KR102325427B1 - Filter for filtering harmonics and intermodulation components by adding multiple resonators and a three-dimensional structure thereof - Google Patents

Abstract

By additionally connecting a resonator in parallel, the present invention allows an existing low pass filter (LPF) and band pass filter (BPF) to be easily applied by improving the characteristics of the filter such as a third harmonic component generated from the existing LPF and BPF and an intermodulation component that can occur when adding a component such as a mixer and the like. In addition, by connecting a stub and capacitor structure connected in series in parallel, all of the harmonic and intermodulation components can be controlled without increasing a size of the filter.

Description

Filter for filtering harmonics and intermodulation components by adding multiple resonators and a three-dimensional structure thereof

The present invention is a product used in the field of wireless devices, and relates to a filter having a characteristic for simultaneously controlling a frequency band to be removed.

In the case of wireless communication, the effect of attenuation or noise is greater than that of wired communication, so in the case of wireless communication devices, an amplifier or mixer made using non-linear elements is essential in order to interpret the signal sent from the transmitting end at the receiving end.

However, when a system is configured using an amplifier or mixer using non-linear elements, harmonics are generated in frequency components that are multiples of the fundamental frequency because the input/output characteristics are non-linear. Such a harmonic component acts as a factor causing noise and induced interference in communication that transmits a signal with information loaded on a sine wave.

In the prior art, a resonator using a stub was used to remove such a harmonic component, but this approach is used only for removing the harmonic component of a wireless communication device that processes a signal of one bandwidth. The harmonic component is removed, and it is difficult to reduce the size of the filter because an additional filter is required to remove the intermodulation component due to multiple frequencies in addition to the harmonic in a wireless communication device that processes signals of various bandwidths.

For reference, the intermodulation component is an output frequency component that is combined with the sum and difference of harmonic frequencies of two different input frequency signals in the process of processing an RF signal through a nonlinear element, and is a distortion component that interferes with the original signal.

The present invention is to solve the above problems, and an object of the present invention is not only a harmonic component that simultaneously satisfies the characteristics of LPF and BPF, but also a filter used after an amplifier among filters used in a system with multiple frequency bands. An object of the present invention is to provide a ceramic filter having a property of simultaneously removing intermodulation components.

The above and other objects, advantages and features of the present invention, and a method for achieving them will become clear when referring to the embodiments described below in detail in conjunction with the accompanying drawings.

A filter for removing harmonic and intermodulation components by adding a multi-resonator according to an aspect of the present invention includes a first inductor (L1), fourth and fifth inductors (L1) connected to both terminals of the first inductor (L1) ( L4 and L5), an input port 10 connected to the fourth inductor, an output port 20 connected to the fifth inductor, and a second inductor L2 commonly connected to the first inductor and the fourth inductor ) and a first capacitor (C1) connecting the second inductor and the ground, and a third inductor (L3) commonly connected to the first inductor and the fifth inductor and connecting the third inductor and the ground A first resonator 30 and a third resonator 50 including a second capacitor C2 and connected in parallel between the input port and the fourth inductor and between the ground and the input port to remove a harmonic component and an intermodulation component. ); and a second resonator 40 and a fourth resonator 60 connected in parallel between the output port and the fifth inductor and between the ground.

The three-dimensional structure of the filter according to another aspect of the present invention includes first and third resonators connected in parallel to the input port pattern 10P and second and fourth resonators connected in parallel to the output port pattern 20P. wherein the first resonator includes a first short stub pattern ST1P and a third capacitor pattern C3P connected in series, and the third resonator includes a third short stub pattern ST3P and a third short stub pattern ST3P connected in series. 5 capacitor pattern C5P, wherein the second resonator includes a second short stub pattern ST2P and a fourth capacitor pattern C4P connected in series, and the fourth resonator includes a fourth short stub pattern connected in series. A three-dimensional structure of a filter configured to include a pattern ST4P and a sixth capacitor pattern C6P, simultaneously removing a harmonic component and an intermodulation component included in a signal input through the input port, and outputting it through the output port a first layer on which the input port pattern and the output port pattern are patterned; The first short stub pattern ST1P connected to the input port pattern through a via V1, the second short stub pattern ST2P connected to the output port pattern through a via V2, and the third short circuit a second layer on which the stub pattern ST3P and the fourth short stub pattern ST4P are patterned; The third capacitor pattern C3P connected to the first short stub pattern ST1P through a via V12 formed across the second to sixth layers and a via V13 formed across the second to sixth layers a sixth layer patterned with the fourth capacitor pattern C4P connected to the second short stub pattern ST2P through ); A fifth capacitor pattern C5P connected to the third short stub pattern ST3P through a via V16 formed across the second to seventh layers and a via V17 formed across the second to seventh layers a seventh layer patterned with the sixth capacitor pattern C6P connected to the fourth short stub pattern ST4P through and an eighth layer patterned with a ground plate serving as a common electrode facing the third to sixth capacitor patterns.

According to the present invention, the resonator is combined with the third harmonic component generated from the existing LPF (Low Pass Filter) and BPF (Band Pass Filter) as well as the intermodulation component that can occur when adding components such as a mixer. It can be easily applied to the existing LPF and BPF by further connecting to the filter to improve the characteristics of the filter.

In addition, by connecting a stub and a capacitor connected in series in parallel, both harmonic and intermodulation components can be controlled without increasing the filter size.

1 is a circuit diagram of a filter implemented to remove both harmonic and intermodulation components according to an embodiment of the present invention.
2 is a diagram illustrating a three-dimensional structure of a filter according to an embodiment of the present invention.
3 to 10 are views for explaining an exemplary layout of each layer in the 3D structure shown in FIG. 2 .

Since the present invention can have various changes and can have various embodiments, specific embodiments are illustrated in the drawings and described in detail. However, this is not intended to limit the present invention to specific embodiments, and it should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It should be understood that this does not preclude the existence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and should not be interpreted in an ideal or excessively formal meaning unless explicitly defined in the present application. does not

Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the drawings.

1 is a circuit diagram of a filter proposed to remove both harmonic and intermodulation components according to an embodiment of the present invention.

Referring to FIG. 1 , a filter according to an embodiment of the present invention may be, for example, a BFP filter, but is not limited thereto.

The filter according to the embodiment of the present invention may be used in a communication system having multiple frequency bands, for example, may be used in an output stage of an amplifier designed in the communication system.

These filters include an input port 10, an output port 20, first to fifth inductors L1 to L5, first and second capacitors C1 and C2, first to fourth resonators 30, 30, 50 and 60).

First, the input port 10 is connected to one terminal L4a of the fourth inductor L4, and the other terminal L4b of the fourth inductor L4 is connected to one terminal L1a of the first inductor L1. Connected.

The other terminal L1b of the first inductor L1 is connected to one terminal L5a of the fifth inductor L5 , and the other terminal L5b of the fifth inductor L5 is connected to the output port 20 . .

One terminal L2a of the second inductor L2 is commonly connected to one terminal L1a of the first inductor L1 and the other terminal L4b of the fourth inductor L4. The other terminal L2b of the second inductor L2 is connected to one terminal C1a of the first capacitor C1. And the other terminal C1b of the first capacitor C1 is connected to the ground GND.

One terminal L3a of the third inductor L3 is commonly connected to the other terminal L1b of the first inductor L1 and one terminal L5a of the fifth inductor L5. The other terminal L3b of the third inductor L3 is connected to one terminal C2a of the second capacitor C2, and the other terminal C2b of the second capacitor C2 is connected to the ground GND.

The first resonator 30 includes a first short stub ST1 and a third capacitor C3 connected in series with the first short stub ST1. One terminal ST1a of the first shorting stub ST1 is commonly connected to the input port 10 and one terminal L4a of the fourth inductor L4, and the other terminal ST1b of the first shorting stub ST1 ) is connected to one terminal C3a of the third capacitor C3, and the other terminal C3b of the third capacitor C3 is connected to the ground GND.

The third resonator 50 connected in parallel to the first resonator 30 includes a third shorted stub ST3 and a fifth capacitor C5 connected in series to the third shorted stub ST3. One terminal ST3a of the third shorting stub ST3 is commonly connected to the input port 10, one terminal ST1a of the first shorting stub ST1, and the terminal L4a of the fourth inductor L4. and the other terminal ST3b of the third short stub ST3 is connected to one terminal C5a of the fifth capacitor C5. The other terminal C5b of the fifth capacitor C5 is connected to the ground GND.

The second resonator 40 includes a second short stub ST2 and a fourth capacitor C4 connected in series to the second short stub ST2. One terminal ST2a of the second shorting stub ST2 is commonly connected to the other terminal L5b of the fifth inductor L5 and the output port 20 . The other terminal ST2b of the second short stub ST2 is connected to one terminal C4a of the fourth capacitor C4, and the other terminal C4b of the fourth capacitor C4 is connected to the ground GND. .

The fourth resonator 60 connected in parallel to the second resonator 40 includes a fourth shorted stub ST4 and a sixth capacitor C6 connected in series to the fourth shorted stub ST4. One terminal ST4a of the fourth shorting stub ST4 is commonly connected to the output port 20, one terminal ST2a of the second shorting stub ST2, and the other terminal L5b of the fifth inductor L5. and the other terminal ST4b of the fourth shorting stub ST4 is connected to one terminal C6a of the sixth capacitor C6, and the other terminal C6b of the sixth capacitor C6 is connected to the ground GND. Connected.

Each of the short stubs ST1 , ST2 , ST3 and ST4 in the first to fourth resonators 30 , 40 , 50 , and 60 may have a length of, for example, λ/4. In this case, λ is not a length corresponding to the frequency used in the filter, but a length corresponding to the maximum intermodulation frequency component that can occur in a communication system including the filter, and the maximum intermodulation frequency component is the maximum frequency that can occur in the communication system am.

For example, in the case of a communication system in which a filter passband is 1.2 GHz and a bandwidth having a frequency of 15 GHz is simultaneously processed, λ corresponds to 15 GHz. If, in the case of a communication system using a different bandwidth, a resonator length corresponding to the frequency to be removed is applied.

As such, by designing resonators using short stubs 11, 13, 22 and 24 having a length λ corresponding to intermodulation, it can function as a filter capable of simultaneously removing not only harmonic frequency components but also intermodulation frequency components. there will be

2 is a diagram illustrating a three-dimensional structure of a filter according to an embodiment of the present invention, and FIGS. 3 to 10 are views for explaining an exemplary layout of each layer in the three-dimensional structure illustrated in FIG. 2 .

The three-dimensional structure of the filter implemented according to an embodiment of the present invention may consist of a total of eight layers, and in order to help the understanding of the description, reference will be made to FIG. 1 together.

First, referring to FIG. 3 , in the first layer (Top layer) in the three-dimensional structure of the filter, an input port pattern 10P corresponding to an input port (10 in FIG. 1 ) and an output port (20 in FIG. 1 ) The output port pattern 20P corresponding to ? is patterned (designed or designed).

Referring to FIG. 4 , in the second layer, a first shorted stub pattern ST1P forming a first shorted stub (ST1 in FIG. 1 ), and a third shorted stub pattern corresponding to the third shorted stub (ST3 in FIG. 1 ) (ST3P), a 4-1 inductor pattern (L4P_1) forming a part of the fourth inductor (L4 in FIG. 1), a second shorting stub pattern (ST2P) forming a second shorting stub (ST2 in FIG. 1), The fourth shorting stub pattern ST4P forming the fourth shorting stub (ST4 in FIG. 1 ), the 5-1 inductor pattern L5P_1 and the 5-2 inductor pattern forming a part of the fifth inductor L5 ( ST4 in FIG. 1 ) L5P_2) is patterned (designed or designed). The first short stub pattern ST1P has a straight line shape, and one end thereof is electrically connected to the input port pattern (10P in FIG. 3 ) patterned on the upper portion (the first layer) through the via V1 . The third short stub pattern ST3P has a straight line shape and extends from the other end of the first short stub pattern ST1P. That is, the first short stub pattern and the third short stub pattern may be integrally formed. The 4-1 th inductor pattern L4P_1 extends from one end of the first short stub pattern ST1P and is patterned in a rectangular line shape. The second short stub pattern SP2P has the same straight line shape as the first short stub pattern ST1P, and one end of the output port pattern (FIG. 3) and electrically connected to 20P). The fourth short stub pattern ST4P has the same straight line shape as the third short stub pattern ST3P of FIG. 1 , and extends from the other end of the second short stub pattern ST2P. That is, the second short stub pattern ST2P and the fourth short stub pattern ST4P may be integrally formed. The 5-1 th inductor pattern L5P_1 extends from one end of the second short stub pattern SP2P and is patterned in a rectangular line shape symmetrical with the 4-1 th inductor pattern L4P_1 . The 5-2 inductor pattern L5P_2 that forms a part of the fifth inductor L5 together with the 5-1 inductor pattern L5P_1 includes the 5-1 inductor pattern L5P_1 and the second and fourth short stub patterns. It is physically separated from the ST2P and ST4P, and the second layer is patterned in the form of a square line above the 5-1 inductor pattern L5P_1 on the layout.

Referring to FIG. 5 , in the third layer, a 4-2 inductor pattern L4P_2 and a fourth inductor pattern L4P_2 forming a fourth inductor (L4 in FIG. 1 ) together with the 4-1 inductor pattern L4P_1 patterned in the second layer The 5-2 inductor pattern L5P_2 forming the fifth inductor (L5 in FIG. 1) together with the 5-1 inductor pattern L5P_1 patterned on the second layer and the first inductor L1 shown in FIG. 1 The 1-1 inductor pattern L1P_1 forming a part is patterned. The 4-2 inductor pattern L4P_2 is patterned in a zigzag-shaped line with a structure bent at 90 degrees at five sites, and one end of the 4-1 inductor pattern (L4P_2) is patterned on the second layer through the via V3. It is electrically connected to the end of L4P_1). The inductor pattern L5P_2 is designed to be physically separated from the 4-2 inductor pattern L4P_2 and the 1-1 inductor pattern L1P_1. , and one end thereof is electrically connected to one end of the 5-1 th inductor pattern L5P_1 patterned on the second layer through the via V5. The 1-1 inductor pattern L1P_1 is disposed above the 5-2 inductor pattern L5P_2 on the layout of the third layer, and is generally patterned to have an 'L' shape. The 1-1 inductor pattern L1P_1 is electrically connected to one end of the 5-2 th inductor pattern L5P-2 patterned on the second layer through the via V6.

Referring to FIG. 6 , in the fourth layer, the 1-2 inductor pattern L1P_2 forming a part of the first inductor L1 shown in FIG. 1 together with the 1-1 inductor pattern L1P_1 and the A 2-1 inductor pattern L2P_1 forming a part of the illustrated second inductor L2 is patterned. The 1-2 inductor pattern L1P_2 is patterned to have a structure in which one portion is bent at 90 degrees as shown in '┍'. The 2-1 inductor pattern L2P_1 is patterned to extend in a straight line from one end of the 1-2 inductor pattern L1P_2. The 1-2 th inductor pattern L1P_2 and the 2-1 th inductor pattern L2P_1 are electrically connected to one end of the 4-2 th inductor pattern L4P_2 patterned on the third layer through the via V7 .

Referring to FIG. 7 , in the fifth layer, the 2-2 inductor pattern L2P_2 forming a part of the second inductor L2 shown in FIG. 1 together with the 2-1 inductor pattern L2P_1 and the A 3-1 inductor pattern L3P_1 forming a part of the illustrated third inductor L3 is patterned. The 2-2nd inductor pattern L2P_2 is patterned in a rectangular line shape, and is electrically connected to one end of the 2-1th inductor pattern L2P_1 patterned on the fourth layer through the via V8. The 3-1 th inductor pattern L3P_1 is patterned to have substantially the same shape as the 2-2 th inductor pattern L2P_2 , and one side of the 5-2 th inductor pattern LSP_2 patterned on the third layer through the via V9 electrically connected to the end.

Referring to FIG. 8 , in the sixth layer, a portion of the second inductor L2 is formed along with the 2-1 inductor pattern L2P_1 and the 2-2 inductor pattern L2P_2 formed in the fourth and fifth layers, respectively. A 3-2 inductor pattern L3P_2 forming the third inductor L3 is patterned together with the 2-3 inductor pattern L2P_3 and the 3-1 inductor pattern L3P_2 patterned on the fifth layer. . The 2-3rd inductor pattern L2P_3 and the 3-2nd inductor pattern L3P_2 are physically separated on the same layout and patterned in the same 'U' shape. The 2-3rd inductor pattern L2P_3 is electrically connected to one end of the 2-2nd inductor pattern patterned on the fifth layer through the via V10, and the 3-2nd inductor pattern L3P_2 is the via V11. is electrically connected to the 3-1 th inductor pattern L3P_1 patterned on the fifth layer through

In addition, in the sixth layer, the third capacitor pattern C3P forming the upper electrode of the third capacitor C3 shown in FIG. 1 and the fourth capacitor C3P forming the upper electrode of the fourth capacitor C4 shown in FIG. 1 are formed on the sixth layer. The capacitor pattern C4P is further patterned. The ground plate formed on the eighth layer shown in FIG. 10 serves as a lower electrode opposite to the third capacitor pattern C3P serving as an upper electrode to form a third capacitor C3. Similarly, the ground plate formed in the eighth layer serves as a lower electrode opposite to the fourth capacitor pattern C4P serving as an upper electrode to form a fourth capacitor C4. The third capacitor pattern C3P and the fourth capacitor pattern C4P are disposed on both sides of the 2-3 inductor pattern L2P_3 and the 3-2 inductor pattern L3P_2 therebetween. The third capacitor pattern C3P is a first short stub pattern ST1P patterned on the second layer through the via V12 formed across the sixth layer, the fifth layer, the fourth layer, the third layer, and the second layer. is electrically connected to In this case, the via V12 may be viewed as a single via or including a plurality of vias divided by the sixth layer, the fifth layer, the fourth layer, the third layer, and the second layer. Similarly, the fourth capacitor pattern C4P has a second short stub patterned in the second layer through the via V13 formed across the sixth layer, the fifth layer, the fourth layer, the third layer, and the second layer. ST2P) and electrically connected. Similarly, in this case, the via V13 may be considered as one via or a plurality of vias divided by the sixth layer, the fifth layer, the fourth layer, the third layer, and the second layer.

Referring to FIG. 9 , the seventh layer has a first capacitor pattern C1P serving as an upper electrode of the first capacitor (C1 in FIG. 1 ), and an upper electrode of the second capacitor (C2 in FIG. 1 ). The second capacitor pattern C2P, the fifth capacitor pattern C5P serving as the upper electrode of the fifth capacitor (C5 in FIG. 1), and the sixth capacitor serving as the upper electrode of the sixth capacitor (C6 in FIG. 1) The capacitor pattern C6P is patterned.

The ground plate patterned on the eighth layer shown in FIG. 10 serves as a common lower electrode of the first, second, fifth and sixth capacitor patterns C1P, C2P, C5P and C6P, The second, fifth and sixth capacitors C1, C2, C5, and C6 are respectively formed.

Meanwhile, the first capacitor pattern C1P is electrically connected to the 2-3th inductor pattern L2P_3 patterned on the sixth layer through the via V14, and the second capacitor pattern C2P connects the via V15. is electrically connected to the 3-2 inductor pattern L3P_2 patterned on the sixth layer through the

In addition, the fifth capacitor pattern C5P has a third short circuit patterned in the second layer through the via V16 formed across the seventh layer, the sixth layer, the fifth layer, the fourth layer, the third layer, and the second layer. Electrically connected to the stub pattern ST3P, and similarly, the sixth capacitor pattern C6P is a via ( V17) and is electrically connected to the fourth short stub pattern ST4P patterned on the second layer.

As described above, although the embodiments have been described with reference to the limited embodiments and drawings, various modifications and variations are possible by those skilled in the art from the above description. For example, the described techniques are performed in a different order than the described method, and/or the described components of the system, structure, apparatus, circuit, etc. are combined or combined in a different form than the described method, or other components Or substituted or substituted by equivalents may achieve an appropriate result.

Claims (8)

a first inductor L1, fourth and fifth inductors L4 and L5 connected to both terminals of the first inductor L1, an input port 10 connected to the fourth inductor, and the fifth inductor; an output port 20 connected to, a second inductor L2 commonly connected to the first inductor and the fourth inductor, a first capacitor C1 connected between the second inductor and ground, and the first inductor and a third inductor (L3) commonly connected to the fifth inductor and a second capacitor (C2) connected between the third inductor and ground,
To remove harmonic components and intermodulation components,
a first resonator 30 and a third resonator 50 connected in parallel between the input port and the fourth inductor and between the ground; and
A second resonator (40) and a fourth resonator (60) connected in parallel between the output port and the fifth inductor and between the ground
Filter for removing harmonic and intermodulation components by adding a multi-resonator further comprising a. In claim 1,
The first resonator includes a first shorting stub and a third capacitor connected in series,
The third resonator includes a third shorting stub and a fifth capacitor connected in series,
The second resonator includes a second short stub and a fourth capacitor connected in series,
The fourth resonator is a filter for removing harmonic and intermodulation components by adding a multi-resonator including a fourth short stub and a sixth capacitor connected in series. In claim 2,
Each of the first to fourth short stubs is designed with a length of λ/4,
The λ is,
Filter for removing harmonics and intermodulation components by adding a multi-resonator whose length corresponds to the maximum intermodulation frequency component that can occur in a communication system including the filter, not the length corresponding to the frequency used in the filter . In claim 3,
The maximum intermodulation frequency component is a filter for removing harmonics and intermodulation components by adding a multi-resonator that is a maximum frequency that can be generated in the communication system. A filter including first and third resonators connected in parallel to the input port pattern 10P and second and fourth resonators connected in parallel to the output port pattern 20P, wherein the first resonator is a first resonator connected in series a short stub pattern ST1P and a third capacitor pattern C3P, wherein the third resonator includes a third short stub pattern ST3P and a fifth capacitor pattern C5P connected in series, the second resonator includes a second short stub pattern ST2P and a fourth capacitor pattern C4P connected in series, and the fourth resonator includes a fourth short stub pattern ST4P and a sixth capacitor pattern C6P connected in series In a three-dimensional structure of a filter that simultaneously removes a harmonic component and an intermodulation component included in a signal input through the input port and outputs it through the output port,
a first layer on which the input port pattern and the output port pattern are patterned;
The first short stub pattern ST1P connected to the input port pattern through a via V1, the second short stub pattern ST2P connected to the output port pattern through a via V2, and the third short circuit a second layer on which the stub pattern ST3P and the fourth short stub pattern ST4P are patterned;
The third capacitor pattern C3P connected to the first short stub pattern ST1P through the via V12 formed across the second to sixth layers and the via V13 formed across the second to sixth layers a sixth layer patterned with the fourth capacitor pattern C4P connected to the second short stub pattern ST2P through );
A fifth capacitor pattern C5P connected to the third short stub pattern ST3P through a via V16 formed across the second to seventh layers and a via V17 formed across the second to seventh layers a seventh layer patterned with the sixth capacitor pattern C6P connected to the fourth short stub pattern ST4P through and
An eighth layer patterned with a ground plate serving as a common electrode facing the third to sixth capacitor patterns
A three-dimensional structure of a filter containing In claim 5,
The third short stub pattern ST3P extends from one end of the first short stub pattern ST1P. In claim 5,
The fourth short stub pattern ST4P extends from one end of the second short stub pattern ST2P. In claim 5,
The first to fourth short stub patterns are a three-dimensional structure of a filter that is formed in the form of a straight line.

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