KR102333558B1 - display apparatus - Google Patents

Abstract

A display device according to an aspect of the present invention includes a housing, a display module installed in the housing, a first heat sink installed on a rear surface of the display module and forming a first channel for a first flow path between the display modules, the A second heat sink installed on the rear surface of the first heat sink and forming a second channel for a second flow path between the first heat sink, a driving board installed on the rear surface of the second heat sink, and an installation area sealed around the driving board and a bracket for partitioning the device, and a back cover coupled to the housing from the rear side and sealing the installation area, wherein the first flow path is introduced into the first channel from the outside of the device, and air is heat-exchanged in the first channel. is an open loop exiting the device, and the second flow path is a closed loop circulating through the second channel and the installation area.

Description

display apparatus

The present invention relates to a display device with improved heat dissipation structure and reduced thickness of the device.

A display device using an LCD or OLED panel is widely used throughout the industry. For example, the display device may be used as a digital signage used as a billboard or displaying various information such as a letter E image in a public or commercial space.

Recently, the demand for digital signage is increasing due to the rapid development of intelligent digital imaging devices based on LCD or LED. However, since the place where the device is used is outdoors or in a worse environment than indoors, a special design is required differently from home use.

Typically, due to the nature of digital signage being mainly used for outdoor advertising, it is necessary to protect the device from foreign substances such as moisture and dust, and also to prevent the device from overheating during operation due to hot heat.

SUMMARY OF THE INVENTION The present invention aims to solve the above and other problems.

SUMMARY OF THE INVENTION One object of the present invention is to effectively dissipate heat generated in a display device to the outside of the device.

Another object of the present invention is to reduce the thickness of the device.

A display device according to an aspect of the present invention for achieving the above object is installed in a housing, a display module installed in the housing, and a rear surface of the display module, and includes a first channel for a first flow path between the display modules. A first heat sink to form, a second heat sink installed on a rear surface of the first heat sink and forming a second channel for a second flow path between the first heat sink, a driving board installed on the rear surface of the second heat sink, the driving a bracket for partitioning a sealed installation area around the board, and a back cover coupled to the housing from a rear side and sealing the installation area, wherein the first flow path flows into the first channel from the outside of the device, and The first channel is an open loop through which the heat exchanged air exits the device, and the second flow path is a closed loop that circulates between the second channel and the installation area.

The housing includes a transparent substrate installed on the front surface, and the front surface of the display module is bonded to the rear surface of the transparent substrate.

The first flow path is a first fan (FAN) for introducing air into the first channel from one of the front end or the rear end of the first heat sink, and discharging the heat exchanged air from the first channel to the other one. It is formed including a first hole.

The back cover is formed to correspond to the portion where the first fan is installed and includes a second hole for supplying air to the first channel and a third hole for discharging the heat-exchanged air from the first channel CH1 to the outside. includes

The first channel is partitioned by a sealing part, and the sealing part is installed on a rear surface of the display module, a first gasket partitioning the first channel, and a front surface of the first heat sink, the first and an insert insertedly coupled to the gasket.

The second flow path includes a second fan formed at either a front end or a rear end of the second heat sink, and a fourth hole formed at the other end and circulating the heat exchanged air in the second channel.

and a second gasket disposed between the bracket and the back cover to seal the installation area, wherein the back cover is bolted to the bracket to apply pressure to the second gasket along the periphery of the second gasket. .

The display device may further include a temperature sensor installed in the first channel, and a timer for adjusting the rotation speed of the first fan according to the temperature measured by the temperature sensor, wherein the timer is measured by the temperature sensor. It stores more log information that records the temperature in units of time.

A heat sink may be disposed in at least one of the first flow path and the second flow path.

In another example of the present invention, the display device includes a housing, a display module installed inside the housing, a third heat sink installed on a rear surface of the display module and forming a third channel for a third flow path between the display modules, A driving board disposed on the rear surface of the third heat sink, a bracket defining an installation area sealed around the driving board, a fourth heat sink coupled to the bracket from the rear to seal the installation area, and the housing from the rear surface, and and a back cover forming a fourth channel for a fourth flow path between the fourth heat sink, wherein the third flow path is a closed loop circulating the third channel and the installation area, and the fourth flow path is It is an open loop in which air introduced into the fourth channel from the outside and heat-exchanged in the fourth channel exits to the outside of the device.

The housing includes a transparent substrate installed on the front surface, and the front surface of the display module is bonded to the rear surface of the transparent substrate.

The third flow path includes a third fan installed at either the top or the bottom of the third heat sink in the height direction of the device, and a fifth hole formed at the other and circulating the heat exchanged air in the third channel. do.

The fourth flow path includes a fourth fan installed at either the upper or lower end of the back cover in the height direction of the device, and a sixth hole formed in the other and discharging heat exchanged air in the fourth channel to the outside of the device. formed including

The driving unit includes a first driving unit and a second driving unit physically divided in a height direction of the device, and the third flow path includes an operating fan disposed between the first driving unit and the second driving unit, and the device in the height direction of the device. and a first sub-hole and a second sub-hole respectively formed at an upper end and a lower end of a third heat sink, wherein the third channel includes a first sub-channel circulating along the operating fan and the first sub-hole; It includes an operation fan and a second sub-channel circulating along the second sub-hole.

The effect of the display device according to the present invention will be described as follows.

According to at least one of the embodiments of the present invention, an open loop air circulation structure in which air is introduced and circulated from the outside of the device is interposed between the display module and the driving unit, so that the thickness of the device is reduced while being separated from the driving unit and the display module. The generated heat can be effectively dissipated to the outside.

In addition, according to at least one of the embodiments of the present invention, the driving unit is disposed in a closed loop to improve waterproof and dustproof performance, and the air circulation structure of the closed loop is similar to the air circulation structure of the open loop. Since they are in contact, the driving part can also effectively dissipate heat.

Further scope of applicability of the present invention will become apparent from the following detailed description. However, it should be understood that the detailed description and specific embodiments such as preferred embodiments of the present invention are given by way of illustration only, since various changes and modifications within the spirit and scope of the present invention may be clearly understood by those skilled in the art.

1 shows an overall appearance of a display device according to an exemplary embodiment.
FIG. 2 is a view showing a cross-sectional view taken along line I-I' of FIG. 1 .
FIG. 3 is a view for explaining a heat dissipation flow path of the device shown in FIG. 2 .
4 is a view for explaining an apparatus including a thermocompressor.
Fig. 5 is a rear view of the device shown in Fig. 1, with the back cover removed;
6 is a view for explaining a device including a temperature sensor.
7 is a view for explaining a device including a heat sink.
8 is a diagram illustrating a cross-sectional view of a display device according to another example.
9 is a view for explaining a heat dissipation flow path of the device shown in FIG. 8 .
10 is a view showing a state in which the operating fan is disposed between the driving units.
FIG. 11 is a view for explaining a flow path of the device according to FIG. 10 .
12 is a view for explaining an apparatus including a thermocompressor.
13 is a view for explaining a device including a temperature sensor.
14 is a view for explaining an apparatus including a heat sink.
15 and 16 are views showing a double-sided display device made by using the device according to FIG. 8 .

Hereinafter, the embodiments disclosed in the present specification will be described in detail with reference to the accompanying drawings, but the same or similar components are assigned the same reference numerals regardless of reference numerals, and overlapping descriptions thereof will be omitted. The suffixes "module" and "part" for the components used in the following description are given or mixed in consideration of only the ease of writing the specification, and do not have a meaning or role distinct from each other by themselves. In addition, in describing the embodiments disclosed in the present specification, if it is determined that detailed descriptions of related known technologies may obscure the gist of the embodiments disclosed in the present specification, the detailed description thereof will be omitted. In addition, the accompanying drawings are only for easy understanding of the embodiments disclosed in the present specification, and the technical spirit disclosed herein is not limited by the accompanying drawings, and all changes included in the spirit and scope of the present invention , should be understood to include equivalents or substitutes.

In addition, in the drawings, the configuration of each part may be expressed a little differently depending on the drawings for simplified illustration according to selection, but in the case of the same reference numerals, the same configuration is indicated.

The display device described herein collectively refers to all devices having an output unit for outputting an image. Representative examples include digital TV, analog TV, desktop computer, digital signage, and the like. In addition, it may include a medium to large output device such as a signage installed in an outdoor type housing. For example, an outdoor billboard may be used as an example. The present invention in one embodiment particularly relates to a display device installed and used outdoors as a digital signage.

FIG. 1 is a view showing the overall appearance of a display device according to an embodiment, and FIG. 2 is a view showing a cross-sectional view taken along line I-I' of FIG. 1 .

With reference to this, an example of the display apparatus 100 will be described as follows.

1 and 2 , in one example, the display apparatus 100 may include a display module 110 , a driving unit 120 , and a housing 130 for mounting them.

The display module 110 may be provided on the front surface of the display device 100 , and the driving unit 120 may be stacked on the rear surface of the display module 110 . Here, the front side and the rear side are referred to as the front side where an image is displayed in the thickness direction of the display device, respectively, and the other side of the front side is referred to as the back side.

The display module 110 may have any structure. For example, the display may be implemented in a liquid crystal display (LCD) method, an organic light emitting diode (OLED) method, or a micro-LED (Micro-LED) method. In the present invention, a liquid crystal display method will be described on the premise. However, it may be freely applied to other types of displays within the scope that is not contradictory.

The display module 110 may be sequentially stacked along the thickness direction of the device in the order of the liquid crystal panel, the optical sheet, and the backlight unit positioned on the front surface of the display device 100 , and these may be supported by the case. The case protects the display panel and the backlight unit and secures the rigidity of the display module. In addition, the case may serve to radiate heat by receiving heat generated from the light source and the display panel.

In a preferred example, the front surface of the display module 110 , that is, the display panel may be bonded to the rear surface of the transparent substrate 131 installed to be sealed on the front surface of the housing 130 , for example, a glass substrate. Until the present application, a flow path was formed between the glass substrate 131 and the display module 110 to radiate heat from the front of the device. Rather than cooling the device, it can easily heat up.

In one example, in order to solve this problem, the front surface of the display module 110 is bonded to a transparent substrate without forming a flow path. Various known methods may be used for bonding the display module 110 and the front substrate. As an example, a transparent adhesive may be preferably used, but is not limited thereto. In one example, the thickness of the device can be reduced by bonding the display module 110 to the glass substrate, and the heat generated from the display module 110, more precisely, the display panel, is transferred to the rear surface of the apparatus through the housing and disposed on the rear surface. It can be dissipated by an established heat dissipation system.

The driving unit 120 supplies an electrical signal necessary for driving the display panel, and the electrical signal includes a digital signal and an analog signal. The driving unit may be configured in the form of a board in which circuit elements are mounted on a circuit board, and the driving board is a power supply board for supplying power, a main board or T-con (T-con) that supplies a digital signal for driving each pixel of the display panel. ) may be configured including a board and the like.

The housing 130 forms the exterior of the display apparatus 100 , and may mount and support components such as the display module 110 and the driving unit 120 . The housing 130 may be coupled to the back cover 140 to mount the display module 110 and the driving unit 120 inside the housing 130 . The display apparatus 100 may additionally include a sealing member to form a closed space inside the apparatus from an external space.

3 is a view showing a flow of air that circulates inside and outside the device and radiates heat to the device in an air-cooled manner. The apparatus 100 of this example is configured to include a first flow path AF1 and a second flow path AF2 .

The first flow path AF1 is configured to have an open loop, and air flows along the first channel CH1. Here, the open loop refers to the flow of air formed to pass through the inside and outside of the device. Accordingly, the air may be introduced from the outside to the inside through the first flow path, and may be discharged to the outside of the device after heat exchange.

In one example, the first flow path AF1 may flow along the first channel CH1 formed between the display module 110 and the driver 120 in the thickness direction of the device. According to this arrangement, the first flow path AF1 receives heat generated from the driving unit 120 as air flows along the second flow path and radiates heat from the driving unit, and at the same time receives heat generated from the display module 110 to receive the heat generated by the driving unit 120 . ) and the display module 110 can be radiated at the same time.

The second flow path AF2 is configured to have a closed loop, and air flows along the second channel CH2. Here, the closed loop refers to the flow of air formed in the enclosed space.

In one example, the driving unit 120 may be disposed in the peruf, and in this case, the driving unit 120 may be effectively protected from dust and moisture. As illustrated, a first channel CH1 and a second channel CH2 are formed with the first heat sink 210 interposed therebetween so that the first flow path AF1 can exchange heat with the second flow path AF2 . Therefore, even if the second flow path AF2 is a closed loop, the driving unit 120 can be cooled while easily heat-exchanging with the first flow path AF1 .

A heat exchanger 500 may be additionally disposed as illustrated in FIG. 4 for more effective heat exchange between the first channel CH1 and the second channel CH2 .

In this case, a part of the heat exchanger 500 may be exposed to the first flow path AF1 , and another part may be installed to be exposed to the second flow path AF2 , respectively. The heat exchanger 500 may be used in a variety of known configurations without limitation.

The heat exchanger 500 may be provided with a heat pipe, a thermoelectric module, water cooling, or an LHP method. The heat exchanger 500 may be directly transferred according to a method, or heat may be exchanged between the first flow path AF1 and the second flow path AF2 indirectly through a working fluid.

The heat pipe type heat exchanger 500 is a method for indirectly transferring heat by a working fluid. The working fluid receives heat from the second flow path AF2 in the evaporation area, moves to the condensation area due to the pressure difference, and transfers the received heat to the first flow path AF1 to be condensed, and is again evaporated by capillary force move to

The thermoelectric module type heat exchanger 500 refers to a method in which electrons receive energy and move between two metals having a potential difference, and heat is brought in this process.

The water-cooled heat exchanger 250 circulates and heat exchanges a refrigerant using the pressure of a pump.

In the LHP (Loop Heat Pipe) type heat exchanger 500, the refrigerant is vaporized by heat in the evaporation area, liquefied through heat exchange with the first flow path AF1 in the condensation area, and the refrigerant moves and circulates in the evaporation area again. say

As illustrated, in the first flow path AF1 , air enters the first flow path AF1 from the outside of the device 100 and heat exchange is performed. The heat-exchanged air is exhausted to the outside of the device 100 through the first flow path AF1 . In the second flow path AF2, air is circulated only within the closed area and is a loop that does not escape to the outside of the device.

Hereinafter, with reference to the accompanying drawings, a mechanical configuration in which the first flow passage and the second flow passage are made will be described in more detail with reference to FIGS. 2 and 5 . 5 is a view showing a rear view of the device with the back cover 140 removed.

Referring to these drawings, the front surface of the display module 110 is bonded to the rear surface of the front substrate 131 , and is fixed to the inner edge portion of the housing 130 . The housing 130 may be a mechanism that functions as a cabinet so that the display module 110 can be fixed inside the housing.

When the front substrate 131 is coupled to the housing 130 , a sealing member SM may be disposed between the front substrate 131 and the housing to prevent dust or moisture from entering. Here, the sealing member may be a gasket made of a rubber material.

Meanwhile, a first heat sink 210 is disposed on the rear surface of the display module 110 to face the rear surface of the display module 110 . The first heat sink 210 is a plate material and may be disposed to be a predetermined distance away from the rear surface of the display module 110 to create a channel through which air can flow between the two. Accordingly, a first channel CH1 through which air may pass may be formed between the display module 110 and the first heat sink 210 . In this specification, a channel formed between the display module 110 and the first heat sink 210 is referred to as a first channel, and a flow of air flowing along the first channel is referred to as a first flow path AF1 .

One end 211 of the first heat sink 210 may be coupled to the upper housing 130a, and the other end 211 may be installed in the lower housing 130b. In this case, a sealing member SM may be disposed between the first heat sink 210 and the housings 130a and 130b to seal the inside of the device.

Meanwhile, a sealing part 310 may be formed between the first heat sink 210 and the display module 110 to maintain a gap and partition the first channel CH1 . The sealing part 310 may be formed at both ends of the display module 110 based on the height direction of the device (the z-axis direction intersecting the thickness direction of the device). The sealing part 310 is installed to protrude from the rear surface of the display module 110 toward the first heat sink 210 , and includes a first gasket 311 and a first heat sink 210 that partition the first channel CH1 . ) installed on the front surface and may be configured to include an insert 312 inserted and coupled to the first gasket. The insert 312 may be fitted into a groove provided in the first gasket 311 .

A second heat sink 220 fixed to the rear surface of the first heat sink 210 while maintaining a predetermined distance from the first heat sink 210 may be installed on the rear surface of the first heat sink 210 . Accordingly, a channel through which air may pass may be formed between the first heat sink 210 and the second heat sink 220 . In this specification, a channel formed between the first heat sink 210 and the second heat sink 220 is referred to as a second channel CH2 , and a flow of air flowing along the second channel is referred to as a second flow path AF2 .

The driving board 120 is disposed on the rear surface of the second heat sink 220 . The driving board 120 may include a first driving board 120a and a second driving board 120b that are functionally separated and physically separated. In one example, the first driving board 120a may be a power supply board, and the second driving board 120b may be a main board or a Ticon board.

The back cover 140 is coupled to the housing at the rear of the device. Between the back cover 140 and the first heat dissipation plate 210 , a bracket 510 for partitioning the sealed installation area MA around the driving board 120 may be further formed.

The bracket 510 is positioned outside the second heat sink 220 in the height direction of the device. The bracket 510 includes a first bracket 510a disposed above the driving board 120 in the height direction and a second bracket 510b disposed below the driving board 120 . Since the first bracket 510a and the second bracket 510b are disposed to surround the driving board 120 as described above, the driving board 120 may be disposed in the sealed installation area MA. When the driving board 120 is disposed in an enclosed area, it is possible to prevent the driving board from being exposed to dust or moisture, thereby preventing device failure in advance.

A second gasket 411 is further disposed between the bracket 510 and the back cover 140 to seal the installation area MA.

Meanwhile, when the back cover 140 is coupled to the rear surface of the device, it may be bolted to apply pressure to the second gasket along the periphery of the second gasket 411 . For bolting, the bracket 510 is configured to include a boss 713 , so that the bolt or screw 711 is bolted to the boss, so that the installation area can be sealed.

Accordingly, the installation area MA in which the driving board 120 is disposed may be more hermetically sealed.

In each of the first flow path AF1 and the second flow path AF2 , each structure includes a fan and a hole so that air can flow along the flow path.

The first flow path AF1 includes a first fan F1 that supplies air to the first channel CH1 from one of the front end or the rear end of the first heat sink 210 in the height direction of the device, and the other one. It may be formed to include a first hole 141 for discharging the heat-exchanged air in the first channel CH1.

The back cover 140 is formed to correspond to the portion where the first fan F1 is installed and includes a second hole 143 for supplying air to the first channel CH1, and the heat-exchanged air from the first channel CH1. It may be configured to include a third hole 141 for discharging to the outside of the device.

In one example, the second hole 143 may be installed at the lower end of the back cover 140 in the height direction of the device, and the third hole 141 may be installed at the upper end of the back cover 140 . The shape of the hole is not particularly limited. It may have various shapes within a range that does not interfere with the flow of air forming the flow path. 5 shows an example in which the hole is composed of a plurality of small holes to reduce the input of dust or moisture into the device.

If the bottom is the floor where the device is installed, cold air is introduced through the second hole 143 , and the air heated by heat exchange in the first channel CH1 is discharged to the top of the device through the third hole 141 . Since the air moves upward when it becomes hot, when the first hole 143 is disposed on the floor in this way, there is an advantage in that it is easy to circulate the air.

The first fan F1 is installed on the first heat sink 210 at a position facing the second hole 143 . That is, the first fan F1 is installed at the lower end of the heat sink 210 .

A first hole 211 is installed at the rear end of the first heat sink 210 , and may be installed at a position corresponding to the third hole 143 provided in the back cover 140 .

Accordingly, when the first fan F1 is operated in the direction toward the first channel CH1, air flows into the device through the second hole 143 of the back cover 140 and the first channel CH1 ) is supplied. Thereafter, the air heat-exchanged in the first channel CH1 may be discharged to the outside of the device through the first hole 211 and the third hole 141 of the back cover 140 .

The second flow path AF2 is a flow of air that circulates through the second channel CH2 and the closed installation area MA, and is formed at either the upper end or the lower end of the second heat sink 220 in the height direction of the device. The second fan F2 and the fourth hole 151 formed in the other one and circulating the heat-exchanged air in the second channel CH2 may be included. The drawing illustrates that the second fan F2 is formed on the upper end of the second heat sink 220 .

The second fan F2 may forcibly flow air into the second channel CH2 , and the air flowing along the second channel CH2 is circulated to the installation area MA through the fourth hole 151 . A second flow path AF2 may be formed.

Meanwhile, in one example, the device 100 may be configured to include a temperature sensor 810 disposed in the first flow path AF1 as illustrated in FIG. 6 . The temperature sensor 810 measures the temperature of the air flowing into the first channel CH1 along the first flow path AF1 and operates to transmit it to a timer (not shown).

The timer (not shown) may be configured as a part of the driving board 120 or as a separate driving board. The timer may operate to adjust the amount of air introduced into the first flow path AF1 by adjusting the rotation speed of the first fan F1 according to a signal input from the temperature sensor 810 .

In addition, the timer may store log information in which the temperature measured by the temperature sensor is recorded in units of time. The log information can be used as AS information in case the device malfunctions.

7 illustrates an example in which the device is configured to further include a heatsink disposed on the flow path. In the present specification, a heat sink refers to a heat-conducting medium, and the shape or mechanical configuration may be used without any particular limitation as long as it does not interfere with the flow of air on the flow path without any particular limitation.

In this example, the heat sink is a first heat sink HS1 disposed on the first channel CH1 between the display module 110 and the first heat sink 210 or/and the first heat sink 210 and the first heat sink 210 . A second heat sink HS2 disposed on the second channel CH2 between the two heat sinks 220 may be included.

By increasing the contact area of the first and second heat sinks HS1 and HS2 with the air flowing along the channel, it may help to more effectively dissipate the heated air.

Hereinafter, another example of the display apparatus 1000 will be described with reference to FIG. 8 . 8 is a diagram illustrating a cross-sectional configuration of a display device according to another example. The cross-section is based on the line I-I' of FIG. 1 .

The display apparatus 1000 illustrated in FIG. 8 has the same basic configuration as compared to the display apparatus 100 described above, but has a difference in the configuration of the first channel forming the open loop.

Another example of the display apparatus 1000 may include a display display module 1100 , a driving unit 1200 , and a housing 1300 for mounting them. Their configuration is substantially the same as that of the above-described display module 110 , the driving unit 120 , and the housing 130 , so a detailed description of the configuration will be omitted.

In FIG. 8 , the third heat sink 2300 is located on the rear side of the display module 1100 , is disposed to face the display module 1100 , and forms a third channel CH3 between the display modules 1100 . The third channel CH3 constitutes a closed loop, which will be described in detail later.

The upper and lower ends of the third heat sink 2300 may be fixed to the display module 1100 while being bent toward the display module 1100 , respectively.

The driving unit 120 may be installed on the rear surface of the third heat sink 2300 .

A fourth heat sink 2100 may be disposed on the rear surface of the third heat sink 2300 while maintaining a predetermined distance from the third heat sink 2300 . Between the third heat sink 2300 and the fourth heat sink 2100 , a bracket 5100 that partitions the installation area MA sealed around the driving board may be further formed.

The bracket 5100 is positioned outside the third heat sink 2300 in the height direction of the device. The bracket 5100 includes a first bracket 5100a disposed above the driving board 1200 in the height direction and a second bracket 5100b disposed below the driving board 1200 . Since the first bracket 5100a and the second bracket 5100b are disposed to surround the driving board 1200 as described above, the driving board 1200 may be disposed in the sealed installation area MA. When the driving board 1200 is disposed in an enclosed area, it is possible to prevent the driving board from being exposed to dust or moisture, thereby preventing device failure in advance.

A third gasket 4110 is further disposed between the bracket 510 and the fourth heat sink 2100 to seal the installation area MA.

The back cover 1400 is attached to the housing 1300 while maintaining a predetermined distance from the fourth heat sink 2100 on the rear surface of the device, and forming a channel therebetween. Hereinafter, a channel formed between the fourth heat sink 2100 and the back cover 1400 is referred to as a fourth channel CH4.

The display apparatus 1000 includes a third flow path AF3 formed through the third channel CH3 and a fourth flow path AF4 formed through the fourth channel CH4 through this configuration.

Hereinafter, the channel and the flow path will be described with reference to FIG. 9 .

In one example, the third flow path AF3 is a closed loop that circulates between the third channel CH3 and the installation area MA, and the fourth flow path AF4 flows into the fourth channel CH4 from the outside of the device. , is an open loop through which the heat exchanged air in the fourth channel DH4 exits to the outside of the device.

The third flow path AF3 is formed in the third fan F3 installed at either the top or the bottom of the third heat sink 2300 in the height direction of the device, and is formed in the other one and is heat-exchanged in the third channel CH3. It may be formed to include a fifth hole 2311 for circulating air.

When the third fan F3 operates, air flows into the third channel CH3 and exchanges heat transferred from the display module 1100 into the sealed installation area MA through the fifth hole H5. . Since the third channel CH3 and the installation area MA are closed spaces, air is circulated in a closed loop along the third flow path FA3 without introducing air from the outside of the device.

The fourth flow path (AF4) is formed in the fourth fan (F4) installed at either the top or the bottom of the back cover (1400) in the height direction of the device, and the air formed in the other one and heat-exchanged in the fourth channel (CH4) It may be formed to include a sixth hole 1141 for discharging to the outside of the device.

When the fourth fan F4 operates, air is introduced into the fourth channel CH4 from the outside of the device. However, since the third flow path FA3 and the fourth flow path FA4 face each other with the fourth heat sink 2100 interposed therebetween, the air passing through the fourth flow path FA4 exchanges heat transferred from the third flow path side. As the air heat-exchanged in the fourth channel CH4 is discharged to the outside through the sixth hole 1141, heat generated in the device may be discharged.

10 illustrates an example in which the operating fan is disposed between the driving units. In FIG. 10 , the first sub-hole ( 2311a) and a second sub-hole 2311b may be formed.

According to this configuration, the flow path FA3 forms a flow path as illustrated in FIG. 11 . In this example, the third flow path FA3 includes a first sub flow path FA31 and a second sub flow path FA32 .

The first sub flow path FA31 is a flow of air circulated around the first driving unit 1120a , and the second sub flow path FA32 is a flow of air circulated around the second driving unit 1120b .

The operating fan DF and the first sub-hole 2311a are disposed on the first sub-channel FA31 , and the operating fan DF and the second sub-hole 2311b are disposed on the second sub-channel FA32 . The first sub-hole 2311a may be installed at the upper end of the third heat sink 2300 in the height direction of the device, and the second sub-hole 2311b may be installed at the lower end.

12 shows a cross-sectional view of an apparatus configured to include a heat exchanger 5000 disposed on a third flow path and a fourth flow path. The heat exchanger 5000 may be installed on the fourth heat sink 2100 so that a part is exposed to the third flow path FA3 and a part is exposed to the fourth flow path FA4 . Since the configuration related to the heat exchanger is substantially the same as that of the heat exchanger 500 described in FIG. 4 , a detailed description thereof will be omitted.

13 is a view for explaining an example in which a temperature sensor is further installed in the fourth channel CH4. Since the configuration is substantially the same as that of the temperature sensor 810 described in FIG. 6 , a detailed description thereof will be omitted.

14 is a view for explaining an example in which a heat sink is further installed in a third channel and a fourth channel. Since this example also has substantially the same configuration as the heat sink described in FIG. 7 , a detailed description thereof will be omitted.

15 and 16 are diagrams illustrating an example of a double-sided display device DA made by using the display device 1000 described with reference to FIG. 8 .

The double-sided display device includes a first display device D1 and a second display device D2 hinged to the first display device D1. Each configuration of the first and second display devices is the same as described with reference to FIG. 8 .

The first display device D1 is positioned to face the front, and the second display device D2 is positioned to face the rear when the first display device D1 is referenced. Accordingly, the back cover of the first display device D1 and the back cover of the second display device D2 are positioned in contact with each other.

The double-sided display device DA may be connected through the hinge part HR. As the hinge part HR, various well-known hinge configurations may be used.

One end of the hinge part HR is coupled to the first display device D1, and the other end of the hinge part HR is coupled to the second display device D2. 2 is exemplified by being fixed to the top of the display device.

According to this configuration, when one of the first display device or the second display device breaks down, as illustrated in FIG. 16 , the hinge part can be spread out, so that the malfunctioning device can be easily repaired.

In addition, in the example shown in FIG. 8 , in the display device, a fourth flow path formed as an open loop is formed between the backer and the fourth heat sink. Accordingly, when the first and second display devices are configured in a double-sided type, since the fourth flow path of the first display device and the fourth flow path of the second display device are disposed in contact with each other, heat dissipation efficiency of the double-sided display device can be effectively improved.

Claims (15)

housing;
a display module installed in the housing;
a transparent substrate installed on the front surface of the display module;
a first heat sink installed on a rear surface of the display module;
a sealing part partitioning a space between the display module and the first heat sink to form a first channel for a first flow path;
a second heat sink installed on a rear surface of the first heat sink and forming a second channel for a second flow path between the first heat sink;
a driving board installed on a rear surface of the second heat sink;
a back cover attached to the housing to cover the driving board; and
a bracket for partitioning a sealed installation area around the driving board between the second heat sink and the back cover;
including,
The first flow path is an open loop that is introduced into the first channel from the outside of the device, and the heat exchanged air in the first channel exits the outside of the device,
The second flow path is a closed loop that circulates through the second channel and the installation area around the driving board,
A front surface of the display module is bonded to a rear surface of the transparent substrate. delete According to claim 1,
The first flow path is a first fan (FAN) for introducing air into the first channel from one of the front end or the rear end of the first heat sink, and discharging the heat exchanged air from the first channel to the other one. A display device formed including a first hole. 4. The method of claim 3,
The back cover is formed to correspond to the portion where the first fan is installed, and includes a second hole for supplying air to the first channel and a third hole for discharging the heat-exchanged air from the first channel CH1 to the outside. A display device comprising a. According to claim 1,
The sealing part,
a first gasket installed on the rear surface of the display module and partitioning the first channel;
an insert installed on the front surface of the first heat sink and inserted and coupled to the first gasket;
A display device comprising a. 4. The method of claim 3,
The second flow path includes a second fan formed at either a front end or a rear end of the second heat sink, and a fourth hole formed at the other end and circulating the heat exchanged air in the second channel. According to claim 1,
a second gasket disposed between the bracket and the back cover to seal the installation area;
The back cover is bolted to the bracket to apply pressure to the second gasket along the periphery of the second gasket. 4. The method of claim 3,
a temperature sensor installed in the first channel;
a timer for adjusting the rotation speed of the first fan according to the temperature measured by the temperature sensor;
A display device further comprising a. 9. The method of claim 8,
The timer further stores log information in which the temperature measured by the temperature sensor is recorded in units of time. According to claim 1,
A heat sink is disposed in at least one of the first channel and the second channel. housing;
a transparent substrate installed on the front surface of the display module;
a display module installed inside the housing;
a third heat sink installed on a rear surface of the display module and forming a third channel for a third flow path between the display modules;
a driving board disposed on the rear surface of the third heat sink;
a fourth heat sink installed to cover the driving board;
a bracket for partitioning a sealed installation area around the driving board between the third heat sink and the fourth heat sink; and
a back cover coupled to the housing at the rear surface of the fourth heat sink and forming a fourth channel for a fourth flow path between the fourth heat sink;
including,
The third flow path is a closed loop that circulates through the third channel and the installation area around the driving board,
The fourth flow path is an open loop that is introduced into the fourth channel from the outside of the device, and the heat exchanged air in the fourth channel goes out to the outside of the device,
A front surface of the display module is bonded to a rear surface of the transparent substrate. delete 12. The method of claim 11,
The third flow path includes a third fan installed at either the upper or lower end of the third heat sink in the height direction of the device, and a fifth hole formed at the other and circulating the heat exchanged air in the third channel. display device. 12. The method of claim 11,
The fourth flow path includes a fourth fan installed at either the upper or lower end of the back cover in the height direction of the device, and a sixth hole formed at the other and discharging heat exchanged air in the fourth channel to the outside of the device. A display device formed by including. 12. The method of claim 11,
The driving board includes a first driving unit and a second driving unit physically divided in the height direction of the device,
The third flow path includes an operating fan disposed between the first driving unit and the second driving unit, and first and second sub-holes respectively formed at upper and lower ends of the third heat sink in the height direction of the device. composed,
The third flow path includes a first sub flow path circulating along the operating fan and the first sub-hole, and a second sub flow path circulating along the operating fan and the second sub-hole.

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