KR102390155B1 - Wire processing device capable of processing round and semi-circular wires interchangeably - Google Patents

Abstract

The present invention relates to a processing device for processing the outer periphery of a wire, and more particularly to the wire processing device capable of processing circular and semi-circular wires interchangeably, which can selectively process wires with circular cross-sections and semi-circular cross-sections, and can simultaneously process the semi-circular wires while transferring a pair of the semi-circular wires in close contact with each other at flat parts thereof when beautifully processing wires by continuously cutting the outer periphery of the wires used as a material for manufacturing ornaments. To this end, the wire processing device capable of processing the circular and semi-circular wires interchangeably according to an embodiment of the present invention comprises: a supply unit that supplies the wire to be processed; an entry unit that guides the entry of the wire; a processing unit that cuts the outer periphery of the wire; a driving unit that drives the processing unit; a discharge unit that guides the processed wire to discharge the same; and a recovery unit that recovers the wire discharged through the discharge unit, wherein the processing unit includes: a guide tube that surrounds and supports the wire while the wire is being processed; a cutting unit that is provided to rotate together with the guide tube to cut and process the outer periphery of the wire; and a rotating plate that rotates the guide tube and the cutting unit together. In the guide tube, the semi-circular wire can be processed by combining a semi-circular wire supporting tool that can be processed while supporting the semi-circular wire by supporting the flat part of the wire having a semi-circular cross-section.

Description

Wire processing device capable of processing round and semi-circular wires interchangeably

The present invention relates to a processing apparatus for processing the outer periphery of a wire, and more particularly, in beautiful processing by continuously cutting the outer periphery of a wire used as a material for manufacturing ornaments, a wire having a circular cross section and It relates to a wire processing apparatus that can selectively process a semi-circular wire, and can process a round and a semi-circular wire interchangeably, which can simultaneously process the semi-circular wire as a pair so that the flat parts are in close contact with each other.

In general, jewelry made of precious metals can be manufactured and used as ornaments by processing the outer surface of the metal to inscribe a pattern or by processing the metal through chamfering to make the metal stand out in order to make the exterior look beautiful.

However, most of the engraving processing is done manually by the operator, and the pattern is not processed according to the skill of the operator, and the production process is not easy because the processing time is long. .

In particular, in processing thin wire-type metal, the engraving process is not practical because it is a very difficult task to engraving on the outer periphery of a substantially thin and round wire.

In order to solve the above problems, various methods of beautiful processing have been carried out by grinding the outer periphery of the wire while continuously passing through the grinder in processing the wire shape.

In particular, in Prior Document 1 (Korean Patent No. 10-1265471 Surface Processing Device for Long Chain), two grinders are arranged side by side and a belt-shaped chain is rotated through a jig to process the inside and outside of the chain, or the angle of the jig By changing the position of the surface to be processed by adjusting the position of the workpiece is variable and the configuration is disclosed that can be continuously processed.

However, in Prior Document 1, when processing a workpiece using a grinder, it is configured to process by changing only some angles, so that the part that can be processed in processing the workpiece is limited, and it can be processed as it is processed using a grinder A problem arises in that the pattern that exists is inevitably limited.

In Prior Document 2 (Registration Patent No. 10-1835306 Wire processing apparatus for ornaments) filed by the applicant of the present application to solve the above problems, it is rotated along the circumference of the wire and a configuration that can process a cutting pattern as a whole on the outer periphery of the wire This is disclosed.

In this prior document 2, the outer side of the wire can be processed as a whole, but only a circular wire can be processed, so a new design and cost reduction due to weight reduction and a new processing method that can sell the consumer price at a low price are required. .

Prior Document 1 (Korean Patent No. 10-1265471 Surface Processing Device for Long Chain) Prior Document 2 (Registration Patent 10-1835306 Wire processing device for ornaments)

The present invention has been devised to solve the above problems, and in processing the outer periphery of a metal wire for manufacturing ornaments, a circular wire or a semi-circular wire can be selectively processed, and a specific shape according to the shape of the cutter It becomes possible to cut and process the entire outer periphery of the wire continuously while the cutter rotates 360° along the outer periphery of the wire. By using a wire support tool to cut and process the opposite side to which the wire is transferred, it can be processed without moving the wire even when processing a semi-circle, and two semi-circular wires can be connected simultaneously to form a circle from both sides. An object of the present invention is to provide a wire processing apparatus capable of processing a circular and semi-circular wire that can be processed interchangeably.

A wire processing apparatus capable of processing a circular and semi-circular wire interchangeably according to the present invention for achieving the above object is a supply unit 100 for supplying a processing target wire, which is provided just behind the supply unit 100 and the wire The entry part 200 for inducing the entry, the processing part 300 provided right behind the entry part 200 for cutting and processing the outer periphery of the wire, and provided on one side of the processing part 300, The driving unit 400 for driving the processing unit 300, the discharging unit 500 that is provided right behind the processing unit 300 to guide and discharge the processed wire, and the discharge unit 500 are provided behind the discharging unit 500 In including a recovery unit 600 for recovering the wire discharged through the discharge unit 500, the processing unit 300 is provided while wrapping the outside of the wire entered into the processing unit 300 so that the wire is A guide tube 340 that wraps and supports the wire during processing, and a cutting unit 320 that is provided to rotate together with the guide tube 340 on the outside of the guide tube 340 to cut and process the outer periphery of the wire and a rotating plate 310 that forms a concentric circle with the guide tube 340 and rotates the guide tube 340 and the cutting part 320 together, wherein the guide tube 340 includes a wire having a semicircular cross-section. It is characterized in that the semi-circular wire can be processed by combining the semi-circular wire supporter 370 that can be processed while supporting the semi-circular wire by supporting the flat portion of the.

Here, the semi-circular wire support 370 is made of a length corresponding to the length of the guide tube 340 in the guide tube 340 having a circular space in which the wire is transported, and the semi-circular wire is formed in the guide tube 340 . ) is inserted into the semi-circular wire support surface 371 for supporting the flat portion of the semi-circular wire when transported and the other side of the semi-circular wire support surface 371 is formed of a semi-circular shape corresponding to the inner periphery of the guide tube 340 and a semi-circular wire is provided on the input direction side in the feed direction of the guide tube support surface 372 and the semi-circular wire to support not to flow when the guide tube 340 is processed inside the semi-circular wire support 370, according to the transfer of the semi-circular wire It is characterized in that it includes a locking part 373 to be fixed and maintained inside the guide tube 340 without being transferred together.

At this time, the cutting part 320 is rotated on the opposite side where the semi-circular wire is cut in the semi-circular wire support 370, and when the semi-circular wire is processed, the cutting part 320 is transferred to the semi-circular wire support 370 in the rotating process. ) It is characterized in that the cutter avoidance support 374 that can support the semicircular wire while avoiding to be caught is formed.

Wire processing apparatus capable of processing a circular and semi-circular wire interchangeably according to an embodiment of the present invention has the following effects.

First, a circular wire and a semi-circular wire are selectively input and transported, and there is an effect that can be continuously processed.

Second, there is an effect that the cutting pattern can be precisely processed by processing the semi-circular wire while stably supporting it so that the opposite side to which the semi-circular wire is transferred is not pushed.

Third, as semicircular wires can be processed, jewelry with a new aesthetic design can be manufactured, and cost can be reduced due to weight reduction, so that consumer prices can be supplied at low prices to satisfy consumer needs. It works.

Fourth, in processing the outer periphery of the wire, there is an effect that various patterns can be processed according to the shape of the cutter.

Fifth, since the entire outer periphery of the wire can be processed while rotating, there is an effect of forming a continuous pattern on the entire outer periphery of the wire.

Sixth, there is an effect that continuous processing is possible while adjusting the spacing of the patterns according to the feed speed of the wire.

Seventh, as the chips of the cut wire do not leak to the outside and most can be recovered and regenerated, there is an effect that can be used economically without wasting precious metal material.

1 is an overall perspective view of a wire processing apparatus capable of processing a circular and semi-circular wire interchangeably according to an embodiment of the present invention;
Figure 2 is an overall perspective view showing the direction of the driving part of the wire processing device capable of processing a circular and semi-circular wire interchangeably according to an embodiment of the present invention
Figure 3 is a view showing in detail the cover structure of the wire processing device that can interchangeably process a circular and semi-circular wire according to an embodiment of the present invention;
Figure 4 is a perspective view showing in detail the processing part of the wire processing apparatus that can interchangeably process a circular and semi-circular wire according to an embodiment of the present invention;
5 is a perspective view showing in detail a cutting part of a wire processing device capable of processing a circular and semi-circular wire interchangeably according to an embodiment of the present invention;
Figure 6 is a perspective view showing in detail the structure of the cutter adjusting unit of the wire processing device capable of processing a circular and semi-circular wire interchangeably according to an embodiment of the present invention;
7 is a perspective view showing in detail a guide tube and a semi-circular wire support of a wire processing device capable of processing a circular and semi-circular wire interchangeably according to an embodiment of the present invention;
Figure 8 is a partial cross-sectional perspective view showing in detail the coupling state of the guide tube and the semi-circular wire support of the wire processing apparatus capable of processing the circular and semi-circular wires interchangeably according to an embodiment of the present invention;
9 is an operation state diagram of a flow prevention ball in a wire processing device capable of processing a circular and semi-circular wire interchangeably according to an embodiment of the present invention;
10A to 10B are cross-sectional views illustrating a state in which the processing unit rotates around the outside of the wire in a wire processing apparatus capable of processing a circular and semi-circular wire interchangeably according to an embodiment of the present invention;
11 is a semi-circular wire (A), a round wire (B), a semi-circular wire (B) in a wire processing apparatus capable of processing a circular and semi-circular wire interchangeably according to an embodiment of the present invention, respectively showing a state (C) of two simultaneous processing of the semi-circular wire Example diagram
12 is a product photograph of an ornament manufactured using a wire processed by a wire processing device capable of processing a circular and semi-circular wire interchangeably according to an embodiment of the present invention;

The present invention relates to a wire processing apparatus, and by cutting and processing the entire outer periphery of a wire used as a material for manufacturing an ornament, a pattern is formed so that the appearance of the wire for manufacturing an ornament can be seen beautifully and speed It is possible to continuously process various patterns by changing the shape of the cutter. Round and semi-circular wires that can be processed selectively and interchangeably with semi-circular wires by improving the point that only the existing round wires can be processed It is characterized in that it relates to a wire processing device that can be processed interchangeably.

Hereinafter, a wire processing apparatus capable of processing a circular and semi-circular wire interchangeably according to an embodiment of the present invention having these characteristics will be described in detail with reference to the accompanying drawings.

1 is an overall perspective view of a wire processing device capable of processing a circular and semi-circular wire interchangeably according to an embodiment of the present invention, Figure 2 is a circular and semi-circular wire compatible processing according to an embodiment of the present invention It is an overall perspective view showing the direction of the driving part of the wire processing apparatus.

1 to 2 , the present invention largely includes a supply unit 100 , an entry unit 200 , a processing unit 300 , a driving unit 400 , a discharge unit 500 , a recovery unit 600 , and a cover 700 . ) is included.

The supply unit 100 supports and supplies the wire (W) in a state in which a large amount of the wire (W) is wound. It is configured to include a supply motor 120 for driving.

The supply drum 110 is further provided with a driven pulley 111 operated in connection with the supply motor 120 , and the supply motor 120 is connected with the driven pulley 111 to the driven pulley 111 side. The driving pulley 121 and the driven pulley 111 and the driving pulley 121 for transmitting the power of the supply motor 120 are connected to the driving pulley 121 and the driving pulley to be rotated by the supply motor 120 . It is configured to include a drive belt 122 that connects the driven pulley 111 associated with the 121 to rotate together.

The supply drum 110 gradually supports the wire W as the wire W enters the processing unit 300 side through the entry unit 200 in a state in which the wire W is wound. ) to allow the wire (W) to enter uniformly.

The entry part 200 is to enter and move the wire (W) wound on the supply drum 110 toward the processing part 300, while supporting both sides of the wire (W) by rotating the wire ( A guide roller 210 for guiding W) toward the processing unit 300 and a wire (W) provided in front of the guide roller 210 so that the wire is uniformly transferred to the guide roller 210 side. It is configured to include an entry guide 220 to guide.

The guide roller 210 is provided in a plurality of crossing each other at the upper and lower portions based on the path through which the wire W is transported, as viewed from the upper portion, so that the wire W forms a wave shape while maintaining the tension. It is possible to be transferred to the processing unit 300 side.

The entry guide 220 is formed with wire support holes 221 of various sizes corresponding to the standard of the wire W to be processed, so that the corresponding wire support hole 221 is applied according to the standard of the wire W. This allows the wire to be guided.

The processing unit 300 is able to process the entire outer periphery of the wire (W) entered through the entry unit 200, from the outside of the wire (W) based on the transfer path of the wire (W) A cutting unit 320 for processing the outer periphery of the wire W while continuously rotating and a rotating plate for rotating the cutting unit 320 so that the cutting unit 320 rotates the entire outer periphery of the wire (W) 310) is provided so that the outer periphery of the wire (W) can be processed while rotating along the entire outer periphery of the wire (W).

The driving unit 400 is configured to drive the processing unit 300 , and is fixedly provided with the rotating plate 310 on one side into which the wire W of the processing unit 300 enters, and the processing unit 300 at the center. A driven pulley 410 having an entry hole 411 through which the wire W enters toward the part 300 is formed, and a drive shaft is provided below the driven pulley 410 to be parallel to each other. A driving pulley 420 providing power to be rotated, a driving motor 430 connected to the rotation shaft of the driving pulley 420 to rotate the driving pulley 420, and the driving pulley 420 and the driven pulley ( It is configured to include a driving belt 440 that connects the 410 to each other and transmits the power of the driving pulley 420 to the driven pulley 410 side.

As a result, the cutting unit 320 provided in the processing unit 300 is rotated along the outer periphery of the wire W, so that the entire outer periphery of the wire W can be processed.

The discharge unit 500 is provided right behind the processing unit 300 to support and pull the processed wire (W), and power to discharge the wire (W) while maintaining the tension of the wire (W) A discharging unit driving motor 510 that provides is composed The support roller 520 includes a driving gear 511 provided in the discharge unit driving motor 510 and a driven gear 521 provided to correspond to the driving gear 511 at the rear of the support roller 520 . It is possible to discharge while supporting the wire (W) at a constant speed as they rotate in engagement with each other.

At this time, the outside of any one of the support rollers 520 provided to face each other in the upper and lower portions is made of a soft material such as silicone, rubber, or urethane, so that the wire W slides or is processed. It becomes possible to discharge while stably supporting the outer periphery of (W) so that deformation does not occur.

On the other hand, on the outer peripheral surface of the discharge part 500 side of the cover 700 surrounding the processing part 300, a wire detection sensor 530 capable of detecting the wire W just above the path through which the wire W is transported. is further provided.

The wire detection sensor 530 automatically stops the operation of the device when the wire W is cut during processing or the end of the wire W is sensed as the supply is completed in the supply unit 100, so that the operator can take a seat. Even if it is empty, unnecessary operation can be avoided.

The recovery unit 600 is provided at the rear of the discharge unit 500 to recover the wire W as it winds up the wire W discharged from the discharge unit 500 , and the recovery unit 600 ) includes a collecting drum 610 on which the wire W is wound, and a collecting motor 620 for rotating the collecting drum 610 .

In the recovery drum 610 and the recovery motor 620 , a driven pulley 611 provided in the recovery drum 610 and a driving pulley 621 provided in the recovery motor 620 are connected to each other by a driving belt 622 . As the power of the recovery motor 620 is transmitted to the driven pulley 611 by the driving pulley 621, the recovery drum 610 rotates and the wire W is wound and recovered.

The cover 700 covers the entire outer side of the processing unit 300 and is for sealing the chips cut from the wire W from leaking to the outside. It is provided to cover all of them.

Accordingly, it is possible to minimize the waste of raw materials through the recovery and regeneration of chips by preventing the chips generated by the processing in the processing unit from being lost to the outside.

Figure 3 is a view showing in detail the structure of the cover of the wire processing apparatus capable of processing the circular and semi-circular wire interchangeably according to an embodiment of the present invention.

Referring to FIG. 3 , the cover 700 includes a cover body 710 and a door 720 provided with a cover body 710 to rotate and open on the front surface of the cover body 710 , and a handle 721 for facilitating opening and closing is installed on the front surface. ) and a locking device 730 provided between the cover body 710 and the door 720 to maintain the cover 700 in a locked state and formed to open downwardly below the cover body 710, It is configured to include a chip recovery port 740 capable of recovering chips generated in the wire processing process.

At this time, the outer side of the cover body 710 and the door 720 closes a gap that may occur between the cover body 710 and the door 720 made of a metal material when the cover 700 is maintained in a closed state to close the precious metal. A packing 750 capable of preventing the jain chips from leaking to the outside is further provided.

Due to this, it is possible to minimize the waste of materials by collecting and regenerating the chips collected inside the cover 700 while preventing the chips generated in the wire processing process from leaking to the outside.

Figure 4 is a perspective view showing in detail the processing part of the wire processing apparatus capable of processing a circular and semi-circular wire interchangeably according to an embodiment of the present invention.

Referring to FIG. 4 , the processing unit 300 is integrally coupled with the driven pulley 410 of the driving unit and rotates together with the driven pulley 410 , and a rotating plate 310 in the form of a disk, and one side of the rotating plate 310 . A cutting unit 320 provided and individually operated for cutting, a cutter adjusting unit 330 provided between the cutting unit 320 and the rotating plate 310 to adjust the cutting position of the cutting unit 320, and the A guide tube 340 which is provided in the form of a tube on the other side provided with the driven pulley 410 of the rotating plate 310 to protect the outer periphery of the wire W and the cutting part 320 of the rotating plate 310 ) is provided on the other side and is configured to include a counterweight 360 for distributing the eccentric load of the rotating plate 310 in alignment with the driving unit and the center of gravity.

As a result, while stably rotating along the entire outer circumferential surface of the wire (W), it is possible to partially cut the wire (W) and process it beautifully.

5 is a perspective view showing in detail a cutting part of a wire processing apparatus capable of processing a circular and semi-circular wire interchangeably according to an embodiment of the present invention.

5, the cutting unit 320 of the present invention is a cutter 321 for processing the wire (W) and the cutter 321 is fixedly installed, the cutter rotating plate 322 for rotating the cutter 321, and It is connected to the cutter rotating plate 322 and rotates the cutter rotating plate 322 to include a cutting motor 323 that provides power so that the cutter 321 can cut the wire (W).

The cutter 321 is fixedly installed on the cutter rotating plate 322 by a cutter fixing bolt 321a, and can be easily replaced by using the cutter fixing bolt 321a when replacing.

Due to this, the cutting unit 320 can rotate along the entire outer periphery of the wire W by the rotation of the rotating plate 310 , and the cutting unit 320 is individually mounted on the rotating plate 310 while being fixedly installed. As the cutter 321 is rotated, it is possible to cut the entire outer periphery of the wire (W).

6 is a perspective view showing in detail the structure of the cutter adjusting unit of the wire processing apparatus capable of processing a circular and semi-circular wire interchangeably according to an embodiment of the present invention.

Referring to FIG. 6 , the cutter adjusting unit 330 includes a distance adjusting bracket 331 for adjusting the distance between the wire W and the cutter 321 and the angle at which the cutter 321 processes the wire (W). It is configured to include an angle adjustment bracket 332 to adjust the.

The distance adjusting bracket 331 is a distance adjusting hole 331a in the form of a small hole that adjusts the distance between the wire W and the cutter 321 to be farther or closer to each other while being fastened to the rotating plate 310 by a bolt; Angle adjustment holes 331b in the shape of an arc facing each other that can rotate the entire angle of the angle adjustment bracket 332 while being fastened by the angle adjustment bracket 332 and bolts are formed.

At this time, the distance adjusting bracket 331 is moved back and forth by a distance adjusting block 333 provided between the center of the rotating plate 310 and the distance adjusting bracket 331, and the distance adjusting block 333 is provided with two As the nut hole is formed and the bolt is fastened to the nut hole, the distance adjustment bracket 331 is pushed and supported, so that the distance between the distance adjustment bracket 331 and the wire W can be adjusted.

The angle adjustment bracket 332 is fastened with the angle adjustment hole 331b and is bolted within the range of the angle adjustment hole 331b so that the angle at which the cutter 321 processes the wire can be adjusted.

For this reason, in cutting the pattern on the wire (W), the shape of the cutter (321), the distance between the wire (W) and the cutter (321), and the angle at which the cutter (321) processes the wire (W) are adjusted to provide various shape can be cut.

7 is an exploded perspective view showing in detail a guide tube and a semi-circular wire supporter of a wire processing apparatus capable of processing a circular and semi-circular wire interchangeably according to an embodiment of the present invention, and FIG. 8 is an exploded perspective view according to an embodiment of the present invention It is a partial cross-sectional perspective view showing in detail the coupling state of the guide tube and the semi-circular wire support of the wire processing device capable of processing circular and semi-circular wires interchangeably.

7 and 8, the guide tube 340 is to protect the wire (W) of the portion provided with the cutting part 320 when the wire (W) is processed, the cutting part 320 is provided An exposure groove 341 for exposing only a portion of the wire W to be cut is formed on one side thereof.

A cutter avoidance groove 341a is formed in the exposed groove 341 at the machining position of the cutter 321 so that the cutter 321 can prevent collision with the cutter 321 when processing a wire.

The guide tube 340 is mounted and detached by the guide tube fixing member 350 provided integrally with the rotating plate 310 .

The guide tube fixing member 350 is a fixing bolt 351 for fixing the guide tube 340 while being fastened from the outside to the inside of the guide tube fixing member 350, and the fixing bolt 351 is fastened or separated. It is configured to include a fixing nut hole 352 for guiding and supporting.

At this time, the guide tube 340 is further provided with a semi-circular wire support 370 for supporting the other side of the semi-circular wire is processed so as to process the semi-circular wire.

The semi-circular wire support 370 is fitted and coupled to the inside to which the wire is transferred from the guide tube 340, and has a semi-circular shape corresponding to the semi-circular wire, and the flat portion of the semi-circular wire is a flat portion of the semi-circular wire. It is symmetrically positioned so as to be in close contact with the semicircular wire.

The semi-circular wire support 370 is provided in various standards according to the standards of the wire to be processed to correspond to the standards of the wire and can process wires of various standards.

This semi-circular wire support 370 is made of a semi-circular wire support surface 371 that supports the flat part of the back to which the semi-circular wire is transferred, and a semi-circular shape corresponding to the semi-circular wire on the opposite side where the semi-circular wire is processed. As the inner side of the 340 is supported, the semicircular wire is configured to include a guide tube support surface 372 that can be cut stably.

And in the direction in which the semi-circular wire support 370 is fitted to the guide tube 340, a locking part 373 for supporting the semi-circular wire support 370 is not pushed in and fixed in the process of cutting the wire is provided. .

The locking part 373 is provided so as to be caught on the guide tube 340 in the direction in which the wire is inserted, and may be fixed to the installation position without being pushed in in the process of processing and transporting the wire, and after processing is completed, the guide tube When separating at (340), it becomes possible to separate easily.

And in the state in which the semi-circular wire support 370 is installed, the semi-circular wire is cut at the point where the exposed groove 341 where the wire is cut and processed in the guide tube 340 is cut and the cutting part 320 is rotated. A cutter avoidance support 374 is formed that can avoid the cutter 321 from being caught in the semicircular wire support 370 when it moves and rotates opposite the cutting surface.

The cutter avoidance support 374 is formed to be concave with a minimum space only at the position where the cutter 321 is rotated and passes, so that the cutting position is not pushed when the semi-circular wire is processed while avoiding the cutter 321. .

The semi-circular wire support 370 made as described above is made of a carbide material, so that it can be firmly supported so as not to be pushed even when cutting the processing part of the semi-circular wire, and has high durability against deformation and abrasion, so that it can be used for a long time.

On the other hand, in the state where the semi-circular wire support 370 is coupled to the inner periphery of the guide tube 340 on the opposite side where the exposed groove 341 is formed, the flow prevention ball 342 is located at the position where the cutter avoidance support part 374 is formed. ) is further provided.

The flow prevention ball 342 has a built-in elastic member 342a that elastically supports the flow prevention ball 342 to always protrude to the inside of the guide tube 340 by elasticity in the guide tube 240, While maintaining the protruding state by the rotation, it is rotated together with the guide tube 340, and when the cutter 321 processes the wire, it is possible to buffer and stably support the opposite side.

Due to this, in the process of processing the wire (W), the cutter ( 321), it is possible to prevent damage or failure of the device by contacting the wire W with a part other than 321), as well as a guide tube 340 suitable for the shape of the cutter 321 or the angle of the cutting part 320. By applying this, it is possible to selectively process patterns of various shapes and sizes on the wire (W).

9 is an operation state diagram of a flow prevention ball in a wire processing apparatus capable of processing a circular and semi-circular wire interchangeably according to an embodiment of the present invention.

Referring to FIG. 9 , the flow prevention ball 342 protrudes toward the cutter avoidance support 374 during semi-circular wire processing to cushion the semi-circular wire support 370 and support it not to flow.

And as the cutting part 320 is rotated, it moves toward the semi-circular wire by the guide tube 340 rotated together, and is guided by the curved surface of the semi-circular wire and is pushed in to be positioned inside the guide tube 340 .

Thereafter, by the rotation of the guide pipe 340, the semi-circular wire support part 370 is positioned again as the cutter avoidance support part 374, and it protrudes by the elastic member 342a and comes in close contact with the cutter avoidance support part 374. It is possible to buffer the earth 70 and support it so that it does not flow.

At this time, the flow prevention ball 342 is rotatably provided so that even when the semi-circular wire is transferred, it is possible to smoothly maintain the semi-circular wire without interfering with the transfer of the wire while minimizing friction by the rotational force.

10A to 10B are cross-sectional views illustrating a state in which the processing unit rotates around the outside of the wire in a wire processing apparatus capable of processing a circular and semi-circular wire interchangeably according to an embodiment of the present invention.

10a to 10b, the cutting unit 320 is individually driven and after machining one side of the outer periphery of the wire (W), the rotating plate 310 is rotated concentrically with the outer periphery of the wire (W). It is possible to process the pattern along the entire outer periphery of the wire (W) while rotating together.

This makes it possible to process the entire outer periphery of the wire W beautifully.

11 is an embodiment diagram showing a semicircular wire, a circular wire, and two simultaneous processing states of a semicircular wire in a wire processing apparatus capable of processing a circular and a semicircular wire interchangeably according to an embodiment of the present invention.

Referring to FIG. 11 , in the present invention, when the semi-circular wire support 370 is combined in one device, it is possible to process a semi-circular wire, and in a state in which the semi-circular wire support 370 is separated, the cross-section of the wire forming a circle It is also possible to process two semi-circular wires at the same time while feeding the semi-circular wires so that the flat parts are attached to each other.

At this time, even in a state in which the semi-circular wire support 370 is not coupled, the flow prevention ball 342 buffers and supports the other side where the wire is processed to minimize the flow due to impact during processing so that the cutting state can be processed precisely. do.

12 is a product photograph of an ornament manufactured using a wire processed by a wire processing device capable of processing a circular and semi-circular wire interchangeably according to an embodiment of the present invention.

Referring to FIG. 12 , it is an actual photograph made with a ring using a processed semicircular wire, and a flat part is positioned in a semicircle on the inside that is worn on the finger, and a continuous cutting pattern is formed on the outside of the cut pattern. Through multi-angle light reflection, more beautiful products can be manufactured.

In addition, it is possible to reduce the weight worn on the finger by reducing the weight by about 50% compared to the existing weight, and it is possible to reduce the weight of the jewelery made of precious metal. be able to satisfy

The present invention made as described above can process the wire for ornaments in a unique and beautiful pattern by cutting and processing the entire outer side of the metal wire, which is a raw material, and can process the wire continuously while advancing at a constant speed. In addition to being able to maximize the efficiency, semi-circular wire or round wire can be selectively processed by installing a semi-circular wire support in one device, and two semi-circular wires are fed together and transported while simultaneously cutting two semi-circular wires. It can also be processed, and since chips generated during processing are prevented from leaking to the outside and the chips are separately recovered after processing, they can be recycled and used economically.

100: supply unit 110: supply drum
111: driven pulley 120: supply motor
121: drive pulley 122: drive belt
200: entry part 210: guide roller
220: entry guide 221: wire support hole
300: processing unit 310: rotating plate
320: cutting part 321: cutter
321a: cutter fixing bolt 322: cutter rotating plate
323: cutting motor 330: cutter control unit
331: distance adjustment bracket 331a: distance adjustment hole
331b: angle adjustment hole 332: angle adjustment bracket
333: distance control block 340: guide tube
341: exposed groove 341a: cutter avoiding groove
342: flow prevention ball 342a: elastic member
350: guide tube fixing member 351: fixing bolt
352: fixed nut hole 360: counterweight
370: semi-circular wire support 371: semi-circular wire support surface
372: guide tube support surface 373: locking part
374: cutter avoidance support 400: driving part
410: driven pulley 411: entry hole
420: drive pulley 430: drive motor
440: drive belt 500: discharge part
510: exhaust drive motor 511: drive gear
520: support roller 521: driven gear
530: wire detection sensor 600: recovery unit
610: recovery drum 611: driven pulley
620: recovery motor 621: drive pulley
622: drive belt 700: cover
710: cover body 720: door
721: handle 730: lock
740: chip recovery port 750: packing
760: over-open prevention chain W: wire
S: semicircular wire

Claims (3)

a supply unit 100 for supplying a wire to be processed; an entry part 200 provided just behind the supply part 100 to induce the wire to enter; a processing unit 300 provided just behind the entry unit 200 to cut and process the outer periphery of the wire; a driving unit 400 provided on one side of the processing unit 300 to drive the processing unit 300 ; a discharge unit 500 provided just behind the processing unit 300 to guide and discharge the processed wire; and a recovery unit 600 provided at the rear of the discharge unit 500 to recover the wire discharged through the discharge unit 500;
The processing unit 300 is provided while wrapping the outside of the wire entered into the processing unit 300, and a guide tube 340 that wraps around and supports the wire while the wire is being processed, and the guide tube 340 on the outside of the guide tube 340 . A cutting part 320 that is provided to rotate together with the guide pipe 340 to cut and process the outer periphery of the wire, and the guide pipe 340 and the concentric circle, the guide pipe 340 and the cutting part 320 together A semi-circular wire support 370 that includes a rotating plate 310 for rotating, but in the guide tube 340, supports a flat portion of a wire having a semi-circular cross-section to support the semi-circular wire. ) to be able to process a semi-circular wire,
The semi-circular wire support 370 is made of a length corresponding to the length of the guide tube 340 in the guide tube 340 having a circular space in which the wire is transferred, and the semi-circular wire is transferred to the guide tube 340 . The semi-circular wire support surface 371 that supports the flat portion of the semi-circular wire when it is inserted and transported and the other side of the semi-circular wire support surface 371 has a semi-circular shape corresponding to the inner periphery of the guide tube 340, so that the semi-circular wire is guided It is provided on the input direction side in the feed direction of the guide tube support surface 372 and the semi-circular wire that support it so that it does not flow when it is processed inside the tube 340 so that the semi-circular wire support 370 is transferred along with the transfer of the semi-circular wire. A wire processing device capable of processing a circular and semi-circular wire interchangeably, characterized in that it comprises a locking part 373 to be fixed and maintained inside the guide tube 340 without being not.
delete The method according to claim 1,
On the opposite side where the semi-circular wire is cut in the semi-circular wire support 370, the cutting part 320 is rotated, and when the semi-circular wire is processed, the cutting part 320 is transferred to the semi-circular wire support 370 in the rotation process. A wire processing device capable of processing a circular and semi-circular wire interchangeably, characterized in that the cutter avoidance support 374 capable of supporting the semi-circular wire while avoiding being caught is formed.

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