KR102343006B1 - Manufacturing method of indicators of in-mold electronic device type - Google Patents

Abstract

The present invention reduces the light extraction pattern part printing step of a separate light extraction pattern part by forming the light extraction pattern part in the injection molding step through injection molding, and the formation of the light extraction pattern part after the parts attachment step, preform step and injection molding step This reduces the damage to the light extraction pattern part due to high temperature or high pressure in the parts attachment step, preform step, and injection molding step, so that the light emitted from the light source by the light extraction pattern part is scattered and reflected even in indicators of complex shapes and shapes. The present invention relates to an in-mold electronic device type indicator capable of realizing uniform illuminance and luminance, and a manufacturing method thereof.

Description

Manufacturing method of indicators of in-mold electronic device type

The present invention relates to an indicator and a manufacturing method of an in-mold electronic device type, and more particularly, by forming a light extraction pattern portion through injection molding, the printing process of a separate light extraction pattern portion is omitted, and damage to the light extraction pattern portion is reduced The present invention relates to an in-mold electronic device type indicator and a manufacturing method capable of realizing uniform illuminance and luminance even in indicators of complex shapes and shapes by

In recent years, as the consumption tendency has changed, there is a trend of demanding products by focusing on the aesthetics of the appearance of the electronic devices as well as the product performance of the electronic devices.

In line with this trend, electronic devices are equipped with an indicator) so that the user can check the presence, size, and operation of the signal of the electronic device using light, etc. to improve the quality of the electronic device while improving the quality of the electronic device They are being produced in the direction of enhancing the aesthetics of the appearance of electronic devices, and recently, indicators are being produced as in-mold electronic devices.

The indicator simultaneously implements the function of information that transmits information of the electronic device and the aesthetic function that forms the appearance of the electronic device. Therefore, the indicator needs to have a high amount of light emitted from the light source and uniformly emit light over the entire display area at the same time so that information can be clearly transmitted to the user.

In addition, since the indicator can be formed in complex and various shapes to improve the aesthetic function of the electronic device, even when implemented in such a complex shape, a uniformly high light quantity over the entire display area so as not to impair the information transfer function of the electronic device should be expressed as

In the case of a conventional in-mold electronic device, there is a problem in that the amount of transmitted light is different depending on the relative position between the light source and the display area, so that illuminance and luminance are non-uniform.

1 and 2, the indicator of the conventional in-mold electronic device type has a substrate 100 on which the light source 110 is mounted, and a cover 200 that faces the substrate 100 and is spaced apart from each other by a predetermined distance. are doing As such, the light emitted from the light source 110 is not uniform in illuminance and luminance depending on the distance away from the light source 110 , so there is a problem in that the function of information transmission of the indicator is impaired.

In addition, in the case of the conventional in-mold electronic device manufacturing method, since the process of the light extraction pattern sub-printing step must be separately performed after the circuit pattern printing step, the manufacturing process is complicated.

Furthermore, in the case of the conventional in-mold electronic device manufacturing method, since the light extraction pattern portion is formed in the light extraction pattern portion printing step after the circuit pattern printing step, the component attachment step, the preform step, and the injection molding even after the light extraction pattern portion is formed. Since additional steps are required, there is a problem in that the light extraction pattern part is damaged by high temperature or high pressure in this process.

Republic of Korea Patent Publication No. 10-1675793

The present invention is to solve the above problems, and an object of the present invention is to omit the printing process of a separate light extraction pattern part by forming a light extraction pattern part in the injection molding step through injection molding, and to form a light extraction pattern part By reducing the damage to the light extraction pattern part by high temperature or high pressure during the parts attachment step, preform step, and injection molding step after the part attachment step, preform step and injection molding step, uniform illumination and It relates to an indicator of an in-mold electronic device type capable of implementing luminance and a manufacturing method.

In order to achieve the object of the present invention, an in-mold electronic device type indicator according to the present invention includes a first substrate on which a light source is mounted; and a light extraction pattern portion formed on the first substrate, wherein the light extraction pattern portion may be integrally molded with the first substrate during injection molding to reflect and scatter the light transmitted from the light source.

Further, in another preferred embodiment of the in-mold electronic device type indicator according to the present invention, the light extraction pattern portion of the in-mold electronic device type indicator is emitted to the first substrate so that the light source forms a light pattern in the display area. It can be integrally molded at the time of shaping|molding.

Further, in another preferred embodiment of the in-mold electronic device type indicator according to the present invention, it includes a transmitting part through which the light emitted from the light source is transmitted and a shielding part through which the light emitted from the light source is blocked, the first substrate and a second substrate facing each other and installed to be vertically spaced apart; and a filling layer injected into the space between the first substrate and the second substrate to seal the space between the first substrate and the second substrate.

In addition, in another preferred embodiment of the in-mold electronic device type indicator according to the present invention, the in-mold electronic device type indicator reflects and scatters the light emitted from the light source in the light extraction pattern part and transmits the transmission part. a display area to be formed; and a blocking region in which the light emitted from the light source is reflected and scattered by the light extraction pattern unit and is blocked by the shielding unit.

Further, in another preferred embodiment of the in-mold electronic device type indicator according to the present invention, the in-mold electronic device type indicator includes a circuit unit formed between the first substrate and the second substrate; and a component part connected to the circuit part.

In another preferred embodiment of the method for manufacturing an in-mold electronic device type indicator according to the present invention in order to achieve another object of the present invention, the manufacturing method of the in-mold electronic device type indicator designs the light pattern of the light extraction pattern part to do; manufacturing an injection mold; printing the circuit pattern of the circuit unit; attaching the component part to the printed circuit pattern; pre-molding in a state in which the parts are attached; and injection molding the light extraction pattern portion onto the first substrate according to the light pattern determined in the step of manufacturing the injection mold.

Further, in another preferred embodiment of the method for manufacturing the in-mold electronic device type indicator according to the present invention, the manufacturing method for the in-mold electronic device type indicator includes a first substrate and a second substrate after manufacturing the injection mold. , and preparing a filling layer; may further include.

Further, in another preferred embodiment of the method for manufacturing the in-mold electronic device type indicator according to the present invention, the in-mold electronic device type indicator manufacturing method includes the first step after attaching the component part to the printed circuit pattern. It may further include; disposing the second substrate so as to face and spaced apart from the substrate.

Further, in another preferred embodiment of the method for manufacturing the in-mold electronic device type indicator according to the present invention, the manufacturing method of the in-mold electronic device type indicator includes the first substrate and the second substrate after the pre-forming step. The method may further include a step of sealing the space between the first substrate and the second substrate by injecting a filling material into the space therebetween.

The indicator of the in-mold electronic device type according to the present invention is provided with a light extraction pattern portion, thereby improving the non-uniform amount of transmitted light depending on the relative position between the conventional light source and the display area, so that the light emitted from the light source is removed from the light extraction pattern portion. After scattering and reflection, the light-transmitting part is transmitted to make the luminance uniform, so that the indicator can be displayed brightly and uniformly in the display area.

In addition, in the case of the manufacturing method of the in-mold electronic device type indicator according to the present invention, since there is no need to separately go through the process of the light extraction pattern sub-printing step after the circuit pattern printing step, the manufacturing process is simplified to produce the in-mold electronic device type. It has the effect of improving the productivity of the indicator and reducing the waste of resources due to unnecessary processes.

Furthermore, in the case of the method for manufacturing an in-mold electronic device type indicator according to the present invention, after the process of applying high temperature or high pressure in the parts attachment step, preform step, and injection molding step, which is a process after the circuit pattern printing step, has elapsed. By forming the light extraction pattern portion in the injection molding step, there is an effect that can prevent the light extraction pattern portion from being damaged by high temperature or high pressure.

1 shows an indicator of a conventional in-mold electronic device type.
2 shows an indicator of a conventional in-mold electronic device type.
3 shows an indicator of an in-mold electronic device type according to an embodiment of the present invention.
4 shows an indicator of an in-mold electronic device type according to an embodiment of the present invention.
5 shows a state in which there is no light extraction pattern part.
6 shows a state in which the height of the light extraction pattern part is 40um.
7 shows a state in which the height of the light extraction pattern portion is 90um.
8 shows a method of manufacturing an in-mold electronic device type indicator according to an embodiment of the present invention.
9 shows a view in which the amount of light is measured in a state where there is no light extraction pattern part.
10 is a view showing the measurement of the amount of light in a state in which the height of the light extraction pattern portion is 90um.
11 shows a method of manufacturing an in-mold electronic device type indicator according to an embodiment of the present invention.

Hereinafter, an in-mold electronic device type indicator and a manufacturing method according to an embodiment of the present invention will be described in detail with reference to the drawings. The embodiments introduced below are provided as examples so that the spirit of the present invention can be sufficiently conveyed to those skilled in the art. Accordingly, the present invention is not limited to the embodiments described below and may be embodied in other forms. And in the drawings, the size and thickness of the device may be exaggerated for convenience. Like reference numbers refer to like elements throughout.

Advantages and features of the present invention, and a method for achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, and only these embodiments allow the disclosure of the present invention to be complete, and those of ordinary skill in the art to which the present invention pertains. It is provided to fully inform the person of the scope of the invention, and the present invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout. The sizes and relative sizes of layers and regions in the drawings may be exaggerated for clarity of description.

The terminology used herein is for the purpose of describing the embodiments, and thus is not intended to limit the present invention. In this specification, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, “comprise” and/or “comprising” refers to the presence of one or more other components, steps, operations, and/or elements mentioned. or addition is not excluded.

1 shows an indicator of a conventional in-mold electronic device type, and FIG. 2 shows an indicator of a conventional in-mold electronic device type.

3 shows an indicator of an in-mold electronic device type according to an embodiment of the present invention, and FIG. 4 shows an indicator of an in-mold electronic device type according to an embodiment of the present invention.

5 shows a state in which there is no light extraction pattern part, and FIG. 6 shows a state in which the height of the light extraction pattern part is 40um.

7 shows a state in which the height of the light extraction pattern portion is 90um, and FIG. 8 shows a method of manufacturing an in-mold electronic device type indicator according to an embodiment of the present invention.

9 shows a view in which the light quantity is measured in the absence of the light extraction pattern part, and FIG. 10 shows a view in which the light quantity is measured in a state where the height of the light extraction pattern part is 90um.

11 shows a method of manufacturing an in-mold electronic device type indicator according to an embodiment of the present invention.

Definitions of terms used below are as follows. "Horizontal direction" means a horizontal direction, that is, the X-axis direction in FIG. 3, and "vertical direction" means a height direction while orthogonal to the horizontal direction, that is, the Z-axis direction in FIG. 3 . In addition, upper (upper) means an upward direction in the "vertical direction", that is, a direction toward the upper side of the Z-axis in FIG. means the direction it is going.

An in-mold electronic device type indicator 1 according to a preferred embodiment of the present invention will be described with reference to FIGS. 3 to 10 . 3 to 4 and 8 , the in-mold electronic device type indicator 1 according to an embodiment of the present invention includes a first substrate 10 and a second substrate 20 . It includes a light extraction pattern unit 30 .

The indicator 1 of the in-mold type electronic device is formed through injection molding.

The first substrate 10 serves as a means on which an electronic device such as the light source 11 is mounted. The first substrate 10 may be implemented with a flexible thermoplastic film material. Specifically, it may be implemented with a flexible plastic such as PET, PC, PEN, PI, or COP.

Although not necessarily limited thereto, the first substrate 10 is made of an opaque material in order to prevent light emitted from the light source 11 in an area other than the display area 40 from passing through the substrate 10 and being irradiated to the outside. It is desirable to do However, when the first substrate 10 itself is attached to an opaque product, it may be implemented with a transparent material.

A light source 11 is mounted on the first substrate 10 . One or more light sources 11 may be mounted depending on the type and size of the indicator, and a means for converting an electric signal into light such as LED, OLED, EL, or QD may be mounted and used.

The light source 11 may be selected from one of a side view method or a top view method. The light emitted from the light source 11 is transmitted through the light-transmitting unit 21, and when the light emitted from the light source 11 is reflected and scattered by the light extraction pattern unit 30, the side view method is applied. desirable.

The second substrate 20 selectively transmits light emitted from the light source 11 mounted on the first substrate 10 to express various patterns or shapes, thereby enhancing the appearance of the in-mold electronic device type indicator 1 . plays a role in shaping

In addition, the second substrate 20 faces the first substrate 10 and is vertically spaced apart from each other, and includes a transmission portion 21 and a cover portion 22 .

The transmission part 21 is a part through which the light emitted from the light source 11 is transmitted, and the cover part 22 is a part where the light emitted from the light source 11 is blocked. Transparent material or opaque material may be used for the transmitting portion 21 and the covering portion 22 depending on the purpose of use of the in-mold electronic device type indicator 1, and the corresponding label may be used to express a label, pattern or pattern as necessary. , patterns or patterns may be printed, or by printing with an opaque material in an area excluding the corresponding label, pattern or pattern, it may be implemented in various shapes or patterns.

The transmissive part 21 may be formed using a transparent material through which the light emitted from the light source 11 is transmitted, and while printing the covering part 22 with an opaque material, except for the area where the transmissive part 21 is formed. may be formed.

The filling layer 40 is injected into the space between the first substrate 10 and the second substrate 20 to seal the space between the first substrate 10 and the second substrate 20 .

Specifically, the first substrate 10 is injected between the first substrate 10 and the second substrate 20 to seal the space between the first substrate 10 and the second substrate 20 . and serves to bond the second substrate 20 to each other.

In this way, the filling layer 40 is filled in the space between the first substrate 10 and the second substrate 20, so that the first substrate 10 and the second substrate 20 are maintained in a bonded state. To protect electronic devices such as the light source 11 mounted between the first substrate 10 and the second substrate 20 , the circuit printed on the first substrate 10 , and the light extraction pattern unit 30 , etc. can

The filling layer 40 may be implemented with a transparent thermoplastic resin capable of performing an injection process. Resins such as PP, PE, PC, ABS, MPPO may be used.

An in-mold electronic device type indicator 1 according to a preferred embodiment of the present invention includes a display area 50 and a blocking area 60 .

The display area 50 refers to an area formed by passing the light emitted from the light source 11 after being reflected and scattered by the light extraction pattern unit 30 and then passing through the transmission unit 21 . The shape or pattern of the indicator 1 displayed on the display area 40 must be displayed with bright, clear, and uniform luminance to faithfully perform the role of information transmission.

The blocking area 60 refers to an area formed by being blocked by the shielding unit 22 after the light emitted from the light source 11 is reflected and scattered by the light extraction pattern unit 30 .

The indicator 1 of an in-mold electronic device type according to a preferred embodiment of the present invention includes a circuit part 70 and a component part 80 .

The circuit unit 70 is formed between the first substrate 10 and the second substrate 20 . In addition, the circuit unit 60 is formed so that various electronic devices can be mounted, and is a conductive wire pattern capable of transmitting an electrical signal. Such a circuit pattern may be formed on the first substrate 10 through printing, plating, deposition, and mounting.

Although not necessarily limited thereto, as the material for forming the circuit pattern, a metal capable of transmitting electricity, a ceramic, a conductive polymer, and combinations thereof may be used. Here, Ag, Au, Cu, etc. may be used as the metal, ITO IZTO may be used as the ceramic, and PEDOT may be used as the conductive polymer.

The component part 70 is connected to the circuit part 60 . Examples of components include LEDs and small electronic components.

The light extraction pattern part 30 is formed on the first substrate 10 .

Specifically, the light extraction pattern unit 30 scatters the light emitted from the light source 11 to uniformly disperse the light, and then reflects the light to the transmitting unit 21 in a portion facing the transmitting unit 21 of the first substrate. It is formed to be located on the top.

In addition, the light extraction pattern portion 30 may be formed in plurality to form a light pattern. That is, the light that is scattered and reflected by the light extraction pattern unit 30 and has passed through the transmission unit shows a light pattern having a uniform shape in the display area 40 .

In addition, when a plurality of light extraction pattern portions 30 are formed, the luminosity of light displayed in the display area can be adjusted by variously changing the formation of the light pattern by adjusting the density and height of a certain light extraction pattern portion 30 . have. Also, the light pattern may have a checkerboard shape.

Accordingly, the indicator 1 of the in-mold electronic device type according to the present invention includes the light extraction pattern unit 30, thereby improving the non-uniform amount of transmitted light depending on the relative position between the conventional light source and the display area. The light emitted in (11) is scattered and reflected by the light extraction pattern unit 30 and then passes through the light-transmitting unit 21 to make the luminance uniform, so that the indicator display is brightly and uniformly formed in the display area 50. can have an effect.

In addition, the light extraction pattern portion 30 may be formed so that the height (H) of the light extraction pattern portion 30 is 60um or more to 90um or less.

The luminance of the display area varies according to the height H of the light extraction pattern part 30, and the higher the height H of the light extraction pattern part 30, the higher the luminance is measured. However, if the height (H) of the light extraction pattern portion 30 exceeds 90um, there is a high possibility that the molding of the light extraction pattern portion 30 is not performed in the injection molding process.

Therefore, the height (H) of the light extraction pattern portion 30 is preferably formed to be less than 90um, and in particular, to prevent the light extraction pattern portion 30 from being unmolded in the injection molding process while increasing the brightness to the highest. The height (H) of the extraction pattern portion 30 is preferably formed to a height of 90um.

Referring to FIGS. 5 to 7 , it can be seen that the luminance varies according to the height H of the light extraction pattern unit 30 .

5 is a case in which the light extraction pattern part 30 is not applied, and since the light source only emits light directly, the overall luminance is not high, and the amount of light is also formed intensively only at the center of the light source, so that the light is not uniformly formed.

6 is a case in which the height (H) of the light extraction pattern part 30 is applied to 40um, and unlike the case where the light extraction pattern part 30 of FIG. 5 is not applied, a certain light pattern is formed and the overall luminance is improved, It can be seen that the amount of light is also uniformly formed in a certain area. That is, when the height (H) of the light extraction pattern part 30 is applied to 40um, the luminance is increased by 3 to 4 times compared to the case where the light extraction pattern part 30 is not formed.

7 is a case in which the height (H) of the light extraction pattern part 30 is applied to 90um, and unlike in FIGS. 5 to 6 , a constant light pattern is formed, the overall luminance is improved, a clear and bright light is formed, and a light quantity diagram It can be seen that the formation is uniform. That is, when the height (H) of the light extraction pattern part 30 is applied to 90um, the luminance is increased by 5 to 10 times compared to the case where the light extraction pattern part 30 is not formed.

9 to 10 show the measurement positions of the amount of light emitted through the light source in order to measure the amount of light emitted according to the height H of the light extraction pattern part 30 . 9 is a case in which the light extraction pattern part 30 is not formed, and FIG. 10 is a case where the height H of the light extraction pattern part 30 is applied to 90 μm.

The amount of light was measured using a light quantity measuring device (ILT1700, International Light Technologies), and -15mm from the light source in the horizontal direction. The area was divided into three positions of 0 mm and 15 mm and four positions of 15 mm, 30 mm, 45 mm, and 60 mm from the light source in the vertical direction, and the amount of light was measured at a total of 12 positions.

The measured light quantity is as follows.

distance from the light source -15 mm 0 mm 15 mm 15 mm 0.6 10.0 0.6 30 mm 2.0 3.9 1.8 45 mm 1.6 2.0 1.6 60 mm 1.6 1.9 1.5

Light intensity (A.U)

[Measurement of light quantity when light extraction pattern part is not formed]

distance from the light source -15 mm 0 mm 15 mm 15 mm 10.5 23.6 10.6 30 mm 17.6 22.0 29.0 45 mm 14.9 23.7 16.7 60 mm 11.4 14.0 13.2

Light intensity (A.U)

[Measurement of light quantity when the height of the light extraction pattern part is 90um]

In the case of Table 1, looking at the results measured by setting the reference value as 10, when the light extraction pattern unit 30 is not formed, only the portion where the light source is located shows 10.0, and the light quantity is significantly low at the remaining 11 positions. can check that

In the case of Table 2, looking at the results measured with a reference value of 10, when the height of the light extraction pattern part 30 is formed to be 90um, it can be confirmed that it shows 10.0 or more in 12 areas including the portion where the light source is located. can

Accordingly, in the in-mold electronic device type indicator 1 according to the present invention, as the height of the light extraction pattern part 30 is formed to be 90 μm, the amount of transmitted light varies according to the relative position between the conventional light source and the display area. The non-uniform thing was improved to form a luminous intensity of 10 or more uniformly, and the light emitted from the light source 11 was scattered and reflected by the light extraction pattern part 30 and then passed through the transmissive part 21 to make the luminance uniform. There is an effect that the indicator display can be formed brightly and uniformly in the display area 50 .

Hereinafter, a method of manufacturing an in-mold electronic device type indicator according to an embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 11, the method of manufacturing an in-mold electronic device type indicator according to an embodiment of the present invention includes a light pattern design step (S1), an injection mold production step (S2), a preparation step (S3), and a circuit pattern printing step. (S4), a component attachment step (S5), an arrangement step (S6), a preform step (S7), a filling layer forming step (S8) and an injection molding step (S9).

The light pattern of the light extraction pattern part is designed by designing the number of light sources and the arrangement between the plurality of light sources according to the size and shape of the indicator by conducting a simulation using a light source in advance before manufacturing the injection mold.

After the light pattern design step (S1), the injection mold is manufactured with a pattern corresponding to the light extraction pattern portion so that the light extraction pattern portion is formed according to the number of light sources and the battery between the light sources determined through the pattern design step.

After the injection mold manufacturing step (S2), the first substrate, the second substrate, and the filling layer are prepared.

After the preparation step (S3), the circuit pattern of the circuit unit is printed on the first substrate.

After the circuit pattern printing step (S4), the part is attached to the printed circuit pattern.

After the component attachment step (S5), the second substrate is disposed to face the first substrate and spaced apart so that a space is formed between the first substrate and the second substrate.

After the arrangement step (S6), it is formed in advance in advance. In this process, the film is curvature-formed.

After the preform step (S7), a filling material is injected into the space between the first substrate and the second substrate to seal the space between the first substrate and the second substrate.

After the filling layer forming step (S8), the light extraction pattern portion is formed through injection molding according to the light pattern determined in the injection mold manufacturing step.

Figure 8 (a) shows the step of printing the circuit was conventionally formed a light extraction pattern part after this process. Figure 8 (b) shows the step of attaching the component to the printed circuit. Figure 8 (c) shows a process of pre-molding in a state in which the part is attached. In this process, as shown in the drawing, the process of bending during curvature is made. Therefore, there is a problem in that the light extraction pattern part and the like are damaged when this process is performed. FIG. 8(d) is an injection molding step. In this process, there may be a risk that the high-temperature and high-pressure injection resin may damage the light extraction pattern part and the like.

In the case of the present invention, since the light extraction pattern portion is formed in the injection molding step (S9), there is no need to separately go through the process of the light extraction pattern portion printing step, thereby simplifying the manufacturing process to improve the productivity of the in-mold electronic device type indicator, , it is possible to reduce the waste of resources due to unnecessary processes, and the light extraction pattern in the injection molding step, which is after the process of applying high temperature or high pressure in the parts attachment step, preform step, and injection molding step, which is a process after the circuit pattern printing step, has elapsed. By forming a portion, it is possible to prevent the light extraction pattern portion from being damaged by high temperature or high pressure.

Accordingly, the present invention forms the light extraction pattern portion during the injection molding in order to reflect and scatter light transmitted from the light source to minimize damage to the light extraction pattern portion, so that the luminance of the light source transmitted through the transmission portion can be uniform. .

In the detailed description of the present invention described above, although it has been described with reference to preferred embodiments of the present invention, those skilled in the art or those having ordinary knowledge in the art will It will be understood that various modifications and variations of the present invention can be made without departing from the spirit and scope of the present invention. Accordingly, the technical scope of the present invention should not be limited to the content described in the detailed description of the specification, but should be defined by the claims.

1: indicator of in-mold electronic device type, 10: first substrate,
11: light source, 20: second substrate,
21: a transmission part, 22: a cover part.
30: light extraction pattern part, 40: filling layer,
50: display area, 60: blocking area,
70: circuit part, 80: parts part,

Claims (9)

delete delete delete delete delete designing a light pattern of the light extraction pattern unit;
manufacturing an injection mold;
printing the circuit pattern of the circuit unit;
attaching the component part to the printed circuit pattern;
pre-molding in a state in which the parts are attached; and
The method of manufacturing an in-mold electronic device type indicator, comprising: injection-molding the light extraction pattern portion on the first substrate according to the light pattern determined in the step of manufacturing the injection mold.
7. The method of claim 6,
After the step of manufacturing the injection mold,
The method of manufacturing an in-mold electronic device type indicator further comprising; preparing a first substrate, a second substrate, and a filling layer.
8. The method of claim 7,
After the step of attaching the part to the printed circuit pattern,
The method of manufacturing an in-mold electronic device type indicator further comprising; disposing the second substrate to face the first substrate and to be spaced apart from each other.
8. The method of claim 7,
After the preforming step,
The method of manufacturing an in-mold electronic device type indicator further comprising: injecting a filling material into the space between the first substrate and the second substrate to seal the space between the first substrate and the second substrate Way.

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