KR102316791B1 - Display device and method for fabricating the same - Google Patents

Abstract

The present invention relates to a display device capable of preventing damage to a carrier tape and a method for manufacturing the same, comprising: a display panel having a curved shape; first and second printed circuit boards; at least one first carrier tape connecting the first printed circuit board and the display panel; at least one second carrier tape connecting the second printed circuit board and the display panel; and a connection unit connecting the first printed circuit board and the second printed circuit board; The connection part is a part of a layer included in at least one of the first printed circuit board and the second printed circuit board.

Description

Display device and manufacturing method thereof

The present invention relates to a display device, and more particularly, to a display device capable of preventing damage to a carrier tape and a method of manufacturing the same.

A liquid crystal display device is one of the most widely used flat panel display devices at present, and includes two substrates on which field generating electrodes such as a pixel electrode and a common electrode are formed and a liquid crystal layer interposed therebetween. The liquid crystal display adjusts the amount of transmitted light by rearranging liquid crystal molecules in the liquid crystal layer by applying a voltage to the electric field generating electrode.

The liquid crystal display device is being used as a display device of a television receiver, and the area is increasing. As the size of the liquid crystal display increases as described above, the visual difference increases when the viewer sees the central part and the left and right ends of the screen.

In order to compensate for such a visual difference, a curved display device in which both sides of the display area are curved from the center of the display area as a starting point has been recently developed.

The curved display device includes a curved display panel and a bottom case. Here, a plurality of tape carriers are positioned between the display panel and the printed circuit board to electrically connect them.

When the display device is completed, the printed circuit board is positioned on the rear surface of the bottom cover by rotating the tape carriers about the axis.

Before the printed circuit board moves to the rear surface of the bottom case, the curvature of the printed circuit board maintains substantially the same curvature as the curvature of the display panel. However, when the printed circuit board moves to the rear surface of the bottom case, the curvature of the printed circuit board increases. At this time, the printed circuit board receives a tensile force from both sides thereof due to the increased curvature. The printed circuit board is continuously stressed by this tensile force. And this stress affects the tape carriers connected thereto. That is, by the stress, the tape carriers made of a relatively weak and soft material may be torn. Then, the wiring patterns and the driving integrated circuit formed on the tape carrier are damaged, and thus cannot function properly.

The present invention has been devised to solve the above problems, and an object of the present invention is to provide a display device capable of preventing damage to a tape carrier and a method of manufacturing the same.

According to an aspect of the present invention, there is provided a display device comprising: a display panel having a curved shape; first and second printed circuit boards; at least one first carrier tape connecting the first printed circuit board and the display panel; at least one second carrier tape connecting the second printed circuit board and the display panel; and a connection unit connecting the first printed circuit board and the second printed circuit board; The connection part is a part of a layer included in at least one of the first printed circuit board and the second printed circuit board.

The length of the connection part is longer than the length between the first printed circuit board and the second printed circuit board.

At least a portion of the first printed circuit board protrudes toward the second printed circuit board.

At least a portion of the second printed circuit board protrudes toward the first printed circuit board.

At least one of the first printed circuit board and the second printed circuit board may include a polyimide layer; a first upper conductive layer positioned on the polyimide layer; an upper coverlay layer positioned on the first upper conductive layer; an upper prepreg layer positioned on the upper coverlay layer; a second upper conductive layer positioned over the upper prepreg layer; a first resist layer positioned over the second upper conductive layer; a first lower conductive layer positioned under the polyimide layer; a lower coverlay layer located under the first lower conductive layer; a lower prepreg layer located below the lower coverlay layer; a second lower conductive layer located under the lower coverlay layer; and a second resist layer positioned under the second lower conductive layer.

The connection part includes the polyimide layer, the first upper conductive layer, the upper coverlay layer, and the upper prepreg layer.

bottom case; a light source emitting light; a light guide plate transmitting light from the light source unit to the display panel; and a mold frame for supporting the display panel while being fixed to the bottom case.

The first and second printed circuit boards are positioned on the rear side of the bottom case.

According to an aspect of the present invention, there is provided a method of manufacturing a display device, comprising: a display panel having a curved shape; first and second printed circuit boards; at least one first carrier tape connecting the first printed circuit board and the display panel; at least one second carrier tape connecting the second printed circuit board and the display panel; and a connection unit connecting the first printed circuit board and the second printed circuit board; the connection part is a part of a layer included in at least one of the first printed circuit board and the second printed circuit board; In the method of manufacturing a curved display device in which at least a portion of the first printed circuit board and at least a portion of the second printed circuit board are connected, preparing a bottom case having a curved shape: the bottom case and the display panel assembling; separating the first printed circuit board and the second printed circuit board; and rotating the first printed circuit board and the second printed circuit board to the rear side of the bottom case.

The method further includes disposing a reflective plate, a light guide plate, an optical sheet, a mold frame, and a light source unit on the bottom case.

Separating the first printed circuit board and the second printed circuit board, preparing a laser cutting equipment; and cutting a connection portion between the first printed circuit board and the second printed circuit board using the laser cutting equipment.

A cut line is displayed on the connection portion between the first printed circuit board and the second printed circuit board.

Separating the first printed circuit board and the second printed circuit board, preparing a laser cutting equipment; and cutting a connection portion between the first printed circuit board and the second printed circuit board along the cutting line using the laser cutting equipment.

A length of the flexible printed circuit board is longer than a length between the first printed circuit board and the second printed circuit board.

According to the display device according to the present invention, since the first printed circuit board and the second printed circuit board can move in both directions, it is possible to prevent stress from accumulating on the first printed circuit board and the second printed circuit board. Therefore, deformation and damage of the first carrier tape and the second carrier tape can be prevented.

1 is an exploded perspective view of a display device according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along line II′ of FIG. 1 .
FIG. 3 is a detailed configuration diagram of the display panel of FIG. 1 .
FIG. 4 is a diagram illustrating an arrangement of pixels positioned in the display area of FIG. 3 .
5 is a view showing a cross-section taken along the line II′ of FIG. 3 .
6A and 6B are views illustrating a process of separating the first printed circuit board and the second printed circuit board.
7 is a view showing the rear surface of the bottom case.

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, and only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the technical field to which the present invention belongs It is provided to fully inform the possessor of the scope of the invention, and the present invention is only defined by the scope of the claims. Accordingly, in some embodiments, well-known process steps, well-known device structures, and well-known techniques have not been specifically described in order to avoid obscuring the present invention. Like reference numerals refer to like elements throughout.

In order to clearly express various layers and regions in the drawings, the thicknesses are enlarged. Throughout the specification, like reference numerals are assigned to similar parts. When a part of a layer, film, region, plate, etc. is said to be “on” another part, it includes not only cases where it is “directly on” another part, but also cases where there is another part in between. Conversely, when we say that a part is "just above" another part, we mean that there is no other part in the middle. Also, when a part of a layer, film, region, plate, etc. is said to be “under” another part, it includes not only the case where the other part is “directly under” but also the case where there is another part in between. Conversely, when we say that a part is "just below" another part, it means that there is no other part in the middle.

Spatially relative terms "below", "beneath", "lower", "above", "upper", etc. It can be used to easily describe a correlation between an element or components and other elements or components. Spatially relative terms should be understood as terms including different orientations of the device during use or operation in addition to the orientation shown in the drawings. For example, when an element shown in the figures is turned over, an element described as "beneath" or "beneath" another element may be placed "above" the other element. Accordingly, the exemplary term “below” may include both directions below and above. The device may also be oriented in other orientations, and thus spatially relative terms may be interpreted according to orientation.

In the present specification, when a part is said to be connected to another part, it includes not only a case in which it is directly connected, but also a case in which it is electrically connected with another element interposed therebetween. In addition, when it is said that a part includes a certain component, this means that other components may be further included, rather than excluding other components, unless otherwise stated.

In this specification, terms such as first, second, third, etc. may be used to describe various components, but these components are not limited by the terms. The above terms are used for the purpose of distinguishing one component from other components. For example, without departing from the scope of the present invention, the first component may be referred to as a second or third component, and similarly, the second or third component may also be alternately named.

Unless otherwise defined, all terms (including technical and scientific terms) used herein may be used with the meaning commonly understood by those of ordinary skill in the art to which the present invention belongs. In addition, terms defined in a commonly used dictionary are not to be interpreted ideally or excessively unless clearly specifically defined.

Hereinafter, a backlight unit according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 3 . On the other hand, component names used in the following description are selected in consideration of the ease of writing the specification, and may be different from the actual product names.

1 is an exploded perspective view of a display device according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line II′ of FIG. 1 .

A display device according to an exemplary embodiment of the present invention is a curved display device in which both sides of the display area are rounded with respect to the central portion of the display area. Hereinafter, unless otherwise specified, all components are made of a material having a property of being bent.

As shown in FIGS. 1 and 2 , the curved display device of the present invention includes a bottom case BC, a reflector 900 , a light guide plate LGP, an optical sheet 201 , a light source unit 801 , and a light source cover. LC, a mold frame MF, a display panel DP, and a top cover TC. The components listed above form a curved shape in accordance with the curved shape. Here, the reflector 900 , the light guide plate LGP, the optical sheet 201 , the light source unit 801 , the light source cover LC, and the mold frame MF are included in the backlight unit. Meanwhile, the display panel DP and the backlight unit are assembled in a stacked state to constitute a display module. The display module includes a top case (TC) and a bottom case (BC) for protecting and fixing the display panel (DP) and the backlight unit, and a driving circuit board (not shown) for driving the display panel (DP). may include more.

The bottom case BC includes a storage space therein. A reflection plate 900 , a light guide plate LGP, an optical sheet 201 , a light source unit 801 , and a light source cover LC are disposed in this accommodation space. In order to secure the storage space, the bottom case BC may include a bottom portion 111a and a plurality of side portions 111b. For example, the bottom portion 111a may have a rectangular shape, and each of the aforementioned side portions 111b protrude from each edge of the bottom portion 111a to have a predetermined height. Edges of the adjacent side portions 111b are connected to each other. A space defined by being surrounded by the side portions 111b and the bottom portion 111a becomes the storage space described above. On the other hand, a locking jaw 635 is formed on the outside of the side portions 111b facing each other, and the mold frame MF is fixed to the bottom case BC by the locking jaw 635 . The locking protrusion 635 may be formed by bending a portion of the corresponding side portion 111b to have a shape protruding toward the mold frame MF.

The light source unit 801 is a component for generating light, and may include a printed circuit board 801a and at least one light source 801b as shown in FIG. 2 . Here, the printed circuit board 801a forms a roundly curved shape.

Although not shown, one surface of the printed circuit board 801a is divided into at least one mounting area and a wiring area. When there are two or more light sources, one light source is installed in each mounting area, and a plurality of wires for transmitting driving power to the light sources to the light sources are installed in the wiring area. The above-described driving power is generated from an external power supply unit (not shown) and then supplied to the plurality of wires through a separate connector (not shown).

The light source 801b is a means for emitting light to the outside, and is installed on the printed circuit board 801a. The light source 801b may be a light emitting package including at least one light emitting diode. For example, one light emitting package may include a red light emitting diode emitting red light, a green light emitting diode emitting green light, and a blue light emitting diode emitting blue light therein. The light emitting package generates white light by combining three kinds of colors. As another example, the light emitting package may include only a blue light emitting diode among the above-described three color light emitting diodes therein. In this case, a phosphor for converting blue light into white light emits light of the blue light emitting diode. formed in wealth Light emitted from the light source 801b is incident on the light guide plate LGP.

As shown in FIGS. 1 and 2 , the light guide plate LGP may have a roundly curved polyhedral shape. Among the plurality of surfaces included in the light guide plate LGP, one surface facing the light source is set as the light incident surface 122 . The light incident surface 122 has a roundly curved shape. If the long side of the display panel DP is curved, the display panel DP may be set in a direction in which the long side of the display panel DP corresponds to the light incident surface 122 . The light emitted from the light source 801b is incident on the light incident surface 122 and then proceeds to the inside of the light guide plate LGP. The light guide plate LGP totally reflects the light entered therein and guides it toward the display area of the display panel DP. Meanwhile, although not shown, a plurality of scattering patterns may be further installed on the lower outer surface of the light guide plate LGP in order to improve the reflectivity of the light guide plate LGP. In this case, the scattering patterns may be arranged in such a way that the distance from the light incident surface 122 of the light guide plate LGP gradually increases.

The light guide plate LGP may be made of a material having a light-transmitting property to efficiently guide light, for example, an acrylic resin such as PMMA (PolyMethylMethAcrylate), or a material such as polycarbonate (PC).

The reflective plate 900 is provided under the light guide plate LGP. The reflector 900 minimizes the light loss rate by reflecting the light flowing out through the lower outer surface of the light guide plate LGP again and returning it to the light guide plate LGP.

The optical sheet 201 diffuses and condenses the light transmitted from the light guide plate LGP, and as shown in FIGS. 1 and 2 , it is positioned between the light guide plate LGP and the display panel DP. The optical sheet 201 may include a diffusion sheet 201a, a light collection sheet 201b, and a protection sheet 201c. The diffusion sheet 201a, the light collecting sheet 201b, and the protective sheet 201c are sequentially laminated on the light guide plate LGP in the listed order.

The diffusion sheet 201a disperses the light transmitted from the light guide plate LGP to prevent the light from being partially concentrated.

The light collecting sheet 201b is positioned on the diffusion sheet 201a to collect light diffused from the diffusion sheet 201a in a direction perpendicular to the display panel DP. To this end, triangular prisms may be arranged on one surface of the light collecting sheet 201b in a predetermined arrangement.

The protective sheet 201c is positioned on the light collecting sheet 201b to protect the surface of the light collecting sheet 201b, and to diffuse the light to make the light distribution uniform. The light passing through the protective sheet 201c is provided to the display panel DP.

As shown in FIG. 2 , the light source cover LC surrounds one side of the light guide plate LGP so that the light source unit 801 and the light incident surface 122 are included in the receiving space therein. The light source cover LC aligns the light incident surface 122 with the light sources 801b so that light from the light sources 801b can be accurately irradiated to the light incident surface 122 of the light guide plate LGP. For this reason, the light source cover LC also has a rounded shape. On the other hand, when the light guide plate (LGP) is made of a flexible material that cannot maintain a specific shape, for example, a bent state by itself, the light source cover (LC) is such that the light guide plate (LGP) can maintain a bent state. provides coercion.

The light source cover LC may be made of a metal material, for example, a stainless steel material.

The light source cover LC may include a light source installation part 777a, an upper cover 777b, and a lower cover 777c.

The upper cover 777b extends from one edge of the light source installation part 777a toward the upper outer surface of the light guide plate LGP.

The lower cover 777c extends from the other edge of the light source installation part 777a toward the lower outer surface of the light guide plate LGP. The lower cover 777c may take various shapes depending on the shape of the bottom part 111a of the bottom case BC. For example, as shown in FIG. 2 , the lower cover 777c has a first horizontal portion 780a extending to a predetermined length from the other side of the light source installation unit 777a, and the first horizontal portion 780a. It may include a second horizontal portion 780b positioned closer to the lower surface of the light guide plate LGP, and an inclined portion 780c connecting the first and second horizontal portions 780a and 780b to each other.

The light source 801b and the printed circuit board 801a are disposed in the receiving space surrounded by the light source installation unit 777a, the upper cover 777b, and the lower cover 777c. At this time, an adhesive member 801c is provided on one of the opposite surfaces between the other surface of the printed circuit board 801a and the light source installation unit 777a. The light source unit 801 may be attached to the light source installation unit 777a by the adhesive member 801c. The adhesive member 801c may be a double-sided tape. At this time, the light source unit 801 may be configured in a state in which one side of the adhesive side of the double-sided tape is attached to the printed circuit board 801a.

The mold frame MF supports the display panel DP and the top case TC while being fixed to the bottom case BC, and maintains a constant distance between the display panel DP and the optical sheet 201 . keep it To this end, the mold frame MF may have a rectangular frame shape including a first support part 311a, a second support part 311b, and a fixing part 311c.

The first support part 311a supports the top case TC covered thereon in a state in which it rests on the plurality of side parts 111b.

The second support portion 311b extends from the inner edge of the first support portion 311a toward the optical sheet 201 . The height of the second support part 311b is lower than that of the first support part 311a. A space is formed between the top case TC and the second support part 311b by the height difference between the second support part 311b and the first support part 311a, and the edge of the display panel DP is formed in the space. Located. Here, a buffer pad 500 protruding from the end toward the display panel DP may be further formed at the end of the second support 311b, and the edge of the display panel DP is positioned on the buffer pad 500 . placed on The buffer pad 500 prevents the display panel DP from being in direct contact with the second support part 311b, thereby preventing the display panel DP from being scratched.

The fixing part 311c extends from the lower surface of the first supporting part 311a toward the side part 111b. A coupling groove is formed on the inner surface of the fixing portion 311c, that is, on the surface facing the engaging projection 635 among the surfaces of the fixing portion 311c. The mold frame MF may be fixed to the bottom case BC by fitting the locking protrusion 635 into the coupling groove.

The top case TC has a rectangular frame shape with an open center. The top case TC is positioned on the display panel. The display area A2 of the display panel DP is exposed through the open portion of the top case TC. The top case TC surrounds the edge of the display panel DP, the top and side surfaces of the first support part 311a of the mold frame MF, and the side surface of the fixing part 311c. To this end, the top case TC includes a front cover 933a covering an edge of the display panel DP and an upper surface of the first support part 311a, and side and fixing parts of the first support part 311a. and a side cover 933b covering the sides of 311c together. Meanwhile, a hook 425 may be formed inside the side cover 933b, and the hook 425 is in contact with the lower surface of the fixing part 311c formed in the mold frame MF. The top case TC may be fixed to the mold frame MF by the hook 425 . In addition, an opening is formed in a portion of any one of the side covers 933b. The first and second printed circuit boards 401 and 402 may be exposed to the outside of the top case TC through this opening.

The display panel DP receives an image data signal from a system (not shown) and light from a backlight unit to display an image. The display panel DP may have a rectangular shape as shown in FIG. 1 . In this case, while two relatively long sides (hereinafter, long sides) form a curved shape, two relatively short sides (hereinafter, short sides) extend straight in a straight line. On the other hand, on the contrary, the long side may have a straight shape and the short side may have a curved shape.

The display panel of FIG. 1 will be described in detail with reference to FIGS. 3 and 4 .

FIG. 3 is a detailed configuration diagram of the display panel DP of FIG. 1 , and FIG. 4 is a diagram illustrating an arrangement of pixels located in the display area of FIG. 3 .

3 , the display panel DP includes a lower substrate 361a and an upper substrate 361b facing each other with a liquid crystal layer interposed therebetween.

As shown in FIG. 3 , the lower substrate 361a is divided into a display area A1 and a non-display area A2 . In the display area A1 , as shown in FIG. 4 , a plurality of gate lines, a plurality of data lines intersecting the gate lines, and a plurality of pixels connected to the gate lines and the data lines are arranged

The upper substrate 361b is positioned on the lower substrate 361a. The upper substrate 361b has a size sufficient to cover at least the entire surface of the display area A1 of the lower substrate 361a.

The upper substrate and the lower substrate each have a plurality of faces. For convenience of description, a plurality of surfaces included in each of the substrates 361a and 361b are defined by the following terms. That is, each of the surfaces facing each other with the liquid crystal layer interposed therebetween is defined as the front surface of the substrate, and the surface opposite to the top surface is defined as the rear surface of the substrate.

Although not shown, a black matrix, a plurality of color filters, and a common electrode are positioned on the front surface of the upper substrate 361b.

The black matrix is positioned on the remaining portion of the front surface except for portions corresponding to the pixel areas.

The color filters are located in the pixel area. The color filters are classified into a red color filter, a green color filter, and a blue color filter.

Pixels are arranged in a matrix form in the display area A1 . The pixels R, G, and B include red pixels R positioned to correspond to the red color filter, a green pixel G positioned to correspond to the green color filter, and a blue pixel B positioned to correspond to the blue color filter. are separated In this case, the red pixel R, the green pixel G, and the blue pixel B adjacent in the horizontal direction may be unit pixels for displaying one unit image.

The j pixels (hereinafter, n-th horizontal line pixels) arranged along the n-th horizontal line (n is any one of 1 to i) are individually provided to each of the first to j-th data lines DL1 to DLj. connected In addition, these nth horizontal line pixels are commonly connected to the nth gate line. Accordingly, the nth horizontal line pixels receive the nth gate signal in common. That is, all j pixels arranged on the same horizontal line receive the same gate signal, but pixels located on different horizontal lines receive different gate signals. For example, both the red pixel R and the green pixel G located on the first horizontal line HL1 receive the first gate signal, while the red pixel R and the green pixel G located on the second horizontal line HL2 and The green pixel G is supplied with a second gate signal having a timing different from these.

Each pixel includes a thin film transistor TFT, a liquid crystal capacitor C _LC , and an auxiliary capacitor Cst, as shown in FIG. 4 .

The thin film transistor TFT is turned on according to a gate signal from a gate line. The turned-on thin film transistor TFT supplies the analog image data signal provided from the data line to the liquid crystal capacitor C _LC and the auxiliary capacitor Cst.

The liquid crystal capacitor C _LC includes a pixel electrode and a common electrode positioned to face each other.

The storage capacitor Cst includes a pixel electrode and a counter electrode positioned to face each other. Here, the opposite electrode may be a previous gate line or a common line for transmitting a common voltage.

The gate driver 534 is located in the non-display area A2 . For example, as shown in FIG. 3 , the gate driver 534 may be located in a portion of the non-display area A2 adjacent to the left edge of the display area A1 .

The gate driver 534 generates gate signals according to a gate control signal provided from the timing controller, and sequentially supplies the gate signals to a plurality of gate lines. The gate driver 534 may include, for example, a shift register configured to generate gate signals by shifting a gate start pulse according to a gate shift clock. The shift register may include a plurality of switching elements. These switching elements may be formed on the front surface of the lower substrate 361a in the same process as the thin film transistor of the display area A1 .

The data driving integrated circuits (D-ICs) receive digital image data signals and data control signals from a timing controller. After sampling the digital image data signals according to the data control signal, the data driving integrated circuits (D-ICs) latch the sampled image data signals corresponding to one horizontal line every horizontal period and transfer the latched image data signals to the data lines. (DL1 to DLj) are supplied. That is, the data driving integrated circuits (D-ICs) convert the digital image data signals from the timing controller into analog image signals using a gamma voltage input from a power supply unit (not shown) to the data lines DL1 to DLj. ) is supplied.

The data driving integrated circuits (D-ICs) are mounted one by one on carrier tapes 601 to 603 and 701 to 703 as shown in FIG. 3 .

The carrier tape may be manufactured in the form of a film.

A carrier tape on which a data driving integrated circuit (D-IC) is mounted is also called a tape carrier package.

The carrier tapes 601 to 603 and 701 to 703 may be divided into first carrier tapes 601 to 603 and second carrier tapes 701 to 703 .

The first carrier tapes 601 to 603 electrically connect the first printed circuit board 401 and the display panel DP. To this end, for example, input terminals of the first carrier tapes 601 to 603 are connected to first signal wiring patterns (not shown) formed on the first printed circuit board 401 , and the first carrier tape Output terminals of the elements 601 to 603 are connected to a first pad portion (not shown) formed in the non-display area A2 of the display panel DP.

The first pad part is connected to some of the data lines through first link lines.

One side of the first carrier tape on which the input terminals are located and the first printed circuit board 401 may be bonded by an anisotropic conductive bonding film. In addition, the other side of the first carrier tape on which the output terminals are positioned and the display panel DP may be adhered to each other by an anisotropic conductive film.

The second carrier tapes 701 to 703 electrically connect the second printed circuit board 402 and the display panel DP. To this end, for example, input terminals of the second carrier tapes 701 to 703 are connected to second signal wiring patterns (not shown) formed on the second printed circuit board 402, and the second carrier tape Output terminals of the elements 701 to 703 are connected to a second pad portion (not shown) formed in the non-display area A2 of the display panel DP.

The second pad part is connected to another part of the data lines through second link lines.

One side of the second carrier tape on which the input terminals are located and the second printed circuit board 402 may be adhered to each other by an anisotropic conductive film. Similarly, the other side of the second carrier tape on which the output terminals are positioned and the display panel DP may be adhered to each other by an anisotropic conductive film.

The first and second carrier tapes 701 to 703 may be formed of a flexible material that can be bent. For example, the first and second carrier tapes 701 to 703 may be made of polyimide, which is a material having excellent coefficient of thermal expansion (CTE) or durability. In addition, synthetic resins such as acrylic, polyether nitrile, polyethersulfone, polyethylene terephthalate, and polyethylenenaphthalate may be used.

The first and second pad parts may be located in a portion adjacent to the upper edge of the display area A1 of the non-display area A2 .

The output terminals of the first carrier tapes 601 to 603 and the output terminals of the second carrier tapes 701 to 703 may be located in a portion of the non-display area A2 adjacent to the upper edge of the display area A1. can

Some of the first signal wiring patterns include a data driving integrated circuit (D-IC) mounted on the first carrier tapes 601 to 603 using digital image data signals and data control signals provided from the timing controller; hereinafter, first data driving integrated circuits). In this case, the first data driving integrated circuit receives digital image data signals and data control signals through input wiring patterns (not shown) formed on the first carrier tape. In addition, the first data driving integrated circuit outputs analog image data signals through output wiring patterns formed on the first carrier tape. Here, an end of each input wiring pattern corresponds to the above-described input terminal, and an end of each output wiring pattern corresponds to the above-described output terminal.

Another part of the first signal wiring patterns transmits a gate control signal to the gate driver 534 through auxiliary wiring patterns formed on any one carrier tape and auxiliary lines formed on the corners of the lower substrate 361a. The auxiliary wiring patterns may be formed on one carrier tape positioned at the outermost side among all the carrier tapes 601 to 603 and 701 to 703 . For example, as shown in FIG. 3 , auxiliary wiring patterns may be formed on one first carrier tape 601 located at the leftmost side.

Some of the second signal wiring patterns include a data driving integrated circuit (D-IC) in which digital image data signals and data control signals provided from the timing controller are mounted on the second carrier tapes 701 to 703; integrated circuits). In this case, the second data driving integrated circuit receives digital image data signals and data control signals through input wiring patterns (not shown) formed on the second carrier tape. The second data driving integrated circuit outputs analog image data signals through output wiring patterns formed on the second carrier tape. Here, an end of each input wiring pattern corresponds to the above-described input terminal, and an end of each output wiring pattern corresponds to the above-described output terminal.

The timing controller and the power supply may be located on any one of the first and second printed circuit boards 402 .

The first printed circuit board 401 and the second printed circuit board 402 are electrically connected to each other by a connection part 777 .

A flexible printed circuit board may be used as the connection part 777 .

A plurality of connection wiring patterns are formed in the connection part 777 .

When the timing controller is located on the first printed circuit board 401 , signals from the timing controller are supplied to the first signal wiring patterns of the first printed circuit board 401 through the connection wiring patterns of the connection unit 777 . can On the other hand, when the timing controller is located on the second printed circuit board 402 , the signals from the timing controller are transmitted to the second signal wiring patterns of the second printed circuit board 402 through the connection wiring patterns of the connection unit 777 . can be supplied.

At least a portion of the first printed circuit board 401 protrudes toward the second printed circuit board 402 . In addition, at least a portion of the second printed circuit board 402 protrudes toward the first printed circuit board 401 . For example, a portion of each of the facing surfaces between the first printed circuit board 401 and the second printed circuit board 402 protrudes toward each other by a predetermined length. Here, the protruding portions of the facing surfaces are defined as first and second protrusions 401a and 402a, respectively, and non-protruding portions are respectively defined as first and second non-protruding portions 401b and 402b. .

In a state where the first protrusion 401a and the second protrusion 402a are in exact contact, the distance between the first non-protrusion 401b and the second non-protrusion 402b is defined as D, and the length of the connecting portion 777 is L When defined as , L is greater than D. In other words, in a state where the first protrusion 401a and the second protrusion 402a are in contact, the length of the connecting portion 777 is longer than the distance between the first non-protrusion 401b and the second non-protrusion 402b. .

The above-described connection part 777 may be a part of a layer included in at least one of the first printed circuit board 401 and the second printed circuit board 402 . An example thereof will be described with reference to FIG. 5 as follows.

FIG. 5 is a view showing a cross-section cut along the line I-I` of FIG. 3 .

The first printed circuit board 401 and the second printed circuit board 402 include a plurality of layers.

For example, as shown in FIG. 5 , the first printed circuit board 401 includes a polyimide layer 10 , a first upper conductive layer 11u positioned on the polyimide layer 10 , and the first 1 The upper coverlay layer 12u positioned on the upper conductive layer 11u, the upper prepreg layer 13u positioned on the upper coverlay layer 12u, and the upper prepreg layer 13u a second upper conductive layer 14u positioned, a first resist layer 15u positioned on the second upper conductive layer 14u, a first lower conductive layer 11d positioned under the polyimide layer 10; a lower coverlay layer 12d positioned under the first lower conductive layer 11d, a lower prepreg layer 13d positioned under the lower coverlay layer 12d, and the lower prepreg layer 13d It may include a second lower conductive layer 14d positioned below and a second resist layer 15d positioned under the second lower conductive layer 14d.

Circuit patterns patterned through exposure and etching processes are formed on the first upper conductive layer 11u. The first lower conductive layer 11d may have the same configuration as the first upper conductive layer 11u.

The upper coverlay layer 12u is an insulating layer and protects the surface of the connection part 777 . The lower coverlay layer 12d may have the same configuration as the upper coverlay layer 12u.

The upper prepreg layer (prepreg) imparts rigidity to the first printed circuit board 401 and the second printed circuit board 402 . The lower prepreg layer 13d may have the same configuration as the upper prepreg layer 13u.

Circuit patterns patterned through exposure and etching processes are formed on the second upper conductive layer 14u. The second lower conductive layer 14d may have the same configuration as the second upper conductive layer 14u.

Contact holes passing therethrough may be formed in the first printed circuit board 401 and the second printed circuit board 402 . The second upper conductive layer 14u formed on the first printed circuit board 401 and the first upper conductive layer 11u formed on the connection part 777 are connected to each other through the contact holes, or the second printed circuit board 402 The second upper conductive layer 14u formed in the ? and the first upper conductive layer 11u formed in the connecting portion 777 may be connected to each other.

The first printed circuit board 401 and the second printed circuit board 402 may rotate about the first carrier tapes 601 to 603 and the second carrier tapes 701 to 703 as axes. When the first printed circuit board 401 and the second printed circuit board 402 rotate, the first carrier tapes 601 to 603 and the second carrier tapes 701 to 703 are bent along the rotation direction. .

When the display device is completed, the first printed circuit board 401 and the second printed circuit board 402 are rotated to be positioned on the rear surface of the bottom case TC.

Hereinafter, a method of manufacturing a display device according to an embodiment of the present invention will be described.

First, a bottom case BC having a curved shape is prepared. The bottom case BC is made of a hard material such as metal and has a curved shape from the beginning. Therefore, the bottom case BC maintains its curved shape without a separate external force.

Next, the reflector 900 is placed on the bottom portion 111a of the bottom case BC. The reflector 900 is made of a flexible material that can be bent. Accordingly, when the reflective plate 900 is placed on the bottom of the bottom case BC, the reflective plate 900 takes the same curved shape as the bottom case BC.

Next, the light guide plate LGP in which the light source cover LC and the light source unit 801 are combined is placed on the reflective plate 900 .

The light source cover LC, like the above-described bottom case BC, is made of a hard material such as metal in a curved shape from the beginning.

The light source cover LC is bent in the same shape as the bottom case BC. In addition, the light guide plate LGP is made of a flexible material. Accordingly, the light guide plate LGP is bent in the same shape as the bottom case BC by the light source cover LC made of a hard material.

Meanwhile, the printed circuit board 801a included in the light source 801 is made of a flexible material such as polyimide. Therefore, the printed circuit board 801a is bent in the same shape as the bottom case BC while being coupled to the light source cover LC.

Next, the optical sheet 201 is placed on the light guide plate LGP. The optical sheet 201 is made of a flexible material. Accordingly, the optical sheet 201 is bent in the same shape as the bottom case BC.

Next, the mold frame MF is placed on the side portions 111b of the bottom case BC, and the display panel DP is placed on the second support portion 311b of the mold frame MF. The mold frame MF and the display panel DP may be made of a flexible material such as plastic. Here, the mold frame MF and the display panel DP may maintain a curved shape as the top case TC, which will be described later, is coupled to the bottom case BC. Meanwhile, the first and second printed circuit boards 401 and 402 are attached to the display panel DP through the first and second carrier tapes 701 to 703 .

Then, the first printed circuit board 401 and the second printed circuit board 402 are separated. This will be described in detail with reference to FIGS. 6A and 6B.

6A and 6B are views illustrating a process of separating the first printed circuit board 401 and the second printed circuit board 402, and FIG. 7 is a view showing the rear surface of the bottom case BC.

As shown in FIG. 6A , the first printed circuit board 401 and the second printed circuit board 402 are made of a single printed circuit board 444 that is not separated. At this time, a cutting line 969 may be further displayed at the center of this single printed circuit board 444 .

As shown in FIG. 6B , the center of the printed circuit board 969 is cut by a laser cutting device (not shown). Then, one printed circuit board 969 is divided into two printed circuit boards 401 and 402 .

Next, as shown in FIG. 7 , the separated first printed circuit board 401 and the second printed circuit board 402 are separated from the first carrier tapes 601 to 603 and the second carrier tapes 701 to 703) is rotated toward the rear surface of the bottom case BC. Then, the first printed circuit board 401 and the second printed circuit board 402 are positioned on the rear surface of the bottom case BC.

Then, the top case TC is coupled to the bottom case BC in a state in which the top case TC is positioned above the display panel DP. The top case TC, like the above-described bottom case BC, is made of a hard material such as metal in a curved shape from the beginning. Accordingly, the top case TC maintains its curved shape without a separate external force. As the top case TC and the bottom case BC are coupled, the display panel DP and the mold frame positioned between them have a curved shape.

In this way, the bottom case (BC), the reflector (900), the light source unit (801), the light source cover (LC), the light guide plate (LGP), the optical sheet 201, the mold frame (MF), the display panel (DP), the first printing The circuit board 401 and the top case TC both have similar curved shapes, but have different curvatures.

That is, among the components included in the display device, the first and second printed circuit boards 401 and 402 have the greatest curvature. This is because the first and second printed circuit boards 401 and 402 are located at the lowermost side among the components. On the other hand, the uppermost top case TC has the smallest curvature. Components positioned between the printed circuit boards 401 and 402 and the top case TC have a curvature value between the largest curvature and the smallest curvature.

On the other hand, before the first and second printed circuit boards 401 and 402 move to the rear surface of the bottom case BC, the curvature of the first and second printed circuit boards 401 and 402 is the display panel DP. maintains a curvature substantially equal to the curvature of However, when the first and second printed circuit boards 401 and 402 move toward the rear surface of the bottom case BC, the curvature of the first and second printed circuit boards 401 and 402 increases. At this time, the first printed circuit board 401 and the second printed circuit board 402 receive a force to move away from each other due to the increased curvature. By this force, as shown in FIG. 7 , the first printed circuit board 401 moves in the left arrow direction while the second printed circuit board 402 moves in the right arrow direction. At this time, as the first printed circuit board 401 and the second printed circuit board 402 move away from each other, the connecting portion 777 coupled therebetween is also pulled to both sides and the bent portion is unfolded. The gap between the first printed circuit board 401 and the second printed circuit board 402 and the increased curvature of the first and second printed circuit boards 401 and 402 are maintained by the connection part 777 .

In this way, even if the curvature of the first printed circuit board 401 and the second printed circuit board 402 increases, the first printed circuit board 401 and the second printed circuit board 402 can move to both sides, It is possible to prevent stress from accumulating on the first printed circuit board 401 and the second printed circuit board 402 . Therefore, deformation and damage of the first carrier tapes 601 to 603 and the second carrier tapes 701 to 703 are prevented. Also, damage to the wiring patterns and the data driving integrated circuit (D-IC) formed on the carrier tapes 601 to 603 and 701 to 703 can be prevented.

The display panel DP presented in the present invention may be a liquid crystal panel, but is not limited thereto. In addition to the liquid crystal panel, any structure in the form of a panel capable of displaying an image such as an organic light emitting display panel (DP) may be used.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and it is common in the technical field to which the present invention pertains that various substitutions, modifications and changes are possible without departing from the technical spirit of the present invention. It will be clear to those who have the knowledge of

777: connection unit 401: first printed circuit board
402: second printed circuit board BC: bottom case
401a: first protrusion 401b: first non-protrusion
402a: second protrusion 402b: second non-protrusion
601-603: first carrier tape 701-703: second carrier tape

Claims (43)

a first printed circuit unit;
a second printed circuit unit; and
a connection part connecting the first printed circuit part and the second printed circuit part;
The connection part is a part of a layer included in at least one of the first printed circuit part and the second printed circuit part,
At least one of the first printed circuit unit and the second printed circuit unit,
polyimide layer;
a first upper conductive layer positioned on the polyimide layer;
an upper coverlay layer positioned on the first upper conductive layer;
an upper prepreg layer positioned on the upper coverlay layer;
a second upper conductive layer positioned over the upper prepreg layer;
a first lower conductive layer positioned under the polyimide layer;
a lower coverlay layer located under the first lower conductive layer;
a lower prepreg layer located below the lower coverlay layer; and
A printed circuit board including a second lower conductive layer positioned below the lower coverlay layer. The method of claim 1,
The printed circuit board has a length greater than the distance between the connection part and the first printed circuit part and the second printed circuit part. The method of claim 1,
A printed circuit board in which at least a portion of the first printed circuit unit protrudes toward the second printed circuit unit. 4. The method of claim 3,
A printed circuit board in which at least a portion of the second printed circuit unit protrudes toward the first printed circuit unit. The method of claim 1,
At least one of the first printed circuit unit and the second printed circuit unit,
a first resist layer positioned over the second upper conductive layer; and
The printed circuit board further comprising a second resist layer positioned below the second lower conductive layer. 6. The method of claim 5,
The connection part may include the polyimide layer, the first upper conductive layer, the upper coverlay layer, and the upper prepreg layer. The method of claim 1,
The connection part,
a first portion between the first printed circuit portion and the second printed circuit portion;
a second portion extending from the first portion and disposed within the first printed circuit portion; and
and a third portion extending from the first portion and disposed in the second printed circuit portion. 8. The method of claim 7,
the second portion of the connecting portion is disposed between the layers of the first printed circuit portion; and,
The third portion of the connection portion is a printed circuit board disposed between the layers of the second printed circuit portion. 5. The method of claim 4,
the first printed circuit unit includes a first protrusion protruding toward the second printed circuit unit; and,
The second printed circuit board includes a second protrusion protruding toward the first protrusion. 10. The method of claim 9,
A printed circuit board connected to the first protrusion and the second protrusion. 11. The method of claim 10,
A printed circuit board in which a cut line is displayed on a connection portion between the first protrusion and the second protrusion. 11. The method of claim 10,
The printed circuit board has a length greater than an interval between the non-protrusion part of the first printed circuit part and the non-protrusion part of the second printed circuit part. 11. The method of claim 10,
A printed circuit board in which a part of the connection part is curved. 10. The method of claim 9,
A printed circuit board in which the first protrusion and the second protrusion are separated from each other. 10. The method of claim 9,
When the opposite ends of the first protrusion and the second protrusion come into contact with each other, the connecting portion has a length greater than an interval between the first non-protrusion part of the first printed circuit part and the second non-protrusion part of the second printed circuit part A printed circuit board having The method of claim 1,
Each of the first printed circuit unit and the second printed circuit unit includes a rigid printed circuit board. The method of claim 1,
The connection part is a printed circuit board including a flexible printed circuit board. The method of claim 1,
a thickness of the first printed circuit part is greater than a thickness of the connection part; and,
A thickness of the second printed circuit part is greater than a thickness of the connection part. The method of claim 1,
The thickness of the first printed circuit part is the same as the thickness of the second printed circuit part. The method of claim 1,
The first printed circuit part and the second printed circuit part are symmetrical with respect to a central portion of the connection part. The method of claim 1,
The connection part is a printed circuit board for physically and electrically connecting the first printed circuit part and the second printed circuit part. The method of claim 1,
the number of layers included in the connection part is smaller than the number of layers included in the first printed circuit part; and,
The number of layers included in the connection part is smaller than the number of layers included in the second printed circuit part. 23. The method of claim 22,
A printed circuit board in which the number of layers included in the first printed circuit part is the same as the number of layers included in the second printed circuit part. a first printed circuit unit;
a second printed circuit unit; and
a connection part connecting the first printed circuit part and the second printed circuit part;
The connection part is a part of a layer included in at least one of the first printed circuit part and the second printed circuit part,
The first printed circuit unit includes a first protrusion protruding toward the second printed circuit unit,
The second printed circuit part includes a second protrusion protruding toward the first protrusion, and
The connection part is a printed circuit board disposed between the non-protrusion part of the first printed circuit part and the non-protrusion part of the second printed circuit part. 25. The method of claim 24,
The printed circuit board has a length greater than the distance between the connection part and the first printed circuit part and the second printed circuit part. 25. The method of claim 24,
At least one of the first printed circuit unit and the second printed circuit unit,
polyimide layer;
a first upper conductive layer positioned on the polyimide layer;
an upper coverlay layer positioned on the first upper conductive layer;
an upper prepreg layer positioned on the upper coverlay layer;
a second upper conductive layer positioned over the upper prepreg layer;
a first resist layer positioned over the second upper conductive layer;
a first lower conductive layer positioned under the polyimide layer;
a lower coverlay layer located under the first lower conductive layer;
a lower prepreg layer located below the lower coverlay layer;
a second lower conductive layer located under the lower coverlay layer; and
and a second resist layer positioned under the second lower conductive layer. 27. The method of claim 26,
The connection part may include the polyimide layer, the first upper conductive layer, the upper coverlay layer, and the upper prepreg layer. 25. The method of claim 24,
The connection part,
a first portion between the non-projecting portion of the first printed circuit portion and the non-projecting portion of the second printed circuit portion;
a second portion extending from the first portion and disposed within the first printed circuit portion; and
and a third portion extending from the first portion and disposed in the second printed circuit portion. 29. The method of claim 28,
the second portion of the connecting portion is disposed between the layers of the first printed circuit portion; and,
The third portion of the connection portion is a printed circuit board disposed between the layers of the second printed circuit portion. 25. The method of claim 24,
A printed circuit board connected to the first protrusion and the second protrusion. 31. The method of claim 30,
A printed circuit board in which a cut line is displayed on a connection portion between the first protrusion and the second protrusion. 31. The method of claim 30,
The printed circuit board has a length greater than an interval between the non-protrusion part of the first printed circuit part and the non-protrusion part of the second printed circuit part. 31. The method of claim 30,
A printed circuit board in which a part of the connection part is curved. 25. The method of claim 24,
A printed circuit board in which the first protrusion and the second protrusion are separated from each other. 25. The method of claim 24,
When the opposite ends of the first protrusion and the second protrusion come into contact with each other, the connecting portion has a length greater than an interval between the first non-protrusion part of the first printed circuit part and the second non-protrusion part of the second printed circuit part A printed circuit board having 25. The method of claim 24,
Each of the first printed circuit unit and the second printed circuit unit includes a rigid printed circuit board. 25. The method of claim 24,
The connection part is a printed circuit board including a flexible printed circuit board. 25. The method of claim 24,
a thickness of the first printed circuit part is greater than a thickness of the connection part; and,
A thickness of the second printed circuit part is greater than a thickness of the connection part. 25. The method of claim 24,
The thickness of the first printed circuit part is the same as the thickness of the second printed circuit part. 25. The method of claim 24,
The first printed circuit part and the second printed circuit part are symmetrical with respect to a central portion of the connection part. 25. The method of claim 24,
The connection part is a printed circuit board for physically and electrically connecting the first printed circuit part and the second printed circuit part. 25. The method of claim 24,
the number of layers included in the connection part is smaller than the number of layers included in the first printed circuit part; and,
The number of layers included in the connection part is smaller than the number of layers included in the second printed circuit part. 43. The method of claim 42,
A printed circuit board in which the number of layers included in the first printed circuit part is the same as the number of layers included in the second printed circuit part.

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