KR102441698B1 - Thermo electric device - Google Patents

Abstract

An embodiment relates to a thermoelectric element having improved connection characteristics with an external wiring, comprising: a first substrate including a first electrode and a second substrate including a second electrode; an N-type cell and a P-type cell disposed between the first substrate and the second substrate and electrically connected through the first electrode and the second electrode; and an electrode pad disposed on the first electrode so as to protrude from an edge of the first substrate, electrically connected to the first electrode, and including an electrode pad including a groove for fastening with an external wiring, wherein the groove includes one of the wirings The ends are inserted and fixed.

Description

Thermoelectric element {THERMO ELECTRIC DEVICE}

The embodiment relates to a thermoelectric device having improved reliability.

The thermoelectric phenomenon is a phenomenon in which heat and cooling are made at both ends of a material junction by applying an electric current between two materials (Peltier effct) or, conversely, an electromotive force is generated by the temperature difference between two materials (Seebeck effect). The thermoelectric element refers to a metal or ceramic element having a function of directly converting heat into electricity or electricity into heat by using the thermoelectric phenomenon as described above.

Thermoelectric devices can convert heat generated from computers or automobile engines into electrical energy by using the Seebeck effect. And, by using the Peltier effect (Peltier effct) it is possible to implement various cooling systems that do not require a refrigerant.

In the thermoelectric element, N-type and P-type cells are disposed between an upper substrate and a lower substrate, and the N-type and P-type cells are connected to each other through solder. In addition, the thermoelectric element may be connected to a wiring to receive power from the outside.

However, when the thermoelectric element is miniaturized, an area in which the wiring and the thermoelectric element are connected is narrow, and thus poor connection may occur, thereby reducing the reliability of the thermoelectric element. In addition, in general, since the wiring and the thermoelectric element are connected using a soldering method, sufficient soldering space must be secured. Since soldering is performed on the lower substrate, the area of N-type and P-type cells is reduced when securing space for soldering. decreases.

The embodiment provides a thermoelectric element having improved connection characteristics with an external wiring.

The thermoelectric element of the embodiment includes a first substrate including a first electrode and a second substrate including a second electrode; an N-type cell and a P-type cell disposed between the first substrate and the second substrate and electrically connected through the first electrode and the second electrode; and an electrode pad disposed on the first electrode so as to protrude from an edge of the first substrate, electrically connected to the first electrode, and including an electrode pad including a groove for fastening with an external wiring, wherein the groove includes one of the wirings The ends are inserted and fixed.

In addition, the thermoelectric element according to the embodiment includes a first substrate including a first electrode and a second substrate including a second electrode; an N-type cell and a P-type cell disposed between the first substrate and the second substrate and electrically connected through the first electrode and the second electrode; and an electrode pad disposed on the first electrode so as to protrude from the edge of the substrate, electrically connected to the first electrode, and including an electrode pad including a groove fastened to an external wiring, and inserted from an upper surface of the electrode pad to insert the electrode pad and a screw for fixing the wiring.

According to an embodiment, in the thermoelectric element, since the external wiring is inserted into the groove of the electrode pad to electrically connect the external wiring and the first electrode, the fastening force may be improved. Furthermore, fixing force between the electrode pad and the external wiring can be improved by using screws or forming the electrode pad with a heat shrinkable material.

In particular, since the external wiring and the electrode pad are coupled from the outside of the first substrate, it is necessary to secure a sufficient area for the connection with the wiring in the first substrate, but in the embodiment of the present invention, it is necessary to secure an additional area on the first substrate. none.

1 is a perspective view of a thermoelectric element according to an embodiment of the present invention.
FIG. 2A is a plan view of the connection area A of FIG. 1 .
FIG. 2B is a cross-sectional view taken along line I-I' of FIG. 2A.
3 is a cross-sectional view of pressing a bonding portion between an electrode pad and a wiring.
4 is a photograph showing a defective connection between the thermoelectric element and the wiring.
5A is a plan view of a connection area according to another embodiment of the present invention.
5B is a cross-sectional view taken along line I-I' of FIG. 5A.
6A to 6E are cross-sectional views illustrating a method of manufacturing a thermoelectric device according to an embodiment of the present invention.

Since the present invention may have various changes and may have various embodiments, specific embodiments will be illustrated and described in the drawings. However, this is not intended to limit the embodiment of the present invention to a specific embodiment, and it should be understood to include all changes, equivalents, or substitutes included in the spirit and scope of the embodiment.

Terms including an ordinal number, such as first, second, etc., may be used to describe various elements, but the elements are not limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the second component may be referred to as the first component, and similarly, the first component may also be referred to as the second component. and/or includes a combination of a plurality of related listed items or any of a plurality of related listed items.

When a component is referred to as being “connected” or “connected” to another component, it may be directly connected or connected to the other component, but other components may exist in between. will have to be understood On the other hand, when it is said that a certain element is "directly connected" or "directly connected" to another element, it should be understood that no other element is present in the middle.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the embodiments of the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as "comprise" or "have" are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It is to be understood that it does not preclude the possibility of the presence or addition of numbers, steps, operations, components, parts, or combinations thereof.

In the description of the embodiment, in the case where one component is described as being formed on "on or under" of another component, above (above) or below (below) (on or under) includes both components in which two components are in direct contact with each other or in which one or more other components are disposed between the two components indirectly. In addition, when expressed as "up (up) or down (on or under)", the meaning of not only an upward direction but also a downward direction based on one component may be included.

Hereinafter, the embodiment will be described in detail with reference to the accompanying drawings, but the same or corresponding components are given the same reference numerals regardless of reference numerals, and overlapping descriptions thereof will be omitted.

Hereinafter, a thermoelectric device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of a thermoelectric element according to an embodiment of the present invention. FIG. 2A is a plan view of the connection region A of FIG. 1 , and FIG. 2B is a cross-sectional view taken along line I-I' of FIG. 2A . And, FIG. 3 is a cross-sectional view of pressing the bonding portion between the electrode pad and the wiring.

1, 2a, and 2b, the thermoelectric element of the embodiment of the present invention includes a first substrate 10a including a first electrode 20a, a second substrate 10b including a second electrode 20b, An N-type cell 30a and a P-type cell 30b disposed between the first substrate 10a and the second substrate 10b and electrically connected through the first electrode 20a and the second electrode 20b, the first 1 The electrode pad ( 50), and one end of the wiring 40 is inserted into the groove 50a and fixed.

The first substrate 10a and the second substrate 10b may include at least one of Al ₂ O ₃ (Alumina), Boron Nitride (BN), and a carbon material. Carbon materials, for example, aluminum silicon carbide composite material (AlSiC), graphite (Graphite), carbon black (Caron Black), graphene (Graphene), fullerene (fullerene), carbon nano tube (Carbon Nano Tube; CNT) and It may be one of the mixtures selected from them.

The N-type cell 30a is, for example, Bi ₂ Te _{3 -x- y} Se _x Cu _y (0.1<x<0.5, 0<y<0.1) or Bi ₂ Te _{3 -x} Se _x (0.1<x<0.5). , 0<y<0.1), but is not limited thereto. And, the P-type cell 30b is, for example, Bi _{2 -x- y} Sb _{x - y} Te ₃ Cu _y (0.1<x<0.5, 0<y<0.1) or Bi _{2 -x} Sb _x Te ₃ (0.1 <x<0.5, 0<y<0.1), but is not limited thereto. Although not shown, the N-type cell 30a and the P-type cell 30b and the first and second electrodes 20a and 20b may be connected to each other through solder.

For example, when a DC voltage is applied by connecting the wiring 50 to the first and second electrodes 20a and 20b of the thermoelectric element as described above, due to the Peltier effect, from the P-type cell 30b to the N-type cell ( The second substrate 10b through which current flows to 30a) absorbs heat and acts as a cooling unit, and the first substrate 10a through which current flows from the N-type cell 30a to the P-type cell 30b is heated and acts as a heating unit. can work

The wiring 40 may be electrically connected to the first electrode 20a , and for this purpose, an electrode pad 50 is disposed between the first electrode 20a and the wiring 40 . The wiring 40 may be formed of a single wire or a plurality of wires. The width w2 of the wiring 40 made of a single or a plurality of wires is narrower than the width w1 of the electrode pad 50 .

The electrode pad 50 is to prevent contact failure between the wiring 40 and the first electrode 20a and includes a groove 50a for insertion of the wiring 40 .

4 is a photograph showing a defective connection between the thermoelectric element and the wiring.

As shown in FIG. 4 , in a typical thermoelectric element, a wiring and a first electrode are connected to each other by a soldering method on a first substrate. Therefore, if the soldering area is not sufficiently secured, the contact area is too narrow, and the soldering area is limited, and connection failure may occur.

The present invention is to solve the above problem, and the wiring 40 and the first electrode 20a can be electrically connected by using the electrode pad 50 protruding to the outside of the first substrate 10a. The electrode pad 50 includes a concave groove 50a formed in the longitudinal direction of the electrode pad 50 from the side, and one end of the wiring 40 may be inserted into the groove 50a.

To this end, the diameter of the groove 50a is wider than the width w1 of the wiring 40 , and the width w2 of the electrode pad 50 to fix and support the wiring 40 is the width of the wiring 40 . It may have a width of about 2 to 4 times that of (w1). For example, when the width w2 of the electrode pad 40 is too narrow, the groove 50a does not have a sufficient diameter, and when the width w2 of the electrode pad 40 is too wide, the electrode pad 40 The area overlapping the first substrate 10a and the first electrode 20a is too large, so it is difficult to reduce the size of the thermoelectric element.

In order to improve the fixing force between the electrode pad 50 and the wiring 40 , the electrode pad 50 may include a heat-shrinkable material having conductivity. For example, the electrode pad 50 may be a heat shrinkable tube. The heat-shrinkable tube includes a hole penetrating in the longitudinal direction, and when the heat-shrinkable tube is made of a transparent material, the connection and fixation of the electrode pad 50 and the wiring 40 can be visually confirmed.

That is, after inserting the wiring 40 into the groove 50a, heat is applied in the insertion region to contract the electrode pad 50, thereby improving the bonding force between the groove 50a and the wiring 40 and at the same time. It is possible to effectively prevent moisture permeation. Moreover, as shown in FIG. 3 , in addition to heat, by physically pressing the periphery of the groove 50a of the electrode pad 50 , the groove 50a and the wiring 40 can be brought into closer contact. Although the drawing shows that the cross section of the groove 50a is circular, the cross section of the groove 50a may be a polygonal shape, an oval shape, or the like, but is not limited thereto.

In the thermoelectric element according to the embodiment of the present invention as described above, the external wiring 40 and the first electrode 20a of the thermoelectric element are electrically connected through the electrode pad 50 protruding from the edge of the first substrate 10a, and the electrode Since the pad 50 and the wiring 40 have a structure in which the wiring 40 is inserted into the groove 50a instead of soldering, the fastening force and fixing force are improved. In particular, since the electrode pad 50 and the wiring 40 are coupled outside the first substrate 10a, a space for the electrical connection between the first electrode 20a and the wiring 40 is removed on the first substrate 10a. can do.

Hereinafter, a thermoelectric device according to another embodiment of the present invention will be described with reference to the accompanying drawings.

5A is a plan view of a connection region according to another embodiment of the present invention, and FIG. 5B is a cross-sectional view taken along line I-I' of FIG. 5A.

5A and 5B , the electrode pad 150 may be coupled to the wiring 40 through the screw 60 . The electrode pad 150 includes a concave groove 150a formed in the longitudinal direction of the electrode pad 150 from the side, and one end of the wiring 40 may be inserted into the groove 150a. Then, the wire 40 inserted into the groove 150a through the screw 60 inserted in the direction penetrating the electrode pad 150 from the upper surface of the electrode pad 150 is separated from the electrode pad 150 . can be prevented

That is, the screw 60 fixes the wire 40 and the electrode pad 150 in the groove 150a, and for this purpose, the wire 40 is the screw 60 and the electrode pad 150 in the groove 150a. ) is fixed between

The electrode pad 150 may include a heat-shrinkable material having conductivity. For example, the electrode pad 150 may be a heat shrinkable tube. The heat shrinkable tube (tube) is made of a transparent material, so that the connection and fixation of the electrode pad 150 and the wiring 40 can be visually confirmed.

In addition, before coupling the electrode pad 150 and the screw 60 , heat may be applied to contract the electrode pad 150 , or the screw 60 may be coupled after the electrode pad 150 is contracted. Although the figure shows that the cross section of the groove 150a is rectangular, the cross section of the groove 150a may be circular, polygonal, oval, etc., but is not limited thereto.

In the thermoelectric element of another embodiment of the present invention as described above, the external wiring 40 and the first electrode 20a of the thermoelectric element are electrically connected through the electrode pad 150 protruding from the edge of the first substrate 10a, The wire 40 is inserted into the groove 150a where the electrode pad 150 and the wire 40 are not soldered, and at the same time, the electrode pad 150 and the wire 40 are coupled through the screw 60 to provide fastening and fixing force. This can be improved.

Hereinafter, a method of manufacturing a thermoelectric element according to an embodiment of the present invention will be described.

6A to 6E are cross-sectional views illustrating a method of manufacturing a thermoelectric device according to an embodiment of the present invention.

As shown in FIG. 6A , the first electrode 20a is formed on the first substrate 10a. In this case, the first electrode 20a may include a metal material such as Cu, Ag, or Ni. Then, as shown in FIG. 6B , the electrode pad 50 is formed on the first electrode 20a so as to protrude from the edge of the first substrate 10a. The electrode pad 50 may include a heat-shrinkable material having conductivity. For example, the electrode pad 50 may be a heat shrinkable tube. The electrode pad 50 as described above includes a groove ( 50a in FIG. 2A ) concavely formed along the longitudinal direction of the electrode pad 50 from the side surface.

Next, as shown in FIG. 6C , an N-type cell 30a and a P-type cell 30b are formed. The N-type cell 30a and the P-type cell 30b are respectively disposed on the first electrode 20a, and the N-type cell 30a and the P-type cell 30b are disposed on the same first electrode 20a. may be electrically connected through the first electrode 20a.

As shown in FIG. 6D, a second substrate 10b including a second electrode 20b electrically connecting an N-type cell 30a and a P-type cell 30b disposed on different first electrodes 20a. place the Then, the N-type cell 30a and the P-type cell 30b are fixed between the first and second substrates 10a and 10b by pressing the first and second substrates 10a and 10b.

That is, the plurality of N-type cells 30a and P-type cells 30b may all be electrically connected to each other through the first and second electrodes 20a and 20b. In this case, the second electrode 20b may be formed of a metal material such as Cu, Ag, or Ni.

Then, as shown in FIG. 6E , the wiring 40 is inserted into the groove ( 50a in FIG. 2A ) of the electrode pad 50 . In addition, a screw (60 in FIG. 5A ) may be further inserted to improve the fastening force.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and it is conventional in the art to which the present invention pertains that various substitutions, modifications and changes are possible within the scope without departing from the technical spirit of the embodiments. It will be clear to those who have knowledge.

10a: first substrate 10b: second substrate
20a: first electrode 20b: second electrode
30a: N-type cell 30b: P-type cell
40: wiring 50, 150: electrode pad
50a, 150a: groove 60: screw

Claims (9)

a first substrate including a first electrode and a second substrate including a second electrode;
an N-type cell and a P-type cell disposed between the first substrate and the second substrate and electrically connected through the first electrode and the second electrode; and
and an electrode pad disposed on the first electrode so as to protrude from the edge of the first substrate, electrically connected to the first electrode, and including a groove coupled to an external wiring;
One end of the wire is inserted into the groove and fixed,
The groove is formed concave along the length direction of the electrode pad from the side of the electrode pad,
The electrode pad includes a heat-shrinkable material and is a transparent material that is shrunk in the groove. delete delete The method of claim 1,
The heat-shrinkable material is a heat-shrinkable tube. a first substrate including a first electrode and a second substrate including a second electrode;
an N-type cell and a P-type cell disposed between the first substrate and the second substrate and electrically connected through the first electrode and the second electrode;
an electrode pad disposed on the first electrode so as to protrude from the edge of the first substrate, electrically connected to the first electrode, and including a groove coupled to an external wiring;
a screw inserted from the upper surface of the electrode pad to fix the electrode pad and the wire;
The groove is formed concave along the length direction of the electrode pad from the side of the electrode pad,
The electrode pad includes a heat-shrinkable material and is a transparent material that is shrunk in the groove. delete delete 6. The method of claim 5,
The heat-shrinkable material is a heat-shrinkable tube. 6. The method of claim 5,
The screw is a thermoelectric element inserted into the electrode pad so that an end of the screw is in contact with the wiring.

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