KR102420665B1 - Auto Repair LASER Processing Apparatus and System - Google Patents

Abstract

Disclosed are an AR laser processing device and a system. According to one aspect of an embodiment of the present invention, the AR laser processing device that analyzes the nature of a defect occurring in a substrate and selects an optimal processing method for repairing the same includes: a communication part that receives a detection result of a defect occurring in a substrate and an image of the substrate from the outside; a defect analysis part that analyzes information on defects generated in the substrate based on the image of the substrate and the detection result of the defect received by the communication part; and a processing method selection part for selecting a processing method to repair the defect based on the analysis result of the defect analysis part, thereby capable of automatically repairing defects properly.

Description

AR laser processing apparatus and system {Auto Repair LASER Processing Apparatus and System}

The present invention relates to an AR laser processing apparatus and system capable of detecting and repairing defects in a substrate by themselves.

The content described in this section merely provides background information for the present embodiment and does not constitute the prior art.

With the remarkable development of display device technology, technologies related to various types of image display apparatuses, such as liquid crystal displays and plasma displays, have been greatly advanced. In particular, in image display devices that realize large-scale and high-definition display, a high degree of technological innovation is progressing in order to reduce the manufacturing cost and improve image quality. High dimensional quality and high-precision surface properties are required for glass substrates mounted on such various devices and used to display images. In the manufacture of glass for display device use, etc., although a glass substrate is shape|molded by using various manufacturing apparatuses, it is generally performed to shape|mold into a predetermined shape after all inorganic glass raw materials are heat-melted and a molten glass is homogenized. At this time, due to various causes such as insufficient melting of glass raw materials, unintentional mixing of foreign substances during manufacturing, deterioration of molding equipment or temporary molding conditions, and defects occurring in the process of cutting to a desired size after completion. As a result, defects such as abnormality in surface quality may occur in the glass substrate.

In order to suppress the occurrence of such defects in the glass substrate, various countermeasures have been taken so far, but it is difficult to completely suppress the occurrence of defects, and even if the occurrence of defects can be suppressed to some extent, a glass substrate having defects If there is no technology to clearly identify the defects, defective products that should be originally defective are mixed in the glass substrates judged to be good products. Therefore, a technique for detecting defects in a glass substrate with high precision and discriminating the detected defects is very important.

As a method of inspecting and discriminating defects in glass substrates, the visual inspection method, which relies on the senses of the inspector, has been widely practiced from the past. revealing limits.

In order to solve this problem, an auto repair system has been introduced. The auto repair system automatically detects defects in the image of the board and performs repair.

However, since the conventional auto repair system has consistently repaired defects regardless of the location, type, or size of the defect in the substrate, it is difficult to properly repair the defect according to the defect.

An embodiment of the present invention is to provide an AR laser processing apparatus and system for automatically repairing defects appropriately by analyzing the characteristics of the defects detected in the substrate and selecting a processing method suitable for each detected defect. There is a purpose.

According to one aspect of the present invention, in the AR laser processing apparatus that analyzes the nature of the defects generated in the substrate and selects the optimal processing method in repairing them, the detection result of the defects occurring in the substrate from the outside and the image of the substrate are Based on the receiving communication unit and the communication unit receiving the image of the substrate and the detection result of the defect, the defect analysis unit that analyzes information on the defect occurring on the substrate and the defect analysis unit select a processing method to repair the defect based on the analysis result It provides an AR laser processing apparatus, characterized in that it comprises a processing method selection unit.

According to an aspect of the present invention, the defect analysis unit determines where the defect occurred in the substrate, whether it overlapped with a layer that should exist in the pixel, how much overlapped with the layer, and how much area and thickness the defect occurred. It is characterized by analyzing some or all of whether it has occurred.

According to one aspect of the present invention, the defect analysis unit detects the defect occurring on the substrate as a first case directly generated on the glass substrate rather than on a layer that should exist in the pixel or a second case generated by overlapping a layer that should exist in the pixel. It is characterized by distinguishing

According to one aspect of the present invention, the processing method selection unit is characterized in that, when the defect occurring on the substrate is the first case, the processing method is selected to adjust the number of overlaps without adjusting the energy of the laser to be irradiated.

According to an aspect of the present invention, the processing method selection unit is characterized in that the laser is adjusted so that the relatively thick portion of the thickness of the defect generated on the substrate is relatively more overlapped.

According to an aspect of the present invention, the processing method selection unit selects a processing method for adjusting the energy intensity of the laser to be irradiated without adjusting the number of overlapping lasers when the defect occurring on the substrate is the second case. .

According to one aspect of the present invention, the processing method selection unit is characterized in that the laser energy intensity is adjusted in consideration of whether a layer exists at the lower end of the defect in the direction in which the laser is irradiated to the defect.

According to one aspect of the present invention, the processing method selection unit is defective in the direction in which the laser is irradiated to the defect so that the laser of relatively weak energy is irradiated when there is a layer at the bottom of the defect in the direction in which the laser is irradiated as the defect. When there is no layer at the bottom of the , it is characterized in that a laser of relatively strong energy is irradiated.

According to one aspect of the present invention, there is provided.

As described above, according to one aspect of the present invention, there is an advantage in that defects can be automatically properly repaired by analyzing the characteristics of defects detected in the substrate and selecting a processing method suitable for each detected defect.

1 is a diagram showing the configuration of an AR laser processing system according to an embodiment of the present invention.
2 is a diagram illustrating a configuration of a defect detection apparatus according to an embodiment of the present invention.
3 is a diagram illustrating an image of a pixel in which no defect exists.
4 is a diagram illustrating an image in which each pixel is divided in an image of a substrate to be inspected and processed according to a defect detection apparatus according to an embodiment of the present invention.
5 is a diagram illustrating a process in which a defect detection apparatus according to an embodiment of the present invention detects a defect in a specific pixel in a substrate.
6 is a diagram showing the configuration of an AR laser processing apparatus according to an embodiment of the present invention.
7 to 9 are diagrams illustrating types of defects occurring in a substrate.
10 is a view illustrating a processing method selected for repairing a type of defect by the AR laser processing apparatus according to an embodiment of the present invention.
11 is a view illustrating the remaining processing method selected to repair one type of defect by the AR laser processing apparatus according to an embodiment of the present invention.
12 and 13 are diagrams illustrating a profile of a laser beam irradiated or controlled by a repair apparatus according to an embodiment of the present invention.

Since the present invention can have various changes and can have various embodiments, specific embodiments are illustrated in the drawings and described in detail. However, this is not intended to limit the present invention to a specific embodiment, it should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention. In describing each figure, like reference numerals have been used for like elements.

Terms such as first, second, A, and B may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component. and/or includes a combination of a plurality of related listed items or any of a plurality of related listed items.

When a component is referred to as being “connected” or “connected” to another component, it may be directly connected or connected to the other component, but it is understood that other components may exist in between. it should be On the other hand, when it is said that a certain element is "directly connected" or "directly connected" to another element, it should be understood that no other element is present in the middle.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. It should be understood that terms such as “comprise” or “have” in the present application do not preclude the possibility of addition or existence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification in advance. .

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

Terms such as those defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related art, and should not be interpreted in an ideal or excessively formal meaning unless explicitly defined in the present application. does not

In addition, each configuration, process, process or method included in each embodiment of the present invention may be shared within a range that does not technically contradict each other.

1 is a diagram showing the configuration of an AR laser processing system according to an embodiment of the present invention.

Referring to FIG. 1 , an AR laser processing system 100 according to an embodiment of the present invention includes a defect detection device 110 , an AR laser processing device 120 , and a repair device 130 .

The defect detection apparatus 110 detects a defect occurring in the substrate.

The defect detection apparatus 110 generates an image of a substrate to detect a defect in the substrate. The defect detection apparatus 110 analyzes the image of the substrate and recognizes each unit pixel included in the substrate in the image of the substrate. The defect detection apparatus 110 recognizes the coordinates of each unit pixel, and recognizes each layer in the pixel together with the coordinates of the pixel. Defects may occur throughout a pixel, but may only occur in some layers within a pixel. If only a pixel is recognized, there is a possibility that the defect detection apparatus 110 may not completely detect a specific location where a defect occurs in a pixel. Accordingly, the defect detection apparatus 110 detects in which unit pixel the defect is generated and in which layer within the pixel the defect is generated.

The defect detection apparatus 110 includes a pre-stored reference image of a unit pixel (hereinafter, abbreviated as 'reference image') and an image of each unit pixel (hereinafter, abbreviated as 'pixel image') for detecting defects in the substrate. ), it is determined whether a defect exists in each unit pixel. The defect detection apparatus 110 generates a subtracted image by subtracting the reference image and the pixel image, thereby detecting a defect in the subtracted image.

The defect detection apparatus 110 transmits information on the detected defect to the AR laser processing apparatus 120 so that the AR laser processing apparatus 120 can select an appropriate processing method to repair the detected defect. A detailed configuration and operation of the defect detection apparatus 110 will be described later with reference to FIGS. 2 to 5 .

The AR laser processing apparatus 120 receives information on the defect from the defect detection apparatus 110 , analyzes the defect, selects a processing method suitable therefor, and transmits the information to the repair apparatus 130 .

The AR laser processing apparatus 120 receives the information of the defect from the defect detection apparatus 110 and analyzes the nature of the defect. The AR laser processing apparatus 120 analyzes information such as which unit pixel the defect exists in, and to what layer if it exists. This is because the intensity of the laser to be irradiated for repair and the control for irradiating should be different depending on where and what layer the defect exists. To this end, the AR laser processing apparatus 120 analyzes the nature of the defect generated on the substrate.

The AR laser processing apparatus 120 selects an optimal processing method in repairing it according to the analyzed nature of the defect. When a defect does not occur on a separate layer and there is no configuration to be damaged by laser irradiation, it is desirable to focus on repairing the defect quickly. On the other hand, when a defect is generated on a certain layer, when the laser is arbitrarily irradiated, there is a high possibility that the laser may adversely affect even a layer in which an abnormality in the pixel does not occur. In this case, it is preferable that the energy of the laser to be irradiated is adjusted and irradiated. The AR laser processing apparatus 120 determines whether to properly repair the defect as the laser is irradiated with what profile, depending on the nature of the analyzed defect. The AR laser processing apparatus 120 transmits the determined laser profile along with the analyzed defect properties to the repair apparatus 130 so that the repair apparatus 130 can irradiate an optimal laser to repair the generated defect. The specific configuration and operation of the AR laser processing apparatus 120 will be described later with reference to FIGS. 6 to 9 .

The repair apparatus 130 repairs the defect by outputting a laser according to the laser profile received from the AR laser processing apparatus 120 . The repair apparatus 130 includes a laser oscillation unit (not shown) for oscillating a laser and a scanner (not shown) for adjusting the path, shape, and intensity of the oscillated laser. The repair apparatus 130 receives the nature of the defect and the laser profile for repairing it from the AR laser processing apparatus 120 . The repair apparatus 130 oscillates the laser according to the received laser profile using an oscillator (not shown). The repair apparatus 130 adjusts the laser profile to the location of the received defect using a scanner (not shown) and irradiates it. For example, the operation of a scanner (not shown) is illustrated in FIGS. 12 and 13 .

12 and 13 are diagrams illustrating a profile of a laser beam irradiated or controlled by a repair apparatus according to an embodiment of the present invention.

Referring to FIG. 12 , a scanner (not shown) may adjust a position at which a laser beam is output. For example, a portion 1210 of the defect 510 may be formed to be relatively thin and another portion 1220 may be formed to be relatively thick. When such defect analysis information is received, the scanner (not shown) performs a laser scan on the portion 1220 in which the defect is relatively thick, and the laser in the portion 1210 in which the defect is relatively thin, so that more lasers are scanned. It can be controlled to be scanned.

Alternatively, referring to FIG. 13 , the scanner (not shown) may adjust the shape of the laser beam to be irradiated according to the shape of the generated defect. For example, when a circular defect 1310 occurs on one layer 310 , a scanner (not shown) may adjust the laser to a circular shape to repair the corresponding defect 1310 . Conversely, when a square-shaped defect 1320 occurs on another layer 320 , a scanner (not shown) may repair the defect 1320 by adjusting the laser beam.

Referring back to FIG. 1 , a scanner (not shown) may be implemented as an encoder-type scanner. Accordingly, the coordinates of each unit pixel of the substrate for repair may be recognized, and the coordinates of the defect detection apparatus and each unit pixel may be linked.

FIG. 2 is a diagram showing the configuration of a defect detection apparatus according to an embodiment of the present invention, FIG. 3 is a diagram showing an image of a pixel in which a defect does not exist, and FIG. 4 is a diagram showing an image of a pixel having no defects. It is a view showing an image in which each pixel in an image of a substrate to be inspected and processed according to a defect detection apparatus is divided, and FIG. 5 is a defect detection apparatus according to an embodiment of the present invention detecting a defect in a specific pixel in the substrate It is a drawing showing the process.

Referring to FIG. 2 , the defect detecting apparatus 110 according to an embodiment of the present invention includes an image generating unit 210 , a pattern period recognition unit 220 , a memory unit 230 , a defect detecting unit 240 , and a control unit ( 250 ) and a communication unit 260 .

A substrate for detecting defects includes a plurality of pixels. In general, a substrate is composed of many pixels, and each pixel is also composed of a plurality of layers. Pixels in the substrate are implemented with a plurality of layers, such as an active layer, a gate layer, and a source and drain layer. In the process of producing a substrate, fine particles may be introduced to cause a defect on the substrate, and in particular, may be introduced into an arbitrary layer of a pixel in the substrate to cause a defect on a specific layer. The defect detection apparatus 110 may detect which pixel of which layer included in the substrate has a defect.

The image generator 210 generates an image of the substrate to detect defects in the substrate. The image generator 210 may be implemented as a device capable of generating an image of the substrate, such as a camera.

The pattern period recognition unit 220 recognizes the period of the unit pixel in the image of the substrate, and recognizes each unit pixel included in the substrate. The pattern period recognition unit 220 analyzes the image of the substrate to recognize each unit pixel included in the substrate. The unit pixel recognition unit 230 analyzes the image of the substrate in the horizontal and vertical directions, respectively, and recognizes the start x-coordinate and the start y-coordinate of each unit pixel. Since the unit pixel has a constant size, each unit pixel has a constant period. Accordingly, if the start coordinates of a specific unit pixel are recognized, the coordinates of all adjacent unit pixels or all unit pixels in the substrate may be recognized. The pattern period recognizing unit 220 recognizes the coordinates of each unit pixel by recognizing the period of the unit pixel in the image of the substrate as described above. This is shown in FIG. 4 .

Referring to FIG. 4 , numerous unit pixels exist in the image 400 of the substrate generated by the image generator 210 . In this case, the pattern period recognition unit 220 recognizes the coordinates of each unit pixel 300 by recognizing the start x/y coordinates of each unit pixel.

Referring back to FIG. 2 , when recognizing each pixel in the substrate, the pattern period recognizing unit 220 may also recognize each layer in the pixel. Defects may occur throughout a pixel, but may only occur in some layers within a pixel. In this case, if the pattern period recognizing unit 220 recognizes only the pixel, there is a possibility that the defect detection apparatus may not completely detect the specific location of the defect in the pixel. Accordingly, the pattern period recognition unit 220 recognizes each layer in the pixel.

The memory unit 230 stores a reference image of a unit pixel. The memory unit 230 selects the reference image of the unit pixel so that the defect detection unit 240, which will be described later, compares each unit pixel recognized by the pattern period recognition unit 220 and determines whether a defect exists in each unit pixel. Save. A reference image of a unit pixel is shown in FIG. 3 . As shown in FIG. 3 , the reference image 300 of the unit pixel stored in the memory unit 230 corresponds to the image 300 of the unit pixel in which a defect does not exist. The memory unit 230 stores an image of a unit pixel having no defects as a reference image, so that it is possible to detect whether a defect exists in each unit pixel by comparing it with the reference image in another configuration later. The reference image 300 of the unit pixel corresponds to an image divided up to the respective layers 310 and 320 in the unit pixel. Accordingly, the defect detection unit 240, which will be described later, can also detect which layer has the defect in the image of the unit pixel where the defect has occurred.

The defect detection unit 240 compares the reference image stored in the memory unit 230 with each pixel image to detect a defect occurring in each unit pixel. The contrast procedure is shown in FIG. 4 . The defect detector 240 compares the reference image 300 (refer to FIG. 4(a)) and each pixel image 500 (refer to FIG. 4(b)). The defect detector 240 may detect the defect 510 from the pixel image 500 in which the defect 510 is generated based on the contrast between the images 300 and 500 .

The control unit 250 controls the operation of each component in the defect detection apparatus 110 .

The communication unit 260 transmits the generated substrate image and the detection result of the defect detection unit 240 to the AR laser processing apparatus 120 .

6 is a diagram showing the configuration of an AR laser processing apparatus according to an embodiment of the present invention.

Referring to FIG. 6 , the AR laser processing apparatus 120 according to an embodiment of the present invention includes a communication unit 610 , a defect analysis unit 620 , a processing method selection unit 630 , and a memory unit 640 . .

The communication unit 610 receives the image of the substrate generated from the defect detection apparatus 110 and the detection result of the defect.

The communication unit 610 transmits the analysis result of the defect analysis unit 620 and the processing method selected by the processing method selection unit 630 to the repair apparatus 130 .

The defect analyzer 620 analyzes defect information based on the received image and defect detection result. The defect analyzer 620 analyzes defect information, mainly, information to be analyzed for repair of the defect. For example, the defect analyzer 620 determines where the defect occurred, whether it overlapped with a layer that should exist in the pixel, how much overlapped with the layer, and how much area and thickness the defect occurred. Analyze etc. When the defect analyzer 620 analyzes the thickness of the generated defect, the thickness of the defect may be analyzed using a separate measuring device (not shown). Examples of the defect information analyzed by the defect analysis unit 620 are shown in FIGS. 7 to 9 .

7 to 9 are diagrams illustrating types of defects occurring in a substrate.

When a defect 510 is detected by the defect detection apparatus 110 as shown in FIG. 7A , the defect analysis unit 620 analyzes information on the defect. Defects may be classified into defects shown in FIGS. 7(b), 7(c), 8 and 9 .

As shown in FIG. 7B , there is a case in which the defect 510 directly occurs on the glass substrate 710 rather than on a separate layer.

As shown in FIG. 7C , there is a case where the defect 510 occurs on the layer 720 formed on the glass substrate 710 .

As shown in FIG. 8 , a defect 510 may occur at a point where a hole in a layer is to be formed. When the defect 510 does not occur, a hole in the layer should be formed. However, when the defect 510 occurs, the hole is blocked and the hole is not formed.

As shown in FIG. 9 , there is a case in which a defect 510 is formed in most areas of one or more unit pixels in a substrate. As the defect 510 occurs as described above, the unit pixel in which the defect 510 occurs has a situation in which it is difficult to fully operate even if it is repaired.

Referring back to FIG. 6 , the defect analyzer 620 analyzes the defect information as described above.

The machining method selection unit 630 selects a machining method to repair the defect based on the defect information analyzed by the defect analysis unit 620 .

If there is no separate layer (must be present on the glass substrate) at the lower end of the defect 510 (the rear in the direction in which the laser is irradiated to the defect), as in the defect shown in FIG. 7(b) , , it is desirable to minimize the time (machining time) consumed for repairing without worrying about the damage that may occur at the bottom of the defect. Accordingly, the machining method selection unit 630 selects the machining method so that the repair is performed as shown in FIG. 10 .

10 is a view illustrating a processing method selected for repairing a type of defect by the AR laser processing apparatus according to an embodiment of the present invention.

The processing method shown in FIG. 10 is a processing method when a separate layer 720 exists at the lower end of the defect. The processing method selection unit 630 determines, from the defect analysis unit 620 , whether it overlaps with a layer that should exist in the pixel and how much overlap occurs with the corresponding layer. Accordingly, the processing method selection unit 630 distinguishes a portion 1010 that overlaps with the lower layer 720 and a portion 1020 that does not. When the laser is irradiated for repair of a defect, the processing method selection unit 630 selects a processing method such that the energy of the laser to be irradiated to each region 1010 and 1020 is differently irradiated. The processing method selection unit 630 reduces the processing time by irradiating a laser of relatively strong energy to the region 1020 where the layer does not exist at the bottom of the defect. On the other hand, the processing method selection unit 630 minimizes damage to the layer 720 by irradiating a laser of relatively weak energy to the region 1010 where the layer exists at the bottom of the defect. The processing method selection unit 630 adjusts the intensity of the laser energy irradiated to the region 1010 according to the thickness of the defect 510 generated on the layer 720 .

On the other hand, if there is a separate layer 720 at the bottom of the defect, as in the defect shown in FIG. . Accordingly, the machining method selection unit 630 selects the machining method so that the repair proceeds as shown in FIG. 11 .

11 is a view illustrating the remaining processing method selected to repair one type of defect by the AR laser processing apparatus according to an embodiment of the present invention.

The processing method shown in FIG. 11 is a processing method when only the glass substrate 710 is present without a separate layer 720 at the lower end of the defect. The processing method selection unit 630 determines the thickness of the generated defect. A relatively thick portion 1110 may exist, and a relatively thin portion 1120 may exist. The processing method selection unit 630 does not adjust the energy intensity as in the method described with reference to FIG. 8 , but adjusts the overlap rate of the irradiated laser. The processing method selection unit 630 allows the laser to be irradiated with relatively less overlapping in order to repair the relatively thin region 1120 , and the laser to repair the relatively thick region 1110 . to be more overlapped and investigated. Accordingly, the processing method selection unit 630 allows the defect to be repaired quickly and completely.

As with the defects shown in FIG. 8 , in order to remove only the defects formed in the holes and formed in the holes, the machining method selection unit 630 may select the following machining methods. When processing is performed on a defect formed in a specific portion within a unit pixel, the defect is repaired and a burr is generated. Burrs should be minimized as they adversely affect adjacent or repaired areas. Accordingly, the processing method selection unit 630 allows the laser having a preset amount of energy and a preset overlapping rate to minimize the occurrence of burrs in repairing defects. At this time, since the diameter (or area) of the formed defect is relatively larger than that of the laser to be irradiated, the processing method selection unit 630 indicates that the laser irradiated to one point (eg, the center of the defect) proceeds in a spiral. to repair the defect.

Alternatively, as in the case of the defect illustrated in FIG. 9 , since the unit pixel in which the defect occurs does not function properly anyway, damage to layers in the unit pixel does not need to be considered. Therefore, the processing method selection unit 630 repairs the defect 510 quickly by maximizing the overlap rate, the energy intensity of the laser, and the moving speed of the point where the rayer is irradiated so that the defect 510 can be repaired as quickly as possible. You can choose the processing method that allows you to do it.

Referring back to FIG. 6 , the memory unit 640 stores information received by the communication unit 610 .

The above description is merely illustrative of the technical idea of this embodiment, and various modifications and variations will be possible without departing from the essential characteristics of the present embodiment by those of ordinary skill in the art to which this embodiment belongs. Accordingly, the present embodiments are intended to explain rather than limit the technical spirit of the present embodiment, and the scope of the technical spirit of the present embodiment is not limited by these embodiments. The protection scope of this embodiment should be interpreted by the claims below, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present embodiment.

100: AR laser processing system
110: defect detection device
120: AR laser processing device
130: repair device
210: image generating unit
220: pattern period recognition unit
230: memory unit
240: defect detection unit
250: control unit
260, 610: communication unit
300: unit pixel
310, 320, 720: layer
400: substrate image
500: substrate image
510, 1110, 1120: Defect
620: defect analysis unit
630: processing method selection unit
640: memory unit
710: glass substrate

Claims (9)

In the AR laser processing apparatus that analyzes the nature of the defects generated in the substrate and selects the optimal processing method for repairing them,
a communication unit configured to receive a detection result of a defect occurring in the substrate and an image of the substrate from the outside;
a defect analysis unit for analyzing information on defects occurring in the substrate based on the image of the substrate received by the communication unit and the detection result of the defect; and
and a processing method selection unit for selecting a processing method to repair the defect based on the analysis result of the defect analysis unit,
The defect analysis unit,
Analyze some or all of where the defect occurred in the substrate, overlapped with a layer that should exist in the pixel, how much overlap occurred with the layer, and how much area and thickness the defect occurred,
Defects generated on the substrate are divided into a first case that occurs directly on the glass substrate rather than on a layer that should exist in a pixel, or a second case that occurs by overlapping a layer that should exist in a pixel,
AR laser processing apparatus, characterized in that when the defect occurring on the substrate is the second case, the processing method selection unit selects the processing method for adjusting the energy intensity of the laser to be irradiated without adjusting the number of overlapping lasers. delete delete According to claim 1,
The processing method selection unit,
AR laser processing apparatus, characterized in that selecting a processing method for adjusting the number of overlaps without adjusting the energy of the laser to be irradiated when the defect occurring on the substrate is the first case. 5. The method of claim 4,
The processing method selection unit,
AR laser processing apparatus, characterized in that the area where the thickness of the defect occurring on the substrate is relatively thick is adjusted so that the laser overlaps more. delete According to claim 1,
The processing method selection unit,
AR laser processing apparatus, characterized in that the laser energy intensity is adjusted in consideration of whether a layer exists at the bottom of the defect in the direction in which the laser is irradiated to the defect. 8. The method of claim 7,
The processing method selection unit,
When a layer exists at the bottom of the defect in the direction in which the laser is irradiated to the defect, a relatively weak energy laser is irradiated. AR laser processing apparatus, characterized in that the laser of energy is irradiated. delete

Images