KR102332452B1 - Di-functional thermosetting resin comprising aziridine derivatives - Google Patents

Di-functional thermosetting resin comprising aziridine derivatives Download PDF

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KR102332452B1
KR102332452B1 KR1020170100128A KR20170100128A KR102332452B1 KR 102332452 B1 KR102332452 B1 KR 102332452B1 KR 1020170100128 A KR1020170100128 A KR 1020170100128A KR 20170100128 A KR20170100128 A KR 20170100128A KR 102332452 B1 KR102332452 B1 KR 102332452B1
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윤효재
강서현
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고려대학교 산학협력단
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Abstract

본 발명은 하기 [화학식 Ⅰ]로 표시되는 아지리딘 유도체를 포함하는 이관능성 열경화성 수지에 관한 것으로서, 경화속도가 빠르고, 낮은 에너지 조건에서도 높은 경화도를 가지며, 아지리딘에 도입되는 치환기를 조절하여 다양한 기질에 대해서 선택적인 반응성을 갖는 것을 특징으로 한다.
[화학식 Ⅰ]

Figure 112017076203358-pat00026
The present invention relates to a bifunctional thermosetting resin comprising an aziridine derivative represented by the following [Formula I], has a fast curing rate, a high degree of curing even under low energy conditions, and various substrates by controlling the substituents introduced into aziridine It is characterized in that it has a selective reactivity with respect to
[Formula Ⅰ]
Figure 112017076203358-pat00026

Description

아지리딘 유도체를 포함하는 이관능성 열경화성 수지{Di-functional thermosetting resin comprising aziridine derivatives}Di-functional thermosetting resin comprising aziridine derivatives

본 발명은 아지리딘 유도체를 포함하는 이관능성 열경화성 수지에 관한 것으로서, 경화속도가 빠르고, 경화제에 대한 기질 선택성을 가지면서, 낮은 에너지 조건에서도 높은 경화도를 갖는 이관능성 열경화성 수지에 관한 것이다.The present invention relates to a bifunctional thermosetting resin containing an aziridine derivative, and to a bifunctional thermosetting resin having a fast curing rate, substrate selectivity to a curing agent, and a high degree of curing even under low energy conditions.

현재 가장 흔히 사용되는 삼각고리 헤테로고리화합물인 에폭사이드(Epoxide)의 경우 아래에서 보는 바와 같이, 상당한 ring strain으로 인하여 개환반응이 용이하여, 에폭사이드 작용기를 포함하는 비스페놀형 수지인 DGEBA (Diglycidyl Ether of Bisphenol A)가 현재 고분자 에폭시 산업에서 가장 흔히 쓰이는 수지이다.In the case of epoxide, which is the most commonly used tricyclic heterocyclic compound, as shown below, the ring-opening reaction is easy due to significant ring strain, and DGEBA (Diglycidyl Ether of DGEBA), a bisphenol-type resin containing an epoxide functional group, is Bisphenol A) is currently the most commonly used resin in the polymer epoxy industry.

Figure 112017076203358-pat00001
Figure 112017076203358-pat00001

그러나, 현재 산업에서 가장 흔히 사용되는 에폭시 수지의 경우 경화속도가 느리고, 저온에 경화 정도가 낮으며, 경화제에 대한 기질 선택성이 매우 낮다는 문제점이 있다.However, in the case of the epoxy resin most commonly used in industry at present, there are problems in that the curing rate is slow, the curing degree is low at a low temperature, and the substrate selectivity for the curing agent is very low.

따라서, 기존 에폭시 기반 코팅 재료의 문제 해결을 위한 새로운 원천 물질 개발이 절실히 필요한 실정이고, 특히 에폭시 대비 낮은 에너지 조건에서 고분자화가 진행될 수 있고, 에폭시 대비 보다 더 빠르게 경화반응이 진행할 수 있는 물질의 확보가 필요하다.Therefore, there is an urgent need to develop a new source material to solve the problem of existing epoxy-based coating materials. In particular, polymerization can proceed under low energy conditions compared to epoxy, and it is difficult to secure a material that can cure faster than epoxy. necessary.

따라서, 본 발명은 상기와 같은 문제점을 해결하기 위하여, 경화속도가 빠르고, 경화제에 대한 기질 선택성을 가지며 낮은 에너지 조건에서도 높은 경화도를 갖는 열경화성 수지를 제공하고자 한다.Accordingly, in order to solve the above problems, an object of the present invention is to provide a thermosetting resin having a high curing rate, a substrate selectivity to a curing agent, and a high degree of curing even under low energy conditions.

본 발명은 상기 과제를 해결하기 위하여, 하기 [화학식 Ⅰ]로 표시되는 열경화성 수지 (Diaziridyl Ether of Bisphenol A, DzEBA)를 제공한다.The present invention provides a thermosetting resin (Diaziridyl Ether of Bisphenol A, DzEBA) represented by the following [Formula I] in order to solve the above problems.

[화학식 Ⅰ][Formula Ⅰ]

Figure 112017076203358-pat00002
Figure 112017076203358-pat00002

상기 [화학식 Ⅰ]의 특징 및 R의 정의에 대해서는 후술한다.The characteristics of the [Formula I] and the definition of R will be described later.

본 발명에 따른 열경화성 수지는 경화속도가 빠르고, 경화제에 대한 기질 선택성을 가지며 낮은 에너지 조건에서도 높은 경화도를 갖는 장점이 있으며, 종래 에폭사이드 기반의 소재에 비하여 저에너지 공정이 가능하여 생산단가 절감 효과를 거둘 수 있다. 또한 다양한 화학종의 기질에 대한 반응성을 조절이 가능하여 다양한 새로운 소재 개발을 가능하게 할 수 있다.The thermosetting resin according to the present invention has the advantage of having a fast curing rate, substrate selectivity to a curing agent, and a high degree of curing even under low energy conditions. can In addition, it is possible to control the reactivity of various chemical species to the substrate, enabling the development of various new materials.

도 1은 80 ℃, DMSO 용매 조건에서 Bn-DzEBA 및 DGEBA를 각각 dodecanedioic acid와 경화 반응한 결과를 보여주는 그래프이다.
도 2는 80 ℃, DMSO 용매 조건에서 Ts-DzEBA 및 DGEBA를 각각 Ethylene diamine과 경화 반응한 결과를 보여주는 그래프이다.
도 3은 DMSO를 용매로 하고, 상온, 40 ℃, 60 ℃, 80 ℃에서 각각 Ts-DzEBA를 Ethylene diamine과 경화 반응한 결과를 보여주는 그래프이다.
도 4는 본 발명에 따른 열경화성 수지에서, 아지리딘의 질소에 치환되는 작용기로 전자주개그룹 (EDG)을 도입한 Bn-DzEBA와, 전자끌개그룹 (EWG)을 도입한 Ts-DzEBA을 각각 80 ℃, DMSO 용매 조건에서 dodecanedioic acid와 경화 반응한 결과를 보여주는 그래프이다.
도 5는 본 발명에 따른 열경화성 수지에서, 아지리딘의 질소에 치환되는 작용기로 전자주개그룹 (EDG)을 도입한 Bn-DzEBA와, 전자끌개그룹 (EWG)을 도입한 Ts-DzEBA을 각각 80 ℃, DMSO 용매 조건에서 Ethylene diamine과 경화 반응한 결과를 보여주는 그래프이다.
도 6은 본 발명에 따른 이관능성 열경화성 수지의 구조를 나타낸 대표도이다.
1 is a graph showing the results of curing reaction of Bn-DzEBA and DGEBA with dodecanedioic acid at 80° C. and DMSO solvent conditions, respectively.
2 is a graph showing the results of curing reaction of Ts-DzEBA and DGEBA with ethylene diamine at 80° C. and DMSO solvent conditions, respectively.
3 is a graph showing the results of curing reaction of Ts-DzEBA with ethylene diamine at room temperature, 40°C, 60°C, and 80°C using DMSO as a solvent, respectively.
4 is a thermosetting resin according to the present invention, Bn-DzEBA introducing an electron donor group (EDG) as a functional group substituted for nitrogen of aziridine, and Ts-DzEBA introducing an electron withdrawing group (EWG) at 80 ° C. , It is a graph showing the result of curing reaction with dodecanedioic acid in DMSO solvent condition.
5 is a thermosetting resin according to the present invention, Bn-DzEBA introducing an electron donor group (EDG) as a functional group substituted for nitrogen of aziridine, and Ts-DzEBA introducing an electron withdrawing group (EWG) at 80 ° C. , It is a graph showing the result of curing reaction with ethylene diamine in DMSO solvent condition.
6 is a representative view showing the structure of the bifunctional thermosetting resin according to the present invention.

이하, 본 발명을 더욱 상세하게 설명한다.Hereinafter, the present invention will be described in more detail.

본 발명에 따른 치환된 아지리딘을 도입한 수지는 하기 [화학식 Ⅰ]로 표시되고, (ⅰ) 아지리딘 구조체가 도입된 것을 특징으로 하고, 이러한 구조적 특징에 의해서 낮은 온도에서도 빠른 경화속도를 갖도록 한 것을 특징으로 한다. 또한, (ⅱ) 아지리딘의 질소에 결합하는 작용기를 전자 주개 그룹 (EDG), 전자 끌개 그룹 (EWG)으로 조절하여 기질에 대한 선택성을 증가시킨 것을 특징으로 한다.The resin to which the substituted aziridine according to the present invention is introduced is represented by the following [Formula I], (i) characterized in that an aziridine structure is introduced, and by this structural feature, it has a fast curing rate even at a low temperature characterized in that In addition, (ii) the functional group binding to the nitrogen of aziridine is adjusted to an electron donor group (EDG) or an electron withdrawing group (EWG) to increase the selectivity for the substrate.

[화학식 Ⅰ][Formula Ⅰ]

Figure 112017076203358-pat00003
Figure 112017076203358-pat00003

상기 [화학식 Ⅰ]에서,In the [Formula I],

R은 치환 또는 비치환된 탄소수 1 내지 20의 알킬기, 치환 또는 비치환된 탄소수 2 내지 30의 알케닐기, 치환 또는 비치환된 탄소수 3 내지 20의 시클로알킬기, 치환 또는 비치환된 탄소수 6 내지 20의 아릴기 및 하기 [구조식 1] 중에서 선택되는 어느 하나이다.R is a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, a substituted or unsubstituted C6 to C20 Any one selected from an aryl group and the following [Structural Formula 1].

[구조식 1][Structural Formula 1]

Figure 112017076203358-pat00004
Figure 112017076203358-pat00004

상기 [구조식 1]에서,In the [Structural Formula 1],

R1 및 R2는 각각 독립적으로 수소, 중수소, 할로겐기, 니트릴기, 히드록시기, 치환 또는 비치환된 탄소수 1 내지 20의 알킬기, 치환 또는 비치환된 탄소수 2 내지 20의 알케닐기, 치환 또는 비치환된 탄소수 2 내지 20의 알키닐기, 치환 또는 비치환된 탄소수 3 내지 20의 시클로알킬기, 치환 또는 비치환된 탄소수 6 내지 20의 아릴기 및 탄소수 3 내지 20의 헤테로아릴기 중에서 선택되는 어느 하나이다.R 1 and R 2 are each independently hydrogen, deuterium, a halogen group, a nitrile group, a hydroxy group, a substituted or unsubstituted C 1 to C 20 alkyl group, a substituted or unsubstituted C 2 to C 20 alkenyl group, a substituted or unsubstituted Any one selected from an alkynyl group having 2 to 20 carbon atoms, a substituted or unsubstituted cycloalkyl group having 3 to 20 carbon atoms, a substituted or unsubstituted aryl group having 6 to 20 carbon atoms and a heteroaryl group having 3 to 20 carbon atoms.

한편, 상기 치환 또는 비치환이란 상기 R, R1 및 R2가 각각 독립적으로 중수소, 할로겐기, 니트릴기, 히드록시기, 탄소수 1 내지 20의 알킬기, 탄소수 2 내지 20의 알케닐기, 탄소수 3 내지 20의 시클로알킬기, 탄소수 6 내지 20의 아릴기 및 탄소수 3 내지 20의 헤테로아릴기 중에서 선택되며, 선택된 1 또는 2 이상의 치환기로 치환되거나, 상기 치환기 중 2 이상의 치환기가 연결된 치환기로 치환되거나, 또는 어떠한 치환기도 갖지 않는 것을 의미한다.On the other hand, the substituted or unsubstituted means that R, R 1 and R 2 are each independently deuterium, a halogen group, a nitrile group, a hydroxy group, an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, and 3 to 20 carbon atoms. It is selected from a cycloalkyl group, an aryl group having 6 to 20 carbon atoms, and a heteroaryl group having 3 to 20 carbon atoms, and is substituted with one or more selected substituents, or substituted with a substituent to which two or more of the substituents are connected, or any substituents means not having

구체적인 예를 들면, 치환된 아릴기라 함은, 페닐기, 비페닐기, 나프탈렌기, 플루오레닐기, 파이레닐기, 페난트레닐기, 페릴렌기, 테트라세닐기, 안트라센닐기 등이 다른 치환기로 치환된 것을 의미한다.For specific examples, the substituted aryl group means that a phenyl group, a biphenyl group, a naphthalene group, a fluorenyl group, a pyrenyl group, a phenanthrenyl group, a perylene group, a tetracenyl group, an anthracenyl group, etc. are substituted with other substituents do.

본 발명에 있어서, 상기 치환기들의 예시들에 대해서 아래에서 구체적으로 설명하나, 이에 한정되는 것은 아니다.In the present invention, examples of the substituents will be described in detail below, but the present invention is not limited thereto.

본 발명에 있어서, 상기 알킬기는 직쇄 또는 분지쇄일 수 있고, 구체적인 예로는 메틸기, 에틸기, 프로필기, n-프로필기, 이소프로필기, 부틸기, n-부틸기, 이소부틸기, tert-부틸기, sec-부틸기, 1-메틸-부틸기, 1-에틸-부틸기, 펜틸기, n-펜틸기, 이소펜틸기, 네오펜틸기, tert-펜틸기, 헥실기, n-헥실기, 1-메틸펜틸기, 2-메틸펜틸기, 4-메틸-2-펜틸기, 3,3-디메틸부틸기, 2-에틸부틸기, 헵틸기, n-헵틸기, 1-메틸헥실기, 시클로펜틸메틸기, 시클로헥틸메틸기, 옥틸기, n-옥틸기, tert-옥틸기, 1-메틸헵틸기, 2-에틸헥실기, 2-프로필펜틸기, n-노닐기, 2,2-디메틸헵틸기, 1-에틸-프로필기, 1,1-디메틸-프로필기, 이소헥실기, 2-메틸펜틸기, 4-메틸헥실기, 5-메틸헥실기 등이 있으나, 이들에 한정되지 않는다.In the present invention, the alkyl group may be linear or branched, and specific examples include a methyl group, an ethyl group, a propyl group, n-propyl group, isopropyl group, butyl group, n-butyl group, isobutyl group, tert-butyl group , sec-butyl group, 1-methyl-butyl group, 1-ethyl-butyl group, pentyl group, n-pentyl group, isopentyl group, neopentyl group, tert-pentyl group, hexyl group, n-hexyl group, 1 -Methylpentyl group, 2-methylpentyl group, 4-methyl-2-pentyl group, 3,3-dimethylbutyl group, 2-ethylbutyl group, heptyl group, n-heptyl group, 1-methylhexyl group, cyclopentyl group methyl group, cyclohexylmethyl group, octyl group, n-octyl group, tert-octyl group, 1-methylheptyl group, 2-ethylhexyl group, 2-propylpentyl group, n-nonyl group, 2,2-dimethylheptyl group, 1-ethyl-propyl group, 1,1-dimethyl-propyl group, isohexyl group, 2-methylpentyl group, 4-methylhexyl group, 5-methylhexyl group, and the like, but is not limited thereto.

본 발명에 있어서, 아릴기는 단환식 또는 다환식일 수 있고, 단환식 아릴기의 예로는 페닐기, 비페닐기, 터페닐기, 스틸벤기 등이 있고, 다환식 아릴기의 예로는 나프틸기, 안트라세닐기, 페난트레닐기, 파이레닐기 등이 있으나, 본 발명의 범위가 이들 예로만 한정되는 것은 아니다.In the present invention, the aryl group may be monocyclic or polycyclic, and examples of the monocyclic aryl group include a phenyl group, a biphenyl group, a terphenyl group, and a stilbene group, and examples of the polycyclic aryl group include a naphthyl group and an anthracenyl group. , a phenanthrenyl group, a pyrenyl group, and the like, but the scope of the present invention is not limited to these examples.

본 발명에 있어서, 상기 알케닐기는 직쇄 또는 분지쇄일 수 있고, 구체적인 예로는 비닐기, 1-프로페닐기, 이소프로페닐기, 1-부테닐기, 2-부테닐기, 3-부테닐기, 1-펜테닐기, 2-펜테닐기, 3-펜테닐기 등이 있으나 이들에 한정되지 않는다.In the present invention, the alkenyl group may be linear or branched, and specific examples include a vinyl group, 1-propenyl group, isopropenyl group, 1-butenyl group, 2-butenyl group, 3-butenyl group, 1-pentenyl group. , 2-pentenyl group, 3-pentenyl group, and the like, but are not limited thereto.

본 발명에 있어서, 헤테로아릴기는 이종원자로 O, N 또는 S를 포함하는 헤테로고리기로서, 그 예로는 티오펜기, 퓨란기, 피롤기, 이미다졸기, 티아졸기, 옥사졸기, 옥사디아졸기, 트리아졸기, 피리딜기, 비피리딜기, 피리미딜기, 트리아진기, 트리아졸기, 아크리딜기, 피리다진기, 피라지닐기, 퀴놀리닐기, 퀴나졸린기, 퀴녹살리닐기 등이 있으나, 이들에만 한정되는 것은 아니다.In the present invention, the heteroaryl group is a heterocyclic group containing O, N or S as a heteroatom, and examples thereof include a thiophene group, a furan group, a pyrrole group, an imidazole group, a thiazole group, an oxazole group, an oxadiazole group, Triazole group, pyridyl group, bipyridyl group, pyrimidyl group, triazine group, triazole group, acridyl group, pyridazine group, pyrazinyl group, quinolinyl group, quinazoline group, quinoxalinyl group, etc., but limited to these it's not going to be

본 발명에 있어서, 시클로알킬기는 특별히 한정되지 않으나, 구체적으로 시클로프로필기 시클로부틸기 시클로펜틸기 3-메틸시클로펜틸기 2,3-디메틸시클로펜틸기, 시클로헥실기, 3-메틸시클로헥실기, 4-메틸시클로헥실기 등이 있으나 이에 한정되지 않는다.In the present invention, the cycloalkyl group is not particularly limited, but specifically, a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a 3-methylcyclopentyl group, a 2,3-dimethylcyclopentyl group, a cyclohexyl group, a 3-methylcyclohexyl group, 4-methylcyclohexyl group, and the like, but is not limited thereto.

본 발명에 있어서, 할로겐기의 예로는 불소, 염소, 브롬 또는 요오드가 있다.In the present invention, examples of the halogen group include fluorine, chlorine, bromine or iodine.

본 발명에 따른 [화학식 Ⅰ]의 구체적인 일 예시로서, 하기 [화학식 1] 또는 [화학식 2]를 들 수 있으며, 이는 아지리딘의 질소에 도입되는 일 작용기를 보여주는 구체적인 예시로서, 본 발명의 범위가 이에 제한되지 않는다.As a specific example of [Formula I] according to the present invention, the following [Formula 1] or [Formula 2] may be mentioned, which is a specific example showing one functional group introduced into the nitrogen of aziridine, and the scope of the present invention is It is not limited thereto.

[화학식 1][Formula 1]

Figure 112017076203358-pat00005
Figure 112017076203358-pat00005

[화학식 2][Formula 2]

Figure 112017076203358-pat00006
Figure 112017076203358-pat00006

이하, 실시예 및 실험예를 통하여 본 발명을 더욱 상세하게 설명하기로 한다. 이러한 실시예 및 실험예는 본 발명을 구체적으로 예시하기 위한 것일 뿐이며, 본 발명의 범위가 이러한 실시예 및 실험예에 의하여 제한되는 것은 아니다.Hereinafter, the present invention will be described in more detail through Examples and Experimental Examples. These Examples and Experimental Examples are only for specifically illustrating the present invention, and the scope of the present invention is not limited by these Examples and Experimental Examples.

합성예 1 : Benzyl Diaziridyl Ether of Bisphnol A (Bn-DzEBA)Synthesis Example 1: Benzyl Diaziridyl Ether of Bisphnol A (Bn-DzEBA)

(1) 중간체 S3의 합성(1) Synthesis of intermediate S3

Figure 112017076203358-pat00007
Figure 112017076203358-pat00007

에틸아크릴레이트 (10.63 mL, 99.88 mmol)의 용액 (DCM 75 mL)에 브롬 (5.14 mL, 99.88 mmol)을 0 ℃에서 20 분동안 불활성 분위기에서 적가하였으며, 반응 혼합물을 0 ℃에서 1 시간 동안 교반한 후, 실온에서 3 시간 동안 교반하였다. 반응 완료 후, 혼합물을 포화 Na2S2O3 수용액으로 ??칭시킨 후, 혼합물을 DCM 및 물로 추출한 다음, 유기층을 분리하여 S3 화합물을 수득하였다.Bromine (5.14 mL, 99.88 mmol) was added dropwise to a solution of ethyl acrylate (10.63 mL, 99.88 mmol) (DCM 75 mL) at 0 °C for 20 min in an inert atmosphere, and the reaction mixture was stirred at 0 °C for 1 hour. Then, the mixture was stirred at room temperature for 3 hours. After completion of the reaction, the mixture was quenched with saturated Na 2 S 2 O 3 aqueous solution, the mixture was extracted with DCM and water, and the organic layer was separated to obtain S3 compound.

(2) 중간체 S4의 합성(2) Synthesis of intermediate S4

Figure 112017076203358-pat00008
Figure 112017076203358-pat00008

에틸2,3-디브로모프로파노에이트 (15 g, 57.71 mmol) 및 트리메틸아민 (16 mL, 69.6 mmol)을 중 벤질아민 용액 (무수 에탄올 120 mL)에 0 ℃에서 질소 분위기에서 순차적으로 첨가하였다. 반응 혼합물을 60 ℃에서 1 시간 동안 교반하였다. 혼합물의 용매를 증발시키고 조 생성물을 디클로로메탄으로 추출하고, 유기상을 황산마그네슘으로 건조시키고, 용매를 실온에서 감압하여 제거하였으며, 컬럼크로마토그래피로 정제하여 백색 고체 생성물 S4를 수득하였다.Ethyl2,3-dibromopropanoate (15 g, 57.71 mmol) and trimethylamine (16 mL, 69.6 mmol) were added sequentially to a solution of benzylamine in heavy (120 mL anhydrous ethanol) at 0 °C in a nitrogen atmosphere. . The reaction mixture was stirred at 60 °C for 1 h. The solvent of the mixture was evaporated, the crude product was extracted with dichloromethane, the organic phase was dried over magnesium sulfate, the solvent was removed under reduced pressure at room temperature, and purified by column chromatography to obtain a white solid product S4.

(3) 중간체 S5의 합성(3) Synthesis of intermediate S5

Figure 112017076203358-pat00009
Figure 112017076203358-pat00009

리튬알루미늄하이드라이드 (1.849 g, 48.72 mmol)를 에틸1-벤질아지리딘-2-카르복실레이트 (5 g, 24.36 mmol) 용액(디에틸에테르 130 mL)에 서서히 첨가한 후 실온에서 3 시간 동안 교반하였다. 반응 혼합물을 물 (1.9 mL) 및 15 % NaOH 수용액 (1.9 mL), 이어서 물 (5.6 mL)로 ??칭시켰다. 혼합물의 여과 후, 조 화합물을 에틸 아세테이트로 추출하였다. 유기상을 황산마그네슘으로 건조시키고, 용매를 감압하에서 제거한 후에 S5 황색 분말을 수득하였다.Lithium aluminum hydride (1.849 g, 48.72 mmol) was slowly added to a solution of ethyl 1-benzylaziridine-2-carboxylate (5 g, 24.36 mmol) (130 mL of diethyl ether), followed by stirring at room temperature for 3 hours. did. The reaction mixture was quenched with water (1.9 mL) and 15% aqueous NaOH solution (1.9 mL) followed by water (5.6 mL). After filtration of the mixture, the crude compound was extracted with ethyl acetate. The organic phase was dried over magnesium sulfate and the solvent was removed under reduced pressure to give S5 yellow powder.

(4) 중간체 S5의 합성(4) Synthesis of intermediate S5

Figure 112017076203358-pat00010
Figure 112017076203358-pat00010

(1-벤질아지리딘-2-일)메탄올 (1 g, 6.127 mmol) 용액 (트리에틸아민 3.0 mL, 21.64 mmol)에 p-톨루엔 술포닐 클로라이드 (1.402 g, 7.352 mmol), 디클로로메탄 (15 mL)을 질소 분위기, 0 ℃에서 첨가하고, 혼합물을 0 ℃에서 2 시간 동안 교반하였다. 반응물의 미정제물을 디클로로메탄으로 추출하였으며, 유기상을 황산마그네슘으로 건조시키고, 용매를 실온에서 감압하여 제거하였으며, 컬럼크로마토그래피로 정제하여 백색 고체 생성물 S6를 수득하였다.To a solution of (1-benzylaziridin-2-yl)methanol (1 g, 6.127 mmol) (triethylamine 3.0 mL, 21.64 mmol) p-toluene sulfonyl chloride (1.402 g, 7.352 mmol), dichloromethane (15 mL) ) was added at 0 °C in a nitrogen atmosphere, and the mixture was stirred at 0 °C for 2 hours. The crude product of the reaction product was extracted with dichloromethane, the organic phase was dried over magnesium sulfate, the solvent was removed under reduced pressure at room temperature, and purified by column chromatography to obtain a white solid product S6.

(4) Benzyl Diaziridyl Ether of Bisphnol A (S1, Bn-DzEBA)의 합성(4) Synthesis of Benzyl Diaziridyl Ether of Bisphnol A (S1, Bn-DzEBA)

Figure 112017076203358-pat00011
Figure 112017076203358-pat00011

비스페놀 A (108 mg, 0.436 mmol), 18-크라운-에테르 (15.5 mg, 0.0586 mmol) 및 KOH (135 mg, 2.398 mmol) 용액 (THF 15 mL)에 (1-벤질아지리딘-2-일)메틸 4-메틸벤젠술포네이트 (277 mg, 0.872 mmol)를 첨가하고, 혼합물을 17 시간 동안 환류시켰다. 반응 용액을 실온으로 냉각시키고 CH2Cl2로 추출하였다. 합쳐진 유기층을 무수 MgSO4상에서 건조시키고 여과하고 진공 하에서 농축시켰다. 조 생성물을 칼럼크로마토그래피 (EA : 헥산 = 2 : 1)로 정제하여 황색 오일의 S1 화합물을 수득하였다.(1-benzylaziridin-2-yl)methyl in a solution of bisphenol A (108 mg, 0.436 mmol), 18-crown-ether (15.5 mg, 0.0586 mmol) and KOH (135 mg, 2.398 mmol) (THF 15 mL) 4-Methylbenzenesulfonate (277 mg, 0.872 mmol) was added and the mixture was refluxed for 17 h. The reaction solution was cooled to room temperature and extracted with CH 2 Cl 2 . The combined organic layers were dried over anhydrous MgSO 4 , filtered and concentrated in vacuo. The crude product was purified by column chromatography (EA : hexane = 2 : 1) to obtain S1 compound as a yellow oil.

합성예 2 : Tosyl Diaziridyl Ether of Bisphenol A (Ts-DzEBA)Synthesis Example 2: Tosyl Diaziridyl Ether of Bisphenol A (Ts-DzEBA)

(1) 중간체 S7의 합성(1) Synthesis of intermediate S7

Figure 112017076203358-pat00012
Figure 112017076203358-pat00012

DMSO를 용매로 하여 탄산칼륨 (6.09 g, 44.06 mmol), p-톨루엔술폰아미드 (5.03 g, 29.37 mmol), 디글리시딜에테르-비스페놀 A (5 g, 14.69 mmol) 및 18-크라운-6 (233 mg, 0.8814 mmol)의 혼합물을 100 ℃에서 2 시간 동안 가열하면서 교반하였다. 실온으로 냉각시킨 후, 반응 혼합물을 에틸아세테이트로 희석하고 증류수로 세척하였다. 유기층을 무수 Na2SO4 상에서 건조시키고 감압 하에서 농축시켰다. 조생성물을 칼럼크로마토그래피 (EA : 헥산 = 3 : 1)로 정제하여 상황색 오일의 S7을 수득하였다.Using DMSO as a solvent, potassium carbonate (6.09 g, 44.06 mmol), p-toluenesulfonamide (5.03 g, 29.37 mmol), diglycidyl ether-bisphenol A (5 g, 14.69 mmol) and 18-crown-6 ( 233 mg, 0.8814 mmol) was stirred with heating at 100 °C for 2 h. After cooling to room temperature, the reaction mixture was diluted with ethyl acetate and washed with distilled water. The organic layer was anhydrous Na 2 SO 4 dried over and concentrated under reduced pressure. The crude product was purified by column chromatography (EA : hexane = 3 : 1) to obtain S7 as a yellow oil.

(2) 중간체 S8의 합성(2) Synthesis of intermediate S8

Figure 112017076203358-pat00013
Figure 112017076203358-pat00013

N, N'- (((프로판-2,2-디일비스(4,1-페닐렌))비스(옥시)비스(2-히드록시 프로판-3,1-디일)비스(4-메틸벤젠술폰아미드) 및 트리에틸아민 (120.9 mg, 1.195 mmol)의 용액에 0 ℃에서 메탄설포닐클로라이드 (40.3 mg, 0.3515 mmol)를 질소 분위기에서 첨가하였다. 혼합물을 실온에서 가열하고 5 시간 동안 교반하였다. 반응 혼합물을 증류수로 ??칭시키고 에틸아세테이트로 추출 작업을 수행하였다. 이어서, 유기물을 염수로 세척하고 Na2SO4 상에서 건조시키고 감압 하에서 농축시켰다. 조생성물을 칼럼크로마토그래피 (EA : 헥산 = 1 : 1)로 정제하여 황색 오일의 S8을 수득하였다.N,N'-(((propane-2,2-diylbis(4,1-phenylene))bis(oxy)bis(2-hydroxypropane-3,1-diyl)bis(4-methylbenzenesulfone To a solution of amide) and triethylamine (120.9 mg, 1.195 mmol) was added methanesulfonylchloride (40.3 mg, 0.3515 mmol) at 0 ° C. The mixture was heated at room temperature and stirred for 5 hours. The mixture was quenched with distilled water and extracted with ethyl acetate, then the organics were washed with brine and Na 2 SO 4 dried over and concentrated under reduced pressure. The crude product was purified by column chromatography (EA: hexane = 1:1) to obtain S8 as a yellow oil.

(3) Tosyl Diaziridyl Ether of Bisphenol A (S2, Ts-DzEBA)의 합성(3) Synthesis of Tosyl Diaziridyl Ether of Bisphenol A (S2, Ts-DzEBA)

Figure 112017076203358-pat00014
Figure 112017076203358-pat00014

((프로판-2,2-디일비스(4,1-페닐렌))비스(옥시)비스 (1-(4-에틸페닐술폰아미도)프로판-3,2-디일) 디메탄술포네이트, 탄산칼륨 및 아세토니트릴 용액을 실온에서 16 시간 동안 교반하였다. 반응 혼합물을 에틸아세테이트로 희석시키고 증류수에 붓고 에틸아세테이트로 추출 작업을 수행하였다. 조생성물을 칼럼크로마토그래피 (EA : 헥산 = 1 : 2)로 정제하여 황색 오일의 S1 화합물을 수득하였다.((propane-2,2-diylbis(4,1-phenylene))bis(oxy)bis(1-(4-ethylphenylsulfonamido)propane-3,2-diyl)dimethanesulfonate, carbonic acid Potassium and acetonitrile solution was stirred at room temperature for 16 hours.The reaction mixture was diluted with ethyl acetate, poured into distilled water, and extracted with ethyl acetate.The crude product was subjected to column chromatography (EA: hexane = 1: 2). Purification gave the S1 compound as a yellow oil.

실험예 1Experimental Example 1

(1) 상기 합성예 1에 따라 제조한 본 발명에 따른 아지리딘 열경화성 수지 화합물 (Benzyl Diaziridyl Ether of Bisphnol A, Bn-DzEBA)과 동일한 골격 (Bisphnol A)을 갖는 에폭사이드 작용기를 갖는 열경화성 수지 (Diglycidyl Ether of Bisphnol A, DGEBA)를 비교예로 하여 경화반응 정도를 확인하였다.(1) A thermosetting resin having an epoxide functional group having the same skeleton (Bisphnol A) as the aziridine thermosetting resin compound (Benzyl Diaziridyl Ether of Bisphnol A, Bn-DzEBA) according to the present invention prepared according to Synthesis Example 1 (Diglycidyl) Ether of Bisphnol A, DGEBA) was used as a comparative example to confirm the degree of curing reaction.

도 1은 80 ℃, DMSO 용매 조건에서 Bn-DzEBA 및 DGEBA를 각각 dodecanedioic acid와 경화 반응한 결과로서, DGEBA에 비해 아지리딘을 내포하는 본 발명에 따른 열경화성 수지 (DzEBA)가 빠른 시간 내에 고리 개환 반응 (Ring Opening Polymerization)이 완결됨을 확인할 수 있다.1 is a result of curing reaction of Bn-DzEBA and DGEBA with dodecanedioic acid in DMSO solvent conditions at 80 ° C., compared to DGEBA. (Ring Opening Polymerization) can be confirmed.

[Diglycidyl Ether of Bisphnol A, DGEBA][Diglycidyl Ether of Bisphnol A, DGEBA]

Figure 112017076203358-pat00015
Figure 112017076203358-pat00015

(2) 상기 합성예 2에 따라 제조한 본 발명에 따른 아지리딘 열경화성 수지 화합물 (Tosyl Diaziridyl Ether of Bisphenol A, Ts-DzEBA)과 동일한 골격 (Bisphnol A)을 갖는 에폭사이드 작용기를 갖는 열경화성 수지 (Diglycidyl Ether of Bisphnol A, DGEBA)를 비교예로 하여 경화반응 정도를 확인하였다.(2) A thermosetting resin having an epoxide functional group having the same skeleton (Bisphnol A) as the aziridine thermosetting resin compound (Tosyl Diaziridyl Ether of Bisphenol A, Ts-DzEBA) according to the present invention prepared according to Synthesis Example 2 (Diglycidyl) Ether of Bisphnol A, DGEBA) was used as a comparative example to confirm the degree of curing reaction.

도 2는 80 ℃, DMSO 용매 조건에서 Ts-DzEBA 및 DGEBA를 각각 Ethylene diamine과 경화 반응한 결과로서, DGEBA에 비해 아지리딘을 내포하는 본 발명에 따른 열경화성 수지 (DzEBA)가 빠른 시간 내에 고리 개환 반응 (Ring Opening Polymerization)이 완결됨을 확인할 수 있다.Figure 2 is the result of curing reaction of Ts-DzEBA and DGEBA with ethylene diamine, respectively, in a DMSO solvent condition at 80 ° C. Compared to DGEBA, the thermosetting resin (DzEBA) containing aziridine according to the present invention has a faster ring-opening reaction. (Ring Opening Polymerization) can be confirmed.

실험예 2Experimental Example 2

상기 합성예 2에 따라 제조한 본 발명에 따른 아지리딘 열경화성 수지 화합물 (Tosyl Diaziridyl Ether of Bisphenol A, Ts-DzEBA)를 DMSO 용매 조건에서 온도를 달리하여 Ethylene diamine과의 경화반응을 확인하였다.The curing reaction of the aziridine thermosetting resin compound (Tosyl Diaziridyl Ether of Bisphenol A, Ts-DzEBA) according to the present invention prepared according to Synthesis Example 2 with ethylene diamine was confirmed by varying the temperature in DMSO solvent conditions.

도 3은 DMSO를 용매로 하고, 상온, 40 ℃, 60 ℃, 80 ℃에서 각각 Ts-DzEBA를 Ethylene diamine과 경화 반응한 결과로서, 본 발명에 따른 열경화성 수지의 경우 낮은 온도 조건에서도 고리 개환 반응이 완결됨을 확인할 수 있다.Figure 3 is the result of curing reaction of Ts-DzEBA with ethylene diamine at room temperature, 40 ℃, 60 ℃, 80 ℃ using DMSO as a solvent, in the case of the thermosetting resin according to the present invention, the ring-opening reaction was You can check the completion.

특히, 도 3의 결과와 도 2의 결과와 종합하여 비교하면 80 ℃ 이하에서도 나아가서 상온에서도 DGEBA보다 향상된 경화 성능을 가짐을 알 수 있다.In particular, when compared with the results of Figure 3 and the results of Figure 2, it can be seen that it has an improved curing performance than DGEBA even at room temperature or below 80 ℃.

실험예 3Experimental Example 3

본 발명에 따른 열경화성 수지 (Bn-DzEBA, Ts-DzEBA)에 대해서 동일한 골격 (Bisphnol A)을 갖는 에폭사이드 작용기를 갖는 열경화성 수지 (Diglycidyl Ether of Bisphnol A, DGEBA)를 비교예로 하여 다양한 기질에 대해서 경화반응을 확인하였다.With respect to the thermosetting resin (Bn-DzEBA, Ts-DzEBA) according to the present invention, a thermosetting resin (Diglycidyl Ether of Bisphnol A, DGEBA) having an epoxide functional group having the same backbone (Bisphnol A) as a comparative example for various substrates The curing reaction was confirmed.

도 4는 본 발명에 따른 열경화성 수지에서, 아지리딘의 질소에 치환되는 작용기로 전자주개그룹 (EDG)을 도입한 Bn-DzEBA와, 전자끌개그룹 (EWG)을 도입한 Ts-DzEBA을 각각 80 ℃, DMSO 용매 조건에서 dodecanedioic acid와 경화 반응한 결과이다.4 is a thermosetting resin according to the present invention, Bn-DzEBA introducing an electron donor group (EDG) as a functional group substituted for nitrogen of aziridine, and Ts-DzEBA introducing an electron withdrawing group (EWG) at 80 ° C. , the result of curing reaction with dodecanedioic acid in DMSO solvent conditions.

도 4를 살펴보면 기질을 카르복실산 (dodecanedioic acid)으로 한 경우에는 전자주개그룹을 도입한 경우에 보다 경화반응이 우수함을 알 수 있다.Referring to FIG. 4 , it can be seen that when the substrate is carboxylic acid (dodecanedioic acid), the curing reaction is better than when the electron donor group is introduced.

도 5는 본 발명에 따른 열경화성 수지에서, 아지리딘의 질소에 치환되는 작용기로 전자주개그룹 (EDG)을 도입한 Bn-DzEBA와, 전자끌개그룹 (EWG)을 도입한 Ts-DzEBA을 각각 80 ℃, DMSO 용매 조건에서 Ethylene diamine과 경화 반응한 결과이다.5 is a thermosetting resin according to the present invention, Bn-DzEBA introducing an electron donor group (EDG) as a functional group substituted for nitrogen of aziridine, and Ts-DzEBA introducing an electron withdrawing group (EWG) at 80 ° C. , the result of curing reaction with ethylene diamine in DMSO solvent conditions.

도 5를 살펴보면 기질을 아민 (Ethylene diamine)으로 한 경우에는 전자끌개그룹을 도입한 경우에 보다 경화반응이 우수함을 알 수 있다.Referring to FIG. 5 , it can be seen that when the substrate is ethylene diamine, the curing reaction is better than when an electron withdrawing group is introduced.

하기 [표 1]은 Bn-DzEBA, Ts-DzEBA, DGEBA 각각을 다양한 기질에 대해서 고리 개환 반응을 24시간 진행한 결과로서, 반응 진행 정도(%)를 나타낸 것이다.The following [Table 1] shows the reaction progress (%) as a result of the ring-opening reaction of each of Bn-DzEBA, Ts-DzEBA, and DGEBA for 24 hours on various substrates.

기질(substrate)substrate Bn-DzEBABn-DzEBA Ts-DzEBATs-DzEBA DGEBADGEBA Carboxylic
acid
Carboxylic
acid

Figure 112017076203358-pat00016
Figure 112017076203358-pat00016
100%100% 0%0% 97%97%
Figure 112017076203358-pat00017
Figure 112017076203358-pat00017
100%100% 100%100% 62%62%
AlcoholAlcohol
Figure 112017076203358-pat00018
Figure 112017076203358-pat00018
52%52% 100%100% 0%0%
Figure 112017076203358-pat00019
Figure 112017076203358-pat00019
17%17% 100%100% 0%0%
AmineAmine
Figure 112017076203358-pat00020
Figure 112017076203358-pat00020
0%0% 100%100% 77%77%
Figure 112017076203358-pat00021
Figure 112017076203358-pat00021
87%87% 100%100% 64%64%

상기 [표 1]를 살펴보면, 본 발명에 따른 열경화성 수지가 기존의 DGEBA에 비하여 경화 반응 진행정도가 우수하고, 다양한 작용기와의 개환 반응을 통한 경화 가능성이 확장되었음을 알 수 있으며, DzEBA의 질소 원자의 치환체를 조절하여 기질에 대한 선택성을 높일 수 있다.Looking at [Table 1], it can be seen that the thermosetting resin according to the present invention has an excellent curing reaction progress compared to the conventional DGEBA, and the curing possibility through ring-opening reaction with various functional groups is expanded, and the nitrogen atom of DzEBA is By adjusting the substituents, the selectivity for the substrate can be increased.

Claims (3)

하기 [화학식 Ⅰ]로 표시되는 열경화성 수지:
[화학식 Ⅰ]
Figure 112017076203358-pat00022

상기 [화학식 Ⅰ]에서,
R은 치환 또는 비치환된 탄소수 1 내지 20의 알킬기, 치환 또는 비치환된 탄소수 2 내지 30의 알케닐기, 치환 또는 비치환된 탄소수 3 내지 20의 시클로알킬기, 치환 또는 비치환된 탄소수 6 내지 20의 아릴기 및 하기 [구조식 1] 중에서 선택되는 어느 하나이며,
[구조식 1]
Figure 112017076203358-pat00023

상기 [구조식 1]에서,
R1 및 R2는 각각 독립적으로 수소, 중수소, 할로겐기, 니트릴기, 히드록시기, 치환 또는 비치환된 탄소수 1 내지 20의 알킬기, 치환 또는 비치환된 탄소수 2 내지 20의 알케닐기, 치환 또는 비치환된 탄소수 3 내지 20의 시클로알킬기, 치환 또는 비치환된 탄소수 6 내지 20의 아릴기 및 탄소수 3 내지 20의 헤테로아릴기 중에서 선택되는 어느 하나이다.
Thermosetting resin represented by the following [Formula I]:
[Formula Ⅰ]
Figure 112017076203358-pat00022

In the [Formula I],
R is a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, a substituted or unsubstituted C6 to C20 Any one selected from an aryl group and the following [Structural Formula 1],
[Structural Formula 1]
Figure 112017076203358-pat00023

In the [Structural Formula 1],
R 1 and R 2 are each independently hydrogen, deuterium, a halogen group, a nitrile group, a hydroxy group, a substituted or unsubstituted C 1 to C 20 alkyl group, a substituted or unsubstituted C 2 to C 20 alkenyl group, a substituted or unsubstituted any one selected from a cycloalkyl group having 3 to 20 carbon atoms, a substituted or unsubstituted aryl group having 6 to 20 carbon atoms, and a heteroaryl group having 3 to 20 carbon atoms.
제1항에 있어서,
상기 치환 또는 비치환이란 상기 R, R1 및 R2가 각각 독립적으로 중수소, 할로겐기, 니트릴기, 히드록시기, 탄소수 1 내지 20의 알킬기, 탄소수 2 내지 20의 알케닐기, 탄소수 3 내지 20의 시클로알킬기, 탄소수 6 내지 20의 아릴기 및 탄소수 3 내지 20의 헤테로아릴기 중에서 선택되며, 선택된 1 또는 2 이상의 치환기로 치환되거나, 상기 치환기 중 2 이상의 치환기가 연결된 치환기로 치환되거나, 또는 어떠한 치환기도 갖지 않는 것을 의미하는 열경화성 수지.
According to claim 1,
The substituted or unsubstituted means that R, R 1 and R 2 are each independently deuterium, a halogen group, a nitrile group, a hydroxy group, an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, a cycloalkyl group having 3 to 20 carbon atoms. , is selected from an aryl group having 6 to 20 carbon atoms and a heteroaryl group having 3 to 20 carbon atoms, and is substituted with one or more selected substituents, or is substituted with a substituent to which two or more substituents are connected among the substituents, or does not have any substituents thermosetting resin, which means that
제1항에 있어서,
상기 [화학식 Ⅰ]은 하기 [화학식 1] 또는 [화학식 2]인 것을 특징으로 하는 열경화성 수지:
[화학식 1]
Figure 112017076203358-pat00024

[화학식 2]
Figure 112017076203358-pat00025
According to claim 1,
The [Formula I] is a thermosetting resin, characterized in that the following [Formula 1] or [Formula 2]:
[Formula 1]
Figure 112017076203358-pat00024

[Formula 2]
Figure 112017076203358-pat00025
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WO2011082488A1 (en) 2010-01-06 2011-07-14 British Columbia Cancer Agency Branch Bisphenol derivative therapeutics and methods for their use
US20130336962A1 (en) 2012-04-16 2013-12-19 The University of Biritish Columbia Aziridine bisphenol ethers and related compounds and methods for their use

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US3169122A (en) * 1959-09-04 1965-02-09 Dow Chemical Co Bis-phenol aziridinecarboxylic esters
US3576786A (en) * 1968-09-27 1971-04-27 Nasa Epoxy-aziridine polymer product

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WO2011082488A1 (en) 2010-01-06 2011-07-14 British Columbia Cancer Agency Branch Bisphenol derivative therapeutics and methods for their use
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