KR102351349B1 - 반도체 응용들을 위한 저해상도 이미지들로부터 고해상도 이미지들의 생성 - Google Patents

반도체 응용들을 위한 저해상도 이미지들로부터 고해상도 이미지들의 생성 Download PDF

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KR102351349B1
KR102351349B1 KR1020207002904A KR20207002904A KR102351349B1 KR 102351349 B1 KR102351349 B1 KR 102351349B1 KR 1020207002904 A KR1020207002904 A KR 1020207002904A KR 20207002904 A KR20207002904 A KR 20207002904A KR 102351349 B1 KR102351349 B1 KR 102351349B1
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South Korea
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resolution image
specimen
low
resolution
convolutional neural
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KR1020207002904A
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Korean (ko)
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KR20200015804A (ko
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사우랍 샤르마
아미토즈 에스. 단디아나
모한 마하데반
차오 팡
아미르 아조르드간
브라이언 더피
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케이엘에이 코포레이션
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Priority claimed from US16/019,422 external-priority patent/US10769761B2/en
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Publication of KR20200015804A publication Critical patent/KR20200015804A/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70653—Metrology techniques
    • G03F7/70675—Latent image, i.e. measuring the image of the exposed resist prior to development
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
KR1020207002904A 2017-06-30 2018-06-29 반도체 응용들을 위한 저해상도 이미지들로부터 고해상도 이미지들의 생성 KR102351349B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
IN201741023063 2017-06-30
IN201741023063 2017-06-30
US201762545906P 2017-08-15 2017-08-15
US62/545,906 2017-08-15
US16/019,422 US10769761B2 (en) 2017-06-30 2018-06-26 Generating high resolution images from low resolution images for semiconductor applications
US16/019,422 2018-06-26
PCT/US2018/040160 WO2019006221A1 (en) 2017-06-30 2018-06-29 GENERATING HIGH RESOLUTION IMAGES FROM LOW RESOLUTION IMAGES FOR SEMICONDUCTOR APPLICATIONS

Publications (2)

Publication Number Publication Date
KR20200015804A KR20200015804A (ko) 2020-02-12
KR102351349B1 true KR102351349B1 (ko) 2022-01-13

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KR1020207002904A KR102351349B1 (ko) 2017-06-30 2018-06-29 반도체 응용들을 위한 저해상도 이미지들로부터 고해상도 이미지들의 생성

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KR (1) KR102351349B1 (zh)
CN (1) CN110785709B (zh)
TW (1) TWI754764B (zh)

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CN112365556B (zh) * 2020-11-10 2021-09-28 成都信息工程大学 一种基于感知损失和风格损失的图像扩展方法
TWI775586B (zh) * 2021-08-31 2022-08-21 世界先進積體電路股份有限公司 多分支的檢測系統及多分支的檢測方法
KR102616400B1 (ko) * 2022-04-12 2023-12-27 한국항공우주연구원 광학계 특성을 반영한 딥러닝 기반의 영상 해상도 향상 시스템 및 그 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2431889C1 (ru) * 2010-08-06 2011-10-20 Дмитрий Валерьевич Шмунк Способ суперразрешения изображений и нелинейный цифровой фильтр для его осуществления
US9286662B2 (en) * 2013-09-26 2016-03-15 Siemens Aktiengesellschaft Single image super resolution and denoising using multiple wavelet domain sparsity
CA2941352C (en) * 2014-03-06 2022-09-20 Progress, Inc. Neural network and method of neural network training
US9401016B2 (en) * 2014-05-12 2016-07-26 Kla-Tencor Corp. Using high resolution full die image data for inspection
CN106796716B (zh) * 2014-08-08 2018-11-16 北京市商汤科技开发有限公司 用于为低分辨率图像提供超分辨率的设备和方法
US10417525B2 (en) * 2014-09-22 2019-09-17 Samsung Electronics Co., Ltd. Object recognition with reduced neural network weight precision
CN105976318A (zh) * 2016-04-28 2016-09-28 北京工业大学 一种图像超分辨率重建方法
CN106228512A (zh) * 2016-07-19 2016-12-14 北京工业大学 基于学习率自适应的卷积神经网络图像超分辨率重建方法
CN106339984B (zh) * 2016-08-27 2019-09-13 中国石油大学(华东) 基于k均值驱动卷积神经网络的分布式图像超分辨方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DONG, C . e t al., 13th European Conference on Computer Vision, 2014, LNCS 8692, pages 184-199. 1부.*

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TWI754764B (zh) 2022-02-11
TW201910929A (zh) 2019-03-16
KR20200015804A (ko) 2020-02-12
CN110785709B (zh) 2022-07-15
CN110785709A (zh) 2020-02-11

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