side surface of the gate stacked body 110, a plurality of channel stacked bodies 9 are formed to be spaced apart, and an insulator 7 is formed between these channel stacked bodies 9 . In addition, an insulator 7 is also formed on the other side of the gate stacked body 110 . In other words, the insulator 7 is filled in the space between the two adjacent gate stacked bodies.

Above the memory cell structure MC, as shown in Fig. 3A, a plurality of bit lines 8 processed to form a strip shape (spherical shape) in plan view are arranged in a stripe shape in the row direction. is published as Each of the plurality of bit lines 8 is electrically connected to the upper end 9A of the corresponding channel stack 9 at a position intersecting the gate stack 110 . The bit line 8 is made of, for example, a metal material such as polycrystalline silicon or Al.

Next, a method of manufacturing the NAND-type flash memory of the present embodiment will be described with reference to FIGS. 7 to 18 . First, as shown in FIG. 7 , an insulating layer 2 is formed on a substrate 1 , and a lower conductive layer 3 is formed on the insulating layer 2 . Next, on the lower conductive layer 3 , a stack 110A including a stack of the insulators 4 and 6 and the conductor 5 is formed. The stack 110A is a precursor of the gate stack 110 . The number of conductors 5 stacked in stack 110A is determined by the number of memory cells in the NAND string (eg, 32 or 64).

Next, a patterned etching mask (not shown) is formed on the insulator 6 using a photo lithography process, and the insulators 4 and 6 and the conductors ( 5) is simultaneously anisotropically etched. This etching is performed until the lower conductive layer 3 is reached. This etching is performed by, for example, anisotropic etching or a combination of anisotropic etching and isotropic etching. On the surface of the lower conductive layer 3 , minute steps or recesses removed by etching may be formed, but the lower conductive layer 3 is sufficiently formed with respect to these steps or recesses. It is preferable that it is a large film thickness. In this way, on the lower conductive layer 3, as shown in FIG. 8, a strip-shaped gate stacked body 110 extending in the column direction is formed. The pitch P between the gate stacked bodies 110 is, for example, 180 nm. Fig. 9 is a cross-sectional view taken along line A-A (line A-A is the same position as line A-A in Fig. 3).

Next, as shown in FIG. 10 , a channel stack 9 is formed on the entire surface of the substrate to cover the gate stack 110 . The configuration of the channel stacked body 9 will be described with reference to FIGS. 10A to 10D . The enlarged cross-sectional views of FIGS. 10B to 10D correspond to the regions Q1 and Q2 shown in FIG. 10A , respectively.

As shown in FIG. 10B , an insulating layer 10 , a charge accumulation layer 11 , an insulating layer 12 and a polysilicon layer 13 are sequentially stacked on the entire surface of the substrate to cover the gate stacked body 110 . . Although the formation method of such a film|membrane is not specifically limited, For example, CVD and sputtering are used. The insulating layer 12 is made of silicon dioxide (SiO ₂ ), or a stack of silicon dioxide (SiO ₂ ) and silicon nitride (SiN). The charge accumulation layer 11 is constituted by several insulators, and is constituted by, for example, a stack of silicon nitride (SiN) or silicon dioxide (SiO ₂ ) capable of storing electric charges. The insulating layer 10 is composed of some insulator such as a HiK material having a high dielectric constant. The polycrystalline silicon layer 13 is No Doping, and is therefore made of intrinsic silicon.

Next, using an etching mask (not shown) here, as shown in FIG. 10C , the bottom of the insulating layer 10 , the charge storage layer 11 , the insulating layer 12 , and the polysilicon layer 13 . ) is etched. This etching is performed by, for example, anisotropic etching or a combination of anisotropic etching and isotropic etching, and is performed until the surface of the lower conductive layer 3 is exposed. Although minute steps or recesses removed by etching may be formed on the surface of the lower conductive layer 3, the lower conductive layer 3 has a sufficiently large film thickness for these steps or recesses. It is preferable to be Next, as shown in Fig. 10D, a polycrystalline silicon layer 14 is deposited on the entire surface of the substrate. The polycrystalline silicon layer 14 is also No Doping, and therefore intrinsic silicon. The two polycrystalline silicon layers 13 and 14 are electrically connected to each other, and the lower end of the polycrystalline silicon layer 14 is electrically connected to the lower conductive layer 3 . In this way, the channel stacked body 9 is formed so as to cover both sides of the gate stacked body 110 . Fig. 11 is a cross-sectional view taken along the line C-C in Fig. 3 .

Next, as shown in Fig. 12, the channel stacked body 9 is processed into a plurality of stripes by etching, and a plurality of channel stacked bodies 9 insulated from each other are formed. As shown in FIG. 13 , one channel stacked body 9 is extended in a direction perpendicular to the direction in which the gate insulator 110 extends, and the plurality of channel stacked bodies 9 have a gate insulator 110 . They are spaced apart at a constant pitch in the direction of extension and are arranged.

Next, the channel laminate 9 is further processed so as to conform to one side surface of the gate insulator 110 . 14 to 16 show this processing flow. 14 to 16 are cross-sectional views taken along the line A-A in FIG. 13 . As shown in FIG. 14 , an etching mask 15 patterned using a photolithography process is formed to cover a portion of the side and top surfaces of the channel stack 9 .

Next, as shown in FIG. 15 , etching is performed to partially remove the channel stacked body 9 through the etching mask 15 . This etching is performed by, for example, anisotropic etching or a combination of anisotropic etching and isotropic etching, and is performed until the surface of the lower conductive layer 3 is exposed. Although minute steps or recesses removed by etching may be formed on the surface of the lower conductive layer 3, the lower conductive layer 3 has a sufficiently large film thickness for these steps or recesses. It is preferable to be By this etching, the channel stacked body 9 is left on one side surface of the gate insulator 110 and covers a part of the insulator 6 of the gate stacked body 110 . The reason for forming the channel stack 9 so as to cover the insulator 6 is to increase the contact area with the bit line 8 or to form a contact hole for connection with the bit line. to increase the area for In addition, the bottom of the channel stacked body 9 is separated from the bottom of the channel stacked body 9 of the adjacent gate stacked body 110, and the lower conductive layer 3 is exposed there.

Next, as shown in Fig. 16, the etching mask 15 is removed. After the etching mask 15 is removed, an intermediate insulator 7 is deposited over the entire surface of the substrate so as to cover the channel stack 9 and the gate stack 110 . Accordingly, the space between the adjacent gate stacked bodies 110 is filled with the intermediate insulator 7 .

Next, as shown in Fig. 17, the intermediate insulator 7 is planarized by CMP or the like. By this planarization process, the top of the channel laminate 9 is exposed.

Next, as shown in Fig. 18, the material of the bit line is deposited on the entire surface of the substrate, and then the bit line 8 is patterned into strips. The bit line 8 is electrically connected to the polysilicon layers 13 and 14 of the channel stack 9 which intersect directly under it. Here, an example in which the bit line 8 directly contacts the upper end 9A of the channel laminate 9 is shown, but an interlayer insulating film is formed after the planarization process, and a contact hole is formed in the interlayer insulating film to form the channel laminate ( 9) may be exposed so that the bit line 8 and the channel stack 9 are electrically connected through a contact hole.

In this way, a NAND string connected between the bit line 8 and the lower conductive layer (source) 3 is formed, and a memory cell array having a three-dimensional structure can be obtained.

Next, the cell size of the NAND-type flash memory having the three-dimensional structure of the present embodiment is compared with that of the conventional product. Fig. 19B schematically shows a top view of the flash memory of this embodiment, and Fig. 19A shows a bit line 8, a bit line 8, a channel thin film 19, A top view without the BL contact 16 between them is schematically shown. In these figures, reference numeral 18 denotes a gate insulating film (insulators 10, 11, 12 shown in Fig. 10B), and reference numeral 19 denotes a channel thin film (polycrystalline silicon 13, 14 shown in Fig. 10D). )to be. A rectangular region R indicated by a broken line indicates the planar size of one memory cell. When the pitch of the gate 5 is 180 nm and the pitch of the channel thin film 19 is 50 nm, the plane size R is 50×180 nm ² .

On the other hand, FIG. 20B schematically shows a top view of the conventional memory cell structure shown in Non-Patent Document 1, and FIG. 20A is a bit line 8 and a bit line BL. ) and the channel thin film 19 are schematically shown in the top view without the plug 17 for contact. The rectangular region R1 represents the planar size of one memory cell, which is shown on the same scale as that of FIG. 20A .

In the conventional memory cell structure, two memory cells are formed on both sides of the gate 5, and the bit line 8 is commonly connected to the two opposing memory cells. For example, the two memory cells MC1 and MC2 are connected to the bit line 8 via a plug 17 . In order to individually operate the two memory cells, the bit lines 8 connected to the two memory cells must be isolated from each other. In contrast, in the memory cell structure of the present embodiment, the memory cells are arranged on only one side of the gate 5 . Therefore, the bit line 8 connected to the two memory cells may be common. According to this difference, the pitch of the bit lines 8 of this embodiment is about half that of the conventional bit lines 8, and the plane size R of the memory cells of this embodiment is the same as the plane of the conventional memory cells. It can be made smaller than the size (R1). Specifically, the planar size R1 of the conventional memory cell is about 160×100 nm ² , and it can be seen that the planar size R of the memory cell of this embodiment is smaller than that of the conventional one.

In the above embodiment, although an example of forming the lower conductive layer (source) 3 made of n-type polycrystalline silicon through the insulating layer 2 on the substrate 1 is shown, it is not limited thereto, and the lower conductive layer The (source) may be, for example, a highly doped n-type well region formed in a P-type silicon substrate.

A NAND-type flash memory includes a plurality of blocks, and each block includes a NAND string having a three-dimensional structure as described above. The memory cell may be an SLC type that stores one bit (binary data) or a type that stores multiple bits. In NAND type flash memory, reading and programming are performed in units of pages, and erase is performed in units of blocks. Since these operations are well known, their description is omitted here.

Although the preferred embodiment of the present invention has been described above, the present invention is not limited to the specific embodiment, and various modifications and changes can be made within the scope of the gist of the invention described in the claims.

1: substrate
2: Insulation layer
3: lower conductive layer
4: insulator
5, 5A, 5B: conductor
6: Insulator
7: Insulator
8: bit line
9: Channel Laminate
9A: upper part
9B: lower part
13: polycrystalline silicon layer
14: polycrystalline silicon layer
15: etching mask
16: contact
17: plug
100: flash memory
110: gate laminate
MC: memory cell stack

Claims (12)

In a NAND-type flash memory having a three-dimensional structure,
board and
a lower conductive layer formed in or on the substrate;
In the plurality of laminates extending in a first direction on the lower conductive layer, each of the plurality of laminates includes a laminate of an insulator and a conductor laminated in a vertical direction from the substrate. Chewa,
In the plurality of channel stacked bodies arranged to be spaced apart along one side surface of the plurality of stacked bodies, each of the plurality of channel stacked bodies includes an insulating layer including a charge storage layer and a channel thin film, and the insulating layer and the channel thin film extends in a vertical direction from the substrate, and a lower end of the channel thin film is electrically connected to the lower conductive layer;
In the plurality of upper conductive layers extending in a second direction orthogonal to the first direction, each of the plurality of upper conductive layers is disposed on the plurality of channel stacks and is electrically connected to the upper end of the intersecting channel thin film. connected, the plurality of upper conductive layers
including,
One laminate includes the one side surface and the other side surface opposite to the one side surface,
The channel laminate and the insulator are disposed between one side surface of the first laminate and the other side surface of the second laminate adjacent in the second direction.
A NAND-type flash memory with a three-dimensional structure. According to claim 1,
The plurality of channel stacked bodies are disposed at a first pitch in a first direction,
One NAND string includes one channel stack.
A NAND-type flash memory with a three-dimensional structure. 3. The method of claim 2,
The plurality of laminates are arranged at a second pitch in a second direction,
The plane size of one memory cell is,
defined by the first pitch and the second pitch
A NAND-type flash memory with a three-dimensional structure. delete 4. The method according to any one of claims 1 to 3,
The upper conductive layer is a bit-line,
The lower conductive layer is a source-line,
The conductor formed on the uppermost layer of the laminate is the gate of the bit line side selection transistor,
The conductor formed in the lowermost layer is the gate of the source line side selection transistor.
A NAND-type flash memory with a three-dimensional structure. 6. The method of claim 5,
The conductor between the conductor of the uppermost layer and the conductor of the lowest layer of the laminate is,
the gate of the transistor of the memory cell and connected to the corresponding word-line
A NAND-type flash memory with a three-dimensional structure. A method for manufacturing a NAND-type flash memory having a three-dimensional structure, the method comprising:
forming a lower conductive layer in or on the substrate;
forming a stack in which an insulator and a conductor are alternately stacked on the lower conductive layer;
etching the stack to a depth reaching the lower conductive layer to form a plurality of laminates extending in a first direction;
forming a channel laminate on the entire surface of the substrate including the plurality of laminates;
etching the channel laminate so as to be spaced apart along one side of each of the plurality of laminates;
forming a plurality of upper conductive layers extending in a second direction orthogonal to the first direction on the channel stack;
electrically connecting to an upper end of the channel stack that crosses each of the plurality of upper conductive layers
A method of manufacturing a NAND-type flash memory having a three-dimensional structure. 8. The method of claim 7,
Forming the channel laminate includes:
forming a first insulating layer;
forming a charge accumulation layer on the first insulating layer;
forming a second insulating layer on the charge accumulation layer;
forming a channel thin film on the second insulating layer
A method of manufacturing a NAND-type flash memory having a three-dimensional structure, comprising: 8. The method of claim 7,
The connecting step is
forming a contact hole in an insulating film formed on the channel stacked body;
including,
The upper conductive layer is
electrically connected to the upper end of the channel stack through a contact hole
A method of manufacturing a NAND-type flash memory having a three-dimensional structure. 8. The method of claim 7,
The manufacturing method is
After etching the channel stack,
forming an insulating film to cover the plurality of channel stacks and the plurality of stacked bodies;
exposing the channel stack by planarizing the insulating layer
A method of manufacturing a NAND-type flash memory having a three-dimensional structure further comprising a. 8. The method of claim 7,
The film thickness of the lower conductive layer is,
When the stack is etched, it is sufficiently larger than the step or recess formed on the surface of the lower conductive layer.
A method of manufacturing a NAND-type flash memory having a three-dimensional structure. 8. The method of claim 7,
The film thickness of the lower conductive layer is,
When the channel stack is etched, it is sufficiently larger than the step or recess formed on the surface of the lower conductive layer.
A method of manufacturing a NAND-type flash memory having a three-dimensional structure.

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