KR102438173B1 - Semiconductor equipment communication protocol layer structure based on iot, gateway and transmission method - Google Patents

Abstract

The semiconductor equipment communication protocol hierarchical structure according to the present invention includes: a GEM layer for generating a Generic Equipment Model (GEM) message defining a procedure to be performed by either a destination of a semiconductor equipment or a host computer; a SECS-II (Semiconductor Equipment Communications Standard-II) layer defining the GEM message in the form of a stream and a function; an HSMS layer that generates a High-Speed SECS Message Services (HSMS) message indicating a communication status in the defined message; an IOT service layer for converting the HSMS message into an Internet of Things (IOT) message by adding a header indicating an IoT service; and a Transmission Control Protocol (TCP)/Internet Protocol (IP) layer for transferring the IOT message to a destination.

Description

Semiconductor equipment communication protocol hierarchical structure, gateway and transmission method based on the Internet of Things

The present invention relates to a semiconductor device communication protocol hierarchical structure, a gateway, and a transmission method based on the Internet of Things.

As communication network technology that transmits data develops very rapidly, efforts to use such communication network technology in the semiconductor manufacturing process have been ongoing for a long time. The data communication network of the semiconductor manufacturing process can efficiently transmit and receive data required for the wafer processing process, and it further promotes automation of the process to increase process efficiency, ultimately contributing to increasing the yield, which is a key problem in the manufacturing process. have.

The Equipment Automation Division of SEMI (Semiconductor Equipment and Materials International) recognized the need for a communication standard protocol for data exchange between semiconductor equipment and a host computer from the late 1990s, and established the related semiconductor equipment communication standard protocol. is coming

On the other hand, as Internet technology develops rapidly and spreads widely around today, Internet of Things technology that provides a function of exchanging data between devices without human intervention is becoming more important. In particular, in the era of the 4th industrial revolution based on various ICT technologies such as artificial intelligence technology, big data technology, sensor technology, automation technology, and communication network technology, it is essential to use Internet of Things technology to realize a smart factory of a company.

Therefore, it is required to implement a communication protocol using IoT technology in the semiconductor equipment area as well.

In order to solve the above-mentioned problems, an object of the present invention is to provide a protocol hierarchical structure, a gateway, and a transmission method for implementing a communication protocol using Internet of Things (IoT) technology in a semiconductor equipment area.

The protocol layer structure for implementing a communication protocol using the Internet of Things technology according to the present invention for achieving the above object is a Generic Equipment Model (GEM) that stipulates a procedure to be performed by either a destination of a semiconductor device or a host computer. GEM layer that generates messages; a SECS-II (Semiconductor Equipment Communications Standard-II) layer defining the GEM message in the form of a stream and a function; an HSMS layer that generates a High-Speed SECS Message Services (HSMS) message indicating a communication status in the defined message; an IOT service layer for converting the HSMS message into an Internet of Things (IOT) message by adding a header indicating an IoT service; and a Transmission Control Protocol (TCP) and Internet Protocol (IP) layer for transmitting the IOT message to a destination.

In an embodiment, the GEM message of the semiconductor device communication protocol hierarchy structure is characterized in that it includes a semiconductor device identifier to be monitored, a device status request from a host, a response from a semiconductor device to be monitored, and a data message.

In one embodiment, the header of the IOT message includes a field indicating the length of the header, a field designating a protocol used for transmitting HSMS data, a field indicating a version of a protocol used for transmitting HSMS data, and control information It is characterized in that it includes a field defining

In one embodiment, the TCP and IP layers include: a transport layer that manages errors and controls to ensure data transmission between a source and a destination; and a network layer that controls the path between the source and the destination so that the packet is sent to the correct destination.

In one embodiment, the semiconductor equipment communication protocol layer structure further includes a data link layer responsible for transmitting the bit stream arriving at the physical layer to the network, and a data link layer responsible for transmission confirmation and management and a physical layer transmitting the bit stream through a communication line. characterized by including.

In a data transmission method of a semiconductor equipment communication gateway based on an IoT service according to the present invention, the method comprising: generating a Generic Equipment Model (GEM) message defining a procedure to be taken by destinations that are either semiconductor equipment or a host computer; defining the GEM message in the form of a stream and a function; generating a High-Speed SECS Message Services (HSMS) message by including a field indicating a communication state in the defined message; converting the HSMS message into an IOT message conforming to the IoT protocol; and delivering the IOT message to a destination.

A semiconductor equipment communication gateway according to the present invention comprises: a GEM module for generating a Generic Equipment Model (GEM) message that defines a procedure to be taken by destinations that are either semiconductor equipment or a host computer; a SECS-II (Semiconductor Equipment Communications Standard-II) module defining the GEM message in the form of a stream and a function; an HSMS module for generating a High-Speed SECS Message Services (HSMS) message by including a field indicating a communication state in the defined message; an IOT module for converting the HSMS message into an IOT message conforming to the IoT protocol; and a Transmission Control Protocol (TCP) and Internet Protocol (IP) module for transmitting the IOT message to a destination.

In an embodiment, the GEM message includes a semiconductor device identifier to be monitored, a device status request from a host, a response from a semiconductor device to be monitored, and a data message.

In one embodiment, the header of the IOT message includes a field indicating the length of the header, a field designating a protocol used for transmitting HSMS data, a field indicating a version of a protocol used for transmitting HSMS data, and control information It is characterized in that it includes a field defining

In one embodiment, the TCP and IP module manages control and error to ensure data transmission between the source and destination, controls the path between the source and the destination so that the packet is sent to the correct destination, and confirms the transmission of data It is in charge of and management and is characterized by delivering a bit stream through a communication line.

According to an embodiment of the present invention, since a means for efficiently connecting and integrated management of semiconductor devices can be obtained through the Internet of Things technology, productivity can be increased and costs can be reduced, thereby contributing to improving corporate competitiveness.

In addition, big data generated in the semiconductor manufacturing process through the Internet of Things can be used as important basic data to efficiently operate and improve the process.

In addition, various functions and services provided by the IoT standard can be easily and conveniently used, and in particular, a function to manage data traffic that affects communication network performance can be used, so that the communication network can be operated stably and data and devices are strengthened. You can use security services, etc.

1 is a diagram illustrating a semiconductor device communication protocol hierarchical structure according to an embodiment of the present invention.
2 is a diagram illustrating a header structure of an IOT service layer according to an embodiment of the present invention.
3 is a block diagram schematically showing the structure of a semiconductor equipment communication system according to a communication protocol according to an embodiment of the present invention.
4 is a block diagram schematically showing the structure of a semiconductor equipment communication gateway according to an embodiment of the present invention.
5 is a flowchart illustrating a data transmission method of a semiconductor equipment communication gateway according to an embodiment of the present invention.

Since the present invention can have various changes and can have various embodiments, specific embodiments will be described in detail with reference to the drawings. However, this is not intended to limit the present invention to a specific embodiment, it should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention. In describing each figure, like reference numerals have been used for like elements.

Terms such as first, second, A, and B may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component. and/or includes a combination of a plurality of related description items or any of a plurality of related description items.

When a component is referred to as “connected” or “connected” to another component, it may be directly connected or connected to the other component, but it should be understood that other components may exist in between. something to do. On the other hand, when it is said that a certain element is "directly connected" or "directly connected" to another element, it should be understood that the other element does not exist in the middle.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It is to be understood that this does not preclude the possibility of the presence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related art, and should not be interpreted in an ideal or excessively formal meaning unless explicitly defined in the present application. does not

Throughout the specification and claims, when a part includes a certain element, it means that other elements may be further included, rather than excluding other elements, unless otherwise stated.

1 is a diagram illustrating a semiconductor equipment communication protocol layer structure according to an embodiment of the present invention, and FIG. 2 is a diagram illustrating a header structure of an IOT service layer according to an embodiment of the present invention.

1, the semiconductor equipment communication protocol hierarchical structure (hereinafter referred to as the protocol hierarchical structure) is a GEM Generic Equipment Model) layer 10, a SECS-II layer 20, a High Speed SECS Message Service (HSMS) layer ( 30), when exchanging data using a hierarchical structure including the IOT service layer 40, TCP (Transmission Control Protocol)/IP (Internet Protocol) layer 50, and data link layer 60 and physical layer 70 Since necessary functions and procedures can be appropriately distributed, protocols can be implemented efficiently.

The GEM layer 10 generates a message that specifies the procedure to be taken by the semiconductor equipment and the host computer in a specific situation. An application layer may come on the GEM layer 10 . The application layer performs the actual services (eg e-mail, file transfer).

The SECS-II layer 20 is a layer following the GEM layer 10, and the message received from the GEM layer 10 is transmitted in the SECS-II layer 20 according to the transmission protocol between the semiconductor equipment and the host computer. It is presented in a structure and meaning that can be interpreted.

More specifically, the SECS-II layer 20 defines the structure and function of the message used between the equipment and the host. In particular, it includes functions necessary for controlling equipment in the semiconductor manufacturing process.

For example, a data item format such as Lists, a data item format used as a standard, and a message used as a standard are defined in the form of a stream and a function. A stream means a set of messages with similar functions, and each message belonging to the stream is called a function. A combination of stream and function can display the message name exchanged between the device and the host.

That is, a stream is a group of messages having similar characteristics, and a function refers to a message that performs a specific function within each stream. All functions used in the SECS-II layer 20 follow the sequential convention of matching primary and secondary message pairs. A message of the SECS-II layer 20 such as S1F1, S6F11, etc. is expressed by combining a stream and a function.

The GEM layer 10 and the SECS-II layer 20 are standardized by SEMI (Semiconductor Equipment and Materials International), a non-profit association. The SECS/GEM standard defines messages, state machines, and scenarios to enable factory-hosted applications to control and monitor manufacturing equipment.

GEM is defined as a standard for equipment operation by matching the scenario for equipment operation with the SECS-II message used at this time.

There are 8 definitions of GEM that must be observed, and these are as follows.

1. State Models

All state of equipment is managed by State Model

● GEM defines three state models

§Communication state model

§ Equipment processing state model

§Control state model

2. Equipment processing status

● Required by GEM to manage the working state of equipment in the name of Equipment Processing State

● Overridable

GEM suggests this standard processing state, but it can be overridden by semiconductor equipment.

3. Host-Initiated S1,F13/14 Scenarios

● Used to establish communication when using HSMS

4. Event Notification

● A rule that the equipment must notify the host of all events that occur in it.

● Using S6,F11 messages

5. Online Identification

● Check if the communication status of the device is in communication

● Used to check if the control status is online.

● Using S1,F1/F2 messages

6. Error message

● Function to detect communication error

● Using stream 9 messages

7. Documentation

● Define all messages used

● GEM compliance technology

● Describe equipment data with VID

● Equipment operation scenario description

● CEID technology

● Alarm code technology

8. Control (Operator-Initiated)

● When the operator changes the control status of the equipment, a defined item on how to do it

For example, if you want to change the device from offline to online, the device sends an online request by sending s1 and f1 to the host, and when received as f2, the device goes online

The HSMS layer 30 is a layer following the SECS-II layer 20, is a protocol for transmitting SECS-II data through Ethernet, and includes a control message for managing the HSMS connection. Control messages can use the following messages according to the connection status.

1) Select.req/Select.rsp

This is a message used to transition from the Not Selected state to the Selected state, and the Active Entity transmits Select.req.

2) Deselect.req/Deselect.rsp

It is used to terminate communication by mutual agreement. The side that wants to end communication sends Deselect.req, and the other side responds to this, thereby ending communication. It is not used in HSMS-SS and is replaced by Separate.req.

3) Linktest.req/Linktest.rsp

To check and maintain the connection status, Linktest.req is sent at regular intervals after communication with each other is terminated. If there is no response to this, it transitions to a Not Connected state.

4) Separate.req

It is used to unilaterally notify the end of communication. A message that does not require a response, and usually ends immediately after sending this message.

5) Reject.req

Sent when an incorrect message is received

The HSMS layer 30 uses TCP/IP and is not limited by communication speed and cable length.

The IOT service layer 40 is a layer following the HSMS layer 30 and converts a message including the HSMS message into a message of the IoT layer. In an embodiment, the IOT service layer 40 receives the HSMS message implemented in the semiconductor equipment communication protocol and adds a header indicating the IOT service layer 40 to convert it into an IoT layer message. The IOT service layer 40 transmits the converted IoT service message to the transport layer and is transmitted to the neighboring semiconductor equipment or host computer through the Internet. The IOT service layer 40 conforms to the IEEE 802.15.4 radio technology standard.

Referring to FIG. 2, looking at the structure of the message header of the IOT service layer 40, the size of each field of the message header is 1 byte and consists of a total of 4 bytes, and a field 410 indicating the length of the header, in the IOT layer, A field 420 for specifying a protocol used for transmitting HSMS data, a field 430 for indicating a protocol version used for transmitting HSMS data, and a field 440 for defining control information required in the future. can

Therefore, through the protocol field of the header of the IOT service layer 40, it is possible to select and use a suitable one according to the GEM application service from among a plurality of IoT protocols currently designated as standards. For example, if you want to send semiconductor equipment monitoring data during GEM application service, you can select and transmit CoAP (Constrained Application Protocol), which is a corresponding IoT service protocol, in consideration of the characteristics of the data. CoAP operates under limited code size and limited memory.

In addition, the IOT service layer 40 provides various services. In particular, functions for managing traffic affecting network performance, etc. may be used, and security functions related to device management and data may be performed.

The TCP/IP layer 50 is a layer following the IOT service layer 40 and defines a method for moving data to a receiver or transmitting data from a sender.

The TCP/IP layer 50 includes a network layer 52 and a transport layer 51 .

The transport layer 51 serves to classify messages for each process. Accordingly, the transport layer 51 manages errors and controls to ensure data transmission between the source and destination. Therefore, the transport layer 51 controls the connection and controls the flow. The data of the transport layer 51 is called a message, and includes service point address information and information necessary for connection and flow control.

The network layer 52 performs a role of designating a logical address (eg, an IP address) used for communication and designating a route between a source and a destination. Data in the network layer is called a packet. The packet contains logical address information.

The data link layer 60 transmits the bit stream arriving at the physical layer 70 to the network layer 52 and transfers the packet of the network layer to the physical layer 70, and performs transmission confirmation and management. . The data in the data layer is called a frame. The frame contains physical address information.

The physical layer 70 transmits a bit stream through a communication line and serves to provide hardware means for sending and receiving data through a transmission medium. It follows the electronic standard according to the interface of the communication line and the physical medium.

There are various IOT protocols applicable in the Internet of Things environment, but among them, the most widely used protocols are CoAP (Constrained Application Protocol), MQTT (Message Queuing Telemetry Transport), or EXPP (Extensible Messaging and Presence Protocol).

Hereinafter, a case in which CoAP (Constrained Application Protocol) is adopted will be described as an example.

CoAP is developed so that resource-constrained devices can communicate over the Internet, and can be usefully used to communicate with low-power sensors and devices controlled through the Internet. CoAP can be easily linked with the conventional HTTP protocol. CoAP is an application protocol for the transport layer and application layer, which are upper layers of TCP/IP. A transaction message has an ID for each transaction, and for a new transaction, it is defined to create a new ID for each transaction. This is a method to prevent transmission of duplicate packets, and the like.

CoAP uses URI (Uniform Resource Identifier) to express resources (temperature, humidity, etc.) used for HTTP request and response. Since CoAP targets nodes that use low-performance CPUs and small memory (constrained nodes), if the entire URI is sent as data, the data size increases, so the abbreviated URI is used internally.

Meanwhile, in CoAP, in some cases, a node may act as a client, server, or proxy. In CoAP, the definition of a proxy is a node that can respond on behalf of a node that is originally supposed to respond to a data request based on previously cached contents. The reason that a proxy is needed in CoAP is that all M2M nodes This is because it can enter the Sleep state (ie, the sleep state that cannot give a response) at any time, and in this case, when there is a request for a resource event for the Sleep node, the proxy makes a cached response on its behalf. In addition, the proxy may play a role of protocol conversion between nodes in the HTTP area (Non-Constrained Node) and the nodes in the CoAP area (Constrained Node) in the existing communication network.

Lastly, to support UDP-based multicast, which is a characteristic of CoAP, the proxy has a function to convert the UDP-based CoAP multicast protocol to the TCP-based HTTP unicast protocol. Through this, event data can be exchanged without distinction between communication networks (HTTP, CoAP).

CoAP uses four types of messages: acknowledgment (CON), non-acknowledgment (NON), acknowledgment (ACK), and reset (RESET). For example, a client requests data from a server through an acknowledgment message, and the server responds to the request by sending a response message, a non-acknowledgment message, and a reset message depending on the situation. When data is transmitted according to a client request, a response message is transmitted, and when the response message cannot be processed, a reset message is transmitted. And if a response message for the data is not needed, the data is transmitted through an unacknowledged message.

For reference, in the CoAP message structure, a fixed header is located in the first 4 bytes. Among the fixed first 4 bytes, the 2-bit Ver field indicates the CoAP version, and the 2-bit Type field distinguishes the above-mentioned four types of messages (acknowledgment, response, unacknowledgment, reset). The 4-bit TKL field indicates the token length and has a token value between 0 and 8 bytes. Code field is 8-bit, and in a 3-bit class, 0 indicates a request, 2 indicates a successful response, 4 indicates a client error response, and 5 indicates a server error response. indicates

The MessageID field is used to identify a message during a transaction of data, followed by an optional part and a payload marker (0xFF) that indicates the start of the payload part containing the data.

For reference, a message transmitted through the HSMS layer 30 is divided into a data message (C) and a control message (A, B).

The data message (C) means a message for transmitting data, the control messages (A, B) mean a communication-related message, and the communication-related message means a message such as initial connection establishment, connection confirmation, or disconnection.

The control message (A, B) may include a 4-byte field (A) indicating the length of the message and a header (B) consisting of 10 bytes.

The header (B) of the HSMS message includes a SessionID of 2 bytes. SessionID is used as a device identifier when transmitting a data message and is set to 0xFFFF when transmitting a control message. In addition, the header (B) of the HSMS message may indicate a stream number and a function number indicating a specific GEM message through HeaderByte2 and HeaderByte3. At this time, the Ptype and Stype bytes each have a value of 0. And 4 bytes of SystemByte are used to distinguish the transaction of the message. Accordingly, the HSMS message of the SECS semiconductor equipment communication protocol may be included in the payload portion of the CoAP protocol to enable transmission.

In an embodiment of the present invention, an HSMS message format is added to the coap_node.h file to implement the CoAP-based SECS protocol. Also, it is necessary to define a get() function to pass the HSMS message through the get() function.

The semiconductor process uses vacuum chamber equipment so that the process can be performed in a vacuum state. If foreign substances exist in the vacuum chamber, it is necessary to monitor the vacuum chamber state using a vacuum gauge, a temperature gauge, a pressure gauge, etc. because impurities may be included in the wafer thin film.

The message of the GEM layer 10 (hereinafter, referred to as a GEM message) may include a semiconductor device identifier, a device status request message, a device status response message, and a data message.

The semiconductor device identifier may be displayed as '0x0001' as an identifier of the device to be monitored.

The device status request message includes a 'COAP_CON' confirmation message as described with reference to FIG. 2 .

3 is a block diagram schematically showing the structure of a semiconductor equipment communication system according to a communication protocol according to an embodiment of the present invention.

The semiconductor equipment communication system S includes one or more semiconductor equipment 110 and one or more IoT sensors 130 for measuring and detecting a process state of each semiconductor equipment, and monitors information of the semiconductor equipment 110 . It may include a host computer 150 that performs data communication between the semiconductor equipment 110 , the IoT sensor 130 , and the host computer 150 , and a gateway 170 .

Each component of the semiconductor equipment communication system S transmits and receives data according to the aforementioned semiconductor equipment communication protocol.

In an embodiment, the gateway 170 transmits data between each semiconductor device 110 , the IoT sensor 130 , and the host computer 150 according to a semiconductor device communication protocol.

4 is a block diagram schematically showing the structure of a semiconductor equipment communication gateway according to an embodiment of the present invention, and FIG. 5 is a flowchart illustrating a data transmission method of the semiconductor equipment communication gateway according to an embodiment of the present invention.

4 and 5 , the semiconductor equipment communication gateway includes a GEM module 710 , a SECS-II module 720 , an HSMS module 730 , an IOT module 740 , a TCP/IP module 750 and a data link. It includes a module 760 and a physical module 770 , wherein each module in each step conforms to the semiconductor equipment communication protocol shown with reference to FIGS. 1 and 2 .

In step S110, the GEM module 710 generates a GEM message defining a procedure to be taken by destinations, either semiconductor equipment or host computer.

In step S120, the SECS-II module 720 defines the GEM message in the form of a stream and a function.

In step S130, the HSMS module 730 generates an HSMS message by including a field indicating a communication state in the defined message.

In step S140, the IOT module 740 converts the HSMS message into an IOT message conforming to the IoT protocol.

In step S150 and the TCP/IP module 750, the link module 760 and the physical module 770 deliver the IOT message to the destination.

Through the exemplary embodiment described above, semiconductor equipment-related data generated from one or more sensors connected through the Internet of Things technology can be transmitted and received according to a communication standard protocol used for semiconductor equipment, thereby enabling easy and effective monitoring and management of semiconductor equipment.

The above description is merely illustrative of the technical idea of the present invention, and a person of ordinary skill in the art to which the present invention pertains may make various modifications and variations without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, but to explain, and the scope of the technical spirit of the present invention is not limited by these embodiments. The protection scope of the present invention should be construed by the following claims, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

Claims (10)

a GEM layer that generates a Generic Equipment Model (GEM) message that defines a procedure to be performed by a destination of either a semiconductor device or a host computer;
a SECS-II (Semiconductor Equipment Communications Standard-II) layer defining the GEM message in the form of a stream and a function;
an HSMS layer that generates a High-Speed SECS Message Services (HSMS) message indicating a communication status in the defined message;
an IOT service layer for converting the HSMS message into an Internet of Things (IOT) message by adding a header indicating an IoT service; and
Transmission Control Protocol (TCP) and Internet Protocol (IP) layers that deliver the IOT message to the destination
In the IOT message, a field indicating the length of the header, a field specifying a protocol used to transmit HSMS data, a field indicating a version of a protocol used to transmit HSMS data, and control information are defined. have a header containing fields,
The GEM message includes a semiconductor device identifier to be monitored, a device status request from a host, a response from a semiconductor device to be monitored, and a data message to which a semiconductor device communication protocol hierarchical structure is applied. delete delete According to claim 1,
The TCP and IP layers are
a transport layer that manages errors and controls to ensure data transmission between a source and a destination; and
a network layer that controls the path between the source and destination so that packets are sent to the correct destination;
A communication device to which a semiconductor equipment communication protocol hierarchical structure comprising a. 5. The method of claim 4,
The semiconductor equipment communication protocol layer structure is
a data link layer that transmits the bit stream arriving from the physical layer to the network, and is responsible for transmission confirmation and management; and
A physical layer that carries a stream of bits over a communication line.
A communication device to which a semiconductor equipment communication protocol hierarchical structure is applied further comprising a. In the data transmission method of a semiconductor equipment communication gateway based on the Internet of Things service,
generating a Generic Equipment Model (GEM) message defining a procedure to be taken by destinations that are either semiconductor equipment or a host computer;
defining the GEM message in the form of a stream and a function;
generating a High-Speed SECS Message Services (HSMS) message by including a field indicating a communication state in the defined message;
converting the HSMS message into an IOT message conforming to the IoT protocol; and
delivering the IOT message to a destination
including,
The IOT message includes a field indicating the length of the header, a field specifying a protocol used to transmit HSMS data, a field indicating a version of a protocol used to transmit HSMS data, and a field defining control information have a header,
The GEM message includes a semiconductor device identifier to be monitored, a device status request from a host, a response from a semiconductor device to be monitored, and a data message. a GEM module for generating a Generic Equipment Model (GEM) message defining a procedure to be taken by destinations that are either semiconductor equipment or a host computer;
a SECS-II (Semiconductor Equipment Communications Standard-II) module defining the GEM message in the form of a stream and a function;
an HSMS module for generating a High-Speed SECS Message Services (HSMS) message by including a field indicating a communication state in the defined message;
an IOT module for converting the HSMS message into an IOT message conforming to the IoT protocol; and
Transmission Control Protocol (TCP) and Internet Protocol (IP) modules that deliver the IOT message to the destination
including,
The IOT message includes a field indicating the length of the header, a field specifying a protocol used to transmit HSMS data, a field indicating a version of a protocol used to transmit HSMS data, and a field defining control information have a header,
The GEM message includes a semiconductor device identifier to be monitored, a device status request from a host, a response from a semiconductor device to be monitored, and a data message. delete delete 8. The method of claim 7,
The TCP and IP modules are
A semiconductor equipment communication gateway, characterized in that it manages errors and controls to ensure data transmission between a source and a destination, and controls a path between a source and a destination so that a packet is sent to the correct destination.

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