KR102373941B1 - 반도체 웨이퍼의 결함 자동 분류를 위한 결정 트리 구성 - Google Patents

반도체 웨이퍼의 결함 자동 분류를 위한 결정 트리 구성 Download PDF

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KR102373941B1
KR102373941B1 KR1020167014743A KR20167014743A KR102373941B1 KR 102373941 B1 KR102373941 B1 KR 102373941B1 KR 1020167014743 A KR1020167014743 A KR 1020167014743A KR 20167014743 A KR20167014743 A KR 20167014743A KR 102373941 B1 KR102373941 B1 KR 102373941B1
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defects
floating
trees
class
floating trees
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KR20160083055A (ko
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치엔-후에이 아담 첸
크리스토퍼 마허
패트릭 휴에트
타이-캄 응
존 알. 조단 Iii
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케이엘에이 코포레이션
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H10P74/203—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G06F18/243—Classification techniques relating to the number of classes
    • G06F18/24323—Tree-organised classifiers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G06F18/20—Analysing
    • G06F18/24—Classification techniques
    • G06F18/245—Classification techniques relating to the decision surface
    • G06K9/6282—
    • G06K9/6285—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H10P74/23—

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Data Mining & Analysis (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Evolutionary Biology (AREA)
  • Evolutionary Computation (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Artificial Intelligence (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Quality & Reliability (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
KR1020167014743A 2013-11-03 2014-11-03 반도체 웨이퍼의 결함 자동 분류를 위한 결정 트리 구성 Active KR102373941B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201361899220P 2013-11-03 2013-11-03
US61/899,220 2013-11-03
US201461972418P 2014-03-31 2014-03-31
US61/972,418 2014-03-31
US14/257,921 US9489599B2 (en) 2013-11-03 2014-04-21 Decision tree construction for automatic classification of defects on semiconductor wafers
US14/257,921 2014-04-21
PCT/US2014/063668 WO2015066602A1 (en) 2013-11-03 2014-11-03 Decision tree construction for automatic classification of defects on semiconductor wafers

Publications (2)

Publication Number Publication Date
KR20160083055A KR20160083055A (ko) 2016-07-11
KR102373941B1 true KR102373941B1 (ko) 2022-03-11

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KR1020167014743A Active KR102373941B1 (ko) 2013-11-03 2014-11-03 반도체 웨이퍼의 결함 자동 분류를 위한 결정 트리 구성

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US (1) US9489599B2 (enExample)
JP (1) JP6576342B2 (enExample)
KR (1) KR102373941B1 (enExample)
TW (1) TWI617799B (enExample)
WO (1) WO2015066602A1 (enExample)

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JP6162909B2 (ja) * 2015-07-31 2017-07-12 楽天株式会社 木構造データ編集装置、木構造データ編集方法、及びプログラム
WO2017024065A1 (en) * 2015-08-05 2017-02-09 Kla-Tencor Corporation Range-based real-time scanning electron microscope non-visual binner
TWI737659B (zh) 2015-12-22 2021-09-01 以色列商應用材料以色列公司 半導體試樣的基於深度學習之檢查的方法及其系統
US10204290B2 (en) * 2016-10-14 2019-02-12 Kla-Tencor Corporation Defect review sampling and normalization based on defect and design attributes
US10185728B2 (en) * 2016-12-19 2019-01-22 Capital One Services, Llc Systems and methods for providing data quality management
TWI660322B (zh) 2018-05-17 2019-05-21 國立成功大學 考慮機台交互作用之辨識良率損失原因的系統與方法
US11321633B2 (en) * 2018-12-20 2022-05-03 Applied Materials Israel Ltd. Method of classifying defects in a specimen semiconductor examination and system thereof
US12038802B2 (en) 2019-10-14 2024-07-16 Pdf Solutions, Inc. Collaborative learning model for semiconductor applications
CN113298166A (zh) * 2021-06-01 2021-08-24 中科晶源微电子技术（北京）有限公司 缺陷分类器和缺陷分类方法、装置、设备及存储介质
WO2023166584A1 (ja) * 2022-03-02 2023-09-07 株式会社アドバンテスト 半導体試験結果分析装置、半導体試験結果分析方法およびコンピュータプログラム
WO2023166585A1 (ja) * 2022-03-02 2023-09-07 株式会社アドバンテスト 半導体試験結果分析装置、半導体試験結果分析方法およびコンピュータプログラム
US20250117915A1 (en) * 2023-10-06 2025-04-10 Applied Materials, Inc. Optical inspection-based automatic defect classification

Citations (3)

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JP2004047939A (ja) * 2002-05-23 2004-02-12 Hitachi High-Technologies Corp 欠陥分類器の生成方法および欠陥自動分類方法
JP2009103508A (ja) * 2007-10-22 2009-05-14 Hitachi Ltd 欠陥分類方法及びその装置
JP2011254084A (ja) * 2011-06-27 2011-12-15 Hitachi High-Technologies Corp 欠陥分類方法及びその装置

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US6148099A (en) 1997-07-03 2000-11-14 Neopath, Inc. Method and apparatus for incremental concurrent learning in automatic semiconductor wafer and liquid crystal display defect classification
US6922482B1 (en) * 1999-06-15 2005-07-26 Applied Materials, Inc. Hybrid invariant adaptive automatic defect classification
US7602962B2 (en) 2003-02-25 2009-10-13 Hitachi High-Technologies Corporation Method of classifying defects using multiple inspection machines
JP4908995B2 (ja) 2006-09-27 2012-04-04 株式会社日立ハイテクノロジーズ 欠陥分類方法及びその装置並びに欠陥検査装置
JP4616864B2 (ja) 2007-06-20 2011-01-19 株式会社日立ハイテクノロジーズ 外観検査方法及びその装置および画像処理評価システム
US8233494B2 (en) 2008-01-22 2012-07-31 International Business Machines Corporation Hierarchical and incremental multivariate analysis for process control
US8315453B2 (en) 2010-07-27 2012-11-20 Applied Materials Israel, Ltd. Defect classification with optimized purity
US8502146B2 (en) 2011-10-03 2013-08-06 Kla-Tencor Corporation Methods and apparatus for classification of defects using surface height attributes
TWI574136B (zh) * 2012-02-03 2017-03-11 應用材料以色列公司 基於設計之缺陷分類之方法及系統
TW201339572A (zh) * 2012-03-21 2013-10-01 Optivu Vision System Corp 元件內部缺陷之檢測裝置及方法
US8948494B2 (en) 2012-11-12 2015-02-03 Kla-Tencor Corp. Unbiased wafer defect samples

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004047939A (ja) * 2002-05-23 2004-02-12 Hitachi High-Technologies Corp 欠陥分類器の生成方法および欠陥自動分類方法
JP2009103508A (ja) * 2007-10-22 2009-05-14 Hitachi Ltd 欠陥分類方法及びその装置
JP2011254084A (ja) * 2011-06-27 2011-12-15 Hitachi High-Technologies Corp 欠陥分類方法及びその装置

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Publication number Publication date
TW201525450A (zh) 2015-07-01
KR20160083055A (ko) 2016-07-11
TWI617799B (zh) 2018-03-11
US20150125064A1 (en) 2015-05-07
JP2017502500A (ja) 2017-01-19
US9489599B2 (en) 2016-11-08
JP6576342B2 (ja) 2019-09-18
WO2015066602A1 (en) 2015-05-07

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