KR102311113B1 - Ultrasonic horn for embedding wire and embedding method using the same - Google Patents

Abstract

An ultrasonic horn for embedding a wire in a substrate includes a horn body that has a bottom having a contact surface in contact with the substrate; a guide groove formed at the bottom of the horn body so that the wire passes through the contact surface while moving along the horn body; and a stepped part formed on one side of the guide groove and providing a lower surface higher than the contact surface. When the horn body moves relative to the substrate in a traveling direction, the stepped part can be formed on the left or right side with respect to the traveling direction.

Description

ULTRASONIC HORN FOR EMBEDDING WIRE AND EMBEDDING METHOD USING THE SAME

The present invention relates to wire embedding or inlay, and more particularly, to an ultrasonic horn capable of embedding tightly arranged single wire or multiple wires to a sufficient depth, and a embedding method using the same.

As mobile devices become more popular in modern society, technologies for wirelessly performing data communication with peripheral devices or charging batteries are also evolving. The NFC function has become an essential function in smartphones and has gone beyond the wired charging method that was generally used in the past.

A mobile device for performing such a purpose is equipped with a transmission/reception module capable of transmitting and receiving signals as well as energy, and an antenna having a coil structure may be used in the transmission/reception module. For these antennas, winding a copper wire was a common technique in the past, but as technology advances, a copper thin film is formed on an FPCB for a thin antenna structure and removed by chemical etching or laser etching to form a fine antenna pattern. became

Korean Utility Model Publication No. 20-2010-0011405 discloses “an ultrasonic horn for embedding an antenna coil”. The ultrasonic horn is assembled into an ultrasonic generator, and a wire is inserted into the ultrasonic horn through a wire guide and embedded through an end thereof.

FIG. 1 is a view for explaining an antenna sheet using a conventional wire embedding, FIG. 2 is a view for explaining a process of manufacturing the antenna sheet of FIG. 1, and FIG. 3 is a view for explaining a process of manufacturing the antenna sheet of FIG. It is a diagram for explaining a wire embedding apparatus, and FIGS. 4 and 5 are diagrams for explaining a process of embedding a wire in an original plate using the wire embedding apparatus of FIG. 3 .

1 to 5, the conventional antenna sheet 10 includes a substrate 20 and an embedded antenna 30 embedded in one surface of the substrate 20, and one end of the embedded antenna 30 is each terminal. It may be electrically connected to 25 , and the terminals 25 of the substrate 20 may be connected to an external or main body circuit through a connection circuit sheet 40 such as an FPCB as shown in the upper right.

The conventional embedded antenna 30 begins to form as the wire begins to be embedded while passing through the terminal 25, and forms a winding structure while rotating counterclockwise in the center of the substrate 20, and the wire located inside While being connected to the other terminal 25, it can function as an antenna.

The embedded antenna 30 of FIG. 1 has a multi-wire structure in which three wires are connected in parallel, and may be embedded while maintaining a fine distance. The antenna sheet 10 may form the substrate 20 by embedding the embedded antenna 30 in the circular plate 21 on which the terminals 25 are formed, and then cutting the circular plate 21 as shown in a dotted line.

The wire embedding device shown in FIG. 3 is a device similar to the wire embedding device included in Patent Application No. 10-2020-0100181 filed on August 10, 2020, and is temporarily on the stage 52 and the stage 52 For moving the fixed substrate or disk 21, the ultrasonic horn 54, the ultrasonic horn 54 integrally mounted with the ultrasonic generator 56, the ultrasonic horn 54 and the ultrasonic generator 56 up and down A vertical drive unit 58 may be included.

The substrate in which the wire is embedded can be directly fixed to the stage 52 , but the original plate 21 before the substrate is fixed to the stage 52 , and after embedding the antenna or RFID coil in the original plate 21 , the original plate 21 ) may be cut into a desired shape to form a substrate.

The illustrated stage 52 can move linearly in the x and y-axis directions, that is, horizontally or rotate about the z-axis, and the ultrasonic horn 54 is relatively stationary with respect to the horizontal direction, and the ultrasonic horn ( 54), it can move as if the stage 52 and the disk 21 move in only one direction. Accordingly, in the ultrasonic horn 54, a triple wire may be formed at the same time.

The bottom surface of the illustrated ultrasonic horn 54 includes a contact surface formed in a ring shape around a central through-hole, and as shown in FIG. 4 , the bottom surface of the ultrasonic horn 54 transmits vibration with a triple wire and the disk 21 ) can be embedded in the wire 30.

Referring to Figure 5 (a), the bottom surface of the ultrasonic horn 54 can form a ring-shaped contact area, and as shown by the arrow, the first wire 30-1 while vibrating up and down or other directions It can be buried to a predetermined depth.

Referring to (b) of FIG. 5 , the ultrasonic horn 54 embeds the first wire 30-1 along a specific trajectory, and then inserts the second wire 30-2 very close to the first wire 30-1. can be buried.

When embedding the first wire 30-1, there are no other wires around, so the wire can be embedded based on the upper surface of the disk 21. However, when embedding the second wire 30-2, the first wire 30-1 ) may be the reference plane. Therefore, when the second wire 30 - 2 is buried, it cannot be buried as deep as the first wire 30 - 1 , and has no choice but to be buried at a relatively lower depth than the first wire 30 - 1 .

Referring to (c) of FIG. 5 , the third wire 30 - 3 cannot be buried deeper than the second wire 30 - 2 in the same way, and is inevitably buried to a relatively lower depth than the second wire 30 - 2 .

When the ultrasonic horn 54 shown in this way is used, the depth of embedding of the wire gradually decreases, and the embedding may become unstable or may not occur at all.

The present invention provides an ultrasonic horn capable of embedding a single wire or multiple wires to a sufficient depth without being disturbed by wires in the process of embedding the wire and a embedding method using the same.

According to an exemplary embodiment of the present invention for achieving the above-described objects of the present invention, the ultrasonic horn for embedding a wire in a substrate is a horn body providing a contact surface in contact with the substrate on the bottom, and the wire is a horn body It includes a guide groove formed at the lower end of the horn body to pass through the contact surface while moving along, and a stepped portion formed on one side of the guide groove and providing a bottom surface higher than the contact surface, and when the horn body moves relative to the substrate in the moving direction , the stepped portion may be formed on the left or right side with respect to the traveling direction.

The guide groove may be formed at the lower end of the through hole penetrating the horn body up and down. Alternatively, the horn body includes a cut surface in which an inclined direction with respect to the traveling direction is cut and a wire guide formed in the up and down direction on the cut surface, The guide groove may be formed at the lower end of the wire guide.

The stepped portion may be formed on the left, right or both sides with respect to the direction of travel, and further may be formed to extend to the front of the direction of travel.

The height of the stepped portion is preferably about 20 to 80 μm. If there is little difference in height between the bottom of the stepped portion and the contact surface, it may be substantially disturbed, and if the height of the stepped portion is higher than about 80 μm or more, it is difficult to return to the original position even if the wire temporarily detaches from the contact surface, Even if it returns, partial damage to the wire may occur. However, if the step of about 8 ~ 90㎛ or less is formed, even if the wire with a diameter of 0.10 ~ 0.15mm is momentarily separated, it can be smoothly returned to the original position again, and the depth of embedding can be kept constant as a whole. In addition, if the height of the stepped portion is too high, physical damage may occur to the remaining portion of the ultrasonic horn, that is, a portion where the contact surface is formed.

According to an exemplary embodiment of the present invention for achieving the objects of the present invention described above, the wire embedding method basically passes the wire through the guide groove of the ultrasonic horn, and passes the wire passing through the guide groove through the contact surface of the ultrasonic horn. It can be embedded in the substrate. Characteristically, the wire embedding method according to the present embodiment includes the steps of providing an ultrasonic horn including a stepped portion providing a lower surface higher than the contact surface on one side of the guide groove, and when passing in parallel to the wire already embedded in the substrate, the embedding It may include restricting the relative movement between the ultrasonic horn and the substrate so that the wire passes through the lower portion of the stepped portion.

When the horn body moves relative to the substrate in a specific traveling direction, the stepped portion may be formed to be located on the left or right side with respect to the traveling direction, and in some cases, the stepped portion may be formed to extend forward with respect to the traveling direction. .

형상으로 형성될 수 있는데, 가이드 홈을 따라 2가닥 이상의 다중 와이어가 공급될 때, 다중 와이어가 단층으로 제공되며, 다중 와이어 중 최외곽에 위치한 와이어가 단층을 이루는 다중 와이어들의 중심으로 가압되도록 가이드 홈의 양측 또는 일측에 경사면을 제공할 수 있다.Guide grooves can be circular arc, elliptical arc, V-shape or

It can be formed in a shape, when two or more multi-wires are supplied along the guide groove, the multi-wire is provided as a single layer, and the guide groove is such that the outermost wire among the multi-wires is pressed into the center of the multi-wires forming a single layer. An inclined surface may be provided on both sides or one side of the.

Among the multiple wires arranged in the guide groove, the center of the relatively high wire may be designed to be at the same or lower position than the top of the other wires in contact with the wire.

While the ultrasonic horn may be in motion and the substrate may be stationary, multiple wires may be embedded by moving the ultrasonic horn stationary and non-rotating, and moving the substrate in a relatively linear motion or rotation. At this time, in response to the stopped ultrasonic horn, the substrate may always move in a predetermined direction, for example, in a direction retracting with respect to the center of the guide groove.

According to the ultrasonic horn of the present invention and the embedding method using the same, when the ultrasonic horn passes around the wire already embedded in the substrate, the already embedded wire passes through the lower part of the stepped portion, and vibration energy is generated by the wire embedded in the ultrasonic horn. transmission can be unobstructed.

As a result, even if there is an already buried wire, the wire buried in the periphery can also be buried to a sufficiently deep depth, and it is possible to prevent the wire from being buried or unstablely buried due to overlapping embedding.

1 is a view for explaining an antenna sheet using a conventional wire embedding.
FIG. 2 is a view for explaining a process of manufacturing the antenna sheet of FIG. 1 .
3 is a view for explaining a wire embedding apparatus using an ultrasonic horn of a different type from the present invention.
4 and 5 are diagrams for explaining a process of embedding a wire in an original plate using the wire embedding apparatus of FIG. 3 .
6 is a view for explaining an ultrasonic horn according to an embodiment of the present invention.
7 is a view for explaining the bottom surface of the ultrasonic horn of FIG.
FIG. 8 is a view for explaining a process of embedding a wire using the ultrasonic horn of FIG. 6 .
9 is a cross-sectional view illustrating a process of embedding a wire in a disk using the ultrasonic horn of FIG. 6 .
FIG. 10 is a plan view for explaining a process of embedding a wire in a disk using the ultrasonic horn of FIG. 6 .
11 is a view for explaining a dimensional relationship between a guide groove and a wire in the ultrasonic horn according to an embodiment of the present invention.
12 is a view for explaining an ultrasonic horn according to an embodiment of the present invention.
13 is a view for explaining a side surface and a bottom surface of the ultrasonic horn of FIG. 12 .
14 is a view for explaining an ultrasonic horn according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or limited by the embodiments. For reference, in the present description, the same numbers refer to substantially the same elements, and contents described in other drawings under the above rules may be cited and described, and contents determined to be obvious to those skilled in the art or repeated may be omitted.

Figure 6 is a view for explaining the ultrasonic horn according to an embodiment of the present invention, Figure 7 is a view for explaining the bottom of the ultrasonic horn of Figure 6, Figure 8 is a wire using the ultrasonic horn of Figure 6 It is a view for explaining the embedding process, FIG. 9 is a cross-sectional view for explaining the process of embedding a wire in a disc using the ultrasonic horn of FIG. 6, and FIG. It is a drawing for explaining the process of embedding in the original plate in a plane.

6 to 10 , the ultrasonic horn 100 according to the present embodiment may be mounted on the wire embedding apparatus shown in FIG. 3 , and the wire embedding apparatus performs horizontal movement and rotational movement about the x and y axes. It may include a possible stage, an ultrasonic generator integrally mounted with the ultrasonic horn 100 , and a vertical driving part for vertically moving the ultrasonic horn 100 and the ultrasonic generator.

In this embodiment, the ultrasonic horn 100 is fixed with respect to the horizontal direction, and in a fixed state, the stage can move linearly in the horizontal direction with respect to the x and y axis directions or rotate about the z axis, but in other implementations In the example, it is also possible that the stage is fixed or that it moves like an ultrasonic horn.

The ultrasonic horn 100 according to this embodiment is for embedding a triple wire, the horn body 110 providing a contact surface 120 on the bottom, and three multi-wires w along the horn body 110 . A guide groove 130 formed at the lower end of the horn body 110 to pass through the contact surface 120 while moving, and a stepped portion 125 formed on one side of the guide groove 130 and providing a lower surface higher than the contact surface 120 . may include.

The ultrasonic horn 100 includes a conical horn body 110 as a whole, and in the center of the horn body 110, a through hole and a through hole penetrating up and down and a wire guide passing through the side of the horn body 110 obliquely ( 112) may be formed. The three wires (w) can pass through the wire guide 112 from the side of the horn body 110, and pass through the circular guide groove 130 at the bottom of the through hole while passing through the C-shaped contact surface ( 120) can pass.

An ultrasonic generator may be provided to the upper portion of the ultrasonic horn 100 , and vibration energy of the ultrasonic generator may be transmitted to the wire w and the disk through the C-shaped contact surface 120 of the ultrasonic horn 100 .

The ultrasonic horn 54 of the other method of FIG. 5 and the ultrasonic horn 100 according to the present embodiment of FIG. 9 may be compared. For reference, the ultrasonic horn 54 of FIG. 5 provides a ring-shaped contact surface surrounding the guide groove, whereas the ultrasonic horn 100 according to the present embodiment is a C- A female contact surface 120 may be provided.

In this embodiment, the ultrasonic horn 100 includes a conical horn body 110 as a whole, a through hole penetrating vertically is formed in the central portion, and a guide groove 130 penetrates the horn body 110 vertically. It may be formed at the lower end of the through hole.

In addition, in this embodiment, the disk 21 may move to the right in the drawing, but in some cases, the disk may be set to move in the opposite direction, and in this case, the direction of embedding of the wire is the opposite direction of the wire guide 112 . can be directed towards

Referring to (a) of FIG. 9 , the contact surface 120 of the ultrasonic horn 100 may be in contact with the disk 21 and the wire 30 in a C-shape excluding the stepped portion 125 on the right side. As also shown by arrows, the first three wires 30 may be embedded to a predetermined depth while vibrating in the vertical or other directions.

Referring to FIG. 9B , the ultrasonic horn 100 may embed the first wire 30 along a specific trajectory and then embed the second wire 30 very closely to the first wire 30 .

The stepped portion 125 is present, and the bottom surface of the stepped portion 125 is sufficiently spaced apart from the first wire 30 so that the second wire 30 may be buried under the same conditions as the first. Accordingly, the second wire 30 may be buried as deep as the first wire 30 .

Referring to FIG. 9C , the third wire 30 may also be buried to the same depth as the second wire 30 , and subsequent wires may also be buried to the same depth.

In this embodiment, the stepped portion 125 is spaced apart from the contact surface 120 by about 50 μm, and preferably, the stepped portion may be formed to a height of about 20 to 80 μm. If the height difference between the bottom surface of the stepped portion 125 and the contact surface 120 is less than about 20 μm, it may be substantially disturbed, and if the height of the stepped portion is higher than about 80 μm or more, the wire temporarily out of the contact surface Even if the separation occurs, it is difficult to return to the original position again, and even if it is returned, partial damage to the wire may occur.

However, as in this embodiment, if the height difference between the stepped portion 125 and the contact surface 120 is about 50 μm, it is possible to smoothly return to the original position even if the wire of about 0.15 mm diameter is momentarily separated, and the overall The depth of embedding can be kept constant.

Referring to FIG. 10 , a process of embedding the outermost wire according to the wire 30 of the first track can be confirmed. And, looking at (b), the wire 30 of the second track can be formed inside the wire 30 of the first track. It is formed to the right with respect to the right direction in the first track can pass through the upper portion of the wire 30.

As shown, the contact surface 120 of the ultrasonic horn is stationary, and it can be seen that the ultrasonic horn moves relatively to the right while the disk 21 moves in the left direction in the drawing.

11 is a view for explaining a dimensional relationship between a guide groove and a wire in the ultrasonic horn according to an embodiment of the present invention.

Referring to (a) of FIG. 11 , the ultrasonic horn can embed three and six wires, _{and assuming that each of the wires to be embedded has a diameter of 0.15 mm (r w} *2), the guide groove is about 0.67 It may be formed in a circle having a diameter of mm (R1*2).

In addition, as shown in (b) of FIG. 11, the ultrasonic horn can embed 6 wires, _{and assuming that each of the wires to be embedded has a diameter of 0.15 mm (r w} *2), the guide groove is about 1.3 mm It may be formed in a circle having a diameter of (R2*2).

In this case, the relationship between the six-layer wire and the guide groove is on both sides of the guide groove so that multiple wires pass through the guide groove in a single layer, and the wires at both ends located at the outermost among the multiple wires are pressed to the center of the multiple wires forming a single layer. An inclined surface may be formed.

In this case, the multiple wires arranged in the guide groove form a single layer, and may be positioned at the same height as the surrounding wires or positioned relatively higher than that. In particular, since the wires at both ends are supported by the inclined surfaces of the guide grooves, they may have a relatively higher center of gravity than the wires located inside them. However, even in this case, it is preferable that the center of the wire located at the end maintains the same or lower height than the top of the wire located immediately inside it.

Conversely, the diameter (R3*2) of the guide groove is made smaller as shown in (c) of FIG. 11, and the center of the wire located at the end may be at a higher position than the top of the wire located right inside it, in this case Wires located at the ends can be overlapped by overlapping inward over adjacent wires. In this case, twisting between the wires may occur, and in this case, the embedding of the wire may be incompletely performed.

In addition, according to the following point of view, when n multi-wires are formed using a wire w having a radius of r, and assuming that the radius of the guide groove is R, R, r, and n have the following relational expressions may be desirable.

형상 등 다양한 형상으로 형성될 수 있다.In this embodiment, the guide groove 130 has a circular shape, and a portion in contact with the substantially three-stranded wire w is provided in an arc shape. However, in addition to this, the guide groove can be formed in an elliptical arc, V-shape or

It may be formed in various shapes, such as a shape.

12 is a view for explaining an ultrasonic horn according to an embodiment of the present invention, and FIG. 13 is a view for explaining a side and a bottom surface of the ultrasonic horn of FIG. 12 .

12 and 13 , the ultrasonic horn 200 according to the present embodiment includes a stage, a substrate or disk on the stage, an ultrasonic generator integrally mounted with the ultrasonic horn 200, and ultrasonic wave generation with the ultrasonic horn 200 It can be used in a wire embedding device including a vertical drive for moving the part up and down.

The ultrasonic horn 200 is also for embedding multiple wires, the horn body 210 providing the contact surface 220 on the floor, and the 6 strands of the multi-wire w moving along the horn body 210 while moving along the contact surface 220 ) may include a guide groove 230 formed at the lower end of the horn body 210, and a stepped portion 225 formed on one side of the guide groove 230 and providing a lower surface higher than the contact surface 220. .

The ultrasonic horn 200 includes a substantially cylindrical horn body 210, and the incision surface 214 and the incision surface 214 cut in an oblique direction from the contact surface 220 of the horn body 210 in the vertical direction. It may include a formed wire guide 212 .

형상의 가이드 홈(230)을 통과하면서 바닥의 ㄴ-자형 또는 L-자형의 접촉면(220)을 통과할 수 있다.The 6-stranded wire (w) may pass through the wire guide 212 exposed on the front of the horn body 210, and at the lower end of the cut surface 214

It may pass through the L-shaped or L-shaped contact surface 220 of the floor while passing through the guide groove 230 of the shape.

The contact surface 220 of the ultrasonic horn 200 may be in contact with the disk and the wire in an L-shape or an L-shape except for the stepped portion 225 . It is possible to embed the six-fold wire 30 to a predetermined depth while vibrating up and down or other directions through the contact surface 220 .

After embedding the wire along a specific trajectory, the ultrasonic horn 200 may embed the wire of the second track to the same depth while passing through the already embedded wire in parallel and close proximity. This is because, as previously described, the stepped portion 225 is present, and the bottom surface of the stepped portion 225 is sufficiently spaced apart from the wire of the first track so that the wire embedded in the second track can be embedded under the same conditions as in the first. .

The relationship between the six-fold wire (w) and the guide groove 230 is that the multi-wire (w) passes in a single layer along the guide groove 230, and the wires at both ends located at the outermost of the multi-wire (w) form a single layer. Inclined surfaces may be formed on both sides of the guide groove 230 to be pressed to the center of the multiple wires.

In this case, the multiple wires w arranged in the guide groove 230 form a single layer, and may be positioned at the same height as the surrounding wires or positioned relatively higher than that. In particular, since the wire at both ends is supported by the inclined surface of the guide groove 230 , it may have a relatively higher center than the wire located inside it. However, even in this case, it is preferable that the center of the wire located at the end maintains the same or lower height than the top of the wire located immediately inside it.

If the width of the guide groove is narrow compared to the number of wires or wires, the center of the wire located at the end may be at a higher position than the top of the wire located right inside it, and in this case, the wire located at the end will ride on the adjacent wire. It can be overlapped by overlapping inward.

형상으로 제공되지만, 이 외에도 가이드 홈은 원호, 타원호, V-자 형상 등 다양한 형상으로 형성될 수 있다.In this embodiment, the guide groove 230 of the open form is

Although provided in a shape, the guide groove may be formed in various shapes, such as a circular arc, an elliptical arc, and a V-shape.

In addition, curved inclined surfaces may be formed on both sides of the guide groove, and by forming the guide groove as an inclined surface inclined to one side, multiple wires pass as a single layer along the inclined guide groove as a whole, and one side located at the outermost side of the wire may be provided to be pressed to one side.

14 is a view for explaining an ultrasonic horn according to an embodiment of the present invention.

Referring to FIG. 14 , the ultrasonic horn 300 includes a conical horn body 310 , a contact surface 320 , and a stepped portion 325 . However, unlike the previous embodiment, the stepped portion 325 is formed on both the front and both sides of the guide groove 330 , and the contact surface 320 may be formed only at the rear of the moving direction.

As shown, the stepped portion 325 may be formed on both sides of the guide groove 330 and may also be formed to extend forward with respect to the traveling direction. However, in this case, since multiple wires may be separated from the contact surface 320 according to the direction change of the substrate or the disk, it is necessary to appropriately control the progress speed, the width of the contact surface 320, the number of wires, and the like.

As described above, although described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify and change the present invention without departing from the spirit and scope of the present invention as set forth in the following claims. You will understand that it can be done.

10: antenna sheet 20: substrate
21: original plate 30: embedded wire
54: ultrasonic horn 56: ultrasonic generator
100, 200, 300: ultrasonic horn 110, 210, 310: horn body
120, 220, 320: contact surface 125, 225, 325: stepped part
130, 230, 330: guide groove

Claims (11)

In the ultrasonic horn for embedding a wire in a substrate,
a horn body providing a bottom surface in contact with the substrate;
a guide groove formed at the lower end of the horn body so that the wire passes through the contact surface while moving along the horn body; and
It is formed on one side of the guide groove, and includes a stepped portion that provides a bottom surface higher than the contact surface;
When the horn body moves relative to the substrate in the traveling direction, the step portion is formed on the left or right side with respect to the traveling direction. According to claim 1,
The guide groove is an ultrasonic horn, characterized in that formed at the lower end of the through hole penetrating the horn body up and down. According to claim 1,
The horn body includes a cut surface cut in an inclined direction with respect to the traveling direction and a wire guide formed in an up and down direction on the cut surface, and the guide groove is formed at a lower end of the wire guide. According to claim 1,
The step portion is ultrasonic horn, characterized in that it is formed to extend to the front with respect to the traveling direction. According to claim 1,
The height of the step portion is an ultrasonic horn, characterized in that 20 ~ 80㎛. A wire embedding method in which a wire is passed through a guide groove of an ultrasonic horn, and the wire that has passed through the guide groove is passed through a contact surface of the ultrasonic horn to be embedded in a substrate,
providing an ultrasonic horn including a stepped portion providing a bottom surface higher than the contact surface on one side of the guide groove; and
and restricting the relative movement between the ultrasonic horn and the substrate so that the embedded wire passes through the lower portion of the stepped portion when passing parallel to the wire already embedded in the substrate. 7. The method of claim 6,
When the ultrasonic horn moves relative to the substrate in the moving direction, the step portion is formed to be located on the left or right side with respect to the moving direction. 8. The method of claim 7,
The wire embedding method, characterized in that the stepped portion is formed to extend to the front with respect to the moving direction. 7. The method of claim 6,
Wire embedding method, characterized in that the height of the step portion is 20 ~ 80㎛. 7. The method of claim 6,
The guide groove may be circular arc, elliptical arc, V-shape or

Wire embedding method, characterized in that formed in a shape. 11. The method of claim 10,
When two or more multiple wires are supplied along the guide groove, the multiple wires are provided as a single layer, and the outermost wire among the multiple wires is pressed to the center of the multiple wires forming a single layer on both sides of the guide groove. Or wire embedding method, characterized in that providing an inclined surface on one side.

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