KR102439113B1 - Manufacturing method of composite plated with network type nano metal layer through silica self crack and wearable electronics carbon fiber manufactured therefrom - Google Patents

Abstract

The present invention relates to a method for manufacturing a composite material plated with a network-type nano-metal layer through silica cracks, and to a wearable electronics carbon fiber manufactured therefrom.
In the present invention, a silica solution is coated on a substrate on a flat or curved surface, silica cracks are randomly formed in the crack direction and size by drying after silica solution coating, and electroless metal plating is performed on the surface of the substrate to form a network type on the silica cracks. Through the method of manufacturing a composite material plated with a nano-metal layer, it is possible to provide a composite material with excellent electrical conductivity and bending resistance by plating a network-type nano-metal layer on a substrate on a curved surface as well as on a flat surface. It is possible to provide wearable electronics carbon fiber with excellent resistance.

Description

Manufacturing method of composite material plated with network-type nano metal layer through silica crack and wearable electronics carbon fiber manufactured therefrom

The present invention relates to a method for manufacturing a composite material plated with a network-type nano-metal layer through silica cracks and to a wearable electronics carbon fiber prepared therefrom, and more particularly, to a substrate of a flat or curved surface by coating a silica solution and after the coating Silica cracks with random crack directions and sizes are formed by drying, electroless metal plating on the surface of the substrate, and an etching process. It relates to a method for manufacturing a composite material having excellent electrical conductivity and bending resistance, plated with a network-type nano-metal layer through silica cracks, and a wearable electronics carbon fiber manufactured therefrom.

Recently, carbon fiber has been widely used in biosensors, electromagnetic wave shielding and reinforcement materials based on excellent properties such as thermal conductivity, heat resistance, electrical conductivity and non-combustibility. In particular, it is useful in products related to heat, such as water heaters, heating glass, and heaters, so continuous research is ongoing.

Carbon fiber can efficiently convert electrical energy into thermal energy through resistance heating, and has several advantages compared to conventional copper wire. It is said that it has better heating efficiency than existing heating elements, reduces electromagnetic waves and emits far-infrared rays useful to the human body.

However, it is known that carbon fiber has a resistivity of 10 ^-3 Ω·cm, which is higher than the resistivity of 1.68×10 ^-6 Ω·cm of a conventional copper wire.

Methods for improving the electrical conductivity of carbon fibers include mixing and coating a conductive material on the surface of the fiber or with a spinning dope when manufacturing carbon fibers, a method of forming a film by an organic copolymer, and a method of forming a metal film on the fiber surface how to do it, etc. Among them, the method of forming a metal film on the fiber surface has an excellent electromagnetic wave shielding effect and has the advantage that it can be mass-processed.

In addition, the electroless plating method capable of forming a metal film on the fiber surface is a method in which the fiber surface is catalytically treated so that the metal to be plated is attached to the fiber through a substitution/reduction reaction with the catalyst. The thickness of the metal plating film can be adjusted according to the concentration and temperature conditions of the plating solution, and excellent electrical conductivity and electromagnetic wave shielding performance can be provided by forming a uniform metal film on the fiber.

In Non-Patent Document 1, a study on the formation of a copper nano/microwire network using electroless copper plating using silica on a flat substrate and a non-uniform transparent electrode using the same is reported.

In addition, Patent Document 1 discloses a three-dimensional network-shaped carbon fiber structure composed of carbon fibers with an average outer diameter of 100 to 300 nm, but the carbon fiber structure has a three-network shape and is mixed with silica as a matrix through a composite material. It is reported to improve the electrical properties.

Patent Document 2 discloses a composite metal foil comprising a porous metal foil having a two-dimensional network structure composed of metal fibers and a primer provided in at least a part of the hole inside and/or around the hole of the porous metal foil, the surface of which is cracked A porous metal foil having a two-dimensional network structure is provided by performing metal plating on the cracks and depositing metals along the cracks in a conductive substrate having a release layer.

However, there are cases in which silica or a metal layer by plating is introduced for manufacturing a conventional composite material, but research on the fabrication of a nano/microwire network on a substrate with a curvature or on a fine fibrous substrate has not been reported.

Accordingly, as a result of the present inventors trying to improve the physical properties of carbon fiber and implement physical properties suitable for use in wearable electronics, a silica solution is coated on a flat or curved substrate and dried after coating to obtain silica cracks having random crack directions and sizes. Formed, electroless metal plating on the surface of the substrate, and an etching process to devise a method for manufacturing a composite material in which a network-type nano-metal layer is plated on the silica crack The present invention was completed by confirming that the obtained carbon fiber has excellent electrical conductivity and bending resistance and is suitable for use in wearable electronics because network-type nano-metal layer plating through silica cracks is possible.

Republic of Korea Patent Publication No. 2011-0027752 (published on December 24, 2015) Japanese Patent No. 5400826 (published on May 21, 2012)

Korean J. Mater. Res. Vol. 29, No. 5 (2019)

It is an object of the present invention to provide a method for manufacturing a composite material on which a network-type nano-metal layer is plated through silica cracks.

Another object of the present invention is to provide a wearable electronics carbon fiber having excellent electrical conductivity and bending resistance, manufactured by the above manufacturing method.

In order to achieve the above object, the present invention is a process for forming silica cracks (Self-Crack) with random crack directions and sizes on the surface of the substrate by coating a silica coating solution on a flat or curved substrate, and drying after the coating,

Electroless metal plating process on the surface of the substrate on which the silica cracks are formed, and

It provides a method of manufacturing a composite material plated with a network-type nano-metal layer consisting of an etching process after the plating process.

In the above, the substrate may include both flat or curved substrates, and is preferably carbon fiber.

In the production method of the present invention, the silica crack forming process is performed by coating a silica coating solution on a substrate at a coating rate of 10 to 100 mm/min, and drying temperature of 40 to 80° C. after the coating.

In addition, in the manufacturing method of the present invention, the electroless metal plating process is preferably performed for a plating time of 10 to 30 minutes.

Further, in the etching process, the concentration of the etching solution is 1 to 3 moles, and the etching time is 12 to 36 hours to remove silica on the surface of the substrate.

In addition, the present invention is manufactured by the above manufacturing method, on the surface of the carbon fiber containing silica cracks randomly formed in the crack direction and size by drying after coating the carbon fiber with a silica solution, nano or micro wire on the silica crack Provided is a wearable electronics carbon fiber having excellent electrical conductivity and bending resistance plated with a network-type nano-metal layer in the form of a metal layer.

The network-type nano-metal layer is plated at intervals of 1 to 1.5 μm.

According to the method for manufacturing a composite material plated with a network-type nano-metal layer of the present invention, network-type nano/micro plating will be possible even in a curved form by the electroless metal plating method on a substrate having a curved surface rather than a flat substrate.

Therefore, a silica coating solution is coated on the carbon fiber, and after the coating is dried, silica cracks having random crack directions and sizes are formed on the surface of the substrate, and a network-type nano-metal layer is applied to the fiber surface through an electroless metal plating method. It is possible to provide nanocomposite fibers with improved electrical conductivity than general carbon fibers by successfully growing them.

In addition, the present invention can provide a wearable electronics carbon fiber strong in bending by plating a network-type metal (copper) wire in the form of a nano/micro wire on a curved surface rather than a flat substrate.

1 is a flow chart for each process of the method for manufacturing a composite material plated with a network-type nano-metal layer of the present invention;
Figure 2 is a result of the silica coating thickness according to the silica coating rate and the drying temperature in the manufacturing method of the present invention,
3 is a SEM result of the silica crack state according to the drying temperature in the manufacturing method of the present invention,
4 is a carbon fiber surface analysis result according to the electroless plating time in the manufacturing method of the present invention,
5 is a carbon fiber surface analysis result according to the concentration of the etching solution and the etching time in the manufacturing method of the present invention;
6 is a surface analysis result using FE-SEM for electroless copper-plated carbon fiber through silica cracks of the present invention;
7 is a result of mapping the components through EDS for the electroless copper-plated carbon fiber through the silica crack of the present invention,
8 is an EDS component analysis graph of FIG. 7 in which carbon, oxygen and copper are indicated as peaks;
9 is an X-ray diffraction analysis result of the electroless copper-plated carbon fiber through the silica crack of the present invention;
10 is a result of measuring the change in the electrical conductivity of the electroless copper-plated carbon fiber through the silica crack of the present invention,
11 is a bending test result of the electroless copper-plated carbon fiber through the silica crack of the present invention.

Hereinafter, the present invention will be described in detail.

1 is a flowchart for each process of the method for manufacturing a composite material plated with a network-type nano-metal layer of the present invention. Silica crack (self-crack) formation process with random crack direction and size on the surface of the substrate;

Electroless metal plating process on the surface of the substrate on which the silica cracks are formed, and

It provides a method of manufacturing a composite material plated with a network-type nano-metal layer consisting of an etching process after the plating process.

The manufacturing method of the composite material of the present invention is characterized in that the substrate can be applied without limitation to a substrate of a curved surface rather than a flat substrate, and since carbon fiber is used as a preferred example of the substrate in the embodiment of the present invention, the following In the description, the carbon fiber shown in FIG. 1 will be described, but it may be understood as a substrate of a curved surface.

1. Silica crack formation process on carbon fiber

In the manufacturing method of the present invention, the silica crack forming step is to coat the carbon fiber with a silica coating solution, but after the coating is dried, the silica cracks are randomly formed in the direction and size of the cracks.

At this time, depending on the appropriate concentration of the silica coating solution, crack formation is affected. If the concentration is too thick or too light, network-type cracks are not generated. In addition, in the silica coating process, it is required to optimize the conditions so that the silica is coated on the carbon fiber to an appropriate thickness as a whole and suitable cracks can be generated while drying.

2 is a result of the silica coating thickness according to the silica coating rate and the drying temperature in the manufacturing method of the present invention. 3 is a SEM result of the silica crack state according to the drying temperature, according to the conditions of the coating speed (10, 50, 10 mm/min speed) of the silica solution and the drying temperature (40, 60, 80 ℃) after the coating, It is affected by silica coating state and crack formation.

Preferably, the silica coating solution on the carbon fiber is carried out at a coating speed of 10 mm / min to 100 mm / min, but if it is less than 10 mm / min, the coating speed is slow and the silica coating thickness is thin and cracks are not easily generated, on the other hand, When it exceeds 100 mm/min, silica is generated too thickly, and since the thickness is thick, there is a problem in that the silica crack interval is wide, and the silica falls well.

In addition, the drying temperature is preferably carried out under the conditions of 40 ° C. to 80 ° C. after coating. If the drying temperature is less than 40 ° C, silica cracks are not easily generated on the dried surface, and when it exceeds 80 ° C, the dried silica coating layer is easily There is a problem with breaking.

Therefore, most preferably, when the silica coating solution on the carbon fiber is performed at a speed of 50 mm/min and a drying temperature of 60° C., it is possible to confirm the generation of silica cracks with a silica coating layer having a thickness of 1.79 μm and an interval of 2.03 μm.

2. Electroless copper plating process

In the manufacturing method of the present invention, as the electroless plating solution used in the electroless metal plating process, synthetic or commercial materials may be used in the experiment, and in the embodiment of the present invention, an electroless copper plating solution is used as an example.

4 is a carbon fiber surface analysis result according to the electroless plating time (10, 20, 30 minutes) in the manufacturing method of the present invention. If the plating time is short, the carbon fiber will not be properly plated. If the plating time is long, the silica coating layer is completely removed. will cover

As a result of the surface analysis according to the copper plating time in FIG. 4, it can be confirmed that the diameter of the carbon fiber and the thickness of the copper plating layer are affected by the electroless copper plating time, and most preferably, in the case of the plating time of 20 minutes, the carbon fiber as a whole A copper plating layer of 496.96 nm is uniformly produced.

3. Etching process

In the manufacturing method of the present invention, it is a process of removing silica on the surface of carbon fibers through an etching process, in which the etching solution removes amorphous silica using a strong alkaline aqueous solution such as KOH, NaOH or TMAH. The KOH solution is a material through which water can easily permeate the carbon fiber surface and the silica surface, and can remove silica in an amorphous state.

Figure 5 shows the carbon fiber surface analysis results according to the concentration (1,2, 3M) and etching time (12, 24, 36 hours) of potassium hydroxide (KOH) as an etching solution in the manufacturing method of the present invention as , most preferably in a 2 mol KOH solution for 24 hours, the best etching results can be confirmed.

Through the above process, the method of manufacturing a composite material plated with a network-type nano-metal layer of the present invention is an electroless metal plating method on a substrate having a curved surface rather than a flat substrate. It will be possible.

In addition, the carbon fiber is coated with a silica coating solution, and after the coating is dried, silica self-cracks having random crack directions and sizes are formed on the surface of the substrate, and the network-type nano metal layer is formed through the electroless metal plating method. By successfully growing on the surface, it is possible to provide nanocomposite fibers with improved electrical conductivity compared to general carbon fibers.

Therefore, the present invention is manufactured by the above manufacturing method, and after coating the carbon fiber with a silica solution, on the surface of the carbon fiber containing silica cracks randomly formed in the crack direction and size by drying, nano or microwires on the silica cracks Provided is a wearable electronics carbon fiber having excellent electrical conductivity and bending resistance plated with a network-type nano-metal layer in the form of a metal layer.

6 is a surface analysis result using FE-SEM for the electroless copper-plated carbon fiber through the silica crack of the present invention. The network-type nano-metal layer is plated at intervals of 1 to 1.5 μm, and silica It can be seen that copper plating was not generated in the coated part, whereas copper plating was generated in the silica cracked part.

7 is a mapping of components through EDS for electroless copper-plated carbon fibers through silica cracks of the present invention, and FIG. 8 is an EDS component analysis graph in which carbon, oxygen and copper are indicated as peaks.

Synthesis of electroless copper-plated carbon fibers through silica cracks can be confirmed from the above components.

9 is an X-ray diffraction analysis result of electroless copper-plated carbon fiber through a silica crack of the present invention, through the diffraction angle of carbon and copper at 2 theta, silica falls during the etching process and carbon fiber It supports the result that only copper plating remains on the

10 is a result of measuring the change in the electrical conductivity of the electroless copper-plated carbon fiber through the silica crack of the present invention, the carbon fiber plated with a network-type nano-metal layer obtained through the manufacturing method of the present invention is a conventional carbon fiber Contrast resistivity is about 10 times lower.

11 shows the results of the bending experiment of the electroless copper-plated carbon fiber through the silica crack of the present invention. As a result of the analysis of the electrical conductivity of the carbon fiber before and after the bending experiment, it shows a low increase/decrease rate.

From the above results, in the case of the basic electroless copper plated carbon fiber, the plating layer is broken due to the bending test, but the network type electroless copper plated carbon fiber through the silica crack of the present invention is formed in a thin network type, so even if one part is broken Because current can flow to the other side, it is useful as a carbon fiber for wearable electronics.

Hereinafter, the present invention will be described in more detail through examples.

These examples are for explaining the present invention in more detail, and the scope of the present invention is not limited to these examples.

<Example 1>

Step 1: Silica crack formation process on carbon fiber

To a solution of 3 ml of TEOS and 1.5 ml of ethanol, a solution of 1.5 ml of distilled water and 0.1 ml of hydrochloric acid was slowly added and stirred for 50 minutes to prepare a silica coating solution.

Carbon fiber (Toray T30 1K fiber) was prepared with a specimen length of 60 mm, immersed in the silica coating solution, and coated with silica.

At this time, in order to coat the carbon fiber with a constant thickness as a whole on the surface of the carbon fiber, the silica coating thickness was confirmed by carrying out under the condition of 50 mm/min at the lifting speed (coating speed) of the carbon fiber during immersion coating. After silica coating, it was dried at a drying temperature of 60° C. to check the interval and thickness of the generated self-cracks.

Step 2: Electroless copper plating process

After silica coating under the conditions of step 1 of Example 1, electroless copper plating was performed. Specifically, electroless copper plating was activated for 30 minutes in a tin chloride solution, washed, and then activated for 30 minutes using palladium(II) chloride. In this process, Sn/Pb nuclei are formed on the carbon fiber surface, and the Sn/Pb nuclei formed on the carbon fiber surface promote electroless copper plating.

Electroless copper plating solution (Young-In Pachem's ELC-250A (copper additive) and ELC-250B (pH adjuster) were used, and electroless plating was performed under the conditions of temperature of 35°C, pH of 10.5, and plating time of 20 minutes. did.

Step 3: Etching process

After silica coating on the carbon fiber through step 2, an electroless copper plating layer was formed. Thereafter, the carbon fibers were immersed in a KOH solution, and after a sufficient time elapsed, ultrasonication was performed for 5 minutes, followed by final waxing with distilled water and drying. At this time, the etching was performed under the conditions of a concentration of 2 mol of the KOH solution and an etching time of 24 hours. From the above steps, electroless copper-plated carbon fibers through silica cracks were prepared.

<Experimental Example 1> Surface analysis according to silica coating speed and drying temperature

In order to establish the optimum conditions for the silica cracking process on the carbon fiber performed in step 1 of Example 1, the coating speed (10, 50, 10 mm/min speed) and the drying temperature after the coating (40, 60, 80°C) ), surface analysis was performed using a scanning electron microscope (Scanning Electron Microscope, ×3,000 magnification) for the thickness of the carbon fiber-like silica coating according to the conditions and the spacing and thickness of self-cracks formed during the drying process.

1. Measurement result of silica coating thickness (㎛) according to silica coating speed and drying temperature

Table 1 and Figure 2 below show the results of the silica coating thickness formed according to the silica coating rate and the drying temperature.

From the results of Table 1 and FIG. 2, silica was coated with an average thickness of 1.67 μm under the 10 mm/min coating speed condition, but cracks were not well generated. It is considered that cracks are not easily generated because the coating speed is slow and the thickness of the silica coating is thin. On the other hand, in the case of a coating speed of 50 mm/min, silica was coated on the carbon fiber with an average thickness of 1.82 μm overall. At a coating speed of 100 mm/min, silica was produced too thick with an average of 2.05 μm. In addition, since the silica thickness was thick, it was confirmed that the silica crack interval was wide and the silica fell well. In the case of the average silica thickness for each temperature according to the coating rate, the silica thickness increased as the coating rate increased, and the drying temperature increased. It is also fine, but the silica thickness is increased.

This result is considered to be a phenomenon in which the silica solution coagulates with each other during the drying process in the part where the thickness increases when the drying temperature is increased at 100 mm/min rather than 10 mm/min in the dip coating method.

2. Analysis of silica cracks (㎛) according to drying temperature

Table 2 and Figure 3 below are the analysis results of the silica cracks according to the drying temperature.

From the results of Table 2 and FIG. 3, (a) the surface dried at a drying temperature of 40 ° C. did not generate silica cracks well, whereas (b) the surface dried at a drying temperature of 60 ° C. produced silica cracks in the carbon fiber. (c) It was confirmed that the silica coating layer was easily broken when dried at 80 °C. That is, as the temperature increased, the silica crack interval increased.

<Experimental Example 2> Surface analysis according to electroless copper plating time

In order to establish the optimal conditions for the electroless plating process performed in step 2 of Example 1, the surface of the carbon fiber according to the electroless plating time (10, 20, 30 minutes) conditions was examined using a scanning electron microscope (Scanning Electron Microscope, × 3,000 magnification) was used for analysis. Tables 3 and 4 below are photographs of the carbon fiber surface according to the electroless plating time.

From the results of Table 3, as the plating time increased, the diameter of the carbon fiber and the thickness of the copper plating layer also increased. In addition, from the results of FIG. 4 , (a) is a photograph of the surface after 10 minutes of electroless copper plating time after silica coating on the carbon fiber, and the plating layer was not sufficiently formed on the carbon fiber as a whole.

On the other hand, (b) is a photograph of the surface after electroless copper plating for 20 minutes, and it was confirmed that a plating layer was formed on the entire carbon fiber and plated between the silica cracks. At this time, a copper plating layer of 496.96 nm was uniformly formed on the carbon fiber as a whole.

In addition, (c) is a photograph of the surface after electroless copper plating for 30 minutes, and it was confirmed that the silica coating layer was melted after 30 minutes.

<Experimental Example 3> Surface analysis according to the etching step

In order to establish the optimum conditions for the etching process performed in step 3 of Example 1, the surface of the carbon fiber according to the concentration of the etching solution (1, 2, 3 moles) and the etching time (12, 24, 36 hours) conditions was analyzed using a scanning electron microscope (×3,000 magnification).

5 is a carbon fiber surface analysis result according to the concentration of the etching solution and the etching time, (a), (b), (c) is 1 mole of KOH, (d), (e), (f) is 2 moles of KOH, and (g), (h), (i) were etched in 3 moles of KOH for 12, 24, and 36 h.

As a result, it was confirmed that the silica fell as the etching time passed, and the etching occurred faster as the concentration increased, but it was confirmed that the etching did not occur at 3 moles of KOH. As the reason, it was confirmed that the silica was melted and surrounded the carbon fibers, rather than the silica was etched away due to overreaction due to too many moles.

<Experimental Example 4> Surface analysis using FE-SEM

For the electroless copper-plated carbon fiber through silica cracks prepared in Example 1, the carbon fiber surface was analyzed through a field emission scanning electron microscope (FE-SEM).

6 is a surface analysis result using FE-SEM of electroless copper-plated carbon fiber through silica cracks of the present invention, the left side is taken at ×5,000 magnification, and the enlarged right part is analyzed at ×10,000 magnification.

As a result, a network-type copper plating interval was created in the range of 1 to 1.5 μm, and referring to FIG. 6 , copper plating was not generated in the portion where the silica was coated on the carbon fiber, and copper plating was generated in the silica crack portion.

<Experimental Example 5> EDS component analysis and mapping

The components of the electroless copper-plated carbon fiber through the silica cracks prepared in Example 1 were mapped through an Energy Dispersive X-ray Spectrometer (EDS).

As shown in FIG. 7 , (a), (b), and (c) are mapped to each component, (a) is indicated in red as a carbon component, (b) is in green as an oxygen component , (c) is indicated in yellow as a copper component.

8 is an EDS component analysis graph of FIG. 7 in which carbon, oxygen, and copper are indicated as peaks.

<Experimental Example 6> X-ray diffraction analysis

After the etching process through the X-ray diffractometer (XRD) to analyze the crystal structure and phase (phase) of the electroless copper-plated carbon fiber through the silica cracks prepared in Example 1 The presence of silica was checked.

As a result, as shown in FIG. 9, the strong diffraction peak of C (carbon) belongs to the crystal plane 101 (consistent with the theoretical value of ICDD card number: 08-0415) with an experimental diffraction angle of 26.3° at 2 theta. , Cu (copper) diffraction peaks also have experimental diffraction angles of 43.5°, 50.5°, and 74.3° for 2theta, which are consistent with the theoretical values of crystal planes (11), (20), (20) (JCPDS card number: 04-0836) applies to

From the above results, through the diffraction angle of carbon and copper at 2 theta, it was confirmed that silica fell during the etching process and only copper plating remained on the carbon fiber.

<Experimental Example 7> Electrical conductivity analysis

In order to confirm the change in the electrical conductivity of the electroless copper-plated carbon fiber through the silica cracks prepared in Example 1, the specific resistance of the carbon fiber was measured and the values are shown in Table 4 and FIG. 10 below.

In the case of carbon fiber used as a starting material (1K T30 by Toray, Japan), a resistivity value of 1.7×10 ^-3 Ω·cm was observed, and when etched in 2 mol of KOH for 24 hours, 1.537×10 ^-4 Ω·cm was observed as That is, it was confirmed that the specific resistance value was lowered by about 10 times than that of the conventional carbon fiber.

On the other hand, as shown in FIG. 10, when 3 mol of KOH is used, the specific resistance of carbon fiber is measured to be high. It can be predicted that as it melts, it wraps around the carbon fiber.

<Experimental Example 8> Analysis of bending experiments

In order to confirm the change in electrical conductivity before and after the bending experiment of the electroless copper-plated carbon fiber through the silica crack prepared in Example 1, the specific resistance of the carbon fiber was measured and the specific resistance after the bending experiment was measured. Afterwards, the change in the resistivity value is shown in Table 5 and FIG. 11 below.

From the above results, the basic electroless copper-plated carbon fiber showed a high increase/decrease rate of 16% from 0.793×10 ^-4 Ω·cm to 2.13×10 ^-4 Ω·cm after the bending test.

On the other hand, in the case of the carbon fiber prepared in Example 1, after the bending test at 1.528×10 ⁻⁴ Ω·cm, it showed a low increase/decrease rate of 3% to 2.038×10 ⁻⁴ Ω·cm.

The above results show that in the case of the basic electroless copper-plated carbon fiber, the plating layer is broken due to the bending experiment, but in the carbon fiber prepared in Example 1, the plating layer is formed in a thin network type, so that even if one part is broken, current can flow to the other side. because there is

In the above, the present invention has been described in detail only with respect to the described embodiments, but it is obvious to those skilled in the art that various changes and modifications are possible within the scope of the technical spirit of the present invention, and it is natural that such variations and modifications belong to the appended claims.

Claims (7)

A silica crack forming step of coating a silica coating solution on a flat or curved carbon fiber substrate, and drying the silica after coating to form silica cracks having random crack directions and sizes on the surface of the carbon fiber substrate;
Electroless metal plating process on the surface of the carbon fiber substrate on which the silica cracks are formed;
After the plating process, it consists of an etching process to remove the silica on the surface of the carbon fiber,
The silica crack forming process,
The silica coating solution is coated at a coating speed of 10 to 100 mm / min, and after the coating is carried out at a drying temperature of 40 to 80 ° C.,
The electroless metal plating process,
It is carried out to form a nano metal layer for a plating time of 10 to 30 minutes,
The etching process is
The concentration of the etching solution is 1 to 3 moles and the etching time is 12 to 36 hours, but a strong alkaline aqueous solution of KOH, NaOH or TMAH (tetramethylammonium hydroxide) is used to remove the amorphous silica using the etching solution. A method of manufacturing a composite material plated with a network-type nano-metal layer, characterized in that it is configured to be delete delete delete delete It is prepared from the manufacturing method of claim 1,
Wearable electronics carbon with excellent electrical conductivity and bending resistance in which silica cracks having random crack directions and sizes are formed by drying after silica coating on a carbon fiber substrate, and a network-type nano-metal layer in the form of nano or microwire is plated on the silica cracks fiber. The wearable electronics carbon fiber of claim 6, wherein the network-type nano-metal layer is plated at intervals of 1 to 1.5 μm.

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