KR102376991B1 - Arcing forecasting and monitoring system through ground vlotage monitoring of plasma process equipment - Google Patents

Abstract

The present invention relates to an arcing forecast and monitoring system through plasma process equipment ground voltage monitoring.
More specifically, in the arcing forecasting and monitoring system for predicting and monitoring arcing occurring in the plasma generating unit, in the arcing forecasting and monitoring system for predicting and monitoring arcing occurring in the plasma generating unit, the plasma generating unit A probe head connected to the extended ground portion to measure the voltage of the ground portion (2) and transmitting the measured voltage as a voltage signal; and a high-speed detection unit configured to output a forecast signal necessary for predicting the occurrence of arcing and a monitoring signal necessary for monitoring using the voltage signal transmitted from the probe head. According to the present invention, by being configured to predict and monitor arcing occurring in the plasma process, there is an effect of being configured to quickly respond to arcing occurring in the plasma process.

Description

Arcing forecasting and monitoring system through plasma process equipment ground voltage monitoring {ARCING FORECASTING AND MONITORING SYSTEM THROUGH GROUND VLOTAGE MONITORING OF PLASMA PROCESS EQUIPMENT}

The present invention relates to an arcing forecast and monitoring system through plasma process equipment ground voltage monitoring.

More specifically, it relates to an arcing forecast and monitoring system through plasma process equipment ground voltage monitoring that is configured to predict and monitor arcing occurring in the plasma process, thereby preventing arcing occurring in the plasma process.

Plasma refers to a gaseous state separated into negatively charged electrons and positively charged ions at extremely high temperatures. At this time, the charge separation is quite high, but the overall number of negative and positive charges is the same, making it neutral. Plasma is called the fourth state of matter, and is used in various fields such as CVD (Chemical Vapor Deposition), PVD (Physical Vapor Deposition), coating, sputtering, nitriding of metals, carbonization crystal growth, diamond synthesis, etc. used in semiconductor processes, etc. It is used.

In order to proceed with the semiconductor device manufacturing process using plasma, the application of high-frequency power is required to generate plasma. At this time, leaving the process chamber in a floating state means that the application of this high-frequency power causes a charge to be applied to the process chamber. ) accumulates, causing undesirable problems with the safety of workers and equipment.

Therefore, by grounding the process chamber using a ground wire with low impedance, the charge accumulated in the process chamber is discharged to the outside.

However, if the charges accumulated in the process chamber are not properly discharged to the outside, micro-arcing occurs through electronic thermofield emission between the accumulated charges and the plasma, and between the parts with poor grounding conditions and the accumulated charges. Arcing occurs, and when this happens, the reliability of the process decreases because the plasma becomes unstable, and not only the lifespan of the equipment but also the stability of the operator operating the equipment is threatened.

Therefore, there is a need for an accurate detection and rapid response system for arcing occurring inside the plasma chamber.

Registered Patent Publication No. 10-1303040 (2013.08.28.) Registered Patent Publication No. 10-0476460 (2005.03.04.)

The present invention was created to solve the above problems. The problem to be solved by the present invention is to predict and monitor arcing occurring in the plasma process, thereby preventing arcing occurring in the plasma process. The purpose is to provide an arcing forecast and monitoring system through monitoring the ground voltage of plasma process equipment.

In order to solve the above problems, the arcing forecasting and monitoring system through plasma process equipment ground voltage monitoring according to the present invention is an arcing forecasting and monitoring system that predicts and monitors arcing occurring in the plasma generating unit. A probe head connected to a ground portion extending from the housing or the plasma generator or between the plasma generator and the ground portion to measure voltage and transmit the measured voltage as a voltage signal; and a high-speed detection unit configured to output a forecast signal necessary for predicting the occurrence of arcing and a monitoring signal necessary for monitoring using the voltage signal transmitted from the probe head.

In addition, the high-speed detection unit includes a first trigger that collects and triggers data obtained by branching the voltage signal transmitted from the probe head, and a forecast module that outputs a forecast signal; And a second trigger that collects and triggers another data branched from the voltage signal transmitted from the probe head, and a signal processing unit that processes the signal triggered from the second trigger into an arcing waveform signal and outputs a monitoring signal. It is characterized by including a module.

Additionally, the first trigger is configured to collect data at least at a faster rate than the first trigger.

In addition, the forecast module includes a first analog digital converter (ADC) that converts the voltage signal transmitted from the probe head into a first digital signal and transmits it; and a first memory configured to store a first digital signal transmitted from the first ADC, and the first trigger is configured to trigger a signal input to the first ADC.

In addition, the first memory is configured to output a signal predicting the occurrence of arcing when it is determined that a specific voltage change has occurred during a preset specific time in the first digital signal output from the first ADC.

In addition, the monitoring module includes a second ADC that converts the voltage signal transmitted from the probe head into a second digital signal and transmits it; and a second memory configured to store a second digital signal transmitted from the second ADC, and the second trigger is configured to trigger a signal input to the second ADC.

In addition, the high-speed detection unit includes an amplification module configured to amplify the voltage signal transmitted from the probe head and transmit it to the forecast module and monitoring module.

According to the arcing forecasting and monitoring system through plasma process equipment ground voltage monitoring according to the present invention, it is configured to predict and monitor arcing occurring in the plasma process, and is configured to quickly respond to arcing occurring in the plasma process. It works.

1 is a diagram showing the application of the arcing forecast and monitoring system through plasma process equipment ground voltage monitoring according to the present invention.
Figure 2 is a diagram showing an arcing forecast and monitoring system through plasma process equipment ground voltage monitoring according to the present invention.
Figure 3 is a reference diagram showing the probe head of the arcing forecasting and monitoring system through plasma process equipment ground voltage monitoring according to the present invention.
Figure 4 is a reference diagram showing a high-speed detection unit of the arcing forecasting and monitoring system through plasma process equipment ground voltage monitoring according to the present invention.
Figure 5 is a system schematic diagram for verifying the arcing detection method of the arcing forecast and monitoring system through plasma process equipment ground voltage monitoring according to the present invention.
Figure 6a is a voltage-time graph when arcing occurs during plasma generation in the arcing forecast and monitoring system through ground voltage monitoring of plasma process equipment according to the present invention.
Figure 6b is a graph showing verification data of the arcing detection method of the arcing forecast and monitoring system through plasma process equipment ground voltage monitoring according to the present invention.
Figures 7a and 7b are graphs measuring the ground, arcing generation electrode, and plasma floating potential of the arcing forecast and monitoring system through plasma process equipment ground voltage monitoring according to the present invention in Test 2 of Figure 5 and Test 3 of Figure 5.
Figure 8 is a graph showing the voltage waveform and current waveform according to the arcing signal generated in the plasma process.
Figure 8 is a diagram showing an existing technology for measuring the current of an arcing signal generated in a plasma process.
Figure 9 is a reference diagram comparing a system for measuring the voltage of an arcing signal generated in a plasma process and a system for measuring current.
Figure 10 is a graph showing the voltage waveform and current waveform according to the arcing signal generated in the plasma process.

Since the present invention can be modified in various ways and can have various embodiments, specific embodiments will be illustrated in the drawings and described in detail. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all changes, equivalents, and substitutes included in the spirit and technical scope of the present invention.

When a component is said to be "connected" or "connected" to another component, it is understood that it may be directly connected to or connected to the other component, but that other components may exist in between. It should be.

On the other hand, when it is mentioned that a component is “directly connected” or “directly connected” to another component, it should be understood that there are no other components in between.

The terms used in this specification are merely used to describe specific embodiments and are not intended to limit the invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, terms such as “comprise” or “have” are intended to designate the presence of features, numbers, processes, operations, components, parts, or combinations thereof described in the specification, but are not intended to indicate the presence of one or more other features. It should be understood that this does not exclude in advance the possibility of the existence or addition of elements, numbers, processes, operations, components, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by a person of ordinary skill in the technical field to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and unless clearly defined in the present application, should not be interpreted as having an ideal or excessively formal meaning. No.

Hereinafter, the present invention will be described in more detail with reference to the attached drawings. Prior to this, the terms or words used in this specification and claims should not be construed as limited to their usual or dictionary meanings, and the inventor should appropriately define the concept of terms in order to explain his or her invention in the best way. Based on the principle of definability, it must be interpreted with meaning and concept consistent with the technical idea of the present invention. In addition, if there is no other definition in the technical and scientific terms used, they have meanings commonly understood by those skilled in the art to which this invention pertains, and the gist of the present invention is summarized in the following description and accompanying drawings. Descriptions of known functions and configurations that may be unnecessarily obscure are omitted. The drawings introduced below are provided as examples so that the idea of the present invention can be sufficiently conveyed to those skilled in the art. Accordingly, the present invention is not limited to the drawings presented below and may be embodied in other forms. Additionally, like reference numerals refer to like elements throughout the specification. It should be noted that like elements in the drawings are represented by like symbols wherever possible.

The present invention relates to an arcing forecast and monitoring system through plasma process equipment ground voltage monitoring, which is configured to predict and monitor arcing occurring in a plasma process, thereby enabling rapid response to arcing occurring in a plasma process.

Hereinafter, the arcing forecasting and monitoring system through plasma process equipment ground voltage monitoring according to the present invention will be described in detail with reference to the attached drawings.

Figure 1 is a diagram showing the state in which the arcing forecast and monitoring system through plasma process equipment ground voltage monitoring according to the present invention is applied, and Figure 2 shows the arcing forecast and monitoring system through plasma process equipment ground voltage monitoring according to the present invention. It is a drawing, and Figure 3 is a reference diagram showing the probe head of the arcing forecast and monitoring system through plasma process equipment ground voltage monitoring according to the present invention, and Figure 4 is an arcing forecast and arcing forecast through plasma process equipment ground voltage monitoring according to the present invention. This is a reference diagram showing the high-speed detection part of the monitoring system.

According to the attached FIGS. 1 to 4, the arcing forecasting and monitoring system through plasma process equipment ground voltage monitoring of the present invention includes a housing of the plasma generator (1) or a ground portion (2) extending from the plasma generator (1). Alternatively, the probe head 100 is connected between the plasma generator 1 and the ground portion 2 to measure voltage and transmit the measured voltage as a voltage signal, and the voltage signal transmitted from the probe head 100. It includes a high-speed detection unit 200 configured to output a forecast signal necessary for forecasting the occurrence of arcing and a monitoring signal necessary for monitoring.

This arcing forecast and monitoring system through monitoring the ground voltage of plasma process equipment monitors the drop or rise of the voltage measured at the ground portion (2) when arcing occurs in the plasma generator (1) and monitors the voltage measured at the ground portion (2). It is configured to forecast and monitor arcing occurring in 1).

At this time, the arcing forecasting and monitoring system through plasma process equipment ground voltage monitoring of the present invention measures and monitors the voltage of the ground unit 2, and a constant voltage is measured, and then the voltage drops at a certain point in time. Or, if the voltage that was falling after the rise is achieved or the voltage that was rising is lowered, it is configured to determine that arcing has occurred in the plasma generator (1), and a constant voltage is measured, and then the voltage drops or rises at a certain point. When this is achieved, it can be configured to predict that arcing may occur in the plasma generator 1.

As shown in FIG. 3, in one embodiment of the present invention, the probe head 100 is installed on the ground portion 2 extending from the plasma generator 1 and is a copper plate on which a cable connection portion 120 is formed on one side. Copper sheet 110 and a plastic holder 130 provided on the outside of the copper plate 110 and configured to protect the copper plate may be included.

The copper plate 110 allows the voltage transmitted through the ground portion 2 to be transmitted to the coaxial cable 300, which will be described later, through the connection portion 120 and to the high-speed detection unit 200.

That is, the probe head 100 is configured to transmit the voltage flowing through the ground unit 2 to the high-speed detection unit 200.

The high-speed detection unit 200 is configured to output a feedback signal by collecting and triggering the voltage signal transmitted from the probe head 100, and an oscilloscope, etc. is typically used.

Additionally, the triggering refers to setting when the oscilloscope captures the waveform and displays it on the screen. The trigger synchronizes the captured waveform and the selected source so that the waveform can be displayed stably on the screen. Trigger sources include input channels, external trigger input, and line power, and in some oscilloscopes, a built-in mode that triggers fast edges and intermittent events that occur at speed. is also provided.

Meanwhile, as shown in FIG. 4, the high-speed detection unit 200 includes a first trigger 211 that collects and triggers one piece of data obtained by branching the voltage signal transmitted from the probe head 100, A forecast module 210 that outputs a forecast signal, a second trigger 221 that collects and triggers another data branched from the voltage signal transmitted from the probe head 100, and triggering from the second trigger 221. A monitoring module 220 that includes a signal processing unit 222 that processes the signal into an arcing waveform and outputs a monitoring signal may be included.

At this time, the first trigger 211 may be configured to collect data at a faster rate than the second trigger 221, if necessary.

The forecast module 210 includes a first analog digital converter (ADC) 212 that converts the voltage signal transmitted from the probe head 100 into a first digital signal and transmits it, and a first analog digital converter (212) transmitted from the first ADC (212). A first memory 213 configured to store one digital signal may be included, and the first trigger 211 may be configured to trigger a signal input to the first ADC 212.

At this time, the first memory 213 is used to predict the occurrence of arcing when it is determined that a voltage drop or voltage increase of a preset amount has occurred during a preset time in the first digital signal output from the first ADC 212. It may be configured to output a signal.

More preferably, the first memory 213 outputs a signal predicting the occurrence of arcing when a specific voltage change (ΔV) occurs during a specific time (Δt) in the first digital signal output from the first ADC (212). It can be configured to do so.

In one embodiment of the present invention, which will be described later, as shown in FIG. 6b, when a voltage drop or voltage rise of more than 20V or a specific voltage change (ΔV) occurs during a specific time (Δt) of 0.05 to 0.15 ㎲, a signal predicting the occurrence of arcing is output. It can be configured to do so.

At this time, the specific time (Δt) and specific voltage change (ΔV), which are the standards for outputting a signal for predicting the occurrence of arcing by the first memory 213, can be changed as much as desired depending on the implementation environment.

The first memory 213 may be configured to store the first digital signal transmitted from the first ADC 212 and analyze and process the frequency of arcing generated in the plasma generator 1. The first digital signal stored in the first memory 213 may be configured to be managed by an operator through a separate processing process.

The monitoring module 220 stores a second ADC 223 that converts the voltage signal transmitted from the probe head 100 into a second digital signal and transmits it, and a second digital signal transmitted from the second ADC 223. A second memory 224 configured to do so may be included, and the second trigger 221 may be configured to trigger a signal input to the second ADC 223.

The second memory 224 may be configured to store the second digital signal transmitted from the second ADC 223 and analyze and process the frequency of arcing generated in the plasma generator 1. The second digital signal stored in the second memory 224 may be configured to be managed by an operator through a separate processing process.

In addition, the high-speed detection unit 200 may include an amplification module 230 configured to amplify the voltage signal transmitted from the probe head 100 and transmit it to the forecast module 210 and the monitoring module 220.

The amplification module 230 increases the amplitude of the input signal and outputs it, between the probe head 100 and the forecast module 210 and between the probe head 100 and the monitoring module 220. It is provided and configured to amplify and transmit the voltage signal.

The amplification module 230 uses a circuit element that can amplify a signal, such as a transistor or an electric field effect transistor (FET), and the transistor or FET inputs electrical energy supplied from the amplifier's power source regardless of the input signal. It is configured to output a signal that increases the amplitude of the input signal by controlling it with a signal.

A representative example of the amplification module 230 is an audio amplifier at home, and the amplifier can use a very weak electrical signal obtained from the magnetic head of a tape record, a record, or a CD pickup to sound through a speaker through the action of a transistor or FET. It is configured to amplify a signal of potentially large amplitude.

The arcing forecasting and monitoring system through plasma processing equipment ground voltage monitoring of the present invention includes a coaxial cable configured to transmit a signal, with one side connected to the probe head 100 and the other side connected to the high-speed detection unit 200. 300) may be further included.

This coaxial cable 300 is a cable with a concentric cross section with conductors arranged in the center and around it and is configured to transmit the signal output from the probe head 100 to the high-speed detection unit 200. .

The coaxial cable 300 can be used to transmit high-frequency signals because the electrical signal flowing through the central copper wire receives less external electrical interference due to the external copper network surrounding it, resulting in less power loss.

Figure 5 is a schematic diagram for verifying the arcing detection method of the arcing forecast and monitoring system through plasma processing equipment ground voltage monitoring according to the present invention, and Figure 6a is an arcing forecast and monitoring through plasma process equipment ground voltage monitoring according to the present invention. It is a voltage-time graph when arcing occurs during plasma generation in the system, and Figure 6b is a graph showing verification data of the arcing detection method of the arcing forecast and monitoring system through monitoring the ground voltage of the plasma process equipment according to the present invention.

According to the attached FIGS. 5 to 6B, an environment in which direct current can flow to the plasma generating electrode was created to create an environment with a high plasma potential, and in addition, arcing ignition was used to facilitate arcing. Probe (AIP) probe was installed. A DC power supply was connected to the AIP probe to apply negative voltage and control the voltage, thereby controlling the frequency and intensity of arcing occurrence.

The floating potential probe was inserted in a direction perpendicular to the AIP probe to measure the plasma floating potential. To measure arcing occurrence, the voltage and floating potential of the AIP probe were monitored using an oscilloscope (TDS3054B, Tektronix) and a 100:1 probe. And as shown in Figure 5, the potentials of Test 1, Test 2, and Test 3 were measured from the ground close to the AIP using a 10:1 probe, and in this case, the main ground was used as the ground of the probe. To trigger arcing, the voltage change of the AIP probe was triggered using a trigger signal generator (DG645), and data was collected by connecting the signal output of the trigger signal generator (DG645) to an oscilloscope.

Meanwhile, 5.0 sccm of argon gas was injected into the plasma generation chamber to maintain the chamber pressure at 28.1 mTorr, 50 W was applied to the RF electrode to generate plasma, and the reflected wave power was maintained at 0 W through an impedance matching device. -50 V was applied to the AIP probe to induce intermittent arcing.

First, in order to verify whether the changes in the AIP voltage signal and the floating potential signal are signals due to arcing, the results of simultaneously measuring the voltage applied to the RF electrode, the AIP probe, and the floating potential are shown in Figure 6a.

At the point when arcing occurred, the voltage applied to the RF electrode decreased to 0 V within a few μs and showed recovery characteristics after 20 μs. It was confirmed that the floating potential was also maintained at about 290 V and showed the same pattern as the electrode voltage.

It is a well-known fact that the plasma floating potential decreases after such arcing occurs. Looking at the voltage of the AIP probe measured at the same time, it can be seen that it is maintained at the initial setting of -50 V, but after arcing occurs, it overshoots to a positive voltage and fluctuates for a long time. Therefore, the voltage signal pattern of the AIP probe as shown in Figure 6a can be confirmed as a signal due to arcing.

Figure 6b is a graph measuring the ground voltage, AIP probe, and floating potential at the Test 1 location when arcing occurred in a situation where no voltage was applied to the AIP voltage.

Before arcing occurs, the voltage of the AIP probe oscillates due to RF noise. It can be seen that the AIP voltage rises 100 ns before arcing occurs, and then decreases again after reaching the maximum value. In the case of plasma floating potential, it can be seen that the floating potential value decreases from the point where the voltage of the AIP probe begins to decrease after reaching the maximum value.

The ground signal at Test 1 shows a similar pattern to the AIP signal. It can be seen that the initial potential value oscillates and then the ground signal rises to a negative value at the same time as the AIP signal increases.

At this time, the signal-to-noise ratio is about 4.5. Therefore, it can be confirmed that the arcing occurrence signal can be measured at the same time by measuring the ground voltage.

What is noteworthy here is that the ground voltage signal changes to be equal to AIP before arcing occurs and the plasma is affected, that is, before the plasma floating potential decreases. In other words, if the ground signal is measured at high speed, it can be confirmed that it can be used as an arcing occurrence prediction signal.

FIGS. 7A and 7B are graphs showing the grounding, arcing generation electrode, and plasma floating potential of the arcing forecast and monitoring system through plasma process equipment ground voltage monitoring according to the present invention measured in Test 2 of FIG. 5 and Test 3 of FIG. 5 .

According to the attached FIGS. 7A and 7B, [0, 1] normalization data was processed to better represent changes in each signal over time. As shown in Figures 7a and 7b, it can be seen that the ground signal is measured equally well as the arcing signal even at Test 2 and Test 3 positions far from the AIP electrode. Therefore, it can be seen that not only the location close to the AIP but also the ground signal from the impedance matching device or the wall of the plasma generating vessel can be used as an arcing detection signal. Accordingly, it can be confirmed that the arcing forecasting and monitoring system through plasma process equipment ground voltage monitoring according to the present invention is not dependent only on plasma generation grounding equipment and can be installed and used in grounding equipment of various systems.

In conclusion, the above experiment verified that the arcing forecasting and monitoring system through plasma process equipment ground voltage monitoring according to the present invention can operate well.

Figure 8 is a diagram showing existing technology for measuring the current of an arcing signal generated in a plasma process, and Figure 9 is a reference diagram comparing a system for measuring the voltage of an arcing signal generated in a plasma process and a system for measuring current. , Figure 10 is a graph showing the voltage waveform and current waveform according to the arcing signal generated in the plasma process.

According to the attached Figure 8, the prior art is to ground the plasma process chamber (10p), install a coil (30p) around the electric wire flowing through the ground during the process, and measure the induced current induced in the coil. It is configured to determine that it is in an abnormal state and that arcing has occurred when the induced current is above the reference value.

According to the attached FIG. 9, the conventional technology (right) detects arcing by measuring the current of the arcing signal generated in the plasma process and the present invention detects arcing by measuring the voltage of the arcing signal generated in the plasma process. If the technology (left) is compared according to Kirchhoff's law, the following results can be obtained as [Equation 1] and [Equation 2].

, k는 결합 계수(coupling coefficient)이고, ω는 펄스신호의 주파수를 나타냄here,

, k is the coupling coefficient, and ω represents the frequency of the pulse signal.

By comparing the voltage of the current measurement method (prior art) and the voltage measurement method in Equation 1 above, the following equation can be obtained.

Generally, since it is within the range of 0 ≤ k ≤ 1, the result of Equation 2 is always greater than 1.

In other words, since the voltage of the voltage measurement method is greater than 1 than the current measurement method, it can be seen that the sensitivity of the voltage measurement method is superior to the current measurement method.

In addition, according to the attached FIG. 10, the black waveform represents the waveform according to the arcing signal generated in the plasma process, the blue waveform represents the voltage waveform measured from the arcing signal, and the red waveform represents the voltage waveform measured from the arcing signal. It represents the current waveform.

As shown in FIG. 10, when the arcing signal waveform (black) occurs, the voltage waveform (blue) immediately responds to the arcing signal waveform (within 0.5 ns) and shows initial behavior similar to the arcing signal waveform, while the current waveform (red It can be seen that (color) shows a much slower response compared to the voltage waveform. In addition, it can be seen that the measured value of the voltage waveform quickly converges to 0 after arcing occurs (after 2 ns), but the current waveform does not converge to 0 and the measurement signal diverges.

In other words, it can be easily seen from the simulation results of FIG. 10 that the voltage measurement method is significantly superior to the existing current measurement method in both the responsiveness to the arcing signal and the followability of the arcing signal.

According to the present invention, by being configured to predict and monitor arcing occurring in the plasma process, there is an effect of being configured to prevent arcing occurring in the plasma process.

In the above description, various embodiments of the present invention have been presented and explained, but the present invention is not necessarily limited thereto, and those skilled in the art will understand various embodiments without departing from the technical spirit of the present invention. It can be seen that branch substitution, transformation, and change are possible.

1: Plasma generator 2: Ground portion
100: Probe head
110: copper plate 120: connection part
130: plastic holder
200: High-speed detection unit
210: Forecast module 211: First trigger
212: 1st ADC 213: 1st memory
220: Monitoring module
221: second trigger 222: signal processing unit
223: 2nd ADC 224: 2nd memory
230: Amplification module
300: Coaxial cable

Claims (7)

delete In the arcing forecasting and monitoring system that predicts and monitors arcing occurring in the plasma generator,
The voltage is measured by connecting the housing of the plasma generator 1 or the ground portion 2 extending from the plasma generator 1 or between the plasma generator 1 and the ground portion 2, and the measured voltage is A probe head 100 that transmits a voltage signal; and
A high-speed detection unit 200 configured to output a forecast signal necessary for predicting the occurrence of arcing and a monitoring signal necessary for monitoring using the voltage signal transmitted from the probe head 100;
includes,
In the high-speed detection unit 200,
A forecast module 210 that includes a first trigger 211 that collects and triggers data obtained by branching the voltage signal transmitted from the probe head 100, and outputs a forecast signal; and
A second trigger 221 collects and triggers another data branched from the voltage signal transmitted from the probe head 100, and processes the signal triggered from the second trigger 221 into an arcing waveform signal to generate a monitoring signal. A monitoring module 220 including an output signal processing unit 222;
An arcing forecast and monitoring system through plasma process equipment ground voltage monitoring, which includes:
According to paragraph 2,
The first trigger 211 is,
An arcing forecast and monitoring system through plasma process equipment ground voltage monitoring, characterized in that it is configured to collect data at least at a faster rate than the second trigger 221.
According to paragraph 2,
In the forecast module 210,
A first analog digital converter (ADC) 212 that converts the voltage signal transmitted from the probe head 100 into a first digital signal and transmits it; and
A first memory 213 configured to store the first digital signal transmitted from the first ADC 212;
includes,
The first trigger 211 is,
An arcing forecast and monitoring system through plasma process equipment ground voltage monitoring, characterized in that it is configured to trigger a signal input to the first ADC (212).
According to clause 4,
The first memory 213 is,
Plasma, characterized in that it is configured to output a signal predicting the occurrence of arcing when it is determined that a specific voltage change (ΔV) has occurred during a preset specific time (Δt) in the first digital signal output from the first ADC (212). Arcing forecasting and monitoring system through process equipment ground voltage monitoring.
According to paragraph 2,
In the monitoring module 220,
a second ADC (223) that converts the voltage signal transmitted from the probe head 100 into a second digital signal and transmits it; and
a second memory 224 configured to store a second digital signal transmitted from the second ADC 223;
includes,
The second trigger 221 is,
An arcing forecast and monitoring system through plasma process equipment ground voltage monitoring, characterized in that it is configured to trigger a signal input to the second ADC (223).
According to paragraph 2,
In the high-speed detection unit 200,
Plasma process equipment ground voltage monitoring, characterized in that it includes an amplification module 230 configured to amplify the voltage signal transmitted from the probe head 100 and transmit it to the forecast module 210 and the monitoring module 220. Arcing forecasting and monitoring system.

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