KR102421459B1 - Manufacturing method of non-sewing yoga outer socks - Google Patents

Abstract

The present invention relates to a method for manufacturing a non-sewn yoga overshoe, and after forming a temporary welding part with ultrasonic waves without a seam on the body part and the sole part, the manufacturing process can be simplified by thermally bonding the hot melt to the temporary welding part, In addition, the elastic bands coupled in a concentric circle form from the instep cover to the soles of the overshoe body are further combined to prevent the overshoes from peeling off, and the elastic bands can be selectively separated into yoga half overshoes and heel protection overshoes for reuse. It is characterized in that it can be used as a virtual boundary line that can be used.

Description

Manufacturing method of non-sewing yoga overshoes

The present invention relates to a method for manufacturing a non-sewn yoga overshoe, and more particularly, by forming a temporary welding part with ultrasonic waves without a seam on the body part and the sole part, and then thermally bonding the hot melt to the temporary welding part, thereby simplifying the manufacturing process. In addition, the elastic bands coupled in a concentric circle form from the instep cover part forming the overshoe body part to the sole part are further combined to prevent peeling of the overshoes, and the elastic bands are selectively used as yoga half overshoes and heel protection overshoes. It relates to a method of manufacturing a non-sewn yoga overshoe that can be used as a virtual boundary that can be separated and reused.

In general, the foot is a part of the body that maintains the balance of the human body and absorbs shock by supporting the body weight.

As a means for protecting and insulating the feet, socks, stockings, socks, or overshoes (hereinafter, collectively referred to as "foot clothing") are used.

Among foot garments, overshoes are made of elastic fibers such as nylon or cotton, and have excellent elasticity and ventilation, so women can easily wear them indoors in their daily life.

These overshoes are made by sewing a number of patterns covering the soles, insteps and heels of the soles, insteps, and heels woven with elastic fibers such as nylon, etc., with elastic threads, and a rubber band is installed around the opening so that they do not come off with a sewing thread.

That is, in the conventional overshoes, a plurality of pattern pieces such as a sole cover pattern, a toe cover pattern, and a heel cover pattern are sewn and connected, or the edge of the sole cover pattern is placed against each other in a pattern in which the toe and heel cover patterns are integrated. The overlapping pattern parts are connected by stitching, and the opening formed by stitching is made of rubber-like material.

It is attached by sewing an elastic rubber band with a sewing thread.

These conventional overshoes have a problem in that, by sewing and connecting each pattern, a thick or convex seam is formed in the region where each pattern is connected, and when worn on the foot, the seam puts pressure on the foot, thereby reducing the fit.

Recently, the use of overshoes has been subdivided, and various overshoes have been developed, such as for yoga in which the toes are opened, and for protecting the ankle, for ankle protection.

Since the use of the subdivided overshoes is limited, when the overshoes are damaged, they cannot be reused and must be disposed of.

Republic of Korea Utility Model Registration No. 0199775

The present invention has been devised in view of the above problems, and the first object of the present invention is to form a temporary welding part with ultrasonic waves without a seam on the overbody body part and the sole part, and then heat-seal the hot melt to the temporary welding part to manufacture it. An object of the present invention is to provide a method for manufacturing non-sewn yoga overshoes to simplify the process.

A second object of the present invention is to prevent peeling of the overshoes by further coupling the elastic bands coupled in a concentric circle form from the instep cover to the soles of the overshoe body, and selectively apply the elastic band to the yoga half overshoes and heels An object of the present invention is to provide a method of manufacturing a non-sewn yoga overshoe that can be used as a virtual boundary line that can be separated and reused as a protective overshoe.

According to a feature for achieving the above object, the first invention relates to a method of manufacturing a non-sewn yoga overshoe, and for this purpose, the fabric is made of an instep cover part and a foot side part extended by branching on both sides of the instep cover part. Individually cutting the body portion, the sole portion coupled to the overskin body portion, and the reinforcing instep cover portion for reinforcing the instep cover portion constituting the overskin body portion; (S10) and reinforcing the instep cover portion of the overskin body portion bonding the reinforcing instep cover to overlap the instep cover; (S20) and perforating five toe openings in which the toes are opened in the reinforcing instep cover overlapping the instep cover of the overshoe body; (S30) and the step of forming a heel portion through a first temporary joint to be temporarily joined at the same time as cutting by putting in an ultrasonic bonding machine in a state in which the tip of the foot side portion of the overshoe body is overlapped, and oscillating an ultrasonic wave to the overlapped portion; (S40), stacking the overshoe body part on the sole part, putting it into an ultrasonic splicer, and oscillating ultrasonic waves to the edge of the lamination part to form a second temporary joining part that is cut and temporarily joined for each foot size of the human body; (S50) ), and adding hot melt to the first and second adhesive parts, and pressing with a heat press to attach and reinforce the hot melt by thermal fusion; Completing yoga overshoes by attaching an elastic band sprayed with adhesive material in a concentric circle form from the cover part to the sole part; (S70) is included, and the hot melt is made by applying an adhesive layer to a polyurethane layer. The adhesive layer is melted by pressing, and the polyurethane layer is attached to the joint surface of the first and second adhesive parts 50a and 50b, and the elastic band prevents peeling of the overshoe, and optionally a yoga half overshoe and a heel protection overshoe. It is characterized in that it is used as a virtual incision that can be separated and reused.

In the second invention, in the first invention, the step of attaching a hot melt to the upper edge of each side of the foot in order to reinforce the overshoe opening formed by the joining of the heel portion of the overshoe body portion of step S40; (S41) Further, the hot melt is characterized in that the adhesive layer is melted by heat and pressure, and the polyurethane layer is attached to the upper edge of each of the foot side parts 20 .

The third invention, in the first invention, after the step S70, marking the incision line that can be cut with a tool such as scissors in the center of the elastic band with a broken line; (S80) is characterized by further comprising: .

In the fourth invention, in the first invention, the step S70 is characterized in that the elastic band is joined in two rows spaced apart from each other to form an incision region that is a virtual incision line that can be incised.

According to the manufacturing method of the non-sewn yoga overshoe of the present invention, after forming the overshoe body part and the sole part with ultrasonic waves without a seam line, the hot melt is heat-sealed to the temporary joint part and joined to simplify the manufacturing process. have.

In addition, the elastic bands coupled in a concentric circle form from the instep cover to the soles of the overshoe body are further combined to prevent the overshoes from peeling off, and the elastic bands can be selectively separated into yoga half overshoes and heel protection overshoes for reuse. There is an effect that can be used as a virtual boundary line that can be used.

In addition, since it is made only of the upper body part and the sole part, there is an effect that manufacturing is easy.

In addition, even when reused as yoga half overshoes and heel protection overshoes, each includes an elastic band, so it is effective to prevent peeling.

1 is a flowchart of a no-sew yoga overshoe according to the present invention;
2 is a configuration diagram showing the overskin body part and the sole part of step S10 of FIG. 1;
3 is a configuration diagram showing a state in which the reinforcing instep cover is joined to the overshoe body in steps S20 and S30 of FIG. 1, and the toe opening is drilled;
4 is a configuration diagram showing the first and second folds of steps S40 and S50 of FIG. 1;
5 is a configuration diagram showing a state in which the hot melt is joined to the first and second temporary joints in step S60 of FIG. 1;
Figure 6 is a configuration diagram showing the completed appearance of the non-sewn yoga overshoes of step S70 in Figure 1;
7 is a configuration diagram showing a state separated into yoga half overshoes and heel protection overshoes by cutting along the incision line in FIG. 6;
8 is a flowchart of a non-sewn yoga overshoe according to another embodiment;
9 is a configuration diagram showing the completed form of the no-sew yoga overshoes of step S80 in FIG. 8 .

The following objects, other objects, features and advantages of the present invention will be readily understood through the following preferred embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms.

Rather, the embodiments introduced herein are provided so that the disclosed subject matter may be thorough and complete, and that the spirit of the present invention may be sufficiently conveyed to those skilled in the art.

The embodiments described and illustrated herein also include complementary embodiments thereof.

In this specification, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, the terms 'comprise' and/or 'comprising' do not exclude the presence or addition of one or more other components.

Hereinafter, the present invention will be described in detail with reference to the drawings. In describing the specific embodiments below, various specific contents have been prepared to more specifically explain and help the understanding of the invention. However, a reader having enough knowledge in this field to understand the present invention may recognize that it can be used without these various specific details. In some cases, it is mentioned in advance that parts which are commonly known and not largely related to the invention in describing the invention are not described in order to avoid confusion in describing the invention.

Hereinafter, in conjunction with the accompanying drawings with respect to the manufacturing method of the non-sewn yoga overshoe according to the present invention will be described in detail.

1 is a flowchart of a no-sewn yoga overshoe according to the present invention, FIG. 2 is a configuration diagram showing the overshoe body part and the sole part of step S10 of FIG. 1, and FIG. It is a configuration diagram showing a state in which the reinforcing instep cover part is joined to the toe opening hole, and FIG. 4 is a configuration diagram showing the first and second folding parts of steps S40 and S50 of FIG. 1 , and FIG. 5 is FIG. It is a configuration diagram showing a state in which the hot melt is joined to the first and second joint parts of step S60 of 6 is a configuration diagram showing a yoga half overshoe and a heel protection overshoe separated by incision along the incision line, FIG. 8 is a flowchart of non-sewn yoga overshoes according to another embodiment, FIG. 9 is a step S80 in FIG. This is a configuration diagram showing the finished shape of the no-sewn yoga overshoes.

First, as shown in Figures 1 to 7, the present invention can simplify the manufacturing process by forming a temporary welding part with ultrasonic waves without a seam on the overshoe body part and the sole part, and then heat-sealing and bonding the hot melt to the temporary welding part. , In addition, the elastic bands coupled in a concentric circle form from the instep cover to the soles of the overshoe body are further combined to prevent the overshoes from peeling off, and the elastic bands are selectively separated into yoga half overshoes and heel protection overshoes and reused It relates to a method of manufacturing a non-sewn yoga overshoe that can be used as a virtual boundary that can be done.

The manufacturing method of the sewing-free yoga overshoes of the present invention is largely composed of steps S10 to S70.

In step S10,

The overskin body part 30 comprising the instep cover part 10 and the foot side part 20 branched and extended on both sides of the instep cover part 10, and the sole part coupled to the overbody body part 30 (40) and the reinforcing instep cover portion 12 for reinforcing the instep cover portion 10 constituting the overshoe body portion 30 is individually cut.

At this time, the overskin body portion 30 is cut into a single fabric with the instep cover portion 10 and the foot side portion 20 integrally branched and extended on both sides of the instep cover portion 10 .

Since the overshoe body part 30 forms the heel part 21 when the ends of the respective foot side parts 20 are coupled to each other, a separate fabric forming the heel part 21 is not required, and thus manufactured The process can be shortened.

In addition, the end portion of each of the foot side portions 20 constituting the heel portion 21 is cut to be gradually wider in width to increase the height of the portion corresponding to the heel of the human body so that the overshoe 100 does not come off. should take precedence

Step S20.

An adhesive is sprayed on the bonding surface of the cut reinforcing instep cover portion 12 to reinforce the instep cover portion 10 of the overshoe body portion 30, and then overlapped on the instep cover portion 10 and pressed with a heat press. To reinforce the instep cover (10).

Step S30,

Using a perforator in the reinforcing instep cover portion 12 overlapped with the instep cover portion 10 constituting the overshoe body portion 30, five toe opening holes 11 open to expose the toes are drilled.

At this time, it may further include a process of melting and heat-treating the opening hole 11 so as not to loosen all of the toe opening hole 11 .

Step S40,

In a state in which the ends of the two foot side parts 20 branched from the instep cover part 10 of the overshoe body part 30 are superimposed, they are put into an ultrasonic splicer, and ultrasonic waves are oscillated on the overlapped parts to be temporarily joined at the same time as cutting The heel portion 21 is formed through the first temporary contact portion 50a.

Here, by bonding the ends of the foot side portion 20, the first temporary welding portion 50a matches the end bonding lines of the two foot side portions 20 to be partially overlapped, and then the overlapped portion is made of ultrasonic waves oscillated in the ultrasonic bonding machine as a base material. It is formed by melting the base material and cutting at the same time as the temporary bonding.

On the other hand, the overshoe body 30 is a step of attaching a hot melt 60 to the upper edge of each of the foot side portions 20 in order to reinforce the overshoe opening 80 formed by bonding of the heel portion 21; (S41) may be further included.
Here, the hot melt 60 is that an adhesive layer is applied to a polyurethane layer. In the hot melt 60, the adhesive layer is melted by heat and pressure, and the polyurethane layer is attached to the upper edge of each foot side part 20 .

Here, step S41 may optionally be performed in a previous step of step S40.

Step S50,

The upper body part 30 is laminated on the sole part 40 and put into an ultrasonic bonding machine, and ultrasonic waves are oscillated to the edge of the laminated part to cut and temporarily join the second temporary bonding part 50b according to the foot size of the human body. Formed to integrate the overskin body part 30 and the sole part 40 .

Here, if the second folding part 50b is formed through ultrasonic waves, a separate cutting step can be eliminated, and the step of aligning the boundary surface of the cut sole part 40 and the boundary surface of the overbody part 30 can be eliminated. This can have the effect of improving productivity.

S60 step,

In order to reinforce the opening of the joint surfaces of the first and second ligatures 50a and 50b, a hot melt 60 is applied to the first and second ligated portions 50a and 50b, and then pressurized with a hot press to melt the hot melt. (60) is attached and reinforced by thermal fusion.

Here, the hot melt 60 is heat-sealed to reinforce the first and second temporary joints 50a and 50b, and an adhesive layer is applied to the polyurethane layer, and the hot melt 60 is produced by heat and pressure. It is integrally joined to the joint surfaces of the first and second junctions 50a and 50b.

S70 step,

In a state in which the sole part 40 and the overshoe body part 30 are inverted, the elastic band 70 in which the adhesive is sprayed in a concentric circle form from the instep cover part 10 to the sole part 40 is pressed with a heat press. Attached to complete the yoga overshoe (100).

Here, the elastic band 70 functions to tighten the heel portion to prevent peeling of the yoga overshoe 100 and further increase the wearing comfort.

In addition, the elastic band 70 may optionally be used as a virtual incision that can be reused by separating the yoga half overshoes 200 and the heel protection overshoes 300 .

On the other hand, in the step S70, the elastic band 70 may be configured by joining two rows spaced apart from each other so that an incision region 72, which is a virtual incision line that can be incised, is formed.

This is to enable the user to selectively use the yoga half overshoes 200 and the heel protection overshoes 300 when the user cuts and separates the cutout area 72 with a tool such as scissors.

As shown in Figures 8 and 9, the manufacturing method of the non-sewn yoga overshoes in another embodiment may be configured to further include a step S80.

For this, step S80 is

In the center of the elastic band 70, an incision line 71 that can be cut with a tool such as scissors is marked with a broken line.

This is when the user wears the non-sewn yoga overshoe 100, and if the front or back part of the overshoe is damaged, it is separated through the incision 71 and is not damaged as the yoga half overshoe 200 or heel protection overshoe 300. to make it reusable.

On the other hand, yoga overshoes manufactured by the non-sewn yoga overshoes of the present invention can be worn without exposing the toe openings to the toes, and using the toe openings as ventilation holes in the toe area.

In addition, after step S10, the process of applying urethane and silicone to prevent slipping on both sides of the sole portion may be further included.

The embodiments described in this specification and the configurations shown in the drawings are only the most preferred embodiment of the present invention and do not represent all the technical spirit of the present invention, so various equivalents that can be substituted for them at the time of the present application It should be understood that there may be variations and examples.

10: instep cover part 11: opening hole 12: reinforcing instep cover part
20: heel side 21: heel
30: oversea body part
40: sole part
50a: first tangible portion 50b: second tangible portion
60: hot melt
70: elastic band 71: incision line 72: incision area
80: overshoe opening
100: seamless yoga sandals
200: yoga half overshoes 300: heel protection overshoes

Claims (4)

In the manufacturing method of the sewing-free yoga overshoe,
The overskin body part 30 comprising the instep cover part 10 and the foot side part 20 branched and extended on both sides of the instep cover part 10, and the sole part coupled to the overbody body part 30 (40) and individually cutting the reinforcing instep cover portion 12 for reinforcing the instep cover portion 10 constituting the overshoe body portion 30; (S10)
Bonding the reinforcing instep cover portion 12 to overlap the instep cover portion 10 in order to reinforce the instep cover portion 10 of the overshoe body portion 30; (S20)
Perforating five toe opening holes 11 through which toes are opened in the reinforcing instep cover portion 12 overlapping the instep cover portion 10 of the overshoe body portion 30; (S30)
In a state in which the end of the foot side part 20 of the overskin body part 30 is partially overlapped, it is put into an ultrasonic splicer, and ultrasonic waves are oscillated to the overlapped part through a first temporary joining part 50a that is temporarily joined at the same time as cutting. Forming the heel portion 21; (S40)
The upper body part 30 is laminated on the sole part 40, put into an ultrasonic bonding machine, and ultrasonic waves are oscillated to the edge of the laminated part to cut and temporarily join the second temporary bonding part 50b according to the foot size of the human body. forming; (S50) and
Reinforcing the hot melt 60 by adding a hot melt 60 to the first and second adhesive portions 50a and 50b, and then attaching the hot melt 60 by thermal fusion by pressing with a hot press; (S60)
Yoga overshoes (100) by attaching an elastic band (70) in which the adhesive material is sprayed in a concentric circle form from the instep cover part (10) to the sole part (40) in a state in which the sole part (40) and the overshoe body part (30) are turned over ) to complete; (S70) is made, including,
The hot melt 60 is constituted by coating an adhesive layer on a polyurethane layer, and the adhesive layer is melted by heat and pressure, and the polyurethane layer is attached to the joint surface of the first and second adhesive parts 50a and 50b,
The elastic band 70 prevents the overshoe from peeling off, and is optionally used as a virtual incision that can be reused by separating it into a yoga half overshoe 200 and a heel protection overshoe 300. A method of manufacturing an overshoe.
According to claim 1,
The overshoe body part 30 of the step S40 attaches a hot melt 60 to the upper edge of each of the foot side parts 20 in order to reinforce the overshoe opening 80 formed by bonding the heel part 21 . further comprising; (S41),
The hot melt 60 is a method of manufacturing a non-sewn yoga overshoe, characterized in that the adhesive layer is melted by heat and pressure, and the polyurethane layer is attached to the upper edge of each of the foot side portions (20).
According to claim 1,
After step S70,
Marking an incision line 71 that can be cut with a tool such as scissors in the center of the elastic band 70 with a broken line;
According to claim 1,
In the step S70, the elastic band 70 is a method of manufacturing a non-sewn yoga overshoe, characterized in that it is joined in two rows spaced apart from each other to form an incision region 72 that is a virtual incision line that can be incised.

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